CN202269090U - Gasket structure for sticking film to outer layer of three-dimensional circuit board - Google Patents
Gasket structure for sticking film to outer layer of three-dimensional circuit board Download PDFInfo
- Publication number
- CN202269090U CN202269090U CN201120344121XU CN201120344121U CN202269090U CN 202269090 U CN202269090 U CN 202269090U CN 201120344121X U CN201120344121X U CN 201120344121XU CN 201120344121 U CN201120344121 U CN 201120344121U CN 202269090 U CN202269090 U CN 202269090U
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- Prior art keywords
- board
- circuit board
- wiring board
- board slot
- groove
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- Expired - Fee Related
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Abstract
The utility model discloses a gasket structure for sticking film to the outer layer of a three-dimensional circuit board. The gasket structure comprises a circuit board, wherein at least one board groove is formed on the circuit board; and a gasket with the same shape and size as the board groove is fixed in the board groove. When the film is stuck to the outer layer of the three-dimensional circuit board, the gasket of which the shape, the size and the thickness are corresponding to those of the board groove is fixed in the board groove on the circuit board, so that the board groove on the whole three-dimensional circuit board is completely filled and leveled up to form a similar planar board; and then the film is struck to the two surfaces of the circuit board. Compared with the prior art, the gasket structure solves the problems of insecure film sticking caused by three-dimensional falls on the surface of the three-dimensional circuit board.
Description
Technical field:
The utility model belongs to wiring board manufacturing technology field, and what be specifically related to is the outer pad pasting gasket construction of a kind of 3 D stereo wiring board, be mainly used in to solve because have three-dimensional drop on the PCB surface, and the insecure problem of the pad pasting that causes.
Background technology:
Fast development along with electron trade; Increasing electronic product can be used the staged wiring board; The staged wiring board is a kind of 3 D stereo wiring board, has three-dimensional drop on the surface of wiring board, and before the wiring board that this surface is existed three-dimensional drop carries out the figure transfer making; Need be on the plate face pad pasting, to realize exposure imaging.For the planar line plate, be easier at plate mask ratio; And for the wiring board that there is three-dimensional drop in the surface; During pad pasting, then can there be the not firm problem of bonding in outer dry film and copper face, after exposure, the development; Dry film will with the copper face direct layering; Influence the follow-up production and the quality of product, and the three-dimensional drop on the wiring board is big more, pad pasting can be insecure more.
Summary of the invention:
In view of above problem, the purpose of the utility model is to provide a kind of 3 D stereo wiring board outer pad pasting gasket construction, has three-dimensional drop to solve on the PCB surface, and the insecure problem of the pad pasting that causes.
For realizing above-mentioned purpose, the utility model mainly adopts following technical scheme:
The outer pad pasting gasket construction of a kind of 3 D stereo wiring board comprises a wiring board, and this wiring board is provided with at least one board slot, is fixed with in the said board slot and the identical pad of this board slot shape size.
Wherein said board slot is rectangle, circle or arbitrary shape.
Be provided with draw-in groove in the wherein said board slot, said pad is fixed in the board slot through above-mentioned draw-in groove inlay card.
The utility model 3 D stereo wiring board is when carrying out outer pad pasting; Be fixed with pad in the board slot in the circuit board with board slot respective shapes, size, thickness; Board slot on the whole 3 D stereo wiring board is filled and led up fully, formed the similar planar plate, afterwards at two masks of plate.Compared with prior art, the utility model has solved on the 3 D stereo PCB surface because of there being three-dimensional drop, and the insecure problem of the pad pasting that causes.
Description of drawings:
Fig. 1 is the structural representation of the utility model.
Identifier declaration among the figure: wiring board 1, board slot 2, pad 3, board slot 4, pad 5.
Embodiment:
For setting forth the thought and the purpose of the utility model, will combine accompanying drawing and specific embodiment that the utility model is done further explanation below.
See also shown in Figure 1ly, Fig. 1 is the structural representation of the utility model.The utility model provides the outer pad pasting gasket construction of a kind of 3 D stereo wiring board, is mainly used in and solves present 3 D stereo wiring board when carrying out outer pad pasting, and is existing because of the surface three-dimensional drop, and causes the unstable problem of pad pasting.
Wherein this structure includes wiring board 1, and wiring board 1 is provided with at least one board slot, be board slot 2 and board slot 4 in the present embodiment, and board slot 2 is different with the shape of board slot 4, can have any shape.
Be fixed with in the corresponding above-mentioned board slot and the identical pad of this board slot shape size, board slot 4 be a rectangle, is fixed with the pad 5 of rectangular shape, and correspondence is fixed with shape with it, size, pad 3 that thickness is identical in the board slot 2.
In addition, in the above-mentioned board slot draw-in groove can be set, be used for the pad inlay card is fixed on board slot; Also can with pad directly place with board slot in, the characteristic of utilizing pad itself produces extruding to the board slot sidewall and forms and fix when being heated.
Wherein above-mentioned pad can adopt the material of FR-4 specification to process, like epoxy glass cloth laminated board, insulation board, epoxy plate, epoxy resin board, brominated epoxy resin plate, glass mat or the like.
The utility model mainly is the filling effect that utilizes pad, existing board slot on the 3 D stereo wiring board is filled and led up, so that operations such as follow-up pad pasting, exposure, developments.Solved on the 3 D stereo PCB surface because of there being three-dimensional drop through this structure, and caused the unstable problem of pad pasting.
More than the outer pad pasting gasket construction of a kind of 3 D stereo wiring board had carried out detailed introduction to the utility model provides; Used concrete example among this paper the principle and the execution mode of the utility model are set forth, the explanation of above embodiment just is used to help to understand the method and the core concept thereof of the utility model; Simultaneously, for one of ordinary skill in the art, according to the thought of the utility model, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as the restriction to the utility model.
Claims (3)
1. the outer pad pasting gasket construction of 3 D stereo wiring board is characterized in that comprising a wiring board, and this wiring board is provided with at least one board slot, is fixed with in the said board slot and the identical pad of this board slot shape size.
2. the outer pad pasting gasket construction of 3 D stereo wiring board according to claim 1 is characterized in that said board slot is rectangle or circle.
3. the outer pad pasting gasket construction of 3 D stereo wiring board according to claim 1 is characterized in that being provided with draw-in groove in the said board slot, and said pad is fixed in the board slot through above-mentioned draw-in groove inlay card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120344121XU CN202269090U (en) | 2011-09-14 | 2011-09-14 | Gasket structure for sticking film to outer layer of three-dimensional circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120344121XU CN202269090U (en) | 2011-09-14 | 2011-09-14 | Gasket structure for sticking film to outer layer of three-dimensional circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202269090U true CN202269090U (en) | 2012-06-06 |
Family
ID=46159869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120344121XU Expired - Fee Related CN202269090U (en) | 2011-09-14 | 2011-09-14 | Gasket structure for sticking film to outer layer of three-dimensional circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202269090U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883545A (en) * | 2012-09-17 | 2013-01-16 | 东莞康源电子有限公司 | Protection process for inner layer welding point of soft and hard combined plate |
-
2011
- 2011-09-14 CN CN201120344121XU patent/CN202269090U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883545A (en) * | 2012-09-17 | 2013-01-16 | 东莞康源电子有限公司 | Protection process for inner layer welding point of soft and hard combined plate |
| CN102883545B (en) * | 2012-09-17 | 2015-04-22 | 东莞康源电子有限公司 | Protection process for inner layer welding point of soft and hard combined plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120606 Termination date: 20160914 |