JP6477328B2 - Package manufacturing method, light emitting device manufacturing method, package, and light emitting device - Google Patents

Description

  The present invention relates to a package manufacturing method, a light emitting device manufacturing method, a package, and a light emitting device.

Conventionally, a package including a lead frame is manufactured by injecting a thermoplastic resin from the back side (see, for example, Patent Documents 1 and 2). And after hardening resin, a lead frame is bent and the light-emitting device is formed.
In addition, it is known that a resin is flown into a cavity for each lead frame of a molding die and cured, and a package is formed by molding a resin molded body integrally with each lead frame ( For example, see Patent Document 3). Further, in the package manufacturing method described in Patent Document 3, the lead frame is bent in advance before being placed in the molding die.

JP 2010-186896 A JP 2013-051296 A JP 2013-077783 A

  In the light emitting devices described in Patent Documents 1 and 2, since the resin is injected from the back side of the lead frame, the thickness of the package is increased. Further, the thickness of a light emitting device using such a package has also been increased. Furthermore, in the conventional light emitting device, it took time and effort to perform processing such as bending the lead frame of the package.

  Therefore, an embodiment according to the present invention provides a manufacturing method for manufacturing a package and a light emitting device thinly and easily, and a thin package and a light emitting device.

  A method of manufacturing a package according to an embodiment of the present disclosure includes a step of preparing a lead frame having a first electrode and a second electrode different from the first electrode in a region where a package is to be formed, A step of sandwiching the first electrode and the second electrode between an upper mold and a lower mold of a mold mold divided vertically, and the first electrode and the second electrode are sandwiched A step of injecting a first resin into the mold die from an injection port formed next to the first electrode outside a region where a package of the mold die is to be formed; A step of curing or solidifying the first resin, and a step of cutting off the injection trace of the inlet of the first resin from the side of the first electrode after the first resin is cured or solidified. Have.

  Further, the manufacturing method of the light emitting device according to the embodiment of the present disclosure includes all the steps in the manufacturing method of the package, and after the first resin is cured or solidified and before the step of removing the injection trace or And a step of mounting a light emitting element on the first electrode or the second electrode at any later timing.

  A package according to an embodiment of the present disclosure fixes a first electrode, a second electrode having a polarity different from that of the first electrode, the first electrode and the second electrode, and at least one of a bottom surface. A wall portion that constitutes a side wall of a bottomed recess formed of the first electrode and the second electrode, and a flange portion that protrudes outward from the wall portion in plan view, At least one of the first electrode and the second electrode has an outer lead portion that protrudes outward from the wall portion in plan view, and the outer lead portion has a second recessed portion at the tip, The flange portion is provided on both sides of the outer lead portion in a plan view with the same thickness as the outer lead portion, and the flange portion is not provided in the second recess portion.

  A light emitting device according to an embodiment of the present disclosure includes the package and a light emitting element placed on at least one of the first electrode and the second electrode of the package.

In the manufacturing method of the package and the light emitting device according to the embodiment of the present disclosure, the resin injection port is provided at a position where it is not required after the resin is cured or solidified, so that the resin is injected and cured or solidified for cutting. Thus, a thin package and a light emitting device can be easily manufactured.
Further, the package and the light emitting device according to the embodiment of the present disclosure can be made thinner than the conventional one.

It is a figure which shows the outline of the package which concerns on embodiment, and is a perspective view which shows the whole package. It is a figure which shows the outline of the package which concerns on embodiment, and is a top view of a package. It is a figure which shows the outline of the package which concerns on embodiment, and is the III-III cross-sectional arrow view of FIG. It is a figure which shows the outline of the package which concerns on embodiment, and is a bottom view of a package. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is a top view of a lead frame. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is VI-VI cross-sectional arrow view of FIG. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is sectional drawing which shows typically arrangement | positioning of the lead frame and mold metal mold | die in the position corresponding to the XX line of FIG. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is sectional drawing which shows typically arrangement | positioning of the lead frame and mold metal in the position corresponding to the XI-XI line of FIG. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is a top view of the lead frame pinched | interposed with the upper metal mold | die and the lower metal mold | die. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is XX sectional arrow directional view of FIG. 9 after 1st resin injection | pouring. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is the XI-XI cross-sectional arrow view of FIG. 9 after 1st resin injection | pouring. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is a schematic plan view of a package. It is a figure which shows the outline of the manufacturing process of the package which concerns on embodiment, and is a XIII-XIII cross-sectional arrow view of FIG. It is a figure which shows the outline of the light-emitting device which concerns on embodiment, and is a perspective view which shows the whole light-emitting device. It is a figure which shows the outline of the package which concerns on other embodiment, and is a perspective view which shows the whole package. It is a figure which shows the outline of the manufacturing process of the package which concerns on other embodiment, and is a top view of a lead frame. It is a figure which shows the outline of the manufacturing process of the package which concerns on other embodiment, and is a top view of the lead frame pinched | interposed by the upper metal mold | die and the lower metal mold | die. It is a figure which shows the outline of the manufacturing process of the package which concerns on other embodiment, and is a XVIII-XVIII cross-sectional arrow view of FIG. 17 after 1st resin injection | pouring. It is a figure which shows the outline of the manufacturing process of the package which concerns on other embodiment, and is the XIX-XIX cross-sectional arrow view of FIG. 17 after 1st resin injection | pouring. It is a figure which shows the outline of the light-emitting device which concerns on other embodiment, and is a perspective view which shows the whole light-emitting device.

  Hereinafter, a manufacturing method of a package and a manufacturing method of a light-emitting device, and a package and a light-emitting device showing an example of an embodiment will be described. Note that the drawings referred to in the following description schematically show the present embodiment, and therefore, scales, intervals, positional relationships, and the like of each member are exaggerated, or some of the members are not shown. There may be. Moreover, in the following description, the same name and code | symbol indicate the same or the same member in principle, and detailed description is abbreviate | omitted suitably.

<Configuration of Package 100>
This will be described with reference to the drawings. FIG. 1 is a diagram schematically illustrating a package according to the embodiment, and is a perspective view illustrating the entire package. FIG. 2 is a diagram schematically illustrating the package according to the embodiment, and is a top view of the package. FIG. 3 is a diagram schematically illustrating the package according to the embodiment, and is a cross-sectional view taken along the line III-III in FIG. 2. FIG. 4 is a diagram schematically illustrating the package according to the embodiment, and is a bottom view of the package.
The package 100 has a substantially rectangular parallelepiped shape as a whole, and is formed in a cup shape having a recess (cavity) on the upper surface. Further, the package 100 includes a first electrode 10, a second electrode 20, and a resin molded body 30 made of the first resin.

  The first electrode 10 includes a first outer lead portion 11 and a first inner lead portion 12. The first outer lead portion 11 refers to a lead portion located outside the wall portion 31 of the resin molded body 30. The shape of the first outer lead portion 11 is rectangular in a plan view, but the shape is not limited to this, and may be partially cutout, recessed, or provided with a through hole.

  The first inner lead portion 12 refers to a lead portion located inside the wall portion 31 of the resin molded body 30 and below the wall portion 31. The shape of the first inner lead portion 12 is substantially rectangular in a plan view, but the shape is not limited to this, and may be partially cutout, recessed, or provided with a through hole. In the back view of the package 100, the width W1 of the first outer lead portion 11 exposed from the first resin is the width W2 of the first inner lead portion 12 exposed from the first resin here. It is formed shorter.

  The second electrode 20 includes a second outer lead portion 21 and a second inner lead portion 22. The second outer lead portion 21 is a lead portion located outside the wall portion 31 of the resin molded body 30. The shape of the second outer lead portion 21 is rectangular in a plan view, but the shape is not limited to this, and a portion having a partially cutout, a dent, or a through hole may be used.

  The second inner lead portion 22 is a lead portion located inside the wall portion 31 of the resin molded body 30 and below the wall portion 31. The shape of the second inner lead portion 22 is substantially rectangular in a plan view, but the shape is not limited to this, and may be a partially cutout, recessed, or through hole. In the rear view of the package 100, the width W1 of the second outer lead portion 21 exposed from the first resin is the width W2 of the second inner lead portion 22 exposed from the first resin here. It is formed shorter.

  The first electrode 10 and the second electrode 20 are formed on the bottom surface of the package 100 so as to be exposed to the outside. The outside of the bottom surface of the package 100 is a surface on the side mounted on an external substrate. The first electrode 10 and the second electrode 20 are spaced apart from each other, and a resin molded body 30 is interposed between the first electrode 10 and the second electrode 20. When used as a light-emitting device, the first electrode 10 and the second electrode 20 correspond to an anode electrode and a cathode electrode, respectively, meaning that the conductivity is different.

  The length, width, and thickness of the first electrode 10 and the second electrode 20 are not particularly limited, and can be appropriately selected according to the purpose and application. The material of the first electrode 10 and the second electrode 20 is preferably, for example, copper or a copper alloy, and the outermost surface thereof is preferably covered with a metal material having a high reflectance such as, for example, silver or aluminum. .

  The resin molded body 30 includes a wall portion 31 and a flange portion 32. The wall portion 31 has four sides that are rectangular on the first electrode 10 and the second electrode 20. Further, the wall portion 31 is formed so as to sandwich the first electrode 10 between two opposing sides of the rectangle, and is formed so as to sandwich the second electrode 20. Thereby, the wall part 31 can fix the first electrode 10 and the second electrode 20.

  The wall 31 is formed so as to form a rectangular recess in plan view, and the shape thereof is formed in a rectangular ring shape in plan view. The height, length, and width of the wall portion 31 are not particularly limited, and can be appropriately selected according to the purpose and application.

  The flange portion 32 is formed adjacent to the first outer lead portion 11 or the second outer lead portion 21, and four flange portions 32 are formed here in plan view. The flange portion 32 protrudes laterally from the wall portion 31 and is formed with the same length and the same thickness as the first outer lead portion 11 and the second outer lead portion 21. The first outer lead portion 11, the second outer lead portion 21, and the flange portion 32 are formed flush with each other. As will be described later, in the present embodiment, since the first resin injection port is provided next to the first electrode 10 which is unnecessary after the first resin is cured or solidified, the first resin is injected. Then, when the material is cut off after being cured or solidified, one flange 32 is left next to the first electrode 10. Although the resin molding 30 is provided with the four collar parts 32, the number should just be one or more. When the flange portion is not provided, the outer surface of the wall portion 31 is formed in a planar manner from the upper surface to the bottom surface.

Examples of the material of the resin molded body 30 include a thermoplastic resin and a thermosetting resin.
In the case of a thermoplastic resin, for example, polyphthalamide resin, liquid crystal polymer, polybutylene terephthalate (PBT), unsaturated polyester, and the like can be used.
In the case of a thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used.
In order to efficiently reflect light on the inner peripheral surface of the wall portion 31 of the resin molded body 30, the resin molded body 30 may contain a light reflecting member. The light reflecting member is a material having a high light reflectance such as a white filler such as titanium oxide, glass filler, silica, alumina, and zinc oxide. The reflectance of visible light is preferably 70% or more, or 80% or more. In particular, the reflectance is preferably 70% or more, or 80% or more in the wavelength region emitted from the light emitting element. The blending amount of titanium oxide or the like may be 5% by weight or more and 50% by weight or less, but is preferably 10% by weight to 30% by weight, but is not limited thereto.

  As described above, the package 100 can reduce the thickness of the package because the resin inlet is provided at a position where it is not required after the resin is cured or solidified. In particular, the thickness on the back side of the package, that is, the thickness of the flange 32, the first electrode 10, the second electrode 20, and the like of the resin molded body 30 can be made thinner than before. For this reason, the heat dissipation at the time of operation | movement of the light emitting element etc. which are mounted in the package 100 can be improved.

<Method for Manufacturing Package 100>
Next, a method for manufacturing the package 100 will be described with reference to FIGS. FIG. 5 is a plan view of the lead frame. 6 is a sectional view taken along the line VI-VI in FIG. FIG. 7 is a cross-sectional view schematically showing the arrangement of the lead frame and the mold at a position corresponding to line XX in FIG. 8 is a cross-sectional view schematically showing the arrangement of the lead frame and the mold at a position corresponding to the line XI-XI in FIG. FIG. 9 is a top view of the lead frame sandwiched between the upper mold and the lower mold. FIG. 10 is a cross-sectional view taken along the line XX of FIG. 9 after the first resin injection. 11 is a cross-sectional view taken along the line XI-XI in FIG. 9 after the first resin injection. FIG. 12 is a schematic plan view of the package. 13 is a sectional view taken along the line XIII-XIII in FIG.
The package manufacturing method of the present embodiment includes the following steps (1) to (5).

(1) Prepare a lead frame.
In the step (1), a lead frame 5 on a flat plate with a part cut away is prepared. The lead frame 5 includes a first electrode 10 and a second electrode 20 different from the first electrode 10 in a package formation planned region 600. The first electrode 10 and the second electrode 20 A gap is provided between the electrode 20 and the electrode 20. This gap preferably has a width equal to or wider than the thickness of the lead frame 5. The first electrode 10 and the second electrode 20 have a substantially rectangular portion, and have a width narrower than the width of the first electrode 10 and the width of the second electrode 20, and further form a package. It is connected to the outside of the scheduled area 600. The cutout of the lead frame 5 can be formed by punching, etching or the like. Here, the package formation planned region 600 is a region that is separated from the lead frame 5 and is an outer periphery of the bottom surface of the package 100 after molding. Further, the first electrode 10 in the lead frame 5 means a portion corresponding to the first electrode 10 after molding, and means a state before being singulated. Similarly, the second electrode 20 in the lead frame 5 means a portion corresponding to the second electrode 20 after molding, and means a state before being singulated. For the sake of simplicity, the lead frame 5 will be described as including one package formation region 600, but a plurality of lead frames 5 may be provided.

  The lead frame 5 is a plate-like member, has a predetermined-shaped gap around the first electrode 10 and the second electrode 20, and the first electrode 10 and the second electrode 20 face each other. The parts are separated. The lead frame 5 includes a frame-like lead support portion 7 that surrounds the first electrode 10 and the second electrode 20, and suspension leads 8 and 9.

  In the first electrode 10, a portion corresponding to the first outer lead portion 11 after molding is connected to the lead support portion 7 by a suspension lead 8. In the lead frame 5, a first space 6 a and a second space 6 b are formed as gaps on both sides of the suspension lead 8. The first space 6 a and the second space 6 b are formed on both sides of the first electrode 10. As will be described later, in the present embodiment, the first resin is injected from the first space 6a.

  In the second electrode 20, a portion corresponding to the second outer lead portion 21 after molding is connected to the lead support portion 7 by the suspension lead 9. In the lead frame 5, a third space 6 c and a fourth space 6 d are formed as gap portions on both sides of the suspension lead 9. The third space 6 c and the fourth space 6 d are formed on both sides of the second electrode 20.

(2) The lead frame is sandwiched between the upper mold and the lower mold.
In this step, the first electrode 10 and the second electrode 20 of the lead frame 5 are sandwiched between the upper mold 550 and the lower mold 560 of the mold mold 500 that are divided vertically. For convenience of explanation, the lower surface of the lead frame 5 and the lower mold 560 are shown separated from each other, but the lead frame 5 is fixed to the lower mold 560.

  The upper mold 550 of the mold 500 has a recess 501 corresponding to the wall portion 31 of the resin molded body 30 formed on the first electrode 10 and the second electrode 20. The first resin was injected into the recess 501 provided in the upper mold 550. The recess 501 of the upper mold 550 is connected in a ring shape. A through hole serving as a gate 555 is formed in the upper mold 550 at a position different from the recess 501 and outside the recess 501 in plan view. The first resin is firmly sandwiched between the lead frame 5 and the upper mold 550 and the lower mold 560 so that the first resin does not enter. When the first resin enters the gaps between the lead frame 5 and the upper mold 550 and the lower mold 560, and the first resin adheres to the surface of the lead frame 5 in the mounting region of the light emitting element, the deburring process is performed. Necessary.

(3) Injecting the first resin into the mold.
The upper mold 550 of the mold 500 includes a gate (injection port) 555 outside the package formation planned region 600. A notch portion of the lead frame 5 is arranged at a portion corresponding to the gate 555 of the upper mold 550. The gate 555 is formed on the side of one lead support portion 7 that is outside the first electrode 10. Here, the light reflecting member is mixed in advance with the first resin injected from the gate 555.

In this step, a gate adjacent to the first electrode 10 (first outer lead portion 11) in a plan view in a mold 500 in which the lead frame 5 is sandwiched between an upper mold 550 and a lower mold 560. The first resin is injected from 555.
The first resin injected from the gate 555 passes through the notch of the lead frame 5 and is injected into the recess 501 of the upper mold 550. Here, although one gate 555 is described, a plurality of gates 555 can be provided in the upper mold 550. Further, although the gate 555 is provided in the upper mold 550, a gate can be provided in the lower mold 560, and the first resin can be injected from the lower mold 560 side.
A known molding method such as injection molding, transfer molding, or extrusion molding can be used for the first resin injection step.

(4) The injected first resin is cured or solidified.
In the present embodiment, as an example, it is assumed that the first resin is a thermosetting resin such as an epoxy resin. In this case, the step of injecting the first resin is assumed to be a transfer mold. In the transfer mold, a pellet-shaped thermosetting resin (tablet) having a predetermined size is put in a predetermined container connected to the upper mold 550 in advance. In the case of transfer molding, the outline of the step (2), the step (3) and the step (4) will be described below.

  In the case of transfer molding, in the step (2), the lead frame 5 is fixed to the heated lower mold 560 and sandwiched between the heated upper mold 550 and the lower mold 560 in the same manner. In the step (3), by applying pressure to a predetermined container connected to the upper mold 550, for example, with a piston, the molten thermosetting property is transferred from the predetermined container to the recess 501 of the upper mold 550 through the gate 555. Resin (first resin) is injected. In the step (4), the filled thermosetting resin (first resin) is heated. The thermosetting resin cured (temporarily cured) by heating becomes the resin molded body 30.

  In addition, when the first resin is a thermoplastic resin such as a polyphthalamide resin, it can be formed by injection molding. In this case, the thermoplastic resin may be melted at a high temperature, placed in a low temperature mold and solidified by cooling.

The injected first resin is cured or solidified, and a wall portion 31 corresponding to the recess 501 included in the upper mold 550 of the mold mold 500 divided into the upper and lower parts is formed.
(5) The injection trace of the injection port of the first resin is excised.
After the first resin is cured or solidified, the injection mark at the injection port of the first resin is excised. Further, the first resin and the lead frame 5 are cut to divide the package 100 into individual pieces. Here, the jig | tool which cut | disconnects the suspension leads 8 and 9 can use a lead cutter, for example. The short left and right sides of the rectangular shape of the package formation planned region 600 correspond to the suspension leads 8 and 9 of the lead frame 5 and the resin molded body 30. The lead frame 5 at the position to be cut can be provided with a cutout or a through hole such as a circle, an ellipse, a polygon, or a substantially polygon to reduce the area of the lead frame 5 to be cut.

  In the present embodiment, when the package 100 is separated from the lead frame 5, the suspension leads 8 and 9 are cut according to the short side of the package formation scheduled region 600. After the injection and curing or solidification of the first resin, since the resin molded body 30 is filled in the recess 501 of the upper mold 550, the end portion of the resin molded body 30 is also cut at the same time.

  By cutting the suspension leads 8 and 9 as described above, the gate trace (injection trace) 155 of the first resin can be excised from the side of the first electrode 10. As a result, no gate mark is left on the surface of the package 100. This cutting may be performed before the light emitting element is mounted or after the light emitting element is mounted. The package 100 can be manufactured by the steps (1) to (5).

  In the conventional method, the resin is injected from the back side of the package. However, according to the package manufacturing method of this embodiment, the resin is injected from the outside of the package formation planned region 600 and next to the first electrode 10. In addition, since the gate trace is removed, the thickness of the package can be reduced.

In addition, according to the package manufacturing method of the present embodiment, the process of bending the lead in the conventional package manufacturing method is not necessary, so that it is possible to save time and effort for bending.
In a conventional manufacturing method, for example, when a plate-shaped lead frame to be prepared includes a plurality of package formation scheduled areas in a two-dimensional array, the interval between them is set to a predetermined length in consideration of bending the leads. On the other hand, according to the package manufacturing method of the present embodiment, there is no need to bend the lead, so it is not necessary to ensure the length of the lead considering bending. That is, the package interval can be reduced by an amount not considering bending, and therefore, the number of packages that can be taken out from the same plate-like lead frame is increased as compared with the conventional case, and the frame (material) can be used effectively.

<Configuration of Light Emitting Device 1>
Next, the configuration of the light emitting device 1 will be described with reference to FIG. FIG. 14 is a diagram illustrating an outline of the light emitting device according to the embodiment, and is a perspective view illustrating the entire light emitting device.
The light emitting device 1 includes a package 100, a light emitting element 200, a wire 250, and a sealing member 300 made of a second resin. The light emitting element 200 is mounted on the second electrode 20 of the package 100. The shape and size of the light emitting element 200 used here are not particularly limited. As the luminescent color of the light emitting element 200, one having an arbitrary wavelength can be selected according to the application. For example, a GaN-based or InGaN-based light-emitting element can be used as a blue light-emitting element (light having a wavelength of 430 to 490 nm). The _{InGaN-based, In X Al Y Ga 1-} X-Y N (0 ≦ X ≦ 1,0 ≦ Y ≦ 1, X + Y ≦ 1) , or the like can be used.

  The wire 250 is a conductive wiring for electrically connecting the electronic components such as the light emitting element 200 and the protection element to the first electrode 10 and the second electrode 20. Examples of the material of the wire 250 include those using metals such as Au (gold), Ag (silver), Cu (copper), Pt (platinum), and Al (aluminum), and alloys thereof. It is preferable to use Au excellent in thermal conductivity and the like. The thickness of the wire 250 is not particularly limited and can be appropriately selected according to the purpose and application.

  The sealing member 300 covers the light emitting element 200 and the like mounted in the package 100. The sealing member 300 is provided to protect the light emitting element 200 and the like from external force, dust, moisture, and the like, and to improve the heat resistance, weather resistance, and light resistance of the light emitting element 200 and the like. Examples of the material of the sealing member 300 include a transparent material such as a thermosetting resin, for example, a silicone resin, an epoxy resin, or a urea resin. In addition to such a material, a filler such as a phosphor or a substance having a high light reflectance can also be included in order to have a predetermined function.

The sealing member 300 can facilitate the color tone adjustment of the light emitting device 1 by mixing phosphors, for example. In addition, as a fluorescent substance, what has larger specific gravity than the sealing member 300, absorbs the light from the light emitting element 200, and can perform wavelength conversion can be used. If the specific gravity of the phosphor is larger than that of the sealing member 300, it is preferable because the phosphor settles on the first electrode 10 and second electrode 20 sides.
Specifically, for example, yellow phosphors such as YAG (Y ₃ Al ₅ O ₁₂ : Ce) and silicate, or red phosphors such as CASN (CaAlSiN ₃ : Eu) and KSF (K ₂ SiF ₆ : Mn) Can be mentioned.

As the filler to be contained in the sealing member 300, for example, a substance having a high light reflectance such as SiO ₂ , TiO ₂ , Al ₂ O ₃ , ZrO ₂ , or MgO can be suitably used. For the purpose of cutting undesired wavelengths, for example, organic or inorganic coloring dyes or coloring pigments can be used.

<Method for Manufacturing Light-Emitting Device 1>
(First manufacturing method)
In the first manufacturing method of the light emitting device 1, after the steps (1) to (4) and before the step (5) among all steps for manufacturing the package 100, The light emitting element 200 is mounted. That is, the light emitting element 200 is mounted on the second electrode 20 of the package 100 that is not separated from the lead frame 5.

  The light emitting element 200 is an element having a single-sided electrode structure in which a pair of n electrodes and p electrodes are formed on an upper surface. In this case, the back surface of the light emitting element 200 is bonded to the second electrode 20 with an insulating die bond member, one electrode on the upper surface is connected to the first electrode 10 by the wire 250, and the other electrode on the upper surface is connected to the second electrode 20. It is connected to the second electrode 20 by a wire 250.

  Subsequently, the sealing member 300 is applied in the recess surrounded by the wall portion 31 of the resin molded body 30 of the package 100 to seal the light emitting element 200. At this time, the sealing member 300 is dropped to the upper surface of the concave portion of the resin molded body 30. As a method for filling the sealing member 300 in the concave portion of the resin molded body 30, for example, injection, compression, extrusion, or the like can be used. However, since dripping can effectively discharge the air remaining in the concave portion of the resin molded body 30, it is preferable to fill by dripping.

(Second manufacturing method of light emitting device)
In the first manufacturing method of the light emitting device 1, the light emitting element 200 is preliminarily mounted in the package 100 and then separated into individual pieces. In the second manufacturing method, the individual package 100 is manufactured in advance. The light emitting element 200 may be mounted on the package 100 after all the steps. That is, the light emitting element 200 is mounted on the package 100 that has been separated.

[Modification 1]
In the lead frame 5 shown in FIG. 5, the first space 6 a and the second space 6 b are formed on both sides of the suspension lead 8, but there is one space for injecting the first resin. Only one of the first space 6a and the second space 6b can be provided.
In the upper mold 550 of the mold 500 shown in FIG. 9, it is assumed that one gate 555 is formed. However, two gates are formed on both sides of the first electrode 10, and two gates are formed. The first resin may be injected.
In addition, the first resin can be injected by providing a gate not only next to the first electrode 10 but also at a position corresponding to one side or both sides of the second electrode 20.

[Modification 2]
The shape of the lead frame 5 shown in FIG. 5 is an example. For example, the sizes of the first electrode 10 and the second electrode 20 may be equal or different from each other.
A through-hole may be provided in the center of the left and right short sides of the package formation planned region 600 indicated by a rectangular phantom line in FIG. In such a configuration, when the suspension leads 8 and 9 are cut, the portion of the through hole is cut to form a castellation. Therefore, the fillet can be observed when the package is soldered, for example, to an external mounting board. In addition, in the process of cutting the suspension leads 8 and 9, for example, the life of the blade of the lead cutter can be extended.

[Modification 3]
Assuming that two packages 100 shown in FIG. 1 are prepared, a double-sized double cavity package having a shape in which the resin molded bodies 30 are connected to each other on the side surface without the flange portion 32 may be manufactured. In this case, the package after molding has two concave portions (cavities) in the vertical direction in plan view. This double cavity package can realize high light output in which the packages 100 are closely arranged.

  This double cavity package can be equivalent to a package in which two packages 100 having different specifications are arranged closely. For example, the phosphor may be contained in one recess of the resin molded body, and the phosphor may not be contained in the other recess. Alternatively, the first phosphor can be contained in one recess of the resin molded body, and the second phosphor can be contained in the other recess. In order to manufacture such a double cavity package, the following lead frame may be prepared.

  That is, in the lead frame 5 shown in FIG. 5, the pattern shape of the gap portion is changed, and two sets of package elements each including the first electrode 10 and the second electrode 20 are prepared in the vertical direction, and two suspensions are prepared. The first space 6 a is disposed between the leads 8, and the third space 6 c is disposed between the two suspension leads 9. At this time, the package formation planned area 600 indicated by the phantom lines in FIG. 5 is enlarged in the vertical direction, and an area having two sets of package elements is defined as a double cavity package formation planned area. In this case, the recess 501 included in the upper mold 550 of the mold 500 shown in FIGS. 7 and 8 is deformed so as to correspond to the wall portion of the resin molded body of the double cavity package.

[Modification 4]
In the double cavity package of Modification 3, a wall between two concave portions of the resin molded body may be removed to manufacture a double size single cavity package. In this case, the package after molding has one concave portion (cavity) of the resin molded body, and four inner lead portions in the concave portion. Thus, for example, three inner lead portions are used as cathode electrodes (second electrodes), light emitting elements corresponding to RGB are mounted on each cathode electrode, and the remaining one inner lead portion is used as an anode electrode (first electrode). Electrode). Further, a protective element may be mounted on the inner lead portion where the light emitting element is not mounted. In order to manufacture such a single cavity package, the recess 501 of the upper mold 550 of the mold 500 shown in FIGS. 7 and 8 corresponds to the wall portion of the resin molded body of the single cavity package. Can be transformed into

[Other variations]
The light emitting element 200 may be, for example, an element having a counter electrode structure (double-sided electrode structure) in which an n electrode (or p electrode) is formed on the back surface of the element substrate. The light emitting element 200 is not limited to the face-up type, and may be a face-down type. When a face-down light emitting element is used, a wire can be eliminated.

  The light emitting element 200 can be mounted on the first electrode 10 instead of the second electrode 20. For example, when the light emitting device 1 includes two light emitting elements 200, the light emitting elements 200 can be mounted on the first electrode 10 and the second electrode 20, respectively. A protective element may be mounted on the inner lead portion where the light emitting element is not mounted.

  The shape of the wall portion 31 of the resin molded body 30 of the package 100 in plan view is not limited to the rectangular ring shape illustrated in FIG. 1. For example, the shape of the wall portion 31 is circular or elliptical in plan view. There may be.

<Configuration of Package 100B>
The package of Modification 2 will be described with reference to the drawings. FIG. 15 is a diagram showing an outline of a package according to another embodiment, and is a perspective view showing the whole package. The same components as those in the package 100 in FIG.

  The package 100B includes a bottomed recess 110 that opens upward, a first outer surface (hereinafter referred to as “gaisokumen” unless otherwise specified) 101, a second outer surface 102 adjacent to the first outer surface 101, A third outer surface 103 adjacent to the second outer surface 102 and facing the first outer surface 101, a fourth outer surface 104 adjacent to the first outer surface 101 and the third outer surface 103, and a bottom surface 105. Here, the bottom surface 105 is a mounting surface of the package 100B. The package 100B includes a first electrode 10B, a second electrode 20B having a polarity different from that of the first electrode 10B, and a resin molded body 30B, and a bottom surface 105 is configured by these members.

  The first electrode 10B has a first outer lead portion 11 protruding outward from the wall portion 31 in plan view (hereinafter referred to as “the side” unless otherwise specified). The first outer lead portion 11 protrudes from the first outer side surface 101 of the package 100B. As described above, the first outer lead portion 11 may be provided with a notch, a recess, or a through hole. Therefore, in the present embodiment, the first outer lead portion 11 has the second recessed portion 50 at the tip. The second recessed portion 50 is recessed in the depth direction when the package 100B is viewed from the side. Thereby, a fillet can be formed when, for example, the second recess 50 is soldered to an external mounting substrate.

  In the present embodiment, the second electrode 20B has a second outer lead portion 21 that protrudes outward from the wall portion 31 in plan view. The second outer lead portion 21 protrudes from the third outer surface 103 of the package 100B. As described above, the second outer lead portion 21 may be provided with a notch, a recess, or a through hole. Therefore, in the present embodiment, the second outer lead portion 21 has the second recessed portion 50 at the tip. In the package 100B, only one of the electrodes may have the second recessed portion 50, or only one of the electrodes may have the outer lead portion.

As described above, it is preferable that the outermost surfaces of the first electrode 10B and the second electrode 20B are coated with a metal material having a high reflectance such as silver or aluminum.
Therefore, in this embodiment, after providing a gap such as a through hole in the lead frame prepared for manufacturing the package 100B, the lead frame is plated with, for example, silver, aluminum, copper, and gold. . Therefore, the first electrode 10B and the second electrode 20B are plated.

Here, in the first electrode 10 </ b> B, the first outer lead portion 11 is not plated except for the side surface 51 of the second recessed portion 50. The reason for not being plated is that the side surface 43 of the first outer lead portion 11 is a cut surface that appears when the package 100B is separated.
On the other hand, since the first outer lead portion 11 is plated with the upper surface 41, the lower surface 42, and the side surface 51 of the second recessed portion 50, the bonding strength with a conductive member such as solder is increased.
Similarly, in the second electrode 20 </ b> B, the second outer lead portion 21 is plated with the upper surface 41, the lower surface 42, and the side surface 51 of the second recessed portion 50, and the distal end surface is the side surface 51 of the second recessed portion 50. Except for plating.

  Further, since the package 100B is plated on the first inner lead portion 12 of the first electrode 10B and the second inner lead portion 22 of the second electrode 20B, the bottom of the package 100B When a light-emitting device is configured by mounting a light-emitting element in the recess 110, the reflectance of light from the light-emitting element can be increased.

  The resin molded body 30 </ b> B includes a wall portion 31 and a flange portion 32. The wall part 31 and the collar part 32 are integrally formed with the same material. Since they are integrally molded in this way, the strength of the wall portion 31 and the collar portion 32 can be increased.

  The wall portion 31 fixes the first electrode 10B and the second electrode 20B and constitutes the side wall of the bottomed recess 110. The bottomed recess 110 has a shape that expands in the opening direction. In the bottomed recess 110, at least a part of the bottom surface 110a includes the first inner lead portion 12 of the first electrode 10B and the second inner lead portion 22 of the second electrode 20B.

  The collar portion 32 protrudes outward from the wall portion 31 in plan view. The collar portion 32 protrudes from the first outer side surface 101 of the package 100B. As described above, the flange portion 32 is provided with the same thickness T as the first outer lead portion 11 on both sides of the first outer lead portion 11 in a plan view. The flange portion 32 is not provided in the second recessed portion 50 of the first outer lead portion 11.

  In the present embodiment, the other flange 32 protrudes from the third outer surface 103 of the package 100B and has the same thickness as the second outer lead portion 21 on both sides of the second outer lead portion 21 in plan view. Is provided. The flange portion 32 is not provided in the second recessed portion 50 of the second outer lead portion 21. In addition, you may make it have a collar part only in the both sides of either one outer lead part.

  In the package 100B, the first electrode 10B protrudes from the first outer surface 101 and the second electrode 20B protrudes from the third outer surface 103, but the second outer surface 102 and the fourth outer surface On the side surface 104, the first electrode 10B and the second electrode 20B are not exposed. That is, all of the second outer surface 102 and all of the fourth outer surface 104 are formed of the same material as the wall portion 31. Therefore, when the package 100B is soldered to an external mounting substrate, for example, solder leakage to the second outer surface 102 and the fourth outer surface 104 can be reduced.

  In the package 100B, the second outer surface 102 and the fourth outer surface 104 are partially recessed. The first recess 33 is formed at the lower end of the second outer surface 102 and communicates with the bottom surface 105. The other first recess 33 is formed at the lower end of the fourth outer surface 104 and communicates with the bottom surface 105. These first dents 33 are traces of two hanger leads formed in advance on a lead frame used for manufacturing the package 100B. For example, when the lead frame 705 shown in FIG. 16 is used for manufacturing the package 100B, the shape of the first recess 33 in a plan view is a trapezoid like the shapes of the hanger leads 711 and 712 shown in FIG. The height of this trapezoid is equal to the length of the first recess 33 in the depth direction.

  The first recess 33 has the same thickness as the first and second outer lead portions 11 and 21. That is, the length (height H) of the first dent 33 in the vertical direction of the package 100B is the same as the thickness T of the first and second outer lead portions 11 and 21.

<Method for Manufacturing Package 100B>
Hereinafter, a method for manufacturing the package 100B will be described with reference to FIGS. FIG. 16 is a diagram showing an outline of a manufacturing process of a package according to another embodiment, and is a plan view of a lead frame. FIG. 17 is a view schematically showing a manufacturing process of a package according to another embodiment, and is a top view of a lead frame sandwiched between an upper mold and a lower mold. 18 is a diagram showing an outline of a manufacturing process of a package according to another embodiment, and is a cross-sectional view taken along XVIII-XVIII in FIG. 17 after the first resin injection. FIG. 19 is a diagram illustrating an outline of a manufacturing process of a package according to another embodiment, and is a cross-sectional view taken along the XIX-XIX arrow in FIG. 17 after the first resin injection.
In the manufacturing method of the package 100B, the lead frame to be prepared and the upper mold are different from those used for manufacturing the package 100. The package manufacturing method of this embodiment includes the following steps (1B) to (5B).

(1B) A lead frame is prepared.
In the step (1B), a lead frame 705 on a flat plate with a part cut away is prepared.
The step of preparing the lead frame 705 includes a step of forming a plurality of gap portions including the through holes 713 and 714 around a region to be the first electrode 10B and the second electrode 20B with respect to the plate-like member. And a step of plating the plate-like member in which the gap portion is formed.
Here, in the step of forming the gap portion, the gap portion can be formed in the plate member by punching, etching, or the like.
In the plating step, the lead frame provided with a gap such as a through hole is plated. Specifically, for example, Ag is attached to the lead frame by electrolytic plating.

  The plated lead frame 705 has a first electrode 10B and a second electrode 20B in a package formation planned region 600B, and the first electrode 10B and the second electrode 20B. There is a gap between them. Here, the package formation planned region 600 </ b> B is a region that is separated from the lead frame 705 and becomes the outer periphery of the bottom surface 105 of the package 100 </ b> B after molding. In addition, the first electrode 10B in the lead frame 705 means a portion corresponding to the first electrode 10B after molding, and means a state before being singulated. Similarly, the second electrode 20B in the lead frame 705 means a portion corresponding to the second electrode 20B after molding, and means a state before being singulated. For the sake of simplicity, the lead frame 705 is described as including one package formation scheduled region 600B, but a plurality of lead frames 705 may be provided.

  In the lead frame 705, the package formation region 600B is rectangular in plan view, and is an outer edge on the first electrode 10B side of the first electrode 10B and the second electrode 20B arranged to face each other. A first edge 601, a second edge 602 adjacent to the first edge 601, a third edge 603 adjacent to the second edge 602 and facing the first edge 601; and The first edge 601 and the third edge 603 are adjacent to the fourth edge 604.

  The lead frame 705 is a plate-like member, has a predetermined-shaped gap around the first electrode 10B and the second electrode 20B, and the first electrode 10B and the second electrode 20B face each other. The parts are separated. The lead frame 705 includes a frame-shaped lead support portion 707 surrounding the first electrode 10B and the second electrode 20B, suspension leads 708 and 709, and hanger leads 711 and 712.

The lead support portion 707 is a part for supporting the suspension leads 708 and 709 and the hanger leads 711 and 712.
The suspension leads 708 and 709 are portions for supporting the molded package 100B connected from both sides in one direction (horizontal direction in FIG. 16). It is separated from the electrode 10B and the second electrode 20B.
The hanger leads 711 and 712 are portions for supporting the molded package 100B from both sides in a direction orthogonal to the one direction (vertical direction in FIG. 16), and are not cut. That is, the hanger leads 711 and 712 are not components of the package 100B separated from the lead frame 705.

  Specifically, in the first electrode 10 </ b> B, a portion corresponding to the molded first outer lead portion 11 is connected to the lead support portion 707 by a suspension lead 708. In the lead frame 705, a first space 706 a and a second space 706 b are formed as gaps on both sides of the suspension lead 708. The first space 706a and the second space 706b are formed on both sides of the first electrode 10B. In the present embodiment, the first resin is injected from the first space 706a.

In the second electrode 20B, a portion corresponding to the second outer lead portion 21 after molding is connected to the lead support portion 707 by a suspension lead 709. In the lead frame 705, a third space 706 c and a fourth space 706 d are formed on both sides of the suspension lead 709 as gap portions. The third space 706c and the fourth space 706d are formed on both sides of the second electrode 20B.
In the lead frame 705, the first space 706a, the second space 706b, the third space 706c, and the fourth space 706d communicate with gaps around the first electrode 10B and the second electrode 20B. Yes.

The lead frame 705 includes a hanger lead 712 projecting from the second edge 602 into the package formation planned region 600B and a hanger lead projecting from the fourth edge 604 into the package formation planned region 600B in plan view. 711.
The thickness of the hanger leads 711 and 712 is equal to the thickness of the lead frame 705. That is, the thickness of the hanger leads 711 and 712 is equal to the thickness T of the first and second outer lead portions 11 and 21. For this reason, the height H of the first recess 33 of the package 100B is the same as the thickness T of the first and second outer lead portions 11 and 21.

  As described in the description of the step (5) (step of removing the injection trace), a through-hole such as a circle, an ellipse, a polygon, or a substantially polygon is provided at a position where the lead frame is cut. Can do. Therefore, in the present embodiment, the lead frame 705 has through holes 713 and 714 at a position straddling the outer edge of the package formation planned region 600B in at least one of the first electrode 10B and the second electrode 20B.

  Specifically, in the present embodiment, the lead frame 705 has an oval through hole 713 that is long in the direction along the first edge 601 in the first edge 601 of the package formation planned region 600B. doing. The lead frame 705 has an oval through hole 714 that is long in the direction along the third edge 603 at the third edge 603 of the package formation planned region 600B. The inner peripheral surfaces of the through holes 713 and 714 are also plated. The through holes 713 and 714 are independent and do not communicate with the first space 706a or the like.

(2B) The lead frame is sandwiched between the upper mold and the lower mold.
In this step, the first electrode 10B and the second electrode 20B of the lead frame 705 are sandwiched between the upper mold 550B and the lower mold 560 of the mold mold 500 divided in the vertical direction. The upper mold 550B has a recess 501B corresponding to the wall portion 31 of the resin molded body 30B and a flat portion adjacent to the recess 501B. The recess 501B is connected in a ring shape. The lead frame 705 is arranged so that the package formation planned region 600B is positioned below the recess 501B of the upper mold 550B and the through holes 713 and 714 are positioned outside the recess 501B.

The upper mold 550B has a through hole that becomes the gate 555B at a position where the first space 706a is provided outside the package formation planned region 600B when aligned with the lead frame 705.
Then, the flat portion adjacent to the recess 501B of the upper mold 550B is aligned with at least a part of the lead support portion 707, the suspension leads 708 and 709, and the first and second outer parts after molding. It is made to contact | abut to the part corresponded to the lead parts 11 and 21. FIG. At this time, the first resin is firmly sandwiched between the lead frame 705 and the upper mold 550B and the lower mold 560 so that the first resin does not enter.

(3B) First resin is injected into the mold.
In this step, the gate adjacent to the first electrode 10B (first outer lead portion 11) in a plan view in the mold 500 having the lead frame 705 sandwiched between the upper mold 550B and the lower mold 560. The first resin is injected from 555B. The first resin injected from the gate 555B passes through the first space 706a of the lead frame 5 and is injected into the recess 501B of the upper mold 550B. The first resin is injected into the second space 706b, the third space 706c, and the fourth space 706d that communicate with the first space 706a of the lead frame 705.

  At this time, as described above, the lead frame 705 is disposed such that the through holes 713 and 714 are located outside the recess 501B of the upper mold 550B. Further, the lead frame 705 is placed on the upper die 550B so that the flat portion adjacent to the recess 501B of the upper die 550B is brought into contact with the portions corresponding to the first and second outer lead portions 11 and 21 after molding. And the lower mold 560. Further, the through holes 713 and 714 do not communicate with the first space 706a or the like. Therefore, the first resin does not enter the through holes 713 and 714 of the lead frame 705.

(4B) The injected first resin is cured or solidified.
The wall portion 31 and the flange portion 32 of the resin molded body 30B are formed by the gap portions other than the through holes 713 and 714 of the lead frame 705 and the recesses 501B of the upper mold 550B. At this time, it is adjacent to both sides of the portion corresponding to the first and second outer lead portions 11 and 21 after molding, has the same thickness as the first and second outer lead portions 11 and 21, and has a thickness after molding. A portion corresponding to the portion 32 is formed. At this time, the collar part 32 continues to the gate 555B, but when the package 100B is separated into pieces, the collar part 32 is separated from the gate 555B.

(5B) The injection trace of the injection port of the first resin is excised.
Here, after the first resin is cured or solidified, the injection mark at the injection port of the first resin is excised. Further, the first resin and the lead frame 705 are cut to divide the package 100B into individual pieces. At that time, the suspension leads 708 and 709 are cut at the outer edges (first edge 601 and third edge 603) of the package formation planned region 600B of the lead frame 705. As a result, the through holes 713 and 714 of the lead frame 705 are cut to form the second recessed portions 50 in the first and second outer lead portions 11 and 21. In addition, even when the first electrode 10B and the second electrode 20B are separated from the lead frame 705 during separation, the package 100B is pulled out because the package 100B is sandwiched between the hanger leads 711 and 712. There is no.
The package 100B can be manufactured by the steps (1B) to (5B).

  In the package 100B configured as described above, the flange portion 32 is provided with the same thickness T as the first and second outer lead portions 11 and 21 on both sides of the first and second outer lead portions 11 and 21 in plan view. It has been. Further, the first outer lead portion 11 and the second outer lead portion 21 are provided with a second recessed portion 50.

The second recess 50 is formed by cutting the prepared lead frame 705 at a position passing through the through holes 713 and 714. Since the end surface that appears when the lead frame 705 is cut is not plated, a conductive member such as solder does not adhere to it and does not contribute to bonding.
On the other hand, in the step of injecting the first resin at the time of manufacture, the first resin does not enter the through holes 713 and 714 of the lead frame 705, and the plating on the inner peripheral surface of the through holes 713 and 714 remains as it is. Therefore, the collar portion 32 is not provided in the second recessed portion 50 of the package 100B. And since the side surface 51 of the 2nd recessed part 50 is plated, electroconductive members, such as solder, adhere and contribute to joining. Therefore, the package 100B can increase the bonding strength of a conductive member such as solder as compared to the case where the second recess 50 is not provided.

Further, since the side surface 51 of the second recess 50 is plated in the package 100B, the fillet is observed when the second recess 50 of the package 100B is soldered, for example, to the external mounting substrate as described above. be able to.
In the package 100B, since the first outer lead portion 11 and the second outer lead portion 21 are plated on the upper surface 41 and the lower surface 42, the conductive member such as solder is used as the side surface of the second recessed portion 50. The castellation electrode can be formed by bonding from 51 to the upper surface 41 and the lower surface 42.

<Configuration of Light Emitting Device 1C>
Next, the configuration of the light emitting device 1C will be described with reference to FIG. FIG. 20 is a diagram schematically showing a light emitting device according to another embodiment, and is a perspective view showing the whole light emitting device.

The light emitting device 1C is different from the light emitting device 1 of FIG. 14 in that a package 100C is used. The same components as those of the light emitting device 1 of FIG.
The package 100C is different from the package 100B in the shape of the resin molded body 30C.
The resin molded body 30 </ b> C includes a wall portion 31 and a flange portion 32, and includes a notch portion 120 at one vertex of the wall portion 31. The notch 120 represents the polarity of the first electrode 10B and is used as a cathode mark or an anode mark. The shape and size of the notch 120 are arbitrary. Here, the notch 120 has an inverted triangular shape, for example, and is formed across the first outer surface 101 and the second outer surface 102.

  Since the manufacturing method of the package 100C is the same as the manufacturing method of the package 100B, description thereof is omitted. The notch 120 is manufactured by changing the shape of the recess 501B of the upper mold 550B of FIG. 17 in accordance with the wall 31 of the resin molded body 30C in the mold 500 for manufacturing the package 100B. be able to.

Since the manufacturing method of the light emitting device 1C is the same as the manufacturing method of the light emitting device 1, description thereof is omitted.
In the package 100 </ b> C of FIG. 20, for example, the end point 121 of the notch 120 may be extended to the intersection 122 between the wall portion 31 and the flange portion 32 to enlarge the notch 120 and make it noticeable.
In the light emitting device 1C, the package 100B may be used instead of the package 100C.

  The light emitting device according to the embodiment of the present invention can be used for an illumination device, an in-vehicle light emitting device, and the like.

1, 1B, 1C Light emitting device 5,705 Lead frame 6a, 706a First space 6b, 706b Second space 6c, 706c Third space 6d, 706d Fourth space 7,707 Lead support portion 8, 9, 708, 709 Suspended leads 10, 10B First electrode 11 First outer lead portion 12 First inner lead portion 20, 20B Second electrode 21 Second outer lead portion 22 Second inner lead portion 30, 30B , 30C Resin molded body 31 Wall portion 32 ridge portion 33 first recess 41 upper surface of first outer lead portion 42 bottom surface of first outer lead portion 43 tip surface of first outer lead portion 50 second recess portion 51 first 2 Side surface of the recess H Height of the first recess T Thickness of the first electrode 100, 100B, 100C Package 101 First outside of the package Surface 102 second third bottom 120 notch 155 gate mark of the outer side surface 104 of package recess 110a recessed portion of the fourth bottom surface 110 of package outer surface 105 of package outer surface 103 packages of the package (injection mark)
200 Light Emitting Element 250 Wire 300 Sealing Member 500 Mold Die 501 Recess 550 Upper Die 555 Gate (Injection Port)
560 Lower mold 600,600B Package formation scheduled area 711,712 Hanger lead 713,714 Through hole (gap)

Claims (22)

Providing a lead frame having a first electrode and a second electrode different from the first electrode in a region where a package is to be formed;
Sandwiching the first electrode and the second electrode between an upper mold and a lower mold of a mold that is divided vertically;
When the first electrode is set to the left and the second electrode is set to the right in the plan view in the mold die sandwiched between the first electrode and the second electrode, the mold die A step of injecting a first resin from an injection port formed outside the region where the package is to be formed and formed at the upper left or lower left of the first electrode or the upper right or lower right of the second electrode ;
Curing or solidifying the injected first resin;
After curing or solidifying the first resin, cutting off the injection mark of the first resin injection port from the upper left or lower left of the first electrode or the upper right or lower right of the second electrode ; A method for manufacturing a package comprising: In the prepared lead frame, a first space is formed on the upper left or lower left of the first electrode , or on the upper right or lower right of the second electrode . From the first space, the first space is formed. The manufacturing method of the package of Claim 1 which inject | pours resin.   The package manufacturing method according to claim 1, wherein the prepared lead frame has the first electrode and the second electrode separated from each other.   4. The method of manufacturing a package according to claim 1, wherein the step of removing the injection mark cuts the lead frame and the first resin at the same time. 5.   5. The mold according to claim 1, wherein the mold has a recess corresponding to a wall portion formed on the first electrode and the second electrode, and the first resin is injected into the recess. The manufacturing method of the package as described in any one of these. The first resin molded using the mold is
A wall part that fixes the first electrode and the second electrode and constitutes a side wall in a bottomed recess in which at least a part of a bottom surface is constituted by the first electrode and the second electrode;
And a flange that protrudes outward from the wall,
At least one of the first electrode and the second electrode has an outer lead portion protruding outward from the wall portion,
The package manufacturing method according to any one of claims 1 to 5, wherein the flange portion is formed on both sides of the outer lead portion with the same thickness as the outer lead portion in a plan view.   The method for manufacturing a package according to any one of claims 1 to 6, wherein the step of injecting the first resin is transfer molding.   The package manufacturing method according to claim 1, wherein a light reflecting member is mixed in the first resin. The prepared lead frame has a through hole at a position straddling an outer edge of a region where the package is to be formed in at least one of the first electrode and the second electrode.
9. The method of manufacturing a package according to claim 1, wherein in the step of removing the injection trace, the lead frame is cut at an outer edge of a region where the package is to be formed. The step of preparing the lead frame includes:
Forming a plurality of gaps including the through holes around a region to be the first electrode and the second electrode with respect to the plate member;
The method for manufacturing a package according to claim 9, further comprising: plating a plate-like member in which the plurality of gaps are formed. The package formation-planning region is rectangular in plan view, and the first edge that is the outer edge on the first electrode side of the first electrode and the second electrode arranged to face each other A second edge adjacent to the first edge, a third edge adjacent to the second edge and facing the first edge, and the first edge and the A fourth edge adjacent to the third edge;
11. The prepared lead frame has hanger leads projecting from the second edge and the fourth edge into the package formation region in a plan view. The manufacturing method of the package as described in any one of Claims. The whole process in the manufacturing method of the package according to any one of claims 1 to 11,
A step of mounting a light emitting element on the first electrode or the second electrode at any timing after the first resin is cured or solidified and before or after the step of removing the injection trace. A method for manufacturing a light emitting device.   The method for manufacturing a light-emitting device according to claim 12, further comprising a step of applying a second resin and sealing the light-emitting element after the step of mounting the light-emitting element. A first electrode;
A second electrode having a polarity different from that of the first electrode;
A wall portion that fixes the first electrode and the second electrode and at least a part of a bottom surface of which constitutes a side wall of a bottomed recess formed by the first electrode and the second electrode;
And a flange that protrudes outward from the wall in plan view,
At least one of the first electrode and the second electrode has an outer lead portion protruding outward from the wall portion in plan view,
The outer lead portion has a second recess at the tip,
The collar portion is provided with the same thickness as the outer lead portion on both sides of the outer lead portion in plan view,
A package in which the flange is not provided in the second recess. Each of the first electrode and the second electrode has an outer lead portion having the second recessed portion,
Any outer lead part has the said collar part on both sides by planar view,
The package of Claim 14 which does not have the said collar part in a said 2nd dent part. The package includes a first outer surface, a second outer surface adjacent to the first outer surface, a third outer surface adjacent to the second outer surface and facing the first outer surface, and A fourth outer surface adjacent to the first outer surface and the third outer surface;
The outer lead portion of the first electrode protrudes from the first outer surface,
The second electrode is provided on the third outer side facing the first electrode,
The package according to claim 14 or 15, wherein the second outer surface and the fourth outer surface are partially recessed.   17. The package according to claim 16, wherein a part of the first recesses of the second outer surface and the fourth outer surface have the same thickness as the outer lead portion.   The package according to claim 16 or 17, wherein the first electrode and the second electrode are not exposed on the second outer surface and the fourth outer surface.   The package according to any one of claims 14 to 18, wherein the wall portion and the flange portion are integrally formed of the same material.   20. The outer lead portion has an upper surface, a lower surface, and a side surface of the second recess portion plated, and a tip end surface is not plated except for a side surface of the second recess portion. The package according to one item. A package according to any one of claims 14 to 20,
And a light emitting device mounted on at least one of the first electrode and the second electrode of the package. The light-emitting device according to claim 21, wherein the light-emitting element is covered with a second resin.

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