WO2010092853A1 - Frame package manufacturing method - Google Patents

Frame package manufacturing method Download PDF

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Publication number
WO2010092853A1
WO2010092853A1 PCT/JP2010/050489 JP2010050489W WO2010092853A1 WO 2010092853 A1 WO2010092853 A1 WO 2010092853A1 JP 2010050489 W JP2010050489 W JP 2010050489W WO 2010092853 A1 WO2010092853 A1 WO 2010092853A1
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WO
WIPO (PCT)
Prior art keywords
frame
mold
gate
cavity
manufacturing
Prior art date
Application number
PCT/JP2010/050489
Other languages
French (fr)
Japanese (ja)
Inventor
孝二 言水
Original Assignee
三洋電機株式会社
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Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Publication of WO2010092853A1 publication Critical patent/WO2010092853A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0231—Stems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D

Definitions

  • the present invention relates to a method for manufacturing a frame package on which a light emitting element is mounted.
  • Conventional frame packages for semiconductor laser devices generally include at least a frame composed of a main frame and a sub frame that are electrically insulated from each other.
  • the main frame and the sub frame are fixed to each other by the resin molding portion.
  • the main frame is a frame on which a semiconductor laser element is mounted and is electrically connected to one electrode of the semiconductor laser element via a bonding wire.
  • the sub-frame is a frame that is electrically connected to the other electrode of the semiconductor laser element via a bonding wire.
  • the above-described conventional frame package for a semiconductor laser device is manufactured through the following processes, for example.
  • a metal structure in which a plurality of frames each composed of a main frame and a sub frame are integrally connected is manufactured by pressing a metal thin plate.
  • a molding die for insert molding is prepared, and the resin molding part is molded using the molding die so that the main frame and the sub frame are fixed to each other by the resin molding part. To do. Thereafter, the molded products are individually separated. As a result, the conventional frame package for the semiconductor laser device is obtained.
  • the mold for insert molding includes a pair of molds arranged to face each other, and a cavity (a shape reflecting the shape of the resin molding portion) is formed by clamping the pair of molds. Space) is formed.
  • One of the pair of molds is provided with a gate for injecting molten resin to be a resin molding portion into the cavity.
  • the conventional frame package manufacturing method has a problem that it is difficult to reduce the thickness of the frame package.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method of manufacturing a frame package capable of reducing the thickness of the frame package (resin molding part).
  • a method of manufacturing a frame package includes at least a frame including a first frame and a second frame that are electrically insulated from each other. And a second frame having a structure in which the second frame is fixed to each other by a resin molded portion, and a light emitting element is mounted on the frame, wherein the first mold and the second mold are arranged to face each other.
  • a cavity is formed by clamping the first mold and the second mold, and a gate protruding into the cavity is provided at a predetermined portion facing the second mold of the first mold.
  • the frame is mounted on the molding die so that the step of preparing the molding die and the portion covered by the resin molding part of the frame are placed in the cavity.
  • a step of clamping by the molten resin serving as the resin molded portion is injected from the gate into the cavity, and a step of curing the molten resin in the cavity.
  • the gate inlet is disposed in a region that does not overlap with the frame in plan view, and the height of the outer edge surface of the gate inlet is A molding die whose position is substantially the same as the height position of the surface on the first die side of the frame is used.
  • the gate inlet is arranged in a region that does not overlap with the frame when seen in plan view.
  • the height position of the outer edge surface of the injection port of the gate is substantially the same as the height position of the surface on the first mold side of the frame, melting in the cavity
  • the depth of the cavity concave portion of the first mold can be made smaller than before without impairing the fluidity of the resin.
  • the thickness of the portion molded by the cavity recess of the first mold (the portion on the first mold side of the resin molding portion) can be made smaller than before, so that the frame package can be made thinner. Is possible.
  • the gate inlet at the time of mold release Even if a burr along the surface of the frame is generated, the burr protrudes from a height position substantially flush with the surface of the frame on the first mold side. For this reason, in addition to being able to reduce the thickness of the frame package, it is possible to suppress burrs from protruding outside the resin molded portion.
  • the outer edge surface of the gate inlet may be in contact with the surface of the frame on the first mold side, or the gate is poured on the surface of the frame on the first mold side.
  • the outer edge surface of the entrance may not be in contact.
  • the gate package has the same function as a presser pin (a pin for suppressing frame misalignment and twisting) installed in the molding die, so the frame package can be made thinner. It is possible to reduce the number of presser pins installed in the molding die.
  • a gate injection port is inserted into a gap between the first frame and the second frame when viewed in plan. Is preferably arranged. In this way, the gate inlet can be easily arranged in a region that does not overlap the frame when seen in a plan view.
  • the frame package can be easily reduced in thickness.
  • FIG. 3 is a plan view for explaining the shape of a resin molding portion of the frame package shown in FIG. 1 (a view when viewed from the side on which the light emitting element is mounted).
  • FIG. 2 is a plan view for explaining the shape of a resin molding portion of the frame package shown in FIG. 1 (a view when viewed from the back side opposite to the side on which the light emitting element is mounted).
  • FIG. 5 is a cross-sectional view taken along line 100-100 in FIGS. 3 and 4.
  • FIG. 8 is a plan view of a state where a resin molding portion is molded in a portion to be a frame shown in FIG.
  • FIG. 8 is a plan view of a state where a resin molding portion is molded in a portion to be a frame shown in FIG. 7 (a diagram when viewed from the back side opposite to the side on which the light emitting element is mounted).
  • a frame package 10 manufactured using the method for manufacturing a frame package according to the present embodiment is for electrically connecting a semiconductor laser element 11 and an external device (not shown) as shown in FIG.
  • the semiconductor laser element 11 mounted on the frame 1 is an example of the “light emitting element” in the present invention.
  • the semiconductor laser element 11 shown in FIG. 1 is attached to the submount 12 by the junction down method, and the submount 12 is fixed to the frame 1 to be mounted on the frame 1. Yes.
  • the semiconductor laser element 11 is a two-wavelength laser element, and the p-side electrode is separated into two and the n-side electrode is common.
  • the p-side electrode and the n-side electrode of the semiconductor laser element 11 are electrically connected to the frame 1 through bonding wires 13. Since the p-side electrode of the semiconductor laser element 11 is electrically connected to the electrode pad formed on the submount 12, the p-side electrode bonding wire 13 is bonded to the electrode pad of the submount 12. .
  • the frame 1 on which the semiconductor laser element 11 is mounted includes one main frame 2 and two sub frames 3 and 4, and these are electrically insulated from each other. It has a structure.
  • the frame 1 is made of a metal thin plate (thin plate made of copper, iron, or the like) and is excellent in thermal conductivity and conductivity.
  • the main frame 2 is an example of the “first frame” in the present invention
  • the sub-frames 3 and 4 are examples of the “second frame” in the present invention.
  • the main frame 2 is a frame on which the semiconductor laser element 11 is mounted and the n-side electrode of the semiconductor laser element 11 is electrically connected. That is, the main frame 2 has at least an element mounting portion 2a on which the semiconductor laser element 11 is mounted and an n-side electrode bonding wire 13 is bonded. A lead portion 2b connected to an external device is provided so as to extend integrally from the element mounting portion 2a of the main frame 2.
  • the sub-frame 3 is a frame to which the p-side electrode (electrode pad of the submount 12) of the semiconductor laser element 11 is electrically connected, and a wire connection portion to which a bonding wire 13 for the p-side electrode is bonded. 3a and a lead portion (a portion connected to an external device) 3b extending integrally from the wire connection portion 3a.
  • the subframe 4 also has a wire connection portion 4 a and a lead portion 4 b as in the subframe 3.
  • the resin molded portion 5 has a shape as shown in FIG. 3 in a plan view from the side on which the semiconductor laser element 11 is mounted (hereinafter referred to as the element mounting side). More specifically, the part on the element mounting side of the resin molding portion 5 surrounds the element mounting area and the area including the peripheral area from three directions when viewed in plan, and the semiconductor laser element 11 (see FIG. 1).
  • the light emitting side is substantially U-shaped open.
  • an opening 5 a that straddles the main frame 2 and the subframe 3 is formed in a portion on the back surface side of the resin molded portion 5. A part of the surface on the back side of each of the main frame 2 and the sub-frame 3 is exposed from the opening 5a.
  • a circular opening 5 b is formed in a portion on the back surface side of the resin molding portion 5 so as to expose a part of the surface on the back surface side of the sub-frame 4.
  • the total thickness T1 of the resin molded portion 5 is about 1.5 mm to about 1.6 mm, and the thickness T2 of the back side portion of the resin molded portion 5 is about 0.2 mm. . That is, the thickness of the portion on the back surface side of the resin molded portion 5 is smaller than that of the conventional one.
  • a metal structure 20 in which a plurality of frames 1 (the hatched portions in FIGS. 6 and 7) are integrally connected is manufactured.
  • Such a metal structure 20 can be obtained by, for example, pressing (punching) a metal thin plate such as a copper thin plate.
  • FIGS. 8 and 9 show a predetermined portion of the frame 1 when viewed from the element mounting side
  • FIG. 9 shows the planar shape of the resin molded portion 5 when viewed from the back side opposite to the element mounting side. is there.
  • the mold 31 is disposed on the back side opposite to the element mounting side, and the mold 32 is disposed on the element mounting side. Is.
  • the pair of molds 31 and 32 included in the molding mold 30 are examples of the “first mold” and the “second mold” of the present invention, respectively.
  • the structure of the molding die 30 used in the insert molding step is a cavity (resin molding part 5 (see FIGS. 8 and 9)) by clamping the pair of dies 31 and 32. 30a) is formed.
  • the space 30a is formed to reflect the shape of the above.
  • the mold 31 of the pair of molds 31 and 32 is provided with a gate 31a for injecting molten resin to be the resin molding portion 5 into the cavity 30a.
  • the gate 31a is formed on the cavity surface of the mold 31 opposite to the cavity surface of the other mold 32 (the bottom surface of the cavity recess formed in the other mold 32). Provided in a predetermined portion of the bottom surface) and protrudes into the cavity 30a.
  • the gate 31a provided in the mold 31 is a region 20a in which the injection port 31b of the gate 31a does not overlap the frame 1 when viewed in plan when the molding die 30 to which the frame 1 is attached is clamped. That is, it is formed so as to be in the gap between the main frame 2 and the sub-frame 3 when seen in a plan view.
  • the protruding height of the gate 31a is such that when the molding die 30 to which the frame 1 is attached is clamped, the outer edge surface 31c of the injection port 31b of the gate 31a is different from the surface of the frame 1 on the die 31 side.
  • the height position of the outer edge surface 31c of the inlet 31b of the gate 31a is set to be substantially the same as the height position of the surface of the frame 1 on the mold 31 side.
  • cross-sectional view of the molding die 30 shown in FIG. 10 represents the shape of the cavity 30a for resin molding of the cross-sectional portion along the line 200-200 in FIGS.
  • the injection port 31b of the gate 31a is disposed in the gap between the main frame 2 and the sub frame 3 when viewed in plan. Further, the outer edge surface 31c of the inlet 31b of the gate 31a is in contact with a part of the surface of the main frame 2 and the sub frame 3 on the mold 31 side. That is, a part of the surface on the mold 31 side of each of the main frame 2 and the sub frame 3 is pressed by the outer edge surface 31c of the inlet 31b of the gate 31a, and the main frame 2 and the sub frame 3 are held. .
  • the main frame 2 and the sub-frame are constituted by the gate 31a and a predetermined portion (a portion on which each of the main frame 2 and the sub-frame 3 is placed) facing the gate 31a.
  • the frame 3 is clamped.
  • a part of the surface of the sub frame 4 on the mold 31 side is held by a pressing pin (not shown).
  • molten resin to be the resin molding portion 5 (see FIGS. 8 and 9) is injected from the gate 31a into the cavity 30a (in the direction of the arrow in FIG. 11). At this time, the molten resin flowing in the cavity 30 a is filled over the entire area of the cavity 30 a without being blocked by the frame 1. Then, after the molten resin is filled over the entire area in the cavity 30a, the molten resin filled in the cavity 30a is cured. Thereby, as shown in FIG. 12, the main frame 2 and the sub-frames 3 and 4 are fixed to each other by the resin molding portion 5.
  • release is performed and the molded product is taken out.
  • a burr 5c is generated along the injection port 31b of the gate 31a.
  • the burr 5c protrudes from a height position substantially flush with the surface of the frame 1 on the mold 31 side.
  • the outer edge surface 31c of the injection port 31b of the gate 31a presses and holds a part of the surface of each of the main frame 2 and the sub frame 3 on the mold 31 side, molding is performed from the back side opposite to the element mounting side.
  • a part of the surface of each of the main frame 2 and the sub-frame 3 (the portion that is pressed and held by the outer edge surface 31c of the inlet 31b of the gate 31a (see FIG. 11)). Will be exposed. That is, the opening 5a is formed in the portion on the back surface side of the resin molding portion 5, and a part of the surface on the back surface side of each of the main frame 2 and the sub frame 3 is exposed from the opening 5a.
  • another opening 5b formed in the portion on the back surface side of the resin molding portion 5 is formed by pressing and holding a part of the surface on the back surface side of the sub frame 4 by a pressing pin (not shown). Is. Therefore, a part of the surface on the back surface side of the sub-frame 4 is exposed from the opening 5 b of the resin molding portion 5.
  • the frame package 10 shown in FIG. 1 is manufactured by separating the molded products individually.
  • the gate 31a is placed in the region 20a that does not overlap the frame 1 when viewed in plan.
  • the molding die 30 in which the injection port 31b is disposed and the outer edge surface 31c of the injection port 31b of the gate 31a is in contact with a part of the surface of the frame 1 on the mold 31 side.
  • the depth of the cavity recess of the mold 31 can be made smaller than before without impairing the fluidity of the molten resin in the cavity 30a.
  • the thickness of the part molded by the cavity recess of the mold 31 (the part on the back side of the resin molding part 5) can be made smaller than before, so that the frame package 10 can be made thinner. It becomes.
  • the outer edge surface 31c of the inlet 31b of the gate 31a is used to A part of the surface on the mold 31 side is pressed and held, so that it is the same as a presser pin (a pin for suppressing misalignment or twisting of the frame 1) installed in the molding die 30. Since the gate 31a has the function, the number of presser pins installed in the molding die 30 can be reduced while reducing the thickness of the frame package 10.
  • the frame package manufacturing method of the present embodiment when the frame 1 is mounted on the molding die 30 and clamped, the main frame 2 and the sub frame 3 are viewed in plan view.
  • the injection port 31b of the gate 31a By arranging the injection port 31b of the gate 31a in the gap between them, the injection port 31b of the gate 31a can be easily arranged in a region that does not overlap with the frame 1 in plan view. it can.
  • the main frame is arranged between the two sub-frames.
  • the present invention is not limited to this, and the arrangement position of each frame can be changed as appropriate. That is, when there is one main frame and two sub frames, one of the two sub frames may be arranged in the center.
  • the structure includes one main frame and two subframes.
  • the present invention is not limited to this, and the number of frames can be changed as appropriate.
  • a structure including one main frame and three sub frames may be used, and the sub frames may be arranged in the order of “sub frame, sub frame, main frame, sub frame”.
  • the outer edge surface of the gate inlet may be brought into contact with the two subframes. In this way, it is possible to reduce the pressing pin for the sub frame.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

Provided is a frame package manufacturing method capable of achieving thickness reduction. The frame package manufacturing method utilizes molding dies (30) made such that, when viewed in plan view, an injection port (31b) of a gate (31a) is disposed in an area (20a) that does not overlap with a frame (1), and the height position of the outer edge surface (31c) of said injection port (31b) is almost the same as the height position of the side of the frame (1) toward the die (31) when the dies clamped.

Description

フレームパッケージの製造方法Manufacturing method of frame package
　本発明は、発光素子が搭載されるフレームパッケージの製造方法に関する。 The present invention relates to a method for manufacturing a frame package on which a light emitting element is mounted.
　従来、発光素子としての半導体レーザ素子が搭載されるフレームパッケージが知られており、半導体レーザ素子と外部機器とを電気的に接続するために使用されている（たとえば、特許文献１参照）。 Conventionally, a frame package in which a semiconductor laser element as a light emitting element is mounted is known, and is used to electrically connect the semiconductor laser element and an external device (for example, see Patent Document 1).
　従来の半導体レーザ素子用のフレームパッケージは、一般的に、互いに電気的に絶縁された主フレームおよび副フレームからなるフレームを少なくとも備えている。そして、それら主フレームおよび副フレームは、樹脂成形部によって互いに固着された状態となっている。なお、主フレームは、半導体レーザ素子が搭載され、かつ、ボンディングワイヤを介して半導体レーザ素子の一方電極と電気的に接続されるフレームである。また、副フレームは、ボンディングワイヤを介して半導体レーザ素子の他方電極と電気的に接続されるフレームである。 Conventional frame packages for semiconductor laser devices generally include at least a frame composed of a main frame and a sub frame that are electrically insulated from each other. The main frame and the sub frame are fixed to each other by the resin molding portion. The main frame is a frame on which a semiconductor laser element is mounted and is electrically connected to one electrode of the semiconductor laser element via a bonding wire. The sub-frame is a frame that is electrically connected to the other electrode of the semiconductor laser element via a bonding wire.
　また、上記した従来の半導体レーザ素子用のフレームパッケージは、たとえば、以下のような工程を経て製造される。 Also, the above-described conventional frame package for a semiconductor laser device is manufactured through the following processes, for example.
　すなわち、まず、金属薄板に対してプレス加工を施すことによって、主フレームおよび副フレームからなるフレームが一体的に複数連結された金属構造体を作製する。次に、インサート成形を行うための成形用金型を準備し、その成型用金型を用いて樹脂成形部を成形することで、主フレームおよび副フレームが樹脂成形部によって互いに固着された状態にする。この後、成形品を個々に分離する。これにより、上記した従来の半導体レーザ素子用のフレームパッケージが得られる。 That is, first, a metal structure in which a plurality of frames each composed of a main frame and a sub frame are integrally connected is manufactured by pressing a metal thin plate. Next, a molding die for insert molding is prepared, and the resin molding part is molded using the molding die so that the main frame and the sub frame are fixed to each other by the resin molding part. To do. Thereafter, the molded products are individually separated. As a result, the conventional frame package for the semiconductor laser device is obtained.
　なお、インサート成形を行うための成形用金型は、互いに対向配置される一対の金型を含んでおり、その一対の金型を型締めすることによってキャビティ（樹脂成形部の形状を反映した形状を成す空間）が形成されるようになっている。また、一対の金型のうちの一方の金型には、樹脂成形部となる溶融樹脂をキャビティ内に注入するためのゲートが設けられている。 The mold for insert molding includes a pair of molds arranged to face each other, and a cavity (a shape reflecting the shape of the resin molding portion) is formed by clamping the pair of molds. Space) is formed. One of the pair of molds is provided with a gate for injecting molten resin to be a resin molding portion into the cavity.
特開２００８－２１７５４号公報JP 2008-21754 A
　ところで、上記した従来のフレームパッケージの製造方法において、より薄型化されたフレームパッケージを得るには、キャビティの厚み（一方の金型のキャビティ用凹部の深さ）を小さくすることで樹脂成形部の厚みを小さくすればよいが、この場合には以下のような不都合が生じる。 By the way, in the above-described conventional frame package manufacturing method, in order to obtain a thinner frame package, it is possible to reduce the thickness of the cavity (the depth of the cavity concave portion of one mold) to reduce the resin molded portion. The thickness may be reduced, but in this case, the following inconvenience occurs.
　すなわち、キャビティの厚みを単に小さくするだけでは、ゲートからキャビティ内に注入される溶融樹脂の流動がフレームによって阻害され、キャビティ内における溶融樹脂の流動性が低下してしまうという不都合がある。したがって、従来のフレームパッケージの製造方法では、フレームパッケージの薄型化を図るのが困難であるという問題がある。 That is, if the thickness of the cavity is simply reduced, the flow of the molten resin injected from the gate into the cavity is hindered by the frame, and the fluidity of the molten resin in the cavity is reduced. Therefore, the conventional frame package manufacturing method has a problem that it is difficult to reduce the thickness of the frame package.
　本発明は、上記のような課題を解決するためになされたものであり、フレームパッケージ（樹脂成形部）の薄型化を図ることが可能なフレームパッケージの製造方法を提供することを目的とする。 The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method of manufacturing a frame package capable of reducing the thickness of the frame package (resin molding part).
　上記の目的を達成するために、本発明の一の局面によるフレームパッケージの製造方法は、互いに電気的に絶縁された第１フレームおよび第２フレームからなるフレームを少なくとも備えているとともに、第１フレームおよび第２フレームが樹脂成形部によって互いに固着された構造を有し、フレームに発光素子が搭載されるフレームパッケージの製造方法であって、互いに対向配置される第１金型および第２金型を含み、第１金型および第２金型を型締めすることによってキャビティが形成され、かつ、キャビティ内に向かって突出するゲートが第１金型の第２金型と対向する所定部分に設けられた成形用金型を準備する工程と、フレームの樹脂成形部によって覆われる部分がキャビティ内に配置されるように、フレームを成形用金型に装着して型締めする工程と、樹脂成形部となる溶融樹脂をゲートからキャビティ内に注入し、キャビティ内の溶融樹脂を硬化させる工程とを備えている。そして、フレームを成形用金型に装着して型締めした際に、平面的に見てフレームと
重畳しない領域にゲートの注入口が配置され、かつ、そのゲートの注入口の外縁面の高さ位置がフレームの第１金型側の表面の高さ位置とほぼ同じとなるような成型用金型を用いる。 In order to achieve the above object, a method of manufacturing a frame package according to an aspect of the present invention includes at least a frame including a first frame and a second frame that are electrically insulated from each other. And a second frame having a structure in which the second frame is fixed to each other by a resin molded portion, and a light emitting element is mounted on the frame, wherein the first mold and the second mold are arranged to face each other. A cavity is formed by clamping the first mold and the second mold, and a gate protruding into the cavity is provided at a predetermined portion facing the second mold of the first mold. The frame is mounted on the molding die so that the step of preparing the molding die and the portion covered by the resin molding part of the frame are placed in the cavity. A step of clamping by the molten resin serving as the resin molded portion is injected from the gate into the cavity, and a step of curing the molten resin in the cavity. When the frame is mounted on the molding die and clamped, the gate inlet is disposed in a region that does not overlap with the frame in plan view, and the height of the outer edge surface of the gate inlet is A molding die whose position is substantially the same as the height position of the surface on the first die side of the frame is used.
　この一の局面によるフレームパッケージの製造方法では、上記のように、フレームを成形用金型に装着して型締めした際に、平面的に見てフレームと重畳しない領域にゲートの注入口が配置され、かつ、そのゲートの注入口の外縁面の高さ位置がフレームの第１金型側の表面の高さ位置と略同じとなるような成型用金型を用いることによって、キャビティ内における溶融樹脂の流動性などを損なうことなく、第１金型のキャビティ用凹部の深さを従来よりも小さくすることができる。その結果、第１金型のキャビティ用凹部で成形される部分（樹脂成形部の第１金型側の部分）の厚みを従来よりも小さくすることができるので、フレームパッケージの薄型化を図ることが可能となる。 In the frame package manufacturing method according to this aspect, as described above, when the frame is mounted on the molding die and clamped, the gate inlet is arranged in a region that does not overlap with the frame when seen in plan view. And by using a molding die in which the height position of the outer edge surface of the injection port of the gate is substantially the same as the height position of the surface on the first mold side of the frame, melting in the cavity The depth of the cavity concave portion of the first mold can be made smaller than before without impairing the fluidity of the resin. As a result, the thickness of the portion molded by the cavity recess of the first mold (the portion on the first mold side of the resin molding portion) can be made smaller than before, so that the frame package can be made thinner. Is possible.
　また、ゲートの注入口の外縁面の高さ位置がフレームの第１金型側の表面の高さ位置と略同じになっている状態で樹脂成形が行われるため、離型時にゲートの注入口に沿ったバリが発生したとしても、そのバリはフレームの第１金型側の表面と略面一の高さ位置から突出する。このため、フレームパッケージを薄型化することができることに加えて、バリが樹脂成形部よりも外側にはみ出してしまうのも抑制することができる。 In addition, since the resin molding is performed in a state where the height position of the outer edge surface of the gate inlet is substantially the same as the height position of the surface on the first mold side of the frame, the gate inlet at the time of mold release Even if a burr along the surface of the frame is generated, the burr protrudes from a height position substantially flush with the surface of the frame on the first mold side. For this reason, in addition to being able to reduce the thickness of the frame package, it is possible to suppress burrs from protruding outside the resin molded portion.
　なお、上記したフレームパッケージの製造方法では、フレームの第１金型側の表面にゲートの注入口の外縁面が接触していてもよいし、フレームの第１金型側の表面にゲートの注入口の外縁面が接触していなくてもよい。 In the frame package manufacturing method described above, the outer edge surface of the gate inlet may be in contact with the surface of the frame on the first mold side, or the gate is poured on the surface of the frame on the first mold side. The outer edge surface of the entrance may not be in contact.
　上記一の局面によるフレームパッケージの製造方法において、フレームを成形用金型に装着して型締めした際に、ゲートの注入口の外縁面でフレームの第１金型側の表面の一部が押圧保持されることが好ましい。このようにすれば、成型用金型に設置される押えピン（フレームの位置ずれやねじれなどを抑制するためのピン）と同様の機能をゲートが持つことになるため、フレームパッケージの薄型化を図りながら、成形用金型に設置する押えピンの個数を減らすことができる。 In the frame package manufacturing method according to the above aspect, when the frame is mounted on a molding die and clamped, a part of the surface on the first mold side of the frame is pressed by the outer edge surface of the gate inlet. It is preferred that it be retained. In this way, the gate package has the same function as a presser pin (a pin for suppressing frame misalignment and twisting) installed in the molding die, so the frame package can be made thinner. It is possible to reduce the number of presser pins installed in the molding die.
　上記一の局面によるフレームパッケージの製造方法において、フレームを成形用金型に装着して型締めした際に、平面的に見て第１フレームと第２フレームとの間の間隙にゲートの注入口が配置されることが好ましい。このようにすれば、容易に、平面的に見てフレームと重畳しない領域にゲートの注入口が配置された状態にすることができる。 In the method of manufacturing a frame package according to the above aspect, when the frame is mounted on a molding die and clamped, a gate injection port is inserted into a gap between the first frame and the second frame when viewed in plan. Is preferably arranged. In this way, the gate inlet can be easily arranged in a region that does not overlap the frame when seen in a plan view.
　この場合、第１フレームおよび第２フレームのそれぞれの第１金型側の表面の一部がゲートの注入口の外縁面で押圧保持されることが好ましい。このようにすれば、フレームの押圧保持を確実に行うことができる。これにより、フレームの位置ずれやねじれなどが抑制され、かつ、薄型化されたフレームパッケージを得ることができる。 In this case, it is preferable that a part of the first mold side surface of each of the first frame and the second frame is pressed and held by the outer edge surface of the gate inlet. In this way, the pressing and holding of the frame can be reliably performed. As a result, a frame package with reduced frame displacement and twist can be obtained.
　以上のように、本発明によれば、容易に、フレームパッケージの薄型化を図ることができる。 As described above, according to the present invention, the frame package can be easily reduced in thickness.
本発明の一実施形態によるフレームパッケージの製造方法を用いて製造されたフレームパッケージの平面図（発光素子が搭載された状態の図）である。It is a top view (figure of the state in which the light emitting element was mounted) of the frame package manufactured using the manufacturing method of the frame package by one Embodiment of this invention. 図１に示したフレームパッケージの構成部材であるフレームの平面図である。It is a top view of the flame | frame which is a structural member of the frame package shown in FIG. 図１に示したフレームパッケージの樹脂成形部の形状を説明するための平面図（発光素子が搭載される側から見た場合の図）である。FIG. 3 is a plan view for explaining the shape of a resin molding portion of the frame package shown in FIG. 1 (a view when viewed from the side on which the light emitting element is mounted). 図１に示したフレームパッケージの樹脂成形部の形状を説明するための平面図（発光素子が搭載される側とは反対の裏面側から見た場合の図）である。FIG. 2 is a plan view for explaining the shape of a resin molding portion of the frame package shown in FIG. 1 (a view when viewed from the back side opposite to the side on which the light emitting element is mounted). 図３および図４の１００－１００線に沿った断面図である。FIG. 5 is a cross-sectional view taken along line 100-100 in FIGS. 3 and 4. 本発明の一実施形態によるフレームパッケージの製造方法を説明するための平面図（フレームとなる金属薄板に対してプレス加工を施した状態の図）である。It is a top view for demonstrating the manufacturing method of the frame package by one Embodiment of this invention (The figure of the state which pressed the metal thin plate used as a flame | frame). 図６の一部（フレームとなる部分）を拡大した平面図である。It is the top view to which a part (part used as a flame | frame) of FIG. 6 was expanded. 図７に示したフレームとなる部分に樹脂成形部が成形された状態の平面図（発光素子が搭載される側から見た場合の図）である。FIG. 8 is a plan view of a state where a resin molding portion is molded in a portion to be a frame shown in FIG. 図７に示したフレームとなる部分に樹脂成形部が成形された状態の平面図（発光素子が搭載される側とは反対の裏面側から見た場合の図）である。FIG. 8 is a plan view of a state where a resin molding portion is molded in a portion to be a frame shown in FIG. 7 (a diagram when viewed from the back side opposite to the side on which the light emitting element is mounted). 本発明の一実施形態によるフレームパッケージの製造方法において用いられる成型用金型の断面図である。It is sectional drawing of the metal mold | die used for the manufacturing method of the frame package by one Embodiment of this invention. 図１０に示した成型用金型を用いて行われるインサート成形工程を説明するための断面図（成型用金型にフレームを装着して型締めした状態の図）である。It is sectional drawing for demonstrating the insert molding process performed using the metal mold | die shown in FIG. 10 (The figure of the state which mounted | wore with the metal mold | die and clamped it). 図１０に示した成型用金型を用いて行われるインサート成形工程を説明するための断面図（キャビティ内に溶融樹脂を注入して硬化させた状態の図）である。It is sectional drawing for demonstrating the insert molding process performed using the metal mold | die shown in FIG. 10 (The figure of the state which inject | poured and hardened molten resin in the cavity). 図１０に示した成型用金型を用いて行われるインサート成形工程を説明するための断面図（離型した状態の図）である。It is sectional drawing for demonstrating the insert molding process performed using the metal mold | die shown in FIG.
　まず、図１～図５を参照して、本実施形態によるフレームパッケージの製造方法を用いて製造されるフレームパッケージ１０の構成について説明する。 First, the configuration of the frame package 10 manufactured using the frame package manufacturing method according to the present embodiment will be described with reference to FIGS.
　本実施形態によるフレームパッケージの製造方法を用いて製造されるフレームパッケージ１０は、図１に示すように、半導体レーザ素子１１と外部機器（図示せず）とを電気的に接続するためのものであり、半導体レーザ素子１１が搭載され、かつ、電気的に接続されるフレーム１を少なくとも備えている。このフレーム１に搭載される半導体レーザ素子１１は、本発明の「発光素子」の一例である。
ところで、図１に示す半導体レーザ素子１１は、ジャンクションダウン方式でサブマウント１２に取り付けられており、そのサブマウント１２がフレーム１に対して固着されることでフレーム１に搭載された状態となっている。また、半導体レーザ素子１１は２波長レーザ素子であり、ｐ側電極が２つに分離され、ｎ側電極が共通となっている。そして、半導体レーザ素子１１のｐ側電極およびｎ側電極は、ボンディングワイヤ１３を介してフレーム１に電気的に接続されている。なお、半導体レーザ素子１１のｐ側電極はサブマウント１２に形成された電極パッドに電気的に接続されているため、ｐ側電極用のボンディングワイヤ１３はサブマウント１２の電極パッドにボンディングされている。 A frame package 10 manufactured using the method for manufacturing a frame package according to the present embodiment is for electrically connecting a semiconductor laser element 11 and an external device (not shown) as shown in FIG. There is at least a frame 1 on which a semiconductor laser element 11 is mounted and electrically connected. The semiconductor laser element 11 mounted on the frame 1 is an example of the “light emitting element” in the present invention.
Incidentally, the semiconductor laser element 11 shown in FIG. 1 is attached to the submount 12 by the junction down method, and the submount 12 is fixed to the frame 1 to be mounted on the frame 1. Yes. The semiconductor laser element 11 is a two-wavelength laser element, and the p-side electrode is separated into two and the n-side electrode is common. Then, the p-side electrode and the n-side electrode of the semiconductor laser element 11 are electrically connected to the frame 1 through bonding wires 13. Since the p-side electrode of the semiconductor laser element 11 is electrically connected to the electrode pad formed on the submount 12, the p-side electrode bonding wire 13 is bonded to the electrode pad of the submount 12. .
　半導体レーザ素子１１が搭載されるフレーム１は、図１および図２に示すように、１つの主フレーム２と２つの副フレーム３および４とを含んでいるとともに、それらが互いに電気的に絶縁された構造となっている。また、このフレーム１は、金属薄板（銅や鉄などからなる薄板）からなっており、熱伝導性および導電性に優れている。なお、主フレーム２は、本発明の「第１フレーム」の一例であり、副フレーム３および４は、本発明の「第２フレーム」の一例である。 As shown in FIGS. 1 and 2, the frame 1 on which the semiconductor laser element 11 is mounted includes one main frame 2 and two sub frames 3 and 4, and these are electrically insulated from each other. It has a structure. The frame 1 is made of a metal thin plate (thin plate made of copper, iron, or the like) and is excellent in thermal conductivity and conductivity. The main frame 2 is an example of the “first frame” in the present invention, and the sub-frames 3 and 4 are examples of the “second frame” in the present invention.
　主フレーム２は、半導体レーザ素子１１が搭載され、かつ、半導体レーザ素子１１のｎ側電極が電気的に接続されるフレームである。すなわち、主フレーム２は、半導体レーザ素子１１が搭載され、かつ、ｎ側電極用のボンディングワイヤ１３がボンディングされる素子搭載部２ａを少なくとも有している。そして、その主フレーム２の素子搭載部２ａから一体的に延びるように、外部機器に接続されるリード部２ｂが設けられている。また、副フレーム３は、半導体レーザ素子１１のｐ側電極（サブマウント１２の電極パッド）が電気的に接続されるフレームであって、ｐ側電極用のボンディングワイヤ１３がボンディングされるワイヤ接続部３ａと、そのワイヤ接続部３ａから一体的に延びるリード部（外部機器に接続される部分）３ｂとを有している。なお、副フレーム４についても、副フレーム３と同様、ワイヤ接続部４ａとリード部４ｂとを有している。 The main frame 2 is a frame on which the semiconductor laser element 11 is mounted and the n-side electrode of the semiconductor laser element 11 is electrically connected. That is, the main frame 2 has at least an element mounting portion 2a on which the semiconductor laser element 11 is mounted and an n-side electrode bonding wire 13 is bonded. A lead portion 2b connected to an external device is provided so as to extend integrally from the element mounting portion 2a of the main frame 2. The sub-frame 3 is a frame to which the p-side electrode (electrode pad of the submount 12) of the semiconductor laser element 11 is electrically connected, and a wire connection portion to which a bonding wire 13 for the p-side electrode is bonded. 3a and a lead portion (a portion connected to an external device) 3b extending integrally from the wire connection portion 3a. The subframe 4 also has a wire connection portion 4 a and a lead portion 4 b as in the subframe 3.
　また、主フレーム２、副フレーム３および４は、樹脂成形部５によって互いに固着されている。この樹脂成形部５は、半導体レーザ素子１１が搭載される側（以下、素子搭載側と言う）からの平面視において、図３に示すような形状となっている。具体的に言うと、樹脂成形部５の素子搭載側の部分は、平面的に見て、素子搭載領域およびその周辺領域を包含する領域を３方向から囲み、半導体レーザ素子１１（図１参照）の光出射側が開放された略コの字形状になっている。 Further, the main frame 2 and the sub frames 3 and 4 are fixed to each other by the resin molding portion 5. The resin molded portion 5 has a shape as shown in FIG. 3 in a plan view from the side on which the semiconductor laser element 11 is mounted (hereinafter referred to as the element mounting side). More specifically, the part on the element mounting side of the resin molding portion 5 surrounds the element mounting area and the area including the peripheral area from three directions when viewed in plan, and the semiconductor laser element 11 (see FIG. 1). The light emitting side is substantially U-shaped open.
　また、樹脂成形部５を素子搭載側とは反対の裏面側から見ると、図４に示すような形状となっている。なお、本実施形態によるフレームパッケージの製造方法を用いて製造すると、主フレーム２および副フレーム３を跨ぐような開口５ａが樹脂成形部５の裏面側の部分に形成され、その樹脂成形部５の開口５ａから主フレーム２および副フレーム３のそれぞれの裏面側の表面の一部が露出した状態となる。また、樹脂成形部５の裏面側の部分には、副フレーム４の裏面側の表面の一部を露出させるような円形状の開口５ｂも形成されている。 Further, when the resin molded portion 5 is viewed from the back side opposite to the element mounting side, the shape is as shown in FIG. When manufactured using the method for manufacturing a frame package according to the present embodiment, an opening 5 a that straddles the main frame 2 and the subframe 3 is formed in a portion on the back surface side of the resin molded portion 5. A part of the surface on the back side of each of the main frame 2 and the sub-frame 3 is exposed from the opening 5a. In addition, a circular opening 5 b is formed in a portion on the back surface side of the resin molding portion 5 so as to expose a part of the surface on the back surface side of the sub-frame 4.
　また、図５に示すように、樹脂成形部５の全体の厚みＴ１は約１．５ｍｍ～約１．６ｍｍであり、樹脂成形部５の裏面側の部分の厚みＴ２は約０．２ｍｍである。すなわち、樹脂成形部５の裏面側の部分の厚みは従来に比べて小さくなっている。 Further, as shown in FIG. 5, the total thickness T1 of the resin molded portion 5 is about 1.5 mm to about 1.6 mm, and the thickness T2 of the back side portion of the resin molded portion 5 is about 0.2 mm. . That is, the thickness of the portion on the back surface side of the resin molded portion 5 is smaller than that of the conventional one.
　次に、図６～図１３を参照して、本実施形態によるフレームパッケージの製造方法について説明する。 Next, a method for manufacturing a frame package according to the present embodiment will be described with reference to FIGS.
　まず、図６および図７に示すように、複数のフレーム１（図６および図７のハッチングが施された部分）が一体的に連結された金属構造体２０を作製する。このような金属構造体２０は、たとえば、銅薄板などの金属薄板をプレス加工（打ち抜き加工）することで得られる。 First, as shown in FIGS. 6 and 7, a metal structure 20 in which a plurality of frames 1 (the hatched portions in FIGS. 6 and 7) are integrally connected is manufactured. Such a metal structure 20 can be obtained by, for example, pressing (punching) a metal thin plate such as a copper thin plate.
　金属構造体２０を作製した後、図８および図９に示すように、フレーム１の所定部分を樹脂成形部５で覆い、主フレーム２、副フレーム３および４が樹脂成形部５によって互いに固着された状態にする。なお、図８は、素子搭載側から見た場合の樹脂成形部５の平面形状であり、図９は、素子搭載側とは反対の裏面側から見た場合の樹脂成形部５の平面形状である。 After the metal structure 20 is manufactured, as shown in FIGS. 8 and 9, a predetermined portion of the frame 1 is covered with the resin molded portion 5, and the main frame 2 and the sub frames 3 and 4 are fixed to each other by the resin molded portion 5. To the state. 8 shows the planar shape of the resin molded portion 5 when viewed from the element mounting side, and FIG. 9 shows the planar shape of the resin molded portion 5 when viewed from the back side opposite to the element mounting side. is there.
　ところで、フレーム１の所定部分を樹脂成形部５で覆う工程（主フレーム２、副フレーム３および４を樹脂成形部５によって互いに固着する工程）では、互いに対向配置される一対の金型３１および３２を含む成型用金型３０（図１０参照）を準備し、その成型用金型３０を用いてインサート成形を行う。この成型用金型３０に含まれる一対の金型３１および３２のうちの金型３１は素子搭載側とは反対の裏面側に配置されるものであり、金型３２は素子搭載側に配置されるものである。なお、成型用金型３０に含まれる一対の金型３１および３２は、それぞれ、本発明の「第１金型」および「第２金型」の一例である。 By the way, in the step of covering a predetermined portion of the frame 1 with the resin molding portion 5 (step of fixing the main frame 2 and the subframes 3 and 4 to each other by the resin molding portion 5), a pair of molds 31 and 32 arranged to face each other. Is prepared, and insert molding is performed using the molding die 30. Of the pair of molds 31 and 32 included in the molding mold 30, the mold 31 is disposed on the back side opposite to the element mounting side, and the mold 32 is disposed on the element mounting side. Is. The pair of molds 31 and 32 included in the molding mold 30 are examples of the “first mold” and the “second mold” of the present invention, respectively.
　インサート成形工程で用いる成型用金型３０の構造としては、図１０に示すように、その一対の金型３１および３２を型締めすることによってキャビティ（樹脂成形部５（図８および図９参照）の形状を反映した形状を成す空間）３０ａが形成されるようになっている。また、一対の金型３１および３２のうちの金型３１には、樹脂成形部５となる溶融樹脂をキャビティ３０ａ内に注入するためのゲート３１ａが設けられている。このゲート３１ａは、他の金型３２のキャビティ面（他の金型３２に形成されたキャビティ用凹部の底面）と対向する金型３１のキャビティ面（金型３１に形成されたキャビティ用凹部の底面）の所定部分に設けられているとともに、キャビティ３０ａ内に向かって突出している。 As shown in FIG. 10, the structure of the molding die 30 used in the insert molding step is a cavity (resin molding part 5 (see FIGS. 8 and 9)) by clamping the pair of dies 31 and 32. 30a) is formed. The space 30a is formed to reflect the shape of the above. The mold 31 of the pair of molds 31 and 32 is provided with a gate 31a for injecting molten resin to be the resin molding portion 5 into the cavity 30a. The gate 31a is formed on the cavity surface of the mold 31 opposite to the cavity surface of the other mold 32 (the bottom surface of the cavity recess formed in the other mold 32). Provided in a predetermined portion of the bottom surface) and protrudes into the cavity 30a.
　さらに、金型３１に設けられたゲート３１ａは、フレーム１が装着された成型用金型３０を型締めしたときに、ゲート３１ａの注入口３１ｂが平面的に見てフレーム１と重畳しない領域２０ａ（図７参照）、すなわち、平面的に見て主フレーム２と副フレーム３との間の間隙に来るように形成されている。また、そのゲート３１ａの突出高さは、フレーム１が装着された成型用金型３０を型締めしたときに、ゲート３１ａの注入口３１ｂの外縁面３１ｃがフレーム１の金型３１側の表面と略面一、すなわち、ゲート３１ａの注入口３１ｂの外縁面３１ｃの高さ位置がフレーム１の金型３１側の表面の高さ位置と略同じになるように設定されている。 Further, the gate 31a provided in the mold 31 is a region 20a in which the injection port 31b of the gate 31a does not overlap the frame 1 when viewed in plan when the molding die 30 to which the frame 1 is attached is clamped. That is, it is formed so as to be in the gap between the main frame 2 and the sub-frame 3 when seen in a plan view. The protruding height of the gate 31a is such that when the molding die 30 to which the frame 1 is attached is clamped, the outer edge surface 31c of the injection port 31b of the gate 31a is different from the surface of the frame 1 on the die 31 side. The height position of the outer edge surface 31c of the inlet 31b of the gate 31a is set to be substantially the same as the height position of the surface of the frame 1 on the mold 31 side.
　なお、図１０に示す成型用金型３０の断面図は、図８および図９の２００－２００線に沿った断面部分の樹脂成形を行うキャビティ３０ａの形状を表している。 Note that the cross-sectional view of the molding die 30 shown in FIG. 10 represents the shape of the cavity 30a for resin molding of the cross-sectional portion along the line 200-200 in FIGS.
　そして、成型用金型３０を用いてインサート成形を行う際には、図１１に示すように、まず、フレーム１の樹脂成形部５（図８および図９参照）によって覆われる部分がキャビティ３０ａ内に配置されるように、フレーム１を成型用金型３０に装着して型締めする。 When insert molding is performed using the molding die 30, as shown in FIG. 11, first, a portion covered by the resin molding portion 5 (see FIGS. 8 and 9) of the frame 1 is inside the cavity 30 a. The frame 1 is mounted on the molding die 30 and clamped so as to be arranged in the above.
　このとき、本実施形態では、平面的に見て主フレーム２と副フレーム３との間の間隙にゲート３１ａの注入口３１ｂが配置された状態となる。さらに、ゲート３１ａの注入口３１ｂの外縁面３１ｃが主フレーム２および副フレーム３のそれぞれの金型３１側の表面の一部に接触した状態となる。すなわち、主フレーム２および副フレーム３のそれぞれの金型３１側の表面の一部がゲート３１ａの注入口３１ｂの外縁面３１ｃで押圧され、主フレーム２および副フレーム３が保持されることになる。具体的に言うと、ゲート３１ａと、そのゲート３１ａと対向する金型３２の所定部分（主フレーム２および副フレーム３のそれぞれの一部が載置される部分）とによって、主フレーム２および副フレーム３が挟持される。なお、副フレーム４の金型３１側の表面の一部は、図示しない押えピンで保持された状態となっている。 At this time, in this embodiment, the injection port 31b of the gate 31a is disposed in the gap between the main frame 2 and the sub frame 3 when viewed in plan. Further, the outer edge surface 31c of the inlet 31b of the gate 31a is in contact with a part of the surface of the main frame 2 and the sub frame 3 on the mold 31 side. That is, a part of the surface on the mold 31 side of each of the main frame 2 and the sub frame 3 is pressed by the outer edge surface 31c of the inlet 31b of the gate 31a, and the main frame 2 and the sub frame 3 are held. . More specifically, the main frame 2 and the sub-frame are constituted by the gate 31a and a predetermined portion (a portion on which each of the main frame 2 and the sub-frame 3 is placed) facing the gate 31a. The frame 3 is clamped. A part of the surface of the sub frame 4 on the mold 31 side is held by a pressing pin (not shown).
　この後、樹脂成形部５（図８および図９参照）となる溶融樹脂をゲート３１ａからキャビティ３０ａ内（図１１の矢印方向）に注入する。この際、キャビティ３０ａ内を流動する溶融樹脂は、フレーム１によって遮られることなく、キャビティ３０ａ内の全域にわたって充填される。そして、キャビティ３０ａ内の全域にわたって溶融樹脂が充填された後に、そのキャビティ３０ａ内に充填された溶融樹脂を硬化させる。これにより、図１２に示すように、主フレーム２、副フレーム３および４が樹脂成形部５によって互いに固着される。 Thereafter, molten resin to be the resin molding portion 5 (see FIGS. 8 and 9) is injected from the gate 31a into the cavity 30a (in the direction of the arrow in FIG. 11). At this time, the molten resin flowing in the cavity 30 a is filled over the entire area of the cavity 30 a without being blocked by the frame 1. Then, after the molten resin is filled over the entire area in the cavity 30a, the molten resin filled in the cavity 30a is cured. Thereby, as shown in FIG. 12, the main frame 2 and the sub-frames 3 and 4 are fixed to each other by the resin molding portion 5.
　続いて、図１３に示すように、離型を行い、成形品を取り出す。このとき、ゲート３１ａの注入口３１ｂに沿ったバリ５ｃが発生するが、そのバリ５ｃはフレーム１の金型３１側の表面と略面一の高さ位置から突出する。 Subsequently, as shown in FIG. 13, release is performed and the molded product is taken out. At this time, a burr 5c is generated along the injection port 31b of the gate 31a. The burr 5c protrudes from a height position substantially flush with the surface of the frame 1 on the mold 31 side.
　また、ゲート３１ａの注入口３１ｂの外縁面３１ｃによって主フレーム２および副フレーム３のそれぞれの金型３１側の表面の一部を押圧保持していたため、素子搭載側とは反対の裏面側から成形品を見ると、図９に示すように、主フレーム２および副フレーム３のそれぞれの表面の一部（ゲート３１ａの注入口３１ｂの外縁面３１ｃ（図１１参照）で押圧保持されていた部分）が露出された状態となる。すなわち、樹脂成形部５の裏面側の部分に開口５ａが形成され、その開口５ａから主フレーム２および副フレーム３のそれぞれの裏面側の表面の一部が露出される。なお、樹脂成形部５の裏面側の部分に形成される別の開口５ｂは、副フレーム４の裏面側の表面の一部が押えピン（図示せず）によって押圧保持されることで形成されるものである。したがって、樹脂成形部５の開口５ｂからは、副フレーム４の裏面側の表面の一部が露出される。 Further, since the outer edge surface 31c of the injection port 31b of the gate 31a presses and holds a part of the surface of each of the main frame 2 and the sub frame 3 on the mold 31 side, molding is performed from the back side opposite to the element mounting side. When viewing the product, as shown in FIG. 9, a part of the surface of each of the main frame 2 and the sub-frame 3 (the portion that is pressed and held by the outer edge surface 31c of the inlet 31b of the gate 31a (see FIG. 11)). Will be exposed. That is, the opening 5a is formed in the portion on the back surface side of the resin molding portion 5, and a part of the surface on the back surface side of each of the main frame 2 and the sub frame 3 is exposed from the opening 5a. In addition, another opening 5b formed in the portion on the back surface side of the resin molding portion 5 is formed by pressing and holding a part of the surface on the back surface side of the sub frame 4 by a pressing pin (not shown). Is. Therefore, a part of the surface on the back surface side of the sub-frame 4 is exposed from the opening 5 b of the resin molding portion 5.
　最後に、成形品を個々に分離することによって、図１に示したフレームパッケージ１０が製造される。 Finally, the frame package 10 shown in FIG. 1 is manufactured by separating the molded products individually.
　本実施形態のフレームパッケージの製造方法では、上記のように、フレーム１を成形用金型３０に装着して型締めした際に、平面的に見てフレーム１と重畳しない領域２０ａにゲート３１ａの注入口３１ｂが配置され、かつ、そのゲート３１ａの注入口３１ｂの外縁面３１ｃがフレーム１の金型３１側の表面の一部に接触した状態となるような成型用金型３０を用いることによって、キャビティ３０ａ内における溶融樹脂の流動性などを損なうことなく、金型３１のキャビティ用凹部の深さを従来よりも小さくすることができる。その結果、金型３１のキャビティ用凹部で成形される部分（樹脂成形部５の裏面側の部分）の厚みを従来よりも小さくすることができるので、フレームパッケージ１０の薄型化を図ることが可能となる。 In the frame package manufacturing method of the present embodiment, as described above, when the frame 1 is mounted on the molding die 30 and clamped, the gate 31a is placed in the region 20a that does not overlap the frame 1 when viewed in plan. By using the molding die 30 in which the injection port 31b is disposed and the outer edge surface 31c of the injection port 31b of the gate 31a is in contact with a part of the surface of the frame 1 on the mold 31 side. The depth of the cavity recess of the mold 31 can be made smaller than before without impairing the fluidity of the molten resin in the cavity 30a. As a result, the thickness of the part molded by the cavity recess of the mold 31 (the part on the back side of the resin molding part 5) can be made smaller than before, so that the frame package 10 can be made thinner. It becomes.
　また、ゲート３１ａの注入口３１ｂの外縁面３１ｃがフレーム１の金型３１側の表面の一部に接触した状態で樹脂成形が行われるため、離型時にゲート３１ａの注入口３１ｂに沿ったバリ５ｃが発生したとしても、そのバリ５ｃはフレーム１の金型３１側の表面と略面一の高さ位置から突出する。このため、フレームパッケージ１０を薄型化できることに加えて、バリ５ｃが樹脂成形部５よりも外側にはみ出してしまうのも抑制することができる。 Further, since resin molding is performed in a state where the outer edge surface 31c of the inlet 31b of the gate 31a is in contact with a part of the surface of the frame 1 on the mold 31 side, the burrs along the inlet 31b of the gate 31a are released at the time of mold release. Even if 5c occurs, the burr 5c protrudes from a height position substantially flush with the surface of the frame 1 on the mold 31 side. For this reason, in addition to being able to reduce the thickness of the frame package 10, it is possible to suppress the burr 5 c from protruding outside the resin molded portion 5.
　また、本実施形態のフレームパッケージの製造方法では、上記のように、フレーム１を成形用金型３０に装着して型締めした際に、ゲート３１ａの注入口３１ｂの外縁面３１ｃでフレーム１の金型３１側の表面の一部が押圧保持されるようにすることによって、成型用金型３０に設置される押えピン（フレーム１の位置ずれやねじれなどを抑制するためのピン）と同様の機能をゲート３１ａが持つことになるため、フレームパッケージ１０の薄型化を図りながら、成形用金型３０に設置する押えピンの個数を減らすことができる。 In the frame package manufacturing method of the present embodiment, as described above, when the frame 1 is mounted on the molding die 30 and clamped, the outer edge surface 31c of the inlet 31b of the gate 31a is used to A part of the surface on the mold 31 side is pressed and held, so that it is the same as a presser pin (a pin for suppressing misalignment or twisting of the frame 1) installed in the molding die 30. Since the gate 31a has the function, the number of presser pins installed in the molding die 30 can be reduced while reducing the thickness of the frame package 10.
　さらに、本実施形態のフレームパッケージの製造方法では、上記のように、フレーム１を成形用金型３０に装着して型締めした際に、平面的に見て主フレーム２と副フレーム３との間の間隙にゲート３１ａの注入口３１ｂが配置されるようにすることによって、容易に、平面的に見てフレーム１と重畳しない領域にゲート３１ａの注入口３１ｂが配置された状態にすることができる。 Furthermore, in the frame package manufacturing method of the present embodiment, as described above, when the frame 1 is mounted on the molding die 30 and clamped, the main frame 2 and the sub frame 3 are viewed in plan view. By arranging the injection port 31b of the gate 31a in the gap between them, the injection port 31b of the gate 31a can be easily arranged in a region that does not overlap with the frame 1 in plan view. it can.
　この場合、主フレーム２および副フレーム３のそれぞれの金型３１側の表面の一部がゲート３１ａの注入口３１ｂの外縁面３１ｃで押圧保持されるようにすることによって、フレーム１の押圧保持を確実に行うことができる。これにより、フレーム１の位置ずれやねじれなどが抑制され、かつ、薄型化されたフレームパッケージ１０を得ることができる。 In this case, by holding a part of the surface of each of the main frame 2 and the sub frame 3 on the mold 31 side so as to be pressed and held by the outer edge surface 31c of the inlet 31b of the gate 31a, the pressing and holding of the frame 1 is maintained. It can be done reliably. As a result, it is possible to obtain a frame package 10 in which the frame 1 is prevented from being displaced and twisted, and is thinned.
　今回開示された実施形態は、すべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した実施形態の説明ではなく特許請求の範囲によって示され、さらに、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.
　たとえば、上記実施形態では、２つの副フレームの間に主フレームを配置したが、本発明はこれに限らず、各フレームの配置位置は適宜変更可能である。すなわち、主フレームが１つで副フレームが２つの場合、２つの副フレームのうちの一方を中央に配置してもよい。 For example, in the above embodiment, the main frame is arranged between the two sub-frames. However, the present invention is not limited to this, and the arrangement position of each frame can be changed as appropriate. That is, when there is one main frame and two sub frames, one of the two sub frames may be arranged in the center.
　また、上記実施形態では、１つの主フレームと２つの副フレームとを含む構造としているが、本発明はこれに限らず、各フレームの個数は適宜変更可能である。たとえば、１つの主フレームと３つの副フレームとを含む構造とし、「副フレーム、副フレーム、主フレーム、副フレーム」の順番で配置してもよい。 In the above embodiment, the structure includes one main frame and two subframes. However, the present invention is not limited to this, and the number of frames can be changed as appropriate. For example, a structure including one main frame and three sub frames may be used, and the sub frames may be arranged in the order of “sub frame, sub frame, main frame, sub frame”.
　また、２つの副フレームが連続して並ぶ場合には、ゲートの注入口の外縁面を２つの副フレームに接触させるようにしてもよい。このようにすれば、副フレーム用の押えピンを削減することができる。 In addition, when two subframes are continuously arranged, the outer edge surface of the gate inlet may be brought into contact with the two subframes. In this way, it is possible to reduce the pressing pin for the sub frame.
　　１　フレーム
　　２　主フレーム（第１フレーム）
　　３、４　副フレーム（第２フレーム）
　　５　樹脂成形部
　　１１　半導体レーザ素子（発光素子）
　　２０ａ　領域
　　３０　成型用金型
　　３０ａ　キャビティ
　　３１　金型（第１金型）
　　３１ａ　ゲート
　　３１ｂ　注入口
　　３１ｃ　外縁面
　　３２　金型（第２金型） 1 frame 2 main frame (first frame)
3, 4 Subframe (second frame)
5 Resin molding part 11 Semiconductor laser element (light emitting element)
20a region 30 mold 30a cavity 31 mold (first mold)
31a Gate 31b Inlet 31c Outer edge surface 32 Mold (second mold)

Claims (4)

  1. 　互いに電気的に絶縁された第１フレームおよび第２フレームからなるフレームを少なくとも備えているとともに、前記第１フレームおよび前記第２フレームが樹脂成形部によって互いに固着された構造を有し、前記フレームに発光素子が搭載されるフレームパッケージの製造方法であって、
    　互いに対向配置される第１金型および第２金型を含み、前記第１金型および前記第２金型を型締めすることによってキャビティが形成され、かつ、前記キャビティ内に向かって突出するゲートが前記第１金型の前記第２金型と対向する所定部分に設けられた成形用金型を準備する工程と、
    　前記フレームの前記樹脂成形部によって覆われる部分が前記キャビティ内に配置されるように、前記フレームを前記成形用金型に装着して型締めする工程と、
    　前記樹脂成形部となる溶融樹脂を前記ゲートから前記キャビティ内に注入し、前記キャビティ内の前記溶融樹脂を硬化させる工程とを備え、
    　前記フレームを前記成形用金型に装着して型締めした際に、平面的に見て前記フレームと重畳しない領域に前記ゲートの注入口が配置され、かつ、前記ゲートの注入口の外縁面の高さ位置が前記フレームの前記第１金型側の表面の高さ位置と略同じとなるような成型用金型を用いることを特徴とするフレームパッケージの製造方法。     A frame comprising at least a first frame and a second frame that are electrically insulated from each other, and having a structure in which the first frame and the second frame are fixed to each other by a resin molding portion; A method of manufacturing a frame package on which a light emitting element is mounted,
    A gate including a first mold and a second mold disposed to face each other, a cavity is formed by clamping the first mold and the second mold, and the gate protrudes into the cavity Preparing a molding die provided at a predetermined portion facing the second die of the first die,
    Attaching the frame to the molding die and clamping the mold so that a portion of the frame covered by the resin molding portion is disposed in the cavity;
    Injecting molten resin to be the resin molded portion into the cavity from the gate, and curing the molten resin in the cavity,
    When the frame is mounted on the molding die and clamped, the gate inlet is disposed in a region that does not overlap with the frame in plan view, and the outer edge surface of the gate inlet is A method of manufacturing a frame package, comprising using a molding die whose height position is substantially the same as the height position of the surface of the frame on the first mold side.
  2. 　前記フレームを前記成形用金型に装着して型締めした際に、前記ゲートの注入口の外縁面で前記フレームの前記第１金型側の表面の一部が押圧保持されることを特徴とする請求項１に記載のフレームパッケージの製造方法。 When the frame is mounted on the mold and clamped, a part of the surface of the frame on the first mold side is pressed and held by the outer edge surface of the inlet of the gate. A manufacturing method of the frame package according to claim 1.
  3. 　前記フレームを前記成形用金型に装着して型締めした際に、平面的に見て前記第１フレームと前記第２フレームとの間の間隙に前記ゲートの注入口が配置されることを特徴とする請求項１または２に記載のフレームパッケージの製造方法。 When the frame is mounted on the molding die and clamped, the gate inlet is disposed in a gap between the first frame and the second frame as viewed in plan. A manufacturing method of the frame package according to claim 1 or 2.
  4. 　前記第１フレームおよび前記第２フレームのそれぞれの前記第１金型側の表面の一部が前記ゲートの注入口の外縁面で押圧保持されることを特徴とする請求項３に記載のフレームパッケージの製造方法。 4. The frame package according to claim 3, wherein a part of the first mold side surface of each of the first frame and the second frame is pressed and held by an outer edge surface of the injection port of the gate. Manufacturing method.
PCT/JP2010/050489 2009-02-10 2010-01-18 Frame package manufacturing method WO2010092853A1 (en)

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