JP2710203B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and in particular, to Small Outline J-lead (hereinafter referred to as "S").
The present invention relates to an IC socket having contact pins suitable for performing test inspection or characteristic measurement of an integrated circuit (IC) element having a package.

[0002]

2. Description of the Related Art Referring to FIG. 4 showing a conventional IC socket and an integrated circuit device inserted therein, an integrated circuit device 20 has a rectangular upper and lower surface of an insulating IC package 6, of which A large number of leads 7 are respectively derived from the side surfaces of the long side portion, and such leads are not derived from the side surface of the short side portion. Inside the package 6, there is an integrated circuit chip, and the pads on this chip and the leads 7 are usually electrically connected, but not shown here. The lead 7 has a so-called J shape wound on a half loop in the lower surface direction, and the lowermost surface portion is mechanically and electrically connected to the conductor portion on the surface of the printed wiring board by soldering or the like. This is the lead of a so-called surface mount type package. The surface of the lead 7 is usually subjected to a solder plating process, a gold plating process, or the like. Usually, the left and right leads 7 indicate a large number of leads arranged symmetrically to the left and right.

In FIG. 4, a hand 8 and a stopper 9 contacting the upper surface and the lower surface of the package 6, respectively, grasp the semiconductor device 20 and set the semiconductor device 20 at a required position of the concave portion 10 of the IC socket 21 to complete the electrical test. Then, it is a handling for pulling out and transporting it to a storage device at another place, which is one of the options that the handling of the industrial robot can use.

Since the IC socket 21 has a symmetrical shape along the line AA 'and has a common operation mechanism on the left and right, the right side of the line AA' is a sectional view here. The left side is a side view showing the appearance.

[0005] In the drawings described below, only one side is shown, but the shape and operation mechanism have symmetry. The IC socket main body 5 of the IC socket 21 is insulative, is made of a material such as polyetherimide (PEI), and the concave portion 10 opening upward has a space for accommodating the SOJ type integrated circuit device 20. It is. The required number of contact pins 11 are prepared at positions corresponding to the respective leads 7 and are implanted in the socket body 5 so as to be electrically insulated from each other. The material thereof is BeCu (berium copper) and the thickness thereof is 0.2mm, width 0.6
mm is formed by bending a plate-shaped metal having a surface plated with gold or the like. The contact pin 1 includes an open contact pin end 11d, a contact surface 11C having a surface that comes into contact with the lead 7, a spring action portion 11e,
It has a base 11b and a connection terminal 11a to the outside. The cam 12 is insulative and made of the above-mentioned PEI, and the cam end 12b is in contact with the inner surface of the contact pin 11 in a slidable manner.

The cam ends 12b are in contact with all the inner surfaces of the pins 11, and are also provided around the pins 3 supporting the ends 12b. The other cam ends 12 a are provided at both ends of the pin 3, respectively, and are integrated with the cam 12. The center of rotation of the cam 12 is the pin 3,
The pin 3 supports the cam 12 in a freely rotatable manner. In the state shown in FIG. 4, the cam 12 rotates clockwise and stops with the cam end 12a protruding. This is maintained only by the elastic force of the contact pin 11. It is necessary to pre-bend the contact pins 11 so as to be in this state. The pins 3 are completely fixed to the IC socket body 5 at both ends or rotatably fixed.

A hand 8 and a stopper 9 which vertically move up and down.
Is attached to a device that automatically inserts and removes the SOJ package 6 from the IC socket 21 (the device is not shown), and is handled with the top and bottom surfaces of the SOJ package 6 interposed therebetween. As shown in FIG. 5, when the SOJ package 6 fixed between the hand 8 and the stop 9 is inserted into the recess 10 of the socket body 5, the cam end 12 a contacts the bottom surface of the stopper 9 to pin the pin 3. The cam end 12b is pushed down about the rotation center, and the
Rotate in the center direction, ie, counterclockwise. Then, the contact pins 11c come into contact with the leads 7 of the package 6 accommodated. Since the distance that the end of the cam 12b rotates and moves to the left is compared with the distance that the cam end 12a is pushed down, by setting the length from the pin 3 to an appropriate dimension, the length of the cam end 12b can be reduced. The required amount of movement is obtained. As described above, since the lead 7 and the contact pin 11 come into contact with each other when the package 6 is almost completely inserted into the IC socket 21, rubbing due to a mechanical load during the insertion can be reduced temporarily, and the lead 7 is plated. Solder scraps are prevented from being generated due to peeling of the processed solder.

The contact pins 11 are formed by punching a thin elastic plate, and are arranged in the socket body 5 at intervals and widths corresponding to the leads 7 respectively.

[0009]

SUMMARY OF THE INVENTION Such a conventional IC
In the socket, since it comes into elastic contact with the lead 7 as shown in FIG.
e is bent on the hairpin and has a spring force, but when the SOJ package 6 is repeatedly mounted on the socket body 5, the contact pin 11 is gradually opened toward the center of the recess 10 by a repeated load of opening. Remains open. When the SOJ package 6 is repeatedly used in such an open state, the friction between the contact pins 11 and the leads 7 increases when the SOJ package 6 is inserted, and solder scraps are generated.

Further, since the current flow path is a path on the loop passing through the spring portion, the distance from the lead 7 of the SOJ package to the connection terminal 11a at the lower end of the contact pin becomes long, and the L component due to the loop portion, The self-inductance is large, making it impossible to accurately inspect high-frequency characteristics.

Another structure for shortening the distance from the lead to the lower end of the contact pin as described above is disclosed in
As disclosed in Japanese Unexamined Patent Application Publication No. 274076/1990 and Japanese Patent Application Laid-Open No. 1-154479, each of these techniques is not an SOJ type, but relates to an IC socket for testing a rat type IC package. In the IC socket shown here, SOJ
When testing and measuring the electrical characteristics of the die package, the contact surface of the contact pin is the bottom surface of the lead 7 of the SOJ package 6.
Is placed and brought into contact with the lead 7 of the SOJ package 6
Adverse effects such as poor contact and lead buckling. SOJ
The bottom surface of the lead 7 of the package 6 is a mounting surface on a substrate. For example, even if the buckling of the lead is 0.1 mm, its reliability is significantly reduced.

Further, the problem with these techniques is that
Since there are two contact pieces and two contact portions 2 including the leads, the reliability is low.

The present invention has the following objects to solve the above problems. (A) Shape change due to deterioration of contact pins due to repeated use is prevented. (B) Prevent mechanical contact between the lead and the contact pin. Prevent the generation of scraps due to this contact,
Eliminates work of removing solder debris. (C) To shorten the contact path from the lead to the external terminal of the contact pin. The inductance and the distributed capacitance of this path are reduced so that the high frequency characteristics of the integrated circuit device can be accurately measured. (D) By increasing the durability of the IC socket, the life is prolonged, and loss time such as replacement time of the IC socket is eliminated. (E) In order to protect the contact surface of the lead with the substrate, this portion is inserted into the IC socket in a non-contact state. (F) The structure is not complicated and the number of contact points is not increased. (G) In order to inspect a large number of integrated circuit devices in a short time,
Even if it is set or reset to the C socket, it has a durable structure. In other words, it must have durability adapted to mass production. (H) Prevent generation of solder chips and the like. When this occurs, not only will leads and pins be damaged, but also a short circuit between leads and pins will occur, and accurate inspection cannot be performed. (I) It is suitable for testing an integrated circuit device having an SOJ type package, and can secure mass productivity and high reliability.

[0014]

According to the present invention, an integrated circuit is provided.
A body having a recess into which the road device is inserted;
A contact pin arranged so as to face each lead is supported on the body the integrated circuit device in said each contour
The co by the rotational force caused by the pressing when supported by the body inside the Kutopin inserting said integrated circuit device
And a cam for moving the Ntakuto pin in a direction to contact with the lead, the contact pins in the IC socket which derives the connection terminal to the outside of the body, the cam, the insertion direction opposite to the direction Is provided, and the tip of the contact pin faces outward.
Together with the tip, the curved spring action portion, the reed
The contact terminal is connected to the connection terminal via a contact portion with the connection terminal.

[0015]

FIG. 1 is a side view showing an IC socket according to a first embodiment of the present invention. In the embodiment shown in FIG. 1, the description common to FIGS. 4, 5 and the description thereof will be omitted. In this embodiment, a helical spring 4 for pushing up the cam reversing step 12a (that is, moving in the clockwise direction) is provided.
The contact pin 1 has a substantially vertical contact surface 1c via a spring acting portion 1e which is the next curved portion, and the end 1d does not become an open end and is erected on the main body 5. Subsequently, the connection terminal 1a is exposed outside. Since the cam a around the pin 3 is partially missing because it extends downward from the contact surface 1c, the cam a does not hinder the rotation operation. Cam 2
Are formed integrally and are linked.
The IC socket main body 5 has a rectangular shape when viewed from the top, and has a shape in which the center portion is hollowed out in the left and right directions. The multiple contact pins are accommodated inside the long sides of the main body 5 corresponding to the leads, fix the base 1b to the main body, and have connection terminals 1d on the lower side. The spring 4 raises all of its lower parts upward so that the left cam end located at the symmetrical position also acts at the same time. That is, a normal compressive force acts on the spring 4.

A spring 4 is provided so that a load (counterclockwise) is not always applied to the contact pin 1 and the cam 2 is separated from the pin 1 when the SOJ package 6 is not mounted. I have. The spring 4 is provided in a pair at the center end of the concave portion 10 of the IC socket body 5.

Although only one side will be described here,
The right side also has the main structure and function. Contact pin 4
The upper end 1d is fitted into the IC socket frame 5 to support the contact pin 1c after the cam 2a presses the contact pin 1c toward the center of the recess, thereby promoting the pulling back of the contact surface 1c. Since the contact pin 1e is formed on the hairpin, it has a spring force, and the open 1e
The part generates a shrinking force. By fixing the 1d portion, the contact surface 1c is always kept at a fixed position (in a state where the SOJ package 6 is not inserted) by using a contracting force.

Conventionally, to return the cam 2 to the normal position, only the contact pin 1 is resilient. However, here, since the cam 2 returns to the normal position by the spring 4, the load on the contact pin 1 is extremely small. Thus, a durable, non-deformed contact pin is obtained. End 2 of cam 2
b is located at a position opposing the contact surface 1c, but may be provided in a shorter shape so as to be lower than the contact surface. The set lead and the pin 3 are placed on the contact surface 1c of the contact pin.
And is led out to the lower connection terminal 1a, and this path is the shortest. From the contact surface 1c to the connection terminal 1
The path to “a” is extremely short, the inductance and the stray capacitance are extremely small, and the value is negligibly small in a high-frequency characteristic test. Since the contact pin 1 has no load on the cam 2, deformation due to repeated load is small, and therefore, when the lead 7 of the package is set, it does not come down in contact with the lead 7. Therefore, no debris or peeling occurs. The contact surface 1c of the contact pin 1 is processed in advance with a clearance so that the lead 7 to be inserted does not contact. As shown in FIG. 1, there is a slight gap between the cam end 2b and the contact pin 1, and it is preferable to provide such play.

The SOJ package 6 shown in FIG. 4 is mounted on the bottom surface of the concave portion 10, the cam end 2a is pushed downward about the pin 3, and the cam end 2b rotates to the center of the concave portion, and is attached to the cam end 2b. The contact pin contact surface 1c in close contact is pushed toward the center of the recess. At this time, the contact pin 1 and the lead 7 come into contact. The position of the lead 7 of the SOJ package 6 and the position of the contact pin contact surface 1c are parallel to each other. Thereby, the friction between the contact pin 1 and the lead 7 due to the insertion can be reduced. In this embodiment, since the cam end portion 2b is long, the left and right movement distance is large, and the contact pin 1 can be arranged with a sufficient margin so that the lead 7 does not contact. The contact pin 1 is a BeCu cup having a width of 0.6 mm and a thickness of 0.2 mm, and the surface thereof is plated with gold. The IC socket body 5 and the cam 2 are made of PEI, and the pins 3 are made of stainless steel. Distance between contact pins 1 and distance opposite, IC
The size of the socket body and the size of the cam depend on the size of the SOJ package to be measured and inspected. However, it is preferable that the width and the thickness of the contact pin be substantially constant as described above.

In the first embodiment described above, the case where the SOJ type integrated circuit device 20 shown in FIG. 4 is lowered from above and set in the IC socket shown in FIG. 1 is described. There are variations.

After the integrated circuit device 20 is fixed at a predetermined position, the IC socket shown in FIG. 1 may be moved by using a handling mechanism or the like so as to approach the device 20 from below and mount it.

The package 6 of the integrated circuit device 20 shown in FIG.
The upper and lower surfaces may be reversed, and may be mounted in the IC socket of FIG. In this case, the lead 7 is bent upward, and accordingly, the thickness of the stop 9 is adjusted to be thin so that the lead 7 comes into contact with the contact surface 1c.

The modifications described above can be used in combination with and can be appropriately selected according to the state of the manufacturing process before and after, not shown. This modification can be appropriately selected and used in the second and third embodiments described below.

FIG. 2 is a side view showing an IC socket according to a second embodiment of the present invention. In FIG. 2, in this embodiment, a contact pin end 1 d is fixed to an end 2 c of the cam 2. It is preferable that the end portion 2c is sandwiched between the contact pins 1 and is set so that the contact pins 1 can move up and down. Since there is no need to plant the end 1d, there is an advantage that it is easy to manufacture. Other structures and operation mechanisms are common to the case of FIG. 1 and its modified example, and thus detailed description is omitted.

FIG. 3 is a side view showing an IC socket according to a third embodiment of the present invention. In FIG. 3, in this embodiment, the end 2C of the cam 2 is shorter than that of the embodiment of FIG. 2, and there is no end 2c at a position facing the contact surface 1C.
There is an advantage that it comes into contact with the lead 7 more resiliently. The cam end 2a is more exposed than in the cases of FIGS. 1 and 2, thereby compensating for the insufficient movement of the cam end 2c. Since other structures and operation mechanisms are common to the above-described embodiment, description of the common parts will be omitted.

[0026]

As described above, according to the present invention, the object of the present invention has been achieved, and the durability of the IC socket has been improved, the contact load has been reduced, the occurrence of peeling and debris has been reduced, and the test accuracy of high frequency characteristics has been reduced. Improvement, prevention of contact pin shape change,
Improvement of work efficiency The effects of preventing a short circuit accident, improving the reliability with a simple structure, and improving the mass productivity of the SOJ type package can be obtained.

[Brief description of the drawings]

FIG. 1 is a side view showing a partial cross section of an IC socket according to a first embodiment of the present invention.

FIG. 2 is a side view showing an IC socket according to a second embodiment of the present invention as a partial cross section.

FIG. 3 is a side view showing an IC socket according to a third embodiment of the present invention as a partial cross section.

FIG. 4 is a side view showing a conventional IC socket and an integrated circuit device.

FIG. 5 is a side view showing a setting state of the apparatus of FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1,11 Contact pin 2,12 Cam 3 Pin 4 Spring 5 IC socket main body 6 IC package 7 Lead 8 Hand 9 Stopper 10 IC socket recess 1a, 11a Connection terminal 1b, 11b Base 1c, 11c Contact surface 1d, 11d Contact pin end Part 1e, 11e Spring acting part 2a, 2b, 12a, 12b Cam end 20 Integrated circuit device 21 IC socket

Claims (4)

(57) [Claims] An integrated circuit device is formed with a concave portion into which the integrated circuit device is inserted.
A main body, a contact pin supported by the main body in the concave portion and arranged opposite to a lead of the integrated circuit device, and supported by the main body inside each of the contact pins.
Is a cam for moving the contact pins by the rotational force generated by the pressing when inserting the integrated circuit device in a direction to contact with the lead, the contact <br/> pin connection terminal to the outside of the body in the IC socket that derives, on the cam, the insertion direction opposite spring acting in the direction of the is provided, the contact pin its
With the tip facing outward, this tip
An IC socket connected to the connection terminal via a spring action portion and a contact portion with the lead . 2. The IC socket according to claim 1, wherein a tip portion of said contact pin is erected on said main body. 3. The IC socket according to claim 1, wherein said contact pin has a bent end portion to clamp said cam. 4. The cam according to claim 1, wherein the cam is formed so as not to be located at a portion of the contact pin facing a contact surface of the lead.
The described IC socket.