CN101878679A

CN101878679A - Method for manufacturing multilayer printed wiring board

Info

Publication number: CN101878679A
Application number: CN2008801183337A
Authority: CN
Inventors: 西尾健; 浦辻淳广
Original assignee: Sony Chemical and Information Device Corp
Current assignee: Dexerials Corp
Priority date: 2007-11-30
Filing date: 2008-11-27
Publication date: 2010-11-03
Also published as: WO2009069683A1; JPWO2009069683A1

Abstract

Disclosed is a method for exposing an inner layer of a multilayer printed wiring board. In the method, a first pattern (3) is formed at least on one surface (2a) of a first insulating layer (2), and an alkali-soluble ink layer (13) is formed in an exposure region (11) from which the first wiring pattern (3) on the first insulating layer (2) is to be exposed. Furthermore, a second insulating layer (4) is formed on the surface of the first insulating layer (2) whereupon the ink layer is formed so that the ink layer (13) is exposed from the second insulating layer (4), a metal layer (14) is formed on the second insulating layer (4), and a second wiring pattern (5) is formed by patterning the metal layer (14). Then, the ink layer (13) is dissolved and removed, and the first insulating layer (2) and the first wiring pattern (3) are exposed in the exposure region (11).

Description

The manufacture method of multilayer printed-wiring board

Technical field

The present invention relates to the manufacture method of the multilayer printed-wiring board that the part of internal layer exposes.

Background technology

Multilayer printed-wiring board is because the requirement of small-sized, the light weight of in recent years electronic equipment, high performance is required the different multilayer printed-wiring board in techonosphere fractional part ground.For example,, exist and do not connect multilayer rigidity (rigid) substrate each other with the flexible base, board cable, form the hard and soft property printed wiring board of integral structure via connector owing to improve the purpose of the degree of freedom of device design.In addition,, require low thickness, require part with semiconductor element mounted thereon as so-called cavity body structure (cavity structure) as the encapsulation purposes.And then, in nearest hard and soft property printed wiring board, not only flexible part is only used as the cable applications between rigid substrates, and the trend of utilizing energetically as the LCD linking part of parts installation portion, LCD module or connector connecting portion is arranged.

Common hard and soft property printed wiring board forms as follows: utilize the insulation-coated of coverlay etc. to applying at the single face of the dielectric film (coverlay) of polyimide film etc. or flexible base, board that the two sides has formed wiring pattern, and then at stacked prepreg of the part that becomes rigid portion and Copper Foil or have the insulating trip of Copper Foil.

In this case, whole lining epiphragma of flexible part covers, and brings into play function as connecting the cable between rigid portion.

On the other hand, in the hard and soft property printed wiring board that flexible part is used as the connector connecting portion, flexible portion of terminal is given prominence to and is provided with from one side of rigid portion.In such portion of terminal, do not utilize the lining of the film of coverlay, the wiring pattern of flexible base, board is exposed.

As parts installation portion or LCD connecting portion and the hard and soft property printed wiring board that uses also need partly expose the wiring pattern of flexible base, board in its manufacturing process.

The wiring pattern that exposes like this is as parts installation portion, LCD connecting portion or connector connecting portion, and the reliability on its function must be high.

In the manufacture method of hard and soft property printed wiring board, following method is for example arranged, promptly on flexible base, board, be layered in bonding sheet or prepreg that the part that is equivalent to flexible part has peristome, further the copper-surfaced plate or the Copper Foil of laminated glass epoxy resin carry out multiple stratification on this bonding sheet or prepreg, the rigid portion that forms prepreg stacked etc., and form by the not stacked prepreg of above-mentioned peristome, and the flexible part that only constitutes by flexible base, board.

In the method, bonding sheet, prepreg (prepreg), Copper Foil etc. are carried out stacked when stacked owing to heat, pressurize, so the resin that can not avoid constituting bonding sheet or prepreg flows out to peristome.Particularly make in flexible part under the situation that wiring pattern exposes, resin produces electric fault attached to wiring pattern portion.In order to prevent such resin flow, when bonding sheet, prepreg, Copper Foil etc. stacked, the high resin molding of the property of softening that will be called padded coaming is usually imbedded the peristome of bonding sheet or prepreg, prevents resin flow.

; such preventing in the method; because the wiring pattern of flexible part is simultaneously etched when the outer wiring pattern of the rigid portion of back forms; so for example need with the wiring pattern of masking tape covering flexible parts such as (masking tape) etc. such append operation; not only operation becomes complicated, and the precision that requires to paste masking tape.

In addition, other manufacture method as hard and soft property printed wiring board, following method is arranged, promptly with the such polyimide film that has binding agent of Kapton Tape the part that forms flexible part is covered in advance, on this basis with the other parts multiple stratification, peel off Kapton Tape, flexible part is exposed, make hard and soft property printed wiring board., even such method also requires the stickup precision of Kapton Tape, when peeling off the Kapton Tape of the high temperature that is exposed to when stacked, high pressure, produce the residue of binding agent in addition.Particularly when the residue of binding agent is attached at the wiring pattern that flexible part exposes, after the electroplating work procedure of wiring pattern in produce fault, reduce as the connection reliability of terminal.

In addition, in hard and soft property printed wiring board,, such, the method that forms the dyke of the inflow that stops resin at flexible part of record for example arranged in following patent documentation 1 and the patent documentation 2 as preventing the method for resin to the inflow of flexible part., in such method, in flexible part, make under the situation that circuit exposes, also need above-mentioned numerous and diverse operation.

In addition, in following patent documentation 3, put down in writing the flexible part that is equivalent to the warpage book office at hard and soft property printed wiring board, by silk screen printing the thermal endurance film is printed, part beyond the warpage book office is carried out the laminates linearize and formed rigid portion, peel off the hard and soft property printed wiring board of removing the thermal endurance film.In this patent documentation 3, put down in writing and passed through to form the thermal endurance film, thereby can prevent that when multiple stratification the resin in the prepreg from flowing into the warpage book office at flexible part., in this hard and soft property printed wiring board, do not form wiring pattern at joggling part.In addition, prerequisite is to peel off the stripping means of the physics of thermal endurance film with hand.In the manufacture method of so hard and soft property printed wiring board, after the formation of rigid portion, the prepreg of thermal endurance film and adjacency is invaded mutually, therefore become the state that the thermal endurance film is very difficult to peel off, producing the residue of thermal endurance film with the border of prepreg, or when peeling off, produce scar and break at insulating barrier, can make its generation and thoroughly peel off.In addition, in the manufacture method of this hard and soft property printed wiring board, owing to adopt the method for physically peeling off the thermal endurance film, so trouble.

In addition, when using the manufacture method of this hard and soft property printed wiring board under the situation that is formed with wiring pattern at joggling part, different with the smooth face that does not form wiring pattern, the thermal endurance film is by the stacked operation of high temperature, high pressure, the male and fomale(M﹠F) that is formed by wiring pattern is adhered to strongly, be very difficult to not wiring pattern is caused damage and do not produce residue and peel off the thermal endurance film between this wiring pattern.

In addition, in following patent documentation 4, record technology at the exfoliated adhesive tape of the stacked oneself of flexible part.In this patent documentation 4,, use the adhesive tape that produces nitrogen by ultraviolet irradiation on the surface of adhesive tape as the exfoliated adhesive tape of oneself.Therefore, the self-exfoliated adhesive tape that is bonded in flexible part can easily separate from bonding plane by ultraviolet irradiation., about this patent documentation 4, also must peel off self-exfoliated adhesive tape with hand, the trouble that becomes is formed with at flexible part under the situation of the wiring pattern that exposes, and extremely is difficult to peel off self-exfoliated adhesive tape and this wiring pattern is not caused damage.

In addition, worker's law technology (for example, with reference to patent documentation 5, patent documentation 6) that internal layer is exposed is also arranged.In these technology, after stacked prepreg etc., utilize till the internal circuit of wishing to expose counterbore processing that prepreg etc. is planed and internal circuit is exposed, so bother on the operation.

As mentioned above, in the part of exposing, be formed with under the situation of wiring pattern, when peeling off for the resin that prevents prepreg flows into the part expose the film that is provided with or adhesive tape etc., peel off, break in the end that wiring pattern damage or prepreg take place or the residue of film or adhesive tape such as is producing at fault on the wiring pattern or between the wiring pattern.

Patent documentation 1: the Japan Patent spy opens the 2005-64059 communique

Patent application 2: the Japan Patent spy opens the 2006-228887 communique

Patent documentation 3: the Japan Patent spy opens the 2001-15917 communique

Patent application 4: the Japan Patent spy opens the 2006-203155 communique

Patent application 5: the special fair 07-19970 communique of Japan Patent

Patent documentation 6: the Japan Patent spy opens the 2003-179361 communique

Summary of the invention

The problem that the present invention will solve

The present invention proposes in view of so existing situation just, its purpose is to provide a kind of method of making multilayer printed-wiring board, this multilayer printed-wiring board is hard and soft property multiwiring board or rigidity multiwiring board etc., wherein, the part of the internal layer area of wiring pattern etc. is exposed, or the internal layer area of bringing into play function as cable is exposed, when making this multilayer printed-wiring board, do not make the internal layer area exposed or expose zone damage of regional adjacency with this, this external exposing does not make residue produce in the zone.

Be used to solve the scheme of problem

The manufacture method of first multilayer printed-wiring board of the present invention is characterized in that, at the formation of the single face at least wiring pattern of first insulating barrier; Form the alkali-soluble ink layer in the part that comprises above-mentioned wiring pattern on first insulating barrier; The face that ink layer on first insulating barrier forms side forms second insulating barrier, so that above-mentioned ink layer exposes from this second insulating barrier, and forms metal level on this second insulating barrier; In that above-mentioned metal level is carried out composition after forming second wiring pattern, with aqueous slkali above-mentioned ink layer is dissolved and to remove, the part of first insulating barrier and the wiring pattern on it are exposed.

In addition, the manufacture method of second multilayer printed-wiring board of the present invention is characterised in that, forms wiring pattern at the single face at least with flexual first insulating barrier; Wiring pattern formation face configuration coverlay at above-mentioned first insulating barrier; Form the alkali-soluble ink layer in the part on this coverlay; On above-mentioned coverlay, form second insulating barrier,, and on this second insulating barrier, form metal level so that above-mentioned ink layer exposes from this second ink layer; After forming wiring pattern, remove above-mentioned ink layer in that above-mentioned metal level is carried out composition, the part of coverlay is exposed with the aqueous slkali dissolving.。

The effect of invention

In the manufacture method of first, second multilayer printed-wiring board of the present invention, for parts install or connect with and internal memory is exposed, on internal layer, form ink layer, form insulating barrier or metal level, with aqueous slkali the ink layer on the internal layer is dissolved afterwards and remove, therefore, the exposing the zone or do not damage of the internal layer that exposes thus with insulating barrier that exposes regional adjacency etc., and then do not produce the residue of ink layer yet.

Description of drawings

Fig. 1 is the profile of the multilayer printed-wiring board of first execution mode made by the manufacture method of having used multilayer printed-wiring board of the present invention.

Fig. 2 is the profile of the state of expression two sides copper-surfaced core substrate.

Fig. 3 is the profile that is illustrated in the state that has formed first wiring pattern and the 3rd wiring pattern on the core substrate.

Fig. 4 is the profile that has formed the state of ink layer in exposing the zone.

Fig. 5 be in the core substrate mounting profile of state of layer of prepreg and Copper Foil.

Fig. 6 is expression with the profile of the stacked state after integrated of core substrate, layer of prepreg, Copper Foil.

Fig. 7 is the profile that expression has formed the state of via hole, through hole.

Fig. 8 is the profile that expression has formed the state of outer field wiring pattern.

Fig. 9 is illustrated in the profile that the state of electronic unit has been installed in the wiring pattern that exposes zone formation.

Figure 10 is the profile of the multilayer printed-wiring board of second execution mode made by the manufacture method of having used multilayer printed-wiring board of the present invention.

Figure 11 is illustrated in the manufacture method of multilayer printed-wiring board of second execution mode, is exposing the profile that the zone has formed the state of ink layer.

Figure 12 is illustrated in the manufacture method of multilayer printed-wiring board of second execution mode, with the profile of the stacked state after integrated of core substrate, layer of prepreg, Copper Foil.

Figure 13 is illustrated in the manufacture method of multilayer printed-wiring board of second execution mode, has formed the profile of the state of outer field wiring pattern.

Figure 14 is the profile of the multilayer printed-wiring board of the 3rd execution mode made by the manufacture method of having used multilayer printed-wiring board of the present invention.

Figure 15 is illustrated in the manufacture method of multilayer printed-wiring board of the 3rd execution mode, makes first profile that exposes the state that exposes in the zone.

Figure 16 is illustrated in first to expose the zone and second expose the profile that the zone has formed the state of ink layer.

Figure 17 is the profile that is illustrated in the state that has formed duplexer in the manufacture method.

Figure 18 is the profile of the hard and soft property printed wiring board of the 4th execution mode made by the manufacture method of having used multilayer printed-wiring board of the present invention.

Figure 19 is illustrated in the manufacture method of multilayer printed-wiring board of the 4th execution mode, has formed the profile of the state of first wiring pattern and the 3rd wiring pattern on flexible base, board.

Figure 20 is illustrated in the manufacture method of multilayer printed-wiring board of the 4th execution mode, the profile of the state of stacked first coverlay and second coverlay on flexible base, board.

Figure 21 is illustrated in the manufacture method of multilayer printed-wiring board of the 4th execution mode, the profile of the state of stacked first～the 3rd ink layer on flexible base, board.

Figure 22 is illustrated in the manufacture method of multilayer printed-wiring board of the 4th execution mode, on flexible base, board mounting the profile of state of coverlay, layer of prepreg and Copper Foil.

Figure 23 is illustrated in the manufacture method of multilayer printed-wiring board of the 4th execution mode, with the profile of the stacked state after integrated of flexible base, board, coverlay, layer of prepreg, Copper Foil.

Figure 24 is illustrated in the manufacture method of multilayer printed-wiring board of the 4th execution mode, formed the profile of the state of via hole, through hole.

Figure 25 is illustrated in the manufacture method of multilayer printed-wiring board of the 4th execution mode, has formed the profile of the state of outer field wiring pattern.

Figure 26 is the plane graph of the multilayer printed-wiring board of the 5th execution mode made by the manufacture method of having used multilayer printed-wiring board of the present invention.

Figure 27 is the profile of the line segment X-X among Figure 26.

Figure 28 is illustrated in the manufacture method of multilayer printed-wiring board of the 5th execution mode the profile of the state before the flexible portion of terminal stamping-out.

Description of reference numerals

1 multilayer printed-wiring board

2 first insulating barriers (core substrate)

A face of 2a core substrate

Another face of 2b core substrate

2c via hole (via)

3 first wiring patterns

4 second insulating barriers (first layer of prepreg)

The peristome of 4a first layer of prepreg

5 second wiring patterns

6 the 3rd wiring patterns

7 the 3rd insulating barriers (second layer of prepreg)

The peristome of 7a second layer of prepreg

8 the 4th wiring patterns

9 via holes

10 through holes (through hole)

11 expose the zone

12 Copper Foils

13 ink layer

14 Copper Foils

15 Copper Foils

16 duplexers

17 dry film photoresists

18 dry film photoresists

19 electronic units

20 multilayer printed-wiring boards

21 expose the zone

22 ink layer

23 multi-layer laminates

30 multilayer printed-wiring boards

31 first insulating barriers (core substrate)

A face of 31a core substrate

Another face of 31b core substrate

The 31c via hole

32 first wiring patterns

33 second insulating barriers (first layer of prepreg)

The peristome of 33a first layer of prepreg

34 second wiring patterns

35 the 3rd insulating barriers (second layer of prepreg)

The peristome of 35a second layer of prepreg

36 the 3rd wiring patterns

37 the 4th wiring patterns

38 the 4th insulating barriers (the 3rd layer of prepreg)

39 the 5th wiring patterns

40 the 5th insulating barriers (the 4th layer of prepreg)

41 the 6th wiring patterns

42 via holes

43 via holes

44 through holes

45 first expose the zone

46 second expose the zone

47 ink layer

48 Copper Foils

49 Copper Foils

50 hard and soft property printed wiring boards

The flexible part of 51 hard and soft property printed wiring boards 50

First rigid portion of 52 hard and soft property printed wiring boards 50

Second rigid portion of 53 hard and soft property printed wiring boards 50

54 first insulating barriers (flexible base, board)

A face of 54a flexible base, board

Another face of 54b flexible base, board

55 first wiring patterns

56 first coverlays

The peristome of 56a first coverlay

57 second coverlays

58 zones

59 zones

60 second insulating barriers (first layer of prepreg)

The peristome of 60a first layer of prepreg

The peristome of 60b first layer of prepreg

The peristome of 60c first layer of prepreg

61 second wiring patterns

62 the 3rd wiring patterns

63 the 3rd insulating barriers (second layer of prepreg)

64 the 4th wiring patterns

65 via holes

66 via holes

67 expose the zone

68 through holes

69 first ink layer

70 second ink layer

71 the 3rd ink layer

72 Copper Foils

73 Copper Foils

74 duplexers

75 resists

76 resists

80 multilayer printed-wiring boards

The rigid portion of 81 multilayer printed-wiring boards 80

The flexible portion of terminal of 82 multilayer printed-wiring boards 80

The flexible portion of terminal of 83 multilayer printed-wiring boards 80

84 flexible base, boards

85 first wiring patterns

86 coverlays

87 insulating barriers

88 second wiring patterns

89 solder resists

90 electronic unit installation regions

91 expose the zone

92 goods portions

93 goods outsides

Embodiment

Below, with reference to accompanying drawing the manufacture method of having used multilayer printed-wiring board of the present invention is at length described.Have, in each figure, prosign is represented same or equal structural element again.

At first, first execution mode as the manufacture method of having used first multilayer printed-wiring board of the present invention, at the two sides multilayer printed-wiring board (below, only be called multilayer printed-wiring board) manufacture method describe, but before the explanation of this manufacture method, describe at multilayer printed-wiring board by this manufacture method manufacturing.

Multilayer printed-wiring board 1 as shown in Figure 1, a face 2a at the core substrate 2 that becomes first insulating barrier forms first wiring pattern 3, stacked thereon second insulating barrier 4 that is formed by first prepreg with cementability and insulating properties is formed with second wiring pattern 5 on this second insulating barrier 4.Another face 2b at core substrate 2 forms the 3rd wiring pattern 6, and stacked thereon the 3rd insulating barrier 7 that is formed by second prepreg with cementability and insulating properties is formed with the 4th wiring pattern 8 on the 3rd insulating barrier 7.In this multilayer printed-wiring board 1, be formed with the via hole 2c that first wiring pattern 3 and the 3rd wiring pattern 6 are electrically connected at core substrate 2.And then, be formed with the via hole 9 that first wiring pattern 3 and second wiring pattern 5 are electrically connected at this multilayer printed-wiring board 1, the through hole 10 that first wiring pattern 3, second wiring pattern 5, the 3rd wiring pattern 6, the 4th wiring pattern 8 are electrically connected.

In this multilayer printed-wiring board 1, do not have stacked insulating barrier 4 by the part that comprises first wiring pattern 3 on core substrate 2, thereby have that the part of core substrate 2 and first wiring pattern 3 on it expose expose zone 11.Therefore, in this multilayer printed-wiring board 1, expose zone 11 and become concavity, for example install under the situation of electronic unit on first wiring pattern 3 in this exposes zone 11, can seek low thickness.

Such multilayer printed-wiring board 1 can be made as follows.

At first, as shown in Figure 2, prepare to be provided with the core substrate 2 of Copper Foil 12 on the two sides.The thermal endurance of this core substrate 2, mechanical strength, electrical characteristic are superior, for example use the resin of polyimides, epoxy resin, phenolic resins, BT resin etc.

Then, as shown in Figure 3, the via hole 2c that forms first wiring pattern 3, the 3rd wiring pattern 6 and first wiring pattern 3 is electrically connected with the 3rd wiring pattern 6.Formation method as via hole 2c, for example have from another face 2b of the core substrate 2 of Fig. 2, by laser to the Copper Foil 12 of the part that forms via hole 2c and the method that core substrate 2 carries out perforate, or after the Copper Foil 12 of removing the part that forms via hole 2c by etching, core substrate 2 is carried out method of perforate etc. by laser etc., surperficial whole enforcement in the hole that forms by these methods utilizes the copper of electrolytic copper free electroplating method or cathode copper galvanoplastic to electroplate, and forms via hole 2c.In addition, as via hole 2c, after utilizing formation through holes such as drill bit, implement copper and electroplate and form reach through hole and also can.Then, in the not etched mode of via hole 2c that forms, forming resist on the via hole 2c and on the Copper Foil 12 of formation first wiring pattern 3, for example the Copper Foil 12 of a face 2a being arranged on core substrate 2 is carried out etching, form first wiring pattern 3 with relief method (Subtractive Method).The 3rd wiring pattern 6 for example carries out etching with relief method to the Copper Foil 12 of another face 2b of being arranged on core substrate 2 and forms similarly.

Then, as shown in Figure 4, expose zone 11, apply the ink of alkali-soluble, form ink layer 13 what make that first wiring pattern 3 exposes.This ink layer 13 for example is printed onto the ink of alkali-soluble with the printing process of silk screen printing, ink jet printing etc. exposes zone 11, makes its drying, is solidified to form with suitable condition.As ink, use the ink of alkali-soluble, the preferred use at the weak caustic solution that is used for dry film photoresist is developed do not dissolved but at the soluble ink of aqueous slkali that is used for removing the dry film photoresist that solidifies by exposure.

This ink layer 13 as shown in Figure 5, with in ensuing operation on first wiring pattern 3 the roughly the same thickness of stacked first layer of prepreg 4 form.

Then, as shown in Figure 5, the face that the ink layer on core substrate 2 forms side forms layer of prepreg 4, so that ink layer 13 is towards foreign side.That is, the mode of exposing from first layer of prepreg 4 with ink layer 13 forms this first layer of prepreg 4.Particularly, configuration first layer of prepreg 4 in the part that does not form ink layer 13 of a face 2a of the core substrate that has formed ink layer 13 is in whole configuration second layer of prepreg 7 of another face 2b of core substrate 2.First layer of prepreg 4 in the position corresponding with ink layer 13, formed the peristome 4a of the size that ink layer 13 can be inserted in advance by stamping-out etc. with metal pattern etc. before being laminated on first wiring pattern 3.This peristome 4a is in order to prevent and ink layer 13 overlapping or offsets, even also can flow to the degree that ink layer 13 sides can be not overlapping with ink layer 13 yet with the resin in first layer of prepreg 4 in the stacked operation of back, forms significantly than ink layer 13.When on first wiring pattern 3, forming first layer of prepreg 4, ink layer 13 is inserted among the peristome 4a configuration first layer of prepreg 4 on first wiring pattern 3.Have again,, replace prepreg as part stacked on core substrate 2, use bonding sheet (bondingsheet) also can, use after prepreg solidifies insulated substrate also can, as long as can realize function, also can use thermoplastic resin film etc. as insulating barrier.

Then, as shown in Figure 5, on first layer of prepreg 4, be configured as the Copper Foil 14 of second wiring pattern 5, on second layer of prepreg 7, be configured as the Copper Foil 15 of the 4th wiring pattern 8.Have again, in the manufacture method of this multilayer printed-wiring board, replace the configuration of first layer of prepreg 4 and configuration and the configuration of second layer of prepreg 7 and the configuration of Copper Foil 15 of Copper Foil 14, use the copper-surfaced insulated substrate that is pasted with Copper Foil also can.In this case, the zone corresponding with ink layer 13 of copper-surfaced insulated substrate is by opening in advance.

Then, with stacked press (press) part that disposes first layer of prepreg 4, second layer of prepreg 7 and

Copper Foil

14,15 is heated on one side, pressurize towards core substrate 2 sides on one side, thereby first layer of prepreg 4 of semi-cured state and 7 fusions of second layer of prepreg/flow, solidify afterwards, each layer is bonding and integrated thus, thus as shown in Figure 6, forms the duplexer 16 that is made of sandwich construction.

At this moment, when heating, pressurization, even first layer of prepreg, 4 fusions/flow also can flow into by the resin that ink layer 13 prevents to constitute first layer of prepreg 4 and expose zone 11, can prevent that resin is attached to first wiring pattern 3 that exposes or expose zone 11 and stopped up by resin.

Then, as shown in Figure 7, form via hole 9 and through hole 10.Via hole 9 can form as follows, promptly, use drill bit or form the hole by laser processing from Copper Foil 14 to first wiring patterns 3 that form second wiring pattern 5, surperficial whole enforcement in the hole that forms utilizes the copper of electrolytic copper free electroplating method or cathode copper galvanoplastic to electroplate.Through hole 10 can form as follows, promptly, the through hole that uses drill bit or connect to the Copper Foil 15 that forms the 4th wiring pattern 8 from the Copper Foil 14 that forms second wiring pattern 5 by laser processing formation, remove burr residual in through hole, utilize the copper plating of electrolytic copper free electroplating method or cathode copper galvanoplastic in surperficial whole enforcement of through hole.

Then, as shown in Figure 8, form second wiring pattern 5 and the 4th wiring pattern 8 with relief method.Particularly, at first whole on Copper Foil 14 and Copper Foil 15 forms

dry film photoresist

17,18, uses mask to carry out the exposure of

dry film photoresist

17,18 in order to form desirable wiring pattern.Afterwards, the solution by sodium acid carbonate etc. dissolves the dry film photoresist of unexposed portion to be removed, and utilizes the etching of the usual method of iron chloride or copper chloride solution afterwards, forms second wiring pattern 5 and the 4th wiring pattern 8 thus.When etching, though Copper Foil 14 dissolved the removing on the ink layer 13, ink layer 13 is remaining, can expose first wiring pattern 3 that zone 11 forms from the etching solution protection of wet etching.

Then, aqueous slkali with NaOH etc. is removed the

dry film photoresist

17,18 on second wiring pattern 5 and the 4th wiring pattern 8, and also ink layer 13 is dissolved and remove, obtain the multilayer printed-wiring board 1 of Fig. 1 that the part of core substrate 2 in exposing zone 11 and first wiring pattern 3 expose to the outside with aqueous slkali.In this operation, can not remove fully under the situation of ink layer 13, it is impregnated in the aqueous slkali, remove ink layer 13 fully and also can.Not to divest ink layer 13 or remove like this, remove, can easily, fully remove ink layer 13 thus but dissolve with aqueous slkali with physical means with hand.Have again, also can carry out removing of

dry film photoresist

17,18 and removing of ink layer 13 with different respectively operations.

In the manufacture method of above multilayer printed-wiring board 1; owing to make exposing that first wiring pattern 3 exposes form ink layer 13 in the zone 11; even so first layer of prepreg 4 is heated, pressurizes; the resin that also can prevent to constitute first layer of prepreg 4 flows into and exposes in the zone 11; can protect first wiring pattern 3, can prevent that electric fault from producing.In addition, in the manufacture method of this multilayer printed-wiring board 1, because form ink layer 13, so can easily remove ink layer 13 fully by aqueous slkali by the alkali-soluble ink.Therefore,, also can compatibly protect and expose zone 11 and first wiring pattern 3, can prevent from exposing zone 11, to produce ink layer 13 even exposing fine shape in regional 11.

In addition, in the manufacture method of this multilayer printed-wiring board 1, owing to remove ink layer 13 with aqueous slkali dissolving, thus can prevent adjacency second insulating barrier 4 the end face damage or peel off, become smooth with the end face that exposes regional 11 sides of second insulating barrier 4 that exposes regional 11 adjacency.

In addition, in the manufacture method of this multilayer printed-wiring board 1, by in exposing zone 11, forming first wiring pattern 3, expose zone 11 and become concavo-convex, when ink layer 13 is pressed against the male and fomale(M﹠F) that exposes zone 11 by stacked press, with expose the zone and 11 be close to, but can and remove fully with the aqueous slkali dissolving.Therefore, the residue that can prevent ink layer 13 is producing on first wiring pattern 3 or between first wiring pattern 3.

In the multilayer printed-wiring board 1 that obtains, as shown in Figure 9, exposing on 11 first wiring pattern 3 of zone becomes the splicing ear that electronic unit 19 is installed.In this case, the thickness that exposes the multilayer printed-wiring board 1 in the zone 11 is thinner than the part that is provided with second wiring pattern 5, is formed with concavity, even therefore electronic unit 19 is installed on first wiring pattern 3, highly can be not too high yet, and can realize low thickness.

Have again, in above-mentioned multilayer printed-wiring board 1, be provided with wiring pattern on the two sides of core substrate 2, but be not limited thereto, only wiring pattern is set and also can at a face 2a of core substrate 2.In addition, in multilayer printed-wiring board 1, on a face 2a of core substrate 2, formed second insulating barrier 4 and second wiring pattern 5, but further formed insulating barrier and wiring pattern and as also can more than 3 layers.Similarly, the mode of Figure 10 is such as described later, on another face 2b of core substrate 2, form expose the zone also can, further form insulating barrier and wiring pattern and as also can more than 3 layers.In multilayer printed-wiring board 1, a face 2a at core substrate 2 further forms insulating barrier and wiring pattern with another face 2b, with each

face

2a, 2b as under the situation more than 3 layers, wiring pattern on the core substrate 2 is exposed, make to be positioned at other inner wiring pattern at both sides'

face

2a, 2b and to expose and also can.

Then, as second execution mode, also can use ink, multilayer printed-wiring board 20 as shown in figure 10 is such, not only in a face 2a side of core substrate 2, also forms in another face 2b side and to expose zone 21.Have again, in this multilayer printed-wiring board 20,, give same Reference numeral and omit detailed explanation at the structure identical with above-mentioned multilayer printed-wiring board 1.

In this multilayer printed-wiring board 20, in exposing in the zone 11 of a face 2a side that is arranged at core substrate 2, do not form second insulating barrier 4, first wiring pattern 3 exposes thus, in exposing in the zone 21 of another face 2b side that is arranged at core substrate 2, do not form the 3rd insulating barrier 7, the part of the 3rd wiring pattern 6 is exposed thus.

In the manufacture method of this multilayer printed-wiring board 20, after the manufacture method with above-mentioned multilayer printed-wiring board 1 similarly forms first wiring pattern 3 and the 3rd wiring pattern 6, as shown in figure 11, a face 2a face at core substrate 2 forms ink layer 13, and also forms ink layer 22 at another face

2b.Ink layer

13,22 is respectively with first layer of prepreg 4 that becomes second insulating barrier with become the roughly the same thickness of second layer of prepreg 7 of the 3rd insulating barrier and form.

Then, in the position corresponding with each

ink layer

13,22, to form first layer of prepreg 4 of

peristome

4a, 7a of the size that can insert

ink layer

13,22 and second layer of prepreg 7 so that

ink layer

13,22 modes towards foreign side are configured on first wiring pattern 3 and the 3rd wiring pattern 6, so on each layer of prepreg 4,7 configuration Copper Foil 14,15.Then, with the manufacture method of above-mentioned multilayer printed-wiring board 1 similarly, by heat/pressure, become incorporate multi-layer laminate 23 shown in Figure 12.At this moment, by being formed with

ink layer

13,22, can prevent that resin from flowing into each and exposing

zone

11,21 from first layer of prepreg 4, second layer of prepreg 7.

Then, as shown in figure 13, with the manufacture method of above-mentioned multilayer printed-wiring board 1 similarly, form through hole 10 and via hole 9, the etching by

Copper Foil

14,15 forms second wiring pattern 5 and the 4th wiring pattern 8 then.Then, removing the dry film photoresist that when forming second wiring pattern 5 and the 4th wiring pattern 8, uses with aqueous slkali at 17,18 o'clock, also dissolving and remove exposing

ink layer

13,22 that

zone

11,21 forms.When forming second wiring pattern 5 and the 4th wiring pattern 8,, can expose first wiring pattern 3 and the 3rd wiring pattern 6 that exposes regional 11,21 from the etching solution protection by in exposing

zone

11,21, being formed with

ink layer

13,22.

In the manufacture method of above such multilayer printed-wiring board 20, by using the ink of alkali-soluble, can be on the two sides of face 2a and another face 2b of core substrate 2, exposing of forming simultaneously that first wiring pattern 3 exposes, zone the 11 and the 3rd wiring pattern 7 exposed exposes zone 21.Can obtain the same effect of manufacture method with above-mentioned multilayer printed-wiring board 1 exposing zone 11 and expose zone 21 both sides.

Then,, can use ink, make multilayer printed-wiring board 30 as shown in Figure 14 as the 3rd execution mode.

Particularly; in multilayer printed-wiring board 30; form first wiring pattern 32 at a face 31a as the core substrate 31 of first insulating barrier; stacked this first wiring pattern 32 is protected; and first wiring pattern 32 to adjacency insulate each other; second insulating barrier 33 with cementability; on this second insulating barrier 33, form second wiring pattern 34; stacked this second wiring pattern 34 is protected; and second wiring pattern 34 to adjacency insulate each other; the 3rd insulating barrier 35 with cementability is formed with the 3rd wiring pattern 36 on the 3rd insulating barrier 35.Another face 31b at core substrate 31 forms the 4th wiring pattern 37; stacked the 4th insulating barrier 38 that the 4th wiring pattern 37 is protected and the 4th wiring pattern 37 of adjacency is insulated each other; on the 4th insulating barrier 38, form the 5th wiring pattern 39; stacked the 5th wiring pattern 39 is protected and to the 5th insulating barrier 40 that the 5th wiring pattern 39 of adjacency insulate each other, is formed with the 6th wiring pattern 41 on the 5th insulating barrier 40.In addition, in this multilayer printed-wiring board 30, be formed with: the via hole 31c that in core substrate 31, is electrically connected first wiring pattern 32 and the 4th wiring pattern 37, be electrically connected the via hole 42 of second wiring pattern 34 and the 3rd wiring pattern 36, be electrically connected the via hole 43 of the 5th wiring pattern 39 and the 6th wiring pattern 41, and the through hole 44 that is electrically connected first wiring pattern 32, second wiring pattern 34, the 3rd wiring pattern 36, the 4th wiring pattern 37, the 5th wiring pattern 39, the 6th wiring pattern 41.

In this multilayer printed-wiring board 30, be not only in exposing zone 45, the part of first wiring pattern 32 that forms on core substrate 31 is exposed, and in exposing zone 46, the part of second wiring pattern 34 that forms on second insulating barrier 33 is also exposed to the outside.

Such multilayer printed-wiring board 30 can be made as follows.

At first, as shown in figure 15, make to have and expose regional 45 multilayer printed-wiring board.This can similarly make with above-mentioned multilayer printed-wiring board 1, therefore omits detailed explanation.

Then, as shown in figure 16, expose zone 45 and second first and expose in the zone 46,, form ink layer 47 with the ink of printing alkali-solubles such as silk screen printing.This ink layer 47 is heating, is pressurizeing second layer of prepreg 35 that becomes the 3rd insulating barrier and carrying out when stacked in the operation of back, and the resin that prevents the uncured resin that comprises in second insulating barrier 33 and second layer of prepreg 35 flows into first and exposes zone 45 and second and expose zone 46.Therefore, ink layer 47 as shown in figure 16, around the peristome 33a of second insulating barrier 33, with become with in ensuing operation on second insulating barrier 33 mode of the roughly the same thickness of the thickness of the second stacked layer of prepreg 35 form.

Then, as shown in figure 17, on second insulating barrier 33, be configured as second layer of prepreg 35 of the 3rd insulating barrier, so that ink layer 47 is towards foreign side.That is, the mode of exposing from this second layer of prepreg with ink layer 47 disposes second layer of prepreg 35.More specifically, use second layer of prepreg 35 of the peristome 35a that has formed the size that ink layer 47 can be inserted, dispose in the mode that ink layer 47 is inserted this peristome 35a.Then, the Copper Foil 48 of configuration formation the 3rd wiring pattern 36 on this second layer of prepreg 35.On the other hand, on the 4th insulating barrier 38, be configured as the 4th layer of prepreg 40 of the 5th insulating barrier, configuration thereon forms the Copper Foil 49 of the 6th wiring pattern 41.Second layer of prepreg 35, the 4th layer of prepreg 40, Copper Foil 48,49 towards core substrate 31 sides, are pressurizeed while heat, make it stacked integrated.

When heating, pressurization, expose the zone and be formed with ink layer 47 in 46 by exposing zone 45 and second first, even thereby second insulating barrier 33 and second layer of prepreg 35 are softening, the resin that also can prevent to constitute it flows into first and exposes zone 45 and second and expose zone 46, can prevent that resin from exposing first wiring pattern 32 that forms in the zone 45 or exposing second wiring pattern 34 that forms in the zone 46 second attached to first, or resin stops up first and exposes zone 45 and second and expose zone 46.

Then, with the manufacture method of above-mentioned multilayer printed-wiring board 1 similarly, form via

hole

42,43 and through hole 44, then Copper Foil 48,49 is formed the 3rd wiring pattern 36 and the 6th wiring pattern 41 by relief method.When forming the 3rd wiring pattern 36 and the 6th wiring pattern 41; because ink layer 37 is remaining, so can expose first wiring pattern 32 of formation the zone 45 and expose second wiring pattern 34 that forms in the zone 46 first from the etching solution protection of wet etching second.

Then, aqueous slkali with NaOH etc., remove the dry film photoresist that when forming the 3rd wiring pattern 36 and the 6th wiring pattern 41, uses, and also dissolve with aqueous slkali and to remove ink layer 47, as shown in figure 14, acquisition exposes first that first wiring pattern 32 exposes in the zone 45, exposes the multilayer printed-wiring board 30 that exposes of second wiring pattern 34 in the zone 46 second.

In the manufacture method of this multilayer printed-wiring board 30, by using ink, can make at different first wiring pattern 32, second wiring pattern 34 that form respectively on the core substrate 31, on second insulating barrier 33 and in same operation, expose, manufacturing process is simplified.

In addition, in the manufacture method of this multilayer printed-wiring board 30, not to remove ink layer 47 by the means of physics, remove but ink layer 47 dissolved, so can prevent to make and expose zone 45 and second first and expose

first wiring pattern

32 and 34 damages of second wiring pattern of exposing in the zone 46, or second insulating barrier 33 or the 3rd insulating barrier 35 peel off, and first expose first of second insulating barrier 33 that exposes regional 46 adjacency in zone 45 and second, the 3rd insulating barrier 35 and expose area side 45 and second and expose the end face of area side 46 sides and become smooth.

In addition, in the manufacture method of this multilayer printed-wiring board 30, be formed with first wiring pattern 32 by exposing in the zone 45 first, expose the zone second and be formed with second wiring pattern 34 in 46, thereby become concavo-convex, when being pressed against first by stacked press, ink layer 47 exposes zone 45 and second when exposing zone 46 male and fomale(M﹠F), closely connected in first expose the zone 45 and second expose the zone 46, but because can remove ink layer 47 fully, so can prevent at first wiring pattern 32 with aqueous slkali, on second wiring pattern 34, between first wiring pattern 32, produce the residue of ink layer 47 between second wiring pattern 34.

Then, as the 4th execution mode, to passing through to use first and second the present invention, the method for making hard and soft property printed wiring board 50 as shown in Figure 18 describes.Hard and soft property printed wiring board 50 is connected with first rigid portion 52 and second rigid portion 53 by having flexual flexible part 51.

In flexible part 51; on a face 54a who becomes flexible base, board 54 with flexual first insulating barrier; be formed with first wiring pattern 55 that first rigid portion 52 and second rigid portion 53 are electrically connected; be formed with first coverlay 56 that this first wiring pattern 55 is protected and first wiring pattern 55 of adjacency is insulated each other, and be formed with second coverlay 57 at another face 54b.In flexible part 51, a face 54a side at flexible base, board 54, has the zone 58 that this first coverlay 56 is exposed by not stacked first layer of prepreg 60 on first coverlay 56, with this zone 58 opposite to each other, in another face 54 sides, has the zone 59 that this second coverlay 57 is exposed by not stacked second layer of prepreg 63 on second coverlay 57.

In first rigid portion 52, second insulating barrier 60 and second wiring pattern 61 that are laminated with first wiring pattern 55, first coverlay 56, form by first layer of prepreg at a face 54a of flexible base, board 54.In addition, in first rigid layer 52, the 3rd insulating barrier 63 and the 4th wiring pattern 64 that are laminated with the 3rd wiring pattern 62, second coverlay 57, form by second layer of prepreg at another face 54b of flexible base, board 54.In first rigid portion 52, in flexible base, board 54, be formed with the via hole 65 that first wiring pattern 55 and the 3rd wiring pattern 62 are electrically connected, be formed with the via hole 66 that first wiring pattern 55 and second wiring pattern 61 are electrically connected.In addition, first rigid portion 52 have make that first wiring pattern 55 exposes expose zone 67.

In second rigid portion 53, with first rigid portion 52 similarly, on a face 54a of flexible base, board 54, be laminated with first wiring pattern 55, first coverlay 56, by second insulating barrier 60 and second wiring pattern 61 that first layer of prepreg forms, the 3rd insulating barrier 63 and the 4th wiring pattern 64 that on another face 54b of flexible base, board 54, are laminated with the 3rd wiring pattern 62, second coverlay 57, form by second layer of prepreg.In second rigid portion 53, be formed with the through hole 68 that first wiring pattern 55, second wiring pattern 61, the 3rd wiring pattern 62, the 4th wiring pattern 64 are electrically connected.

This hard and soft property printed wiring board 50 can be made as follows.At first, as shown in figure 19, with the manufacture method of above-mentioned multilayer printed-wiring board 1 similarly, preparation has the flexible base, board of Copper Foil on the two sides, after forming via hole 65, a face 54a at flexible base, board 54 forms first wiring pattern 55 with relief method, forms the 3rd wiring pattern 62 at another face 54b.

Then, as shown in figure 20, on a face 54a, to expose first coverlay 56 that regional 67 corresponding zones have formed peristome 56a and undertaken stacked by press etc.On another face 54b, still by stacked second coverlays 57 such as press.

Then, as shown in figure 21, with with around the peristome 56a of first coverlay 56 in ensuing operation on first coverlay 56 thickness of the first stacked layer of prepreg 60 become the mode of roughly the same thickness, form first ink layer 69 till around the peristome 56a, and in the corresponding zone, zone on first coverlay 56 and not stacked first layer of prepreg 60 58, utilize silk screen printing etc. to form second ink layer 70 with the roughly the same thickness of thickness with first layer of prepreg 60 stacked on first coverlay 56.On second coverlay 57, in the zone corresponding with the zone 59 of not stacked second layer of prepreg 63, with in the operation of back on second coverlay 57 the roughly the same thickness of the thickness of the second stacked layer of prepreg 63 form the 3rd ink layer 71.

Then, as shown in figure 22, on first coverlay 56, make first ink layer 69 and second ink layer 70 dispose first layer of prepreg 60 towards foreign side.That is, on first coverlay 56, dispose first layer of prepreg 60 in the mode that first ink layer 69 and second ink layer 70 is exposed from first layer of prepreg 60.More specifically, configuration first layer of prepreg 60 on first coverlay 56, this first layer of prepreg 60 is formed with

peristome

60a, 60b in the position corresponding with first ink layer 69 and second ink layer 70.In addition, on second coverlay 57, formed second layer of prepreg 63 of peristome 63a, made second layer of prepreg 63 of the 3rd ink layer 71 towards foreign side thereby form by being configured in the position corresponding with the 3rd ink layer 71.

And then on first layer of prepreg 60, first ink layer 69, second ink layer 70, configuration forms the Copper Foil 72 of second wiring pattern 61, and configuration forms the Copper Foil 73 of the 4th wiring pattern 64 on second layer of prepreg 63, the 3rd ink layer 71.

Then, with the manufacture method of above-mentioned multilayer printed-wiring board 1 similarly, by heating, pressurization, as shown in figure 23, form duplexer 74.

When heating, pressurization, even constitute first layer of prepreg 60 and second layer of prepreg 63 the resin fusion, flow, can prevent to constitute the

resin inflow region

58,59 of first layer of prepreg 60 and second layer of prepreg 63 or expose zone 67 by first ink layer 69, second ink layer 70, the 3rd ink layer 71, can prevent that resin from stopping up the

zone

58,59 that do not have stacked layer of prepreg, exposing zone 67 attached to first wiring pattern 55 that exposes or resin.

Then, at duplexer 74, with the via hole 11 of above-mentioned multilayer printed-wiring board 1 and through hole 12 similarly, as shown in figure 24, form via hole 66 and through hole 68.

Then, as shown in figure 25, with relief method Copper Foil 72 is carried out etching and form second wiring pattern 61, also Copper Foil 73 is carried out etching and form the 4th wiring pattern 64 with relief method.When forming second wiring pattern 61,, can expose first wiring pattern 55 that exposes regional 67 from the etching solution protection by in exposing zone 67, being formed with first ink layer 69.

Then, the resist that uses when removing at formation second wiring pattern 61 and the 4th wiring pattern 64 with aqueous slkali 75,76 o'clock also makes first ink layer 69,

second ink layer

70,71 dissolvings of the 3rd ink layer, removes with aqueous slkali.By removing resist 75,76, first ink layer 69, second ink layer 70, the 3rd ink layer 71, as shown in figure 18, thereby make by zone 58 that does not have stacked first layer of prepreg 60 and the zone 59 that does not have stacked second layer of prepreg 63 and form flexible parts 51, connect via this flexible part 51 and have first rigid portion 52 of exposing zone 67 and the hard and soft property printed wiring board 50 of second rigid portion 53.

Like this according to the manufacture method of hard and soft property printed wiring board 50, use ink making exposing that first wiring pattern 55 exposes form first ink layer 69 in the zone 67.Form second ink layer 70 in the zone 58 that first coverlay 56 is exposed.Form the 3rd ink layer 71 in the zone 59 that second coverlay 57 is exposed.And, remove first ink layer 69, second ink layer 70, the 3rd ink layer 71 by dissolving, thereby first wiring pattern 55 that is formed at inside is exposed with aqueous slkali.Therefore, this can be exposed zone 67 splicing ears as electronic unit.In addition, do not keep pliability, because first wiring pattern 55 is covered by first coverlay 56 and second coverlay 57, so can make flexible part 51 bring into play function as cable by in flexible part 51, not forming layer of prepreg.

And then, in the manufacture method of this hard and soft property printed wiring board 50, by forming second ink layer 70, the 3rd ink layer 71, thereby when forming duplexer 74, even first layer of prepreg 60 and second layer of prepreg 63 are heated, pressurize, also can prevent to constitute the resin inflow region 58 and the zone 59 of first layer of prepreg 60 and second layer of prepreg 63, therefore can in flexible part 51, keep the pliability of flexible base, board 54 well.In addition, by forming first ink layer 69, can prevent when the formation of duplexer 74 that the resin inflow of first layer of prepreg 60 from exposing zone 67.Therefore, in exposing zone 67, can prevent resin, can prevent also that thus electric fault from producing attached to first wiring pattern 55 that exposes.

In addition, in the manufacture method of this hard and soft property printed wiring board 50, not to remove first ink layer 69, second ink layer 70, the 3rd ink layer 71 by physical means, remove but dissolve with aqueous slkali, so can not make first wiring pattern, 55 damages of exposing in the zone 67 in exposing of first rigid portion 52, or first coverlay 56, second coverlay 57, first layer of prepreg 60 and second layer of prepreg 63 peel off, and can remove first ink layer 69, second ink layer 70, the 3rd ink layer 71.And then, be adjacent to the end face of the end face of zone 58 first coverlay 56 and second insulating barrier 60, end face and the end face of the 3rd insulating barrier 63, the end face that is adjacent to first coverlay 56 that exposes zone 67 and the end face of second insulating barrier 60 that is adjacent to second coverlay 57 in zone 59 becomes smooth.

In addition, in the manufacture method of this hard and soft property printed wiring board 50, become concavo-convex because expose zone 67 by first wiring pattern 55, so when first ink layer 69 being pressed into the male and fomale(M﹠F) that exposes zone 67 by stacked press, first ink layer 69 is closely connected in exposing zone 67, but can be by making the dissolving of first ink layer 69 with aqueous slkali and remove fully, so on first wiring pattern 55 or can prevent between first wiring pattern 55 that the residue of first ink layer 69 from producing the bad connection that causes.In addition, owing to second ink layer 70, the 3rd ink layer 71 are also removed with the aqueous slkali dissolving, so can prevent the flexual reduction that the generation of the residue of second ink layer 70, the 3rd ink layer 71 in zone 58 and zone 59 causes at flexible part 51.

Have again, in above-mentioned hard and soft property printed wiring board 50, what be formed with in first rigid portion 52 that first wiring pattern 55 exposes exposes zone 67, do not expose zone 67 but can in first rigid portion 52, not form this yet, and formed based on the hard and soft property printed wiring board of zone 58 with the flexible part 51 in zone 59 by method manufacturing of the present invention.

In addition, in above-mentioned hard and soft property printed wiring board, further in another face 54b of flexible base, board 54, also can to form the zone of exposing that the 3rd wiring pattern 62 exposes with the same mode of multilayer printed-wiring board shown in Figure 10 20.

Then,, can use ink, make multilayer printed-wiring board 80 as shown in Figure 26 as the 5th execution mode.This multilayer printed-wiring board 80 comprises: the rigid portion 81 of installation electronic unit etc.; With flexible portion of

terminal

82,83 in the outstanding setting in the both sides of this rigid portion 81.This multilayer printed-wiring board 80 is electrically connected flexible portion of

terminal

82,83 with the connector of other electronic unit, electronic unit and other electronic unit that is installed in rigid portion 81 is electrically connected.

Figure 27 is the figure of the section of the line segment X-X among expression Figure 26; in rigid portion 81; on flexible base, board 84, form first wiring pattern 85; on flexible base, board 84; the stacked coverlay 86 that first wiring pattern 85 is protected and first wiring pattern 85 is insulated each other; on this coverlay 86, be formed with the insulating barrier 87 that forms by layer of prepreg, and then be formed with second wiring pattern 88 thereon.As shown in figure 26, in the surface of rigid portion 81, except the electronic unit installation region 90 that second wiring pattern 88 exposes as terminal, covered by solder resist (solder resist) 89.

In flexible portion of

terminal

82,83, on flexible base, board 84, be formed with first wiring pattern 85.Do not have laminated cover film 86 and insulating barrier 87 on this first wiring pattern 85, flexible portion of

terminal

82,83 has the part that first wiring pattern 85 exposes.

Here, first wiring pattern 85 and second wiring pattern 88 need be obtained conducting by through hole or via hole, here omit.In addition, flexible portion of terminal 83 is also identical with flexible portion of terminal 82, therefore economizes sketch map.

The structure of the flexible portion of terminal 82 of this multilayer printed-wiring board 80, particularly as shown in figure 28, not only in goods portion 92, and spread all over that goods outside 93 form first wiring pattern 85 expose zone 91, Z-Z among the figure can be formed by carrying out stamping-out as section.The structure of Figure 28 can be made to expose zone 67 same methods with the formation of recording and narrating in the 4th execution mode, in addition, obtains same effect.

Have again,, also can be used as and further have the wiring plate that is connected by flexible cable portion between a plurality of rigid portion, rigid portion as the multilayer printed-wiring board made from method of the present invention.

Embodiment

Below, describe at the embodiment and the comparative example of multilayer printed-wiring board.

＜embodiment 〉

In an embodiment, make multilayer printed-wiring board as follows.At first, prepare to have the two sides copper-surfaced flexible base, board of the Copper Foil of thickness 18 μ m, form wiring pattern on its two sides by common relief method on the two sides of polyimide insulative layer.Then, two sides at flexible base, board, the coverlay that will have the adhesive layer of thick polyimide film of 12.5 μ m and 25 μ m in advance covers with the hot pressing machine in a vacuum, make internal substrate, wherein, this polyimide film carries out opening by stamping-out pair with the corresponding zone, zone of exposing that wiring pattern is exposed.Then, exposing in the zone by silk screen printing at wiring pattern to alkali-soluble ink (Yamahide Chemistry Co., Ltd.'s system, trade name: SER-451B) print, carry out drying and curing with 150 ℃, 20 minutes, form ink layer.The thickness of the print film (ink layer) after drying, the curing becomes 60 μ m.

Then, in the mode that ink layer is inserted, epoxy resin impregnation glass cloth prepreg at the two sides of internal substrate configuration thickness 60 μ m, this epoxy resin impregnation glass cloth prepreg is to be formed with peristome with ink layer same position, shape by stamping-out, and then at two outsides placement Copper Foil, in a vacuum with 40kg/cm ²Pressure, suppress with 180 ℃, 90 minutes, formed duplexer.The outward appearance of the duplexer after the compacting is smooth.

Then,, expose, develop, utilize the etching of the spraying of ferric chloride in aqueous solution, form wiring pattern at Copper Foil thus being arranged at stacked dry film photoresist on the outer field Copper Foil of duplexer.In this case, after etching is removed fully with unexposed of dry film photoresist corresponding Copper Foil quilt, also remaining ink layer.Then, duplexer is impregnated into the sodium hydrate aqueous solution of the 3wt% that is set at 50 ℃.Thus, ink layer is dissolved removes, and manifests inner wiring pattern.

In this embodiment, on wiring pattern, do not constitute the situation of the resin inflow of epoxy resin impregnation glass cloth prepreg, coverlay and the epoxy resin impregnation glass cloth end face with border ink prepreg does not damage, become very precipitous shape, do not having residue on the wiring pattern and between wiring pattern.

＜comparative example 〉

In comparative example, except replacing the alkali-soluble ink, the ink (trade name ソ Le ダ one シ one Le De SSZ-100SCB) that uses sun ink to make Co., Ltd.'s system forms outside the ink layer, similarly makes multilayer printed-wiring board with embodiment.

In comparative example, because ink is not an alkali-soluble, so ink layer is not removed, inner wiring pattern does not manifest.When cautiously peeling off ink layer, because ink layer is invaded prepreg, so produce the residue of ink layer on border prepreg and ink layer with hand.In addition, on the contrary, the part of prepreg is taken together in the ink layer of peeling off, and produces in prepreg and breaks.And then, during wiring pattern after peeling off, between some local wiring pattern, also find residue with microscopic examination.

According to this embodiment and comparative example, be formed under the situation of the multilayer printed-wiring board that inner wiring pattern exposes in making as can be known, use the present invention of the ink of alkali-soluble by application, can cause damage ground to make multilayer printed-wiring board to wiring pattern and coverlay, prepreg extremely easily and not.

Utilize possibility on the industry

Expose or make the multiwiring board that exposes as the inside region of cable performance function for the manufacture of the part multilayer printed-wiring boards such as hard and soft property multiwiring board or rigidity multiwiring board, that make the inside region of wiring pattern etc.

Claims

1. the manufacture method of a multilayer printed-wiring board is characterized in that,

Single face at least at first insulating barrier forms wiring pattern,

Form the ink layer of alkali-soluble in the part that comprises above-mentioned wiring pattern on first insulating barrier,

The face that ink layer on first insulating barrier forms side forms second insulating barrier, so that above-mentioned ink layer exposes from this second insulating barrier, and forms metal level on this second insulating barrier,

In that above-mentioned metal level is carried out composition after forming second wiring pattern, with aqueous slkali above-mentioned ink layer is dissolved and to remove, the part of first insulating barrier and the wiring pattern on it are exposed.

2. the manufacture method of multilayer printed-wiring board according to claim 1 wherein, in order to form above-mentioned second wiring pattern, is removed resist and the above-mentioned ink layer that is arranged on this second insulating barrier simultaneously with above-mentioned aqueous slkali.

3. the manufacture method of multilayer printed-wiring board according to claim 1, wherein, above-mentioned second insulating barrier and above-mentioned metal level form as follows, promptly, by prepreg and the metal forming that is configured on this prepreg are pressurizeed while heating, thereby make it stacked integrated, wherein, this prepreg forms the mode of exposing in the face of side with the ink layer of ink layer on above-mentioned first insulating barrier and disposes.

4. the manufacture method of multilayer printed-wiring board according to claim 1, wherein, above-mentioned second insulating barrier and above-mentioned metal level form as follows, promptly, ink at above-mentioned first insulating barrier forms face, the mode of exposing with above-mentioned ink layer disposes the insulated substrate that is pasted with metal forming, while make it stacked integrated by heating to pressurize.

5. the manufacture method of a multilayer printed-wiring board wherein, in the two sides of above-mentioned first insulating barrier, exposes the part of first insulating barrier and the wiring pattern on it by the described method of claim 1.

6. the manufacture method of multilayer printed-wiring board according to claim 1 is being formed with on second insulating barrier of above-mentioned second wiring pattern, and further form insulating barrier and wiring pattern successively and form sandwich construction, wherein,

Form the new ink layer of alkali-soluble in the part that comprises second wiring pattern on second insulating barrier,

On second insulating barrier, form new insulating barrier, so that above-mentioned new ink layer exposes from this new insulating barrier, and forms new metal level on this new insulating barrier,

This new metal level is carried out composition and forms new wiring pattern, with aqueous slkali above-mentioned new ink layer is dissolved and remove, the part of second insulating barrier and second wiring pattern on it are exposed.

7. the manufacture method of multilayer printed-wiring board according to claim 1, wherein,

Above-mentioned first insulating barrier has pliability,

Wiring pattern on above-mentioned first insulating barrier forms the back, before above-mentioned ink layer forms, except making the part that first insulating barrier and wiring pattern expose, with coverlay to covering on first insulating barrier.

8. the manufacture method of multilayer printed-wiring board according to claim 7, wherein, form second ink layer in the part on above-mentioned coverlay, form above-mentioned second insulating barrier, so that the ink layer of second ink layer on first insulating barrier exposed from this second insulating barrier, with above-mentioned aqueous slkali second ink layer on ink layer on first insulating barrier and the coverlay is dissolved together and to remove, the part of coverlay is exposed.

9. the manufacture method of multilayer printed-wiring board according to claim 8 wherein, in the both sides of first insulating barrier, forms the part that coverlay is exposed in mutual mode in opposite directions.

10. the manufacture method of multilayer printed-wiring board according to claim 1, wherein, with the splicing ear of the wiring pattern that exposes on above-mentioned first insulating barrier as electronic unit.

11. the manufacture method of multilayer printed-wiring board according to claim 7 wherein, is cut off first insulating barrier that exposes by removing of ink layer.

12. the manufacture method of multilayer printed-wiring board according to claim 11, wherein, with the splicing ear of the wiring pattern that exposes on first insulating barrier as electronic unit.

13. the manufacture method of a multilayer printed-wiring board, wherein,

Form wiring pattern at single face at least with flexual first insulating barrier,

At the wiring pattern formation face configuration coverlay of above-mentioned first insulating barrier,

Form the ink layer of alkali-soluble in the part on this coverlay,

On above-mentioned coverlay, form second insulating barrier, so that above-mentioned ink layer exposes from this second ink layer, and forms metal level on this second insulating barrier,

After forming wiring pattern, remove above-mentioned ink layer in that above-mentioned metal level is carried out composition, the part of coverlay is exposed with the aqueous slkali dissolving.

14. the manufacture method of multilayer printed-wiring board according to claim 13 wherein, in the two sides of first insulating barrier, forms the part that coverlay is exposed in mutual mode in opposite directions.