JP2806877B2 - Socket for IC measurement - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dual in-line having a plurality of leads which are led out side by side from both sides of a package body, bent downward, and further bent upward to form a horizontal flat surface at a tip end. The present invention relates to an IC measurement socket used for measuring the electrical characteristics of a mold IC.

[0002]

2. Description of the Related Art FIG. 3 is a perspective view showing an example of a conventional IC measuring socket. As shown in FIG. 3, an IC measurement socket used for measuring the electrical characteristics of this type of dual in-line type IC includes a holder 5 for vacuum-sucking and holding an IC package 8 and a holder 5 for holding the IC package 8. A socket body 4 for fixing the package body 8 by pressing in the direction of the arrow;
A contact portion 7 was provided at a position corresponding to the lead 9 of the IC sandwiched and fixed between the socket body 4 and the holder 5, and provided with a contact pin 6 for penetrating the tip through the socket body 4.

[0003] In an electrical characteristic test of a dual in-line type IC, various IC measurement for each tester having an interval of a contact portion 7 corresponding to an interval W of an opposing lead 9 depending on the size of each IC. The sockets were prepared respectively, and corresponded to the electrical characteristic tests of ICs having different sizes. However, many types of IC
Aligning the measurement sockets not only increases operating costs, but also increases the cost of replacing and managing IC measurement sockets. Under such circumstances, there has been a demand for an improved versatile IC measurement socket in order to reduce the number of IC measurement sockets.

An example of the improved IC measuring socket is disclosed in Japanese Patent Application Laid-Open No. Hei 3-267772. This IC measurement socket has a fixed contact having a flat portion which is bent at one end so as to have a spring property and penetrates the socket body at the other end, and has a long flat portion at one end in one direction. And a movable contact having a flat surface contact portion at the front end which can move in the direction.

In this IC measuring socket, I
The movable contact is slid on the flat part of the fixed contact according to the distance between the leads which are led out from both sides of the package body of C, and the flat surface of the lead is adjusted so as to match the contact part. It is designed to be applicable to various different ICs.

[0006]

In the above-described versatile IC measuring socket, there is a portion where the movable contact and the fixed contact come into contact with each other in addition to the contact portion which comes into contact with the lead. For this reason, there is a disadvantage that the contact resistance increases even if a contact failure does not occur. In particular, in recent years, there has been a tendency to lower the voltage of ICs, and a voltage drop due to contact resistance becomes a problem that makes measurement uncertain. Further, there is a concern that dust or foreign matter may be attached to the exposed sliding surface of the movable contact, causing uncertainty of measurement. Further, there is a disadvantage that moving and adjusting the movable contact for each IC having different sizes is a very troublesome operation.

Accordingly, an object of the present invention is to provide a semiconductor device which does not require replacement of the socket body or adjustment of the alignment without changing the distance between the opposing leads extending from both side surfaces of the package body.
An object of the present invention is to provide an IC measurement socket capable of reliably measuring the electrical characteristics of C.

[0008]

SUMMARY OF THE INVENTION A feature of the present invention is that a plurality of leads are led out side by side from both sides of a package body, bent downward and bent upward to form a horizontal flat surface at the tip end. In an IC socket for mounting the package body of an IC having the same and contacting a contact pin with the flat surface of the lead to measure electrical characteristics, the IC socket of each of the plurality of ICs of the package bodies having different sizes is provided. Recesses into which the package body is inserted and sucked and held in accordance with the size, projections arranged on both sides of the recesses and in contact with the rear surface of the flat surface of the lead, and flat abutments on the outside of the projections A plurality of holders each having a surface, and a step surface corresponding to a corresponding contact surface of each of the holders holding the respective package bodies of the IC, and A socket body that abuts the contact surface and the step surface and cooperates with the holding tool to sandwich the package body; and wherein the ICs sandwiched between the socket body and the holding tool have different opposing intervals. An IC measurement socket having a contact portion having a length capable of contacting the flat surface of the lead at one end and a contact pin having the other end led out from the socket body.

It is preferable that a height adjusting member for changing a step between the projection and the contact portion be provided. Further, it is desirable that a portion of the contact portion of the contact pin which does not contact the lead is concave.

[0010]

Next, the present invention will be described with reference to the drawings.

FIG. 1 shows an IC according to an embodiment of the present invention.
It is a figure which shows the socket for a measurement. As shown in FIG. 1, this IC measuring socket has a plurality of package bodies 8a, 8b, 8c of a plurality of package bodies 10a, 10b, 10c having different sizes according to the sizes of the package bodies 8a, 8b, 8c. The recesses 8c are inserted and held by suction, and the leads 9a, 9b, 9c are arranged on both sides of the recesses.
Protruding portions 12a, 12b, 12 abutting on the back surface of the flat surface of
c and a plurality of holders 5a, 5b, 5c having flat contact surfaces 11a, 11b, 11c outside the projections 12a, 12b, 12c, and respective packages 8a, 8b of ICs 10a, 10b, 10c. Abutment surfaces 11a, 11c of holders 5a, 5b, 5c for holding
b, 11c and the holding tool 5 which is brought into contact with the contact surfaces 11a, 11b, 11c and the step surface 3.
a, 5b, 5c in cooperation with package bodies 8a, 8b, 8
c and the socket body 1
A contact portion 2b having a length capable of contacting the flat surfaces of the leads 9a, 9b, 9c of the respective ICs 10a, 10b, 10c which are sandwiched between the holding members 5a, 5b, 5c and having different intervals is provided at one end. Socket body 1
And a contact pin 2 from which the terminal 2a is led out.

Here, three differently sized ICs 10
a, 10b, and 10c, the contact pin 2 has a longer contact portion 2b and is made of an integral good conductive metal.
The contact between the lead 9a, 9b, 9c and the contact portion 2b of the contact portion 2b must always be satisfactorily obtained. Thus, in the present invention, the leads 9a, 9b, 9b, 9b, 9c, 9d, 9c, 9d, 9c, 9d, 9c, 9c are moved from the center a of the spring portion of the contact pin 2 so that the contact pressure between the contact portion 2b and the leads 9a, 9b, 9c due to the spring pressure of the contact pin 2 becomes constant. For the distances L1, L2, L3 between the contact point 9c and the contact point of the contact portion 2b, the leads 9a, 9b, 9
projections 12a, 12b, 1 that abut against the back of the flat surface of c.
Steps H1, H between the contact surface 2c and the contact surfaces 11a, 11b, 11c.
2 and H3 were designed appropriately. That is, the contact portion 2b
, The bending of the contact portion 2b is increased in order to obtain the same contact pressure.

In this embodiment, three types of ICs are used.
However, four or five types can be applied. Although the number of types increases and the number of holders increases with the increase in cost, there is a concern that the cost is high. However, the cost of the holder itself is much lower than the cost of the socket body, and is only about 1/100. What is necessary is that the holder only needs to be cut, whereas the socket body must be manufactured by precise molding, and an expensive mold is required.

Further, when fine adjustment is required in the above contact pressure adjustment, a shim A screwed to the contact surface 11c of FIG. 1 is provided, and various thicknesses of the shim A are prepared.
If the contact pressure is adjusted by replacing the shim A, the step H
The contact pressure can be adjusted more easily and precisely by adjusting.

FIGS. 2A and 2B are a sectional view of a socket main body and a side view of a contact pin showing a modification of the IC measuring socket of FIG. As shown in FIG. 2, the IC measuring socket includes ICs 10a, 10b, and 10c.
Of the leads 9a, 9b, 9c of the contact portion 2b. Other than that, it is the same as the above-described IC measurement socket.

Usually, the leads of the IC are plated with solder on the surface. Therefore, every time the lead comes into contact with the contact portion, the solder of the lead peels off and adheres to the contact portion. Then, if the solder lump 14 is deposited on the contact portion and reaches a certain size, the solder lump is reattached to the IC and is sandwiched between adjacent leads, causing a problem at the time of mounting, and there is a problem that the solder lump remains in the contact portion. Inaccurate measurements. Therefore, if the recess 13 is provided, the contact 2
By the springback b, the solder mass 14 falls into the recess 13 and the contact failure as in the conventional example is eliminated.

[0017]

As described above, according to the present invention, a contact pin having a contact portion having a length extending over a position of a lead is provided in one socket body so that leads of a plurality of ICs having different sizes can come into contact with each other. By arranging and providing a means for adjusting the contact pressure of each lead to the contact portion to a constant value, it is possible to apply even ICs having different sizes,
This has the effect of reducing operation costs and man-hours for adjustment, as well as enabling highly reliable measurement.

[Brief description of the drawings]

FIG. 1 is a diagram showing an IC measurement socket according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a socket main body and a side view of a contact pin showing a modification of the IC measuring socket of FIG. 1;

FIG. 3 is a perspective view of an IC measuring socket showing an example of the related art.

[Explanation of symbols]

 1, 1a, 4 Socket body 2, 6 Contact pin 2a Terminal 2b, 7 Contact part 3 Stepped surface 5, 5a, 5b, 5c Holder 8, 8a, 8b, 8c Package body 9, 9a, 9b, 9c Lead 10a, 10b, 10c IC 11a, 11b, 11c Contact surface 12a, 12b, 12c Projection 13 Depression 14 Solder mass

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int.Cl. ⁶ , DB name) H01R 33/76 H01L 23/32

Claims (3)

(57) [Claims] 1. A lead having a plurality of leads which are led out side by side from both side surfaces of a package body, bent downward, and further bent upward to form a horizontal flat surface at a tip end.
C. An IC socket in which the package body is placed and a contact pin is brought into contact with the flat surface of the lead to measure electrical characteristics. In the IC socket, the size of each of the ICs of the plurality of package bodies having different sizes is measured. A concave portion into which the package body is inserted and sucked and held in accordance with the projection, a projection disposed on both sides of the depression and in contact with the rear surface of the flat surface of the lead, and a flat contact surface outside the projection. A plurality of holders having a step surface corresponding to a corresponding contact surface of each holder for holding the package body of the IC, and the contact surface and the step surface are brought into contact with each other. A socket body which cooperates with a holder to sandwich the package body, and wherein the ICs sandwiched between the socket body and the holder have different opposing intervals. IC measuring socket, characterized in that it comprises a contact pin and the other end is derived from the socket body with having a contact portion having a length that may be in contact with the flat surface of the over de one end. 2. The IC measuring socket according to claim 1, further comprising a height adjusting member for changing a step between the protrusion and the contact portion. 3. The IC measuring socket according to claim 1, wherein a portion of the contact portion of the contact pin which is not in contact with the lead is recessed.