JP2003046016A - Structure of molded package for oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure of a molded package for an oscillator where deformation of a lead is prevented, when the characteristics of the oscillator are measured. SOLUTION: A metal terminal 11 to be formed into lead is given a U-shape having a second and a third projecting parts, and a part of the third projection part is made to expose at a probe-abutted window 14, or a probe-pressed part 16 is formed from the tip of an outer lead-piece projecting from a metal terminal 15 to be formed into the lead, so that the probe abuts it, parallel to the bottom surface of the oscillator package. Thus, the abutting pressure of the measuring probe is prevented from acting on a J-shaped lead part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an oscillator mold package, and more particularly to a structure of an oscillator mold package in which lead deformation does not occur even when a probe terminal is pressed during an oscillator characteristic test.

[0002]

2. Description of the Related Art In recent years, electronic components have been downsized, and component mounting technology has also become more sophisticated. There are various types of outer shapes of electronic components in a package sealing method, a mounting method, and the like, and high integration is also progressing. Among electronic components, an oscillator using a piezoelectric vibrator is also downsized, and an example of packaging is shown in FIG. 5 below. Figure 5 (a) shows the SOJ (Small Outline J-
It is a top view which shows the state before the lead bending process of the base part in surface mounting type packaging called a lead package), and (b) is the sectional view. The oscillator base shown in this example is provided with two metal terminals 2 on each of two opposing sides of a quadrilateral resin mold base 1 when viewed from above. Further, in the center of the resin mold base 1, there is provided a printed board mounting portion 3 formed in a concave shape. As shown in the cross-sectional view, the metal terminal 2 is molded in an L-shaped bent state, the upward projecting portion is a pillar for supporting the printed circuit board, and the lateral projecting portion is It becomes a J-type lead.

FIG. 6 is an assembly view seen from the side, showing an example of the assembly processing of the above-mentioned SOJ package.
Processing is performed in the order of (e). First, in the step (a), molding is performed by rounding down the tip portions of the metal terminals 2 protruding on both sides of the resin mold base 1. next,
In the step (b), the metal terminal 2 is bent substantially vertically downward near the resin mold base 1 rather than the rounded portion. As a result, the tip of the rounded portion is fed to the bottom surface of the resin mold base 1. That is,
The J-type lead portion of the metal terminal 2 is formed by the steps (a) and (b).

Next, in step (c), the printed circuit board 6 which is the core of the oscillator is mounted on the printed circuit board mounting portion 3 of the resin mold base 1. The printed circuit board 6 has, for example, high-density components mounted on both sides thereof, and through holes for penetrating the board supporting portion 4 of the metal terminal 2 are provided at four corners of the board. Then, in the step of (d), the mounted printed circuit board 6 is fixed to the board support portion 4 by soldering, and the cap 7 is covered. At the final step (e), the resin mold base 1 and the cap 7
And are bonded to complete the cap sealing. In this case, the bonding method is appropriately selected depending on the material of the cap 7.

When the oscillator is manufactured as described above,
A product inspection will be performed to see if the oscillator satisfies predetermined performance characteristics. Here, for example, assuming a case where the frequency characteristic of the oscillator is measured, the measuring method will be described. FIG. 7 is a diagram showing an example of the characteristic measurement configuration of the oscillator. FIG. 7A shows a scene before the cover is closed by disposing the oscillator on the holding jig 8, and FIG. ,
It shows a state in which the cover is closed. The holding jig 8 has a base portion and a cover portion rotatably engaged with each other, and a portion of the base portion on which the oscillator is mounted has a position corresponding to a lead of the oscillator. The probe 9 is embedded, and the probe 9 is connected to the measuring instrument. That is, as shown in FIG. 7B, when the cover of the holding jig 8 is closed, pressure is applied so that the lead of the oscillator surely abuts on the probe 9, and measurement by the measuring instrument is performed via the probe 9. The frequency characteristic of the oscillator is measured.

[0006]

However, in the characteristic measurement in the structure of the above-mentioned conventional oscillator mold package, there are the following problems.
That is, when the measurement is performed as shown in FIG.
The contact pressure with the probe 9 sometimes deforms the J-shaped lead portion of the oscillator. If the lead portion is deformed, the flatness between the leads of the oscillator is impaired, which may cause conduction failure such as solder float when the oscillator is surface-mounted on a printed circuit board. There was a problem.

The present invention has been made to solve the above problems, and provides a structure of an oscillator mold package which prevents deformation of the lead portion when the characteristics of the oscillator are measured. The purpose is to provide.

[0008]

In order to solve the above-mentioned problems, the invention according to claim 1 of the structure of an oscillator mold package according to the present invention is characterized in that the metal plate on which the leads of the oscillator package are formed is U-shaped. One of the U-shaped protruding pieces of the inner lead is exposed at the package opening.

According to a second aspect of the present invention, there is provided an oscillator mold package structure in which the tip of the outer lead projecting piece of the metal plate forming the leads of the oscillator package is placed parallel to the bottom surface of the oscillator package. It is characterized by being processed so as to contact.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below based on the illustrated embodiments. FIG. 1 is a diagram showing an embodiment of the structure of a molded package for an oscillator according to the present invention. Here, an image of the layout of the metal terminals 11 before processing used in the present invention is shown. Note that FIG. 1 (a)
Shows a layout as seen from above, and (b) shows a layout as seen from the side. In both cases, the resin mold base is formed on the wavy line.

A feature of the metal terminal 11 shown in this example is that it has three protrusions. Each of these protrusions is a first protrusion extending inside the resin mold base, and of the two protrusions extending outside the resin mold base, the longer protrusion is the second protrusion and the shorter protrusion is the third protrusion. Will be described below. First, the first of the metal terminal 11
The protruding portion is a functional portion which is the same as the board supporting portion 4 shown in the above-mentioned prior art, and is for fixing the printed circuit board 6 incorporated in the oscillator.

Next, the second protruding portion (the longer one) of the metal terminal 11 is the same functional portion as the J-type lead portion 5 shown in the above-mentioned prior art, and the outer portion forming the J-type lead of the oscillator. Be the lead. On the other hand, the third metal terminal 11
The protruding portion (the shorter one) is an inner lead forming a measurement electrode described later. The inner lead referred to here means a portion of the metal terminal 11 located inside the resin mold base, whereas a portion located outside the resin mold base is an outer lead.

Next, FIG. 2 is a diagram showing an example of a processing procedure in the structure of the oscillator molded package according to the present invention, wherein (a2), (b2), (c) and (d) are side views. In the figures, (a1) and (b1) are top views and (e) is a back view. The processing procedure will be described below with reference to this drawing.

First, (a1) and (a2) are a top view and a side view showing a first processing step when one metal terminal 11 is focused on. Here, the substrate support portion 4 is shown.
At the same time as bending the (first protrusion) vertically upward,
The measurement electrode portion 12 (third protrusion) is bent vertically downward. Next, (b1) and (b2) are a top view and a side view showing the second stage processing corresponding to (a1) and (a2), respectively, and at this stage, the measurement electrode bent downwards. The middle part of the part 12 is bent at a right angle.
The bending direction at this time is, for example, the center direction of the resin mold base.

The next step (c) is a molding process, in which the resin mold base 13 is formed around the metal terminals 11, and the metal terminals 11 are fixed at predetermined positions on the resin mold base 13. Here, as a characteristic point in the structure of the oscillator mold package according to the invention of the present application, a part of the measuring electrode portion 12 is partially covered with the resin mold base 13.
A window 14 for contacting the probe is provided by exposing the surface of the probe. In the example shown in this figure, this is provided on the back surface of the resin mold base 13, but it may be on the side surface, for example, depending on the position of the probe 9.

Next to the molding step, in the step (d),
The J-type lead portion 5 (second protrusion) of the metal terminal 11 is bent downward at a substantially right angle, and the tip of the J-type lead is positioned on the back surface of the resin mold base 13. In addition,
This bending process is the same as the above-mentioned conventional one. The processing is performed as described above, and when the finish is viewed from the back surface of the resin mold base 13, it is as shown in (e) below. That is, the measurement electrode portion 1 is slightly closer to the inside of the resin mold base 13 than the position of the J-type lead.
A probe contact window 14 having an exposed portion 2 is arranged.

In this way, when the oscillator mold package is formed and the characteristics of the oscillator are measured, the probe 9 is pressed against the probe contact window 14 to perform the measurement. Since no pressure is applied to the J-shaped lead portion, the J-shaped lead portion can be measured without being deformed.

In the embodiment of the present invention described above, a part of the inner lead (measurement electrode portion 12) in the resin mold base 13 is exposed from the probe contact window 14 and the probe is placed there. Although the example in which 9 is pressed is shown, the present invention is not limited to this example, and may be configured as in the second embodiment shown in FIG. 3 below. .

FIG. 3 is a processing procedure diagram showing a second embodiment of the structure of the oscillator molded package according to the present invention. In addition, the metal terminal 15 used here has a substrate support portion 4 (first protrusion) and a J-type lead portion 5 (second protrusion), and has a measuring electrode portion 12 (third protrusion). Does not hold. However, the configuration is different from the above-described conventional metal terminal 2 in that the length of the J-type lead portion 5 (second protrusion) is longer in the metal terminal 15.

That is, in the structure of the oscillator mold package shown in this example, at the stage of FIG. 2A, the substrate support portion 4 and the J-type lead portion 5 are formed in the resin mold base in the state of forming the L-shape. A fixed scene is shown, and the processing procedure will be described below when viewed from the side. Here, first, in the step (b), the tip of the J-type lead portion 5 is bent upward at an obtuse angle. The surface from the bent portion to the tip portion serves as a probe pressing portion described later.

Next, in the step (c), the tip of the J-shaped lead portion 5 is rounded downward except for the portion bent in the step (b). Then, at the stage of (d),
The J-type lead portion 5 of the metal terminal 15 is bent downward substantially vertically at a portion closer to the resin mold base than the rounded portion. As a result, the J-shaped lead is formed and the flat portion of the tip (probe pressing portion 16) is formed.
Will be arranged parallel to the bottom surface of the resin mold base.

Therefore, according to this, when the characteristic of the oscillator is measured, if the probe 9 is pressed against the above-mentioned probe pressing portion 16, the probe pressing portion 16 is pressed by the resin by the pressing of the probe 9. Since it is closely fixed to the bottom surface of the mold base, it is possible to perform the measurement without causing deformation of the J-type lead portion.

As described above, in the structure of the oscillator molded package according to the present invention, as in the first embodiment, the probe contact window 14 is provided separately from the J-type lead, or in the second embodiment. As described above, since the probe pressing portion 16 is provided at the tip portion of the J-type lead, it is possible to prevent the J-type lead portion from being deformed when measuring the characteristics of the oscillator.

The metal terminal 11 shown in the first embodiment is used.
As an example of the above-mentioned supply, as shown in FIG. 4, a flat-belt-shaped copper plate is pressed and punched and metal terminals 11 corresponding to respective positions are integrally formed. here,
First, the connecting portion a between the frame 17 and the metal terminal 11 is cut, and the first protrusion (substrate support portion 4) and the third protrusion (measurement electrode portion 12) are bent. Next, after undergoing a molding step in this state, the metal terminal portion 11 is fixed to the resin mold base, and then the connecting portion b between the frame 17 and the metal terminal 11 is cut and separated to bend the J lead portion. After the application, the exposed portion of the metal terminal 11 may be subjected to solder plating to complete.

[0025]

As described above, in the structure of the molded package for the oscillator according to the present invention, the metal plate (metal terminal 11) forming the leads of the oscillator package has the U-shape having the second and the third protruding portions. And forming one of the U-shaped inner lead projecting pieces (a part of the third projecting section) in the package opening (probe contact window 14), or forming a lead of an oscillator package. The tip of the outer lead protruding piece of the metal plate (metal terminal 15) is processed so as to be in parallel contact with the bottom surface of the oscillator package (probe pressing portion 16 is formed), and the measurement probe is contacted. Since the pressure is not applied to the J-type lead portion, it is possible to prevent the J-type lead portion from being deformed when measuring the characteristics of the oscillator. Concrete can be realized.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a structure of a molded package for an oscillator according to the present invention. (A) shows the layout seen from above, (b) shows the layout seen from the side.

FIG. 2 is a diagram showing an example of a processing procedure in the first embodiment of the structure of the oscillator mold package according to the present invention, wherein (a2), (b2), (c) and (d) are side views. In the figures, (a1) and (b1) are top views and (e) is a back view.

FIG. 3 is a working procedure diagram showing a second embodiment of the structure of the oscillator molded package according to the present invention.

FIG. 4 is a view showing an example of supplying metal terminals in the first embodiment of the structure of the oscillator molded package according to the present invention.

[Fig. 5] (a) shows SOJ (Small Outline J-lead Pac
It is a top view which shows the state before the lead bending process of the base part in surface mounting type packaging called kage), and (b) is the sectional view.

FIG. 6 is an assembly diagram showing an example of assembly processing of the SOJ package shown in FIG.

FIG. 7 is a diagram showing an example of a characteristic measurement configuration of an oscillator,
(A) shows the scene before the cover is closed by placing the oscillator on the holding jig 8, and (b) shows the state where the cover is closed.

[Explanation of symbols]

1 ... Resin mold base 2 ... Metal terminal 3 ... Printed circuit board mounting part 4 ... Board support (metal terminal) 5: J type lead part (metal terminal) 6 ... Printed circuit board 7 ... Cap 8: Hold jig 9 ... Probe 10 ... Measuring instrument 11 ... Metal terminals 12 ... Measurement electrode part (metal terminal) 13: Resin mold base 14 ... Probe contact part 15 ... Metal terminal 16 ... Probe pressing part 17 ... Frame

Claims (2)

[Claims] 1. A structure of a molded package for an oscillator, wherein a metal plate forming a lead of the oscillator package has a U-shape, and one inner lead projecting piece of the U-shape is exposed at a package opening. . 2. A structure of an oscillator mold package, characterized in that a tip of an outer lead projecting piece of a metal plate forming a lead of an oscillator package is processed so as to abut against a bottom surface of the oscillator package in parallel.