CN200959193Y - LED display lattice block with silica-gel and epoxy-resin secondary package formation - Google Patents
LED display lattice block with silica-gel and epoxy-resin secondary package formation Download PDFInfo
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- CN200959193Y CN200959193Y CN 200620046449 CN200620046449U CN200959193Y CN 200959193 Y CN200959193 Y CN 200959193Y CN 200620046449 CN200620046449 CN 200620046449 CN 200620046449 U CN200620046449 U CN 200620046449U CN 200959193 Y CN200959193 Y CN 200959193Y
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- led
- dot matrix
- wiring board
- printed wiring
- cage plate
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Abstract
The utility model relates to an LED display lattice lump encapsulated twice by the silica gel and the epoxide resin, comprises a printed board and an assemble structure with an injection set and an assorted lattice set, the structure of the printed board and the injection set is same as the groovy LED display lattice lump, the utility model is charactered in that a lattice set is arranged between the the printed board and the injection set, a plurality of LED opening is arranged on the lattice set,the LED chip arranged on the opening and the printed board is truly match along with the position of the reflex cavity of the injection set, and combines the the reflex cavity of the injection set with an integrated cavity forming a twice encapsulated structure used by the rigorous envelopment of the epoxide resin in the out surface of the injection set, enveloped rigorously by the silica gel to the LED chip in the internal lattice set. When long term wore leads to high temperature, the epoxide resin around the LED chip of the LED display lattice lump encapsulated completely by the epoxide resin will become old, crisp and crazing, results in the shine function of the LED impaired, the utility model overcomes the disadvantage, increase the reliability of the LED display lattice lump.
Description
Technical field
The utility model relates to the making of display device luminous component, relates in particular to a kind of LED and shows the fast encapsulating structure of mould.
Background technology
LED shows lattice block as a kind of common luminous component in the LED display making field, is formed, independently formed on the structure minimum unit of LED display by several LED pixels.Its structure is generally: use light-emitting pixels element led chip the method for solid brilliant pressure welding to be fixed on and also be arranged in matrix on the printed wiring board at a certain distance, be furnished with the tinsel cord forming circuit on the printed wiring board, and vertically draw some metal stitch from the back side, other has the injection moulding external member supporting with printed wiring board, positive corresponding each the led chip place of described injection moulding external member all disposes reflecting chamber, surround the formation inner chamber around the injection moulding external member, embedding printed wiring board in the injection moulding external member inner chamber of prior perfusion liquid attitude epoxy resin makes overall package and through solidifying, promptly becomes LED and show lattice block.
LED with said structure shows that lattice block can be assembled into LED display.Development in LED display is early stage, and this type of LED display mostly is monochromatic or double-colored screen, and promptly each pixel is made up of one or two LEDs chips, and the led chip heating effect is not fairly obvious.After red green blue three primary colours full color display comes out, three LEDs luminescence chips in a pixel, have been assembled, can produce comparatively significantly LED temperature-rise effect during actual the use, this has a negative impact to encapsulating material epoxy resin, show that epoxy resin is subjected to heat ageing for a long time, to cause near the epoxy resin generation vitrifacation qualitative change the led chip, embrittlement even local cracking, and then cause led chip or pressure welding line impaired too early, make display screen dim spot or blind point occur, thereby directly influenced the quality of LED display.How improving this phenomenon has become professional's focal point and difficult point.
The utility model content
In order to overcome above-mentioned defective, the utility model provides a kind of and carries out encapsulated LED lattice block structure at twice with the different encapsulating materials with epoxy resin of silica gel, be heated aging and qualitative change cracking phenomena take place to avoid occurring epoxy resin, thereby the quality of LED display is further promoted.
The utility model shows lattice block with the LED of silica gel and twice encapsulated moulding of epoxy resin, comprise printed wiring board, the unitized construction of supporting injection moulding external member and supporting dot matrix cage plate, described printed wiring board shows that with conventional LED the encapsulating structure of lattice block is identical with the injection moulding external member, it is characterized in that: between printed wiring board and supporting injection moulding external member, install a dot matrix cage plate additional, have some LED fenestras on it, the reflecting chamber position of led chip and supporting injection moulding external member is accurately corresponding on fenestra and the printed wiring board, and be combined into complete optical cavity with the reflecting chamber of supporting injection moulding external member, be formed on the inner layer surface of dot matrix cage plate and can tightly seal with silica gel led chip, twice encapsulated moulding structure on the outer layer surface of injection moulding external member, tightly sealing with epoxy resin.
The material of described supporting dot matrix cage plate is the insulating material of easy injection mo(u)lding or identical with the composition material of injection moulding external member, and its planar dimension is no more than the outside dimensions of corresponding printed wiring board, and its thickness is below 2mm; The reverse side of described supporting dot matrix cage plate fits tightly with corresponding printed wiring board front, the front of dot matrix cage plate fits tightly in order to the reverse side with supporting injection moulding external member, and the inwall requirement of LED fenestra is smooth and reflective, the LED fenestra docks and be combined into complete optical cavity fully with the reflecting chamber of supporting injection moulding external member.
The one side that described supporting dot matrix cage plate and printed wiring board are fitted has at least 2 register pins, and corresponding one by one with the pilot hole of printed wiring board corresponding position; Described supporting dot matrix cage plate has at least 2 pilot holes, and corresponding one by one with register pin in the supporting injection moulding external member inner chamber, also the pilot hole one with the printed wiring board corresponding position is corresponding.
Have the number of pins hole on the described supporting dot matrix cage plate, corresponding one by one with the present position of metal pins root on the printed wiring board; Have some glue holes of leading on the described supporting dot matrix cage plate, with the printed wiring board corresponding position to lead the glue hole corresponding one by one.
And have pin bores on the above-mentioned dot matrix cage plate and lead the glue hole different second kind of way be, described supporting dot matrix cage plate is except that the structure that keeps described LED fenestra, register pin and pilot hole and necessary each other the connection, other positions are empty frame in blocks, and these sky frames are contained the glue hole of leading of printed wiring board corresponding position fully.
Because typical silica gel temperature adaptation scope is at-55～200 ℃, and typical glass epoxy inversion temperature is 115～120 ℃, illustrates that the thermotolerance of silica gel obviously is better than epoxy resin.After realizing the utility model, formed twice encapsulated moulding structure tightly sealing with silica gel, on the outer layer surface of injection moulding external member, tightly to seal led chip on the inner layer surface of dot matrix cage plate with epoxy resin, thereby avoided making LED show that the reliability of lattice block is improved because of the long-term work temperature drift causes near the led chip the aging embrittlement of epoxy resin even the generation of cracking phenomena.Outer encapsulation is used epoxy resin instead without silica gel, can state in realization on the basis of target, continues to keep LED to show the integral rigidity performance of lattice block.
Be close to led chip around also have a benefit with silica gel encapsulation: because silica gel can use softer recipe ratio such as jelly shape material, therefore be when led chip is done the silica gel encapsulation of inner layer surface when encapsulating for the first time, can increase by one subsequently and detect operation, show mass defects such as the dim spot that may exist in the lattice block or blind point with timely discovery LED, do over again thereby can repair easily immediately, avoided causing the phenomenon of waste product to take place with finding quality problems can't retrieve behind encapsulated moulding of epoxy resin again.
Description of drawings
Fig. 1 is the explosive view of primary structure injection moulding external member, dot matrix cage plate and the printed wiring board of the utility model embodiment one;
Fig. 2 is the schematic appearance of the dot matrix cage plate of embodiment one;
Fig. 3 is the printed wiring board back appearance synoptic diagram of embodiment one;
Fig. 4 is injection moulding external member, dot matrix cage plate and the printed wiring board encapsulation sectional view of embodiment one;
Fig. 5 is the explosive view of primary structure injection moulding external member, dot matrix cage plate and the printed wiring board of the utility model embodiment two;
Fig. 6 is the schematic appearance of the dot matrix cage plate of embodiment two.
Embodiment
The utility model is described in further detail to show the encapsulating structure of dot matrix below in conjunction with Fig. 1 to one: 4 * 4LED of embodiment shown in Figure 4:
The utility model shows lattice block with the LED of silica gel and twice encapsulated moulding of epoxy resin, the structure that comprises printed wiring board 3, supporting injection moulding external member 1 and dot matrix cage plate 2, the structure of described printed wiring board and injection moulding external member is identical with above-mentioned existing structure, and wherein the setting of dot matrix cage plate 2 is improvement and the innovations on existing structure basis two.
The material of described supporting dot matrix cage plate 2 and injection moulding external member 1 are the PPO material and make, the planar dimension of dot matrix cage plate 2 and quadrilateral shape are identical with corresponding printed wiring board 3, the outside dimensions that does not surpass corresponding printed wiring board, its thickness is at 1mm, have 4 * 4 LED fenestras 21 on it, reflecting chamber 11 positions of its Kong Weiyu printed wiring board 3 top led chips and injection moulding external member 1 are accurately corresponding, and fenestra inner wall smooth and reflective.Dot matrix cage plate LED fenestra docks fully with supporting injection moulding external member reflecting chamber, and is combined into complete optical cavity.
Dot matrix cage plate 2 has two register pins 22 with the one side that printed wiring board fits tightly, and is fully corresponding with pilot hole 32 on the printed wiring board 3.In addition, dot matrix cage plate 2 also has two pilot holes 23, and several pin bores 24 and several are led glue hole 25.Pilot hole 23 on the dot matrix cage plate is corresponding one by one with register pin 13 in the supporting injection moulding external member inner chamber, also with printed wiring board on pilot hole 33 corresponding one by one.On the dot matrix cage plate on the position of pin bores 24 and the printed wiring board root position of metal pins 34 corresponding one by one.It is corresponding one by one with the position of leading glue hole 35 on the printed wiring board to lead glue hole 25 on the dot matrix cage plate.
Two register pins 22 of described dot matrix cage plate 2 are aimed at the pilot hole 32 of printed wiring board 3 insert and fit tightly, consider that metal pins 34 is vertically to press on printed wiring board 3, its root can minute protrusions occur in the printed wiring board front, leave pin bores 24 on the dot matrix cage plate 2 for this reason, get out of the way these minute protrusions, thereby guarantee to accomplish closely continuously when dot matrix cage plate 2 is fitted with printed wiring board 3.Two plates fit tightly the bottom that all led chips on the printed wiring board 3 of back just all fall into the fenestra 21 of dot matrix cage plate 2.LED fenestra 21 surrounds the small container shape with the led chip of fenestra bottom like this, point filling silica gel begins to carry out the encapsulation first time in this container, the silica gel groundwater increment is to flood led chip and to exceed a little less than the surface of dot matrix cage plate, because dot matrix cage plate 2 has fitted tightly with printed wiring board 3, has avoided producing leakage glue because of there being the slit between two plates.Dot matrix cage plate 2 after the applying has been connected as a single entity with printed wiring board 3, the pilot hole 23 of dot matrix cage plate 2 and overlapping the integrating of pilot hole 33 of printed wiring board 3, dot matrix cage plate 2 lead glue hole 25 and printed wiring board 3 to lead glue hole 35 also overlapping fully.After encapsulation is finished for the first time, can carry out the overall package second time with epoxy resin according to a conventional method.Front surface with the injection moulding external member sticks adhesive tape earlier, place the adhesive tape injection moulding external member inner chamber that faces down on the table up, make reflecting chamber Cheng Kesheng fluent meterial container-like of injection moulding external member and pour into liquid-state epoxy resin, the two fit face down that harden of filling out that the printed wiring board of irritating silica gel and dot matrix cage plate fit tightly, two register pins 13 that harden fit pilot hole 23 that has and 33 aligning injection moulding external members plug together the location, two zoariums that harden are inserted the bottom of injection moulding external member inner chamber and compressed, overflow equal uniform flow if be positioned at the two unnecessary liquid-state epoxy resin glue in fit below that harden through the two fit total glue holes 25 and 35 of leading of hardening, to satisfy the packaging technology requirement that LED shows lattice block
Owing to adopted above-mentioned improvement organization plan, after register pin, pilot hole by correspondence are completely fixed the location, supporting dot matrix cage plate fits tightly with corresponding printed wiring board front, printed wiring board is faced up, aim at the led chip point of fenestra in the hole of dot matrix cage plate and irritate the encapsulation for the first time of silica gel do, until flooding led chip, and slightly be shallower than dot matrix cage plate surface.Carry out according to existing packaging technology flow process fully during for the second time with epoxy encapsulation, promptly make satisfactory LED through baking-curing again and show lattice block.
The utility model indication is in twice encapsulated moulding structure can tightly sealing with silica gel, tightly seal with epoxy resin on the outer layer surface of injection moulding external member led chip on the inner layer surface of dot matrix cage plate, its encapsulation needn't be limited to the process sequence of encapsulating epoxy resin behind the first encapsulation silica gel, also can encapsulate silica gel behind the first encapsulating epoxy resin, as described in following examples two:
In Fig. 5, embodiment two shown in Figure 6, printed wiring board 3 and supporting injection moulding cover 1 are identical with embodiment one, but the structure of dot matrix cage plate 2 is different.The pin bores 24 of dot matrix cage plate 2 and lead glue hole 25 and in embodiment two, replaced among the embodiment one by empty frame 26 in blocks, in other words, described supporting dot matrix cage plate 2 is except that keeping described LED fenestra 21, register pin 22 and the structure of pilot hole 23 and necessary each other the connection, other positions are empty frame 26 in blocks, and these sky frames are contained the glue hole 35 of leading of printed wiring board corresponding position fully.At this moment main encapsulation step is:
The first step, earlier the front surface with injection moulding external member 1 sticks adhesive tape, and the adhesive tape injection moulding external member inner chamber that faces down is placed on the table up, makes reflecting chamber Cheng Kesheng fluent meterial container-like of injection moulding external member and pours into an amount of liquid-state epoxy resin;
Second step, make the register pin 13 of the pilot hole 23 aligning injection moulding external members of dot matrix cage plate 2 plug together the location, dot matrix cage plate 2 is inserted the intracavity bottom of injection moulding external member 1 and compress, the liquid-state epoxy resin glue that is arranged in dot matrix cage plate 2 belows overflows to the LED fenestra 21 of dot matrix cage plate 2 and empty frame 26 in blocks, but because the strict amount of pouring into of having controlled liquid-state epoxy resin, so the liquid level of epoxy resin is more lower slightly than the upper surface of dot matrix cage plate 2, can not cover the surface of dot matrix cage plate;
In the 3rd step, above-mentioned packaging part advances baking oven, makes epoxy resin cure;
In the 4th step, the packaging part after take out solidifying is to pour into proper silica gel on the dot matrix cage plate of epoxy resin layer toward the bottom;
The 5th step, make the register pin 23 of the pilot hole 33 aligning dot matrix cage plates of printed wiring board 3 plug together the location, printed wiring board 3 is inserted injection moulding external member 1 intracavity bottom that is packaged with dot matrix cage plate 2 and compress, the liquid-state silicon gel that is arranged in printed wiring board 3 belows allows on a small quantity and overflows from the glue hole 35 of leading of printed wiring board;
The 6th step was cured according to the normal temperature of silica gel or the curing process of heating, and encapsulation is finished.
In embodiment two, the dosage of the control infusion epoxy resin first time is most important, because the liquid level of epoxy resin is more lower slightly than the upper surface of dot matrix cage plate 2, can not cover the surface of dot matrix cage plate, therefore printed wiring board 3 just may fit tightly with dot matrix cage plate 2, and the silica gel of encapsulation for the second time can enter in the LED fenestra 21 in the dot matrix cage plate 2, then the led chip on the printed wiring board 3 could be flooded by the silica gel of 21 li of corresponding LED fenestras and tightly seal, thereby reach on the inner layer surface of dot matrix cage plate led chip is tightly sealed with silica gel, twice encapsulation purpose on the outer layer surface of injection moulding external member, tightly sealing with epoxy resin.
Claims (6)
1. the utility model shows lattice block with the LED of silica gel and twice encapsulated moulding of epoxy resin, comprise printed wiring board (3), the unitized construction of supporting injection moulding external member (1) and supporting dot matrix cage plate (2), described printed wiring board shows that with conventional LED the encapsulating structure of lattice block is identical with the injection moulding external member, it is characterized in that: between printed wiring board (3) and supporting injection moulding external member (1), install a dot matrix cage plate (2) additional, have some LED fenestras (21) on it, fenestra is accurately corresponding with reflecting chamber (11) position that printed wiring board (3) is gone up led chip and supporting injection moulding external member (1), and be combined into complete optical cavity with the reflecting chamber of supporting injection moulding external member, be formed on the inner layer surface of dot matrix cage plate and can tightly seal with silica gel led chip, twice encapsulated moulding structure on the outer layer surface of injection moulding external member, tightly sealing with epoxy resin.
2. show lattice block according to the described LED of claim 1 with silica gel and twice encapsulated moulding of epoxy resin, it is characterized in that: the material of described supporting dot matrix cage plate is the insulating material of easy injection mo(u)lding or identical with the composition material of injection moulding external member, its planar dimension is no more than the outside dimensions of corresponding printed wiring board, and its thickness is below 2mm; The reverse side of described supporting dot matrix cage plate fits tightly with corresponding printed wiring board front, the front of dot matrix cage plate fits tightly in order to the reverse side with supporting injection moulding external member, the inwall of LED fenestra (21) requires smooth and reflective, and LED fenestra (21) docks and be combined into complete optical cavity fully with the reflecting chamber (11) of supporting injection moulding external member.
3. show lattice block according to the described LED of claim 2 with silica gel and twice encapsulated moulding of epoxy resin, it is characterized in that: the one side that described supporting dot matrix cage plate and printed wiring board are fitted has at least 2 register pins (22), and corresponding one by one with the pilot hole (32) of printed wiring board corresponding position; Described supporting dot matrix cage plate has at least 2 pilot holes (23), and corresponding one by one with register pin (13) in the supporting injection moulding external member inner chamber, also the pilot hole (33) with the printed wiring board corresponding position is corresponding one by one.
4. show lattice block according to the described LED of claim 3 with silica gel and twice encapsulated moulding of epoxy resin, it is characterized in that: have number of pins hole (24) on the described supporting dot matrix cage plate, corresponding one by one with the present position of metal pins on the printed wiring board (34) root; Have some glue holes (25) of leading on the described supporting dot matrix cage plate, with the printed wiring board corresponding position to lead glue hole (35) corresponding one by one.
5. show lattice block according to the described LED of claim 3 with silica gel and twice encapsulated moulding of epoxy resin, it is characterized in that: described supporting dot matrix cage plate is except that keeping described LED fenestra (21), register pin (22) and the structure of pilot hole (23) and necessary each other the connection, other positions are empty frame (26) in blocks, and these sky frames are contained the glue hole (35) of leading of printed wiring board corresponding position fully.
6. show lattice block according to the described LED of claim 1 with silica gel and twice encapsulated moulding of epoxy resin, it is characterized in that: described in twice encapsulated moulding structure can tightly sealing with silica gel, on the outer layer surface of injection moulding external member, tightly seal led chip on the inner layer surface of dot matrix cage plate with epoxy resin, two kinds of forms of encapsulation silica gel behind encapsulating epoxy resin and the first encapsulating epoxy resin behind the permission elder generation encapsulation silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620046449 CN200959193Y (en) | 2006-09-29 | 2006-09-29 | LED display lattice block with silica-gel and epoxy-resin secondary package formation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620046449 CN200959193Y (en) | 2006-09-29 | 2006-09-29 | LED display lattice block with silica-gel and epoxy-resin secondary package formation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200959193Y true CN200959193Y (en) | 2007-10-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620046449 Expired - Lifetime CN200959193Y (en) | 2006-09-29 | 2006-09-29 | LED display lattice block with silica-gel and epoxy-resin secondary package formation |
Country Status (1)
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|---|---|
| CN (1) | CN200959193Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752275B (en) * | 2009-10-23 | 2012-01-04 | 中外合资江苏稳润光电有限公司 | Packaging method and packaging structure of light emitting diode (LED) module |
| CN106531865A (en) * | 2016-10-24 | 2017-03-22 | 东莞市凯昶德电子科技股份有限公司 | Preparation method of dam ceramic substrate for ultraviolet LED package |
-
2006
- 2006-09-29 CN CN 200620046449 patent/CN200959193Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101752275B (en) * | 2009-10-23 | 2012-01-04 | 中外合资江苏稳润光电有限公司 | Packaging method and packaging structure of light emitting diode (LED) module |
| CN106531865A (en) * | 2016-10-24 | 2017-03-22 | 东莞市凯昶德电子科技股份有限公司 | Preparation method of dam ceramic substrate for ultraviolet LED package |
| CN106531865B (en) * | 2016-10-24 | 2019-06-21 | 东莞市国瓷新材料科技有限公司 | A kind of box dam ceramic substrate preparation method of ultraviolet LED encapsulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20071010 |
|
| EXPY | Termination of patent right or utility model |