CN106028685A - Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board - Google Patents
Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board Download PDFInfo
- Publication number
- CN106028685A CN106028685A CN201610448391.2A CN201610448391A CN106028685A CN 106028685 A CN106028685 A CN 106028685A CN 201610448391 A CN201610448391 A CN 201610448391A CN 106028685 A CN106028685 A CN 106028685A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- ink
- printing
- board manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing method of a flexible circuit board employing ink instead of an adhesive tape and the flexible circuit board. The manufacturing method comprises the steps of: (A) carrying out board grinding treatment on the flexible circuit board; (B) printing etch-resistant ink on the flexible circuit board and then carrying out baking for curing; and (C) sequentially carrying out laminating, quick pressure or transfer pressure curing, drilling, electroless copper plating, outer-layer pattern manufacturing, developing and etching for film stripping and a post-procedure. According to the manufacturing method disclosed by the invention, the ink is adopted instead of the adhesive tape; the ink can withstand high temperature and high pressure after being printed and cured; the binding force is high; the ink can also be easily cleaned when in a film stripping liquid; meanwhile, the production process is simple; the production efficiency is high; the accuracy can be effectively improved by overall board printing; the deviation risk is reduced; direct film stripping can be carried out in the later stage; and the manufacturing method is simple, convenient and fast.
Description
Technical field
The present invention relates to flexible PCB field, particularly relate to flexible circuit board manufacturing method and the flexible PCB utilizing ink to replace adhesive tape.
Background technology
Flexible PCB (FPC) industry competition is more and more fierce, so also promoting flexible PCB manufacturing process updating optimization.In flexible PCB, existing mono-/bis-panel can not meet the demand in market, and then, multi-layer sheet demand increases day by day.In multiple-plate production process, often pad/ground connection the copper sheet etc. of patch high temperature protection adhesive tape protection internal layer, but in irregular shape due to it, skewness, and this may result in the inconvenience or tape extremely inefficient of taping.It addition, tape also can bring a great hidden danger to rear operation: below after operation tear tape, cull at internal layer pad/copper sheet, it is fabricated into turmeric operation, just directly results in Lou turmeric phenomenon.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide flexible circuit board manufacturing method and the flexible PCB utilizing ink to replace adhesive tape, it is intended to solve the problem that existing FPC multi-layer sheet manufacturing process needs to tape.
Technical scheme is as follows:
A kind of flexible circuit board manufacturing method utilizing ink to replace adhesive tape, wherein, including:
Step A, flexible PCB is carried out nog plate process；
Step B, then flexible PCB is printed anti-etching printing ink, then carry out baking-curing；
Step C, finally carry out lamination, fast pressure or pressure transmission successively and solidify, hole, heavy copper facing, make outer graphics, development etching stripping and operation afterwards.
Described flexible circuit board manufacturing method, wherein, in described step A, it is 1200# that nog plate processes the polish-brush used, current stresses: 2.5-2.8A；Nog plate speed: 2.0-2.2m/min.
Described flexible circuit board manufacturing method, wherein, in described step B, all prints anti-etching printing ink to the two sides of flexible PCB.
Described flexible circuit board manufacturing method, wherein, after first printing anti-etching printing ink of flexible PCB, toasts 15min at a temperature of 160 DEG C.
Described flexible circuit board manufacturing method, wherein, after second printing anti-etching printing ink of flexible PCB, toasts 30min at a temperature of 160 DEG C.
Described flexible circuit board manufacturing method, wherein, in described step B, the anti-etching printing ink thickness of printing is 20 ~ 40 μm.
Described flexible circuit board manufacturing method, wherein, in described step B, scraper pressure used during printing is 6-8kg/cm2。
Described flexible circuit board manufacturing method, wherein, in described step B, scraper angle used during printing is 45-60 degree.
A kind of flexible PCB, wherein, uses flexible circuit board manufacturing method as above to make.
Beneficial effect: the manufacture method in the present invention, ink is used to substitute adhesive tape, after ink printing solidification, energy high temperature high voltage resistant, adhesion is strong and chance liquid parting can easily be cleaned again, production process is simple simultaneously, production efficiency of the present invention is high, and imposite printing can be effectively improved precision, reduces off normal risk, later stage direct stripping, simple and convenient fast.
Accompanying drawing explanation
Fig. 1 is the flow chart that the present invention utilizes the flexible circuit board manufacturing method preferred embodiment of ink replacement adhesive tape.
Detailed description of the invention
The present invention provides flexible circuit board manufacturing method and the flexible PCB utilizing ink to replace adhesive tape, and for making the purpose of the present invention, technical scheme and effect clearer, clear and definite, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to the flow chart that Fig. 1, Fig. 1 are a kind of flexible circuit board manufacturing method preferred embodiment utilizing ink to replace adhesive tape of the present invention, as it can be seen, comprising:
Step S1, flexible PCB is carried out nog plate process；
Step S2, then flexible PCB is printed anti-etching printing ink, then carry out baking-curing；
Step S3, finally carry out lamination, fast pressure or pressure transmission successively and solidify, hole, heavy copper facing, make outer graphics, development etching stripping and operation afterwards.
The present invention uses ink to substitute adhesive tape, and ink has high temperature high voltage resistant after hardening, and adhesion is strong and meets the feature that liquid parting easy cleaning is clean, so the production efficiency of the present invention is high, imposite printing can be effectively improved precision, reduces off normal risk, later stage direct stripping, simple and convenient fast.
Specifically, in described step S1, before flexible PCB is carried out printing-ink, first carry out nog plate process, to ensure plate face cleanliness factor.Additionally the flexible PCB of milled need to print at 4h, the most easily aoxidizes.If flexible PCB process standing time is oxidized, the plate of oxidation need to return overground printed line and process.
In nog plate processes, the polish-brush of employing is 1200#, uses 1 polish-brush.Current stresses during nog plate is preferably 2.5-2.8A, and nog plate speed is preferably 2.0-2.2m/min.Such as current stresses is 2.6A, and nog plate speed is 2.1m/min, under these conditions, nog plate best results, ink can be made to be uniformly distributed in the surface of described flexible PCB.
Then in described step S2, carry out ink printing.Anti-etching printing ink is preferably all printed in the two sides of flexible PCB by the present invention, more preferably to protect the pad/ground connection copper sheet etc. of internal layer.
Specifically, the cure parameter after two-face printing ink is different, specific as follows: after first printing anti-etching printing ink of flexible PCB, toast 15min at a temperature of 160 DEG C.
And after second printing anti-etching printing ink to flexible PCB, at a temperature of 160 DEG C, toast 30min.
I.e. after first printing anti-etching printing ink, its baking time is shorter, because after printing anti-etching ink at second, also can toast, such first face also can obtain repeating baking.In the present invention, after preferably printing anti-etching ink at first, at a temperature of 160 DEG C, toast 15min, and after printing anti-etching ink at second, at a temperature of 160 DEG C, toast 30min.So the ink on two sides can completion of cure, can ensure that again the ink of first will not over-curing.
It addition, whether at first or at second, after printing anti-etching ink, need standing a period of time to solidify, such as selecting time of repose in the present invention is 10min, and so before solidification, ink can natural drying a period of time again.
Anti-etching printing ink of the present invention is preferably anti-etching printing ink.The feature of anti-etching printing ink is to have anti-etching function, is mainly made up of acrylic resin and polymer etc..
It addition, whether at first or at second, printed anti-etching printing ink thickness is both preferably 20 ~ 40 μm, such as be 30 μm, can be protected against the pad/ground connection copper sheet etc. of internal layer, ink can be prevented again blocked up, impact is normal to be used.
The scraper pressure used when printing-ink is 6-8kg/cm2, such as scraper pressure is 7kg/cm2, under this condition, ink can even print on flexible PCB surface, and can be compacted.
Further, in described step S2, scraper angle used during printing is 45-60 degree, scraper angle is the key factor affecting the ink uniformity, so present invention preferably employs the scraper angle of 50 degree, under this parameter, ink is uniformly sprawled, it is more flat that ink can be scraped, and has enough printing efficiencies.
In printing process, it should not off normal, do not reveal orifice ring, oil-tight, bubble-free, to guarantee printing effect.
In printing process, film engineering design requirements is as follows: ink than pad >=1MM, AD edge than ink >=1MM.And as follows for printing room environmental requirement: temperature: 21 ± 3 DEG C, humidity: 55% ± 10%.Under these conditions, ink can cover pad/ground connection copper sheet etc. comprehensively, plays a good protection, and does not also interfere with ink quality simultaneously.
In step s3, according to general procedure, carry out lamination, fast pressure or pressure transmission successively and solidify, hole, heavy copper facing, make outer graphics, development etching stripping and operation afterwards.
Owing to the present invention uses the mode of printing-ink, when making outer graphics, after waste material copper sheet etches away, exposed ink will be rinsed out by alkalescence liquid parting, and the most protected internal layer pad/ground connection copper sheet just displays, and has been finally reached the purpose of protection.
On the whole, by above-mentioned improvement, the manufacture method flow process of flexible PCB will be by following original flow process:
... → assemble-patch high temperature protection adhesive tape → lamination → fast/pressure transmission solidification → boring → heavy copper facing → outer graphics → development etching stripping → tear tape → rear operation →...
It is modified to new technological process:
... → silk-screen-print anti-etching printing ink → baking-curing → lamination → fast/pressure transmission solidification → boring → heavy copper facing → outer graphics → development etching stripping → rear operation →...
The present invention also provides for a kind of flexible PCB, and it uses flexible circuit board manufacturing method as above to make.
The present invention is to upgrade on the basis of dry film replaces adhesive tape；Dry film can cover through hole, causes orifice ring corrosion, but be weak to long High Temperature High Pressure in preventing liquid medicine access aperture, and this can make dry film the most crisp fragile；And after the present invention uses ink printing solidification, energy high temperature high voltage resistant, adhesion is strong and chance liquid parting can easily be cleaned again, produces simple efficiency high simultaneously.
In the present invention, after imposite print anti-etching printing ink, solidifying, pad/ground connection copper sheet the shape of inner tube layer needs protection is not how, and distribution is the most random, can realize accurate covering protection, thus applied widely, easy to use.
The production efficiency of the present invention is high, it is not necessary to single pcs/set manually pastes, and imposite printing can be effectively improved precision, reduces off normal risk.In the rear operation of traditional method, need tear tape, waste time and energy, there is also cull phenomenon.Direct stripping in the present invention, simple and convenient fast.
In sum, manufacture method in the present invention, uses ink to substitute adhesive tape, after ink printing solidification, energy high temperature high voltage resistant, adhesion is strong and chance liquid parting can easily be cleaned again, and production process is simple simultaneously, and production efficiency of the present invention is high, imposite printing can be effectively improved precision, reduce off normal risk, later stage direct stripping, simple and convenient fast.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, all these modifications and variations all should belong to the protection domain of claims of the present invention.
Claims (9)
1. one kind utilizes the flexible circuit board manufacturing method that ink replaces adhesive tape, it is characterised in that including:
Step A, flexible PCB is carried out nog plate process；
Step B, then flexible PCB is printed anti-etching printing ink, then carry out baking-curing；
Step C, finally carry out lamination, fast pressure or pressure transmission successively and solidify, hole, heavy copper facing, make outer graphics, development etching stripping and operation afterwards.
Flexible circuit board manufacturing method the most according to claim 1, it is characterised in that in described step A, it is 1200# that nog plate processes the polish-brush used, current stresses: 2.5-2.8A；Nog plate speed: 2.0-2.2m/min.
Flexible circuit board manufacturing method the most according to claim 1, it is characterised in that in described step B, all prints anti-etching printing ink to the two sides of flexible PCB.
Flexible circuit board manufacturing method the most according to claim 3, it is characterised in that after first printing anti-etching printing ink of flexible PCB, toast 15min at a temperature of 160 DEG C.
Flexible circuit board manufacturing method the most according to claim 3, it is characterised in that after second printing anti-etching printing ink of flexible PCB, toast 30min at a temperature of 160 DEG C.
Flexible circuit board manufacturing method the most according to claim 1, it is characterised in that in described step B, the anti-etching printing ink thickness of printing is 20 ~ 40 μm.
Flexible circuit board manufacturing method the most according to claim 1, it is characterised in that in described step B, scraper pressure used during printing is 6-8kg/cm2。
Flexible circuit board manufacturing method the most according to claim 1, it is characterised in that in described step B, scraper angle used during printing is 45-60 degree.
9. a flexible PCB, it is characterised in that use the flexible circuit board manufacturing method as described in any one of claim 1 ~ 8 to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610448391.2A CN106028685A (en) | 2016-06-21 | 2016-06-21 | Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610448391.2A CN106028685A (en) | 2016-06-21 | 2016-06-21 | Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106028685A true CN106028685A (en) | 2016-10-12 |
Family
ID=57085591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610448391.2A Pending CN106028685A (en) | 2016-06-21 | 2016-06-21 | Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106028685A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109375479A (en) * | 2018-12-26 | 2019-02-22 | 广东台名智能设备有限公司 | A kind of UV LED cold light source projection mask aligner of pcb board and technique |
| CN113543531A (en) * | 2021-06-25 | 2021-10-22 | 江西红板科技股份有限公司 | Method for processing soft and hard combined board with multiple surface treatment processes in soft board area |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN101986773A (en) * | 2010-11-03 | 2011-03-16 | 东莞红板多层线路板有限公司 | Method for manufacturing combined rigid/flexible circuit board |
| CN102883545A (en) * | 2012-09-17 | 2013-01-16 | 东莞康源电子有限公司 | Protection process for inner layer welding point of soft and hard combined plate |
| CN103730374A (en) * | 2012-10-15 | 2014-04-16 | 深南电路有限公司 | Process for manufacturing cavity of package substrate |
| CN104486911A (en) * | 2014-10-31 | 2015-04-01 | 镇江华印电路板有限公司 | Manufacturing technology for flex-rigid joint board having welding disc or golden finger at inner layer |
| CN105472913A (en) * | 2015-12-28 | 2016-04-06 | 深圳市景旺电子股份有限公司 | Multi-layer board production method adopting dry film to replace high temperature adhesive tape |
-
2016
- 2016-06-21 CN CN201610448391.2A patent/CN106028685A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN101986773A (en) * | 2010-11-03 | 2011-03-16 | 东莞红板多层线路板有限公司 | Method for manufacturing combined rigid/flexible circuit board |
| CN102883545A (en) * | 2012-09-17 | 2013-01-16 | 东莞康源电子有限公司 | Protection process for inner layer welding point of soft and hard combined plate |
| CN103730374A (en) * | 2012-10-15 | 2014-04-16 | 深南电路有限公司 | Process for manufacturing cavity of package substrate |
| CN104486911A (en) * | 2014-10-31 | 2015-04-01 | 镇江华印电路板有限公司 | Manufacturing technology for flex-rigid joint board having welding disc or golden finger at inner layer |
| CN105472913A (en) * | 2015-12-28 | 2016-04-06 | 深圳市景旺电子股份有限公司 | Multi-layer board production method adopting dry film to replace high temperature adhesive tape |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109375479A (en) * | 2018-12-26 | 2019-02-22 | 广东台名智能设备有限公司 | A kind of UV LED cold light source projection mask aligner of pcb board and technique |
| CN113543531A (en) * | 2021-06-25 | 2021-10-22 | 江西红板科技股份有限公司 | Method for processing soft and hard combined board with multiple surface treatment processes in soft board area |
| CN113543531B (en) * | 2021-06-25 | 2023-01-13 | 江西红板科技股份有限公司 | Method for processing soft and hard combined board with multiple surface treatment processes in soft board area |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5474097B2 (en) | Touch screen and manufacturing method thereof | |
| KR101191003B1 (en) | Conductive patterns and method for manufacturing the same | |
| CN104267848B (en) | A kind of contact panel and preparation method thereof | |
| CN101765298B (en) | Processing technology of printed circuit board | |
| CN107493662B (en) | Method for manufacturing carbon oil with low resistance value and thickness of more than or equal to 25um on printed circuit board | |
| WO2020024937A1 (en) | Method for improving height-differential drilling of rigid-flex pcb | |
| CN106028685A (en) | Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board | |
| TW201419965A (en) | Method for manufacturing circuit | |
| JP2008283042A (en) | Manufacturing method of light transmissive electromagnetic wave shielding member | |
| CN1996144A (en) | Method for making hole-plugging ink composition for printed circuit board plating through hole and printed circuit board | |
| CN101772270B (en) | Preprocessing method for image transfer of flexible PCB (printed circuit board) | |
| CN204189149U (en) | A kind of contact panel | |
| CN110430689B (en) | Manufacturing method of double-sided ink for through hole of thin plate | |
| CN206452594U (en) | A kind of use liquid photosensitive PI flexible electric circuit board | |
| CN206237670U (en) | Metallization flexible base plate | |
| CN108124387B (en) | A kind of FPC line pattern production method | |
| KR101431225B1 (en) | Pattern forming method by transferring of ink | |
| JPH1040808A (en) | Thick-film pattern forming method | |
| US9223201B2 (en) | Method of manufacturing a photomask with flexography | |
| CN106535489A (en) | Selective immersion tin method | |
| JP2011069938A5 (en) | ||
| WO2022006785A1 (en) | Method for preparing circuit board | |
| WO2023123804A1 (en) | Conductive pattern and method for forming same | |
| CN206380175U (en) | Based on the pcb board for improving light blocking performance | |
| JP2008235653A (en) | Method for forming emi shielding member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |