JP2806877B2 - Socket for IC measurement - Google Patents
Socket for IC measurementInfo
- Publication number
- JP2806877B2 JP2806877B2 JP8136686A JP13668696A JP2806877B2 JP 2806877 B2 JP2806877 B2 JP 2806877B2 JP 8136686 A JP8136686 A JP 8136686A JP 13668696 A JP13668696 A JP 13668696A JP 2806877 B2 JP2806877 B2 JP 2806877B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- socket
- lead
- package body
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、パッケージ体の両
側面から並んで導出され下方に折り曲げられ更に上方に
折り曲げ返されて先端部に水平な平坦面が形成される複
数のリードを有するデュアルインライン型のICの電気
特性の測定に使用するIC測定用ソケットに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dual in-line having a plurality of leads which are led out side by side from both sides of a package body, bent downward, and further bent upward to form a horizontal flat surface at a tip end. The present invention relates to an IC measurement socket used for measuring the electrical characteristics of a mold IC.
【0002】[0002]
【従来の技術】図3は従来の一例を示すIC測定用ソケ
ットの斜視図である。この種のデュアルインライン型の
ICの電気特性の測定に使用するIC測定用ソケット
は、図3に示すように、ICのパッケージ体8を真空吸
着し保持する保持具5と、この保持具5を矢印の方向に
押し付けパッケージ体8を固定するソケット本体4と、
ソケット本体4と保持具5とで挟み固定されたICのリ
ード9に対応し接触する位置にコンタクト部7を配置し
先端をソケット本体4に貫通させるコンタクトピン6と
を備えていた。2. Description of the Related Art FIG. 3 is a perspective view showing an example of a conventional IC measuring socket. As shown in FIG. 3, an IC measurement socket used for measuring the electrical characteristics of this type of dual in-line type IC includes a holder 5 for vacuum-sucking and holding an IC package 8 and a holder 5 for holding the IC package 8. A socket body 4 for fixing the package body 8 by pressing in the direction of the arrow;
A contact portion 7 was provided at a position corresponding to the lead 9 of the IC sandwiched and fixed between the socket body 4 and the holder 5, and provided with a contact pin 6 for penetrating the tip through the socket body 4.
【0003】そして、デュアルインライン型ICにおけ
る電気特性試験では、一台のテスターに対しそれぞれの
ICの大きさによる対向するリード9の間隔Wに適合し
たコンタクト部7の間隔をもつ種々のIC測定用ソケッ
トをそれぞれ準備し、サイズの異なるICの電気特性試
験に対応していた。しかしながら、数多くの種類のIC
測定用ソケットを揃えることは、運用コストの増大を招
くばかりではなく、IC測定用ソケットの交換や管理す
るコストも増大することになる。このような状況のもと
に、IC測定用ソケットの数を減らすために汎用性のあ
るIC測定用ソケットの改善が求められていた。[0003] In an electrical characteristic test of a dual in-line type IC, various IC measurement for each tester having an interval of a contact portion 7 corresponding to an interval W of an opposing lead 9 depending on the size of each IC. The sockets were prepared respectively, and corresponded to the electrical characteristic tests of ICs having different sizes. However, many types of IC
Aligning the measurement sockets not only increases operating costs, but also increases the cost of replacing and managing IC measurement sockets. Under such circumstances, there has been a demand for an improved versatile IC measurement socket in order to reduce the number of IC measurement sockets.
【0004】この改善されたIC測定用ソケットの一例
として特開平3一267772号公報に開示されてい
る。このIC測定用ソケットは、先端がソケット本体を
貫通しばね性をもたせるように湾曲させ他端に一方向に
長い平坦部をもつ固定接触子と、この固定接触子の平坦
部と接触しながら一方向に移動できるとともに先端にリ
ードと接触する平坦な面の接点部とをもつ可動接触子と
を備えている。An example of the improved IC measuring socket is disclosed in Japanese Patent Application Laid-Open No. Hei 3-267772. This IC measurement socket has a fixed contact having a flat portion which is bent at one end so as to have a spring property and penetrates the socket body at the other end, and has a long flat portion at one end in one direction. And a movable contact having a flat surface contact portion at the front end which can move in the direction.
【0005】そして、このIC測定用ソケットでは、I
Cのパッケージ体の両側から導出され対向するリードの
間隔に応じて可動接触子を固定接触子の平坦部を摺動さ
せリードの平坦面が接点部と合うように調節し、パッケ
ージ体のサイズの異なる種々のICに適用できるように
なされたものである。In this IC measuring socket, I
The movable contact is slid on the flat part of the fixed contact according to the distance between the leads which are led out from both sides of the package body of C, and the flat surface of the lead is adjusted so as to match the contact part. It is designed to be applicable to various different ICs.
【0006】[0006]
【発明が解決しようとする課題】上述した汎用性をもた
せたIC測定用ソケットでは、リードと接触する接点部
以外に可動接触子と固定接触子とが接触する部分があ
る。このため接触不良を起さないまでも接触抵抗が増大
する欠点がある。特に、近年、ICの低電圧化の傾向と
なり、接触抵抗による電圧降下は測定の不確実にする問
題になる。また、露呈している可動接触子の摺動面に埃
や異物が付き測定の不確実性を引き起す懸念がある。さ
らに、サイズの異なるIC毎に可動接触氏を異動させ調
節することは非常に煩わしい作業となる欠点がある。In the above-described versatile IC measuring socket, there is a portion where the movable contact and the fixed contact come into contact with each other in addition to the contact portion which comes into contact with the lead. For this reason, there is a disadvantage that the contact resistance increases even if a contact failure does not occur. In particular, in recent years, there has been a tendency to lower the voltage of ICs, and a voltage drop due to contact resistance becomes a problem that makes measurement uncertain. Further, there is a concern that dust or foreign matter may be attached to the exposed sliding surface of the movable contact, causing uncertainty of measurement. Further, there is a disadvantage that moving and adjusting the movable contact for each IC having different sizes is a very troublesome operation.
【0007】従って、本発明の目的は、パッケージ体の
両側面から導出される対向するリードの間隔が変っても
ソケット本体の交換や位置合せの調整をすることなくI
Cの電気特性の測定を確実にできるIC測定用ソケット
を提供することである。Accordingly, an object of the present invention is to provide a semiconductor device which does not require replacement of the socket body or adjustment of the alignment without changing the distance between the opposing leads extending from both side surfaces of the package body.
An object of the present invention is to provide an IC measurement socket capable of reliably measuring the electrical characteristics of C.
【0008】[0008]
【課題を解決するための手段】本発明の特徴は、パッケ
ージ体の両側面から並んで導出され下方に折り曲げられ
更に上方に折り曲げ返されて先端部に水平な平坦面が形
成される複数のリードを有するICの前記パッケージ体
を載置し前記リードの該平坦面にコンタクトピンを接触
させ電気特性を測定するICソケットにおいて、大きさ
の異なる複数の前記パッケージ体のICのそれぞれの該
パッケージ体の大きさに応じて該パッケージ体が挿入さ
れ吸着保持されるそれぞれの窪みと該窪みの両側に配置
され前記リードの該平坦面の背面に当接する突起部とこ
の突起部の外側に平坦な当接面とを具備する複数の保持
具と、前記ICのそれぞれの該パッケージ体を保持する
それぞれの前記保持具の該当接面と対応する段差面を有
するとともに前記当接面と前記段差面と当接させ前記保
持具とで協働し前記パッケージ体を挟み付けるソケット
本体と、このソケット本体と前記保持具とで挟み込まれ
るそれぞれの前記ICの対向する間隔の異なる前記リー
ドの該平坦面と接触し得る長さをもつコンタクト部を一
端にもつとともに前記ソケット本体から他端が導出され
るコンタクトピンとを備えるIC測定用ソケットであ
る。SUMMARY OF THE INVENTION A feature of the present invention is that a plurality of leads are led out side by side from both sides of a package body, bent downward and bent upward to form a horizontal flat surface at the tip end. In an IC socket for mounting the package body of an IC having the same and contacting a contact pin with the flat surface of the lead to measure electrical characteristics, the IC socket of each of the plurality of ICs of the package bodies having different sizes is provided. Recesses into which the package body is inserted and sucked and held in accordance with the size, projections arranged on both sides of the recesses and in contact with the rear surface of the flat surface of the lead, and flat abutments on the outside of the projections A plurality of holders each having a surface, and a step surface corresponding to a corresponding contact surface of each of the holders holding the respective package bodies of the IC, and A socket body that abuts the contact surface and the step surface and cooperates with the holding tool to sandwich the package body; and wherein the ICs sandwiched between the socket body and the holding tool have different opposing intervals. An IC measurement socket having a contact portion having a length capable of contacting the flat surface of the lead at one end and a contact pin having the other end led out from the socket body.
【0009】また、前記突起部と前記当接部の段差を変
える高さ調節部材を備えることが望ましい。さらに、前
記コンタクトピンの該コンタクト部の前記リードと接触
しない部分が凹んでいることが望ましい。It is preferable that a height adjusting member for changing a step between the projection and the contact portion be provided. Further, it is desirable that a portion of the contact portion of the contact pin which does not contact the lead is concave.
【0010】[0010]
【発明の実施の形態】次に、本発明について図面を参照
して説明する。Next, the present invention will be described with reference to the drawings.
【0011】図1は本発明の一実施の形態におけるIC
測定用ソケットを示す図である。このIC測定用ソケッ
トは、図1に示すように、大きさの異なる複数のパッケ
ージ体のIC10a,10b,10cのそれぞれのパッ
ケージ体8a,8b,8cの大きさに応じてパッケージ
体8a,8b,8cが挿入され吸着保持されるそれぞれ
の窪みと窪みの両側に配置されリード9a,9b,9c
の平坦面の背面に当接する突起部12a,12b,12
cとこの突起部12a,12b,12cの外側に平坦な
当接面11a,11b,11cとを有する複数の保持具
5a,5b,5cと、IC10a,10b,10cのそ
れぞれのパッケージ体8a,8b,8cを保持するそれ
ぞれの保持具5a,5b,5cの当接面11a,11
b,11cと対応する段差面3を有するとともに当接面
11a,11b,11cと段差面3と当接させ保持具5
a,5b,5cとで協働しパッケージ体8a,8b,8
cを挟み付けるソケット本体1と、このソケット本体1
と保持具5a,5b,5cとで挟み込まれるそれぞれの
IC10a,10b,10cの対向する間隔の異なるリ
ード9a,9b,9cの平坦面と接触し得る長さをもつ
コンタクト部2bを一端にもつとともにソケット本体1
から端子2aが導出されるコンタクトピン2とを備えて
いる。FIG. 1 shows an IC according to an embodiment of the present invention.
It is a figure which shows the socket for a measurement. As shown in FIG. 1, this IC measuring socket has a plurality of package bodies 8a, 8b, 8c of a plurality of package bodies 10a, 10b, 10c having different sizes according to the sizes of the package bodies 8a, 8b, 8c. The recesses 8c are inserted and held by suction, and the leads 9a, 9b, 9c are arranged on both sides of the recesses.
Protruding portions 12a, 12b, 12 abutting on the back surface of the flat surface of
c and a plurality of holders 5a, 5b, 5c having flat contact surfaces 11a, 11b, 11c outside the projections 12a, 12b, 12c, and respective packages 8a, 8b of ICs 10a, 10b, 10c. Abutment surfaces 11a, 11c of holders 5a, 5b, 5c for holding
b, 11c and the holding tool 5 which is brought into contact with the contact surfaces 11a, 11b, 11c and the step surface 3.
a, 5b, 5c in cooperation with package bodies 8a, 8b, 8
c and the socket body 1
A contact portion 2b having a length capable of contacting the flat surfaces of the leads 9a, 9b, 9c of the respective ICs 10a, 10b, 10c which are sandwiched between the holding members 5a, 5b, 5c and having different intervals is provided at one end. Socket body 1
And a contact pin 2 from which the terminal 2a is led out.
【0012】ここで、三つの大きさの異なるIC10
a,10b,10cに適用できるように、コンタクトピ
ン2はコンタクト部2bを長くし一体の良導電金属で製
作されているものの、いずれのIC10a,10b,1
0cのリード9a,9b,9cとコンタクト部2bとの
接触が常に良好に得らなければならない。そこで、本発
明では、コンタクトピン2のばね圧によるコンタクト部
2bとリード9a,9b,9cとの接触圧が一定になる
ように、コンタクトピン2のばね部の中心a点からリー
ド9a,9b,9cとコンタクト部2bの接触点までの
距離L1 ,L2 ,L3 に対して、リード9a,9b,9
cの平坦面の背面と当接する突起部12a,12b,1
2cと当接面11a,11b,11cとの段差H1 ,H
2 ,H3 を適宜設計した。すなわち、コンタクト部2b
の先端側に行く程、同じ接触圧を得るためにコンタクト
部2bの撓みを大きくしている。Here, three differently sized ICs 10
a, 10b, and 10c, the contact pin 2 has a longer contact portion 2b and is made of an integral good conductive metal.
The contact between the lead 9a, 9b, 9c and the contact portion 2b of the contact portion 2b must always be satisfactorily obtained. Thus, in the present invention, the leads 9a, 9b, 9b, 9b, 9c, 9d, 9c, 9d, 9c, 9d, 9c, 9c are moved from the center a of the spring portion of the contact pin 2 so that the contact pressure between the contact portion 2b and the leads 9a, 9b, 9c due to the spring pressure of the contact pin 2 becomes constant. For the distances L1, L2, L3 between the contact point 9c and the contact point of the contact portion 2b, the leads 9a, 9b, 9
projections 12a, 12b, 1 that abut against the back of the flat surface of c.
Steps H1, H between the contact surface 2c and the contact surfaces 11a, 11b, 11c.
2 and H3 were designed appropriately. That is, the contact portion 2b
, The bending of the contact portion 2b is increased in order to obtain the same contact pressure.
【0013】また、この実施の形態では、三種類のIC
に適用するように述べたが、四種類あるいは五種類でも
適用できる。なお、種類が増えそれに伴なって保持具の
数が増えコスト高の懸念があるが、保持具自体のコスト
はソケット本体のコストに比べ遥に安く、1/100程
度で済む。何となれば、保持具は切削加工で済むのに対
し、ソケット本体は精密なモールド成形で製作しなけれ
ばならず、しかも高価なモールド金型を必要とする。In this embodiment, three types of ICs are used.
However, four or five types can be applied. Although the number of types increases and the number of holders increases with the increase in cost, there is a concern that the cost is high. However, the cost of the holder itself is much lower than the cost of the socket body, and is only about 1/100. What is necessary is that the holder only needs to be cut, whereas the socket body must be manufactured by precise molding, and an expensive mold is required.
【0014】さらに、上述の接触圧調整に際して、微妙
な調整が必要な場合は、図1の当接面11cにねじ止め
されるシムAを設け、このシムAの厚さを種々準備し、
シムAを交換することで接触圧調整を行なえば、段差H
の調整による接触圧調整がより簡単に精密にできる。Further, when fine adjustment is required in the above contact pressure adjustment, a shim A screwed to the contact surface 11c of FIG. 1 is provided, and various thicknesses of the shim A are prepared.
If the contact pressure is adjusted by replacing the shim A, the step H
The contact pressure can be adjusted more easily and precisely by adjusting.
【0015】図2(a)および(b)は図1のIC測定
用ソケットの変形例を示すソケット本体の断面図および
コンタクトピンの側面図である。このIC測定用ソケッ
トは、図2に示すように、IC10a,10b,10c
のリード9a,9b,9cのコンタクト部2bへの接触
部以外に凹み13を設けたことである。それ以外は、前
述のIC測定用ソケットと同じである。FIGS. 2A and 2B are a sectional view of a socket main body and a side view of a contact pin showing a modification of the IC measuring socket of FIG. As shown in FIG. 2, the IC measuring socket includes ICs 10a, 10b, and 10c.
Of the leads 9a, 9b, 9c of the contact portion 2b. Other than that, it is the same as the above-described IC measurement socket.
【0016】通常、ICのリードは表面に半田メッキが
施されている。このため、リードがコンタクト部に接触
する毎に、リードの半田が剥離しコンタクト部に付着す
る。そして、コンタクト部に堆積してある程度の半田塊
14の大きさになるとICに再付着し隣接するリードの
間に挟まり実装時にトラブルを引き起すという問題があ
るし、コンタクト部に残ったままであると測定が不正確
となる。そこで、凹み13を設ければ、コンタクト部2
bのスプリングバックで半田塊14はこの凹み13に落
ち込み従来例のような接触不良がなくなる。Usually, the leads of the IC are plated with solder on the surface. Therefore, every time the lead comes into contact with the contact portion, the solder of the lead peels off and adheres to the contact portion. Then, if the solder lump 14 is deposited on the contact portion and reaches a certain size, the solder lump is reattached to the IC and is sandwiched between adjacent leads, causing a problem at the time of mounting, and there is a problem that the solder lump remains in the contact portion. Inaccurate measurements. Therefore, if the recess 13 is provided, the contact 2
By the springback b, the solder mass 14 falls into the recess 13 and the contact failure as in the conventional example is eliminated.
【0017】[0017]
【発明の効果】以上説明したように本発明は、大きさの
異なる複数のICのリードが接触し得るようにリードの
位置にまたがった長さのコンタクト部をもつコンタクト
ピンを一つのソケット本体に配置し、コンタクト部への
それぞれのリードの接触圧を一定に調節する手段とを設
けることによって、大きさの異なるICでも適用でき、
運用コストの低減や調整工数の低減が図れるとともに信
頼度の高い測定ができるという効果がある。As described above, according to the present invention, a contact pin having a contact portion having a length extending over a position of a lead is provided in one socket body so that leads of a plurality of ICs having different sizes can come into contact with each other. By arranging and providing a means for adjusting the contact pressure of each lead to the contact portion to a constant value, it is possible to apply even ICs having different sizes,
This has the effect of reducing operation costs and man-hours for adjustment, as well as enabling highly reliable measurement.
【図1】本発明の一実施の形態におけるIC測定用ソケ
ットを示す図である。FIG. 1 is a diagram showing an IC measurement socket according to an embodiment of the present invention.
【図2】図1のIC測定用ソケットの変形例を示すソケ
ット本体の断面図およびコンタクトピンの側面図であ
る。FIG. 2 is a cross-sectional view of a socket main body and a side view of a contact pin showing a modification of the IC measuring socket of FIG. 1;
【図3】従来の一例を示すIC測定用ソケットの斜視図
である。FIG. 3 is a perspective view of an IC measuring socket showing an example of the related art.
1,1a,4 ソケット本体 2,6 コンタクトピン 2a 端子 2b,7 コンタクト部 3 段差面 5,5a,5b,5c 保持具 8,8a,8b,8c パッケージ体 9,9a,9b,9c リード 10a,10b,10c IC 11a,11b,11c 当接面 12a,12b,12c 突起部 13 凹み 14 半田塊 1, 1a, 4 Socket body 2, 6 Contact pin 2a Terminal 2b, 7 Contact part 3 Stepped surface 5, 5a, 5b, 5c Holder 8, 8a, 8b, 8c Package body 9, 9a, 9b, 9c Lead 10a, 10b, 10c IC 11a, 11b, 11c Contact surface 12a, 12b, 12c Projection 13 Depression 14 Solder mass
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H01R 33/76 H01L 23/32──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int.Cl. 6 , DB name) H01R 33/76 H01L 23/32
Claims (3)
れ下方に折り曲げられ更に上方に折り曲げ返されて先端
部に水平な平坦面が形成される複数のリードを有するI
Cの前記パッケージ体を載置し前記リードの該平坦面に
コンタクトピンを接触させ電気特性を測定するICソケ
ットにおいて、大きさの異なる複数の前記パッケージ体
のICのそれぞれの該パッケージ体の大きさに応じて該
パッケージ体が挿入され吸着保持されるそれぞれの窪み
と該窪みの両側に配置され前記リードの該平坦面の背面
に当接する突起部とこの突起部の外側に平坦な当接面と
を具備する複数の保持具と、前記ICのそれぞれの該パ
ッケージ体を保持するそれぞれの前記保持具の該当接面
と対応する段差面を有するとともに前記当接面と前記段
差面と当接させ前記保持具とで協働し前記パッケージ体
を挟み付けるソケット本体と、このソケット本体と前記
保持具とで挟み込まれるそれぞれの前記ICの対向する
間隔の異なる前記リードの該平坦面と接触し得る長さを
もつコンタクト部を一端にもつとともに前記ソケット本
体から他端が導出されるコンタクトピンとを備えること
を特徴とするIC測定用ソケット。1. A lead having a plurality of leads which are led out side by side from both side surfaces of a package body, bent downward, and further bent upward to form a horizontal flat surface at a tip end.
C. An IC socket in which the package body is placed and a contact pin is brought into contact with the flat surface of the lead to measure electrical characteristics. In the IC socket, the size of each of the ICs of the plurality of package bodies having different sizes is measured. A concave portion into which the package body is inserted and sucked and held in accordance with the projection, a projection disposed on both sides of the depression and in contact with the rear surface of the flat surface of the lead, and a flat contact surface outside the projection. A plurality of holders having a step surface corresponding to a corresponding contact surface of each holder for holding the package body of the IC, and the contact surface and the step surface are brought into contact with each other. A socket body which cooperates with a holder to sandwich the package body, and wherein the ICs sandwiched between the socket body and the holder have different opposing intervals. IC measuring socket, characterized in that it comprises a contact pin and the other end is derived from the socket body with having a contact portion having a length that may be in contact with the flat surface of the over de one end.
高さ調節部材を備えることを特徴とする請求項1記載の
IC測定用ソケット。2. The IC measuring socket according to claim 1, further comprising a height adjusting member for changing a step between the protrusion and the contact portion.
前記リードと接触しない部分が凹んでいることを特徴と
する請求項1および2記載のIC測定用ソケット。3. The IC measuring socket according to claim 1, wherein a portion of the contact portion of the contact pin which is not in contact with the lead is recessed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8136686A JP2806877B2 (en) | 1996-05-30 | 1996-05-30 | Socket for IC measurement |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8136686A JP2806877B2 (en) | 1996-05-30 | 1996-05-30 | Socket for IC measurement |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09320716A JPH09320716A (en) | 1997-12-12 |
JP2806877B2 true JP2806877B2 (en) | 1998-09-30 |
Family
ID=15181109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8136686A Expired - Fee Related JP2806877B2 (en) | 1996-05-30 | 1996-05-30 | Socket for IC measurement |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2806877B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4505342B2 (en) * | 2005-02-04 | 2010-07-21 | 株式会社日本マイクロニクス | Electrical connection device |
-
1996
- 1996-05-30 JP JP8136686A patent/JP2806877B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH09320716A (en) | 1997-12-12 |
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