CN105720179A - Anti-static LED display screen and manufacturing method thereof - Google Patents
Anti-static LED display screen and manufacturing method thereof Download PDFInfo
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- CN105720179A CN105720179A CN201610076339.9A CN201610076339A CN105720179A CN 105720179 A CN105720179 A CN 105720179A CN 201610076339 A CN201610076339 A CN 201610076339A CN 105720179 A CN105720179 A CN 105720179A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000002245 particle Substances 0.000 claims abstract description 40
- 230000003068 static effect Effects 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 15
- 238000002834 transmittance Methods 0.000 claims description 12
- 238000009792 diffusion process Methods 0.000 claims description 9
- 239000002216 antistatic agent Substances 0.000 claims description 7
- 239000000084 colloidal system Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 229920000297 Rayon Polymers 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 230000002265 prevention Effects 0.000 claims description 3
- 238000003854 Surface Print Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000006378 damage Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 4
- 230000005611 electricity Effects 0.000 abstract 1
- 238000012216 screening Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides an anti-static LED display screen and a manufacturing method thereof. The display screen comprises a PCB, a plurality of LED particles, a plastic frame and an anti-static layer, wherein the plurality of LED particles are arranged on the PCB; the plastic frame is arranged on the PCB; the plastic frame comprises a plurality of bulge parts which are arranged at intervals in the direction vertical to the PCB; the bulge parts and the PCB form a plurality of grooves; the LED particles are arranged in the plurality of grooves; and the anti-static layer covers the upper surface of the plastic frame. The anti-static LED display screen has the advantages that the anti-static layer attached to the surface of the anti-static LED display screen can play a shielding effect, increases the contrast and can avoid the damage of static electricity to the LED particles.
Description
Technical field
The present invention relates to display screen field, particularly relate to a kind of antistatic LED display and manufacture method thereof.
Background technology
Existing LED display is by single LEDs SMT (SurfaceMountTechnology, surface mounting technology, it is called for short SMT) on pcb board, each LED isolated by the glue frame then pasting lastblock black, every LEDs is made to form independent imaging pixel, avoid the mutual crosstalk of light between LED, improve contrast.Simultaneously for promoting contrast, also use the PCB of black and be with melanic LED packaging plastic, black glue frame can absorb a lot of light, the PCB of black also can absorb a lot of light, LED particle is also required to being with melanic packaging plastic, and this brightness resulting in LED display is substantially reduced, and luminous efficiency seriously reduces, and the granular sensation of display screen is very strong, it does not have the flat board sense of one.
But, LED generally exposed in atmosphere, by the antistatic property of LED self, resist the damage of extraneous static.But, the antistatic behaviour of LED is typically between 2KV-5KV, and is likely in actually used process need antistatic to reach 10KV or higher, and therefore existing LED screen easily has bad point.
Therefore, it is necessary to defect of the prior art is made further improvements.
Summary of the invention
It is an object of the invention to provide a kind of antistatic LED display, not only screening effect is good for it, increases contrast, and it can be avoided that LED is subject to electrostatic damage.
The antistatic LED display of the present invention, comprising:
Pcb board；
Several LED particle, it is arranged on described pcb board；
Glue frame, it is arranged on described pcb board, and described glue frame includes some spaced lobe on the direction perpendicular with described pcb board, and described lobe and described pcb board form several grooves, and described LED particle is arranged in several grooves described；
Antistatic backing, it is covered in described glue frame upper surface.
As one preferred embodiment of the invention, described antistatic backing is electrostatic prevention film or plate.
As one preferred embodiment of the invention, described antistatic backing is to be made by antistatic material.
As one preferred embodiment of the invention, described antistatic material includes one or more in static dissipative material, conducting electrostatic materials, electrostatic screen and (or) electromagnetic shielding material.
As one preferred embodiment of the invention, the surface resistivity of described static dissipative material equals to or more than 105Ω/sq. but less than 1012Ω/sq., the specific insulation of described static dissipative material equals to or more than 104Ω cm but less than 1011Ω·cm。
As one preferred embodiment of the invention, the surface resistivity of described conducting electrostatic materials is less than 105Ω/sq., specific insulation is less than 104Ω.cm。
As one preferred embodiment of the invention, the surface resistivity of described electrostatic screen and (or) electromagnetic shielding material equals to or less than 10^4 Ω/sq..
Further, the present invention also provides for a kind of method manufacturing above-mentioned antistatic LED display, and it comprises the steps:
A1, installing several LED particle on pcb board, wherein, on described pcb board, the dot spacing of LED particle is 2.5mm；
A2, being pasted on described pcb board by glue frame, wherein, described glue frame includes some spaced lobe on the direction perpendicular with described pcb board, and described lobe and described pcb board form several grooves, and described LED particle is arranged in several grooves described；
A3, the glue being mixed with diffusion particle is filled in described groove formation gelatinous layer；
A4, stick antistatic backing, described antistatic backing rubber cover frame and gelatinous layer at gelatinous layer upper surface,
Wherein, the light transmittance of described antistatic backing is 25%, the thickness 0.2mm of described antistatic backing.
Further, the present invention also provides for the another kind of method manufacturing above-mentioned antistatic LED display, and it comprises the steps:
B1, glue frame and antistatic backing being fitted, wherein, the light transmittance of antistatic backing is 15%, and the thickness of antistatic backing is 0.5mm；
B2, adopting mode for dispensing glue colloid to be filled between glue frame, antistatic backing is connected to described glue frame for one side by solidifying, the height of described colloid is less than or equal to the half of glue frame thickness；
B3, being attached on the pcb board being provided with LED particle by viscose glue by the another side of glue frame, wherein, on pcb board, the dot spacing of LED particle is 2mm.
Further, the present invention also provides for another method manufacturing above-mentioned antistatic LED display, and it comprises the steps:
C1, antistatic backing lower surface print one layer diffusion glue, dry solidification, wherein, the light transmittance of antistatic backing is 8%, and the thickness of antistatic backing is 1mm；
C2, employing point gum machine draw silica gel screen frame on pcb board, and wherein on pcb board, the dot spacing of LED particle is 1.667mm；
C3, antistatic backing in step C1 is had diffusion glue one side be attached in step S2 and have on the silica gel screen frame of colloid, solidify to form antistatic LED display.
Beneficial effects of the present invention: compared with prior art, the antistatic LED display of the present invention has the advantage that it is attached to the antistatic backing on surface, can not only play screening effect, increases contrast, and it can be avoided that LED particle is subject to the injury of electrostatic.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme of the embodiment of the present invention, below the accompanying drawing used required during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.Wherein:
Fig. 1 is antistatic LED display of the present invention structural representation in a specific embodiment；
Fig. 2 is the antistatic LED display of the present invention structural representation in another specific embodiment；
Fig. 3 is the antistatic LED display of the present invention structural representation in another specific embodiment.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
" embodiment " or " embodiment " referred to herein refers to the special characteristic, structure or the characteristic that may be included at least one implementation of the present invention.Different local in this manual " in one embodiment " occurred not refer both to same embodiment, neither be independent or selective and that other embodiments are mutually exclusive embodiment.
Referring to Fig. 1, Fig. 1 is antistatic LED display of the present invention structural representation in a specific embodiment.As it is shown in figure 1, described antistatic LED display, it includes pcb board 1, several LED particle 2, glue frame 3, gelatinous layer 4 and antistatic backing 5.Several LED particle 2, it is arranged on described pcb board 1, and described glue frame and described pcb board 1 form several grooves, and described LED particle 2 is arranged in several grooves described.
Glue frame 3, it is arranged on described pcb board 1, and described glue frame 3 includes some spaced lobe on the direction perpendicular with described pcb board 1, and described lobe and described pcb board 1 form several grooves, and described LED particle is arranged and in several grooves described.The height of described glue frame 3 is more than the height of described LED particle 2.In this embodiment, the lobe of described glue frame 3 includes with described pcb board 1 is connected bottom 31 and be positioned at the top 32 above described bottom 31, the end face width on described top 32 is less than the width of described bottom 31.In other embodiments, cylindrically shaped, prismatic or other shapes of described glue frame 3.
Please continue to refer to Fig. 1.Described gelatinous layer, it is arranged between glue frame adjacent between two.In this embodiment, described gelatinous layer 4 is covered in described LED particle 2 around.Further, described gelatinous layer 4 is concordant with the top of described glue frame 3.
Please continue to refer to Fig. 1.Described antistatic backing 5, it is covered in the upper surface of described glue frame 3 and gelatinous layer 4.Described antistatic backing 5 is film or plate.Described antistatic backing it can be avoided that LED particle 2 is subject to electrostatic damage, and, when described LED particle 2 is not luminous, described antistatic backing 5 can also effectively reduce the reflectance of glue frame 3 light to external world, it is possible to plays good screening effect, increases contrast.In the present invention, the light transmittance of described film or plate is more than 5%, less than 30%, and its light transmittance can be adjusted according to actual needs, reaches the equilibrium point of contrast and light transmittance.Further, this antistatic backing can better make LED display have a body-sensing, can also play the effect of waterproof so that the application places of LED display is more extensive simultaneously.
Described antistatic backing 5 is electrostatic prevention film or plate.Described antistatic backing 5 is to be made by antistatic material.The production technology of the manufacture method of this antistatic backing such as PE antistatic poly-bag, utilizes common PE poly-bag production line, as long as adding a certain proportion of antistatic agent in proportioning raw materials, the product produced will have the function of antistatic.Described antistatic material includes one or more in static dissipative material, conducting electrostatic materials, electrostatic screen and (or) electromagnetic shielding material.The surface resistivity of described static dissipative material equals to or more than 105Ω/sq. but less than 1012Ω/sq., the specific insulation of described static dissipative material equals to or more than 104Ω cm but less than 1011Ω cm.The surface resistivity of described conducting electrostatic materials is less than 105Ω/sq., specific insulation is less than 104Ω .cm.Described electrostatic screen and (or) electromagnetic shielding material are the electric conductors that resistivity is very low, and its surface resistivity equals to or less than 104Ω/sq., surface is subject to friction and does not generally play electrostatic, shielded radio frequency and low frequency electromagnetic field can be used for, but because its resistance is too little, easily in electrostatic field, produce electrostatic induction and static discharge and damage product, therefore generally at one layer of static dissipative material of shielding material (such as: metal forming) internal layer compound.
Please continue to refer to Fig. 1, in this embodiment, the manufacture method of described antistatic LED display is: on the pcb board of white, paster completes the installation of LED particle, and wherein, on described pcb board, the dot spacing of LED particle is 2.5mm；Then the white size frame brushing viscose is attached on pcb board, being blown into by the glue being mixed with diffusion particle with scraper and form gelatinous layer in the groove of described glue frame, and make its surface slightly overflow, finally sticking light transmittance is 25%, thickness is the antistatic backing of 0.2mm, namely completes whole technique after drying.
Referring to Fig. 2, it is the antistatic LED display of the present invention structural representation in another specific embodiment.In this embodiment, described gelatinous layer 6 is between the top 32 of several grooves being filled in described glue frame 3, and described gelatinous layer 6 does not contact with LED particle 2.Other identical with the embodiment shown in Fig. 1.In this embodiment, the manufacture method of described antistatic LED display is: first sticked together by the antistatic backing 5 of white size frame Yu the 0.5mm thickness on surface, wherein the light transmittance of antistatic backing is 15%, then adopt mode for dispensing glue, on putting in each groove, the glue with diffusant forms gelatinous layer 6, the THICKNESS CONTROL of gelatinous layer 6, in the half equal to or less than glue frame 3 height, then solidifies, and makes antistatic backing 5 and glue frame 3 integral；Again by the upper viscose of brush bottom glue frame 3, being pasted on the pcb board being provided with LED particle, wherein, on pcb board, the dot spacing of LED particle is 2mm, paste solid after namely complete whole technique.
Referring to Fig. 3, it is the antistatic LED display of the present invention structural representation in another specific embodiment.In this embodiment, it does not have gelatinous layer, but glue frame upper surface is provided with the film 7 with diffusibility and shielding, other identical with the embodiment shown in Fig. 1.In this embodiment, the manufacture method of described antistatic LED display is: at 1.0mm thickness, and light transmittance is on the antistatic backing 7 of 8%, by the mode of printing, prints one layer of diffusion glue, dry solidification at its lower surface；Adopting point gum machine to draw silica gel screen frame on pcb board, wherein on pcb board, the dot spacing of LED particle is 1.667mm；Before colloid is uncured, sticking thereon by the antistatic backing 7 printing the 1.0mm thickness of diffusion glue, namely solidification is stable shapes.
The antistatic LED display of the present invention has the advantage that it is attached to the antistatic backing on surface, can not only play screening effect, increases contrast, and it can be avoided that LED particle is subject to the injury of electrostatic.
Described above has fully disclosed the specific embodiment of the present invention.It is pointed out that any change that the specific embodiment of the present invention done by one skilled in the art scope all without departing from claims of the present invention.Correspondingly, the scope of the claims of the present invention is also not limited only to previous embodiment.
Claims (10)
1. an antistatic LED display, it is characterised in that: comprising:
Pcb board；
Several LED particle, it is arranged on described pcb board；
Glue frame, it is arranged on described pcb board, and described glue frame includes some spaced lobe on the direction perpendicular with described pcb board, and described lobe and described pcb board form several grooves, and described LED particle is arranged in several grooves described；
Antistatic backing, it is covered in described glue frame upper surface.
2. antistatic LED display according to claim 1, it is characterised in that: described antistatic backing is electrostatic prevention film or plate.
3. antistatic LED display according to claim 1, it is characterised in that: described antistatic backing is to be made by antistatic material.
4. antistatic LED display according to claim 3, it is characterised in that: described antistatic material includes one or more in static dissipative material, conducting electrostatic materials, electrostatic screen and (or) electromagnetic shielding material.
5. antistatic LED display according to claim 4, it is characterised in that: the surface resistivity of described static dissipative material equals to or more than 105Ω/sq. but less than 1012Ω/sq., the specific insulation of described static dissipative material equals to or more than 104Ω cm but less than 1011Ω·cm。
6. antistatic LED display according to claim 4, it is characterised in that: the surface resistivity of described conducting electrostatic materials is less than 105Ω/sq., specific insulation is less than 104Ω.cm。
7. antistatic LED display according to claim 4, it is characterised in that: the surface resistivity of described electrostatic screen and (or) electromagnetic shielding material equals to or less than 10^4 Ω/sq..
8. the method for the arbitrary described antistatic LED display of manufacturing claims 1-7, it is characterised in that: it comprises the steps:
A1, installing several LED particle on pcb board, wherein, on described pcb board, the dot spacing of LED particle is 2.5mm；
A2, being pasted on described pcb board by glue frame, wherein, described glue frame includes some spaced lobe on the direction perpendicular with described pcb board, and described lobe and described pcb board form several grooves, and described LED particle is arranged in several grooves described；
A3, the glue being mixed with diffusion particle is filled in described groove formation gelatinous layer；
A4, stick antistatic backing, described antistatic backing rubber cover frame and gelatinous layer at gelatinous layer upper surface,
Wherein, the light transmittance of described antistatic backing is 25%, the thickness 0.2mm of described antistatic backing.
9. the method for the arbitrary described antistatic LED display of manufacturing claims 1-7, it is characterised in that: it comprises the steps:
B1, glue frame and antistatic backing being fitted, wherein, the light transmittance of antistatic backing is 15%, and the thickness of antistatic backing is 0.5mm；
B2, adopting mode for dispensing glue colloid to be filled between glue frame, antistatic backing is connected to described glue frame for one side by solidifying, the height of described colloid is less than or equal to the half of glue frame thickness；
B3, being attached on the pcb board being provided with LED particle by viscose glue by the another side of glue frame, wherein, on pcb board, the dot spacing of LED particle is 2mm.
10. the method for the arbitrary described antistatic LED display of manufacturing claims 1-7, it is characterised in that: it comprises the steps:
C1, antistatic backing lower surface print one layer diffusion glue, dry solidification, wherein, the light transmittance of antistatic backing is 8%, and the thickness of antistatic backing is 1mm；
C2, employing point gum machine draw silica gel screen frame on pcb board, and wherein on pcb board, the dot spacing of LED particle is 1.667mm；
C3, antistatic backing in step C1 is had diffusion glue one side be attached in step S2 and have on the silica gel screen frame of colloid, solidify to form antistatic LED display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610076339.9A CN105720179A (en) | 2016-02-04 | 2016-02-04 | Anti-static LED display screen and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610076339.9A CN105720179A (en) | 2016-02-04 | 2016-02-04 | Anti-static LED display screen and manufacturing method thereof |
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| CN105720179A true CN105720179A (en) | 2016-06-29 |
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| CN201610076339.9A Pending CN105720179A (en) | 2016-02-04 | 2016-02-04 | Anti-static LED display screen and manufacturing method thereof |
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| EP3343281A1 (en) * | 2016-12-28 | 2018-07-04 | LG Display Co., Ltd. | Light source module, and backlight unit and liquid crystal display device including the same |
| CN108564893A (en) * | 2018-06-15 | 2018-09-21 | 北京环宇蓝博科技有限公司 | Antistatic LED display and preparation method thereof |
| CN109741685A (en) * | 2019-02-18 | 2019-05-10 | 深圳市洲明科技股份有限公司 | A kind of LED display module and preparation method thereof |
| WO2020020176A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳Tcl新技术有限公司 | Led display screen and manufacturing method therefor |
| CN111477735A (en) * | 2019-01-24 | 2020-07-31 | 深圳光峰科技股份有限公司 | L ED display screen |
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Application publication date: 20160629 |