CN102883545B - Protection process for inner layer welding point of soft and hard combined plate - Google Patents
Protection process for inner layer welding point of soft and hard combined plate Download PDFInfo
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- CN102883545B CN102883545B CN201210345344.7A CN201210345344A CN102883545B CN 102883545 B CN102883545 B CN 102883545B CN 201210345344 A CN201210345344 A CN 201210345344A CN 102883545 B CN102883545 B CN 102883545B
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Abstract
The invention provides a protection process for an inner layer welding point of a soft and hard combined plate. The protection process comprises the following steps of: 1, supplying a soft and hard combined thin plate, wherein the soft and hard combined thin plate has an inner layer welding point structure; 2, performing silk screening on a circuit board at the inner layer welding point structure of the soft and hard combined thin plate by ink; 3, supplying a plurality of copper foils and a plurality of prepregs; 4, setting laminated positions between the copper foils, the prepregs and the soft and hard combined thin plate according to a requirement of the finished soft and hard combined plate, and laminating; 5, performing film drying process according to the requirement of the finished soft and hard combined plate; 6, performing etching process; and 7, eliminating the ink, and exposing an inner layer circuit board. By the protection process for the inner layer welding point of the soft and hard combined plate, the circuit board at the inner layer welding point is prevented from being corroded during etching; the flow of the process is simple; the circuit board at the inner layer welding point can be well protected from being corroded; and the quality of the soft and hard combined plate is guaranteed.
Description
Technical field
The present invention relates to Rigid Flex field, particularly relate to a kind of protection technique of Rigid Flex internal layer circuit plate.
Background technology
Industry, Medical Devices, 3G mobile, LCD TV and other consumer electronics are as the continuous expansion of the portable electronics market demand such as hard disk drive, floppy disk, mobile phone, notebook computer, camera, video camera, PDA of electronic computer, and electronic equipment is more and more towards light, thin, short, the little and future development of multifunction.The particularly application of the flexible board of high density interconnection structure (HDI), to greatly drive the fast development of flexible printed circuit technology, simultaneously along with development and the raising of printed circuit technique, the developmental research of Rigid Flex (Rigid-Flex PCB) also gets a lot of applications, and estimates that the supply of whole world Rigid Flex from now on will roll up.Meanwhile, the durability of Rigid Flex, with flexible, also make it be more suitable for medical treatment and applies with military field, progressively nibble the market share of rigidity PCB.
The technique but the tradition of existing Rigid Flex is uncapped, mainly contain MILL plate (cold-reduced sheet), fill out pad, blade cuts etc., but pad (PAD) is revealed for internal layer and completes the Rigid Flex of thickness of slab at below 0.4mm, the quality hidden danger that when easily occurring uncapping, internal layer PAD weathers.
Summary of the invention
The object of the present invention is to provide a kind of protection technique of Rigid Flex inner welded point, technological process is simple, the wiring board at inner welded point place can be protected well not weather, ensure that the quality of Rigid Flex.
For achieving the above object, the invention provides a kind of protection technique of Rigid Flex inner welded point, it is characterized in that, comprise the following steps:
Step 1, provide soft or hard in conjunction with thin plate, described soft or hard has inner welded dot structure in conjunction with thin plate;
Step 2, on the wiring board of soft or hard in conjunction with the inner welded dot structure place of thin plate ink for screen printing;
Step 3, provide several pieces Copper Foils and several prepregs;
Step 4, according to the requirement of finished product Rigid Flex, Copper Foil, prepreg and soft or hard are set in conjunction with the stratification position between thin plate, and carry out pressing;
Step 5, carry out dry film process operation according to the requirement of finished product Rigid Flex;
Step 6, carry out etch process operation;
Step 7, ink to be returned, expose the wiring board at inner welded dot structure place.
Described ink is not etched for the protection of the wiring board at inner welded dot structure place.
For providing two panels Copper Foil and two prepregs in described step 3.
Described step 4 is be placed between two panels Copper Foil according to the requirement of finished product Rigid Flex by two prepregs, soft or hard is placed between two prepregs in conjunction with thin plate, and carries out pressing.
Described step 5 comprises the following steps:
Step 5.1, provide dry film, egative film and pad;
Step 5.2, dry film to be adhered on Copper Foil, and according to the requirement of finished product Rigid Flex, pad is set on dry film, finally egative film is placed on pad;
Step 5.3, carry out exposing, developing.
Also comprise before described step 5.2 and clean is carried out to copper foil surface.
Described the method that copper foil surface carries out clean to be comprised: mechanical nog plate method and chemical cleaning.
In described step 5.2, dry film is arranged the position of pad for position of windowing.
Described step 6 is for etch away pads placement and outer-layer circuit.
Beneficial effect of the present invention: the protection technique of Rigid Flex inner welded point of the present invention adopts ink protection inner welded point place wiring board not weather when etching; and adopt Copper Foil and prepreg to carry out Multi-layer force fit; technological process is simple; the wiring board at inner welded point place can be protected well not weather, ensure that the quality of Rigid Flex.
In order to further understand feature of the present invention and technology contents, refer to following detailed description for the present invention and accompanying drawing, but accompanying drawing only provides reference and explanation use, is not used for being limited the present invention.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention describe in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In accompanying drawing,
Fig. 1 is the flow chart of the protection technique of Rigid Flex inner welded point of the present invention;
Fig. 2 is the protection technique schematic diagram in kind of Rigid Flex inner welded point of the present invention.
Embodiment
For further setting forth the technological means and effect thereof that the present invention takes, be described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
Refer to Fig. 1 and 2, the invention provides a kind of protection technique of Rigid Flex inner welded point, it comprises the following steps:
Step 1, provide soft or hard in conjunction with thin plate 2, described soft or hard has inner welded dot structure 22 in conjunction with thin plate 2;
Step 2, on the wiring board of soft or hard in conjunction with inner welded dot structure 22 place of thin plate 2 ink for screen printing 4;
Described ink 4 is not etched in back segment etch process flow process for the protection of the wiring board at inner welded dot structure 22 place, and then protects inner welded dot structure 22 wiring board well.
Step 3, provide several pieces Copper Foils 8 and several prepregs 6;
Described several Copper Foils 8 and several prepregs 6 are for carrying out Multi-layer force fit.In the present embodiment, in described step 3 for providing two panels Copper Foil 8 and two prepregs 6.
Step 4, according to the requirement of finished product Rigid Flex, Copper Foil 8, prepreg 6 and soft or hard are set in conjunction with the stratification position between thin plate 2, and carry out pressing;
In the present embodiment, described step 4 is be placed between two panels Copper Foil 8 according to the requirement of finished product Rigid Flex by two prepregs 6, soft or hard is placed between two prepregs 6 in conjunction with thin plate 2, and carries out pressing.
Step 5, carry out dry film process operation according to the requirement of finished product Rigid Flex;
Described step 5 comprises the following steps:
Step 5.1, provide dry film, egative film and pad (not shown);
Step 5.2, dry film to be adhered on Copper Foil 8, and according to the requirement of finished product Rigid Flex, pad is set on dry film, finally egative film is placed on pad;
In this step pads placement is designed to window, and does Graphic transitions together with circuit in subsequent step.
Before adhesion dry film, also clean is carried out to Copper Foil 8 surface, clean out oxide, spot on Copper Foil 8 surface, increase Copper Foil 8 surface microroughness simultaneously, increase the contact area on dry film and Copper Foil 8 surface.Described the method that clean is carried out on Copper Foil 8 surface to be comprised: mechanical nog plate method and chemical cleaning.
Step 5.3, carry out exposing, developing.
Selected and the time for exposure sets according to actual needs according to actual needs to expose exposure machine light source used, and both all can adopt existing technique.
Step 6, carry out etch process operation;
Dry film in described step 5.2 will be arranged the position of pad for position of windowing, and just pads placement and the unexposed Copper Foil 8 of skin etch away.
Step 7, ink 4 to be returned, expose the wiring board at inner welded dot structure 22 place.Ink 4 is returned, exposes the wiring board at inner welded dot structure 22 place, complete the making of Rigid Flex, ensure that the quality of Rigid Flex well.
In sum; the invention provides a kind of protection technique of Rigid Flex inner welded point; ink protection inner welded point place wiring board is adopted not weather when etching; and adopt Copper Foil and prepreg to carry out Multi-layer force fit; technological process is simple; the wiring board at inner welded point place can be protected well not weather, ensure that the quality of Rigid Flex.
The above, for the person of ordinary skill of the art, can make other various corresponding change and distortion according to technical scheme of the present invention and technical conceive, and all these change and be out of shape the protection range that all should belong to the claims in the present invention.
Claims (7)
1. a protection technique for Rigid Flex inner welded point, is characterized in that, comprise the following steps:
Step 1, provide soft or hard in conjunction with thin plate, described soft or hard has inner welded dot structure in conjunction with thin plate;
Step 2, on the wiring board of soft or hard in conjunction with the inner welded dot structure place of thin plate ink for screen printing;
Step 3, provide several pieces Copper Foils and several prepregs;
Step 4, according to the requirement of finished product Rigid Flex, Copper Foil, prepreg and soft or hard are set in conjunction with the stratification position between thin plate, and carry out pressing;
Step 5, carry out dry film process operation according to the requirement of finished product Rigid Flex;
Step 6, carry out etch process operation;
Step 7, ink to be returned, expose the wiring board at inner welded dot structure place;
Described step 5 comprises the following steps:
Step 5.1, provide dry film, egative film and pad;
Step 5.2, dry film to be adhered on Copper Foil, and according to the requirement of finished product Rigid Flex, pad is set on dry film, finally egative film is placed on pad;
Step 5.3, carry out exposing, developing;
In described step 5.2, dry film is arranged the position of pad for position of windowing, do Graphic transitions at subsequent step Intermediate gasket together with circuit.
2. the protection technique of Rigid Flex inner welded point as claimed in claim 1, it is characterized in that, described ink is not etched for the protection of the wiring board at inner welded dot structure place.
3. the protection technique of Rigid Flex inner welded point as claimed in claim 1, is characterized in that, for providing two panels Copper Foil and two prepregs in described step 3.
4. the protection technique of Rigid Flex inner welded point as claimed in claim 3; it is characterized in that; described step 4 is be placed between two panels Copper Foil according to the requirement of finished product Rigid Flex by two prepregs, soft or hard is placed between two prepregs in conjunction with thin plate, and carries out pressing.
5. the protection technique of Rigid Flex inner welded point as claimed in claim 1, is characterized in that, also comprise and carry out clean to copper foil surface before described step 5.2.
6. the protection technique of Rigid Flex inner welded point as claimed in claim 5, is characterized in that, describedly comprises the method that copper foil surface carries out clean: mechanical nog plate method and chemical cleaning.
7. the protection technique of Rigid Flex inner welded point as claimed in claim 1, it is characterized in that, described step 6 is for etch away pads placement and outer-layer circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210345344.7A CN102883545B (en) | 2012-09-17 | 2012-09-17 | Protection process for inner layer welding point of soft and hard combined plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210345344.7A CN102883545B (en) | 2012-09-17 | 2012-09-17 | Protection process for inner layer welding point of soft and hard combined plate |
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| Publication Number | Publication Date |
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| CN102883545A CN102883545A (en) | 2013-01-16 |
| CN102883545B true CN102883545B (en) | 2015-04-22 |
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| CN201210345344.7A Active CN102883545B (en) | 2012-09-17 | 2012-09-17 | Protection process for inner layer welding point of soft and hard combined plate |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028685A (en) * | 2016-06-21 | 2016-10-12 | 深圳市景旺电子股份有限公司 | Manufacturing method of flexible circuit board employing ink instead of adhesive tape and flexible circuit board |
| CN106231820A (en) * | 2016-07-29 | 2016-12-14 | 台山市精诚达电路有限公司 | Rigid Flex processing method |
| CN106341944B (en) * | 2016-09-29 | 2018-09-07 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board and preparation method thereof for protecting internal layer pad |
| CN106961810A (en) * | 2017-04-20 | 2017-07-18 | 高德（无锡）电子有限公司 | A kind of production method using the Rigid Flex finished product of pressing production twice |
| CN111867248A (en) * | 2019-04-24 | 2020-10-30 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
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| CN201563300U (en) * | 2009-12-10 | 2010-08-25 | 昆山市线路板厂 | Continuous dry film laminating system for flexible circuit board |
| CN101878679A (en) * | 2007-11-30 | 2010-11-03 | 索尼化学&信息部件株式会社 | Method for manufacturing multilayer printed wiring board |
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| CN202425190U (en) * | 2011-12-20 | 2012-09-05 | 广州杰赛科技股份有限公司 | Stepped circuit board |
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| US20070096652A1 (en) * | 2005-10-28 | 2007-05-03 | Chao-Jen Chang | Methods for fabricating step-formed patterned layer and frbricating rib of plasma display panel |
| KR20090105047A (en) * | 2008-04-01 | 2009-10-07 | (주)인터플렉스 | Manufacturing method of rigid-flexible multi-layer printed circuit board using flexible ink |
| US10195570B2 (en) * | 2011-01-07 | 2019-02-05 | Creative Micro Tech, Inc. | Fabrication of microfilters and nanofilters and their applications |
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|---|---|---|---|---|
| CN101878679A (en) * | 2007-11-30 | 2010-11-03 | 索尼化学&信息部件株式会社 | Method for manufacturing multilayer printed wiring board |
| CN201563300U (en) * | 2009-12-10 | 2010-08-25 | 昆山市线路板厂 | Continuous dry film laminating system for flexible circuit board |
| CN202269090U (en) * | 2011-09-14 | 2012-06-06 | 深圳崇达多层线路板有限公司 | Gasket structure for sticking film to outer layer of three-dimensional circuit board |
| CN202425190U (en) * | 2011-12-20 | 2012-09-05 | 广州杰赛科技股份有限公司 | Stepped circuit board |
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| CN102883545A (en) | 2013-01-16 |
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