JP5246662B2 - Package for semiconductor device and method for manufacturing the same - Google Patents

Description

  The present invention relates to a semiconductor device package that includes a semiconductor element mounting region and is resin-molded, and a method for manufacturing the same.

  Generally, in resin injection molding of semiconductor device packages and the like, especially when a small-sized one is resin injection molded, when opening the mold plate after molding, the sprue, runner and resin molded body are placed between the plates. The separation is performed automatically, and the pinpoint gate method is adopted as the method.

  In this method, it is assumed that there is a gate residue on the resin molded product side during separation, and the gate portion of the resin molded product is provided on the bottom of a recess called a gate escape, and the gate residue is the depth of this gate escape. The form which is settled in the range and prevents it from protruding from the surface of the outer shape of the resin molded body is taken.

Hereinafter, a method for manufacturing a package for a semiconductor device employing the above-described gate relief will be described with reference to FIG.
4A and 4B are diagrams for explaining a conventional method for manufacturing a package for a semiconductor device. FIG. 4A is a cross-sectional view showing a method of insert molding a lead with a molding die, and FIG. 4B is a completed semiconductor. It is a cross section which shows the package for apparatuses. The semiconductor device package 100 in this description has a structure in which a resin molded body 104 is formed in which a lead frame is provided with a housing portion 104c serving as a semiconductor element mounting portion.

  In FIG. 4, 100 is a package for an optical semiconductor device, 103 is a lead, 103a is a connection electrode, 103b is an outer lead, 104 is a resin molding, 104a is a remaining gate, 104b is a gate escape, 104c is an accommodating portion, 110 is A molding die, 110a is a lower die, 110b is an upper die, and 111 is a sprue.

  At the time of resin molding, the lead 103 is sandwiched between the lower mold 110a and the upper mold 110b, which are the molding dies 110, and melted in a gap that becomes a molding region of the resin molded body 104 formed inside the molding dies 110. The resin molding 104 is molded integrally with the lead 103 by injecting molding resin.

  The resin molded body 104 is formed with a bottomed concave accommodating portion 104c that serves as a semiconductor element mounting region, and the lead 103 has a shape extending from the bottom surface of the accommodating portion 104c to the outside of the resin molded body 104.

  Melted molding resin is injected from the surface of the resin molded body 104 opposite to the side having the accommodating portion 104c and the front and back sides, and a resin introduction path serving as a sprue 111 is provided in the upper mold 110b in communication with the gap. The sprue 111 tapers in the direction of the resin molded body 104 and reaches the air gap to form a pinpoint gate.

In the resin molded body 104, a concave gate relief 104b is formed at the end of the pinpoint gate (FIG. 4A).
When the lower mold 110a and the upper mold 110b are opened after the molding resin is solidified after resin injection, the resin molded body 104 has a contact area with the lower mold 110b depending on the shape of the resin molded body 104. Since it is larger than the area, the resin mold 104 and the lead 103 are not separated from the lower mold 110a, but the upper mold 110b is separated. At this time, the sprue 111 is cut with the pin point gate together with the upper mold 110b, and a trace remains as the gate remaining 104a on the bottom surface of the gate relief 104b on the resin molded body 104 side.

  Thereafter, the integrally formed resin molded body 104 and the lead 103 are taken out from the lower mold 110a, and the lead 103 extending to the outside of the resin molded body 104 is bent as necessary to form the semiconductor device package 100. Form.

  That is, the conventional package 100 for a semiconductor device includes a connection electrode 103a exposed on the bottom surface of the housing portion 104c in a form encompassed by a box-shaped resin molded body 104 having a housing portion 104c for housing a semiconductor element; A lead 103 comprising an outer lead 103b extending to the outside of the resin molded body 104, and a gate relief 104b is formed on the surface of the resin molded body 104 on the side opposite to the side where the housing portion 104c is formed, The remaining gate 104a remains on the bottom surface of the gate relief 104b (FIG. 4B).

By forming the gate relief 104b in this way, the remaining gate 104a remaining at the tip of the sprue 111 by the pinpoint gate method is prevented from protruding from the outer dimension of the package by being accommodated in the gate relief 104b ( For example, see Patent Document 1).
JP 2003-25379 A

  By the way, in recent years, the progress of optical semiconductor devices using optical semiconductor elements has been remarkable, and in particular, the use of the optical semiconductor device as a backlight of a display is expected to be increased. Is required.

  However, in the conventional configuration, it is necessary to provide the concave gate relief 104b that accommodates the remaining gate 104a on the surface opposite to the front and back sides of the housing portion 104c of the resin molded body 104, and ensures the thickness of the resin provided below the lead 103. In order to do so, there was a problem that a reduction in height would be a factor.

  The package for a semiconductor device and the method for manufacturing the same according to the present invention are intended to solve the above-described conventional problems, and to achieve a reduction in height and size without increasing the external dimensions.

In order to achieve the above object, a method for manufacturing a package for a semiconductor device according to the present invention includes one or more first holes formed on a resin molded body formation scheduled portion and one or more formed on an outer lead. A lead frame having a plurality of second holes is used, and the lead frame and the molding are formed by injecting molding resin into a gap formed inside the molding die in a state where the lead frame is sandwiched between the molding dies. At the time of insert molding integrally forming resin, a sprue having a side gate extending from the second hole to the first hole is connected to the second hole, and the second hole is connected to the second hole from the sprue. The molding resin is injected into the gap from a part of the parting line of the molding die through which the outer lead of the lead frame is sandwiched.

  Further, a resin reservoir connected to the second hole is provided at a connection portion of the side gate with the sprue, and a resin flow path extending from the resin reservoir to the first hole via the side gate is formed. Features.

In addition, a constricted portion is provided in the resin reservoir.
Further, the second hole is provided with a taper so that the diameter of the hole increases as it approaches the resin reservoir.

Furthermore, the package for a semiconductor device of the present invention is a package for a semiconductor device on which a semiconductor element is mounted, wherein a plurality of leads in which outer electrodes serving as connection electrodes connected to the semiconductor element and external terminals are integrally formed, A resin molded body formed on the lead; a housing provided on the resin molded body to expose the connection electrode and serving as a mounting region of the semiconductor element; and from the resin molded body of the lead to the resin molded body A first hole provided on the outer side , a second hole provided in the outer lead, and a gate residue remaining in the first hole on the outer lead.
As described above, it is possible to reduce the height without increasing the outer dimensions.

  As described above, according to the semiconductor device and the method for manufacturing the same according to the present invention, since the gate relief for accommodating the gate remainder is not required at the bottom, it is possible to realize a low profile without increasing the external dimensions. .

  The semiconductor device package manufacturing method of the present invention eliminates the need to form a gate relief at the bottom of the semiconductor device package by injecting resin from a parting line that sandwiches the lead frame of the molding die. Since the gate residue remains in the bent portion, the height can be reduced without increasing the external dimensions. That is, since the resin is injected from the side surface of the semiconductor device package, it is not necessary to form a gate relief in the thickness direction, and at least a reduction in the height of the semiconductor device package can be realized. Further, by injecting the resin from the region where the outer lead exists, the remaining gate does not fit in the bent region of the outer lead and the external dimensions are not enlarged.

Embodiments of the present invention will be described below with reference to the drawings.
1A and 1B are diagrams showing a configuration of a lead frame used in a package for a semiconductor device according to the present invention. FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line AA in FIG. . FIG. 2 is a process sectional view showing a method for manufacturing a semiconductor device package according to the present invention, and FIG. 2A is a sectional view of a lead frame similar to FIG.

  In FIGS. 1 and 2, 1 is a lead frame, 2 is a resin molded body forming portion, 3 is a lead, 3a is a connection electrode, 3b is an outer lead, 4 is a frame body for holding the lead frame 1, and 5 is a first One hole, 6 is a second hole, 6a is a tapered surface, 7 is a molding die, 7a is an upper die, 7b is a lower die, 8 is a resin molding, 9 is a side gate, 10 is a sprue, and 11 is a resin. Reservoir 11a is a constricted portion, 12 is an ejector pin, 13 is a gate punch, 14 is a gate remaining, and 15 is a receiving portion.

  FIG. 1 shows a configuration of a lead frame 1 used for manufacturing, and resin molding is performed in a state where a plurality of leads 3 used for a package for a semiconductor device are connected by a frame body 4. The lead frame 1 includes a plurality of leads 3 including connection electrodes 3a connected to a semiconductor element to be mounted and outer leads 3b serving as external terminals. The leads 3 include at least a resin molded body formation planned portion 2. The first hole 5 and the second hole 6 formed outside the resin molded body formation scheduled portion 2 are provided. A resin molded body 8 is formed on the resin molded body formation scheduled portion 2 of the lead frame 1 to form a package for a semiconductor device.

  In FIG. 2, as described above, the lead frame 1 is formed by supporting the leads 3 on a pair of opposing two sides among the four sides forming the frame body 4. Each lead 3 is assumed to have a resin molded body formation scheduled portion 2 including the respective leads 3, and includes a first hole 5 extending from the inside to the outside of the resin molded body formation planned portion 2, and the first A second hole 6 is formed at a position farther from the resin molded body formation scheduled portion 2 than the hole 5 (FIG. 2 (a)).

  In the method for manufacturing a package for a semiconductor device of the present invention, a lead frame is sandwiched between molding dies 7 and a molding resin is injected into a gap formed in the molding die 7 so that the lead frame 1 and the molding resin are integrated. The molding resin is inserted from the part of the parting line of the upper mold 7a and the lower mold 7b of the molding die 7 where the lead 3 of the lead frame is sandwiched into the gap of the molding die 7. To be injected.

At this time, it is preferable to use the above-described lead frame 1 as the lead frame. Hereinafter, a manufacturing method using the lead frame 1 will be described.
As a flow path of the molding resin to be injected, a sprue 10 communicated from a resin supply unit (not shown) to the upper mold 7a of the molding die 7 sandwiching the lead frame 1 is substantially perpendicular to the lead frame 1. It is formed. The sprue 10 is in the form of a pinpoint gate that tapers as it approaches the lead 3 that is the lead frame 1, and its tip is positioned so as to be connected to the second hole 6 opened in the lead 3 when resin is injected. A cylindrical resin reservoir 11 having a predetermined capacity that is continuously connected from the sprue 10 through the second hole 6 is formed at a portion to which the second hole 6 of the lower mold 7b is connected. A side gate 9 that reaches the first hole 5 is formed from the resin reservoir 11 along the lead 3 so as to cover the surface of the lower mold 7b. On the bottom surface of the resin reservoir 11, the top surface of the ejector pin 12 embedded in the lower mold 7b is located. As a result, the molding resin pumped from the resin supply unit (not shown) is accumulated in the resin reservoir 11 from the sprue 10 through the second hole 6 of the lead 3, and passes through the side gate 9 to the first hole 5. And the gap of the molding die 7 is filled.

  A convex portion reaching the surface of the lead 3 is formed in a trapezoidal shape on the lower mold 7b of the molding die 7, and the accommodating portion 15 is formed by the convex portion. The lead 3 is exposed from the molding resin at the bottom of the housing portion 15 and serves as a connection electrode 3a. As described above, the resin molded body 8 is formed in the gap of the molding die 7 (FIG. 2B).

  Next, after the molding of the resin molded body 8 is completed, the upper mold 7a and the lower mold 7b are opened. At this time, due to the shape of the resin molded body 8 and the presence of the resin reservoir 11 and the side gate 9, the contact area with the lower mold 7b is larger than that of the upper mold 7a, and the adhesion is greater. It remains on the lower mold 7b side and is separated from the upper mold 7a (FIG. 2 (c)).

Further, the molding resin is cut at the tip of the sprue 10 which is a pinpoint gate, and the sprue 10 is separated together with the upper die 7a.
Here, as shown in the enlarged view, when the constricted portion 11a is provided on the peripheral portion of the resin reservoir 11, an anchor effect between the resin reservoir 11 and the lower mold 7b is obtained, and the sprue 10 is opened when the mold is opened. Thus, it is possible to reliably prevent the resin reservoir 11 from floating away from the lower mold 7b.

  Next, by pushing up the resin reservoir 11 with the ejector pin 12, the integrally formed lead 3, resin molded body 8, side gate 9, and resin reservoir 11 are released from the lower mold 7b and taken out (FIG. 2D). )).

  Next, the resin reservoir 11 is pressed by pressing the resin reservoir 11 through the second hole 6 from the opposite surface of the lead 3 on the side where the side gate 9 is formed by the gate punch 13 of a gate cutting machine (not shown). 11 and the side gate 9 are cut together.

Accordingly, the remaining gate 14 remaining in the resin molded body 8 can be stopped in the first hole 5 or on the first hole 5 located outward from the resin molded body 8.
Here, as shown in the enlarged view, when the cross section of the second hole 6 is a tapered surface 6a that expands toward the resin reservoir 11, the gate can be easily cut and the stress applied to the lead 3 can be reduced. Is possible (FIG. 2E).

  Next, if necessary, the lead 3 is cut to a certain size, and the lead 3 is bent with the surface on which the side gate 9 is present outside to form the outer lead 3b, thereby forming a semiconductor device. The outer lead 3b may be bent into a gull wing shape, may be J-bended, and the terminal shape is arbitrary.

  Thus, by injecting the resin from the parting line, it is not necessary to provide the gate relief 104b at the bottom of the semiconductor device package, and the thickness of the semiconductor device package can be reduced.

  Further, by bending along the side surface of the resin molded body 8 with the side of the lead 3 where the side gate 9 is present as the outside, the remaining gate 14 is positioned above the bending of the lead 3 from the first hole 5. Therefore, the remaining gate 14 does not hinder bending.

  Further, since the remaining gate 14 remaining in the resin molded body 8 remains in the range of the first hole 5, it does not protrude beyond the lead 3 from the side surface of the resin molded body 8 and does not affect the package dimensions (FIG. 2 (f)).

  According to such a configuration, since it is not necessary to provide the gate relief 104b on the bottom surface to accommodate the remaining gate 14 of the resin molded body 8, the thickness of the semiconductor device package can be reduced, and the bent portion of the lead 3 can be formed. Since the remaining gate 14 can be accommodated in the gate, the height and size can be reduced.

  Even when the lead frame 1 shown in FIG. 1 is not used, it is not necessary to provide the gate relief 104b at the bottom of the package for the semiconductor device by injecting resin from the parting line, and at least for the semiconductor device. The thickness of the package can be reduced.

  Further, in the case where a plurality of semiconductor device packages are simultaneously resin-molded with one molding die 7, the first hole 5 of the lead 3 is used as a space for the molding resin flow path. When the molding resin is injected from the joining surface of the upper mold 7a and the lower mold 7b, which is a parting line, it is not necessary to secure a resin flow path separately, so the space efficiency of the arrangement of the molding mold 7 and the lead frame 1 is eliminated. Many semiconductor device packages can be molded at the same time with the molding die 7 having the same size.

The semiconductor device package obtained from the method for manufacturing an optical semiconductor device package of the present invention is as shown in FIG.
That is, a box-shaped resin molded body 8 having a housing portion 15 for housing a semiconductor element, and an outer lead 3b extending from the connection electrode 3a exposed on the bottom surface of the housing portion 15 to the outside of the resin molded body 8. The outer lead 3b includes a first hole 5 extending from the resin molded body 8 to the outside of the resin molded body 8 and the resin molded body 8 from the first hole 5. A second hole 6 located at a distant location is opened, and the outer lead 3b is bent along the side surface of the resin molded body 8 in the direction opposite to the front and back where the housing portion 15 of the resin molded body 8 is formed.

The remaining gate 14 remaining on the side surface of the resin molded body 8 is located on the first hole 5 of the outer lead 3b.
A semiconductor device using such a package for a semiconductor device will be described with reference to FIG.

FIG. 3 is a diagram showing a configuration of a semiconductor device using the package for a semiconductor device of the present invention.
In FIG. 3, an optical semiconductor device using an optical semiconductor element as a semiconductor element will be described as an example. The same constituent elements as those in FIGS.

  In the optical semiconductor device shown in FIG. 3, the optical semiconductor element 16 is fixed to one of the connection electrodes 3a located on the bottom surface of the housing portion 15, and the bonding electrode (not shown) of the optical semiconductor element 16 and the other connection electrode are connected. 3a is wire-bonded with a wire 17 and includes the optical semiconductor element 16, and the accommodating portion 15 is filled with a translucent sealing resin 18.

  In the optical semiconductor device of the present invention, the outer lead 3b is bent along the side surface of the molded body 8 in the direction opposite to the front and back of the molded body 8 where the housing portion 15 is formed. Since it is bent in a direction parallel to the surface on which the housing portion 15 of the resin molded body 8 is formed, the resin molded body 8 is mounted on a mounting board (not shown) on the front and back opposite surfaces on which the housing portion 15 is formed. The so-called top view type that emits light having an optical axis substantially perpendicular to the mounting surface of the mounting substrate (not shown) is not limited to this, but the outer lead Depending on the shape and bending direction of 3b, the mounting surface of the resin molded body 8 with respect to the mounting substrate (not shown) is changed so that the optical axis is substantially parallel to the mounting surface of the mounting substrate (not shown). So-called side view that emits light with It is also possible to type.

  In the above description, the example in which the outer leads 3b serving as the external terminals are formed in a gull wing shape is illustrated and described. However, J bend may be applied, and the terminal shape is arbitrary.

  INDUSTRIAL APPLICABILITY The present invention can realize a reduction in height without enlarging the external dimensions, and is useful for a resin-molded semiconductor device package having a semiconductor element mounting region and its manufacturing method.

The figure which shows the structure of the lead frame used for the package for semiconductor devices of this invention Process sectional drawing which shows the manufacturing method of the package for semiconductor devices of this invention The figure which shows the structure of the semiconductor device using the package for semiconductor devices of this invention The figure explaining the manufacturing method of the conventional package for semiconductor devices

DESCRIPTION OF SYMBOLS 1 Lead frame 2 Resin molded object formation scheduled part 3, 103 Lead 3a, 103a Connection electrode 3b, 103b Outer lead 4 Frame 5 First hole 6 Second hole 6a Tapered surface 7, 110 Mold 7a, 110b Upper die 7b, 110a Lower die 8, 104 Resin molded body 9 Side gate 10, 111 Sprue 11 Resin reservoir 11a Constricted portion 12 Ejector pin 13 Gate punch 14, 104a Gate remaining 15, 104c Housing portion 16 Optical semiconductor element 17 Wire 18 Sealing Resin 100 Package for semiconductor device 104b Gate escape

Claims (5)

Using a lead frame having one or more first holes formed over the resin molded body formation scheduled portion and one or more second holes formed in the outer lead,
In the insert molding in which the lead frame and the molding resin are integrally formed by injecting a molding resin into a gap formed inside the molding die with the lead frame sandwiched between the molding dies.
A sprue having a side gate extending from the second hole to the first hole is connected to the second hole, and the parting line of the molding die is connected to the second hole from the sprue through the second hole. A method of manufacturing a package for a semiconductor device, characterized in that the molding resin is injected into the gap from a portion where an outer lead of a lead frame is sandwiched. A resin reservoir connected to the second hole is provided at a connection portion of the side gate with the sprue, and a resin flow path extending from the resin reservoir to the first hole via the side gate is formed. A method for manufacturing a package for a semiconductor device according to claim 1. 3. The method for manufacturing a package for a semiconductor device according to claim 2, wherein a constriction is provided in the resin reservoir . 4. The method of manufacturing a package for a semiconductor device according to claim 2 , wherein a taper is provided so that the diameter of the hole increases as the second hole approaches the resin reservoir . A package for a semiconductor device on which a semiconductor element is mounted,
  A plurality of leads formed integrally with an outer lead to be a connection electrode and an external terminal connected to the semiconductor element;
  A resin molded body formed on the lead;
  A housing part provided on the resin molded body to expose the connection electrode and serve as a mounting region of the semiconductor element;
  A first hole provided from the resin molded body of the lead to the outside of the resin molded body;
  A second hole provided in the outer lead;
  Gate residue remaining in the first hole on the outer lead
A package for a semiconductor device, comprising:

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