TWI588494B - Probe and inspection socket provided with the probe - Google Patents

Description

Probe and inspection socket having the same

The present invention relates to, for example, a probe used for inspecting electrical characteristics of a semiconductor integrated circuit and a test socket including the probe.

In recent years, in semiconductor devices, semiconductor integrated circuits, and the like (hereinafter referred to as "ICs, etc.") for inspecting electrical characteristics through such inspection sockets, the high frequency of analog signals such as analog ICs has been progressing in digital ICs. The speed of the digital signal continues to progress. With this progress, the shortening of the signal transmission path is achieved, and a vertical type probe that is resistant to external noise is often used for the inspection socket (for example, refer to Patent Document 1).

FIG. 19 shows an example of the configuration of an inspection socket using a vertical probe inspection IC disclosed in Patent Document 1. As shown in FIG. 19, the conventional vertical type probe 80 is provided with the plungers 81 and 82, the coil spring 83, and the housing 84. The plunger 81 is in contact with the solder ball 85a of the IC 85, and the plunger 82 is in contact with the electrode pad 86a of the printed circuit board 86. The wire member 87a is welded to the electrode pad 86a for connection to an inspection device (not shown). With this configuration, the probe 80 is formed to relay the signal between the solder ball 85a of the IC 85 and the inspection device via the printed substrate 86.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1]

Japanese Laid-Open Patent Publication No. 2009-085948 ([0034]~[0036 〕, Figure 7)

However, the conventional vertical type probe 80 has the following problems.

(1) The plungers 81 and 82 of the conventional probe 80 are produced by cutting one cylindrical one through one single piece. For example, the rods 81 and 82 are cut into 0.8 mm bar, and one piece is machined into one Obtained by a thickness of about 0.3 mm. Therefore, in the conventional probe 80, since a lot of man-hours are required for production, the number of productions is limited, and there is a problem that it cannot cope with mass production. Further, in the conventional probe 80, a lot of man-hours are required for production, and since the amount of cutting is relatively large, the material cost is added, and there is a problem that cost reduction is difficult.

(2) In the inspection socket using the probe 80, an organic material such as resin is generally used as the material of the printed substrate 86. However, since the linear expansion coefficient of the organic material is relatively large, the interval between the ambient temperature patterns is easily changed. It is impossible to minimize the pitch between electrodes of an IC or the like. When the ceramic is used as the material of the printed circuit board 86, the coefficient of linear expansion can be made smaller than that of the organic material, and the pitch between the electrodes of the IC or the like can be minimized. However, the manufacturing cost of the inspection socket increases due to the increase in the cost of the printed circuit board 86.

The present invention has been made to solve the problem of the prior art, and it is an object of the present invention to provide a probe that can cope with mass production and that can reduce the manufacturing cost and minimize the inter-electrode pitch of the object to be inspected. an examination socket.

In the probe of the present invention, the first contact terminal and the second contact terminal are provided, and the first electrode that is the external connection terminal of the first electronic component and the second electrode that is the external connection terminal of the second electronic component are electrically connected. In the probe, the first contact terminal is formed of a first contact portion that is in contact with the first electrode at one end, and a plate-shaped member is formed at the other end, and the second contact terminal is The central portion has a joint portion, and a plate-shaped member having two plate-like portions is bent at least at least once at the both ends of the joint portion to bend the joint portion at least once, and the two plate portions are opposed to each other, and are formed with: a nip portion that sandwiches at least one portion of the strip portion and a second contact portion that is in contact with the second electrode, and a first contact terminal is pressed against the first electrode around the nip portion Further, the second contact terminal is pressed against the spring of the second electrode.

According to this configuration, the probe of the present invention includes the first and second contact terminals formed of a flat metal plate. Therefore, conventionally, one of the probes is not used for cutting, and chemical etching is used. Mold stamping technology can be mass produced with high precision and can reduce manufacturing costs.

Further, in the inspection socket including the probe of the present invention, it is not necessary to form a printed circuit board on a high-priced ceramic substrate as in the related art, and the vertical probe can be used to minimize the pitch between electrodes of the object to be inspected.

Therefore, the probe of the present invention can be produced in a large amount, and can be reduced in accordance with the reduction in manufacturing cost and the distance between the electrodes of the test object.

In the probe according to the first aspect of the invention, the first contact portion has two protrusions that are in contact with the first electrode, and the second contact terminal is formed by bending the joint portion into a U shape. Further, the opposing plate-like portion sandwiches at least a part of the strip-shaped portion as a sandwiching portion, the joint portion functions as a second contact portion, and the spring is attached to at least one portion of the sandwiching portion. A surrounding closed coil spring and a thick coil spring mounted in series with the closed coil spring.

According to this configuration, the second contact terminal can be formed in a U shape by bending the plate member once.

The probe according to the present invention has a configuration in which four protrusions that are in contact with the first electrode are formed in the first contact portion.

According to this configuration, in the probe of the present invention, the first contact terminal is formed to be more stable and in contact with the electrode.

In the probe of the present invention, the first contact terminal is formed by laminating planar metal plates each including two of the four protrusions.

According to this configuration, in the probe of the present invention, the first contact terminal is formed to be more stable and in contact with the electrode.

In the probe of the present invention, the first contact terminal has a configuration in which the planar metal plates each including the two protrusions are opposed to each other at the contact portion.

According to this configuration, in the probe of the present invention, the first contact terminal is formed to be more stable and in contact with the electrode.

The probe of the present invention has the second contact terminal and the junction The joint is bent in a V shape.

According to this configuration, the probe of the present invention can obtain electrical conduction between the electrode and the pad by a simple configuration.

In the probe according to the present invention, the second contact terminal is formed by bending a plate-like member having at least two projections extending from the plate-like portion on both sides of the joint portion, and the joint plate is U-shaped. In a shape, the two plate-like portions are opposed to each other and have a shape in which the protrusions are formed, and the plate-like portion serves as the sandwiching portion, and the protrusion functions as a first contact portion.

According to this configuration, the first contact terminal can bend the plate-like member once to form a U-shape, thereby reducing the manufacturing cost.

In the probe according to the present invention, the second contact terminal is formed by bending a plate-like member having at least two protrusions extending from the plate-like portion on both sides of the joint portion, and the joint portion is M-shaped. In a shape, the two plate-like portions are opposed to each other and have a shape in which the protrusions are formed, and the plate-like portion serves as the sandwiching portion, and the protrusion functions as a first contact portion.

According to this configuration, the first contact terminal can bend the plate-like member twice to form an M-shape, and the manufacturing cost can be reduced.

In the probe according to the present invention, the second contact terminal is formed by bending the joint portion into a W-shape and facing the two plate-like portions, and the plate-like portion is bent as a first contact portion. The central concave portion of the shape of the joint portion functions as the nip portion.

According to this configuration, the second contact terminal can bend the plate member The W shape is formed at a time, and the manufacturing cost can be reduced.

The inspection socket according to the present invention includes: a probe; a housing body on which the housing portion for housing the probe is formed; an inspection object holding portion that holds the inspection target body on which the electrode is provided; and the welding In the printed circuit board of the pad, each of the center line of the electrode and the pad is formed on a center line of the probe.

According to this configuration, the inspection socket of the present invention can be produced in large quantities, and can be reduced in accordance with the manufacturing cost and the distance between the electrodes of the object to be inspected.

The present invention can provide a probe that can cope with mass production and can reduce the manufacturing cost and minimize the inter-electrode pitch of the object to be inspected, and a probe having the inspection check socket.

[Formation for carrying out the invention] [First Embodiment]

Hereinafter, a first embodiment of the present invention will be described using the drawings.

Further, in the following embodiments, the first electronic component is an IC, and the second electronic component is a printed substrate.

Further, the first electrode is a solder ball which is an external connection terminal of the IC, and the second electrode is a solder pad which is an external connection terminal of the printed circuit board.

As shown in FIG. 1, the inspection socket 100 of the first embodiment is an IC 50 of a BGA (Ball Grid Array) type as a test object, and the electrical characteristics of the IC 50 are inspected via the solder balls 51 provided on the lower surface of the IC 50. Further, the solder ball 51 is an electrode constituting the present invention.

The inspection socket 100 includes a probe 10, a housing 20, an IC mounting portion 30, and a printed circuit board 40. Further, the IC mounting portion 30 is a subject holding portion constituting the present invention.

The probe 10 is a so-called vertical type probe, and includes a metal electrode contact terminal 11 that is in contact with the solder ball 51, a metal pad contact terminal 12 that is in contact with the pad 41, and an electrode. A coil spring 13 made of metal is in contact between the contact terminal 11 and the pad contact terminal 12. Further, the electrode contact terminal 11 and the pad contact terminal 12 constitute the first and second contact terminals of the present invention, respectively.

The casing 20 includes an upper casing portion 21 and a lower casing portion 22 which are formed of an electrically insulating material. The upper side frame portion 21 and the lower side frame portion 22 are fixed by screws (not shown). A through hole 21a is formed in the upper frame portion 21, and a through hole 22a is formed in the lower frame portion 22. The main portion of the probe 10 is housed in the accommodating portion formed by the through holes 21a and 22a.

The IC mounting portion 30 moves so that the solder ball 51 can come into contact with the electrode contact terminal 11 while the IC 50 is held.

The printed circuit board 40 is disposed on the lower surface side of the inspection socket 100, and is formed with wiring (not shown) from which a current supply circuit and a voltage measurement circuit are connected. A pad 41 is formed on the upper surface of the printed substrate 40.

FIG. 2 shows a state in which the IC 50 is inspected by checking the socket 100. As shown in FIG. 2, the center lines of the pad 41 and the solder balls 51 are located on the center line of the probe 10. The electrode contact terminal 11 is in contact with the solder ball 51, and the pad contact terminal 12 is in contact with the pad 41. The electrical conduction between the electrode contact terminal 11 and the pad contact terminal 12 is ensured by the coil spring 13. The coil spring 13 is formed to push the electrode contact terminal 11 against the solder ball 51, and the spring pushes the pad contact terminal 12 against the pad 41.

Next, a detailed configuration of the probe 10 will be described with reference to FIG. 1 as a center. 3(a) is a front view of the probe 10, and FIG. 3(b) is a side view of the probe 10.

As shown in FIGS. 3(a) and 3(b), the electrode contact terminal 11 includes a solder ball contact portion 11a that is in contact with the solder ball 51, and a strip shape extending from one end of the electrode contact terminal 11 toward the pad 41. Band portion 11b. Further, the solder ball contact portion 11a is a contact portion constituting the present invention.

The pad contact terminal 12 is provided with a pad contact portion 12a that is in contact with the pad 41, and a pinch portion 12b that sandwiches at least a part of the strip portion 11b of the electrode contact terminal 11.

The electrode contact terminal 11 is formed of a flat metal plate as shown in Fig. 4 (a).

Further, the pad contact terminal 12 is formed by bending the planar metal plate shown in FIG. 4(b) in a U shape by using the pad contact portion 12a as a base. Therefore, the electrode contact terminal 11 and the pad contact terminal 12 can be mass-produced with high precision by using a chemical etching technique or a die pressing technique, and the manufacturing cost can be reduced.

The coil spring 13 is, for example, a tight coil portion 13a in which a wire plated with a gold plated surface is wound, and a wide coil portion 13b which is wound at a wider pitch than the tight coil portion 13a. The close coil portion 13a is provided around at least a part of the nip portion 12b of the pad contact terminal 12. The wide winding portion 13b is an outer circumference of the strip portion 11b provided on the electrode contact terminal 11. The diameter of the coil spring 13 is uniform. Further, the tight coil portion 13a and the wide coil portion 13b constitute the first spring and the second spring of the present invention, respectively.

The section A-A of the probe 10 is shown in the upper part of Fig. 3(b). Since the probe 10 is configured as described above, even when the electrode contact terminal 11 is inclined in the Y-axis direction during the inspection of the IC 50, the tilt is restricted by the tight coil portion 13a of the coil spring 13, and the electrode contact terminal 11 is Electrical conduction between the pad contact terminals 12 can be ensured by the coil springs 13.

On the other hand, even if the electrode contact terminal 11 is inclined toward the X-axis direction, it can be represented as shown in the mode of FIG. 5, since the electrode contact terminal 11 contacts the contact portion 12b of the terminal 12 at two places of the B portion and the C portion with the pad. Contact, so the probe 10 can surely ensure electrical conduction between the electrode contact terminal 11 and the pad contact terminal 12.

Further, the coil spring 13 described above is exemplified by an example in which the tight coil portion 13a and the wide coil portion 13b are integrally formed, but the compact coil spring 13 may be replaced by a tight coil spring; and the wide coil spring may be used instead of the wide coil spring 13; The two parts of the roll portion 13b are configured. At this time, the tight coil portion 13a and the wide coil portion 13b are formed to have the same diameter and are disposed to face each other.

As described above, the probe 10 of the present embodiment is provided with: Since the electrode contact terminal 11 and the pad contact terminal 12 formed by the planar metal plate are configured as described above, it is not necessary to perform one cutting process, and a large number of high precision can be used by using a chemical etching technique or a die pressing technique. Production, and can reduce manufacturing costs.

Further, in the inspection socket 100 including the probe 10 of the present invention, the printed circuit board 40 is formed of a high-priced ceramic substrate as in the related art, and the pitch between the electrodes of the object to be inspected can be minimized.

Therefore, the probe 10 of the present invention can be produced in a large amount, and the manufacturing cost can be reduced and the distance between the electrodes of the test object can be minimized.

In the first embodiment, the electrode contact terminal 11 is used as the first contact terminal of the present invention, and the pad contact terminal 12 is used as the second contact terminal of the present invention. However, the present invention is not limited thereto. In other words, the electrode contact terminal 11 may be the second contact terminal of the present invention, and the pad contact terminal 12 may be the first contact terminal of the present invention.

Next, a modification of the first embodiment will be described using the drawings. In the following description, the differences between the above-described embodiments will be mainly described.

(Modification 1)

Modification 1 will be described with reference to Fig. 6 . In the first embodiment, the solder ball contact portion 11a of the electrode contact terminal 11 has a shape as shown in Fig. 6(a). In the first modification of the electrode contact terminal 11, as shown in Fig. 6(b), the solder ball contact portion 11a has four projections 11c, 11d, 11e, and 11f. This shape is, for example, a V-shaped groove 11g which is formed in a mold in advance, and Obtained by the formation of stamping.

According to this configuration, the solder ball contact portion 11a is formed to be in contact with the solder ball 51 more stably.

Further, as shown in FIG. 6(c), the two metal sheets 11A and 11B of the same shape may be superposed by welding the shape shown in FIG. 6(b) by welding, caulking, or the like.

(Modification 2)

The modification 2 will be described with reference to Fig. 7 . The electrode contact terminal 15 in the second modification is formed of two metal plates of the shape shown in Fig. 4(a) as shown in Figs. 7(a) to 7(c).

In other words, the electrode contact terminal 15 is formed by laminating two flat metal plates of the same shape by welding, caulking, or the like, and has a solder ball contact portion 15a and a strip portion. 15b.

The planar metal plates on which the solder ball contact portions 15a are formed are separated from each other. The two strip portions 15b are superposed by being welded, riveted, and then joined to each other.

According to this configuration, the solder ball contact portion 15a is formed to be more stably in contact with the solder ball 51.

Further, when the solder ball contact portion 15a comes into contact with the solder ball 51, the solder ball contact portion 15a is enlarged along the shape of the solder ball 51, and an oxide film (hereinafter wiped) on the surface of the solder ball 51 can be cut.

By this wiping, the contact resistance of the solder ball contact portion 15a and the solder ball 51 can be greatly reduced.

Further, the wiping can be adjusted by appropriately setting the length L, the thickness t, and the interval d of the solder ball contact portion 15a.

Further, as shown in FIGS. 7(d), (e) and (f), when the diameter of the solder ball 51 is relatively large, the solder ball contact portion 15a is also folded in two stages to ensure the amount of wiping.

(Modification 3)

Modification 3 will be described with reference to Fig. 8 . The probe 16 in the third modification includes the pad contact terminal 121 instead of the pad contact terminal 12 in the above-described embodiment. The pad contact terminal 121 is a V-shaped curved metal plate and has a V shape with the pad 41 side as a vertex. Further, the pad contact terminal 121 is a pad contact portion that forms a V-shaped tip end in contact with the pad 41.

The electrode contact terminal 11 is an inner surface contact portion 11h and 11i having a V-shaped inner surface in contact with the pad contact terminal 121 by contraction of the coil spring 13.

With this configuration, the probe 16 can be electrically connected between the pad 41 and the solder ball 51 by a simple configuration.

[Second Embodiment]

Next, a second embodiment of the present invention will be described.

As shown in FIG. 9, the inspection socket 600 of the second embodiment includes a probe 60, a housing 20, an IC mounting portion 30, and a printed circuit board 40. In addition, the same component as the first embodiment is labeled with the same reference. The number is omitted and detailed instructions are omitted.

The probe 60 of the second embodiment includes an electrode contact terminal 61 that is in contact with the solder ball 51, a pad contact terminal 62 that is in contact with the pad 41, and an electrode contact terminal 61 and a pad contact terminal 62. Coil spring 63 between.

Next, a detailed configuration of the probe 60 will be described with reference to Fig. 9 as a center. Fig. 10(a) is a front view of the probe 60, and Fig. 10(b) is a side view of the probe 60.

As shown in FIGS. 10(a) and (b), the pad contact terminal 62 is provided with a pad contact portion 62a that is in contact with the pad 41, and a direction from the end of the pad contact terminal 62 toward the solder ball 51. A strip portion 62b extending in a strip shape.

Further, the electrode contact terminal 61 is provided with a solder ball contact portion 61a that is in contact with the solder ball 51, a sandwiching portion 61b that sandwiches at least a portion of the strip portion 62b of the solder contact terminal 62, and a clamping portion that connects the both ends The joint portion 61c of 61b.

Further, Fig. 10(c) is a top view of the probe 60, and Fig. 10(d) is a lower view.

The pad contact terminal 62 is formed of a planar metal plate as shown in Fig. 11(a).

Moreover, the electrode contact terminal 61 has a connecting portion 61c as a base, and the planar metal plate shown in FIG. 11(b) is bent to form a U-shape.

That is, the solder ball contact portion 61a is provided to extend from the sandwiching portion 61b on both sides of the connecting portion 61c.

Therefore, when the connecting portion 61c is bent in a U shape, the solder ball contact portion 61a is separated from the connecting portion 61c to form a contact with the solder ball 51.

Further, even in the probe 60 of the second embodiment, when the solder ball contact portion 61a comes into contact with the solder ball 51, the oxide film of the solder ball 51 can be removed by wiping.

Fig. 12 is a first modification of the second embodiment, and the length of the solder ball contact portion 61a can be increased.

In other words, as shown in Fig. 13, by providing the notch 61f from the branching position 61e of the solder ball contact portion 61a and the connecting portion 61c, it is possible to form a solder ball contact portion which can be bent when the connecting portion 61c is bent into a U shape. long.

At this time, since only the connecting portion is bent in a U shape, the interval between the sandwiching portions 61b may be too large, and the connecting portion may be an M-shaped intermediate fold, and the interval may be adjusted.

Fig. 14 is a modification of the second to fourth embodiments of the second embodiment, and the length of the solder ball contact portion 61a can be increased.

In other words, in the second modification (a), the solder ball contact portion 61a opposite to each other is provided around the connection portion 61c of the electrode contact 61, and the connection portion 61c is bent in an inverted U shape or M. In the case of a shape, the solder ball contact portions 61a are four in a parallelogram shape.

In the third modification (b), the downward solder ball contact portion 61a is formed on the outer side of the two connection portions 61c, and the upward solder ball contact portion 61a is formed inside the two connection portions 61c, and the connection portion is formed. When the 61c is bent in an inverted U shape or an M shape, the solder ball contact portion 61a is three.

In the fourth modification (c), two connection portions 61c are provided on the outer side, and the notch and the connection portion of the four solder ball contact portions 61a are cut into the inside. Regardless of the length of 61c, the length of the solder ball contact portion 61a can be increased.

Even in the present modification, when the connecting portion 61c is bent in a U shape, the four solder ball contact portions 61a stand.

Fig. 15 is a fourth modification of the second embodiment. Similarly to Figs. 7(d) to 7(f), in the embodiment in which the solder ball contact portion 61a is folded in two, even when the diameter of the solder ball 51 is large, It ensures contact.

[Third embodiment]

Next, a third embodiment of the present invention will be described.

As shown in FIG. 16, the probe 70 of the third embodiment includes an electrode contact terminal 71 that is in contact with the solder ball 51, a pad contact terminal 72 that is in contact with the pad 41, and an electrode contact terminal 71. The pad contacts the coil spring 73 between the terminals 72.

Further, Fig. 16(a) is a front view of the probe 70, and Fig. 16(b) is a side view of the probe 70.

As shown in FIGS. 16(a) and 16(b), the pad contact terminal 72 is provided with a pad contact portion 72a that is in contact with the pad 41, and a direction from the end of the pad contact terminal 72 toward the solder ball 51. A strip-shaped portion 72b extending in a strip shape.

Further, the electrode contact terminal 71 is provided with a solder ball contact portion 71a that is in contact with the solder ball 51, and a connection portion 71c that connects the sandwiching portions 71b at both ends.

The pad contact terminal 72 is formed of a planar metal plate as shown in Fig. 17 (a).

Further, the electrode contact terminal 71 is formed by bending a flat metal plate as shown in FIG. 17(b) so that the connecting portion 71c is formed in a W shape.

Therefore, when the connecting portion 71c is bent in a W shape, the solder ball contact portion 71a is formed at both ends, and the sandwiching portion 71b is formed at the center.

Further, even in the probe 70 of the third embodiment, when the solder ball contact portion 71a comes into contact with the solder ball 51, the oxide film of the solder ball 51 can be removed by wiping.

Fig. 18 is a modification of the third embodiment, and in the same manner as in Figs. 7(d) to (f), in the embodiment in which the two portions of the solder ball contact portion 71a are bent, the contact of the solder ball 51 is large, and the contact can be ensured. Sex.

[Industrial availability]

As described above, the probe of the present invention and the inspection-receiving socket having the same can be used as an inspection IC in accordance with the effect of mass production, reduction in manufacturing cost, and minimization of the inter-electrode pitch of the object to be inspected. The probe used for the electrical characteristics of the device and the probe socket having the probe are useful.

10‧‧‧ probe

11‧‧‧Electrode contact terminals

11A‧‧‧Metal plate

11a‧‧‧Ball contact

11b‧‧‧Strip

11c, 11d, 11e, 11f‧‧

11g‧‧‧V-groove

11h‧‧‧Internal contact

12‧‧‧ solder pad contact terminal

12a‧‧‧pad contact

12b‧‧‧ gripping department

13a‧‧‧Compact coil department

13b‧‧‧ Wide Volume

15‧‧‧Electrode contact terminals

15a‧‧‧Ball contact

15b‧‧‧Strip

16‧‧‧ probe

20‧‧‧ frame

21‧‧‧Upper side frame

21a‧‧‧through holes

22‧‧‧Bottom frame

22a‧‧‧through holes

30‧‧‧IC Mounting Department

40‧‧‧Printing substrate

41‧‧‧ solder pads

50‧‧‧IC

51‧‧‧ solder balls

60‧‧‧ probe

61‧‧‧Electrode contact terminals

61a‧‧‧Ball contact

61b‧‧‧ gripping department

61c‧‧‧Connecting Department

61e‧‧‧ minutes

62‧‧‧ solder pad contact terminal

62a‧‧‧pad contact

62b‧‧‧Strip

70‧‧‧ probe

71‧‧‧Electrode contact terminals

71a‧‧‧Ball contact

71b‧‧‧ gripping department

71c‧‧‧Connecting Department

72‧‧‧pad contact terminal

72a‧‧‧pad contact

72b‧‧‧Strip

80‧‧‧ probe

81‧‧‧Band

82‧‧‧Band

84‧‧‧Shell

85‧‧‧IC

85a‧‧‧ solder balls

86‧‧‧Printing substrate

86a‧‧‧electrode pad

87‧‧‧Wire

100‧‧‧Check socket

121‧‧‧pad contact terminal

[figure 1]

A configuration diagram of the first embodiment of the inspection socket of the present invention.

[figure 2]

In the first embodiment of the inspection socket of the present invention, a configuration diagram of a state during inspection is shown.

[image 3]

A configuration diagram of the first embodiment of the probe of the present invention.

Fig. 4 is a perspective view showing a part of a probe according to a first embodiment of the present invention.

Fig. 5 is a schematic explanatory view showing a state in which the electrode contact terminals are inclined in the first embodiment of the probe of the present invention.

Fig. 6 is a view showing a first modification of the probe according to the first embodiment of the present invention.

Fig. 7 is a view showing a second modification of the probe according to the first embodiment of the present invention.

Fig. 8 is a view showing a modification 3 of the probe according to the first embodiment of the present invention.

Fig. 9 is a configuration diagram of a second embodiment of the inspection socket of the present invention.

Fig. 10 is a configuration diagram of a probe according to a second embodiment of the present invention.

Fig. 11 is a perspective view showing the components of the second embodiment of the probe of the present invention.

Fig. 12 is a view showing a first modification of the probe according to the second embodiment of the present invention.

Fig. 13 is a perspective view showing a part of a modification 1 of the second embodiment of the probe of the present invention.

Fig. 14 is a view showing Modifications 2 to 4 in the second embodiment of the probe of the present invention.

Fig. 15 is a view showing a fifth modification of the probe according to the second embodiment of the present invention.

Fig. 16 is a configuration diagram of a probe according to a third embodiment of the present invention.

Fig. 17 is a perspective view showing a part of a probe according to a third embodiment of the present invention.

Fig. 18 is a view showing a first modification of the probe according to the third embodiment of the present invention.

19 is a configuration diagram of a conventional inspection socket.

10‧‧‧ probe

11a‧‧‧Ball contact

11b‧‧‧Strip

13b‧‧‧ Wide Volume

12b‧‧‧ gripping department

12‧‧‧ solder pad contact terminal

12a‧‧‧pad contact

13a‧‧‧Compact coil department

11‧‧‧Electrode contact terminals

13‧‧‧ coil spring

Claims (4)

A probe includes a first contact terminal and a second contact terminal, and is electrically connected to a first electrode that is an external connection terminal of the first electronic component and a second electrode that is an external connection terminal of the second electronic component. In the first contact terminal, a first contact portion that is in contact with the first electrode is formed at one end, and a plate-shaped member is formed at the other end, and the second contact terminal is a center. Having a joint portion, and a plate-shaped member having two plate-like portions at both ends of the joint portion is bent at least once to form the joint portion, and the two plate portions are opposed to each other and formed with: The nip portion of the at least one portion of the strip portion and the second contact portion that is in contact with the second electrode are mounted around the nip portion to press the first contact terminal against the first electrode, and The second contact terminal is pressed against the spring of the second electrode, and the second contact terminal is formed by bending a plate-shaped member having at least two protrusions extending from the plate-like portion on both sides of the joint portion. The aforementioned bonding plate is U-shaped, The two plate-like portions are opposed to each other and have a shape in which the protrusions are formed. The plate-like portion serves as the sandwiching portion, and the protrusion functions as a first contact portion. A probe includes a first contact terminal and a second contact terminal, and is electrically connected to a first electrode that is an external connection terminal of the first electronic component and a second electrode that is an external connection terminal of the second electronic component. In the first contact terminal, a first contact portion that is in contact with the first electrode is formed at one end, and a plate-shaped member is formed at the other end, and the second contact terminal is a center. Having a joint portion, and a plate-shaped member having two plate-like portions at both ends of the joint portion is bent at least once to form the joint portion, and the two plate portions are opposed to each other and formed with: The nip portion of the at least one portion of the strip portion and the second contact portion that is in contact with the second electrode are mounted around the nip portion to press the first contact terminal against the first electrode, and The second contact terminal is pressed against the spring of the second electrode; and the second contact terminal is formed by bending a plate-like member having at least two protrusions extending from the plate-like portion on both sides of the joint portion The joint portion is formed in an M shape, and the two plate-like portions are opposed to each other, and have a shape in which the projections are erected. The plate-like portion serves as the nip portion, and the projection functions as a first contact portion. A probe includes a first contact terminal and a second contact terminal, and is electrically connected to a first electrode that is an external connection terminal of the first electronic component and a second electrode that is an external connection terminal of the second electronic component. In the needle, the first contact terminal is a plate-shaped member in which a first contact portion that is in contact with the first electrode is formed at one end, and a strip portion is formed at the other end. The second contact terminal has a joint portion at the center, and a plate-shaped member having two plate-like portions at both ends of the joint portion is bent at least once to form the joint portion, and the two plate portions are formed. In the opposing direction, a nip portion that sandwiches at least one portion of the strip portion and a second contact portion that is in contact with the second electrode are formed, and the first contact terminal is pressed around the nip portion a spring that is pressed against the first electrode and that presses the second contact terminal against the second electrode; and the second contact terminal bends the joint portion into a W shape, and the two plate portions are opposed to each other The plate-like portion serves as a first contact portion, and a central recess portion of the joint portion that is bent in a W shape functions as the sandwiching portion. An inspection socket provided with the probe according to any one of claims 1 to 3, wherein the probe is provided with a housing portion for housing the probe: The test object holding portion of the test object of the electrode; and the printed circuit board provided with the second electrode, wherein each center line of the first electrode and the second electrode is on a center line of the probe.