JP4654670B2 - Light emitting device and manufacturing method thereof - Google Patents

Light emitting device and manufacturing method thereof Download PDF

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JP4654670B2
JP4654670B2 JP2004343742A JP2004343742A JP4654670B2 JP 4654670 B2 JP4654670 B2 JP 4654670B2 JP 2004343742 A JP2004343742 A JP 2004343742A JP 2004343742 A JP2004343742 A JP 2004343742A JP 4654670 B2 JP4654670 B2 JP 4654670B2
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surface portion
recess
light emitting
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JP2005203748A (en
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直文 炭谷
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

A light emitting device capable of emitting an excellent mixed color light, and a light emitting device capable of enhancing the concentration of mixed light or the directivity of emission is provided. The light emitting device comprises a light emitting element and a package. The package includes at least two recesses each having a bottom surface for mounting a light emitting element thereon and a side surface extending from the bottom surface, wherein each recess has, in a vertical cross section of the recess, a vertical line passing through the center of the bottom surface of the recess which is different than a vertical line passing through the intersection of a first straight line extending along an inclined edge of the recess and a second straight line extending along an inclined edge on another side of the recess.

Description

本発明は、照明器具、ディスプレイ、携帯電話のバックライト、カメラのフラッシュライト、動画照明補助光源などに用いられる発光装置並びにパッケージ及びその製造方法に関する。   The present invention relates to a light emitting device, a package, and a method for manufacturing the same used in a lighting fixture, a display, a backlight of a mobile phone, a flashlight of a camera, an auxiliary light source for moving picture illumination.

発光素子を用いた発光装置は、小型で電力効率が良く鮮やかな色の発光をする。また、該発光素子は半導体素子であるため球切れなどの心配がない。さらに初期駆動特性が優れ、振動やオン・オフ点灯の繰り返しに強いという特徴を有する。このような優れた特性を有するため、発光ダイオード（ＬＥＤ）、レーザーダイオード（ＬＤ）などの発光素子を用いる発光装置は、各種の光源として利用されている。   A light-emitting device using a light-emitting element emits light with a small color, high power efficiency, and vivid colors. In addition, since the light-emitting element is a semiconductor element, there is no fear of a broken ball. Further, it has excellent initial driving characteristics and is strong against vibration and repeated on / off lighting. Because of such excellent characteristics, light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and laser diodes (LDs) are used as various light sources.

従来の半導体発光装置として以下の構成を有するものがある（例えば、特許文献１参照）。図２２は、従来の半導体発光装置を示す概略断面図である。以下、この図２２を用いて説明する。   Some conventional semiconductor light emitting devices have the following configuration (see, for example, Patent Document 1). FIG. 22 is a schematic cross-sectional view showing a conventional semiconductor light emitting device. Hereinafter, this will be described with reference to FIG.

半導体発光装置１００は、絶縁性の基板１０１の両端に素子搭載用の電極１０２とボンディング用の電極１０３とを備え、電極１０２側に発光素子１０４を導通搭載するとともにこの発光素子１０４と電極１０３とをワイヤ１０５によってボンディングし、電極１０２、１０３の間の領域に被さるレンズ１０６によって発光素子１０４及びワイヤ１０５を樹脂封止したものである。半導体発光装置１００は、凹部１０１ａを１個だけ設けている。   The semiconductor light emitting device 100 includes element mounting electrodes 102 and bonding electrodes 103 on both ends of an insulating substrate 101. The light emitting element 104 is conductively mounted on the electrode 102 side, and the light emitting elements 104 and 103 are electrically connected. Are bonded with a wire 105, and the light emitting element 104 and the wire 105 are sealed with a resin by a lens 106 covering a region between the electrodes 102 and 103. The semiconductor light emitting device 100 is provided with only one recess 101a.

電極１０２、１０３は基板１０１の底面から側面及び上面にかけて形成され、基板１０１の表面側ではそれぞれ基板１０１の中央側に突き出したランド１０２ａ、１０３ａを形成している。この電極１０２側のランド１０２ａの先端部分に相当する領域の基板１０１にはすり鉢状の凹部１０１ａを形成し、この凹部１０１ａの中にランド１０２ａの先端に一体に連なるマウント部１０２ｂを落とし込んでいる。マウント部１０２ｂは凹部１０１ａの内周面及び底面にフィットするように成形され、凹部１０１ａと同様にすり鉢状に形成されている。   The electrodes 102 and 103 are formed from the bottom surface to the side surface and the top surface of the substrate 101, and lands 102 a and 103 a protruding to the center side of the substrate 101 are formed on the surface side of the substrate 101. A mortar-shaped recess 101a is formed in the substrate 101 in a region corresponding to the tip of the land 102a on the electrode 102 side, and a mount 102b integrally connected to the tip of the land 102a is dropped into the recess 101a. The mount portion 102b is shaped to fit the inner peripheral surface and the bottom surface of the recess 101a, and is formed in a mortar shape like the recess 101a.

凹部１０１ａの開口部上方から切断した断面形状において、凹部１０１ａの側面部の一辺１０１ｂから延びる第１の直線１１０と凹部１０１ａの側面部の他の一辺１０１ｃから延びる第２の直線１１１との交点を通る垂線１１２がある。また、凹部１０１ａの開口部上方から切断した断面形状において、凹部１０１ａの底面部（マウント部１０２ｂ）の中心点を通る垂線１１３がある。交点を通る垂線１１２と中心点を通る垂線１１３とは、同一線となっている。この同一線（光軸）にレンズ１０６の集光部を配置している。この半導体発光装置１００は、レンズ１０６を用いて集光性を高めることから、反射面となる凹部１０１ａの側面部１０１ｂ、１０１ｃからの反射光を凹部１０１ａの底面部（マウント部１０２ｂ）の中心点を通る垂線１１３（光軸）に集光させている。   In the cross-sectional shape cut from above the opening of the recess 101a, the intersection of the first straight line 110 extending from one side 101b of the side surface of the recess 101a and the second straight line 111 extending from the other side 101c of the side surface of the recess 101a There is a normal 112 through. Moreover, in the cross-sectional shape cut | disconnected from the opening part upper part of the recessed part 101a, there exists the perpendicular line 113 which passes along the center point of the bottom face part (mount part 102b) of the recessed part 101a. The perpendicular 112 passing through the intersection and the perpendicular 113 passing through the center point are the same line. The condensing part of the lens 106 is arranged on the same line (optical axis). Since the semiconductor light emitting device 100 uses the lens 106 to enhance the light collecting property, the reflected light from the side surface portions 101b and 101c of the concave portion 101a serving as the reflective surface is reflected at the center point of the bottom surface portion (mount portion 102b) of the concave portion 101a. The light is condensed on a perpendicular line 113 (optical axis) passing through.

特開２０００−２９４８３３号公報JP 2000-294833 A

しかし、従来の半導体発光装置１００にあっては、発光素子１０４が実装されている凹部１０１ａが１個だけであるので、２個以上の発光素子１０４を用いて混色光を得ることができない。たとえ半導体発光装置１００を複数個並列に並べた場合でも、１個の半導体発光装置１００が集光性を高めていることから、隣り合う半導体発光装置１００から放出される光が混色光となることはない。   However, since the conventional semiconductor light emitting device 100 has only one recess 101a in which the light emitting element 104 is mounted, it is not possible to obtain mixed color light using two or more light emitting elements 104. Even when a plurality of semiconductor light emitting devices 100 are arranged in parallel, the light emitted from the adjacent semiconductor light emitting devices 100 becomes mixed color light because one semiconductor light emitting device 100 has improved light collecting properties. There is no.

以上のことから、本発明は、良好な混色光を得ることができる発光装置を提供することを目的とする。また、混色光の集光性を高めたり指向性を制御したりすることができる発光装置を提供することを目的とする。さらに、これらの発光装置に用いるパッケージ及びその製造方法を提供することを目的とする。   In view of the above, an object of the present invention is to provide a light-emitting device capable of obtaining good color mixing light. It is another object of the present invention to provide a light emitting device that can improve the light collecting property of mixed color light and control the directivity. Furthermore, it aims at providing the package used for these light-emitting devices, and its manufacturing method.

上記の問題点を解決すべく、本発明者は鋭意検討を重ねた結果、本発明を完成するに到った。   In order to solve the above-mentioned problems, the present inventor has intensively studied, and as a result, the present invention has been completed.

本発明は、発光素子と、発光素子を載置する底面部と、該底面部から延びる側面部とを持つ凹部を複数個有するパッケージと、を有する発光装置であって、該複数個有する凹部の少なくとも１個は、該凹部の開口部上方から切断した断面形状において、該凹部側面部と該凹部上面部との間の第１の角度と、該凹部を挟んで向かい合う該凹部側面部と該凹部上面部との間の第２の角度と、が相違する形状を有する発光装置に関する。   The present invention is a light emitting device having a light emitting device, a bottom surface portion on which the light emitting element is placed, and a package having a plurality of concave portions each having a side surface portion extending from the bottom surface portion. At least one of the cross-sectional shape cut from above the opening of the recess has a first angle between the side surface of the recess and the top surface of the recess, and the recess side surface and the recess facing each other across the recess. The present invention relates to a light emitting device having a shape different from a second angle between the upper surface portion and the upper surface portion.

前記第１の角度は、９０度よりも大きく１８０度よりも小さい角度であり、前記第２の角度は、９０度若しくは９０度よりも大きく１８０度よりも小さい角度であり、前記第１の角度は前記第２の角度よりも大きいことが好ましい。第１の角度と第２の角度とを比較した場合、原則として、発光装置の中央部に近い側の角度を第１の角度とする。   The first angle is an angle that is greater than 90 degrees and less than 180 degrees, and the second angle is an angle that is 90 degrees or greater than 90 degrees and less than 180 degrees, and the first angle Is preferably larger than the second angle. When comparing the first angle and the second angle, in principle, the angle closer to the center of the light emitting device is set as the first angle.

本発明は、発光素子と、発光素子を載置する底面部と、該底面部から延びる側面部と、を持つ凹部を複数個有するパッケージと、を有する発光装置であって、該複数個有する凹部の少なくとも１個は、該凹部の開口部上方から底面部に対する垂線に沿って切断した断面形状において、該凹部底面部の中心点を通る底面部に対する垂線と、該凹部側面部の一辺から延びる第１の直線と該凹部側面部の他の一辺から延びる第２の直線との交点を通る底面部に対する垂線と、が相違する形状を有し、該交点を通る底面部に対する垂線は、該中心点を通る底面部に対する垂線よりも外側に配置されることを特徴とする発光装置に関する。 The present invention is a light emitting device having a light emitting device, a bottom surface portion on which the light emitting element is placed, and a package having a plurality of recesses having a side surface portion extending from the bottom surface portion. At least one of the first and second recesses extending from the upper side of the opening of the recess along a perpendicular to the bottom surface, the perpendicular to the bottom surface passing through the center point of the bottom surface of the recess and one side extending from the side of the side surface of the recess. has a normal to the bottom portion through the intersection of the second straight line extending from the other side of the first straight line and the concave portion side surface portion, the shape is different, the normal to the bottom portion through the intersection point, said center point It is related with the light-emitting device arrange | positioned outside the perpendicular with respect to the bottom face part which passes through.

前記パッケージは、隣接する凹部を２個有しており、隣接する２個の凹部の開口部上方から切断した断面形状において、該２個の凹部は該２個の凹部開口部を挟む垂線に関して対称である発光装置であってもよい。   The package has two adjacent recesses, and the two recesses are symmetrical with respect to a perpendicular line between the two recess openings in a cross-sectional shape cut from above the openings of the two adjacent recesses. It may be a light emitting device.

前記パッケージは、隣接する凹部を複数個有しており、隣接する複数個の凹部の開口部上方から切断した断面形状において、該複数個の凹部は該複数個の凹部開口部の重心を通る垂線に関して対称である発光装置であってもよい。   The package has a plurality of adjacent recesses, and the plurality of recesses are perpendicular to the center of gravity of the plurality of recess openings in a cross-sectional shape cut from above the openings of the adjacent recesses. It may be a light emitting device that is symmetrical with respect to.

前記凹部は、透光性樹脂で発光素子を封止してもよい。   The concave portion may seal the light emitting element with a translucent resin.

本発明は、発光素子を載置するための底面部と、該底面部から延びる側面部と、を持つ凹部を複数個有するパッケージであって、該複数個有する凹部の少なくとも１個は、該凹部の開口部上方から切断した断面形状において、該凹部側面部と該凹部上面部との間の第１の角度と、該凹部を挟んで向かい合う該凹部側面部と該凹部上面部との間の第２の角度と、が相違する形状を有するパッケージである。   The present invention is a package having a plurality of recesses having a bottom surface part for mounting a light emitting element and a side surface part extending from the bottom surface part, and at least one of the plurality of recesses is the recess In the cross-sectional shape cut from above the opening, the first angle between the side surface of the recess and the top surface of the recess, and the first angle between the side surface of the recess and the top surface of the recess facing each other across the recess. 2 is a package having a shape different from the angle of 2.

前記第１の角度は、９０度よりも大きく１８０度よりも小さい角度であり、前記第２の角度は、９０度若しくは９０度よりも大きく１８０度よりも小さい角度であり、前記第１の角度は前記第２の角度よりも大きいことが好ましい。   The first angle is an angle that is greater than 90 degrees and less than 180 degrees, and the second angle is an angle that is 90 degrees or greater than 90 degrees and less than 180 degrees, and the first angle Is preferably larger than the second angle.

本発明は、発光素子を載置するための底面部と、該底面部から延びる側面部と、を持つ凹部を複数個有するパッケージであって、該複数個有する凹部の少なくとも１個は、該凹部の開口部上方から前記底面部に対する垂線に沿って切断した断面形状において、該凹部底面部の中心点を通る底面部に対する垂線と、該凹部側面部の一辺から延びる第１の直線と該凹部側面部の他の一辺から延びる第２の直線との交点を通る底面部に対する垂線と、が相違する形状を有し、該交点を通る底面部に対する垂線は、該中心点を通る底面部に対する垂線よりも外側に配置されることを特徴とするパッケージに関する。 The present invention is a package having a plurality of recesses having a bottom surface part for mounting a light emitting element and a side surface part extending from the bottom surface part, and at least one of the plurality of recesses is the recess In a cross-sectional shape cut along the perpendicular to the bottom surface from above the opening of the recess, the perpendicular to the bottom surface passing through the center point of the bottom surface of the recess, the first straight line extending from one side of the side surface of the recess, and the side surface of the recess It has a normal to the bottom portion through the intersection of the second straight line extending from the other side of the section, a shape that is different, normal to the bottom portion through the intersection point, from the normal to the bottom portion through the center point The present invention also relates to a package characterized by being arranged outside.

前記パッケージは、凹部の底面部の少なくとも一部に正負の電極を設けることが好ましい。   The package preferably includes positive and negative electrodes on at least part of the bottom surface of the recess.

前記パッケージは、凹部の底面部から続く正負の電極を裏面に設けており、該電極の厚みと同一の厚みの凸部を設けることが好ましい。   The package is preferably provided with positive and negative electrodes continuing from the bottom surface of the concave portion on the back surface, and a convex portion having the same thickness as the thickness of the electrode.

前記パッケージは、裏面に樹脂注入跡を複数個有していてもよい。   The package may have a plurality of resin injection traces on the back surface.

前記パッケージは、隣接する凹部を２個有しており、隣接する２個の凹部の開口部上方から切断した断面形状において、該２個の凹部は該２個の凹部開口部を挟む垂線に関して対称であるパッケージであってもよい。   The package has two adjacent recesses, and the two recesses are symmetrical with respect to a perpendicular line between the two recess openings in a cross-sectional shape cut from above the openings of the two adjacent recesses. It may be a package.

前記パッケージは、隣接する凹部を複数個有しており、隣接する複数個の凹部の開口部上方から切断した断面形状において、該複数個の凹部は該複数個の凹部開口部の重心を通る垂線に関して対称であるパッケージであってもよい。   The package has a plurality of adjacent recesses, and the plurality of recesses are perpendicular to the center of gravity of the plurality of recess openings in a cross-sectional shape cut from above the openings of the adjacent recesses. It may be a package that is symmetrical with respect to.

本発明は、発光素子を載置するための底面部と、該底面部から延びる側面部と、該底面部の少なくとも一部に配設され、少なくとも一部が該底面部で露出する正負の電極と、を持つ凹部を複数個有するパッケージの製造方法であって、該複数個有する凹部の少なくとも１個は、該凹部の開口部上方から前記底面部に対する垂線に沿って切断した断面形状において、該凹部底面部の中心点を通る底面部に対する垂線と、該凹部側面部の一辺から延びる第１の直線と該凹部側面部の他の一辺から延びる第２の直線との交点を通る底面部に対する垂線と、が相違する形状を有し、該交点を通る底面部に対する垂線は、該中心点を通る底面部に対する垂線よりも外側に配置されるように成型された型枠内に樹脂を注入する工程と、該樹脂を硬化する工程と、該型枠を取り外す工程と、有することを特徴とするパッケージの製造方法に関する。


The present invention relates to a bottom surface portion on which a light emitting element is placed, a side surface portion extending from the bottom surface portion, and at least a part of the bottom surface portion, and at least a part of the positive and negative electrodes exposed at the bottom surface portion. And a manufacturing method of a package having a plurality of recesses, wherein at least one of the plurality of recesses has a cross-sectional shape cut from the upper part of the opening of the recesses along a perpendicular to the bottom part , A perpendicular to the bottom surface passing through the center point of the bottom surface of the recess, and a perpendicular to the bottom surface passing through the intersection of the first straight line extending from one side of the side surface of the recess and the second straight line extending from the other side of the side surface of the recess. If has a shape is different, the normal to the bottom portion through the intersection point, the step of injecting a resin into molded mold frame so as to be disposed outside the normal to the bottom portion through the center point And a process for curing the resin. When a step of removing the mold frame, a method of manufacturing a package, characterized in that it has.


前記樹脂を注入する工程は、トランスファ・モールド成型法を用いることが好ましい。   The step of injecting the resin preferably uses a transfer molding method.

前記樹脂を注入する工程は、２以上の注入口から樹脂を注入していることが好ましい。   In the step of injecting the resin, the resin is preferably injected from two or more injection ports.

前記パッケージは、隣接する凹部を２個有しており、隣接する２個の凹部の開口部上方から切断した断面形状が該２個の凹部開口部を挟む垂線に関して対称であるパッケージの製造方法であってもよい。   The package has two adjacent recesses, and a package manufacturing method in which a cross-sectional shape cut from above the openings of the two adjacent recesses is symmetric with respect to a perpendicular that sandwiches the two recess openings. There may be.

前記パッケージは、隣接する凹部を複数個有しており、隣接する複数個の凹部の開口部上方から切断した断面形状が該複数個の凹部開口部の重心を通る垂線に関して対称であるパッケージの製造方法であってもよい。   The package has a plurality of adjacent recesses, and a package having a cross-sectional shape cut from above the openings of the plurality of adjacent recesses is symmetric with respect to a perpendicular passing through the center of gravity of the plurality of recess openings. It may be a method.

本発明は、前記パッケージの製造方法により製造されたパッケージの凹部底面部に発光素子を実装する工程を有することを特徴とする発光装置の製造方法に関する。   The present invention relates to a method for manufacturing a light emitting device, comprising a step of mounting a light emitting element on a bottom surface of a recessed portion of a package manufactured by the method for manufacturing a package.

前記発光装置のパッケージの凹部に透光性樹脂を注入する工程と、該透光性樹脂を硬化する工程と、を有していてもよい。   You may have the process of inject | pouring translucent resin in the recessed part of the package of the said light-emitting device, and the process of hardening | curing this translucent resin.

本発明は、以上説明したように構成されているので、以下に記載されるような効果を奏する。   Since the present invention is configured as described above, the following effects can be obtained.

本発明は、発光素子と、発光素子を載置する底面部と、該底面部から延びる側面部とを持つ凹部を複数個有するパッケージと、を有する発光装置であって、該複数個有する凹部の少なくとも１個は、該凹部の開口部上方から切断した断面形状において、該凹部側面部と該凹部上面部との間の第１の角度と、該凹部を挟んで向かい合う該凹部側面部と該凹部上面部との間の第２の角度と、が相違する形状を有する発光装置に関する。これにより凹部に載置された発光素子から放出された光が、隣接する発光素子からの光と混合され均一な混色光を発する発光装置を提供することができる。また凹部を上記構成にすることにより、指向性を制御することができる。   The present invention is a light emitting device having a light emitting device, a bottom surface portion on which the light emitting element is placed, and a package having a plurality of concave portions each having a side surface portion extending from the bottom surface portion. At least one of the cross-sectional shape cut from above the opening of the recess has a first angle between the side surface of the recess and the top surface of the recess, and the recess side surface and the recess facing each other across the recess. The present invention relates to a light emitting device having a shape different from a second angle between the upper surface portion and the upper surface portion. Accordingly, it is possible to provide a light emitting device in which light emitted from a light emitting element placed in a recess is mixed with light from an adjacent light emitting element to emit uniform color light. In addition, the directivity can be controlled by configuring the concave portion as described above.

前記第１の角度は、９０度よりも大きく１８０度よりも小さい角度であり、前記第２の角度は、９０度若しくは９０度よりも大きく１８０度よりも小さい角度であり、前記第１の角度は前記第２の角度よりも大きいことが好ましい。これにより、より均一な混色光を発する発光装置を提供することができる。   The first angle is an angle that is greater than 90 degrees and less than 180 degrees, and the second angle is an angle that is 90 degrees or greater than 90 degrees and less than 180 degrees, and the first angle Is preferably larger than the second angle. Thereby, the light-emitting device which emits more uniform color mixing light can be provided.

本発明は、発光素子と、発光素子を載置する底面部と、該底面部から延びる側面部と、を持つ凹部を複数個有するパッケージと、を有する発光装置であって、該複数個有する凹部の少なくとも１個は、該凹部の開口部上方から切断した断面形状において、該凹部底面部の中心点を通る垂線と、該凹部側面部の一辺から延びる第１の直線と該凹部側面部の他の一辺から延びる第２の直線との交点を通る垂線と、が相違する形状を有することを特徴とする発光装置に関する。これにより凹部に載置された発光素子から放出された光が、隣接する発光素子からの光と混合され均一な混色光を発する発光装置を提供することができる。また凹部の底面部及び側面部を上記構成にすることにより、指向性を制御することができる。さらに、前記中心点を通る垂線と前記交点を通る垂線とが同一となる発光装置よりも、本発明に係る発光装置の方が、発光出力の高い発光装置を提供することができる。   The present invention is a light emitting device having a light emitting device, a bottom surface portion on which the light emitting element is placed, and a package having a plurality of recesses having a side surface portion extending from the bottom surface portion. At least one of the cross-sectional shape cut from above the opening of the recess, a perpendicular passing through the center point of the bottom surface of the recess, a first straight line extending from one side of the side surface of the recess, and the other side of the side surface of the recess The present invention relates to a light-emitting device having a shape different from a perpendicular line passing through an intersection with a second straight line extending from one side. Accordingly, it is possible to provide a light emitting device in which light emitted from a light emitting element placed in a recess is mixed with light from an adjacent light emitting element to emit uniform color light. Moreover, directivity can be controlled by making the bottom face part and side face part of a recessed part into the said structure. Furthermore, the light emitting device according to the present invention can provide a light emitting device with higher light output than the light emitting device in which the perpendicular passing through the center point and the perpendicular passing through the intersection are the same.

前記パッケージは、隣接する凹部を２個有しており、隣接する２個の凹部の開口部上方から切断した断面形状において、該２個の凹部は該２個の凹部開口部を挟む垂線に関して対称である発光装置であってもよい。補色の関係にある発光素子をそれぞれの凹部に実装することにより、混色性に富んだ白色に発光する発光装置を提供することができる。また、２個の凹部を挟む部分について集光性を高めることもできる。   The package has two adjacent recesses, and the two recesses are symmetrical with respect to a perpendicular line between the two recess openings in a cross-sectional shape cut from above the openings of the two adjacent recesses. It may be a light emitting device. By mounting light emitting elements having a complementary color relationship in the respective recesses, a light emitting device that emits white light with a high color mixing property can be provided. In addition, it is possible to improve the light condensing performance at a portion sandwiching the two concave portions.

前記パッケージは、隣接する凹部を複数個有しており、隣接する複数個の凹部の開口部上方から切断した断面形状において、該複数個の凹部は該複数個の凹部開口部の重心を通る垂線に関して対称である発光装置であってもよい。複数個の凹部の重心でもっとも高い発光出力を有する発光装置を提供することができる。また、赤色に発光する発光素子を載置した凹部、緑色に発光する発光素子を載置した凹部、青色に発光する発光素子を載置した凹部、をそれぞれ設けることにより、種々の色味を均一に発光する発光装置を提供することができる。   The package has a plurality of adjacent recesses, and the plurality of recesses are perpendicular to the center of gravity of the plurality of recess openings in a cross-sectional shape cut from above the openings of the adjacent recesses. It may be a light emitting device that is symmetrical with respect to. A light emitting device having the highest light emission output at the center of gravity of the plurality of recesses can be provided. In addition, by providing a concave portion in which a light emitting element emitting red light is mounted, a concave portion in which a light emitting element emitting green light is placed, and a concave portion in which a light emitting element emitting blue light is placed, various colors are uniformly provided. A light-emitting device that emits light can be provided.

前記凹部は、透光性樹脂で発光素子を封止してもよい。これにより屈折率の高い発光素子から屈折率の低い樹脂、さらに屈折率の低い空気へと光を放出することができるため、発光素子から放出される光の取り出しを高め、発光出力の向上を図ることができる。   The concave portion may seal the light emitting element with a translucent resin. Accordingly, light can be emitted from a light-emitting element having a high refractive index to a resin having a low refractive index, and further to air having a low refractive index. Therefore, extraction of light emitted from the light-emitting element is enhanced, and light emission output is improved. be able to.

本発明は、発光素子を載置するための底面部と、該底面部から延びる側面部と、を持つ凹部を複数個有するパッケージであって、該複数個有する凹部の少なくとも１個は、該凹部の開口部上方から切断した断面形状において、該凹部側面部と該凹部上面部との間の第１の角度と、該凹部を挟んで向かい合う該凹部側面部と該凹部上面部との間の第２の角度と、が相違する形状を有するパッケージである。これにより凹部に載置された発光素子から放出された光が、隣接する発光素子からの光と混合され均一な混色光を発する発光装置に用いるパッケージを提供することができる。また凹部の底面部及び側面部を上記構成にすることにより、指向性を制御することができる。   The present invention is a package having a plurality of recesses having a bottom surface part for mounting a light emitting element and a side surface part extending from the bottom surface part, and at least one of the plurality of recesses is the recess In the cross-sectional shape cut from above the opening, the first angle between the side surface of the recess and the top surface of the recess, and the first angle between the side surface of the recess and the top surface of the recess facing each other across the recess. 2 is a package having a shape different from the angle of 2. Accordingly, it is possible to provide a package used for a light-emitting device in which light emitted from a light-emitting element placed in a recess is mixed with light from an adjacent light-emitting element to emit uniform color light. Moreover, directivity can be controlled by making the bottom face part and side face part of a recessed part into the said structure.

前記第１の角度は、９０度よりも大きく１８０度よりも小さい角度であり、前記第２の角度は、９０度若しくは９０度よりも大きく１８０度よりも小さい角度であり、前記第１の角度は前記第２の角度よりも大きいことが好ましい。発光素子を載置した該パッケージを用いることにより、より均一な混色光を発する発光装置を提供することができる。   The first angle is an angle that is greater than 90 degrees and less than 180 degrees, and the second angle is an angle that is 90 degrees or greater than 90 degrees and less than 180 degrees, and the first angle Is preferably larger than the second angle. By using the package on which the light-emitting element is mounted, a light-emitting device that emits more uniform color mixture light can be provided.

本発明は、発光素子を載置するための底面部と、該底面部から延びる側面部と、を持つ凹部を複数個有するパッケージであって、該複数個有する凹部の少なくとも１個は、該凹部の開口部上方から切断した断面形状において、該凹部底面部の中心点を通る垂線と、該凹部側面部の一辺から延びる第１の直線と該凹部側面部の他の一辺から延びる第２の直線との交点を通る垂線と、が相違する形状を有することを特徴とするパッケージに関する。これにより凹部に載置された発光素子から放出された光が、隣接する発光素子からの光と混合され均一な混色光を発する発光装置に用いるパッケージを提供することができる。また凹部の底面部及び側面部を上記構成にすることにより、指向性を制御することができる。さらに、前記中心点を通る垂線と前記交点を通る垂線とが同一となる発光装置よりも、本発明に係る発光装置の方が、発光出力の高い発光装置に用いるパッケージを提供することができる。   The present invention is a package having a plurality of recesses having a bottom surface part for mounting a light emitting element and a side surface part extending from the bottom surface part, and at least one of the plurality of recesses is the recess In a cross-sectional shape cut from above the opening of the recess, a perpendicular passing through the center point of the bottom surface of the recess, a first straight line extending from one side of the side surface of the recess, and a second straight line extending from the other side of the side surface of the recess The present invention relates to a package characterized by having a shape different from a perpendicular line passing through an intersection with the. Accordingly, it is possible to provide a package used for a light-emitting device in which light emitted from a light-emitting element placed in a recess is mixed with light from an adjacent light-emitting element to emit uniform color light. Moreover, directivity can be controlled by making the bottom face part and side face part of a recessed part into the said structure. Furthermore, the light emitting device according to the present invention can provide a package used for a light emitting device having a higher light output than the light emitting device in which the perpendicular passing through the center point and the perpendicular passing through the intersection are the same.

前記パッケージは、凹部の底面部の少なくとも一部に正負の電極を設けることが好ましい。凹部の開口端部よりも下側で発光素子と正負の電極とをワイヤで電気的に接続することができるため、凹部を覆う封止樹脂と空気との界面でワイヤ切れを起こさせない。また、従来例のように凹部の開口端部よりも封止樹脂を盛り上げる必要がないため、粘度の低い封止樹脂を用いることもできる。   The package preferably includes positive and negative electrodes on at least part of the bottom surface of the recess. Since the light emitting element and the positive and negative electrodes can be electrically connected to each other below the opening end portion of the concave portion with a wire, wire breakage does not occur at the interface between the sealing resin covering the concave portion and the air. Moreover, since it is not necessary to raise sealing resin rather than the opening edge part of a recessed part like a prior art example, low-viscosity sealing resin can also be used.

前記パッケージは、凹部の底面部から続く正負の電極を裏面に設けており、該電極の厚みと同一の厚みの凸部を設けることが好ましい。これにより発光素子を超音波実装する際のパッケージのたわみを防止することができる。   The package is preferably provided with positive and negative electrodes continuing from the bottom surface of the concave portion on the back surface, and a convex portion having the same thickness as the thickness of the electrode. This can prevent the package from being bent when the light emitting element is ultrasonically mounted.

前記パッケージは、裏面に樹脂注入跡を複数個有していてもよい。パッケージの成型時において、型枠に樹脂注入口を複数設けることによりパッケージの薄型化を図ることができる。   The package may have a plurality of resin injection traces on the back surface. At the time of molding the package, the package can be thinned by providing a plurality of resin injection ports in the mold.

前記パッケージは、隣接する凹部を２個有しており、隣接する２個の凹部の開口部上方から切断した断面形状において、該２個の凹部は該２個の凹部開口部を挟む垂線に関して対称であるパッケージであってもよい。補色の関係にある発光素子をそれぞれの凹部に実装することにより、混色性に富んだ白色に発光する発光装置に用いるパッケージを提供することができる。   The package has two adjacent recesses, and the two recesses are symmetrical with respect to a perpendicular line between the two recess openings in a cross-sectional shape cut from above the openings of the two adjacent recesses. It may be a package. By mounting light emitting elements having a complementary color relationship in the respective concave portions, it is possible to provide a package used for a light emitting device that emits white light with a high color mixing property.

前記パッケージは、隣接する凹部を複数個有しており、隣接する複数個の凹部の開口部上方から切断した断面形状において、該複数個の凹部は該複数個の凹部開口部の重心を通る垂線に関して対称であるパッケージであってもよい。複数個の凹部の重心でもっとも高い発光出力を有する発光装置に用いるパッケージを提供することができる。また、赤色に発光する発光素子を載置した凹部、緑色に発光する発光素子を載置した凹部、青色に発光する発光素子を載置した凹部、をそれぞれ設けることにより、種々の色味を均一に発光する発光装置に用いるパッケージを提供することができる。   The package has a plurality of adjacent recesses, and the plurality of recesses are perpendicular to the center of gravity of the plurality of recess openings in a cross-sectional shape cut from above the openings of the adjacent recesses. It may be a package that is symmetrical with respect to. It is possible to provide a package used for a light emitting device having the highest light emission output at the center of gravity of a plurality of recesses. In addition, by providing a concave portion in which a light emitting element emitting red light is mounted, a concave portion in which a light emitting element emitting green light is placed, and a concave portion in which a light emitting element emitting blue light is placed, various colors are uniformly provided. A package used for a light-emitting device that emits light can be provided.

本発明は、発光素子を載置するための底面部と、該底面部から延びる側面部と、該底面部の少なくとも一部に配設され、少なくとも一部が該底面部で露出する正負の電極と、を持つ凹部を複数個有するパッケージの製造方法であって、該複数個有する凹部の少なくとも１個は、該凹部の開口部上方から切断した断面形状において、該凹部底面部の中心点を通る垂線と、該凹部側面部の一辺から延びる第１の直線と該凹部側面部の他の一辺から延びる第２の直線との交点を通る垂線と、が相違する形状を有するように成型された型枠内に樹脂を注入する工程と、該樹脂を硬化する工程と、該型枠を取り外す工程と、有することを特徴とするパッケージの製造方法に関する。これにより凹部に載置された発光素子から放出された光が、隣接する発光素子からの光と混合され均一な混色光を発する発光装置に用いるパッケージを製造することができる。また凹部の底面部及び側面部を上記構成にすることにより、指向性を制御することができる。さらに、前記中心点を通る垂線と前記交点を通る垂線とが同一となる発光装置よりも、本発明に係る発光装置の方が、発光出力の高い発光装置に用いるパッケージを提供することができる。   The present invention relates to a bottom surface portion on which a light emitting element is placed, a side surface portion extending from the bottom surface portion, and at least a part of the bottom surface portion, and at least a part of the positive and negative electrodes exposed at the bottom surface portion. A package having a plurality of recesses, wherein at least one of the plurality of recesses passes through the center point of the bottom surface of the recess in a cross-sectional shape cut from above the opening of the recess. A mold formed so that a perpendicular line and a perpendicular line passing through an intersection of a first straight line extending from one side of the concave side surface part and a second straight line extending from the other side of the concave side surface part have different shapes. The present invention relates to a package manufacturing method comprising: a step of injecting a resin into a frame; a step of curing the resin; and a step of removing the mold. As a result, it is possible to manufacture a package used for a light emitting device in which light emitted from a light emitting element placed in a recess is mixed with light from an adjacent light emitting element to emit uniform color light. Moreover, directivity can be controlled by making the bottom face part and side face part of a recessed part into the said structure. Furthermore, the light emitting device according to the present invention can provide a package used for a light emitting device having a higher light output than the light emitting device in which the perpendicular passing through the center point and the perpendicular passing through the intersection are the same.

前記樹脂を注入する工程は、トランスファ・モールド成型法を用いることが好ましい。これによりほぼ同一の形状を有するパッケージを容易に大量に製造することができる。   The step of injecting the resin preferably uses a transfer molding method. This makes it possible to easily manufacture a large number of packages having substantially the same shape.

前記樹脂を注入する工程は、２以上の注入口から樹脂を注入していることが好ましい。
パッケージの成型時において、型枠に樹脂注入口を複数設けることにより薄型のパッケージを製造することができる。 In the step of injecting the resin, the resin is preferably injected from two or more injection ports.
When the package is molded, a thin package can be manufactured by providing a plurality of resin injection ports in the mold.

前記パッケージは、隣接する凹部を２個有しており、隣接する２個の凹部の開口部上方から切断した断面形状が該２個の凹部開口部を挟む垂線に関して対称であるパッケージの製造方法であってもよい。これにより、補色の関係にある発光素子をそれぞれの凹部に実装することにより、混色性に富んだ白色に発光する発光装置を製造することができる。また、２個の凹部を挟む部分について集光性を高めることもできる。   The package has two adjacent recesses, and a package manufacturing method in which a cross-sectional shape cut from above the openings of the two adjacent recesses is symmetric with respect to a perpendicular that sandwiches the two recess openings. There may be. Thus, by mounting the light emitting elements having a complementary color relationship in the respective concave portions, it is possible to manufacture a light emitting device that emits white light with a high color mixing property. In addition, it is possible to improve the light condensing performance at a portion sandwiching the two concave portions.

前記パッケージは、隣接する凹部を複数個有しており、隣接する複数個の凹部の開口部上方から切断した断面形状が該複数個の凹部開口部の重心を通る垂線に関して対称であるパッケージの製造方法であってもよい。複数個の凹部の重心でもっとも高い発光出力を有する発光装置を製造することができる。また、赤色に発光する発光素子を載置した凹部、緑色に発光する発光素子を載置した凹部、青色に発光する発光素子を載置した凹部、をそれぞれ設けることにより、種々の色味を均一に発光する発光装置を製造することができる。   The package has a plurality of adjacent recesses, and a package having a cross-sectional shape cut from above the openings of the plurality of adjacent recesses is symmetric with respect to a perpendicular passing through the center of gravity of the plurality of recess openings. It may be a method. A light emitting device having the highest light output at the center of gravity of the plurality of recesses can be manufactured. In addition, by providing a concave portion in which a light emitting element emitting red light is mounted, a concave portion in which a light emitting element emitting green light is placed, and a concave portion in which a light emitting element emitting blue light is placed, various colors are uniformly provided. A light-emitting device that emits light can be manufactured.

本発明は、前記パッケージの製造方法により製造されたパッケージの凹部底面部に発光素子を実装する工程を有することを特徴とする発光装置の製造方法に関する。これにより混色性に富んだ種々の色味に発光する発光装置を製造することができる。   The present invention relates to a method for manufacturing a light emitting device, comprising a step of mounting a light emitting element on a bottom surface of a recessed portion of a package manufactured by the method for manufacturing a package. As a result, it is possible to manufacture light emitting devices that emit light in various colors with rich color mixing properties.

前記発光装置のパッケージの凹部に透光性樹脂を注入する工程と、該透光性樹脂を硬化する工程と、を有していてもよい。これにより屈折率の高い発光素子から屈折率の低い樹脂、さらに屈折率の低い空気へと光を放出することができるため、発光素子から放出される光の取り出しの高い発光装置を製造することができる。   You may have the process of inject | pouring translucent resin in the recessed part of the package of the said light-emitting device, and the process of hardening | curing this translucent resin. As a result, light can be emitted from a light-emitting element having a high refractive index to a resin having a low refractive index and further to air having a low refractive index. it can.

以下、本発明に係る発光装置及びその製造方法並びにパッケージ及びその製造方法を、実施の形態及び実施例を用いて説明する。だたし、本発明は、この実施の形態及び実施例に限定されない。   Hereinafter, a light-emitting device, a manufacturing method thereof, a package, and a manufacturing method thereof according to the present invention will be described using embodiments and examples. However, the present invention is not limited to this embodiment and example.

＜第１の実施の形態＞
図１は、第１の実施の形態に係る発光装置を示す概略平面図である。図２は、第１の実施の形態に係る発光装置を示す概略ＩＩ−ＩＩ断面図である。図３は、第１の実施の形態に係る発光装置を示す概略ＩＩＩ−ＩＩＩ断面図である。図４は、第１の実施の形態に係る発光装置の背面側を示す概略斜視図である。 <First Embodiment>
FIG. 1 is a schematic plan view showing the light emitting device according to the first embodiment. FIG. 2 is a schematic II-II sectional view showing the light emitting device according to the first embodiment. FIG. 3 is a schematic III-III cross-sectional view showing the light emitting device according to the first embodiment. FIG. 4 is a schematic perspective view showing the back side of the light emitting device according to the first embodiment.

（発光装置）
第１の実施の形態に係る発光装置１０は、発光素子２と、発光素子２を載置する底面部１ａと、底面部１ａから延びる側面部１ｂと、を持つ凹部１ｃを２個有するパッケージ１と、を有している。パッケージ１の凹部１ｃの底面部１ａには、電極３を設けており、この電極３のマウント部３ａに発光素子２を搭載している。 (Light emitting device)
The light emitting device 10 according to the first embodiment is a package 1 having two recesses 1c each having a light emitting element 2, a bottom surface portion 1a on which the light emitting element 2 is placed, and a side surface portion 1b extending from the bottom surface portion 1a. And have. An electrode 3 is provided on the bottom surface 1 a of the recess 1 c of the package 1, and the light emitting element 2 is mounted on the mount 3 a of the electrode 3.

発光素子２は、例えばＧａＮ系のものであって、絶縁性のサファイア基板の上に、ｎ型の化合物半導体を積層し、その上にｐ型の化合物半導体を積層する。この発光素子２は、サファイア基板を電極３の上面に搭載している。化合物半導体によるｎ型層の上面に形成されたｎ側電極はワイヤ５により電極３に電気的に接続されている。また、化合物半導体によるｐ型層の上面に形成されたｐ側電極はワイヤ５により電極３に電気的に接続されている。電極３は、一対の正負の電極である。発光素子２は、ＧａＮ系の他、ＩｎＧａＮ系のものやＧａＰ、ＧａＡｓ系のものなども使用することができる。発光素子２は、青色光や緑色光、黄色光、赤色光などの可視光に発光するものを使用することができる他、紫外線、赤外線などを発光するものも使用することができる。   The light emitting element 2 is, for example, a GaN-based device, and an n-type compound semiconductor is stacked on an insulating sapphire substrate, and a p-type compound semiconductor is stacked thereon. In the light emitting element 2, a sapphire substrate is mounted on the upper surface of the electrode 3. An n-side electrode formed on the upper surface of the n-type layer made of a compound semiconductor is electrically connected to the electrode 3 by a wire 5. The p-side electrode formed on the upper surface of the p-type layer made of a compound semiconductor is electrically connected to the electrode 3 by a wire 5. The electrode 3 is a pair of positive and negative electrodes. As the light emitting element 2, in addition to GaN, InGaN, GaP, GaAs, or the like can be used. The light emitting element 2 can be one that emits visible light such as blue light, green light, yellow light, or red light, and can also be one that emits ultraviolet light, infrared light, or the like.

なお、発光素子２として、例えばＧａＰ系のものも使用することができる。発光素子２は、導電性のｎ型の基板の上に化合物半導体を積層してそのｐ−ｎ接合域を発光層としたものである。この発光素子２は、基板の底面に形成されたｎ側電極を導電性の接着剤によって電極３のマウント部に導通させて固定しており、同時に化合物半導体によるｎ型層の上面に形成されたｎ側電極はワイヤ５により電極３に電気的に接続されている。また、化合物半導体によるｐ型層の上面に形成されたｐ側電極はワイヤ５により電極３に電気的に接続されている。   As the light emitting element 2, for example, a GaP-based one can also be used. In the light emitting element 2, a compound semiconductor is stacked on a conductive n-type substrate, and the pn junction region is used as a light emitting layer. The light emitting element 2 is formed by electrically connecting an n-side electrode formed on the bottom surface of the substrate to the mount portion of the electrode 3 with a conductive adhesive, and at the same time, formed on the upper surface of the n-type layer made of a compound semiconductor. The n-side electrode is electrically connected to the electrode 3 by a wire 5. The p-side electrode formed on the upper surface of the p-type layer made of a compound semiconductor is electrically connected to the electrode 3 by a wire 5.

パッケージ１は、上向きに開口する凹部１ｃを２個有している。凹部１ｃは、底面部１ａと側面部１ｂとを有している。凹部１ｃの開口部上方から切断した断面形状において、側面部１ｂと凹部１ｃの上面部１ｉとの間の第１の角度１ｐと、側面部１ｂと凹部１ｃの上面部１ｉとの間の第２の角度１ｑと、は相違する。第１の角度１ｐは９０度よりも大きく１８０度よりも小さい角度であり、第２の角度１ｑは、９０度若しくは９０度よりも大きく１８０度よりも小さい角度であり、第１の角度１ｐは第２の角度１ｑよりも大きい。同様に他の凹部１ｃの第１の角度１ｒと第２の角度１ｓとは相違し、第１の角度１ｒは９０度よりも大きく１８０度よりも小さい角度であり、第２の角度１ｓは、９０度若しくは９０度よりも大きく１８０度よりも小さい角度であり、第１の角度１ｒは第２の角度１ｓよりも大きい。一の凹部１ｃの第１の角度１ｐと他の凹部１ｃの第１の角度１ｒとは同じ角度であり、一の凹部１ｃの第２の角度１ｑと他の凹部１ｃの第２の角度１ｓとは同じ角度である。   The package 1 has two recesses 1c that open upward. The recess 1c has a bottom surface portion 1a and a side surface portion 1b. In a cross-sectional shape cut from above the opening of the recess 1c, a first angle 1p between the side surface 1b and the upper surface 1i of the recess 1c and a second between the side 1b and the upper surface 1i of the recess 1c. This is different from the angle 1q. The first angle 1p is an angle larger than 90 degrees and smaller than 180 degrees, the second angle 1q is an angle larger than 90 degrees or larger than 90 degrees and smaller than 180 degrees, and the first angle 1p is It is larger than the second angle 1q. Similarly, the first angle 1r and the second angle 1s of the other concave portion 1c are different from each other. The first angle 1r is an angle larger than 90 degrees and smaller than 180 degrees, and the second angle 1s is The angle is 90 degrees or greater than 90 degrees and smaller than 180 degrees, and the first angle 1r is larger than the second angle 1s. The first angle 1p of one recess 1c and the first angle 1r of the other recess 1c are the same angle, and the second angle 1q of the one recess 1c and the second angle 1s of the other recess 1c Are the same angle.

パッケージ１は、上向きに開口する凹部１ｃを形成している。凹部１ｃは、発光素子２を載置する底面部１ａと、底面部１ａから延びる側面部１ｂと、を持っている。パッケージ１は、凹部１ｃの開口部上方から切断した断面形状において、凹部１ｃの底面部１ａの中心点を通る垂線ａ−ａと、凹部１ｃの側面部１ｂの一辺から延びる第１の直線ｂ−ｂと凹部１ｃの側面部１ｂの他の一辺から延びる第２の直線ｃ−ｃとの交点を通る垂線ｄ−ｄと、が相違する。交点を通る垂線ｄ−ｄは、中心点を通る垂線ａ−ａよりも外側に配置する場合、発光素子２から放出された光が隣接する凹部１ｃの中央付近で混合され、所定の均一な混色光を得ることができる。これに対し、交点を通る垂線ｄ−ｄは、中心点を通る垂線ａ−ａよりも内側に配置する場合、発光素子２から放出された光が隣接する凹部１ｃの中央付近で混合され、かつ隣接する凹部１ｃの中央付近で高輝度に発光し、高輝度で均一な混色光を得ることができる。隣接する２個の凹部１ｃの開口部上方から切断した断面形状が該２個の凹部１ｃの開口部を挟む垂線ｅ−ｅに関して対称であることが好ましい。対称とすることにより発光素子２から放出される光を均一に混合することができる。パッケージ１の裏面は、凹部１ｃの底面部１ａに設けるマウント部３ａから続く裏面側電極部３ｂを設けている。裏面側電極部３ｂの厚みと、パッケージ１の裏面側の凸部１ｄとは、発光装置１０を載置したときに同一の高さとなることが好ましい。同一の高さにすることにより、発光装置１０を載置する際の安定感を増加することができるからである。パッケージ１の裏面側には、樹脂注入跡１ｅが２つある。パッケージ１の成形において型枠に樹脂注入口を複数設けることによりパッケージ１の薄型化を図ることができるからである。パッケージ１の形状は、特に限定されるものではなく、パッケージ１の底部の投影形状が円、楕円、四角形、多角形又は略これらに対応する形状等、種々のものが挙げられる。パッケージ１の大きさは特に限定されず、例えば０．１ｍｍ２〜１００ｍｍ２のものなどが挙げられる。パッケージ１の厚さは、１００μｍ〜１０ｍｍ程度が挙げられる。パッケージ１の材質は特に限定されず、公知の材料、通常、耐熱性樹脂である熱可塑性エンジニアリングポリマー、熱硬化性樹脂等の１種又は２種以上を組み合わせて形成することができる。例えば、液晶ポリマー（ＬＣＰ）、ポリフェニレンスルフィド（ＰＰＳ）、芳香族ナイロン（ＰＰＡ）、エポキシ樹脂、硬質シリコーンレジンなどが挙げられる。なかでも、熱可塑性エンジニアリングポリマーがコスト面で適当である。また、これらの樹脂には、酸化チタン、酸化亜鉛、アルミナ、シリカ、チタン酸バリウム、リン酸カルシウム、炭酸カルシウム、ホワイトカーボン、タルク、炭酸マグネシウム、窒化ホウ素、グラスファイバー等の無機フィラー等の１種又は２種以上が組み合わされて添加されていてもよい。さらに酸化防止剤、熱安定剤、光安定剤等の添加剤が適宜添加されていてもよい。例えば樹脂１００重量部に対して、無機フィラー等が１０重量部〜８０重量部、好ましくは４０重量部〜８０重量部添加されていることが適当である。パッケージ１の凹部１ｃの開口部は、楕円形状を形成している。楕円形状の一の直径が他の一の直径の二倍の長さであることが好ましい。楕円形状を２個並べることにより、略円形若しくは略正方形に近い形状を形成することができる。均一な混色光を得ることができる。また、楕円形状とすることにより透光性樹脂４の硬化に伴う体積収縮が生じた場合であっても、ワイヤ５が透光性樹脂４の上部に露出することがない。これは楕円形状の中央部の凹みが、円形状の中央部の凹みよりも小さいからである。 The package 1 has a recess 1c that opens upward. The concave portion 1c has a bottom surface portion 1a on which the light emitting element 2 is placed and a side surface portion 1b extending from the bottom surface portion 1a. The package 1 has a cross-sectional shape cut from above the opening of the recess 1c, and a perpendicular line aa passing through the center point of the bottom surface 1a of the recess 1c and a first straight line b- extending from one side of the side surface 1b of the recess 1c. b and a perpendicular line dd passing through the intersection of a second straight line cc extending from the other side of the side surface 1b of the recess 1c is different. When the perpendicular line dd that passes through the intersection is arranged outside the perpendicular line aa that passes through the center point, the light emitted from the light emitting element 2 is mixed in the vicinity of the center of the adjacent recess 1c, and a predetermined uniform color mixture. Light can be obtained. On the other hand, when the perpendicular line dd that passes through the intersection is arranged inside the perpendicular line aa that passes through the center point, the light emitted from the light emitting element 2 is mixed in the vicinity of the center of the adjacent recess 1c, and Light is emitted with high luminance near the center of the adjacent recess 1c, and uniform color mixture light with high luminance can be obtained. It is preferable that the cross-sectional shape cut from above the openings of the two adjacent recesses 1c is symmetric with respect to the perpendicular ee sandwiching the openings of the two recesses 1c. By making it symmetrical, the light emitted from the light emitting element 2 can be uniformly mixed. The back surface of the package 1 is provided with a back surface side electrode portion 3b continuing from a mount portion 3a provided on the bottom surface portion 1a of the recess 1c. It is preferable that the thickness of the back surface side electrode portion 3b and the convex portion 1d on the back surface side of the package 1 have the same height when the light emitting device 10 is placed. This is because by setting the same height, it is possible to increase a sense of stability when the light emitting device 10 is placed. There are two resin injection traces 1 e on the back side of the package 1. This is because the package 1 can be thinned by providing a plurality of resin injection ports in the mold during molding of the package 1. The shape of the package 1 is not particularly limited, and examples thereof include various shapes such as a projected shape of the bottom of the package 1 such as a circle, an ellipse, a quadrangle, a polygon, or a shape substantially corresponding to these. The size of the package 1 is not particularly limited, and the like such as those of 0.1 mm 2 100 mm 2. The thickness of the package 1 is about 100 μm to 10 mm. The material of the package 1 is not particularly limited, and can be formed by combining one kind or two or more kinds of known materials, usually thermoplastic engineering polymers which are heat-resistant resins, thermosetting resins and the like. Examples thereof include liquid crystal polymer (LCP), polyphenylene sulfide (PPS), aromatic nylon (PPA), epoxy resin, and hard silicone resin. Among these, a thermoplastic engineering polymer is appropriate in terms of cost. These resins include one or two of inorganic fillers such as titanium oxide, zinc oxide, alumina, silica, barium titanate, calcium phosphate, calcium carbonate, white carbon, talc, magnesium carbonate, boron nitride, and glass fiber. Two or more species may be added in combination. Furthermore, additives such as an antioxidant, a heat stabilizer, and a light stabilizer may be appropriately added. For example, it is appropriate that 10 to 80 parts by weight, preferably 40 to 80 parts by weight of an inorganic filler is added to 100 parts by weight of the resin. The opening of the recess 1c of the package 1 has an elliptical shape. It is preferable that one diameter of the elliptical shape is twice as long as the other diameter. By arranging two oval shapes, it is possible to form a substantially circular or nearly square shape. Uniform color mixing light can be obtained. Moreover, even if volume contraction accompanying the curing of the translucent resin 4 occurs due to the elliptical shape, the wire 5 is not exposed to the upper part of the translucent resin 4. This is because the oval-shaped central recess is smaller than the circular central recess.

電極３は、発光素子２を載置するためのマウント部３ａ及びマウント部３ａから続く裏面側電極部３ｂとを有する。裏面側電極部３ｂは外部電極と接続するために設ける。電極３は無電解メッキを施したものや露光処理、エッチング処理、レジスト除去等の工程を経て、銅箔にニッケル及び金に電解メッキすることにより得られる。電極３は、銅、鉄等の合金による高熱伝導体により形成することができる。また、これら合金の表面に銀、アルミ、金等のメッキが施されていても良い。   The electrode 3 has a mount portion 3a for mounting the light emitting element 2 and a back surface side electrode portion 3b continuing from the mount portion 3a. The back surface side electrode part 3b is provided in order to connect with an external electrode. The electrode 3 is obtained by performing electroless plating on copper foil and nickel and gold through steps such as exposure treatment, etching treatment, and resist removal. The electrode 3 can be formed of a high thermal conductor made of an alloy such as copper or iron. The surface of these alloys may be plated with silver, aluminum, gold or the like.

発光素子２は、マウント部３ａ上にフェイスアップでダイボンディングして搭載することもできる他、半田バンプ、金バンプ等を介してフェイスダウンで搭載することもできる。そのほか、保護素子上に発光素子２を搭載し、該保護素子を電極３に搭載することもできる。保護素子としては、例えば、ツェナーダイオード、コンデンサ、ダイアック等が挙げられる。   The light-emitting element 2 can be mounted by face-up die bonding on the mount portion 3a, or can be mounted face-down via a solder bump, a gold bump, or the like. In addition, the light emitting element 2 can be mounted on the protective element, and the protective element can be mounted on the electrode 3. Examples of the protective element include a Zener diode, a capacitor, and a diac.

ツェナーダイオードは、正電極を有するｐ型半導体領域と、負電極を有するｎ型半導体領域とを有し、保護素子の負電極および正電極が発光素子のｐ側電極とｎ側電極に対して逆並列となるように接続される。このように、保護素子をツェナーダイオードとすることにより、正負電極間に過大な電圧が印加されても、発光素子の正負両電極間はツェナー電圧に保持されることとなり、過大な電圧から発光素子を保護し、素子破壊や性能劣化の発生を防止することができる。   The Zener diode has a p-type semiconductor region having a positive electrode and an n-type semiconductor region having a negative electrode, and the negative electrode and the positive electrode of the protective element are opposite to the p-side electrode and the n-side electrode of the light emitting element. They are connected in parallel. Thus, by using a Zener diode as the protective element, even if an excessive voltage is applied between the positive and negative electrodes, the positive and negative electrodes of the light emitting element are held at the Zener voltage. Can be prevented and the occurrence of element destruction and performance deterioration can be prevented.

コンデンサは、表面実装用のチップ部品を用いることができる。このような構造のコンデンサは、両側に帯状の電極が設けられており、この電極が発光素子の正電極および負電極に並列接続される。正負電極間に過電圧が印加された場合、この過電圧によって充電電流がコンデンサに流れ、コンデンサの端子電圧を瞬時に下げ、発光素子に対する印加電圧が上がらないようにすることにより、発光素子を過電圧から保護することができる。また、高周波成分を含むノイズが印加された場合も、コンデンサがバイパスコンデンサとして機能するので、外来ノイズを排除することができる。   As the capacitor, a chip component for surface mounting can be used. The capacitor having such a structure is provided with strip-shaped electrodes on both sides, and these electrodes are connected in parallel to the positive electrode and the negative electrode of the light emitting element. When an overvoltage is applied between the positive and negative electrodes, the charging current flows to the capacitor due to this overvoltage, and the terminal voltage of the capacitor is instantaneously reduced, so that the applied voltage to the light emitting element does not increase, thereby protecting the light emitting element from overvoltage. can do. Further, even when noise including a high frequency component is applied, the capacitor functions as a bypass capacitor, so that external noise can be eliminated.

透光性樹脂４は、エポキシ樹脂又はシリコーン樹脂、非晶質ポリアミド樹脂、フッ素樹脂などを用いることができる。   As the translucent resin 4, an epoxy resin, a silicone resin, an amorphous polyamide resin, a fluororesin, or the like can be used.

透光性樹脂４中に蛍光物質を混入しておいてもよい。蛍光物質を用いることにより、発光素子２が励起光源として働き、発光素子２から放出された光により蛍光物質が励起され、発光素子２の放出する光と異なる波長の光を外部に放出する。これにより種々の色味の発光装置１０を提供することができる。蛍光物質は、特に限定されず、セリウムで賦活されたイットリウム・アルミニウム・ガーネット系蛍光物質、ユーロピウムで賦活された窒化物系蛍光物質、ユーロピウムで賦活された酸窒化物系蛍光物質、ベリレン系誘導体、銅で賦活されたセレン化亜鉛系蛍光物質などを用いることができる。セリウムで賦活されたイットリウム・アルミニウム・ガーネット系蛍光物質は、Ｙ、Ｌｕ、Ｓｃ、Ｌａ、Ｔｂ、Ｇｄ及びＳｍの群から選択される少なくとも１つの元素と、Ａｌ、Ｇａ及びＩｎの群から選択される少なくとも１つの元素とを有する。ユーロピウムで賦活された窒化物系蛍光物質は、Ｂａ、Ｓｒ、Ｃａなどのアルカリ土類金属から選択される少なくとも１つの元素と、Ｓｉ、Ｇｅなどの第ＩＶｂ属元素とから選択される少なくとも１つの元素と、窒素と、を有する。ユーロピウムで賦活された酸窒化物系蛍光物質は、Ｂａ、Ｓｒ、Ｃａなどのアルカリ土類金属から選択される少なくとも１つの元素と、Ｓｉ、Ｇｅなどの第ＩＶｂ属元素とから選択される少なくとも１つの元素と、窒素と、酸素と、を有する。   A fluorescent substance may be mixed in the translucent resin 4. By using the fluorescent material, the light emitting element 2 functions as an excitation light source, the fluorescent material is excited by the light emitted from the light emitting element 2, and emits light having a wavelength different from that of the light emitted from the light emitting element 2. Thereby, the light-emitting device 10 of various colors can be provided. The fluorescent material is not particularly limited, yttrium-aluminum-garnet fluorescent material activated with cerium, nitride-based fluorescent material activated with europium, oxynitride-based fluorescent material activated with europium, berylene derivative, A zinc selenide fluorescent material activated with copper can be used. The yttrium-aluminum-garnet phosphor activated by cerium is selected from at least one element selected from the group of Y, Lu, Sc, La, Tb, Gd and Sm, and from the group of Al, Ga and In. And at least one element. The nitride-based phosphor activated with europium is at least one element selected from at least one element selected from alkaline earth metals such as Ba, Sr, and Ca and Group IVb elements such as Si and Ge. Element and nitrogen. The oxynitride-based fluorescent material activated with europium is at least one selected from at least one element selected from alkaline earth metals such as Ba, Sr, and Ca and Group IVb elements such as Si and Ge. One element, nitrogen and oxygen.

（パッケージ及び発光装置の製造方法）
発光素子２を載置するための底面部１ａと、底面部１ａから延びる側面部１ｂと、底面部１ａの少なくとも一部に配設され、少なくとも一部が底面部１ａで露出する正負の電極３と、を持つ凹部１ｃを２個有するパッケージ１の製造方法は以下のごときである。ただし凹部１ｃの個数は２個に限定されず、同様な製造方法により複数個製造することができる。 (Manufacturing method of package and light emitting device)
A bottom surface portion 1a for mounting the light emitting element 2, a side surface portion 1b extending from the bottom surface portion 1a, and a positive / negative electrode 3 disposed on at least a part of the bottom surface portion 1a and at least a part of which is exposed on the bottom surface portion 1a. The manufacturing method of the package 1 having two recesses 1c having the following is as follows. However, the number of recesses 1c is not limited to two, and a plurality of recesses 1c can be manufactured by the same manufacturing method.

まず、凹部１ｃの開口部上方から切断した断面形状において、凹部１ｃ底面部１ａの中心点を通る垂線ａ−ａと、凹部１ｃ側面部１ｂの一辺から延びる第１の直線ｂ−ｂと凹部１ｃ側面部１ｂの他の一辺から延びる第２の直線ｃ−ｃとの交点を通る垂線ｄ−ｄと、が相違するように成形された型枠内に樹脂を注入する。   First, in a cross-sectional shape cut from above the opening of the concave portion 1c, a perpendicular line aa passing through the center point of the bottom surface portion 1a of the concave portion 1c, a first straight line bb extending from one side of the concave portion 1c side surface portion 1b, and the concave portion 1c. Resin is poured into a mold frame formed so that the perpendicular dd passing through the intersection with the second straight line cc extending from the other side of the side surface portion 1b is different.

この樹脂を注入する工程は、トランスファ・モールド成型法を用いることが好ましい。樹脂を注入する工程は、材料の種類等に応じて、射出成形、押出成形、圧縮成型、注型成形、真空成形、積層成形等の方法によりパッケージ１を形成することができる。この樹脂を注入する工程は、２以上の注入口から樹脂を注入することが好ましい。特に凹部１ｃ底面部１ａに相当するパッケージ１の背面側から樹脂を注入することが好ましい。パッケージ１は、隣接する凹部１ｃを２個有しており、隣接する２個の凹部１ｃの開口部上方から切断した断面形状が２個の凹部１ｃ開口部を挟む垂線ｅ−ｅに関して対称となる型枠を用いることもできる。   The step of injecting this resin preferably uses a transfer molding method. In the step of injecting the resin, the package 1 can be formed by a method such as injection molding, extrusion molding, compression molding, cast molding, vacuum molding, or lamination molding depending on the type of material. In the step of injecting the resin, it is preferable to inject the resin from two or more injection ports. In particular, it is preferable to inject the resin from the back side of the package 1 corresponding to the bottom portion 1a of the recess 1c. The package 1 has two adjacent recesses 1c, and a cross-sectional shape cut from above the openings of the two adjacent recesses 1c is symmetric with respect to a perpendicular line ee sandwiching the two recesses 1c openings. Formwork can also be used.

次に、樹脂を硬化する。樹脂の硬化は、型枠内で本硬化まで一段階で行う場合の他、型枠内で仮硬化を行い、型枠を取り外してから本硬化を行う二段階で行う場合もある。   Next, the resin is cured. In addition to the case where the resin is cured in one stage until the main curing in the mold, there is a case where the resin is temporarily cured in the mold, and then the curing is performed in two stages after the mold is removed.

次に、型枠を取り外す。これによりパッケージ１を製造することができる。型枠を取り外す際にパッケージ１との剥離をよくするため、型枠の内面に表面処理を施すことが好ましい。   Next, the mold is removed. Thereby, the package 1 can be manufactured. In order to improve the peeling from the package 1 when removing the mold, it is preferable to subject the inner surface of the mold to a surface treatment.

さらに、このパッケージ１の凹部１ｃ底面部１ａに発光素子２を実装する。これにより発光装置１０を製造することができる。発光素子２は、エポキシ樹脂などのダイボンド樹脂を用いてフェイスアップで実装することもできる。フェイスアップで実装した後、発光素子２の電極とパッケージ１の電極３とをワイヤ５を介して電気的に接続する。これに対し、発光素子２は、金バンプ、半田バンプ等を用いて、超音波実装手段を用いフェイスダウンで実装することもできる。   Further, the light emitting element 2 is mounted on the bottom 1a of the recess 1c of the package 1. Thereby, the light-emitting device 10 can be manufactured. The light emitting element 2 can also be mounted face up using a die bond resin such as an epoxy resin. After being mounted face up, the electrode of the light emitting element 2 and the electrode 3 of the package 1 are electrically connected via a wire 5. On the other hand, the light emitting element 2 can also be mounted face-down using ultrasonic mounting means using gold bumps, solder bumps, or the like.

さらに、発光装置のパッケージ１の凹部１ｃに透光性樹脂４を注入したあと、透光性樹脂４を硬化する。これにより発光装置１０を製造することができる。透光性樹脂４には、蛍光物質をあらかじめ混合しておいてもよい。   Further, after the translucent resin 4 is injected into the recess 1c of the package 1 of the light emitting device, the translucent resin 4 is cured. Thereby, the light-emitting device 10 can be manufactured. The translucent resin 4 may be mixed with a fluorescent material in advance.

＜第２の実施の形態＞
図５は、第２の実施の形態に係る発光装置を示す概略平面図である。図６は、第２の実施の形態に係る発光装置を示す概略ＶＩ−ＶＩ断面図である。以下、第２の実施の形態に係る発光装置について説明する。ただし、第１の実施の形態とほぼ同様の構成を採るところは説明を省略する。 <Second Embodiment>
FIG. 5 is a schematic plan view showing the light emitting device according to the second embodiment. FIG. 6 is a schematic VI-VI sectional view showing the light emitting device according to the second embodiment. Hereinafter, the light emitting device according to the second embodiment will be described. However, the description is omitted where the same configuration as that of the first embodiment is adopted.

第２の実施の形態に係る発光装置２０は、凹部２１ｃの形状を除いて、第１の実施の形態に係る発光装置１０とほぼ同様である。   The light emitting device 20 according to the second embodiment is substantially the same as the light emitting device 10 according to the first embodiment except for the shape of the recess 21c.

パッケージ２１の凹部２１ｃの開口部は、長方形形状を形成している。長方形の一辺は、他の一辺の約二倍の長さを有していることが好ましい。長方形形状を２個並べることにより略正方形に近い形状を形成することができる。これにより均一な混色光を得ることができる。また、長方形形状とすることにより透光性樹脂２４の硬化に伴う体積収縮が生じた場合であっても、ワイヤ２５が透光性樹脂２４の上部に露出することがない。また、発光素子２２を各凹部に１個毎設けることもできるが、２個毎設けることもできる。   The opening of the recess 21c of the package 21 forms a rectangular shape. One side of the rectangle is preferably about twice as long as the other side. By arranging two rectangular shapes, a shape close to a square can be formed. Thereby, uniform color mixture light can be obtained. In addition, even when volume shrinkage occurs due to the hardening of the translucent resin 24 due to the rectangular shape, the wire 25 is not exposed to the upper part of the translucent resin 24. Further, one light emitting element 22 can be provided in each recess, but two light emitting elements 22 can also be provided.

＜第３の実施の形態＞
図７は、第３の実施の形態に係る発光装置を示す概略平面図である。図８は、第３の実施の形態に係る発光装置を示す概略ＶＩＩＩ−ＶＩＩＩ断面図である。以下、第３の実施の形態に係る発光装置について説明する。ただし、第１の実施の形態とほぼ同様の構成を採るところは説明を省略する。 <Third Embodiment>
FIG. 7 is a schematic plan view showing a light emitting device according to the third embodiment. FIG. 8 is a schematic VIII-VIII cross-sectional view showing the light emitting device according to the third embodiment. Hereinafter, the light emitting device according to the third embodiment will be described. However, the description is omitted where the same configuration as that of the first embodiment is adopted.

第３の実施の形態に係る発光装置３０は、凹部３１ｃの個数や配置、大きさ等を除いて、第１の実施の形態に係る発光装置１０とほぼ同様である。   The light emitting device 30 according to the third embodiment is substantially the same as the light emitting device 10 according to the first embodiment except for the number, arrangement, size, and the like of the recesses 31c.

パッケージ３１は、上向きに開口する凹部３１ｃを３個有している。３個の凹部３１ｃは、それぞれ底面部３１ａと側面部３１ｂとを有している。凹部３１ｃの開口部上方から切断した断面形状において、側面部３１ｂと凹部３１ｃの上面部３１ｉとの間の第１の角度３１ｐと、側面部３１ｂと凹部３１ｃの上面部３１ｉとの間の第２の角度３１ｑと、は相違する。第１の角度３１ｐは９０度よりも大きく１８０度よりも小さい角度であり、第２の角度３１ｑは９０度若しくは９０度よりも大きく１８０度よりも小さい角度であり、第１の角度３１ｐは第２の角度３１ｑよりも大きい。同様に他の凹部３１ｃの第１の角度３１ｒと第２の角度３１ｓとは相違し、第１の角度３１ｒは９０度よりも大きく１８０度よりも小さい角度であり、第２の角度３１ｓは９０度若しくは９０度よりも大きく１８０度よりも小さい角度であり、第１の角度３１ｒは第２の角度３１ｓよりも大きい。一の凹部３１ｃの第１の角度３１ｐと他の凹部３１ｃの第１の角度３１ｒとは同じ角度であり、一の凹部３１ｃの第２の角度３１ｑと他の凹部３１ｃの第２の角度３１ｓとは同じ角度である。３個の凹部３１ｃのうち中央の凹部３１ｃは、側面部３１ｂと凹部３１ｃの上面部３１ｉとの間の第１の角度３１ｔと、側面部３１ｂと凹部３１ｃの上面部３１ｉとの間の第２の角度３１ｕと、は同じ角度である。３個の凹部３１ｃを並べており、中央の凹部３１ｃの底面の中心点を通る垂線に対して、両端の凹部３１ｃは対称である。   The package 31 has three recesses 31c that open upward. The three recessed portions 31c each have a bottom surface portion 31a and a side surface portion 31b. In a cross-sectional shape cut from above the opening of the recess 31c, a first angle 31p between the side surface 31b and the upper surface 31i of the recess 31c and a second between the side 31b and the upper surface 31i of the recess 31c. Is different from the angle 31q. The first angle 31p is an angle larger than 90 degrees and smaller than 180 degrees, the second angle 31q is an angle larger than 90 degrees or larger than 90 degrees and smaller than 180 degrees, and the first angle 31p is the first angle 31p. Is larger than the angle 31q of 2. Similarly, the first angle 31r and the second angle 31s of the other recess 31c are different, the first angle 31r is an angle greater than 90 degrees and smaller than 180 degrees, and the second angle 31s is 90 degrees. The first angle 31r is larger than the second angle 31s. The first angle 31p of one recess 31c and the first angle 31r of the other recess 31c are the same angle, and the second angle 31q of the one recess 31c and the second angle 31s of the other recess 31c Are the same angle. Among the three recesses 31c, the center recess 31c is a first angle 31t between the side part 31b and the upper surface part 31i of the recess 31c, and a second angle between the side part 31b and the upper surface part 31i of the recess 31c. The angle 31u is the same angle. Three concave portions 31c are arranged, and the concave portions 31c at both ends are symmetrical with respect to a perpendicular passing through the center point of the bottom surface of the central concave portion 31c.

パッケージ３１には、凹部３１ｃを３個有している。凹部３１ｃの開口部は、楕円形状を形成している。パッケージ３１は、３個の凹部３１ｃをそれぞれ並列に並べている。このとき両端の凹部３１ｃは、底面部３１ａを凹部３１ｃの開口部に対して外側に配置して、中央部の凹部３１ｃは、底面部３１ａを凹部３１ｃの開口部に対してほぼ中央に配置する。これにより均一な混色光を得ることができる。それぞれの凹部３１ｃに青色、緑色、赤色に発光する発光素子３２を載置する。これにより種々の色味を有する発光装置３０を提供することができる。一方、両端の凹部３１ｃに青色、赤色の発光素子３２を２個ずつ載置して、中央の凹部３１ｃに緑色の発光素子３２を１個載置することもできる。これにより種々の色味及び明るさを実現可能な発光装置３０を提供することができる。これは視感度特性を利用したものである。   The package 31 has three recesses 31c. The opening part of the recessed part 31c forms the ellipse shape. The package 31 has three recesses 31c arranged in parallel. At this time, the concave portions 31c at both ends have the bottom surface portion 31a disposed outside the opening portion of the concave portion 31c, and the central concave portion 31c has the bottom surface portion 31a disposed substantially at the center with respect to the opening portion of the concave portion 31c. . Thereby, uniform color mixture light can be obtained. The light emitting elements 32 that emit blue, green, and red light are placed in the respective recesses 31c. Thereby, the light emitting device 30 having various colors can be provided. On the other hand, two blue and red light emitting elements 32 may be placed in the recesses 31c at both ends, and one green light emitting element 32 may be placed in the central recess 31c. Thereby, the light-emitting device 30 which can implement | achieve various colors and brightness can be provided. This utilizes the visibility characteristic.

＜第４の実施の形態＞
図９は、第４の実施の形態に係る発光装置を示す概略平面図である。以下、第４の実施の形態に係る発光装置について説明する。ただし、第１の実施の形態とほぼ同様の構成を採るところは説明を省略する。 <Fourth embodiment>
FIG. 9 is a schematic plan view showing a light emitting device according to the fourth embodiment. Hereinafter, the light emitting device according to the fourth embodiment will be described. However, the description is omitted where the same configuration as that of the first embodiment is adopted.

第４の実施の形態に係る発光装置４０は、凹部４１ｃに載置する発光素子４２の個数や配置、電極４３の個数や配置等を除いて、第１の実施の形態に係る発光装置１０とほぼ同様である。   The light emitting device 40 according to the fourth embodiment is the same as the light emitting device 10 according to the first embodiment except for the number and arrangement of the light emitting elements 42 placed in the recess 41c and the number and arrangement of the electrodes 43. It is almost the same.

パッケージ４１には、開口部を楕円形状とする凹部３１ｃを２個有している。凹部４１ｃには、発光素子４２を２個ずつ計４個載置している。これによりそれぞれの発光素子４２同士の距離が短くなり、発光素子４２の混色性を高め、広範囲の色味を有する発光装置４０を提供することができる。また、凹部４１ｃを被覆する透光性樹脂４４よりもワイヤ４５を低い位置に設けることができるため、透光性樹脂４４の硬化に伴い生じるワイヤ４５のせん断を防止することができる。発光素子４２毎に一対の電極４３をパッケージ４１に配設している。これにより発光素子４２の放熱性の向上を図っている。   The package 41 has two recesses 31c whose openings are elliptical. A total of four light emitting elements 42 are placed in the recess 41c. Accordingly, the distance between the light emitting elements 42 is shortened, the color mixing property of the light emitting elements 42 is improved, and the light emitting device 40 having a wide range of colors can be provided. Further, since the wire 45 can be provided at a lower position than the translucent resin 44 covering the recess 41c, shearing of the wire 45 caused by the curing of the translucent resin 44 can be prevented. A pair of electrodes 43 is provided in the package 41 for each light emitting element 42. Thereby, the heat dissipation of the light emitting element 42 is improved.

＜第５の実施の形態＞
図１０は、第５の実施の形態に係る発光装置を示す概略平面図である。図１１は、第５の実施の形態に係る発光装置を示す概略背面図である。以下、第５の実施の形態に係る発光装置について説明する。ただし、第１の実施の形態とほぼ同様の構成を採るところは説明を省略する。 <Fifth embodiment>
FIG. 10 is a schematic plan view showing a light emitting device according to the fifth embodiment. FIG. 11 is a schematic rear view showing the light emitting device according to the fifth embodiment. The light emitting device according to the fifth embodiment will be described below. However, the description is omitted where the same configuration as that of the first embodiment is adopted.

第５の実施の形態に係る発光装置５０は、凹部５１ｃの形状や大きさ、配置等、電極３の個数や配置等を除いて、第１の実施の形態に係る発光装置１０とほぼ同様である。   The light emitting device 50 according to the fifth embodiment is substantially the same as the light emitting device 10 according to the first embodiment, except for the shape, size, arrangement, and the like of the recess 51c, except for the number and arrangement of the electrodes 3. is there.

パッケージ５１の凹部５１ｃの開口部は、大きさの異なる長方形形状を形成している。開口部の大きい方の凹部５１ｇは底面部５１ａ−ｇを有しており、開口部の小さい方の凹部５１ｈは底面部５１ａ−ｈを有している。凹部５１ｇの底面部５１ａ−ｇは、隣り合う凹部５１ｈよりも遠い位置に設けられている。他方の凹部５１ｆは、開口部の中央に底面部５１ａを有している。これにより混色性を有しつつ、指向性を制御した発光装置５０を提供することができる。   The opening of the recess 51c of the package 51 has a rectangular shape with a different size. The recess 51g having the larger opening has a bottom surface 51a-g, and the recess 51h having the smaller opening has a bottom 51a-h. The bottom portions 51a-g of the recesses 51g are provided at positions farther from the adjacent recesses 51h. The other recess 51f has a bottom surface 51a at the center of the opening. As a result, it is possible to provide the light emitting device 50 having the color mixing property and the directivity controlled.

パッケージ５１は、一対の正負の電極５３を有しており、凹部５１ｇ及び凹部５１ｈにそれぞれ載置された発光素子５２と電気的に接続されている。   The package 51 has a pair of positive and negative electrodes 53, and is electrically connected to the light emitting elements 52 mounted on the recess 51g and the recess 51h, respectively.

＜第６の実施の形態＞
図１２は、第６の実施の形態に係る発光装置を示す概略平面図である。図１３は、第６の実施の形態に係る発光装置を示す概略背面図である。以下、第６の実施の形態に係る発光装置について説明する。ただし、第１の実施の形態とほぼ同様の構成を採るところは説明を省略する。 <Sixth Embodiment>
FIG. 12 is a schematic plan view showing a light emitting device according to the sixth embodiment. FIG. 13 is a schematic rear view showing the light emitting device according to the sixth embodiment. The light emitting device according to the sixth embodiment will be described below. However, the description is omitted where the same configuration as that of the first embodiment is adopted.

第６の実施の形態に係る発光装置６０は、凹部６１ｃの配置、樹脂注入跡６１ｅの位置等を除いて、第１の実施の形態に係る発光装置１０とほぼ同様である。   The light emitting device 60 according to the sixth embodiment is substantially the same as the light emitting device 10 according to the first embodiment except for the arrangement of the recesses 61c, the position of the resin injection trace 61e, and the like.

パッケージ６１の凹部６１ｃの開口部は、楕円形状を形成している。パッケージ６１の一の対角線に対してほぼ平行になるように、楕円形状の凹部６１ｃを２個並べている。それぞれの凹部６１ｃの底面部６１ａは、凹部６１ｃの中央よりも外側になるように設けている。これにより発光装置１０の凹部１ｃよりも直径の長い凹部６１ｃを有する発光装置６０を提供することができる。よって同じ大きさのパッケージであっても配向角の広い発光装置６１を提供することができる。このパッケージ６１は、凹部６１ｃの裏面側より樹脂を注入することにより製造することができる。   The opening of the recess 61c of the package 61 has an elliptical shape. Two oval concave portions 61c are arranged so as to be substantially parallel to one diagonal line of the package 61. The bottom surface portion 61a of each recess 61c is provided outside the center of the recess 61c. Thereby, the light-emitting device 60 which has the recessed part 61c whose diameter is longer than the recessed part 1c of the light-emitting device 10 can be provided. Therefore, the light emitting device 61 having a wide orientation angle can be provided even if the packages have the same size. The package 61 can be manufactured by injecting resin from the back side of the recess 61c.

＜第７の実施の形態＞
図１４は、第７の実施の形態に係る発光装置を示す概略平面図である。図１５は、第７の実施の形態に係る発光装置を示す概略背面図である。以下、第７の実施の形態に係る発光装置について説明する。ただし、第１の実施の形態とほぼ同様の構成を採るところは説明を省略する。 <Seventh embodiment>
FIG. 14 is a schematic plan view showing a light emitting device according to the seventh embodiment. FIG. 15 is a schematic rear view showing the light emitting device according to the seventh embodiment. The light emitting device according to the seventh embodiment will be described below. However, the description is omitted where the same configuration as that of the first embodiment is adopted.

第７の実施の形態に係る発光装置７０は、凹部７１ｃの形状や配置、樹脂注入跡７１ｅの配置等を除いて、第１の実施の形態に係る発光装置１０とほぼ同様である。   The light emitting device 70 according to the seventh embodiment is substantially the same as the light emitting device 10 according to the first embodiment, except for the shape and arrangement of the recesses 71c, the arrangement of the resin injection trace 71e, and the like.

パッケージ７１の凹部７１ｃの開口部は、略直角二等辺三角形形状を形成している。略直角二等辺三角形形状の長辺を対向することにより、略正方形に近い形状を形成する。凹部７１ｃの底面部７１ａは、開口部の略直角二等辺三角形形状の相似形である。この場合、対向する２個の凹部７１ｃを開口部上方から切断する断面形状ＸＩＶ−ＸＩＶにおいて、凹部７１ｃ底面部７１ａの中心点を通る垂線と、凹部７１ｃ側面部７１ｂの一辺から延びる第１の直線と凹部７１ｃ側面部７１ｂの他の一部から延びる第２の直線との交点を通る垂線と、が相違する。この交点を通る垂線は、中心点を通る垂線よりも外側にある。これにより均一な混色光を得ることができる。   The opening of the recess 71c of the package 71 forms a substantially right-angled isosceles triangle shape. By facing the long sides of a substantially right-angled isosceles triangle, a shape close to a substantially square is formed. The bottom surface 71a of the recess 71c is a similar shape of an approximately right-angled isosceles triangle shape of the opening. In this case, in the cross-sectional shape XIV-XIV in which the two concave portions 71c facing each other are cut from above the opening, a perpendicular line passing through the center point of the bottom surface portion 71a of the concave portion 71c and a first straight line extending from one side of the side surface portion 71b of the concave portion 71c And the perpendicular line passing through the intersection of the second straight line extending from the other part of the side portion 71b of the recess 71c is different. The perpendicular passing through this intersection is outside the perpendicular passing through the center point. Thereby, uniform color mixture light can be obtained.

パッケージ７１は、凹部７１ｃ底面部７１ａの裏面側の樹脂注入口から樹脂を注入して成形している。   The package 71 is molded by injecting resin from a resin injection port on the back surface side of the bottom surface 71a of the recess 71c.

＜第８の実施の形態＞
図１６は、第８の実施の形態に係る発光装置を示す概略平面図である。図１７は、第８の実施の形態に係る発光装置を示す概略背面図である。以下、第８の実施の形態に係る発光装置について説明する。ただし、第１の実施の形態とほぼ同様の構成を採るところは説明を省略する。 <Eighth Embodiment>
FIG. 16 is a schematic plan view showing a light emitting device according to the eighth embodiment. FIG. 17 is a schematic rear view showing the light emitting device according to the eighth embodiment. The light emitting device according to the eighth embodiment will be described below. However, the description is omitted where the same configuration as that of the first embodiment is adopted.

第８の実施の形態に係る発光装置８０は、凹部８１ｃの形状や配置、樹脂注入跡８１ｅの配置、電極３の個数等を除いて、第１の実施の形態に係る発光装置１０とほぼ同様である。   The light emitting device 80 according to the eighth embodiment is substantially the same as the light emitting device 10 according to the first embodiment except for the shape and arrangement of the recess 81c, the arrangement of the resin injection trace 81e, the number of electrodes 3, and the like. It is.

パッケージ８１の凹部８１ｃの開口部は、凹部８１ｃを２個合わせた状態で略正六角形形状を形成している。１個の凹部８１ｃは、略正六角形を半分に切断した五角形形状を形成している。五角形形状の長辺を垂直方向に切断するように対向する２個の凹部８１ｃを開口部上方から切断する。凹部８１ｃの底面部８１ａは、開口部の五角形形状の相似形である。この場合、対向する２個の凹部８１ｃを開口部上方から切断する断面形状ＸＶＩ−ＸＶＩにおいて、凹部８１ｃ底面部８１ａの中心点を通る垂線と、凹部８１ｃ側面部８１ｂの一辺から延びる第１の直線と凹部８１ｃ側面部８１ｂの他の一部から延びる第２の直線との交点を通る垂線と、が相違する。この交点を通る垂線は、中心点を通る垂線よりも外側にある。これにより均一な混色光を得ることができる。   The opening of the recess 81c of the package 81 forms a substantially regular hexagonal shape with the two recesses 81c combined. One recess 81c forms a pentagonal shape obtained by cutting a substantially regular hexagon in half. Two opposing concave portions 81c are cut from above the opening so as to cut the long side of the pentagonal shape in the vertical direction. The bottom surface portion 81a of the concave portion 81c has a pentagonal similar shape of the opening. In this case, in the cross-sectional shape XVI-XVI in which the two opposing recesses 81c are cut from above the opening, a perpendicular passing through the center point of the bottom surface 81a of the recess 81c and a first straight line extending from one side of the side surface 81b of the recess 81c And the perpendicular line passing through the intersection of the second straight line extending from the other part of the side part 81b of the recess 81c is different. The perpendicular passing through this intersection is outside the perpendicular passing through the center point. Thereby, uniform color mixture light can be obtained.

パッケージ８１は、凹部８１ｃ底面部８１ａの裏面側の樹脂注入口から樹脂を注入して成形している。パッケージ８１の裏面は凹部８１ｃを並べた方向に凸部８１ｄを設けている。これにより発光素子８２をダイボンディングする際のパッケージ８１が撓むのを防止することができる。   The package 81 is molded by injecting resin from a resin injection port on the back surface side of the bottom surface portion 81a of the recess 81c. On the back surface of the package 81, a convex portion 81d is provided in the direction in which the concave portions 81c are arranged. Thereby, it is possible to prevent the package 81 from being bent when the light emitting element 82 is die-bonded.

電極３は、カソード電極を二個と、アノード電極を一個と有しており、カソード電極とアノード電極とは、対向する辺に配設されている。   The electrode 3 has two cathode electrodes and one anode electrode, and the cathode electrode and the anode electrode are arranged on opposite sides.

＜第９の実施の形態＞
図１８は、第９の実施の形態に係る発光装置を示す概略平面図である。図１９は、第９の実施の形態に係る発光装置を示す概略ＸＸＩ−ＸＸＩ断面図である。以下、第９の実施の形態に係る発光装置について説明する。ただし、第１の実施の形態とほぼ同様の構成を採るところは説明を省略する。 <Ninth embodiment>
FIG. 18 is a schematic plan view showing a light emitting device according to the ninth embodiment. FIG. 19 is a schematic XXI-XXI cross-sectional view showing a light emitting device according to the ninth embodiment. The light emitting device according to the ninth embodiment will be described below. However, the description is omitted where the same configuration as that of the first embodiment is adopted.

第９の実施の形態に係る発光装置９０は、凹部９１ｃの個数や配置、大きさ等を除いて、第１の実施の形態に係る発光装置１０とほぼ同様である。   The light emitting device 90 according to the ninth embodiment is substantially the same as the light emitting device 10 according to the first embodiment except for the number, arrangement, size, and the like of the recesses 91c.

パッケージ９１は、上向きに開口する凹部９１ｃを３個有している。凹部９１ｃの開口部は、楕円形状を形成している。３個の凹部９１ｃの開口部に関して重心９１ｊを持つ。３個の凹部９１ｃの長径は重心９１ｊから外側に拡がるように形成されている。凹部９１ｃを横断するように、この重心９１ｊから外側に延びるように線ＸＸＩ−ＸＸＩを引く。この重心９１ｊを通る線ＸＸＩ−ＸＸＩの断面形状において凹部９１ｃは対称である。これにより均一な混色光を得ることができる。ただし、ＸＸＩ−ＸＸＩの断面形状における凹部９１ｃの上面部９１ｉは必ずしも対称とならなくてもよい。配向に大きく影響を与える部分は凹部９１ｃだからである。それぞれの凹部９１ｃに青色、緑色、赤色に発光する発光素子９２を載置する。これにより種々の色味を有する発光装置９０を提供することができる。また、凹部９１ｃに配置する発光素子９２の個数を変更して、種々の色味及び明るさ変えることもできる。   The package 91 has three recesses 91c that open upward. The opening of the recess 91c has an elliptical shape. It has a center of gravity 91j with respect to the openings of the three recesses 91c. The long diameters of the three recesses 91c are formed so as to expand outward from the center of gravity 91j. A line XXI-XXI is drawn so as to extend outward from the center of gravity 91j so as to cross the recess 91c. In the cross-sectional shape of the line XXI-XXI passing through the center of gravity 91j, the recess 91c is symmetric. Thereby, uniform color mixture light can be obtained. However, the upper surface portion 91i of the concave portion 91c in the XXI-XXI cross-sectional shape is not necessarily symmetric. This is because the portion that greatly affects the orientation is the recess 91c. The light emitting elements 92 that emit blue, green, and red light are placed in the respective recesses 91c. Thereby, the light emitting device 90 having various colors can be provided. In addition, various colors and brightnesses can be changed by changing the number of the light emitting elements 92 arranged in the recess 91c.

＜実施例１＞
実施例１に係る発光装置について以下説明する。 <Example 1>
The light emitting device according to Example 1 will be described below.

図１は、実施例１に係る発光装置を示す概略平面図である。図２は、実施例１に係る発光装置を示す概略ＩＩ−ＩＩ断面図である。図３は、実施例１に係る発光装置を示す概略ＩＩＩ−ＩＩＩ断面図である。図４は、実施例１に係る発光装置の背面側を示す概略斜視図である。図２０は、実施例１に係る発光装置の測定方向を示す概略平面図である。図２１（ａ）〜（ｆ）は、実施例１に係る発光装置の指向特性を示す測定結果である。図２１（ａ）は、ＬＥＤ１及び２を発光させた状態で実施例１に係る発光装置を０°方向から指向特性を測定している。図２１（ｂ）は、ＬＥＤ１を発光させた状態で実施例１に係る発光装置を０°方向から指向特性を測定している。図２１（ｃ）は、ＬＥＤ２を発光させた状態で実施例１に係る発光装置を０°方向から指向特性を測定している。図２１（ｄ）は、ＬＥＤ１及び２を発光させた状態で実施例１に係る発光装置を９０°方向から指向特性を測定している。図２１（ｅ）は、ＬＥＤ１を発光させた状態で実施例１に係る発光装置を９０°方向から指向特性を測定している。図２１（ｆ）は、ＬＥＤ２を発光させた状態で実施例１に係る発光装置を９０°方向から指向特性を測定している。   FIG. 1 is a schematic plan view illustrating the light emitting device according to the first embodiment. FIG. 2 is a schematic II-II sectional view showing the light emitting device according to the first embodiment. FIG. 3 is a schematic III-III sectional view showing the light emitting device according to the first embodiment. FIG. 4 is a schematic perspective view illustrating the back side of the light emitting device according to the first embodiment. FIG. 20 is a schematic plan view illustrating the measurement direction of the light emitting device according to the first embodiment. 21A to 21F are measurement results showing directivity characteristics of the light emitting device according to Example 1. FIG. In FIG. 21A, the directivity characteristics of the light emitting device according to Example 1 are measured from the 0 ° direction in a state where the LEDs 1 and 2 emit light. FIG. 21B shows the directivity characteristics measured from the 0 ° direction of the light emitting device according to Example 1 with the LED 1 emitting light. FIG. 21C shows the directivity characteristics measured from the 0 ° direction of the light emitting device according to Example 1 with the LED 2 emitting light. FIG. 21D shows the directivity characteristics measured from the 90 ° direction of the light emitting device according to Example 1 with the LEDs 1 and 2 emitting light. FIG. 21E shows the directivity characteristics measured from the 90 ° direction of the light emitting device according to Example 1 with the LED 1 emitting light. FIG. 21F shows the directivity characteristics measured from the 90 ° direction of the light emitting device according to Example 1 with the LED 2 emitting light.

実施例１に係る発光装置１０は、発光素子２と、発光素子２を載置する底面部１ａと、底面部１ａから延びる側面部１ｂと、を持つ凹部１ｃを２個有するパッケージ１と、を有している。パッケージ１の凹部１ｃの底面部１ａには電極３を設けており、この電極３のマウント部３ａに発光素子２を搭載している。   A light emitting device 10 according to Example 1 includes a light emitting element 2, a package 1 having two recesses 1c each having a bottom surface portion 1a on which the light emitting element 2 is placed and a side surface portion 1b extending from the bottom surface portion 1a. Have. An electrode 3 is provided on the bottom surface portion 1 a of the recess 1 c of the package 1, and the light emitting element 2 is mounted on the mount portion 3 a of the electrode 3.

発光素子２は、ＧａＮ系のものであって、絶縁性のサファイア基板の上に、ｎ型の化合物半導体を積層し、その上にｐ型の化合物半導体を積層する。この発光素子２は、サファイア基板を電極３の上面に搭載している。化合物半導体によるｎ型層の上面に形成されたｎ側電極はワイヤ５により電極３に電気的に接続されている。また、化合物半導体によるｐ型層の上面に形成されたｐ側電極はワイヤ５により電極３に電気的に接続されている。電極３は、一対の正負の電極である。発光素子２は、４６０ｎｍ近傍に発光ピーク波長を有する青色光を発するものを使用する。   The light-emitting element 2 is a GaN-based device, in which an n-type compound semiconductor is stacked on an insulating sapphire substrate, and a p-type compound semiconductor is stacked thereon. In the light emitting element 2, a sapphire substrate is mounted on the upper surface of the electrode 3. An n-side electrode formed on the upper surface of the n-type layer made of a compound semiconductor is electrically connected to the electrode 3 by a wire 5. The p-side electrode formed on the upper surface of the p-type layer made of a compound semiconductor is electrically connected to the electrode 3 by a wire 5. The electrode 3 is a pair of positive and negative electrodes. The light emitting element 2 that emits blue light having an emission peak wavelength in the vicinity of 460 nm is used.

パッケージ１は、上向きに開口する凹部１ｃを形成している。凹部１ｃは、発光素子２を載置する底面部１ａと、底面部１ａから延びる側面部１ｂと、を持っている。パッケージ１は、凹部１ｃの開口部上方から切断した断面形状において、凹部１ｃの底面部１ａの中心点を通る垂線ａ−ａと、凹部１ｃの側面部１ｂの一辺から延びる第１の直線ｂ−ｂと凹部１ｃの側面部１ｂの他の一辺から延びる第２の直線ｃ−ｃとの交点を通る垂線ｄ−ｄと、が相違する。交点を通る垂線ｄ−ｄは、中心点を通る垂線ａ−ａよりも外側に配置する。隣接する２個の凹部１ｃの開口部上方から切断した断面形状が該２個の凹部１ｃの開口部を挟む垂線ｅ−ｅに関して対称とする。パッケージ１の裏面は、凹部１ｃの底面部１ａに設けるマウント部３ａから続く裏面側電極部３ｂを設けている。裏面側電極部３ｂの厚みと、パッケージ１の裏面側の凸部１ｄとは、発光装置１０を載置したときに同一の高さとする。電極３を配設した所定の形状を形成した型枠内に２箇所からパッケージ樹脂を注入する。注入後、パッケージ樹脂を硬化してパッケージ１を型枠から取り出す。パッケージ１の裏面側には、樹脂注入跡１ｅが２つある。パッケージ１の形状は直方体形状である。パッケージ１は縦３．０ｍｍ、横３．０ｍｍ、厚さ１．０ｍｍの大きさである。パッケージ１の材質は耐熱性の芳香族ナイロン（ＰＰＡ）を使用する。パッケージ１の凹部１ｃの開口部は、楕円形状を形成している。楕円形状の一の直径が他の一の直径の約二倍の長さである。楕円形状を２個並べることにより、略円形若しくは略正方形に近い形状を形成している。電極３は、発光素子２を載置するためのマウント部３ａ及びマウント部３ａから続く裏面側電極部３ｂとを有する。裏面側電極部３ｂは外部電極と接続するために設ける。電極３は銅合金に銀を電解メッキしている。発光素子２は、マウント部３ａ上にフェイスアップでダイボンディングして搭載している。透光性樹脂４は、エポキシ樹脂を用いる。透光性樹脂４中にセリウムで賦活されたイットリウム・アルミニウム・ガーネット系（いわゆるＹＡＧ系）の蛍光物質を混入している。具体的には、（Ｙ，Ｇｄ）３Ａｌ５Ｏ１２：Ｃｅである。 The package 1 has a recess 1c that opens upward. The concave portion 1c has a bottom surface portion 1a on which the light emitting element 2 is placed and a side surface portion 1b extending from the bottom surface portion 1a. The package 1 has a cross-sectional shape cut from above the opening of the recess 1c, and a perpendicular line aa passing through the center point of the bottom surface 1a of the recess 1c and a first straight line b- extending from one side of the side surface 1b of the recess 1c. b and a perpendicular line dd passing through the intersection of a second straight line cc extending from the other side of the side surface 1b of the recess 1c is different. A perpendicular line dd that passes through the intersection is arranged outside a perpendicular line aa that passes through the center point. The cross-sectional shape cut from above the openings of the two adjacent recesses 1c is symmetrical with respect to the perpendicular line ee that sandwiches the openings of the two recesses 1c. The back surface of the package 1 is provided with a back surface side electrode portion 3b continuing from a mount portion 3a provided on the bottom surface portion 1a of the recess 1c. The thickness of the back surface side electrode portion 3b and the convex portion 1d on the back surface side of the package 1 are set to the same height when the light emitting device 10 is placed. Package resin is injected from two places into a mold having a predetermined shape in which the electrodes 3 are disposed. After the injection, the package resin is cured and the package 1 is taken out from the mold. There are two resin injection traces 1 e on the back side of the package 1. The package 1 has a rectangular parallelepiped shape. The package 1 has a size of 3.0 mm in length, 3.0 mm in width, and 1.0 mm in thickness. The package 1 is made of heat-resistant aromatic nylon (PPA). The opening of the recess 1c of the package 1 has an elliptical shape. One diameter of the elliptical shape is about twice as long as the other diameter. By arranging two elliptical shapes, a substantially circular or nearly square shape is formed. The electrode 3 has a mount portion 3a for mounting the light emitting element 2 and a back surface side electrode portion 3b continuing from the mount portion 3a. The back surface side electrode part 3b is provided in order to connect with an external electrode. The electrode 3 is obtained by electroplating silver on a copper alloy. The light emitting element 2 is mounted on the mount portion 3a by face-up die bonding. As the translucent resin 4, an epoxy resin is used. The translucent resin 4 is mixed with an yttrium-aluminum-garnet-based (so-called YAG-based) fluorescent substance activated with cerium. Specifically, it is (Y, Gd) 3 Al 5 O 12 : Ce.

実施例１に係る発光装置１０の指向特性を測定した測定結果から、ＬＥＤを１個のみ発光させた場合と同様に、ＬＥＤを２個発光させた場合もピークが１のみであり、２個のＬＥＤから発する光が混合されていることを示す。また、ＬＥＤを２個発光させた場合でも、２個の凹部１ｃの開口部を挟む垂線ｅ−ｅ上に集光している。発光装置１０の半値幅は、ＬＥＤを２個発光させたとき０°方向では１１５°であり、９０°方向では１１８°である。ＬＥＤ１を発光させたとき０°方向では１１５°であり、９０°方向では１１８°である。ＬＥＤ２を発光させたとき０°方向では１１５°であり、９０°方向では１１８°である。これは３個の実施例１に係る発光装置１０を測定したときの平均値である。   From the measurement result of measuring the directional characteristics of the light emitting device 10 according to Example 1, the peak is only 1 when two LEDs are emitted, similarly to the case where only one LED emits light. It shows that the light emitted from the LED is mixed. Further, even when two LEDs are caused to emit light, the light is condensed on the perpendicular line ee sandwiching the openings of the two recesses 1c. The half width of the light emitting device 10 is 115 ° in the 0 ° direction and 118 ° in the 90 ° direction when two LEDs emit light. When the LED 1 emits light, it is 115 ° in the 0 ° direction and 118 ° in the 90 ° direction. When the LED 2 emits light, it is 115 ° in the 0 ° direction and 118 ° in the 90 ° direction. This is an average value when the three light emitting devices 10 according to Example 1 are measured.

本発明の発光装置は、照明器具、ディスプレイ、携帯電話のバックライト、カメラのフラッシュライト、動画照明補助光源などに用いられる発光装置並びにパッケージなどに利用することができる。   The light emitting device of the present invention can be used for a light emitting device, a package, and the like used for a lighting fixture, a display, a backlight of a mobile phone, a flashlight of a camera, an auxiliary light source for moving picture illumination.

第１の実施の形態に係る発光装置を示す概略平面図である。1 is a schematic plan view showing a light emitting device according to a first embodiment. 第１の実施の形態に係る発光装置を示す概略ＩＩ−ＩＩ断面図である。It is outline II-II sectional drawing which shows the light-emitting device which concerns on 1st Embodiment. 第１の実施の形態に係る発光装置を示す概略ＩＩＩ−ＩＩＩ断面図である。It is a schematic III-III sectional view showing the light emitting device concerning a 1st embodiment. 第１の実施の形態に係る発光装置の背面側を示す概略斜視図である。It is a schematic perspective view which shows the back side of the light-emitting device which concerns on 1st Embodiment. 第２の実施の形態に係る発光装置を示す概略平面図である。It is a schematic plan view which shows the light-emitting device which concerns on 2nd Embodiment. 第２の実施の形態に係る発光装置を示す概略ＶＩ−ＶＩ断面図である。It is general VI-VI sectional drawing which shows the light-emitting device which concerns on 2nd Embodiment. 第３の実施の形態に係る発光装置を示す概略平面図である。It is a schematic plan view which shows the light-emitting device which concerns on 3rd Embodiment. 第３の実施の形態に係る発光装置を示す概略ＶＩＩＩ−ＶＩＩＩ断面図である。It is a schematic VIII-VIII sectional drawing which shows the light-emitting device which concerns on 3rd Embodiment. 第４の実施の形態に係る発光装置を示す概略平面図である。It is a schematic plan view which shows the light-emitting device which concerns on 4th Embodiment. 第５の実施の形態に係る発光装置を示す概略平面図である。It is a schematic plan view which shows the light-emitting device which concerns on 5th Embodiment. 第５の実施の形態に係る発光装置を示す概略背面図である。It is a schematic rear view which shows the light-emitting device which concerns on 5th Embodiment. 第６の実施の形態に係る発光装置を示す概略平面図である。It is a schematic plan view which shows the light-emitting device which concerns on 6th Embodiment. 第６の実施の形態に係る発光装置を示す概略背面図である。It is a schematic rear view which shows the light-emitting device which concerns on 6th Embodiment. 第７の実施の形態に係る発光装置を示す概略平面図である。It is a schematic plan view which shows the light-emitting device which concerns on 7th Embodiment. 第７の実施の形態に係る発光装置を示す概略背面図である。It is a schematic rear view which shows the light-emitting device which concerns on 7th Embodiment. 第８の実施の形態に係る発光装置を示す概略平面図である。It is a schematic plan view which shows the light-emitting device which concerns on 8th Embodiment. 第８の実施の形態に係る発光装置を示す概略背面図である。It is a schematic rear view which shows the light-emitting device which concerns on 8th Embodiment. 第９の実施の形態に係る発光装置を示す概略平面図である。It is a schematic plan view which shows the light-emitting device which concerns on 9th Embodiment. 第９の実施の形態に係る発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the light-emitting device concerning 9th Embodiment. 実施例１に係る発光装置の測定方向を示す概略平面図である。3 is a schematic plan view showing a measurement direction of the light emitting device according to Example 1. FIG. （ａ）〜（ｆ）実施例１に係る発光装置の指向特性を示す測定結果である。(A)-(f) It is a measurement result which shows the directional characteristic of the light-emitting device which concerns on Example 1. FIG. 従来の半導体発光装置を示す概略断面図である。It is a schematic sectional drawing which shows the conventional semiconductor light-emitting device.

符号の説明Explanation of symbols

１ パッケージ
１ａ 底面部
１ｂ 側面部
１ｃ 凹部
１ｄ 凸部
１ｅ 樹脂注入跡
１ｉ 上面部
２ 発光素子
３ 電極
３ａ マウント部
３ｂ 裏面側電極部
４ 透光性樹脂
５ ワイヤ
１０、２０、３０、４０、５０、６０、７０、８０、９０ 発光装置
１００ 半導体発光装置
１０１ 基板
１０１ａ 凹部
１０１ｂ 凹部側面部の一辺
１０１ｃ 凹部側面部の他の一辺
１０２ 電極
１０２ａ ランド
１０２ｂ マウント部
１０３ 電極
１０３ａ ランド
１０４ 発光素子
１０５ ワイヤ
１０６ レンズ
１１０ 第１の直線
１１１ 第２の直線
１１２ 交点を通る垂線
１１３ 中心点を通る垂線
DESCRIPTION OF SYMBOLS 1 Package 1a Bottom surface part 1b Side surface part 1c Concave part 1d Convex part 1e Resin injection trace 1i Upper surface part 2 Light emitting element 3 Electrode 3a Mount part 3b Back surface side electrode part 4 Translucent resin 5 Wire 10, 20, 30, 40, 50, 60, 70, 80, 90 Light-emitting device 100 Semiconductor light-emitting device 101 Substrate 101a Recessed portion 101b One side 101c of the side surface of the recessed portion Other side 102 of the side surface portion of the recessed portion 102 Electrode 102a Land 102b Mount portion 103 Electrode 103a Land 104 Light emitting element 105 Wire 106 Lens 110 First straight line 111 Second straight line 112 Normal line 113 passing through the intersection point Normal line passing through the center point

Claims (17)

発光素子と、発光素子を載置する底面部と、該底面部から延びる側面部と、を持つ凹部を２個有するパッケージと、を有する発光装置であって、
前記パッケージは隣接する２個の凹部を有しており、
前記隣接する２個の凹部は、該２個の凹部の開口部上方から前記底面部に対する垂線に沿って切断した断面形状において、該２個の凹部底面部の中心点を通る前記底面部に対する垂線と、該２個の凹部側面部の一辺から延びる第１の直線と該２個の凹部側面部の他の一辺から延びる第２の直線との交点を通る前記底面部に対する垂線と、が相違する形状を有し、かつ該２個の凹部は該２個の凹部開口部を挟む前記底面部に対する垂線に関して対称であり、
前記交点を通る前記底面部に対する垂線は、前記中心点を通る前記底面部に対する垂線よりも外側に配置されることを特徴とする発光装置。 A light emitting device comprising: a light emitting element; a package having two recesses having a bottom surface portion on which the light emitting element is placed; a side surface portion extending from the bottom surface portion;
The package has two adjacent recesses;
The two adjacent concave portions are perpendicular to the bottom surface portion passing through the center point of the two concave bottom surface portions in a cross-sectional shape cut along a normal to the bottom surface portion from above the openings of the two concave portions. And a perpendicular to the bottom surface portion passing through the intersection of the first straight line extending from one side of the two concave side surfaces and the second straight line extending from the other side of the two concave side surfaces. The two recesses are symmetric with respect to a perpendicular to the bottom surface sandwiching the two recess openings,
The perpendicular to the bottom surface passing through the intersection is disposed outside the perpendicular to the bottom surface passing through the center point. 前記隣接する２個の凹部の開口部は楕円形状であって、前記楕円形状の一の直径が他の直径の二倍の長さであることを特徴とする請求項１に記載の発光装置。 2. The light emitting device according to claim 1 , wherein the openings of the two adjacent recesses are elliptical, and one diameter of the elliptical shape is twice as long as another diameter. 前記パッケージの裏面は、前記隣接する２個の凹部の開口部を挟む前記底面部に対する垂線に関して対称である２個の凸部と、前記隣接する２個の凹部の底面部から裏面に続く正負の電極を有しており、
前記２個の凸部の厚みは、前記正負の電極の厚みとは同一であることを特徴とする請求項１又は２に記載の発光装置。 The back surface of the package has two convex portions that are symmetric with respect to a perpendicular to the bottom surface portion sandwiching the openings of the two adjacent concave portions, and positive and negative signs that continue from the bottom surface portions of the two adjacent concave portions to the back surface. Have electrodes,
The light emitting device according to claim 1 or 2, wherein the thickness of the two convex portions is the same as the thickness of the positive and negative electrodes. 前記凹部は、透光性樹脂で発光素子を封止していることを特徴とする請求項１乃至３のいずれか一項に記載の発光装置。 The light-emitting device according to claim 1, wherein the concave portion seals a light-emitting element with a light-transmitting resin. 発光素子と、発光素子を載置する底面部と、該底面部から延びる側面部と、を持つ凹部を３個有するパッケージと、を有する発光装置であって、
前記パッケージは隣接する凹部を３個有しており、
前記隣接する３個の凹部のうち中央の凹部は、該凹部の開口部上方から前記底面部に対する垂線に沿って切断した断面形状において、該凹部側面部と該凹部上面部との間の第１の角度と、該凹部を挟んで向かい合う該凹部側面部と該凹部上面部との間の第２の角度とは同じ角度であり、
前記隣接する３個の凹部のうち両端の凹部は、該凹部の開口部上方から切断した断面形状において、該凹部側面部と該凹部上面部との間の第１の角度と、該凹部を挟んで向かい合う該凹部側面部と該凹部上面部との間の第２の角度とは相違し、
かつ該両端の凹部は該中央の凹部の底面の中心点を通る前記底面部に対する垂線に対して対称であり、
かつ該両端の凹部側面部の一辺から延びる第１の直線と該両端の凹部側面部の他の一辺から延びる第２の直線との交点を通る前記底面部に対する垂線は、該両端の凹部の底面部の中心点を通る前記底面部に対する垂線よりも外側に配置されることを特徴とする発光装置。 A light emitting device comprising: a light emitting element; a package having three recesses having a bottom surface portion on which the light emitting element is placed; a side surface portion extending from the bottom surface portion;
The package has three adjacent recesses,
Of the three adjacent recesses, the central recess is a first portion between the recess side surface and the recess upper surface in a cross-sectional shape cut along a perpendicular to the bottom surface from above the opening of the recess. And the second angle between the concave side surface and the concave upper surface facing each other across the concave is the same angle,
Of the three adjacent recesses, the recesses at both ends have a first angle between the side surface portion of the recess and the upper surface portion of the recess, and the recess between the recesses in a cross-sectional shape cut from above the opening of the recess. The second angle between the side surface portion of the concave portion and the upper surface portion of the concave portion facing each other is different,
And the concave portions at both ends are symmetric with respect to a perpendicular to the bottom surface portion passing through the center point of the bottom surface of the central concave portion,
The perpendicular to the bottom surface passing through the intersection of the first straight line extending from one side of the concave side surface portion at both ends and the second straight line extending from the other side of the concave side surface portion at both ends is the bottom surface of the concave portion at both ends. A light emitting device, wherein the light emitting device is disposed outside a perpendicular to the bottom surface portion passing through a center point of the portion . 前記パッケージの裏面は、前記隣接する３個の凹部の開口部を挟む前記底面部に対する垂線に関して対称である３個の凸部と、
前記隣接する３個の凹部の底面部から裏面に続く正負の電極を有しており、
前記３個の凸部の厚みと前記正負の電極の厚みとは同一であることを特徴とする請求項５に記載の発光装置。 The back surface of the package has three convex portions that are symmetrical with respect to a perpendicular to the bottom surface portion sandwiching the openings of the three adjacent concave portions, and
Having positive and negative electrodes from the bottom surface of the three adjacent recesses to the back surface;
6. The light emitting device according to claim 5, wherein a thickness of the three convex portions and a thickness of the positive and negative electrodes are the same. 前記凹部は、透光性樹脂で発光素子を封止していることを特徴とする請求項５又は６に記載の発光装置。 The light emitting device according to claim 5, wherein the concave portion seals the light emitting element with a translucent resin. 発光素子と、発光素子を載置する底面部と、該底面部から延びる側面部と、を持つ凹部を複数個有するパッケージと、を有する発光装置であって、
前記パッケージは隣接する凹部を複数個有しており、
前記隣接する複数個の凹部は、該複数個の凹部の開口部上方から前記底面部に対する垂線に沿って切断した断面形状において、該複数個の凹部底面部の中心点を通る前記底面部に対する垂線と、該複数個の凹部側面部の一辺から延びる第１の直線と該複数個の凹部側面部の他の一辺から延びる第２の直線との交点を通る前記底面部に対する垂線と、が相違する形状を有し、
かつ該複数個の凹部は該複数個の凹部開口部の重心を通る前記底面部に対する垂線に関して対称であり、
前記交点を通る前記底面部に対する垂線は、前記中心点を通る前記底面部に対する垂線よりも外側に配置されることを特徴とする発光装置。 A light emitting device having a light emitting element, a bottom surface portion on which the light emitting element is placed, a side surface portion extending from the bottom surface portion, and a package having a plurality of recesses,
The package has a plurality of adjacent recesses,
A plurality of recesses for the neighboring, in cross section taken along the perpendicular line from the opening above of the plurality of recesses against the bottom surface portion, the normal to the bottom section passing through the center point of the several recesses bottom portion plurality And a perpendicular to the bottom surface portion passing through an intersection of a first straight line extending from one side of the plurality of concave side surfaces and a second straight line extending from the other side of the plurality of concave side surfaces. Has a shape,
And the plurality of recesses are symmetric with respect to a perpendicular to the bottom surface passing through the center of gravity of the plurality of recess openings,
The perpendicular to the bottom surface passing through the intersection is disposed outside the perpendicular to the bottom surface passing through the center point. 発光素子を載置する底面部と、該底面部から延びる側面部と、を持つ凹部を２個有するパッケージであって、
前記パッケージは隣接する２個の凹部を有しており、
前記隣接する２個の凹部は、該２個の凹部の開口部上方から前記底面部に対する垂線に沿って切断した断面形状において、該２個の凹部底面部の中心点を通る前記底面部に対する垂線と、該２個の凹部側面部の一辺から延びる第１の直線と該２個の凹部側面部の他の一辺から延びる第２の直線との交点を通る前記底面部に対する垂線と、が相違する形状を有し、かつ該２個の凹部は該２個の凹部開口部を挟む前記底面部に対する垂線に関して対称であり、
前記交点を通る前記底面部に対する垂線は、前記中心点を通る前記底面部に対する垂線よりも外側に配置されることを特徴とするパッケージ。 A package having two recesses having a bottom surface portion on which the light emitting element is placed and a side surface portion extending from the bottom surface portion;
The package has two adjacent recesses;
The two adjacent concave portions are perpendicular to the bottom surface portion passing through the center point of the two concave bottom surface portions in a cross-sectional shape cut along a normal to the bottom surface portion from above the openings of the two concave portions. And a perpendicular to the bottom surface portion passing through the intersection of the first straight line extending from one side of the two concave side surfaces and the second straight line extending from the other side of the two concave side surfaces. The two recesses are symmetric with respect to a perpendicular to the bottom surface sandwiching the two recess openings,
The normal line with respect to the bottom face part passing through the intersection is arranged outside the perpendicular line with respect to the bottom face part passing through the center point. 前記隣接する２個の凹部の開口部は楕円形状であって、前記楕円形状の一の直径が他の直径の二倍の長さであることを特徴とする請求項９に記載のパッケージ。 10. The package according to claim 9 , wherein the openings of the two adjacent recesses are elliptical, and one diameter of the elliptical shape is twice as long as another diameter. 前記パッケージの裏面は、前記隣接する２個の凹部の開口部を挟む前記底面部に対する垂線に関して対称である２個の凸部と、前記隣接する２個の凹部の底面部から裏面に続く正負の電極を有し、
前記２個の凸部の厚みと前記正負の電極の厚みとは同一であることを特徴とする請求項９又は１０に記載のパッケージ。 The back surface of the package has two convex portions that are symmetric with respect to a perpendicular to the bottom surface portion sandwiching the openings of the two adjacent concave portions, and positive and negative signs that continue from the bottom surface portions of the two adjacent concave portions to the back surface. Having electrodes,
The package according to claim 9 or 10, wherein a thickness of the two convex portions and a thickness of the positive and negative electrodes are the same. 発光素子を載置する底面部と、該底面部から延びる側面部と、を持つ凹部を３個有するパッケージであって、
前記パッケージは隣接する凹部を３個有しており、
前記隣接する３個の凹部のうち中央の凹部は、該凹部の開口部上方から前記底面部に対する垂線に沿って切断した断面形状において、該凹部側面部と該凹部上面部との間の第１の角度と、該凹部を挟んで向かい合う該凹部側面部と該凹部上面部との間の第２の角度とは同じ角度であり、
前記隣接する３個の凹部のうち両端の凹部は、該凹部の開口部上方から切断した断面形状において、該凹部側面部と該凹部上面部との間の第１の角度と、該凹部を挟んで向かい合う該凹部側面部と該凹部上面部との間の第２の角度とは相違し、
かつ該両端の凹部は該中央の凹部の底面の中心点を通る前記底面部に対する垂線に対して対称であり、
かつ該両端の凹部側面部の一辺から延びる第１の直線と該両端の凹部側面部の他の一辺から延びる第２の直線との交点を通る前記底面部に対する垂線は、該両端の凹部の底面部の中心点を通る前記底面部に対する垂線よりも外側に配置されることを特徴とするパッケージ。 A package having three recesses having a bottom surface portion on which the light emitting element is placed and a side surface portion extending from the bottom surface portion;
The package has three adjacent recesses,
Of the three adjacent recesses, the central recess is a first portion between the recess side surface and the recess upper surface in a cross-sectional shape cut along a perpendicular to the bottom surface from above the opening of the recess. And the second angle between the concave side surface and the concave upper surface facing each other across the concave is the same angle,
Of the three adjacent recesses, the recesses at both ends have a first angle between the side surface portion of the recess and the upper surface portion of the recess, and the recess between the recesses in a cross-sectional shape cut from above the opening of the recess. The second angle between the side surface portion of the concave portion and the upper surface portion of the concave portion facing each other is different,
And the concave portions at both ends are symmetric with respect to a perpendicular to the bottom surface portion passing through the center point of the bottom surface of the central concave portion,
The perpendicular to the bottom surface passing through the intersection of the first straight line extending from one side of the concave side surface portion at both ends and the second straight line extending from the other side of the concave side surface portion at both ends is the bottom surface of the concave portion at both ends. A package, wherein the package is disposed outside a perpendicular to the bottom surface portion passing through a center point of the portion . 前記パッケージの裏面は、前記隣接する３個の凹部の開口部を挟む前記底面部に対する垂線に関して対称である３個の凸部と、前記隣接する３個の凹部の底面部から裏面に続く正負の電極を有しており、
前記３個の凸部の厚みと前記正負の電極の厚みとは同一であることを特徴とする請求項１２に記載のパッケージ。 The back surface of the package has three convex portions that are symmetrical with respect to the perpendicular to the bottom surface portion that sandwiches the openings of the three adjacent concave portions, and positive and negative that continues from the bottom surface portion of the three adjacent concave portions to the back surface. Have electrodes,
The package according to claim 12, wherein a thickness of the three convex portions and a thickness of the positive and negative electrodes are the same. 発光素子を載置する底面部と、該底面部から延びる側面部と、を持つ凹部を複数個有するパッケージであって、
前記パッケージは隣接する凹部を複数個有しており、
前記隣接する複数個の凹部は、該複数個の凹部の開口部上方から前記底面部に対する垂線に沿って切断した断面形状において、該複数個の凹部底面部の中心点を通る前記底面部に対する垂線と、該複数個の凹部側面部の一辺から延びる第１の直線と該複数個の凹部側面部の他の一辺から延びる第２の直線との交点を通る前記底面部に対する垂線と、が相違する形状を有し、かつ該複数個の凹部は該複数個の凹部開口部の重心を通る前記底面部に対する垂線に関して対称であり、前記交点を通る前記底面部に対する垂線は、前記中心点を通る前記底面部に対する垂線よりも外側に配置されることを特徴とするパッケージ。 A package having a plurality of recesses having a bottom surface portion on which the light emitting element is placed and a side surface portion extending from the bottom surface portion;
The package has a plurality of adjacent recesses,
A plurality of recesses for the neighboring, in cross section taken along the perpendicular line from the opening above of the plurality of recesses against the bottom surface portion, the normal to the bottom section passing through the center point of the several recesses bottom portion plurality And a perpendicular to the bottom surface portion passing through an intersection of a first straight line extending from one side of the plurality of concave side surfaces and a second straight line extending from the other side of the plurality of concave side surfaces. shaped, and the plurality several recesses is symmetrical with respect to the normal to the bottom section passing through the center of gravity of several recesses opening plurality, the normal to the bottom surface portion through said intersection, said passing through the center point A package characterized in that the package is disposed outside a perpendicular to the bottom surface . 発光素子を載置するための底面部と、該底面部から延びる側面部と、該底面部の少なくとも一部に配設され、少なくとも一部が該底面部で露出する正負の電極と、を持つ凹部を隣接するように２個有するパッケージの製造方法であって、
該隣接する２個の凹部は、該２個の凹部の開口部上方から前記底面部に対する垂線に沿って切断した断面形状において、該２個の凹部底面部の中心点を通る前記底面部に対する垂線と、該２個の凹部側面部の一辺から延びる第１の直線と該２個の凹部側面部の他の一辺から延びる第２の直線との交点を通る前記底面部に対する垂線と、が相違する形状を有し、
かつ該２個の凹部は該２個の凹部開口部を挟む前記底面部に対する垂線に関して対称であり、
前記交点を通る前記底面部に対する垂線は、前記中心点を通る前記底面部に対する垂線よりも外側に配置されるように成型された型枠内に樹脂を注入する工程と、
該樹脂を硬化する工程と、
該型枠を取り外す工程と、有することを特徴とするパッケージの製造方法。 A bottom surface portion on which the light emitting element is placed; a side surface portion extending from the bottom surface portion; and a positive and negative electrode that is disposed on at least a part of the bottom surface portion and at least a part of which is exposed on the bottom surface portion. A method of manufacturing a package having two recesses adjacent to each other,
The two adjacent concave portions are perpendicular to the bottom surface portion passing through the center point of the two concave bottom surface portions in a cross-sectional shape cut along a vertical line to the bottom surface portion from above the openings of the two concave portions. And a perpendicular to the bottom surface portion passing through the intersection of the first straight line extending from one side of the two concave side surfaces and the second straight line extending from the other side of the two concave side surfaces. Has a shape,
And the two recesses are symmetric with respect to a perpendicular to the bottom surface sandwiching the two recess openings,
A step of injecting resin into a mold formed so that the perpendicular to the bottom surface portion passing through the intersection point is disposed outside the perpendicular to the bottom surface portion passing through the center point; and
Curing the resin;
A step of removing the mold, and a method of manufacturing a package, comprising: 発光素子を載置するための底面部と、該底面部から延びる側面部と、該底面部の少なくとも一部に配設され、少なくとも一部が該底面部で露出する正負の電極と、を持つ凹部を隣接するように３個有するパッケージの製造方法であって、
前記隣接する３個の凹部のうち中央の凹部は、該凹部の開口部上方から前記底面部に対する垂線に沿って切断した断面形状において、該凹部側面部と該凹部上面部との間の第１の角度と、該凹部を挟んで向かい合う該凹部側面部と該凹部上面部との間の第２の角度とは同じ角度であり、
前記隣接する３個の凹部のうち両端の凹部は、該凹部の開口部上方から切断した断面形状において、該凹部側面部と該凹部上面部との間の第１の角度と、該凹部を挟んで向かい合う該凹部側面部と該凹部上面部との間の第２の角度とは相違し、
かつ該両端の凹部は該中央の凹部の底面の中心点を通る前記底面部に対する垂線に対して対称であり、
かつ該両端の凹部側面部の一辺から延びる第１の直線と該両端の凹部側面部の他の一辺から延びる第２の直線との交点を通る前記底面部に対する垂線は、該両端の凹部の底面部の中心点を通る前記底面部に対する垂線よりも外側に配置されるように成型された型枠内に樹脂を注入する工程と、
該樹脂を硬化する工程と、
該型枠を取り外す工程と、有することを特徴とするパッケージの製造方法。 A bottom surface portion on which the light emitting element is placed; a side surface portion extending from the bottom surface portion; and a positive and negative electrode that is disposed on at least a part of the bottom surface portion and at least a part of which is exposed on the bottom surface portion. A method of manufacturing a package having three recesses adjacent to each other,
Of the three adjacent recesses, the central recess is a first portion between the recess side surface and the recess upper surface in a cross-sectional shape cut along a perpendicular to the bottom surface from above the opening of the recess. And the second angle between the concave side surface and the concave upper surface facing each other across the concave is the same angle,
Of the three adjacent recesses, the recesses at both ends have a first angle between the side surface portion of the recess and the upper surface portion of the recess, and the recess between the recesses in a cross-sectional shape cut from above the opening of the recess. The second angle between the side surface portion of the concave portion and the upper surface portion of the concave portion facing each other is different,
And the concave portions at both ends are symmetric with respect to a perpendicular to the bottom surface portion passing through the center point of the bottom surface of the central concave portion,
The perpendicular to the bottom surface passing through the intersection of the first straight line extending from one side of the concave side surface portion at both ends and the second straight line extending from the other side of the concave side surface portion at both ends is the bottom surface of the concave portion at both ends. Injecting resin into a mold that is molded so as to be placed outside the perpendicular to the bottom portion passing through the center of the part;
Curing the resin;
A step of removing the mold, and a method of manufacturing a package, comprising: 発光素子を載置するための底面部と、該底面部から延びる側面部と、該底面部の少なくとも一部に配設され、少なくとも一部が該底面部で露出する正負の電極と、を持つ凹部を隣接するように複数個有するパッケージの製造方法であって、
該隣接する複数個の凹部は、該複数個の凹部の開口部上方から前記底面部に対する垂線に沿って切断した断面形状において、該複数個の凹部底面部の中心点を通る前記底面部に対する垂線と、該複数個の凹部側面部の一辺から延びる第１の直線と該複数個の凹部側面部の他の一辺から延びる第２の直線との交点を通る前記底面部に対する垂線と、が相違する形状を有し、
かつ該複数個の凹部は該複数個の凹部開口部の重心を通る前記底面部に対する垂線に関して対称であり、
前記交点を通る前記底面部に対する垂線は、前記中心点を通る前記底面部に対する垂線よりも外側に配置されるように成型された型枠内に樹脂を注入する工程と、
該樹脂を硬化する工程と、
該型枠を取り外す工程と、有することを特徴とするパッケージの製造方法。 A bottom surface portion on which the light emitting element is placed; a side surface portion extending from the bottom surface portion; and a positive and negative electrode that is disposed on at least a part of the bottom surface portion and at least a part of which is exposed on the bottom surface portion. A method of manufacturing a package having a plurality of recesses adjacent to each other,
The plurality of adjacent recesses are perpendicular to the bottom surface passing through the center point of the plurality of recess bottom surfaces in a cross-sectional shape cut along the normal to the bottom surface from above the openings of the plurality of recesses. And a perpendicular to the bottom surface portion passing through an intersection of a first straight line extending from one side of the plurality of concave side surfaces and a second straight line extending from the other side of the plurality of concave side surfaces. Has a shape,
And the plurality of recesses are symmetric with respect to a perpendicular to the bottom surface passing through the center of gravity of the plurality of recess openings,
A step of injecting resin into a mold formed so that the perpendicular to the bottom surface portion passing through the intersection point is disposed outside the perpendicular to the bottom surface portion passing through the center point; and
Curing the resin;
A step of removing the mold, and a method of manufacturing a package, comprising:
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