CN102883545A - Protection process for inner layer welding point of soft and hard combined plate - Google Patents
Protection process for inner layer welding point of soft and hard combined plate Download PDFInfo
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- CN102883545A CN102883545A CN2012103453447A CN201210345344A CN102883545A CN 102883545 A CN102883545 A CN 102883545A CN 2012103453447 A CN2012103453447 A CN 2012103453447A CN 201210345344 A CN201210345344 A CN 201210345344A CN 102883545 A CN102883545 A CN 102883545A
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- rigid flex
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Abstract
The invention provides a protection process for an inner layer welding point of a soft and hard combined plate. The protection process comprises the following steps of: 1, supplying a soft and hard combined thin plate, wherein the soft and hard combined thin plate has an inner layer welding point structure; 2, performing silk screening on a circuit board at the inner layer welding point structure of the soft and hard combined thin plate by ink; 3, supplying a plurality of copper foils and a plurality of prepregs; 4, setting laminated positions between the copper foils, the prepregs and the soft and hard combined thin plate according to a requirement of the finished soft and hard combined plate, and laminating; 5, performing film drying process according to the requirement of the finished soft and hard combined plate; 6, performing etching process; and 7, eliminating the ink, and exposing an inner layer circuit board. By the protection process for the inner layer welding point of the soft and hard combined plate, the circuit board at the inner layer welding point is prevented from being corroded during etching; the flow of the process is simple; the circuit board at the inner layer welding point can be well protected from being corroded; and the quality of the soft and hard combined plate is guaranteed.
Description
Technical field
The present invention relates to the Rigid Flex field, relate in particular to a kind of protection technique of Rigid Flex internal layer circuit plate.
Background technology
Industry, Medical Devices, 3G mobile, LCD TV and other consumer electronics as: the continuous expansion of the portable type electronic product market demands such as the hard disk drive that electronic computer is used, floppy disk, mobile phone, notebook computer, camera, video camera, PDA, electronic equipment are more and more towards the future development of light, thin, short, little and multifunction.The particularly application of the flexible board of high density interconnection structure (HDI) usefulness, the fast development of flexible printed circuit technology will greatly be driven, while is along with development and the raising of printed circuit technique, the developmental research of Rigid Flex (Rigid-Flex PCB) also gets a lot of applications, and estimates that the global from now on supply of Rigid Flex will roll up.Simultaneously, the durability of Rigid Flex and flexible also makes it be more suitable for using the market share of progressively nibbling rigidity PCB in medical treatment and military field.
The technique but the tradition of existing Rigid Flex is uncapped, mainly contain MILL plate (cold-reduced sheet), fill out pad, blade cuts etc., but reveal pad (PAD) and finish the Rigid Flex of thickness of slab below 0.4mm, the quality hidden danger that internal layer PAD weathers when occurring uncapping easily for internal layer.
Summary of the invention
The object of the present invention is to provide a kind of protection technique of Rigid Flex inner welded point, technological process is simple, can protect well the wiring board at inner welded point place not weather, and has guaranteed the quality of Rigid Flex.
For achieving the above object, the invention provides a kind of protection technique of Rigid Flex inner welded point, it is characterized in that, may further comprise the steps:
Step 1, provide soft or hard in conjunction with thin plate, described soft or hard has the inner welded dot structure in conjunction with thin plate;
Step 2, soft or hard in conjunction with the wiring board at the inner welded dot structure place of thin plate on ink for screen printing;
Step 3, provide several pieces Copper Foils and several prepregs;
Step 5, carry out dried film process operation according to the requirement of finished product Rigid Flex;
Step 6, carry out the etch process operation;
Step 7, printing ink is returned, exposed the wiring board at inner welded dot structure place.
Described printing ink is not etched for the protection of the wiring board at inner welded dot structure place.
In the described step 3 for two Copper Foils and two prepregs are provided.
Described step 4 places soft or hard between two prepregs in conjunction with thin plate, and carries out pressing for the requirement according to the finished product Rigid Flex places two prepregs between two Copper Foils.
Described step 5 may further comprise the steps:
Step 5.1, provide dry film, egative film and pad;
Step 5.2, dry film is adhered on the Copper Foil, and pad is set on dry film according to the requirement of finished product Rigid Flex, at last egative film is placed on the pad;
Step 5.3, expose, develop.
Also comprise before the described step 5.2 copper foil surface is carried out clean.
The described method that copper foil surface is carried out clean comprises: mechanical nog plate method and chemical cleaning.
The position that pad is set on the dry film in the described step 5.2 is the position of windowing.
Described step 6 is for to etch away pads placement and outer-layer circuit.
Beneficial effect of the present invention: the protection process using printing ink protection inner welded point place wiring board of Rigid Flex inner welded point of the present invention does not weather when etching; and adopt Copper Foil and prepreg to carry out Multi-layer force fit; technological process is simple; can protect well the wiring board at inner welded point place not weather, guarantee the quality of Rigid Flex.
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention is described in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In the accompanying drawing,
Fig. 1 is the flow chart of the protection technique of Rigid Flex inner welded point of the present invention;
Fig. 2 is the protection technique of Rigid Flex inner welded point of the present invention schematic diagram in kind.
Embodiment
Technological means and the effect thereof taked for further setting forth the present invention are described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
See also Fig. 1 and 2, the invention provides a kind of protection technique of Rigid Flex inner welded point, it may further comprise the steps:
Step 1, provide soft or hard in conjunction with thin plate 2, described soft or hard has inner welded dot structure 22 in conjunction with thin plate 2;
Step 2, soft or hard in conjunction with the wiring board at inner welded dot structure 22 places of thin plate 2 on ink for screen printing 4;
Described printing ink 4 is not etched in back segment etch process flow process for the protection of the wiring board at inner welded dot structure 22 places, and then protects well inner welded dot structure 22 wiring boards.
Step 3, provide several pieces Copper Foils 8 and several prepregs 6;
Described several Copper Foils 8 and several prepregs 6 are used for carrying out Multi-layer force fit.In the present embodiment, in the described step 3 for two Copper Foils 8 and two prepregs 6 are provided.
In the present embodiment, described step 4 places soft or hard between two prepregs 6 in conjunction with thin plate 2, and carries out pressing for the requirement according to the finished product Rigid Flex places two prepregs 6 between two Copper Foils 8.
Step 5, carry out dried film process operation according to the requirement of finished product Rigid Flex;
Described step 5 may further comprise the steps:
Step 5.1, provide dry film, egative film and pad (not shown);
Step 5.2, dry film is adhered on the Copper Foil 8, and pad is set on dry film according to the requirement of finished product Rigid Flex, at last egative film is placed on the pad;
In this step pads placement is designed to window, and in subsequent step, does figure with circuit and shift.
Before adhering to dry film, also clean is carried out on Copper Foil 8 surfaces, clean out Copper Foil 8 lip-deep oxides, spot, it is coarse to increase simultaneously Copper Foil 8 surface microscopics, increases the contact area on dry film and Copper Foil 8 surfaces.The described method that clean is carried out on Copper Foil 8 surfaces comprises: mechanical nog plate method and chemical cleaning.
Step 5.3, expose, develop.
The used exposure machine light source that exposes selectes according to actual needs and the time for exposure is set according to actual needs, and both all can adopt existing technique to finish.
Step 6, carry out the etch process operation;
The position that pad is set on the dry film in the described step 5.2 is the position of windowing, and just pads placement and outer unexposed Copper Foil 8 etch away.
Step 7, printing ink 4 is returned, exposed the wiring board at inner welded dot structure 22 places.Printing ink 4 is returned, exposed the wiring board at inner welded dot structure 22 places, finish the making of Rigid Flex, guaranteed well the quality of Rigid Flex.
In sum; the invention provides a kind of protection technique of Rigid Flex inner welded point; adopt printing ink protection inner welded point place wiring board when etching, not weather; and adopt Copper Foil and prepreg to carry out Multi-layer force fit; technological process is simple; can protect well the wiring board at inner welded point place not weather, guarantee the quality of Rigid Flex.
The above for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of claim of the present invention.
Claims (9)
1. the protection technique of a Rigid Flex inner welded point is characterized in that, may further comprise the steps:
Step 1, provide soft or hard in conjunction with thin plate, described soft or hard has the inner welded dot structure in conjunction with thin plate;
Step 2, soft or hard in conjunction with the wiring board at the inner welded dot structure place of thin plate on ink for screen printing;
Step 3, provide several pieces Copper Foils and several prepregs;
Step 4, Copper Foil, prepreg and soft or hard are set in conjunction with the stacked position between the thin plate according to the requirement of finished product Rigid Flex, and carry out pressing;
Step 5, carry out dried film process operation according to the requirement of finished product Rigid Flex;
Step 6, carry out the etch process operation;
Step 7, printing ink is returned, exposed the wiring board at inner welded dot structure place.
2. the protection technique of Rigid Flex inner welded point as claimed in claim 1 is characterized in that, described printing ink is not etched for the protection of the wiring board at inner welded dot structure place.
3. the protection technique of Rigid Flex inner welded point as claimed in claim 1 is characterized in that, in the described step 3 for two Copper Foils and two prepregs are provided.
4. the protection technique of Rigid Flex inner welded point as claimed in claim 3; it is characterized in that; described step 4 places soft or hard between two prepregs in conjunction with thin plate, and carries out pressing for the requirement according to the finished product Rigid Flex places two prepregs between two Copper Foils.
5. the protection technique of Rigid Flex inner welded point as claimed in claim 1 is characterized in that, described step 5 may further comprise the steps:
Step 5.1, provide dry film, egative film and pad;
Step 5.2, dry film is adhered on the Copper Foil, and pad is set on dry film according to the requirement of finished product Rigid Flex, at last egative film is placed on the pad;
Step 5.3, expose, develop.
6. the protection technique of Rigid Flex inner welded point as claimed in claim 5 is characterized in that, also comprises before the described step 5.2 copper foil surface is carried out clean.
7. the protection technique of Rigid Flex inner welded point as claimed in claim 6 is characterized in that, the described method that copper foil surface is carried out clean comprises: mechanical nog plate method and chemical cleaning.
8. the protection technique of Rigid Flex inner welded point as claimed in claim 5 is characterized in that, the position that pad is set on the dry film in the described step 5.2 is the position of windowing.
9. the protection technique of Rigid Flex inner welded point as claimed in claim 5 is characterized in that, described step 6 is for to etch away pads placement and outer-layer circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210345344.7A CN102883545B (en) | 2012-09-17 | 2012-09-17 | Protection process for inner layer welding point of soft and hard combined plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210345344.7A CN102883545B (en) | 2012-09-17 | 2012-09-17 | Protection process for inner layer welding point of soft and hard combined plate |
Publications (2)
| Publication Number | Publication Date |
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| CN102883545A true CN102883545A (en) | 2013-01-16 |
| CN102883545B CN102883545B (en) | 2015-04-22 |
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| CN201210345344.7A Active CN102883545B (en) | 2012-09-17 | 2012-09-17 | Protection process for inner layer welding point of soft and hard combined plate |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028685A (en) * | 2016-06-21 | 2016-10-12 | 深圳市景旺电子股份有限公司 | Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board |
| CN106231820A (en) * | 2016-07-29 | 2016-12-14 | 台山市精诚达电路有限公司 | Rigid Flex processing method |
| CN106341944A (en) * | 2016-09-29 | 2017-01-18 | 深圳市景旺电子股份有限公司 | Rigid-flex PCB capable of protecting inner-layer pads and manufacturing method of rigid-flex PCB |
| CN106961810A (en) * | 2017-04-20 | 2017-07-18 | 高德（无锡）电子有限公司 | A kind of production method using the Rigid Flex finished product of pressing production twice |
| CN111867248A (en) * | 2019-04-24 | 2020-10-30 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
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| US20070096652A1 (en) * | 2005-10-28 | 2007-05-03 | Chao-Jen Chang | Methods for fabricating step-formed patterned layer and frbricating rib of plasma display panel |
| CN101878679A (en) * | 2007-11-30 | 2010-11-03 | 索尼化学&信息部件株式会社 | Method for manufacturing multilayer printed wiring board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106028685A (en) * | 2016-06-21 | 2016-10-12 | 深圳市景旺电子股份有限公司 | Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board |
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| CN106341944A (en) * | 2016-09-29 | 2017-01-18 | 深圳市景旺电子股份有限公司 | Rigid-flex PCB capable of protecting inner-layer pads and manufacturing method of rigid-flex PCB |
| CN106341944B (en) * | 2016-09-29 | 2018-09-07 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board and preparation method thereof for protecting internal layer pad |
| CN106961810A (en) * | 2017-04-20 | 2017-07-18 | 高德（无锡）电子有限公司 | A kind of production method using the Rigid Flex finished product of pressing production twice |
| CN111867248A (en) * | 2019-04-24 | 2020-10-30 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
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|---|---|
| CN102883545B (en) | 2015-04-22 |
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