TWI593133B - Method for manufacturing package, method for manufacturing light emitting device, package and light emitting device - Google Patents

Description

Manufacturing method of package, manufacturing method of light emitting device, package and light emitting device

The present invention relates to a method of manufacturing a package, a method of manufacturing the same, and a package and a light-emitting device.

Conventionally, a package having a lead frame is produced by injecting a thermoplastic resin from the back side (see, for example, Patent Documents 1 and 2). Further, after the resin is cured, the lead frame is bent to form a light-emitting device.

In addition, it is known that a resin is poured into a chamber of each lead frame of a molding die and hardened, and a resin molded body and each lead frame are integrally molded to form a package (see, for example, Patent Document 3). Further, in the manufacturing method of the package described in Patent Document 3, the lead frame is previously bent before being placed in the molding die.

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2010-186896

Patent Document 2: Japanese Patent Laid-Open Publication No. 2013-051296

Patent Document 3: Japanese Patent Laid-Open Publication No. 2013-077813

In the light-emitting devices described in Patent Documents 1 and 2, since the resin is injected from the back side of the lead frame, the thickness of the package is increased. Moreover, the thickness of the light-emitting device using such a package is also increased. Further, in the conventional light-emitting device, it takes a lot of effort to perform processing such as bending the lead frame of the package.

Accordingly, embodiments of the present invention provide a manufacturing method in which a package and a light-emitting device are thinned and which are simply manufactured, and a thin package and light-emitting device.

A method of manufacturing a package according to an embodiment of the present invention has a step of preparing a lead frame having a first electrode and a second electrode different from the first electrode in a predetermined formation region of the package; and using a molding die that is divided vertically The upper mold and the lower mold sandwich the first electrode and the second electrode; and in a molding die in which the first electrode and the second electrode are sandwiched, a predetermined formation region of the package from the molding die The first resin is injected into the injection port formed beside the first electrode; the first resin to be injected is cured or cured; and after the first resin is cured or cured, the first resin is placed beside the first electrode The injection of the injection port is removed.

Further, a method of manufacturing a light-emitting device according to an embodiment of the present invention includes all of the steps in the method of manufacturing the package, and a step before or after the step of cutting the injection mark after curing or curing the first resin. The step of attaching the light-emitting element to the first electrode or the second electrode.

A package according to an embodiment of the present invention includes: a first electrode; a second electrode having a polarity different from that of the first electrode; and a wall portion that fixes the first electrode and the second electrode and constitutes a sidewall of the bottomed recess, the bottomed portion At least a part of the bottom surface of the concave portion is composed of the first electrode and the second electrode; and a flange portion protruding outward from the wall portion in plan view; at least one of the first electrode and the second electrode has a plan view The lead portion is protruded outward from the wall portion, and the outer lead portion has a second recess at the distal end, and the flange portion is provided on the both sides of the outer lead portion in the same thickness as the outer lead portion in plan view. The flange portion is not provided in the second recess.

A light-emitting device according to an embodiment of the present invention includes the package and a light-emitting element that is placed on at least one of the first electrode and the second electrode of the package.

In the method of manufacturing a package and a light-emitting device according to an embodiment of the present invention, the resin injection port is provided at a position where the resin is not used after curing or curing, so that it can be easily removed by injecting and hardening or curing the resin. Manufacturing thin package and illuminating devices.

Further, the package and the light-emitting device of the embodiment of the present invention can be made thinner than before.

1C‧‧‧Lighting device

5‧‧‧ lead frame

6a‧‧‧1st space

6b‧‧‧2nd space

6c‧‧‧3rd space

6d‧‧‧4th space

7‧‧‧Lead Support

8, 9‧‧‧ hanging leads

10‧‧‧1st electrode

10B‧‧‧1st electrode

11‧‧‧1st outer lead

12‧‧‧1st inner lead

20‧‧‧2nd electrode

20B‧‧‧2nd electrode

21‧‧‧2nd outer lead

22‧‧‧2nd inner lead

30‧‧‧Resin molded body

30B‧‧‧Resin molded body

30C‧‧‧Resin molded body

31‧‧‧ wall

32‧‧‧Flange

33‧‧‧1st recess

41‧‧‧ upper surface

42‧‧‧ lower surface

43‧‧‧ side

50‧‧‧2nd recess

51‧‧‧ side

100‧‧‧Package

100B‧‧‧ package

100C‧‧‧ package

101‧‧‧1st outer side

102‧‧‧2nd outer side

103‧‧‧3rd outer side

104‧‧‧4th outer side

105‧‧‧ bottom

110‧‧‧ with bottom recess

110a‧‧‧ bottom

120‧‧‧cutting section

121‧‧‧Endpoint

122‧‧‧ intersection

155‧‧‧Spot marks (injection marks)

200‧‧‧Lighting elements

250‧‧‧Wire

300‧‧‧ Sealing members

500‧‧‧Molding mould

501‧‧‧ recess

501B‧‧‧ recess

550‧‧‧上模

550B‧‧‧上模

555‧‧‧gate

555B‧‧‧gate

560‧‧‧Down

600‧‧‧Predetermined formation area

600B‧‧‧Predetermined formation area

601‧‧‧1st edge

602‧‧‧2nd edge

603‧‧‧3rd edge

604‧‧‧4th edge

705‧‧‧ lead frame

706a‧‧‧1st space

706b‧‧‧Second space

706c‧‧‧3rd space

706d‧‧‧4th space

707‧‧‧ lead support

708, 709‧‧‧ hanging leads

711, 712‧‧‧ hanging leads

713, 714‧‧‧through holes

H‧‧‧ Height

T‧‧‧ thickness

Fig. 1 is a schematic view showing a package of an embodiment, showing a perspective view of the entire package.

Fig. 2 is a schematic view showing the outline of the package of the embodiment, and is a plan view of the package.

Fig. 3 is a schematic view showing a package of the embodiment, and is a cross-sectional view taken along line III-III of Fig. 2;

Fig. 4 is a schematic view showing the outline of the package of the embodiment, and is a bottom view of the package.

Fig. 5 is a view showing the outline of a manufacturing process of the package of the embodiment, and is a plan view of the lead frame.

Fig. 6 is a schematic view showing a manufacturing step of the package of the embodiment, and is a cross-sectional view taken along line VI-VI of Fig. 5.

Fig. 7 is a schematic view showing the manufacturing steps of the package of the embodiment, and is a cross-sectional view schematically showing the arrangement of the lead frame and the molding die at a position corresponding to the X-X line of Fig. 9;

Fig. 8 is a schematic view showing the manufacturing steps of the package of the embodiment, and is a cross-sectional view schematically showing the arrangement of the lead frame and the molding die at a position corresponding to the line XI-XI of Fig. 9;

Fig. 9 is a schematic view showing the manufacturing steps of the package of the embodiment, and is a plan view of the lead frame held by the upper mold and the lower mold.

Fig. 10 is a schematic view showing a manufacturing step of the package of the embodiment, and is a cross-sectional view taken along the line X-X of Fig. 9 after the first resin is injected.

Fig. 11 is a schematic view showing a manufacturing step of the package of the embodiment, and is a cross-sectional view taken along line XI-XI of Fig. 9 after the first resin injection.

Fig. 12 is a schematic view showing the manufacturing steps of the package of the embodiment, and is a schematic plan view of the package.

Fig. 13 is a schematic view showing a manufacturing step of the package of the embodiment, and is a cross-sectional view taken along line XIII-XIII of Fig. 12.

Fig. 14 is a schematic view showing a light-emitting device of the embodiment, showing a perspective view of the entire light-emitting device.

Fig. 15 is a schematic view showing a package of another embodiment, showing a perspective view of the entire package.

Fig. 16 is a view showing the outline of a manufacturing process of the package of another embodiment, and is a plan view of the lead frame.

Fig. 17 is a schematic view showing a manufacturing step of a package according to another embodiment, and is a plan view of a lead frame sandwiched between an upper mold and a lower mold.

Fig. 18 is a schematic view showing a manufacturing step of a package according to another embodiment, and is a cross-sectional view taken along line XVIII-XVIII of Fig. 17 after the first resin injection.

Fig. 19 is a schematic view showing a manufacturing step of a package according to another embodiment, and is a cross-sectional view taken along line XIX-XIX of Fig. 17 after the first resin injection.

Fig. 20 is a schematic view showing a light-emitting device of another embodiment, showing a perspective view of the entire light-emitting device.

Hereinafter, a method of manufacturing a package and a light-emitting device according to an embodiment of the embodiment will be described. The manufacturing method, package, and light-emitting device will be described. In the following description, the present embodiment is schematically illustrated. Therefore, the scale, the interval, the positional relationship, and the like of each member may be exaggerated or one of the members may be omitted. In the following description, the same names and symbols are denoted by the same or equivalent components, and the detailed description thereof will be appropriately omitted.

<Composition of Package 100>

Use the schema to illustrate. Fig. 1 is a schematic view showing a package of an embodiment, showing a perspective view of the entire package. Fig. 2 is a schematic view showing the outline of the package of the embodiment, and is a plan view of the package. Fig. 3 is a schematic view showing a package of the embodiment, and is a cross-sectional view taken along line III-III of Fig. 2; Fig. 4 is a schematic view showing the outline of the package of the embodiment, and is a bottom view of the package.

The overall shape of the package 100 is substantially a rectangular parallelepiped, and is formed in a cup shape having a concave portion (cavity) on the upper surface. Moreover, the package 100 includes the first electrode 10, the second electrode 20, and the resin molded body 30 made of the first resin.

The first electrode 10 includes a first outer lead portion 11 and a first inner lead portion 12 . The first outer lead portion 11 is a lead portion located outside the wall portion 31 of the resin molded body 30. The shape of the first outer lead portion 11 is a rectangular shape in plan view, but the shape is not limited thereto, and a partial slit or a concave portion or a through hole may be provided.

The first inner lead portion 12 is a lead portion located inside the wall portion 31 of the resin molded body 30 and below the wall portion 31. The shape of the first inner lead portion 12 is substantially rectangular when viewed from above, but the shape is not limited thereto, and a partial slit or a recess or a through hole may be provided. When viewed from the back surface of the package 100, the width W1 of the first outer lead portion 11 exposed from the first resin is formed to be shorter than the width W2 of the first inner lead portion 12 from which the first resin is exposed.

The second electrode 20 includes a second outer lead portion 21 and a second inner lead portion 22 . The second outer lead portion 21 is a lead portion located outside the wall portion 31 of the resin molded body 30. The shape of the second outer lead portion 21 is rectangular when viewed from above, but the shape is not limited thereto, and a partial slit or concave may be provided. Part, through hole.

The second inner lead portion 22 is a lead portion located inside the wall portion 31 of the resin molded body 30 and below the wall portion 31. The shape of the second inner lead portion 22 is substantially rectangular when viewed from above, but the shape is not limited thereto, and a partial slit or a recess or a through hole may be provided. When viewed from the back surface of the package 100, the width W1 of the second outer lead portion 21 exposed from the first resin is formed to be shorter than the width W2 of the second inner lead portion 22 from which the first resin is exposed.

The first electrode 10 and the second electrode 20 are formed to be exposed to the outside of the bottom surface of the package 100. The outer side of the bottom surface of the package 100 is the surface on the side of the substrate mounted on the outside. The first electrode 10 and the second electrode 20 are disposed apart from each other, and the resin molded body 30 is interposed between the first electrode 10 and the second electrode 20 . When used as a light-emitting device, the first electrode 10 and the second electrode 20 correspond to an anode electrode and a cathode electrode, respectively, and have different electrical conductivity.

The length, width, and thickness of the first electrode 10 and the second electrode 20 are not particularly limited, and can be appropriately selected depending on the purpose and use. The material of the first electrode 10 and the second electrode 20 is preferably copper or a copper alloy, and it is preferable that the outermost surface thereof is covered with a metal material having a high reflectance such as silver or aluminum.

The resin molded body 30 includes a wall portion 31 and a flange portion 32. The wall portion 31 is formed on the first electrode 10 and the second electrode 20 on the four sides of the rectangular shape. Further, the wall portion 31 is formed by sandwiching the first electrode 10 on both sides of the rectangular shape, and is formed by sandwiching the second electrode 20. Thereby, the wall portion 31 can fix the first electrode 10 and the second electrode 20.

The wall portion 31 is formed to have a rectangular recess in a plan view, and is formed in a rectangular ring shape in plan view. The height, length, and width of the wall portion 31 are not particularly limited, and can be appropriately selected depending on the purpose and use.

The flange portion 32 is formed adjacent to the first outer lead portion 11 or the second outer lead portion 21, and four flange portions 32 are formed in plan view. Each of the flange portions 32 protrudes laterally from the wall portion 31, and is formed to have the same length and the same thickness as the first outer lead portion 11 and the second outer lead portion 21. The first outer lead portion 11 and the second outer lead portion 21 and the flange portion 32 are formed to be flush with each other. Although it is described below, in the present embodiment, the injection port of the first resin is placed beside the first electrode 10 at a position where the first resin is cured or solidified, so that the first resin is injected. After it is hardened or cured, it is cut off, and one flange portion 32 remains on the side of the first electrode 10. The resin molded body 30 is provided with four flange portions 32, but the number thereof may be one or more. When the flange portion is not provided, the outer side surface of the wall portion 31 is formed flat from the upper surface to the bottom surface.

The material of the resin molded body 30 may, for example, be a thermoplastic resin or a thermosetting resin.

In the case of a thermoplastic resin, for example, a polyphthalamide resin, a liquid crystal polymer, polybutylene terephthalate (PBT), an unsaturated polyester, or the like can be used.

In the case of a thermosetting resin, for example, an epoxy resin, a modified epoxy resin, an anthracene resin, a modified oxime resin, or the like can be used.

In order to efficiently reflect light on the inner peripheral surface of the wall portion 31 of the resin molded body 30, the resin molded body 30 may include a light reflecting member. The light reflecting member is, for example, a material having high light reflectance such as titanium oxide, a glass filler, a white filler such as cerium oxide, aluminum oxide or zinc oxide. The reflectance is preferably such that the reflectance of visible light is 70% or more or 80% or more. In particular, in the wavelength region where the light-emitting element is emitted, the reflectance is preferably 70% or more or 80% or more. The amount of the titanium oxide or the like may be 5% by weight or more and 50% by weight or less, preferably 10% by weight to 30% by weight, but is not limited thereto.

As described above, in the package 100, the resin injection port is provided at a position where the resin is used after curing or curing, so that the thickness of the package can be reduced. In particular, the thickness of the back side of the package, that is, the thickness of the flange portion 32 of the resin molded body 30, the first electrode 10, the second electrode 20, and the like can be made thinner than before. Therefore, heat dissipation during operation of the light-emitting element mounted on the package 100 or the like can be improved.

<Manufacturing Method of Package 100>

Next, a method of manufacturing the package 100 will be described with reference to FIGS. 5 to 13 . Figure 5 is a lead Plan view of the line frame. Figure 6 is a cross-sectional view taken along line VI-VI of Figure 5. Fig. 7 is a cross-sectional view schematically showing the arrangement of a lead frame and a molding die at a position corresponding to the X-X line of Fig. 9. Fig. 8 is a cross-sectional view schematically showing the arrangement of a lead frame and a molding die at a position corresponding to the line XI-XI of Fig. 9. Figure 9 is a plan view of a lead frame held by an upper die and a lower die. Fig. 10 is a cross-sectional view taken along line X-X of Fig. 9 after the first resin is injected. Fig. 11 is a cross-sectional view taken along line XI-XI of Fig. 9 after the first resin injection. Figure 12 is a schematic plan view of the package. Figure 13 is a cross-sectional view taken along the line XIII-XIII of Figure 12.

The manufacturing method of the package of this embodiment has the following steps (1) to (5).

(1) Prepare the lead frame.

In the step (1), a flat lead frame 5 having a part of the slit is prepared. The lead frame 5 has a first electrode 10 and a second electrode 20 different from the first electrode 10 in a predetermined formation region 600 of the package, and a gap is provided between the first electrode 10 and the second electrode 20. Preferably, the gap has a width which is the same as or wider than the thickness of the lead frame 5. The first electrode 10 and the second electrode 20 have a substantially quadrangular portion, and have a portion narrower than the width of the first electrode 10 and the width of the second electrode 20, and are further connected to the outside of the predetermined formation region 600 of the package. The slit of the lead frame 5 can be formed by punching, etching, or the like. Here, the predetermined formation region 600 of the package is a region which is separated from the lead frame 5 and which is the outer periphery of the bottom surface of the package 100 after molding. Further, the first electrode 10 in the lead frame 5 is a portion corresponding to the first electrode 10 after molding, and is in a state before singulation. Similarly, the second electrode 20 in the lead frame 5 is a portion corresponding to the second electrode 20 after molding, and is in a state before singulation. Further, for the sake of simplicity, the lead frame 5 is described as a configuration including a predetermined formation region 600 of one package, but the number thereof may be plural.

The lead frame 5 is a plate-shaped member, and has a gap portion having a specific shape around the first electrode 10 and the second electrode 20, and is separated from a portion where the first electrode 10 and the second electrode 20 face each other. The lead frame 5 includes a frame-shaped lead support portion 7 and hanging leads 8 and 9 that surround the periphery of the first electrode 10 and the second electrode 20.

The first electrode 10 is connected to the lead support portion 7 by a hanging lead 8 corresponding to the molded first outer lead portion 11. In the lead frame 5, as the gap portion, the first space 6a and the second space 6b are formed on both sides of the hanging lead 8. The first space 6a and the second space 6b are formed on both sides of the first electrode 10. Further, as described below, in the present embodiment, the first resin is injected from the first space 6a.

The second electrode 20 is connected to the lead support portion 7 by a hanging lead 9 corresponding to the second outer lead portion 21 after molding. In the lead frame 5, as the gap portion, the third space 6c and the fourth space 6d are formed on both sides of the hanging lead 9. The third space 6c and the fourth space 6d are formed on both sides of the second electrode 20.

(2) The lead frame is sandwiched by the upper mold and the lower mold.

In this step, the first electrode 10 of the lead frame 5 and the second electrode 20 are sandwiched by the upper mold 550 and the lower mold 560 of the molding die 500 which is divided up and down. Further, for convenience of explanation, the lower surface of the lead frame 5 is separated from the lower mold 560, but the lead frame 5 is fixed to the lower mold 560.

The upper mold 550 of the mold 500 has a concave portion 501 corresponding to the wall portion 31 of the resin molded body 30 formed on the first electrode 10 and the second electrode 20. Further, the first resin is injected into the concave portion 501 provided in the upper mold 550. The recess 501 of the upper mold 550 is annularly connected. At a position different from the concave portion 501, a through hole that serves as a gate 555 is formed in the upper mold 550 on the outer side of the concave portion 501 in plan view. The first resin is firmly sandwiched so as not to enter the gap between the lead frame 5 and the upper mold 550 and the lower mold 560. When the first resin enters the gap between the lead frame 5 and the upper mold 550 and the lower mold 560, and the first resin adheres to the surface of the lead frame 5 in the mounting region of the light-emitting element, the step of deburring is required.

(3) The first resin is injected into the mold.

The upper mold 550 of the molding die 500 is provided with a gate (injection port) 555 on the outer side of the predetermined formation region 600 of the package. A portion of the gate 555 corresponding to the gate 555 of the upper mold 550 is provided with a slit portion of the lead frame 5. The gate 555 is formed on one of the outer side of the first electrode 10 as the lead support portion 7 side. Here, a light reflecting member is previously mixed in the first resin injected from the gate 555.

In this step, the lead frame 5 is sandwiched between the upper mold 550 and the lower mold 560, and the gate 555 is injected from the first electrode 10 (the first outer lead portion 11) in a plan view. 1 resin.

The first resin injected from the gate 555 is injected into the concave portion 501 of the upper mold 550 through the slit of the lead frame 5. Here, the gate 555 is described in one case, but a plurality of gates can be provided in the upper mold 550. Further, although the gate 555 is provided in the upper mold 550, the gate can be provided in the lower mold 560, and the first resin can be injected from the lower mold 560 side.

The injection step of the first resin can be carried out by a known molding method such as injection molding, transfer molding, or extrusion molding.

(4) The injected first resin is cured or cured.

In the present embodiment, as an example, the first resin is, for example, a thermosetting resin such as an epoxy resin. In this case, the step of injecting the first resin is a transfer molding. In the transfer molding, a thermosetting resin (small piece) having a particle size of a specific size is previously placed in a specific container connected to the upper mold 550. In the case of transfer molding, the steps of the above (2), the steps (3), and (4) will be briefly described below.

In the case of transfer molding, in the step (2) above, the lead frame 5 is fixed to the heated lower mold 560, and is sandwiched by the upper mold 550 and the lower mold 560 by the same heating. In the step (3) above, in a specific container connected to the upper mold 550, for example, a pressure is applied by the piston, thereby injecting a molten thermosetting resin from the specific container through the gate 555 to the concave portion 501 of the upper mold 550. (first resin). In the step (4), the filled thermosetting resin (first resin) is heated. Further, the thermosetting resin which is cured (temporarily hardened) by heating becomes the resin molded body 30.

In the case where the first resin is, for example, a thermoplastic resin such as a polyphthalamide resin, it can be molded by injection molding. In this case, the thermoplastic resin may be melted at a high temperature, placed in a mold having a low temperature, and solidified by cooling.

The first resin thus injected is cured or solidified to form a wall portion 31 corresponding to the concave portion 501 of the upper mold 550 of the molding die 500 divided vertically.

(5) The injection mark of the injection port of the first resin is cut off.

After the first resin is cured or cured, the injection mark of the injection port of the first resin is cut off. Moreover, the first resin and the lead frame 5 are cut, and the package 100 is singulated. Here, for example, a lead cutter can be used for the jig in which the hanging leads 8 and 9 are cut. The left and right short sides of the rectangular shape of the predetermined formation region 600 of the package correspond to the hanging leads 8 and 9 of the lead frame 5 and the resin molded body 30. The lead frame 5 at the cut position is provided with a slit or a through hole such as a circular shape, an elliptical shape, a polygonal shape, or a substantially polygonal shape, and the area of the lead frame 5 to be cut can be reduced.

In the present embodiment, when the package 100 is singulated from the lead frame 5, the hanging leads 8, 9 are cut in accordance with the short sides of the predetermined formation region 600 of the package. After the first resin is injected, cured, or cured, the resin molded body 30 is partially filled in the concave portion 501 of the upper mold 550, and the end portion of the resin molded body 30 is also cut at the same time.

By cutting the hanging leads 8 and 9 as described above, it is possible to cut the gate mark (injection mark) 155 of the first resin from the side of the first electrode 10. Thereby, no gate marks remain on the surface of the package 100. The timing of performing the cutting may be performed before or after the mounting of the light-emitting element. The package 100 can be manufactured by the above steps (1) to (5).

Further, in the prior art, a resin is injected from the back side of the package. However, according to the method of manufacturing the package of the present embodiment, resin is injected from the outside of the predetermined formation region 600 of the package and the first electrode 10 is injected, and the gate mark is cut off. Therefore, the thickness of the package can be reduced.

Moreover, according to the manufacturing method of the package of the present embodiment, the step of bending the lead wire in the prior package manufacturing method is not required, so that the bending processing can be saved.

In the prior manufacturing method, for example, in a case where a predetermined number of predetermined formation regions of the package are provided in a two-dimensional array in a lead frame of a prepared plate, the interval is set to consider bending the lead. Specific length. In contrast, the seal according to the embodiment The manufacturing method does not require bending the lead, so it is not necessary to ensure that the length of the bent lead is considered. In other words, regardless of the bending, the package interval can be blocked accordingly. Therefore, the number of packages taken out from the same plate-shaped lead frame can be increased as compared with the prior art, and the frame (material) can be effectively utilized.

<Configuration of Light Emitting Device 1>

Next, the configuration of the light-emitting device 1 will be described with reference to Fig. 14 . Fig. 14 is a schematic view showing a light-emitting device of the embodiment, showing a perspective view of the entire light-emitting device.

The light-emitting device 1 includes a package 100, a light-emitting element 200, an electric wire 250, and a sealing member 300 made of a second resin. The light emitting element 200 is mounted on the second electrode 20 of the package 100. The light-emitting element 200 used herein is not particularly limited in shape, size, and the like. As the luminescent color of the light-emitting element 200, a member of any wavelength can be selected depending on the application. For example, as the light-emitting element of blue (light having a wavelength of 430 to 490 nm), a GaN-based or InGaN-based device can be used. As the InGaN system, In _X Al _Y Ga _1-XY N (0≦X≦1, 0≦Y≦1, X+Y≦1) or the like can be used.

The electric wire 250 is a conductive wiring for electrically connecting the electronic component such as the light-emitting element 200 or the protective element to the first electrode 10 or the second electrode 20 . Examples of the material of the electric wire 250 include metals such as Au (gold), Ag (silver), Cu (copper), Pt (platinum), and Al (aluminum), and the like, but in particular, excellent thermal conductivity is used. Au is good. In addition, the thickness of the electric wire 250 is not particularly limited, and can be appropriately selected depending on the purpose and use.

The sealing member 300 is a cover member of the light-emitting element 200 or the like to be mounted in the package 100. The sealing member 300 is provided to protect the light-emitting element 200 from external influences, dust, moisture, and the like, and to provide heat resistance, weather resistance, and light resistance of the light-emitting element 200 and the like. Examples of the material of the sealing member 300 include a thermosetting resin, and a transparent material such as an anthracene resin, an epoxy resin, or a urea resin. In addition to such a material, a filler such as a phosphor or a substance having a high light reflectance can be contained in order to have a specific function.

The sealing member 300 can easily perform the light-emitting device 1 by, for example, mixing a phosphor Tonal adjustment. Further, as the phosphor, a member having a larger specific gravity than the sealing member 300 and absorbing light from the light-emitting element 200 and performing wavelength conversion can be used. When the phosphor has a larger specific gravity than the sealing member 300, it is preferably deposited on the first electrode 10 and the second electrode 20 side.

Specifically, for example, a yellow phosphor such as YAG (Y ₃ Al ₅ O ₁₂ :Ce) or citrate or red fluorescent light such as CASN (CAAlSiN ₃ :Eu) or KSF (K ₂ SiF ₆ :Mn) can be cited. body.

As the filler contained in the sealing member 300, for example, a material having high light reflectance such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , ZrO ₂ or MgO can be preferably used. Further, for the purpose of cutting off the desired wavelength, for example, an organic or inorganic dye or a colored pigment can be used.

<Method of Manufacturing Light-Emitting Device 1>

(first manufacturing method)

In the first manufacturing method of the light-emitting device 1, in all the steps for manufacturing the package 100, after the steps (1) to (4) described above, the light-emitting element 200 is mounted on the package before the step (5). 100. That is, the light-emitting element 200 is mounted on the second electrode 20 of the package 100 that is not separated from the lead frame 5.

The light-emitting element 200 is an element having a single-sided electrode structure in which a pair of n-electrodes and p-electrodes are formed on the upper surface. In this case, the light-emitting element 200 is bonded to the second electrode 20 by an insulating bonding member, and one electrode of the upper surface is connected to the first electrode 20 by the electric wire 250, and the other electrode of the upper surface is connected by the electric wire 250. It is connected to the second electrode 20.

Then, the sealing member 300 is applied to the recess surrounded by the wall portion 31 of the resin molded body 30 of the package 100 and the light emitting element 200 is sealed. At this time, the sealing member 300 is dropped onto the upper surface of the concave portion of the resin molded body 30. The method of filling the sealing member 300 into the concave portion of the resin molded body 30 can also use, for example, injection, compression, extrusion, or the like. Since the air remaining in the concave portion of the resin molded body 30 can be efficiently discharged by dropping, it is preferable to perform filling by dropping.

(Second manufacturing method of light-emitting device)

Further, in the first manufacturing method of the light-emitting device 1, the light-emitting element 200 is mounted in the package 100 in advance and then manufactured by singulation. However, in the second manufacturing method, the package 100 which is singulated in advance can be manufactured. After all the steps, the light emitting element 200 is mounted on the package 100. That is, the light-emitting element 200 is mounted in the package 100 which is singulated.

[Variation 1]

In the lead frame 5 shown in FIG. 5, the first space 6a and the second space 6b are formed on both sides of the hanging lead 8, but it is also possible to have one space for injecting the first resin. Only one of the first space 6a and the second space 6b is provided.

In the upper mold 550 of the molding die 500 shown in FIG. 9, one gate 555 is formed. However, two gates may be formed at two positions of the first electrode 10, and the first resin may be injected from the two gates.

Further, not only a gate beside the first electrode 10 but also a gate may be provided at a position corresponding to one or both sides of the second electrode 20 to inject the first resin.

[Variation 2]

The shape of the lead frame 5 shown in FIG. 5 is an example. For example, the first electrode 10 and the second electrode 20 may be equal in size or may be formed in mutually different shapes.

A through hole may be provided in the center of the short side of the left and right of the predetermined formation region 600 of the package shown by the imaginary line of the rectangle in FIG. In the case of such a configuration, when the hanging leads 8 and 9 are cut, the portion of the through hole is cut into a toothed structure. Therefore, when the package is soldered to the external mounting substrate, for example, a fillet can be observed. Further, in the step of cutting the hanging leads 8, 9, the life of the blade such as the lead cutter can be extended.

[Variation 3]

It is also possible to temporarily prepare two packages 100 shown in FIG. 1 and to manufacture a double-sized double-chamber package having a shape in which the side faces of the flange-free portion 32 of the resin molded body 30 are connected to each other. In this case, the package after molding has two recesses (chambers) in the vertical direction in plan view. The The dual chamber package enables a high light output that closely aligns the package 100.

The dual chamber package can be formed as a package that is equivalent to closely aligning two different sizes of package 100. For example, the fluorescent body may be contained in one concave portion of the resin molded body, and the fluorescent material may not be contained in the other concave portion. Alternatively, the first phosphor may be contained in one of the recesses of the resin molded body, and the second phosphor may be contained in the other recess. When manufacturing such a dual chamber package, it is only necessary to prepare a lead frame as follows.

In other words, in the lead frame 5 shown in FIG. 5, the pattern shape of the gap portion is changed, and two sets of package elements including the first electrode 10 and the second electrode 20 are prepared in the vertical direction, and two hanging leads are provided. The first space 6a is disposed between the eight, and the third space 6c is disposed between the two hanging leads 9. At this time, the predetermined formation region 600 of the package shown by the imaginary line of the rectangle in FIG. 5 is enlarged in the up and down direction, and the region having the two sets of package elements is formed as a predetermined formation region of the double chamber package. In this case, the concave portion 501 of the upper mold 550 of the molding die 500 shown in FIGS. 7 and 8 is deformed so as to correspond to the wall portion of the resin molded body of the double chamber package.

[Variation 4]

In the double-chamber package of Modification 3, the wall portion between the two concave portions of the resin molded body can be removed to produce a single-chamber single-chamber package. In this case, the package after molding has one concave portion (cavity) of the resin molded body, and has four inner lead portions in the concave portion. Therefore, for example, three inner lead portions are used as the cathode electrode (second electrode), and each of the cathode electrodes is provided with a light-emitting element corresponding to RGB, and the remaining one of the inner lead portions is used as an anode electrode (first electrode). Further, the protective element may be attached to the inner lead portion where the light emitting element is not mounted. When manufacturing such a single chamber package, the concave portion 501 of the upper mold 550 of the molding die 500 shown in FIGS. 7 and 8 is deformed so as to correspond to the wall portion of the resin molded body of the single chamber package. .

[Other variations]

The light emitting element 200 may also be, for example, an n-electrode (or p-electrode) on the back surface of the element substrate. The component of the opposite electrode structure (two-sided electrode structure). Further, the light-emitting element 200 is not limited to the face-up type, and may be a face-down type. If a face-down type light-emitting element is used, no wires can be used.

The light-emitting element 200 can also be mounted on the first electrode 10 instead of the second electrode 20. When the light-emitting device 1 includes, for example, two light-emitting elements 200, the light-emitting elements 200 can be mounted on the first electrode 10 and the second electrode 20, respectively. The protective element may also be mounted on the inner lead portion to which the light-emitting element is not mounted.

The shape of the wall portion 31 of the resin molded body 30 of the package 100 in a plan view is not limited to the rectangular ring shape illustrated in Fig. 1. For example, the shape of the wall portion 31 may be an annular shape or an elliptical ring shape in plan view.

<Composition of Package 100B>

The package of the above variation 2 will be described using a drawing. Fig. 15 is a schematic view showing a package of another embodiment, showing a perspective view of the entire package. The same components as those of the package 100 of Fig. 1 are denoted by the same reference numerals, and their description will be appropriately omitted.

The package 100B has a bottomed recessed portion 110 that is open at the top, a first outer side surface (hereinafter referred to as "outer side surface" unless otherwise specified) 101, and a second outer side surface 102 that is adjacent to the first outer side surface 101, and 2 The outer surface 102 is adjacent to the third outer surface 103 facing the first outer surface 101, and the fourth outer surface 104 and the bottom surface 105 adjacent to the first outer surface 101 and the third outer surface 103. Here, the bottom surface 105 serves as a mounting surface of the package 100B. The package 100B includes a first electrode 10B, a second electrode 20B having a polarity different from that of the first electrode 10B, and a resin molded body 30B. The bottom surface 105 is formed of these members.

The first electrode 10B has a first outer lead portion 11 that protrudes outward from the wall portion 31 in the plan view (hereinafter, referred to as "outer side surface" unless otherwise specified). The first outer lead portion 11 protrudes from the first outer side surface 101 of the package 100B. As described above, the first outer lead portion 11 may be provided with a partial slit, a recess, and a through hole. Therefore, in the present embodiment, the first outer lead portion 11 has the second recess 50 at the tip end. The second recess 50 is configured to view the side surface of the package 100B. Thereby, when the second recess 50 is welded to the external mounting substrate, for example, the solder fillet can be formed.

In the present embodiment, the second electrode 20B has the second outer lead portion 21 that protrudes outward from the wall portion 31 in plan view. The second outer lead portion 21 protrudes from the third outer side surface 103 of the package 100B. As described above, the second outer lead portion 21 may be provided with a partial slit, a recess, and a through hole. Therefore, in the present embodiment, the second outer lead portion 21 has the second recess 50 at the tip end. Further, in the package 100B, only one of the electrodes may have the second recess 50, or only one of the electrodes may have an outer lead portion.

As described above, it is preferable that the outermost surfaces of the first electrode 10B and the second electrode 20B are covered with a metal material having a high reflectance such as silver or aluminum.

Therefore, in the present embodiment, a gap portion such as a through hole is formed in the lead frame prepared for manufacturing the package 100B, and then the lead frame is plated with, for example, silver, aluminum, copper, or gold. Therefore, the first electrode 10B and the second electrode 20B are plated.

Here, in the first electrode 10B, the first outer lead portion 11 is not plated on the front end surface except for the side surface 51 of the second recess 50. The reason why the plating is not applied is that the side surface 43 of the first outer lead portion 11 is a cut surface which occurs when the package 100B is singulated.

On the other hand, since the first outer lead portion 11 is plated with the upper surface 41 and the lower surface 42 and the side surface 51 of the second recess 50, the bonding strength with the conductive member such as solder increases.

Similarly, in the second electrode 20B, the second outer lead portion 21 is plated with the upper surface 41 and the lower surface 42 and the side surface 51 of the second recess 50, and the front end surface is not plated except for the side surface 51 of the second recess 50. .

Further, since the package 100B is plated with the first inner lead portion 12 of the first electrode 10B and the second inner lead portion 22 of the second electrode 20B, the light-emitting device is mounted on the bottomed concave portion 110 of the package 100B to constitute a light-emitting device. At the same time, the reflectance of light from the light-emitting element can be increased.

The resin molded body 30B includes a wall portion 31 and a flange portion 32. The wall portion 31 and the flange portion 32 are integrally formed of the same material. Because of this integral molding, the wall portion 31 and the convex portion can be improved. The strength of the edge 32.

The wall portion 31 fixes the first electrode 10B and the second electrode 20B and constitutes a side wall of the bottomed recessed portion 110. The bottomed recessed portion 110 has a shape that expands in the opening direction. The bottomed recess 110 has at least a portion of the bottom surface 110a formed by the first inner lead portion 12 of the first electrode 10B and the second inner lead portion 22 of the second electrode 20B.

The flange portion 32 protrudes outward from the wall portion 31 in plan view. The flange portion 32 protrudes from the first outer side surface 101 of the package 100B. As described above, the flange portion 32 is provided on both sides of the first outer lead portion 11 at the same thickness T as the first outer lead portion 11 in plan view. The flange portion 32 is not provided in the second recess portion 50 of the first outer lead portion 11.

In the present embodiment, the other flange portion 32 protrudes from the third outer side surface 103 of the package 100B, and is provided on the both sides of the second outer lead portion 21 in the same thickness as the second outer lead portion 21 in plan view. The flange portion 32 is not provided in the second recess portion 50 of the second outer lead portion 21. Further, a flange portion may be provided on both sides of the lead portion except for either one of them.

In the package 100B, the first electrode 10B is protruded on the first outer surface 101, and the second electrode 20B is protruded on the third outer surface 103. However, the first electrode 10B is not formed on the second outer surface 102 and the fourth outer surface 104. The second electrode 20B is exposed. That is, all of the second outer side surface 102 and the fourth outer side surface 104 are formed of the same material as the wall portion 31. Therefore, when the package 100B is soldered to the external mounting substrate, for example, leakage of the solder to the second outer surface 102 and the fourth outer surface 104 can be reduced.

In the package 100B, one of the second outer side surface 102 and the fourth outer side surface 104 is partially recessed. The first recessed portion 33 is formed at a lower end portion of the second outer side surface 102 and communicates with the bottom surface 105. Further, the other first recessed portion 33 is formed at the lower end portion of the fourth outer side surface 104, and communicates with the bottom surface 105. The first recesses 33 are traces of two suspension leads formed in advance on the lead frame for manufacturing the package 100B. When the lead frame 705 shown in FIG. 16 is used for the manufacture of the package 100B, the planar shape of the first recessed portion 33 is trapezoidal in the same manner as the shape of the suspension leads 711 and 712 shown in FIG. The height of the trapezoid is opposite to the length of the first recess 33 in the depth direction Wait.

Further, the thickness of the first recessed portion 33 is the same as that of the first and second outer lead portions 11 and 21. In other words, the length (height H) of the first concave portion 33 in the upper and lower directions of the package 100B is the same as the thickness T of the first and second outer lead portions 11 and 21.

<Manufacturing Method of Package 100B>

Hereinafter, a method of manufacturing the package 100B will be described with reference to FIGS. 16 to 19. Fig. 16 is a view showing the outline of a manufacturing process of the package of another embodiment, and is a plan view of the lead frame. Fig. 17 is a schematic view showing a manufacturing step of a package according to another embodiment, and is a plan view of a lead frame sandwiched between an upper mold and a lower mold. Fig. 18 is a schematic view showing a manufacturing step of a package according to another embodiment, and is a cross-sectional view taken along line XVIII-XVIII of Fig. 17 after the first resin injection. Fig. 19 is a schematic view showing a manufacturing step of a package according to another embodiment, and is a cross-sectional view taken along line XIX-XIX of Fig. 17 after the first resin injection.

In the manufacturing method of the package 100B, it is different from the case where the prepared lead frame and the upper mold are used to manufacture the package 100. The manufacturing method of the package of this embodiment has the following steps (1B) to (5B).

(1B) Prepare the lead frame.

In the step (1B), a flat lead frame 705 having a part of the slit is prepared.

The step of preparing the lead frame 705 preferably includes a step of forming a plurality of gap portions having through holes 713 and 714 around the region of the first electrode 10B and the second electrode 20B with respect to the plate member; The step of plating the plate members of the gap portions.

Here, in the step of forming the gap portion, the gap portion can be formed by punching, etching, or the like on the plate member.

In the step of plating, the lead frame provided with the gap portion such as the through hole is plated. Specifically, for example, Ag is attached to the lead frame by electrolytic plating.

The lead frame 705 which has been plated as described above is formed in a predetermined formation region 600B of the package. The first electrode 10B and the second electrode 20B are provided with a gap between the first electrode 10B and the second electrode 20B. Here, the predetermined formation region 600B of the package refers to a region which is separated from the lead frame 705 and which is the outer periphery of the bottom surface 105 of the package 100B after molding. Further, the first electrode 10B in the lead frame 705 is a portion corresponding to the first electrode 10B after molding, and is in a state before singulation. Similarly, the second electrode 20B in the lead frame 705 is a portion corresponding to the second electrode 20B after molding, and is in a state before singulation. Further, for the sake of simplicity, the lead frame 705 has a predetermined formation region 600B of one package, but the number thereof may be plural.

In the lead frame 705, the predetermined formation region 600B of the package has a rectangular shape in a plan view, and has a first edge portion 601 which is the outer edge of the first electrode 10B and the second electrode 20B which are opposed to each other, and the first edge portion 601 and the first electrode The second edge portion 602 adjacent to the edge portion 601, the third edge portion 603 adjacent to the second edge portion 602 and facing the first edge portion 601, and the first edge portion 601 and the third edge portion 603 are adjacent to each other 4 edge portion 604.

The lead frame 705 is a plate-shaped member, and has a gap portion having a specific shape around the first electrode 10B and the second electrode 20B, and the first electrode 10B is separated from the portion facing the second electrode 20B. The lead frame 705 includes a frame-shaped lead support portion 707, hanging leads 708 and 709, and suspension leads 711 and 712 that surround the periphery of the first electrode 10B and the second electrode 20B.

The lead support portion 707 is a portion for supporting the suspension leads 708, 709 and the suspension leads 711, 712.

The hanging leads 708 and 709 support the portion for the package 100B after molding in a state of being connected from both sides in a direction (horizontal direction in FIG. 16), and the first electrode 10B and the first electrode are formed when singulated. The 2 electrode 20B is cut away.

The suspension leads 711 and 712 are portions for holding and sealing the package 100B formed on both sides in the direction orthogonal to the above-described one direction (the vertical direction in FIG. 16), and are not cut. That is, the suspension leads 711, 712 are not constituent elements of the package 100B separated from the lead frame 705.

Specifically, the first electrode 10B is connected to the lead supporting portion 707 by a hanging lead 708 corresponding to the molded first outer lead portion 11 . In the lead frame 705, a first space 706a and a second space 706b are formed on both sides of the suspension lead 708 as a gap portion. The first space 706a and the second space 706b are formed on both sides of the first electrode 10B. Furthermore, in the present embodiment, the first resin is injected from the first space 706a.

The second electrode 20B is connected to the lead support portion 707 by a hanging lead 709 corresponding to the second outer lead portion 21 after molding. In the lead frame 705, a third space 706c and a fourth space 706d are formed on both sides of the hanging lead 709 as a gap portion. The third space 706c and the fourth space 706d are formed on both sides of the second electrode 20B.

In the lead frame 705, the first space 706a, the second space 706b, the third space 706c, and the fourth space 706d communicate with the gap portion around the first electrode 10B and the second electrode 20B.

The lead frame 705 has a suspension lead 712 protruding from the second edge portion 602 into the predetermined formation region 600B of the package and a suspension lead 711 protruding from the fourth edge portion 604 into the predetermined formation region 600B of the package in plan view.

The thickness of the suspension leads 711, 712 is the same as the thickness of the lead frame 705. That is, the thickness of the suspension leads 711 and 712 is the same as the thickness T of the first and second outer lead portions 11 and 21. Therefore, the height H of the first recessed portion 33 of the package 100B is the same as the thickness T of the first and second outer lead portions 11 and 21.

As described in the above step (5) (the step of cutting the injection mark), a through hole such as a circular shape, an elliptical shape, a polygonal shape, or a substantially polygonal shape can be provided at a position where the lead frame is cut. Therefore, in the present embodiment, the lead frame 705 has at least one of the first electrode 10B and the second electrode 20B having through holes 713 and 714 at positions beyond the outer edge of the predetermined formation region 600B of the package.

Specifically, in the present embodiment, the lead frame 705 has a long circular through hole 713 that is long in the direction along the first edge portion 601 in the first edge portion 601 of the predetermined formation region 600B of the package. Moreover, the lead frame 705 is at the third edge of the predetermined formation region 600B of the package. The portion 603 has an oblong through hole 714 that is long in the direction along the third edge portion 603. Plating is also performed on the inner circumferential surfaces of the through holes 713 and 714. Further, the through holes 713 and 714 are independent, and are not in communication with the first space 706a or the like.

(2B) The lead frame is sandwiched by the upper mold and the lower mold.

In this step, the first electrode 10B of the lead frame 705 and the second electrode 20B are sandwiched by the upper mold 550B and the lower mold 560 which are divided by the upper and lower molds. The upper mold 550B has a concave portion 501B corresponding to the wall portion 31 of the resin molded body 30B and a flat portion adjacent to the concave portion 501B. The recesses 501B are connected in a ring shape. The lead frame 705 is disposed such that the predetermined formation region 600B of the package is positioned below the concave portion 501B of the upper mold 550B, and the through holes 713, 714 are positioned outside the concave portion 501B.

Further, when the upper mold 550B is aligned with the lead frame 705, a through hole which is a gate 555B is formed at a position where the first space 706a is provided on the outer side of the predetermined formation region 600B of the package.

Further, the position alignment is performed as described above, and the flat portion adjacent to the concave portion 501B of the upper mold 550B and at least a portion of the lead support portion 707, the hanging leads 708, 709, and the first and second outer leads after molding are formed. Portions of parts 11, 21 are abutted. At this time, the first resin is firmly sandwiched so as not to enter the gap between the lead frame 705 and the upper mold 550B and the lower mold 560.

(3B) The first resin is injected into the mold.

In this step, the lead frame 705 is sandwiched between the upper mold 550B and the lower mold 560, and the first gate 10B (the first outer lead portion 11) is injected into the gate 555B in the plan view. Resin. The first resin injected from the gate 555B is injected into the concave portion 501B of the upper mold 550B through the first space 706a of the lead frame 5. Further, the first resin is injected into the second space 706b, the third space 706c, and the fourth space 706d that communicate with the first space 706a of the lead frame 705.

At this time, as described above, the lead frame 705 is located at the upper mold with its through holes 713, 714 The 550B is disposed on the outer side of the recess 501B. Further, the lead frame 705 is pressed by the upper mold 550B and the lower mold 560 so that the flat portion adjacent to the concave portion 501B of the upper mold 550B abuts on the portion corresponding to the first and second outer lead portions 11 and 21 after molding. embed. Further, the through holes 713 and 714 do not communicate with the first space 706a or the like. Therefore, the first resin does not enter the through holes 713 and 714 of the lead frame 705.

(4B) The injected first resin is cured or cured.

The wall portion 31 and the flange portion 32 of the resin molded body 30B are formed by the gap portion other than the through holes 713 and 714 of the lead frame 705 and the concave portion 501B of the upper mold 550B. At this time, it is adjacent to both sides of the portions corresponding to the first and second outer lead portions 11 and 21 after molding, and is formed to have the same thickness as the first and second outer lead portions 11 and 21 and the formed flange. Part 32 is quite a part. Further, at this point of time, the flange portion 32 continues to the gate 555B, but when the package 100B is singulated, the flange portion 32 is cut away from the gate 555B.

(5B) The injection mark of the injection port of the first resin is cut off.

Here, after the first resin is cured or cured, the injection mark of the injection port of the first resin is cut off. Moreover, the first resin and the lead frame 705 are cut, and the package 100B is singulated. At this time, the hanging leads 708 and 709 are cut at the outer edges (the first edge portion 601 and the third edge portion 603) of the predetermined formation region 600B of the package of the lead frame 705. Thereby, the through holes 713 and 714 of the lead frame 705 are cut, and the second recess 50 is formed in the first and second outer lead portions 11 and 21. Further, even when the first electrode 10B and the second electrode 20B are separated from the lead frame 705 at the time of singulation, since the package 100B is sandwiched by the suspension leads 711 and 712, the package 100B does not come off.

The package 100B can be manufactured by the above steps (1B) to (5B).

In the package 100B having the above configuration, the flange portion 32 is provided on both sides of the first and second outer lead portions 11 and 21 in the same manner as the first and second outer lead portions 11 and 21 in the plan view. Further, the first outer lead portion 11 and the second outer lead portion 21 are provided with the second recess 50.

The second recess 50 is formed by passing the prepared lead frame 705 through the through hole 713. The position of 714 is cut and formed. Since the end surface which is formed by the cutting of the lead frame 705 is not plated, the conductive member such as solder is not attached, and the bonding is not facilitated.

On the other hand, in the step of injecting the first resin, the first resin does not enter the through holes 713 and 714 of the lead frame 705, but the plating of the inner peripheral surfaces of the through holes 713 and 714 is left as it is. Ground residue. Therefore, the flange portion 32 is not provided in the second recess 50 of the package 100B. Further, since the plating is performed on the side surface 51 of the second recess 50, a conductive member such as solder is adhered to facilitate bonding. Therefore, the package 100B can improve the bonding strength of the conductive member such as solder as compared with the case where the second recess 50 is not provided.

Further, since the package 100B is plated on the side surface 51 of the second recess 50, the solder fillet can be observed when the second recess 50 of the package 100B is soldered to the external mounting substrate, for example.

Further, in the package 100B, the first outer lead portion 11 and the second outer lead portion 21 are plated on the upper surface 41 and the lower surface 42. Therefore, the conductive member such as solder is applied from the side surface 51 to the upper surface 41 and the lower surface of the second recess 50. 42 bonding enables the formation of a castellation electrode.

<Configuration of Light Emitting Device 1C>

Next, the configuration of the light-emitting device 1C will be described with reference to Fig. 20 . Fig. 20 is a schematic view showing a light-emitting device of another embodiment, showing a perspective view of the entire light-emitting device.

The light-emitting device 1C is different from the light-emitting device 1 of FIG. 14 in that the package 100C is used. The same components as those of the light-emitting device 1 of Fig. 14 are denoted by the same reference numerals, and their description will be omitted.

The package 100C is different from the package 100B in the shape of the resin molded body 30C.

The resin molded body 30C includes a wall portion 31 and a flange portion 32, and has a notch portion 120 at one vertex of the wall portion 31. The notch portion 120 expresses the polarity of the first electrode 10B and is used as a cathode mark or an anode mark. The shape and size of the cutout portion 120 are arbitrary. Here, the notch portion 120 is formed in an inverted triangle shape, for example, and spans the first outer side surface 101 and the second outer side surface 102.

The manufacturing method of the package 100C is the same as the manufacturing method of the package 100B, and thus the description is omitted. Bright. In the molding die 500 for manufacturing the package 100B, for example, the shape of the concave portion 501B of the upper mold 550B of FIG. 17 can be produced by blending and deforming the shape of the concave portion 501B of the resin molded body 30C.

Since the manufacturing method of the light-emitting device 1C is the same as the method of manufacturing the light-emitting device 1, description thereof will be omitted.

In the package 100C of FIG. 20, for example, the end point 121 of the notch portion 120 may be extended to the intersection 122 of the wall portion 31 and the flange portion 32, and the notch portion 120 may be enlarged to be conspicuous.

Further, in the light-emitting device 1C, the package 100B may be used instead of the package 100C.

[Industrial availability]

The light-emitting device according to the embodiment of the present invention can be used for a lighting device, an in-vehicle light-emitting device, or the like.

5‧‧‧ lead frame

7‧‧‧Lead Support

8, 9‧‧‧ hanging leads

10‧‧‧1st electrode

11‧‧‧1st outer lead

12‧‧‧1st inner lead

20‧‧‧2nd electrode

21‧‧‧2nd outer lead

22‧‧‧2nd inner lead

30‧‧‧Resin molded body

31‧‧‧ wall

32‧‧‧Flange

100‧‧‧Package

155‧‧‧Spot marks (injection marks)

Claims (21)

A method of manufacturing a package, comprising: preparing a lead frame having a first electrode and a second electrode different from the first electrode in a predetermined formation region of the package; and using a mold over which the mold is divided up and down The lower mold sandwiches the first electrode and the second electrode; and in the molding die in which the first electrode and the second electrode are sandwiched, outside the predetermined formation region of the package of the molding die and The first resin is injected into the injection port formed beside the first electrode; the first resin to be injected is cured or cured; and after the first resin is cured or cured, the first resin is injected from the first electrode. The step of cutting the injection mark, wherein the lead frame is cut at the same time as the first resin, and the injection mark is disposed at a position that does not overlap the first electrode in a plan view. A method of manufacturing a package according to claim 1, wherein in the lead frame prepared as described above, a first space is formed beside the first electrode, and the first resin is injected from the first space. A method of manufacturing a package according to claim 1 or 2, wherein said prepared lead frame separates said first electrode from said second electrode. The manufacturing method of the package of claim 1 or 2, wherein the molding die has a concave portion corresponding to a wall portion formed on the first electrode and the second electrode, and the first resin is injected into the concave portion. The manufacturing method of the package of claim 1 or 2, wherein the first resin molded using the above molding die has: a wall portion that fixes the first electrode and the second electrode and constitutes a sidewall of the bottomed recess, wherein at least a portion of a bottom surface of the bottomed recess is formed by the first electrode and the second electrode; and a flange portion The protruding portion protrudes outward from the wall portion, and at least one of the first electrode and the second electrode has a lead portion protruding outward from the wall portion, and the flange portion is in the outer lead portion in plan view Both sides are formed to have the same thickness as the above outer lead portion. The manufacturing method of the package of claim 1 or 2, wherein the step of injecting the first resin is a transfer molding. A method of producing a package according to claim 1 or 2, wherein a light reflecting member is mixed with the first resin. The manufacturing method of the package of claim 1 or 2, wherein the prepared lead frame has at least one of the first electrode and the second electrode, and has a through hole at a position spanning an outer edge of a predetermined formation region of the package. In the step of cutting the injection mark, the lead frame is cut at the outer edge of the predetermined formation region of the package. The manufacturing method of the package of claim 8, wherein the step of preparing the lead frame includes forming a plurality of gap portions including the through hole around a region between the first electrode and the second electrode with respect to the plate member And a step of plating a plate member having the plurality of gap portions formed thereon. The manufacturing method of the package of claim 1 or 2, wherein the predetermined formation region of the package has a rectangular shape in plan view, and the first electrode and the second electrode disposed opposite each other are the first edge of the first electrode side a rim portion, a second edge portion adjacent to the first edge portion, and a third edge portion adjacent to the second edge portion and facing the first edge portion And the fourth edge portion adjacent to the first edge portion and the third edge portion, wherein the prepared lead frame protrudes from the second edge portion and the fourth edge portion into a predetermined formation region of the package in plan view Suspension leads. A method of manufacturing a light-emitting device, comprising: all the steps of the method of manufacturing the package of any one of claims 1 to 10; and before the step of cutting the injection mark after hardening or curing the first resin or At any subsequent step, the step of attaching the light-emitting element to the first electrode or the second electrode is performed. The method of manufacturing a light-emitting device according to claim 11, wherein after the step of mounting the light-emitting element, the step of applying the second resin and sealing the light-emitting element is further provided. A package comprising: a first electrode; a second electrode having a polarity different from that of the first electrode; and a wall portion that fixes the first electrode and the second electrode to form a sidewall of the bottomed recess, and a bottom surface of the bottomed recess At least a part of the first electrode and the second electrode; the flange portion protruding outward from the wall portion in a plan view; at least one of the first electrode and the second electrode having a view from the wall The outer lead portion has a second recessed portion at the distal end, and the flange portion is provided on the both sides of the outer lead portion at the same thickness as the outer lead portion in a plan view. The recessed portion is not provided with the above-mentioned flange portion. The package of claim 13, wherein each of the first electrode and the second electrode has a lead portion other than the second recess; Any of the outer lead portions has the flange portion on both sides in a plan view, and the second recess portion does not have the flange portion. The package of claim 13 or 14, wherein the package has a first outer side surface, a second outer side surface adjacent to the first outer side surface, a third outer side surface adjacent to the second outer side surface, and a third outer surface facing the first outer side The outer side surface and the fourth outer side surface adjacent to the first outer side surface and the third outer side surface, wherein the lead portion of the first electrode protrudes from the first outer side surface and faces the first electrode, and the first surface The second electrode is provided on one of the outer side surfaces, and one of the second outer side surface and the fourth outer side surface is partially recessed. The package of claim 15 wherein the thickness of the first recess of one of the second outer side surface and the fourth outer side surface is the same as the outer lead portion. The package of claim 15, wherein the first electrode and the second electrode are not exposed on the second outer side surface and the fourth outer side surface. A package according to claim 13 or 14, wherein said wall portion and said flange portion are integrally formed of the same material. The package of claim 13 or 14, wherein the outer lead portion is plated with the upper surface and the lower surface and the side surface of the second recess, and the front end surface is not plated except for the side surface of the second recess. A light-emitting device comprising: the package of any one of claims 13 to 19; and a light-emitting element that is placed on at least one of the first electrode and the second electrode of the package. The light-emitting device of claim 20, wherein the light-emitting element is covered by the second resin.