JPH10126056A - Manufacturing method of printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board for enhancing the reliability of bonding of chip parts and semiconductor devices to the printed wiring board. SOLUTION: When a first circuit pattern 2 is formed on an insulating substrate 1, an insulating layer 3 is formed on the first circuit pattern 2, a second circuit pattern 4 is formed on the insulating layer 3, and a recess 9 is formed by penetrating the insulating layer 3 so as to expose a part of the first circuit pattern 2, the insulating layer 3 and the second circuit pattern 4 are formed while masking the part of the first circuit pattern 2 with a mask material 7 of the size corresponding to that of the recess 9, and then the recess 9 is exposed by removing the mask material 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board.

[0002]

2. Description of the Related Art In recent years, in order to realize high-density component mounting on a printed wiring board, a multilayer printed wiring board has been attempted, and a bare chip semiconductor element has been directly mounted on the printed wiring board. Have been done. Note that the bare chip type semiconductor element described above is one in which the semiconductor element is formed in a bare state without providing an outer case.

[0003] First, the multilayer structure of a printed wiring board will be described with reference to FIG. In the method of manufacturing a printed wiring board in the conventional example shown in FIGS. 3A to 3E, the first circuit patterns 2 and 2 are formed on the upper and lower surfaces of the insulating substrate 1 made of, for example, glass epoxy, 3A is formed by connecting to the first circuit pattern 2 {FIG. 3A}. Next, insulating layers 3 and 3 are formed on the first circuit patterns 2 and 2 (FIG. 3B). At this time, the insulating layer 3 is simultaneously formed on the electrodes 2a, 2a of the first circuit patterns 2, 2 on the upper surface side. Next, the second circuit patterns 4 and 4 are formed on the insulating layers 3 and 3 (FIG. 3C).

Next, in order to expose the vicinity of the electrodes 2a, 2a of the first circuit pattern 2 on the upper surface side, the insulating layer 3 is scraped off by machining or laser processing using a router (not shown) or the like, and is withdrawn from the insulating layer 3. To form a recess 5,
The electrodes 2a, 2a are exposed in the recess 5 {FIG.
(D)｝. Then, the electrodes 2a, 2a exposed in the recess 5 are formed.
And the electrodes 6a of the chip component 6 (FIG. 3 (E)).

On the other hand, a method of flip-chip mounting a bare chip type semiconductor element on a printed wiring board and sealing the bare chip type semiconductor element with a sealing resin will be described with reference to FIGS. 4 and 5. FIG. Note that the above-described flip chip mounting refers to connecting a bare chip type semiconductor element on a printed wiring board without using a connection wire.

Generally, when a bare chip type semiconductor element is flip-chip mounted on a printed wiring board, electrodes in a circuit pattern formed on the printed wiring board are connected to electrodes (bumps) of the bare chip type semiconductor element, and By filling the gap between the printed wiring board and the bare chip type semiconductor element with epoxy-based sealing resin to cover the bump, the reliability of the connection is ensured, and the stress applied to the bump is relaxed and the moisture resistance is improved. We are improving.

However, recent trends in bare chip type semiconductor devices are to increase the number of electrodes (for example, 400 electrodes per chip) and to reduce the pitch (for example, the pitch between electrodes is 85 μm, the gap between bumps is 25 μm). )
(For example, a chip size of 10 mm or more × 1)
0 mm or more). In addition, the gap between the bumps of the bare chip type semiconductor element and the gap between the printed wiring board and the bare chip type semiconductor element are further reduced (for example, 40 μm or less). A high-fluidity sealing resin is used as the sealing resin.

However, if the fluidity of the sealing resin is increased in order to properly seal the bare chip type semiconductor element under the above-described conditions, the sealing resin flows out of the region to be sealed. Occurs. In order to prevent this, it is very difficult to precisely control the viscosity of the sealing resin.

Therefore, in the conventional method of sealing a semiconductor device to a bare chip type semiconductor device shown in FIGS. 4A to 4E, a circuit pattern 12 is placed at a predetermined position on an insulating substrate 11 made of, for example, glass epoxy. The electrodes 12a, 12a for connecting the bare chip type semiconductor element connected to the substrate are formed {FIG. 4 (A)}. Next, the circuit pattern 1 on the insulating substrate 11
2, an insulating layer 13 is formed {FIG. 4 (B)}. Next, the vicinity of the electrodes 12a, 12a on the insulating substrate 11 is cut off by machining or laser processing using a router or the like (not shown), and a concave portion 14 recessed from the insulating layer 13 is formed larger than the outer shape of a bare chip type semiconductor element 15 described later. Then, the electrodes 12a, 12a are exposed in the recesses 14 (FIG. 4C). Next, the electrodes (bumps) 15a, 15a of the bare chip type semiconductor element 15 are bonded to the electrodes 12a, 12a exposed in the recess 14 (FIG. 4D). Further, the dispenser 16 provides, for example, a viscosity of 600 cps.
A highly fluid sealing resin 17 made of epoxy resin is injected into the concave portion 14 and the inside of the concave portion 14 is filled with the sealing resin 17 (FIG. 4E).

Further, in a method different from the above, FIGS.
In the sealing method for a bare chip type semiconductor element of another example in the conventional example shown in (D), a bare chip type semiconductor element connecting with the circuit pattern 12 is connected to a predetermined position on an insulating substrate 11 made of, for example, glass epoxy. Electrodes 12a, 1
2a is formed {FIG. 5 (A)}. Next, it is larger than the outer shape of the bare chip type semiconductor element 15 and has a thickness of 1 mm.
By preparing a regulation frame 18 surrounded in a substantially rectangular shape by the degree, and placing the regulation frame 18 around the electrodes 12a, 12a on the insulating substrate 11, a concave portion 19 is formed in the regulation frame 18. FIG. 5 (B)｝. Next, bare chip type semiconductor element 1
5 are joined to the electrodes 12a, 12a exposed in the recess 19 (FIG. 5).
(C)｝. Further, a highly fluid sealing resin 17 made of, for example, an epoxy resin having a viscosity of 600 cps is injected into the recess 19 by the dispenser 16, and the recess 19 is filled with the sealing resin 17 (FIG. 5D).

[0011]

In the conventional method of manufacturing a printed wiring board shown in FIG. 3, the insulating layer 3 is shown in order to expose the electrodes 2a of the first circuit patterns 2 and 2. The recessed portion 5 is formed by machining or laser processing using a router or the like which is not formed, and is recessed from the insulating layer 3 to form the concave portion 5.
The thickness of each of the electrodes 2a and 2a is 18 to 70 microns at most, and it is difficult to form the concave portion 5 accurately without impairing the thickness. Was often inadequate.

In the method of manufacturing a printed wiring board in the conventional example shown in FIG.
The electrodes (bumps) 15a, 15a of the bare chip type semiconductor element 15 are connected to 2a, 12a, and both electrodes (12a, 12a) are connected.
In order to seal a) and (15a, 15a) with the sealing resin 17, when the recessed portion 14 is formed by being retracted from the insulating layer 13, the insulating layer 13 is formed by machining using a router (not shown) or laser processing. Due to the shaving, a problem similar to that of FIG. 3 occurs.

Further, in the conventional method of manufacturing a printed wiring board shown in FIG.
The electrodes (bumps) 15a, 15a of the bare chip type semiconductor element 15 are connected to 2a, 12a, and both electrodes (12a, 12a) are connected.
In order to seal (a) and (15a, 15a) with the sealing resin 17, the regulating frame 18 must be adhered onto the insulating substrate 11, but since the flatness is required, the thickness of the regulating frame 18 is relatively small. In addition, there is a problem that the thickness becomes thicker and the periphery of the regulation frame 18 becomes a dead space, which is disadvantageous for high-density mounting.

[0014]

Means for Solving the Problems The present invention has been made in view of the above problems, and a first invention is to form a circuit pattern on an insulating substrate and form an insulating layer on the circuit pattern. And forming a recess through the insulating layer so as to expose a part of the circuit pattern, and forming the recess while masking a part of the circuit pattern with a mask material having a size corresponding to the recess. A method for manufacturing a printed wiring board, comprising: forming a layer; and thereafter, peeling off the mask material to form the recess.

According to a second aspect of the present invention, a first circuit pattern is formed on an insulating substrate, an insulating layer is formed on the first circuit pattern, and a second circuit pattern is formed on the insulating layer. When forming and forming a recess through the insulating layer to expose a portion of the first circuit pattern, a portion of the first circuit pattern is masked with a mask material having a size corresponding to the recess. Forming the insulating layer and the second circuit pattern as it is, and then peeling off the mask material to form the concave portion.

In a third aspect of the present invention, a circuit pattern having an electrode for a semiconductor element is formed on a printed wiring board.
In addition, an insulating layer is formed on the circuit pattern while masking the vicinity of the electrode with a mask material larger than the outer shape of the semiconductor element, and then the mask material is peeled off to form a recess through the insulating layer. A method for manufacturing a printed wiring board, characterized in that the electrode exposed in the recess and the electrode of the semiconductor element are joined to fill the recess with a sealing resin.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method of manufacturing a printed wiring board according to the present invention will be described below in detail in the order of <first embodiment> and <second embodiment> with reference to FIGS. Will be described.

<First Embodiment> FIG. 1 shows a first embodiment according to the present invention.
It is a figure showing the manufacturing method of the printed wiring board of an example in order of a process.

The method of manufacturing a printed wiring board according to the first embodiment of the present invention shown in FIG. 1 is used to increase the number of layers of the printed wiring board in order to realize high-density component mounting on the printed wiring board. This is a technique for manufacturing a printed wiring board that has been improved to the following.

First, as shown in FIG. 1A, first circuit patterns 2 and 2 are formed on the upper and lower surfaces of an insulating substrate 1 made of, for example, glass epoxy, and connected to the first circuit pattern 2 on the upper surface, for example. And the electrodes 2a for connecting chip components,
2a is formed. The first circuit pattern 2 is 18 to 70
It is obtained by performing a copper plating process with a thickness of a micron, followed by an etching process into an appropriate shape.

Next, as shown in FIG. 1B, a mask material 7 which is slightly larger than the outer shape of a chip component 6 to be described later is prepared, and this mask material 7 is attached to the electrodes 2a and 2a of the first circuit pattern 2.
2a is attached on the insulating substrate 1 so as to be masked. At this time, in the embodiment, a tape or the like cut into a substantially rectangular shape is used as the mask material 7, but the present invention is not limited to this, and an appropriate material such as a strip coat material may be used.

Next, as shown in FIG. 1C, while the electrodes 2a, 2a of the first circuit pattern 2 are masked by the mask material 7 attached to the insulating substrate 1, the first circuit formed on the upper and lower surfaces is formed. The insulating layers 3 and 3 are formed on the patterns 2 and 2 using an epoxy resin or the like. At this time, the thickness of the insulating layers 3 and 3 is set to a thickness of 40 to 100 microns and substantially the same as or smaller than the thickness of the mask material 7.

Next, as shown in FIG. 1D, through holes 8 are formed so as to penetrate the insulating layers 3 and 3 formed above and below the insulating substrate 1.

Next, as shown in FIG. 1E, the second circuit patterns 4 and 4 are formed on the insulating layers 3 and 3 formed above and below the insulating substrate 1. At this time, since the copper plating also enters into the through hole 8, the through hole is connected to the first and second circuit patterns 2 and 4.

Next, as shown in FIG. 1 (F),
When the mask material 7 stuck on the insulating substrate 1 is peeled off, a recess 9 is formed through the insulating layer 3 on the upper surface side. The electrodes 2a, 2a are exposed in the recess 9. After that, the electrodes 2a, 2a exposed in the recess 9 are connected to the electrodes 6a, 6a of the chip component 6.

In this embodiment, the case where the chip component 6 is mounted on a multilayer printed wiring board has been described. However, even in the case of a single layer without multilayering, a part of the circuit pattern is masked with a mask material. What is necessary is just to form an insulating layer on the circuit pattern, then peel off the mask material and form a recess through the insulating layer.

<Second Embodiment> FIG. 2 shows a second embodiment according to the present invention.
It is a figure showing the manufacturing method of the printed wiring board of an example in order of a process.

In the method of manufacturing a printed wiring board according to the second embodiment of the present invention shown in FIG. 2, a bare chip type semiconductor element is mounted on the printed wiring board in order to realize high-density component mounting on the printed wiring board. This is a technique for manufacturing a printed wiring board improved when flip-chip mounting is performed.

First, as shown in FIG. 2A, a circuit pattern 12 is formed on the upper surface of an insulating substrate 11 made of, for example, glass epoxy, and connected to the circuit pattern 12 to form an electrode for connecting a bare chip type semiconductor element. 12a, 12
a is formed. The circuit pattern 12 is obtained by performing a copper plating process with a thickness of 18 to 70 microns and then performing an etching process into an appropriate shape. Further, the circuit pattern 12 may be a copper-clad laminate laminated in advance.

Next, as shown in FIG. 2B, a mask material 20 which is slightly larger than the outer shape of the bare chip type semiconductor element 15 described later is prepared, and this mask material 20 is used for the electrodes 12a, 12a of the circuit pattern 12. It is attached on the insulating substrate 11 so as to be masked. At this time, in the embodiment, a tape or the like cut into a substantially rectangular shape is used as the mask material 20. However, the present invention is not limited to this, and an appropriate material such as a strip coat material may be used.

Next, as shown in FIG. 2C, an epoxy resin or the like is applied on the circuit pattern 12 while the electrodes 12a, 12a of the circuit pattern 12 are masked by the mask material 20 attached to the insulating substrate 11. The insulating layer 13 is formed by using this. At this time, the thickness of the insulating layer 13 is set to a thickness of 40 to 100 microns and substantially the same as or thinner than the thickness of the mask material 20.

Next, as shown in FIG. 2D,
When the mask material 20 attached to the insulating substrate 11 is peeled off, a concave portion 21 is formed through the insulating layer 3. The electrodes 12a are exposed in the recess 21.

Next, as shown in FIG. 2E, the electrodes (bumps) 15a, 15a of the bare chip type semiconductor element 15 are formed.
Are bonded to the electrodes 12a, 12a exposed in the recess 21.

Further, as shown in FIG. 2F, a highly fluid sealing resin 17 made of, for example, an epoxy resin having a viscosity of 600 cps is injected into the recess 21 by a dispenser 16, and the inside of the recess 21 is filled with the sealing resin. Filled with 17.

As described in detail above, according to the printed wiring board manufacturing methods of the first and second embodiments according to the present invention, when exposing a part of the circuit patterns 2 and 12, The insulating layers 3 and 13 are formed on the circuit patterns 2 and 12 while being masked by the masks 7 and 20. Thereafter, the masks 7 and 20 are peeled off to form the recesses 9 and 21 through the insulating layers 3 and 13. Therefore, the recesses 9 and 21 can be easily formed without damaging the circuit patterns 2 and 12, and the chip component 6 or the semiconductor element 15 can be mounted in the recesses 2 and 12. When the bare chip type semiconductor element 15 is flip-chip mounted in the recess 21, the sealing resin 17 is filled to reliably cover the electrical connection portion between the bare chip type semiconductor element 15 and the circuit pattern 12. It is possible.

[0036]

According to the method of manufacturing a printed wiring board according to the present invention described in detail above, when exposing a part of a circuit pattern, an insulating layer is formed on the circuit pattern while a portion to be exposed is masked with a mask material. After that, the mask material is peeled off to form a recess through the insulating layer, so that the recess can be easily formed without damaging the circuit pattern, and a chip component or a semiconductor can be formed in the recess. The element can be mounted.Furthermore, when the bare chip type semiconductor element is flip-chip mounted in the recess, the sealing resin is filled, thereby reliably covering the electrical connection portion between the semiconductor element and the circuit pattern. it can.

[Brief description of the drawings]

FIG. 1 is a view showing a method of manufacturing a printed wiring board according to a first embodiment of the present invention in the order of steps.

FIG. 2 is a view showing a method of manufacturing a printed wiring board according to a second embodiment of the present invention in the order of steps.

FIG. 3 is a diagram showing a method of manufacturing a printed wiring board in a conventional example in the order of steps.

FIG. 4 is a view showing a method of manufacturing a printed wiring board in a conventional example in the order of steps.

FIG. 5 is a diagram showing a method of manufacturing a printed wiring board in a conventional example in the order of steps.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Insulating board, 2 ... 1st circuit pattern, 2a ... Electrode,
3 ... insulating layer, 4 ... second circuit pattern, 6 ... chip parts,
6a: electrode, 7: mask material, 9: concave portion, 11: insulating substrate, 12: circuit pattern, 12a: electrode, 13: insulating layer, 15: bare chip type semiconductor element, 15a: electrode, 1
7: sealing resin, 20: mask material, 21: recess.

Continuation of the front page (72) Inventor Shinji Suga 3-12-12 Moriyacho, Kanagawa-ku, Yokohama-shi, Kanagawa Japan Victor Company of Japan, Ltd.

Claims (3)

[Claims] 1. A circuit pattern is formed on an insulating substrate, an insulating layer is formed on the circuit pattern, and a recess is formed through the insulating layer to expose a part of the circuit pattern. When performing the printing, the insulating layer is formed while masking a part of the circuit pattern with a mask material having a size corresponding to the concave portion, and then the mask material is peeled to form the concave portion. Manufacturing method of wiring board. A first circuit pattern formed on the insulating substrate;
And forming an insulating layer on the first circuit pattern;
When forming a second circuit pattern on the insulating layer and forming a recess through the insulating layer to expose a part of the first circuit pattern, a mask material having a size corresponding to the recess is used. A method of manufacturing a printed wiring board, comprising: forming the insulating layer and the second circuit pattern while masking a part of the first circuit pattern, and then removing the mask material to form the recess. 3. A circuit pattern having an electrode for a semiconductor element is formed on a printed wiring board, and an insulating layer is formed on the circuit pattern while masking the vicinity of the electrode with a mask material larger than the outer shape of the semiconductor element. After that, the mask material is peeled off to form a recess through the insulating layer, and the electrode exposed in the recess and the electrode of the semiconductor element are joined to form a sealing resin in the recess. A method for manufacturing a printed wiring board, characterized by filling the substrate.