WO2021258769A1

WO2021258769A1 - Display module and manufacturing method therefor, and display

Info

Publication number: WO2021258769A1
Application number: PCT/CN2021/078919
Authority: WO
Inventors: 徐梦梦
Original assignee: 深圳市艾比森光电股份有限公司
Priority date: 2020-06-24
Filing date: 2021-03-03
Publication date: 2021-12-30
Also published as: CN111754887A; CN111754887B

Abstract

A display module and a manufacturing method therefor, and a display. The display module (10) comprises a PCB (111), pixel units (11) and a barrier board (12), wherein the barrier board (12) is arranged on the PCB (111); the barrier board (12) is provided with through openings (13) at positions corresponding to the pixel units (11); the through openings (13) accommodate first sealing adhesive layers (14); and the pixel units (11) are accommodated in the through openings (13) and are encapsulated in the first sealing adhesive layers (14). Compared with a barrier layer formed by means of adhesive dispensing, the barrier board (12) as an integral board member has a simple assembly process relative to the PCB (111), and the pixel units (11) are integrally accommodated in the through openings (13), such that different LED light-emitting units (19) of the pixel units (11) are not separated from each other, thereby improving the light and color mixing uniformity between the LED light-emitting units (19) of the pixel units (11).

Description

Display module and its manufacturing method and display

This application claims the priority of a Chinese patent application filed with the State Intellectual Property Office on June 24, 2020, the application number is 202010589703.8, and the application name is "display module and its manufacturing method, display", the entire content of which is incorporated by reference in In this application.

Technical field

This application belongs to the technical field of display devices, and in particular relates to a display module, a manufacturing method thereof, and a display.

Background technique

In recent years, as consumers continue to improve the performance requirements of LED display screens, the spacing and size of the LED light-emitting units in the LED display screen are also gradually reduced to improve the display clarity and display brightness of the LED display screen.

In the prior art, as the distance between the LED light-emitting units in the LED display screen is reduced, the light crosstalk phenomenon between adjacent pixel units and the problem of bright lines at the joints of the LED display screen will be aggravated. To solve the above-mentioned problems, a common practice in the industry is to provide a barrier layer between adjacent pixel units to prevent light crosstalk between adjacent pixel units and weaken bright lines at the joints of the display screen. However, most of the existing barrier layers are formed by dispensing glue between adjacent pixel units, so that it is easy for the barrier layer to invade between different LED light-emitting units of the same pixel unit, resulting in uneven light and color mixing in the pixel unit. The phenomenon.

technical problem

The purpose of the embodiments of the present application is to provide a display module, which aims to solve the problem that the barrier layer between adjacent pixel units in the prior art easily invades between different LED light-emitting units of the same pixel unit, causing the pixel unit to emit light. The technical problem of uneven color mixing.

Technical solutions

In order to achieve the above-mentioned purpose, the technical solution adopted in this application is:

In a first aspect, a display module is provided, which includes a PCB board, a plurality of pixel units arranged on the PCB board, and barrier partitions for blocking light. The barrier partitions are arranged on the PCB board, and the barrier partitions correspond to the positions of the pixel units. Each of the through openings is provided with a first sealing glue layer, and the pixel unit is accommodated in the corresponding through opening and encapsulated in the corresponding first sealing glue layer.

Optionally, the barrier plate is a plate containing a black light-absorbing material;

Alternatively, the barrier plate includes a transparent plate body, and a black light-absorbing layer is formed on a surface of the transparent plate body facing away from the PCB board.

Optionally, the black light-absorbing layer is an epoxy resin layer, a silica gel layer or a silicone rubber layer containing black ink.

Optionally, scattered particles are dispersed in the transparent plate.

Optionally, the scattering particles are TiO ₂ particles, Al ₂ O ₃ particles or SiO ₂ particles.

Optionally, the transparent board is a polycarbonate board, an epoxy resin board, an acrylic board, a polyphthalamide board, or a polytetrafluoroethylene board.

Optionally, the through opening is a tapered hole, the lower end opening and the upper end opening of the tapered hole are respectively arranged toward and away from the PCB board, and the radial size of the lower end opening is smaller than that of the upper end opening. Radial size.

Optionally, the hole wall of the tapered hole is formed with a reflective surface for reflecting the light emitted by the pixel unit to the outside of the upper end opening, and the reflective surface is a flat surface;

Alternatively, the reflective surface is a curved surface, and the curved direction of the curved surface faces away from the central axis of the tapered hole.

Optionally, a surface of the first sealing layer facing away from the PCB board is flush with the edge of the upper end opening;

Alternatively, a surface of the first sealing layer facing away from the PCB board protrudes from the upper end opening.

Optionally, the display module further includes a second sealant layer, the second sealant layer is disposed on the side surface of the barrier plate that faces away from the PCB board, and the second sealant layer and The first sealant layer is integrally formed.

Optionally, the first encapsulation adhesive layer and the second encapsulation adhesive layer are both epoxy resin layers or silica gel layers.

Optionally, the surface of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB board is a rough surface.

Optionally, a predetermined pattern is formed on a surface of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB board.

Optionally, a functional film is attached to the surface of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB board.

In a second aspect, a method for manufacturing a display module is provided, which includes the following steps:

Provide a PCB board and multiple pixel units, and set each pixel unit on the PCB board;

Provide barrier plates and molds, open through holes at the positions of the barrier plates corresponding to each pixel unit, and the mold has a detachable upper cover plate and a lower bottom plate;

Put the baffle plate into the mold, remove the upper cover plate of the mold, and fill the first packaging glue in each opening;

After each port is filled with the first packaging glue, cover the upper cover plate of the mold, and press the upper cover plate on the surface of the first packaging glue facing away from the PCB board;

Turn the module upside down, and remove the lower bottom plate of the module, and set the PCB board with the pixel unit on the barrier partition, so that each pixel unit extends into each through port and is packaged in the corresponding first packaging glue;

After each pixel unit is encapsulated in the corresponding first encapsulating glue, the lower bottom plate is installed, and the first encapsulating glue encapsulating the pixel unit is cured;

After the curing process is completed, the mold is removed.

In a third aspect, a display is provided, which includes the above-mentioned display module.

Beneficial effect

In the display module provided by the embodiment of the present application, a barrier plate for blocking light is provided on the PCB of the display module, and the pixel unit provided on the PC board is accommodated in the opening on the barrier plate. In this way, the various ports opened on the barrier partition can separate the pixel units on the PCB board from each other, thereby reducing the light crosstalk between the pixel units and reducing the brightness at the joints of the display screen with the display module. Compared with the barrier layer formed by dispensing glue in the prior art, the assembling process for the PCB board is simpler, and because the pixel unit is integrally accommodated in the corresponding opening In this way, the different LED light-emitting units of such a pixel unit will not be separated, thereby improving the uniformity of light color mixing between the respective LED light-emitting units of the pixel unit.

In the manufacturing method of the display module provided by the embodiment of the present application, after the openings on the barrier spacers are opened, the first encapsulating glue can be filled in the openings, and then the PCB board is arranged on the barrier spacers, and each pixel unit Extend into each port and encapsulate in the corresponding first encapsulant. After that, the first encapsulant is cured, so that the pixel unit is packaged in the port and the display module is manufactured. The manufacturing process of the display module is simplified, and the manufacturing efficiency of the display module is improved. Since the pixel unit is integrally accommodated in the corresponding opening, the different LED light-emitting units of a pixel unit will not be separated. Furthermore, the uniformity of light color mixing among the LED light-emitting units of the pixel unit is improved. By setting the mold, the first encapsulating glue filled in each port forms an independent or connected island structure as a whole under the pressing action of the upper cover plate of the mold. The air bubbles in an encapsulating glue can also flatten the surface of the first encapsulating glue facing away from the PCB board on the other hand.

Since the display provided by the embodiment of the present application includes the above-mentioned display module, the assembly process of the above-mentioned display module is relatively simple, and while reducing the optical crosstalk between the pixel units, it also improves the pixel unit. The uniformity of light and color mixing between the various LED light-emitting units, which improves the overall display effect of the display.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings needed in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only for the present application. For some embodiments, those of ordinary skill in the art can obtain other drawings based on these drawings without creative labor.

FIG. 1 is a top structural diagram 1 of a display module provided by an embodiment of the application;

FIG. 2 is a second top structural view of a display module provided by an embodiment of the application;

FIG. 3 is a cross-sectional view 1 of a display module provided by an embodiment of the application;

4 is a second cross-sectional view of the display module provided by an embodiment of the application;

FIG. 5 is a third cross-sectional view of the display module provided by an embodiment of the application;

Fig. 6 is a fourth sectional view of the display module provided by an embodiment of the application;

FIG. 7 is a display module manufacturing sequence diagram of a method for manufacturing a display module according to an embodiment of the application;

FIG. 8 is a process flow diagram of a manufacturing method of a display module provided by an embodiment of the application.

Among them, the reference signs in the figure:

10-Display module 11-Pixel unit 12-Barrier

13-Through the mouth 14—The first sealant layer 15—The second sealant layer

16-Transparent board body 17—Black light-absorbing layer 18—Functional film

19—LED light-emitting unit 20—Mold 21—Lower bottom plate

22—side wall 23—top cover 111—PCB board.

Embodiments of the present invention

The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings 1 to 8 are exemplary, and are intended to explain the present application, and should not be understood as a limitation to the present application.

In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, not It indicates or implies that the pointed device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application.

In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present application, "a plurality of" means two or more than two, unless otherwise specifically defined.

In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

As shown in FIGS. 1 to 3, the embodiments of the present application provide a display module 10, which is applied to a display, and is particularly applicable to an LED display. Specifically, the display module 10 includes a PCB board 111, a plurality of pixel units 11 arranged on the PCB board 111, and a barrier plate 12 for blocking light.

Among them, the pixel unit 11 is composed of a plurality of LED light-emitting units 19 with different light-emitting colors. For example, the pixel unit 11 can be composed of a red LED light-emitting unit 19, a green LED light-emitting unit 19 and a blue LED light-emitting unit 19. Each LED light-emitting unit 19 can adopt a chip type or TOP type SMD packaging method, or a COB packaging method, and can be fixed on the PCB board 111 by means of patch or welding.

Specifically, the baffle plate 12 is disposed on the PCB board 111, wherein the baffle plate 12 and the PCB board 111 can be fixed by bolt connection, riveting or glue. The barrier plate 12 is provided with a through hole 13 at a position corresponding to each pixel unit 11, and each through hole 13 contains a first sealant layer 14. The pixel unit 11 is accommodated in the corresponding through hole 13, and is packaged in the corresponding的first encapsulation layer 14 within.

The following further describes the display module 10 provided by the embodiment of the present application: the display module 10 provided by the embodiment of the present application is provided with a barrier 12 for blocking light on the PCB 111 of the display module 10, and The pixel units 11 on the PC board are accommodated in the through openings 13 opened on the barrier plate 12, so that the respective through openings 13 opened on the barrier plate 12 can separate the pixel units 11 on the PCB board 111 from each other Therefore, the light crosstalk phenomenon between the pixel units 11 can be reduced, and the bright line phenomenon at the joints of the display screen with the display module 10 can be reduced. The barrier layer formed by glue has a simpler assembly process relative to the PCB board 111, and because the pixel unit 11 is integrally accommodated in the corresponding through opening 13, so that the different LED light-emitting units 19 of a pixel unit 11 are not between different LED light-emitting units 19 Will be separated, thereby improving the uniformity of light color mixing among the LED light-emitting units 19 of the pixel unit 11.

In some other embodiments of the present application, the barrier plate 12 is a plate body containing a black light-absorbing material. Specifically, the black light-absorbing material can be black ink, so that the barrier plate 12 is a black plate as a whole, thereby realizing effective isolation of the light emitted between the pixel units 11, and avoiding the gap between the pixel units 11 Optical crosstalk.

In other embodiments of the present application, as shown in FIG. 4, the barrier 12 includes a transparent board body 16, and a black light-absorbing layer 17 is formed on the surface of the transparent board body 16 facing away from the PCB board 111. Specifically, by disposing the black light-absorbing layer 17 on the side surface of the blocking plate 12 facing away from the PCB board 111, this is equivalent to disposing the black light-absorbing layer 17 on the light-emitting side of the blocking plate 12, so as to realize the interaction between each pixel unit 11. The effective isolation of the light emitted between the pixels avoids the light crosstalk between the pixel units 11. In this way, there is no need to make the barrier plate 12 appear black as a whole, thereby reducing the amount of black ink and saving the manufacturing cost of the barrier plate 12.

In some other embodiments of the present application, the black light-absorbing layer 17 is an epoxy resin layer, a silica gel layer, or a silicone rubber layer containing black ink. Specifically, by making the black light-absorbing layer 17 an epoxy resin layer, a silicone layer or a silicone rubber layer containing black ink, the black light-absorbing layer 17 can be covered with the barrier plate when it is placed on the barrier plate 12 in a liquid state. 12. Re-curing on the barrier plate 12, thereby improving the tightness of the black light absorbing layer 17 and the barrier plate 12, and enabling the black light absorbing layer 17 to cover the barrier plate 12, thereby improving the light blocking performance of the barrier plate 12.

In some other embodiments of the present application, scattering particles are dispersed and distributed in the transparent plate 16. Specifically, by dispersing and distributing the scattering particles in the transparent plate body 16, the scattering performance of the light in the baffle plate 12 is improved, thereby expanding the light path of the light emitted from the opening 13 and further improving the display module. 10's uniform light performance.

In some other embodiments of the present application, the scattering particles are TiO ₂ particles, Al ₂ O ₃ particles, or SiO ₂ particles. Specifically, by selecting the scattering particles as TiO ₂ particles, Al ₂ O ₃ particles, or SiO ₂ particles, since the refractive index of the above-mentioned substances is relatively high, the light will be reflected when it hits the above-mentioned particles, thereby forming light. The diffuse reflection in the baffle 12 further enriches the light exit path of the light finally emitted from the through opening 13.

In other embodiments of the present application, the transparent plate 16 is a polycarbonate plate, an epoxy resin plate, an acrylic plate, a polyphthalamide plate, or a polytetrafluoroethylene plate. Specifically, by selecting the transparent plate body 16 to be made of the above-mentioned materials, the transparent plate body 16 has a better light transmittance, thus reducing the light loss of the light in the barrier plate 12, and improving the display mode. Light output efficiency of group 10.

In some other embodiments of the present application, as shown in FIGS. 3 to 5, the through opening 13 is a tapered hole, the lower end opening and the upper end opening of the tapered hole are respectively arranged toward and away from the PCB board 111, and the diameter of the lower end opening The radial dimension is smaller than the radial dimension of the upper end opening.

Specifically, by making the radial size of the lower end opening of the tapered hole smaller than the radial size of the upper end opening, the tapered hole has better light gathering characteristics, which can further improve the light output efficiency of the display module 10.

In some other embodiments of the present application, the hole wall of the tapered hole is formed with a reflective surface for reflecting the light emitted by the pixel unit 11 to the outside of the upper end opening. Among them, the reflecting surface is an inclined surface. At the same time, the reflecting surface can also be a flat surface or a curved surface. When the reflecting surface is a curved surface, the curved direction of the curved surface faces away from the central axis of the tapered hole.

Specifically, since the wall of the tapered hole is formed with a reflective surface, the light emitted by each LED light-emitting unit 19 of the pixel unit 11 can exit the through opening 13 under the reflection of the reflective surface. The reflective surface can be formed by combining the transparent plate 16 and the scattering particles to form a diffuse reflective surface. By designing the reflecting surface as a curved surface, and making the curved direction of the curved surface face away from the central axis of the tapered hole, the curved surface can produce a gathering effect on the light emitted from the through opening 13.

In other embodiments of the present application, as shown in FIG. 5, the surface of the first sealing layer 14 facing away from the PCB board 111 is flush with the edge of the upper end opening; or, the first sealing layer 14 facing away One side surface of the PCB board 111 protrudes from the upper end opening. The display module 10 also includes a second encapsulant layer 15, which is disposed on the side surface of the barrier plate 12 facing away from the PCB board 111, and the second encapsulant layer 15 and the first encapsulant layer 14 are integrally formed .

Specifically, the first encapsulation adhesive layer and the second encapsulation adhesive layer are both epoxy resin layers or silica gel layers. By setting the first encapsulation adhesive layer and the second encapsulation adhesive layer as an epoxy resin layer or a silicone layer, the light transmission performance of the first encapsulation adhesive layer and the second encapsulation adhesive layer is improved, and the display module is also improved 10 display effect.

By making the side surface of the first sealing layer 14 facing away from the PCB board 111 and the edge of the upper end opening flush, the side surface of the barrier plate 12 facing away from the PCB board 111 can be made relatively flat, thereby making it easier to place the barrier plate 12 on the side surface of the PCB board 111. A second packaging adhesive layer is formed on the surface of one side facing away from the PCB board 111. Alternatively, the side surface of the first encapsulating adhesive layer facing away from the PCB board 111 protrudes from the upper end opening, so that the light emitted by the LED light-emitting unit 19 of the pixel unit 11 can be emitted from a part of the sidewall 22 of the first encapsulating adhesive layer. Thus, the uniform light performance of the display module 10 is further improved.

In some other embodiments of the present application, the surface of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB board 111 is a rough surface. Specifically, by setting the surface of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB board 111 as a rough surface, the light emitted from the LED light-emitting unit 19 is further improved in the first packaging adhesive layer or The scattering performance of the side surface of the second encapsulation adhesive layer facing away from the PCB board 111 improves the uniformity of light emission and the display effect of the display module 10.

In some other embodiments of the present application, a predetermined pattern is formed on the surface of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB board 111. Specifically, by forming a preset pattern on the side surface of the first encapsulating adhesive layer or the second encapsulating adhesive layer facing away from the PCB board 111, the light emitted by the display module 10 can project the above-mentioned pattern on the display to achieve specific The function of, enhances the user experience of the display including the display module 10.

In some other embodiments of the present application, as shown in FIG. 6, the functional film 18 is attached to the surface of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB board 111. Specifically, the functional film 18 may specifically be an anti-moiré film or the like to eliminate defects such as moiré generated when the display module 10 is displayed.

As shown in FIG. 7 and FIG. 8, an embodiment of the present application also provides a manufacturing method of the display module 10, which includes the following steps:

A PCB board 111 and a plurality of pixel units 11 are provided, and each pixel unit 11 is arranged on the PCB board 111;

A barrier plate 12 and a mold 20 are provided, and a through hole 13 is opened at the location of the barrier barrier 12 corresponding to each pixel unit 11. The barrier barrier 12 can be made by injection molding or 3D printing, and it can be added with black light absorbing components (Such as black ink) polycarbonate board, epoxy resin board, acrylic board, polyphthalamide board or polytetrafluoroethylene board. The through opening 13 can be formed on the barrier plate 12 by photolithography or machining.

The mold 20 has a detachable upper cover 23 and a lower bottom 21. Put the barrier plate 12 into the mold 20, remove the upper cover 23 of the mold 20, and fill each through opening 13 with the first packaging glue. The encapsulating glue can be injected into the opening 13 from the upper end of the opening 13 by potting, molding, or dispensing; the blocking plate 12 is set in the mold 20 with the side with the opening 13 facing upwards, so that The first encapsulating glue in a liquid state is filled in the opening 13. The mold 20 is composed of a lower bottom plate 21, a side wall 22, and an upper cover plate 23. The bottom plate and the side wall 22, and the cover plate and the side wall 22 can be fixed by screws or other common methods.

After each port 13 is filled with the first packaging glue, cover the upper cover 23 of the mold 20, and press the upper cover 23 on the surface of the first packaging glue that faces away from the PCB 111;

The mold 20 is turned upside down, and the lower bottom plate 21 of the mold 20 is removed. The PCB board 111 provided with the pixel unit 11 is placed on the barrier plate 12, so that each pixel unit 11 extends into each through opening 13 and is packaged in the corresponding first In the packaging glue; in this way, the pixel unit 11 can extend into the through opening 13 and be encapsulated in the first packaging glue. After each pixel unit 11 is packaged in the corresponding first packaging glue, the bottom board 21 is installed, and The first packaging glue encapsulating the pixel unit 11 is cured; the curing can be photocuring or thermal curing, etc. After the curing process is completed, the mold 20 can be removed.

In the manufacturing method of the display module 10 provided by the embodiment of the present application, after the opening 13 on the barrier plate 12 is opened, the first encapsulant can be filled in the opening 13 first, and then the PCB board 111 is placed on the barrier plate 12 And make each pixel unit 11 extend into each through opening 13 and be encapsulated in the corresponding first encapsulating glue. After that, the first encapsulating glue is cured, so that the pixel unit 11 is in the through opening 13 The packaging of the display module 10 is completed, which simplifies the manufacturing process flow of the display module 10 and improves the manufacturing efficiency of the display module 10, and because the pixel unit 11 is integrally accommodated in the corresponding port 13 In this way, the different LED light-emitting units 19 of such a pixel unit 11 will not be separated from each other, thereby improving the uniformity of light color mixing among the respective LED light-emitting units 19 of the pixel unit 11. By setting the mold 20, under the pressing action of the upper cover 23 of the mold 20, the first packaging glue filled in the openings 13 forms a mutually independent or connected island structure as a whole, which is effective on the one hand Extruding the air bubbles in each first encapsulating glue can also flatten the surface of the first encapsulating glue facing away from the PCB board 111 on the other hand.

The embodiment of the present application also provides a display including the above-mentioned display module 10.

Since the display provided by the embodiment of the present application includes the above-mentioned display module 10, the assembly process of the above-mentioned display module 10 is relatively simple, and while reducing the optical crosstalk between the pixel units 11, it also improves The uniformity of the light and color mixing between the LED light-emitting units 19 of the pixel unit 11 is improved, so that the overall display effect of the display is improved.

The above are only preferred embodiments of this application, and are not intended to limit this application. Any modification, equivalent replacement and improvement made within the spirit and principle of this application shall be included in the protection scope of this application. Inside.

Claims

A display module, characterized in that it comprises a PCB board, a plurality of pixel units arranged on the PCB board, and a barrier plate for blocking light. The barrier plate is arranged on the PCB board, and the barrier The board is provided with a through opening corresponding to each of the pixel units, each of the through openings contains a first sealing glue layer, the pixel units are accommodated in the corresponding through openings, and are packaged in the corresponding through openings. In the first sealant layer.
4. The display module of claim 1, wherein the barrier plate is a plate containing a black light-absorbing material;

Alternatively, the barrier plate includes a transparent plate body, and a black light-absorbing layer is formed on a surface of the transparent plate body facing away from the PCB board.
3. The display module of claim 2, wherein the black light-absorbing layer is an epoxy resin layer, a silica gel layer or a silicone rubber layer containing black ink.
3. The display module of claim 2, wherein the transparent plate is dispersed with scattering particles.
The display module of claim 4, wherein the scattering particles are TiO 2 particles, Al 2 O 3 particles, or SiO 2 particles.
The display module according to claim 2, wherein the transparent board is a polycarbonate board, an epoxy resin board, an acrylic board, a polyphthalamide board, or a polytetrafluoroethylene Board body.
The display module according to any one of claims 1 to 6, wherein the through opening is a tapered hole, and the lower end opening and the upper end opening of the tapered hole are respectively disposed toward and away from the PCB board , And the radial size of the lower end opening is smaller than the radial size of the upper end opening.
7. The display module according to claim 7, wherein the hole wall of the tapered hole is formed with a reflective surface for reflecting the light emitted by the pixel unit to the outside of the upper end opening, and the reflective surface is flat;

Alternatively, the reflective surface is a curved surface, and the curved direction of the curved surface faces away from the central axis of the tapered hole.
7. The display module according to claim 7, wherein: a surface of the first sealing layer facing away from the PCB board is flush with the edge of the upper end opening;

Alternatively, a surface of the first sealing layer facing away from the PCB board protrudes from the upper end opening.
The display module according to any one of claims 1 to 6, characterized in that: the display module further comprises a second sealant layer, the second sealant layer is disposed on the barrier plate facing away from the One side surface of the PCB board, and the second sealing glue layer and the first sealing glue layer are integrally formed.
10. The display module of claim 10, wherein the first encapsulation adhesive layer and the second encapsulation adhesive layer are both epoxy resin layers or silica gel layers.
The display module according to claim 10, wherein the surface of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB board is a rough surface.
11. The display module of claim 10, wherein a predetermined pattern is formed on a surface of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB board.
The display module according to claim 10, wherein a functional film is attached to a surface of the first packaging adhesive layer or the second packaging adhesive layer facing away from the PCB board.
A method for manufacturing a display module is characterized in that it comprises the following steps:

A PCB board and a plurality of pixel units are provided, and each pixel unit is arranged on the PCB board;

Provide a barrier plate and a mold, and open a through hole at the position of the barrier plate corresponding to each of the pixel units, and the mold has a detachable upper cover plate and a lower bottom plate;

Put the baffle plate into the mold, remove the upper cover plate of the mold, and fill each of the through openings with the first packaging glue;

After each port is filled with the first packaging glue, cover the upper cover plate of the mold and press the upper cover plate on the surface of the first packaging glue facing away from the PCB board ；

The mold is turned upside down, and the lower bottom plate of the mold is removed, and the PCB board provided with the pixel unit is set on the barrier plate, so that each pixel unit extends into each of the through openings and is packaged In the corresponding first packaging glue;

After each of the pixel units is encapsulated in the corresponding first encapsulating glue, the lower bottom plate is installed, and the first encapsulating glue encapsulating the pixel units is cured;

After the curing process is completed, the mold is removed.
A display, characterized in that it comprises the display module according to any one of claims 1-14.