CN104167412A - LED packaging structure and manufacturing method thereof - Google Patents
LED packaging structure and manufacturing method thereof Download PDFInfo
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- CN104167412A CN104167412A CN201410420961.8A CN201410420961A CN104167412A CN 104167412 A CN104167412 A CN 104167412A CN 201410420961 A CN201410420961 A CN 201410420961A CN 104167412 A CN104167412 A CN 104167412A
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Abstract
The invention discloses an LED packaging structure and a manufacturing method thereof. The LED packaging structure comprises a COB substrate and N LED chips evenly fixed on the COB substrate, wherein N is an integer large than 1, a surrounding wall formed by box dam glue is arranged around the LED chips, and light emitted from the lateral sides of the LED chips are blocked by the surrounding wall. According to the LED packaging structure, the density of the LED chips is higher, cross light can be effectively prevented, the contrast ratio is increased, and therefore the display effect is better. Furthermore, the COB substrate and the box dam glue can be fully utilized, and cost is reduced.
Description
Technical field
The present invention relates to LED display field, more specifically, relate to a kind of LED encapsulating structure and preparation method thereof.
Background technology
LED display industry is towards high density point apart from future development at present, the lamp pearl that tradition LED display is used adopts Chip SMD LED and Top SMD LED, be the i.e. rgb pixel point of a lamp pearl, but the LED display made from this type of lamp pearl when some distance little to a certain extent after by hard to carry on.Therefore traditional LED display exists technical bottleneck in increase LED chip density.
If a plurality of rgb pixel points are packaged in a COB module, can realize more point distance, but because the spacing of pixel is too small, between pixel, can have the risk of optical crosstalk, can have influence on Integral luminous performance.
Summary of the invention
The present invention is intended to solve the problems of the technologies described above at least to a certain extent.
Primary and foremost purpose of the present invention is to provide a kind of LED encapsulating structure that effectively prevents optical crosstalk, improves contrast.
A further object of the present invention is to provide a kind of manufacture method of LED encapsulating structure.
For solving the problems of the technologies described above, technical scheme of the present invention is as follows:
A kind of LED encapsulating structure, comprise COB substrate and be fixed on the LED chip on COB substrate, on COB substrate, be fixed with uniformly N LED chip, N is greater than 1 integer, LED chip is provided with the enclosure wall that box dam glue forms around, and the light that enclosure wall sends LED chip side blocks.
A manufacture method for LED encapsulating structure, comprises the following steps:
S1: make COB substrate;
S2: LED chip is fixed on COB substrate, and carries out bonding wire;
S3: use box dam glue, make enclosure wall around at LED chip, the light that enclosure wall sends LED chip side blocks;
S4: carry out sealing to completing the COB substrate of S2 and S3 operation.
Compared with prior art, the beneficial effect of technical solution of the present invention is: a plurality of LED chips of the present invention are encapsulated on same COB substrate, LED chip is provided with the enclosure wall that box dam glue forms around, the light that enclosure wall sends LED chip side blocks, the light of crosstalking and sending from LED chip side due to the light between LED chip, therefore the light that uses enclosure wall that LED chip side is sent blocks, can reduce the light of even eliminating between LED chip crosstalks, not only LED chip spacing is less in the present invention, density is larger, and can effectively prevent the generation of optical crosstalk phenomenon, therefore display effect is better.
Accompanying drawing explanation
Fig. 1 is the LED encapsulating structure vertical view of embodiment 1.
Fig. 2 is the LED encapsulating structure directions X sectional view of embodiment 1.
Fig. 3 is the LED encapsulating structure Y-direction sectional view of embodiment 1.
Fig. 4 is the LED encapsulating structure directions X optical effect figure of embodiment 1.
Fig. 5 is the LED encapsulating structure Y-direction optical effect figure of embodiment 1.
Fig. 6 is the LED encapsulating structure vertical view of embodiment 2.
Fig. 7 is the LED encapsulating structure directions X sectional view of embodiment 2.
Fig. 8 is the LED encapsulating structure directions X optical effect figure of embodiment 2.
Fig. 9 is the LED encapsulating structure Y-direction optical effect figure of embodiment 2.
Figure 10 is the some box dam glue method schematic diagram of the multiple-layer stacked of embodiment 2 enclosure walls.
Figure 11 is the some box dam glue method design sketch of the multiple-layer stacked of embodiment 2 enclosure walls.
Figure 12 is the LED encapsulating structure vertical view of embodiment 3.
1, COB substrate; 2, enclosure wall; 3, LED chip; 4, packaging plastic; 5, drive IC.
Embodiment
Accompanying drawing, only for exemplary illustration, can not be interpreted as the restriction to this patent;
For better explanation the present embodiment, some parts of accompanying drawing have omission, zoom in or out, and do not represent the size of actual product;
To those skilled in the art, in accompanying drawing some known configurations and explanation thereof may to omit be understandable.
Below in conjunction with drawings and Examples, technical scheme of the present invention is described further.
embodiment 1
As Figure 1-3, a kind of LED encapsulating structure, comprise COB substrate 1 and be fixed on the LED chip 3 on COB substrate 1, on COB substrate 1, be fixed with uniformly N LED chip 3, N is greater than 1 integer, LED chip 3 is provided with the enclosure wall 2 that box dam glue forms around, and the light that enclosure wall sends LED chip side blocks.
A manufacture method for LED encapsulating structure, comprises the following steps:
S1: make COB substrate 1;
S2: LED chip 3 is fixed on COB substrate 1, and carries out bonding wire;
S3: use box dam glue, make enclosure wall 2 around at LED chip 3, the light that send 2 pairs of LED chip 3 sides of enclosure wall blocks;
S4: carry out sealing to completing the COB substrate 1 of S2 and S3 operation;
S5: cut peripheral redundance, obtain the LED encapsulating structure of complete COB encapsulation.
A plurality of LED chips 3 of the present invention are encapsulated on same COB substrate 1, LED chip 3 is provided with the enclosure wall 2 that box dam glue forms around, the light that send 2 pairs of LED chip 3 sides of enclosure wall blocks, the light of crosstalking and sending from LED chip 3 sides due to the light of 3 of LED chips, therefore the light that uses enclosure wall 2 that LED chip 3 sides are sent blocks, can reduce the light of even eliminating 3 of LED chips crosstalks, not only LED chip 3 spacing are less, density is larger in the present invention, and can effectively prevent the generation of optical crosstalk phenomenon, so display effect is better.
In specific implementation process, the color of described box dam glue is black, so 2 pairs of light of enclosure wall that box dam glue is made have best occlusion effect, and can improve contrast.
In specific implementation process, described LED chip 3 adopts monochromatic LED chip, dual-colored LED chip, RGB three-color LED chip etc., the preferred RGB three-color LED chip that adopts, it comprises the luminescence chip of red (R), green (G), blue (B) three kinds of colors, pixel of expression that can be complete.
In specific implementation process, described COB substrate 1 adopts BT substrate, FR-4 substrate, ceramic substrate or metal substrate, preferably adopts BT substrate.
In specific implementation process, described LED chip 3 adopts formal dress technique or reverse installation process to be fixed on COB substrate 1.
In specific implementation process, in step S4, the method that described COB substrate 1 is carried out to sealing is mold pressing encapsulation or some rubber seal dress.
In specific implementation process, if the thickness of R luminescence chip is h1, B, G luminescence chip thickness are h2, the height of enclosure wall is h3, h2≤h3≤h1, therefore chooses h1=0.15mm, h2=0.08mm in the present embodiment, the height of enclosure wall is between 0.08mm and 0.15mm, and after encapsulation, the gross thickness H of colloid is 0.6mm.
A plurality of LED chips 3 of the present invention are encapsulated on same COB substrate 1, LED chip 3 is provided with the enclosure wall 2 that black box dam glue forms around, LED chip 3 spacing are less, density is larger, and can effectively prevent generation, the raising contrast of optical crosstalk phenomenon, so display effect is better; After fixing to LED chip 3, can first with box dam glue, make then bonding wire of enclosure wall 2, or with box dam glue, make enclosure wall 2 after first bonding wire, its flexible operation, be easy to realize; During encapsulation, both can use mould pressing process sealing, also can use gluing process injecting glue, or only pixel be encapsulated, interior to pixel point rubber seal dress at enclosure wall 2, can greatly increase technique realizability and reduce and opened molding die cost.
embodiment 2
Adopt eye-observation and light distribution test macro in LED encapsulating structure optical analog/test described in embodiment 1.As shown in Figure 4,5, simulation and test result demonstration, enclosure wall 2 " is cut apart " to be had and more obviously improves effect the optical crosstalk of COB module, but there is X, Y-direction improve the inconsistent problem of effect, concrete reason is that directions X and Y-direction lighting angle are inconsistent.This is because R, G, the B tri-LEDs chips 3 of a pixel are to arrange by " one " font, the length of pixel X, Y-direction is originally just different, its length-width ratio is 3:1, therefore LED chip 3 is also inconsistent with the distance in X, Y-direction of enclosure wall 2, therefore X, Y-direction to improve effect inconsistent.
As shown in Figure 6, the present embodiment changes the mode that box dam glue is made enclosure wall 2 on the basis of embodiment 1, adopts the back-shaped method of enclosing, and makes LED chip 3 consistent in the distance of all directions with box dam glue, thereby reaches the consistent object of rising angle.The LED encapsulating structure directions X sectional view of the present embodiment, directions X optical effect figure, Y-direction optical effect figure are as Figure 7-9.
In addition,, in order to make enclosure wall 2 reach not only thin but also high effect, as shown in Figure 10,11, the present embodiment has adopted the some box dam glue method of multiple-layer stacked, by multilayer box dam glue, in the direction vertical with substrate, is to superpose.Conventional box dam method realizes at most the ratio of width to height of 1.5:1, and the width of 1.5mm could be realized the height of 1mm, can realize the ratio of width to height of 1:3 by multilayer box dam method.Due to box dam glue, there is the characteristics such as low thixotroping, high viscosity, after multiple-layer stacked point glue, still keep goodish profile effect, can as common glue, not gutter down, therefore can realize the some box dam glue method of multiple-layer stacked.
Back-shaped enclosure wall 2 structures of the present embodiment can effectively be improved the inconsistent problem of the distance in X, Y-direction of LED chip 3 and enclosure wall 2; The point box dam glue method of the multiple-layer stacked of the present embodiment can improve the height of enclosure wall 2 in the situation that keeping width simultaneously, can effectively save the area of COB substrate 1, and the use amount that can save box dam glue, has saved cost simultaneously.
embodiment 3
On the basis of embodiment 1 or embodiment 2, more multi-functional in order more reasonably to utilize on COB substrate 1 between pixel remaining space and LED encapsulating structure to be realized, as shown in figure 12, the naked crystalline substance of some IC is inserted in the gap design of the present embodiment between pixel, as drive IC 5, or other Small electronic components, the naked crystalline substance of IC is connected with LED chip 3 or substrate by gold thread, to realize circuit, connect, realize the objects such as IC control and driving.
The naked crystalline substance of IC or other Small electronic components are inserted in the gap design of the present embodiment between pixel, have largely improved the service efficiency of COB substrate, make LED encapsulating structure compacter.
The corresponding same or analogous parts of same or analogous label;
In accompanying drawing, describe the term of position relationship only for exemplary illustration, can not be interpreted as the restriction to this patent;
Obviously, the above embodiment of the present invention is only for example of the present invention is clearly described, and is not the restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without also giving all execution modes.All any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in the protection range of the claims in the present invention.
Claims (10)
1. a LED encapsulating structure, comprise COB substrate and be fixed on the LED chip on COB substrate, it is characterized in that, on COB substrate, be fixed with uniformly N LED chip, N is greater than 1 integer, LED chip is provided with the enclosure wall that box dam glue forms around, and the light that enclosure wall sends LED chip side blocks.
2. LED encapsulating structure according to claim 1, is characterized in that, the color of described box dam glue is black.
3. LED encapsulating structure according to claim 1, is characterized in that, described enclosure wall is superposeed and forms in the direction vertical with substrate by multilayer box dam glue.
4. LED encapsulating structure according to claim 1, is characterized in that, the manufacture method of described enclosure wall adopts the back-shaped method of enclosing.
5. LED encapsulating structure according to claim 1, is characterized in that, described LED chip is RGB three-color LED chip.
6. LED encapsulating structure according to claim 1, is characterized in that, described COB substrate is BT substrate, FR-4 substrate, ceramic substrate or metal substrate.
7. LED encapsulating structure according to claim 1, is characterized in that, described LED chip adopts formal dress technique or reverse installation process to be fixed on COB substrate.
8. LED encapsulating structure according to claim 1, is characterized in that, is also fixed with and drives chip or electronic device on described COB substrate.
9. a manufacture method for LED encapsulating structure, is characterized in that, comprises the following steps:
S1: make COB substrate;
S2: LED chip is fixed on COB substrate, and carries out bonding wire;
S3: use box dam glue, make enclosure wall around at LED chip, the light that enclosure wall sends LED chip side blocks;
S4: carry out sealing to completing the COB substrate of S2 and S3 operation;
S5: cut peripheral redundance, obtain the LED encapsulating structure of complete COB encapsulation.
10. LED encapsulating structure according to claim 8, is characterized in that, in step S4, the method for described COB substrate being carried out to sealing is mold pressing encapsulation or some rubber seal dress.
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| CN201410420961.8A CN104167412A (en) | 2014-08-25 | 2014-08-25 | LED packaging structure and manufacturing method thereof |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106597751A (en) * | 2017-01-20 | 2017-04-26 | 马跃 | Liquid crystal display with wide color gamut and color temperature adjustment method thereof |
| JP2017116890A (en) * | 2015-12-25 | 2017-06-29 | 大日本印刷株式会社 | See-through type LED display device and LED display system using the same |
| CN107146787A (en) * | 2017-04-19 | 2017-09-08 | 朱希婕 | A kind of production technology of integrated Surface Mount luminescent device |
| CN109084216A (en) * | 2017-07-19 | 2018-12-25 | 广州超维光电科技有限责任公司 | Integrally packaged type row unit based on class stage structure |
| CN109389910A (en) * | 2017-08-03 | 2019-02-26 | 英属开曼群岛商錼创科技股份有限公司 | Micro-led display panel |
| CN109741685A (en) * | 2019-02-18 | 2019-05-10 | 深圳市洲明科技股份有限公司 | A kind of LED display module and preparation method thereof |
| CN110969959A (en) * | 2018-09-28 | 2020-04-07 | 深圳光峰科技股份有限公司 | LED display screen |
| CN111416030A (en) * | 2020-04-01 | 2020-07-14 | 苏州晶台光电有限公司 | Processing method for whitening of splicing seams between COB modules |
| CN112331757A (en) * | 2020-11-02 | 2021-02-05 | 东莞市中麒光电技术有限公司 | Substrate suitable for mounting small-size element, display module and display screen |
| CN112349214A (en) * | 2020-10-27 | 2021-02-09 | 合肥鑫晟光电科技有限公司 | Micro LED panel, manufacturing method thereof and display device |
| CN112447897A (en) * | 2019-09-03 | 2021-03-05 | 李家铭 | RGB light-emitting diode module with shading film |
| CN113811076A (en) * | 2021-08-03 | 2021-12-17 | 江苏运鸿辉电子科技有限公司 | Display drive packaging and protecting system based on flexible printed circuit board |
| WO2024093239A1 (en) * | 2022-11-01 | 2024-05-10 | 华为技术有限公司 | Display screen and preparation method therefor, and electronic device |
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| CN103531108A (en) * | 2013-10-30 | 2014-01-22 | 广东威创视讯科技股份有限公司 | Light-emitting diode (LED) display screen and packaging method thereof |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017116890A (en) * | 2015-12-25 | 2017-06-29 | 大日本印刷株式会社 | See-through type LED display device and LED display system using the same |
| CN106597751A (en) * | 2017-01-20 | 2017-04-26 | 马跃 | Liquid crystal display with wide color gamut and color temperature adjustment method thereof |
| CN107146787B (en) * | 2017-04-19 | 2019-08-09 | 深圳市梓光智能科技有限公司 | A kind of production technology of integrated Surface Mount luminescent device |
| CN107146787A (en) * | 2017-04-19 | 2017-09-08 | 朱希婕 | A kind of production technology of integrated Surface Mount luminescent device |
| CN109084216A (en) * | 2017-07-19 | 2018-12-25 | 广州超维光电科技有限责任公司 | Integrally packaged type row unit based on class stage structure |
| CN109084216B (en) * | 2017-07-19 | 2021-12-21 | 广州超维光电科技有限责任公司 | Integrally-packaged type row unit based on stage-like structure |
| CN109389910B (en) * | 2017-08-03 | 2021-06-08 | 英属开曼群岛商錼创科技股份有限公司 | Micro light-emitting diode display panel |
| CN109389910A (en) * | 2017-08-03 | 2019-02-26 | 英属开曼群岛商錼创科技股份有限公司 | Micro-led display panel |
| CN110969959A (en) * | 2018-09-28 | 2020-04-07 | 深圳光峰科技股份有限公司 | LED display screen |
| CN109741685A (en) * | 2019-02-18 | 2019-05-10 | 深圳市洲明科技股份有限公司 | A kind of LED display module and preparation method thereof |
| CN109741685B (en) * | 2019-02-18 | 2021-11-02 | 深圳市洲明科技股份有限公司 | LED display module and manufacturing method thereof |
| CN112447897A (en) * | 2019-09-03 | 2021-03-05 | 李家铭 | RGB light-emitting diode module with shading film |
| CN111416030A (en) * | 2020-04-01 | 2020-07-14 | 苏州晶台光电有限公司 | Processing method for whitening of splicing seams between COB modules |
| CN112349214A (en) * | 2020-10-27 | 2021-02-09 | 合肥鑫晟光电科技有限公司 | Micro LED panel, manufacturing method thereof and display device |
| CN112331757A (en) * | 2020-11-02 | 2021-02-05 | 东莞市中麒光电技术有限公司 | Substrate suitable for mounting small-size element, display module and display screen |
| CN113811076A (en) * | 2021-08-03 | 2021-12-17 | 江苏运鸿辉电子科技有限公司 | Display drive packaging and protecting system based on flexible printed circuit board |
| WO2024093239A1 (en) * | 2022-11-01 | 2024-05-10 | 华为技术有限公司 | Display screen and preparation method therefor, and electronic device |
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