JPH04265864A - Measuring terminal of chip type electronic part and manufacture thereof - Google Patents

Abstract

PURPOSE:To measure the electrical characteristics of a chip by bringing both electrodes of the chip into contact with the terminals of terminal pieces being the measuring terminals for inspecting a chip type electronic part and arranged in a dielectric in parallel in an erected state under pressure. CONSTITUTION:Terminal pieces 2a which are formed from narrow and long plate-shaped thin metal plates composed of phosphor bronze and constituted so that the upper end surfaces thereof are formed into the terminals 2 coming into contact with the electrode 1 of a chip (t) and the lower parts thereof are formed as leads 2b are provided and the terminals 2 of the terminal pieces 2a provided in an erected state are arranged in parallel at a set interval l1 or l2. The parallelly arranged ones are embedded in a core holder 5a composed of a dielectric such as plastic or silicon in a left and right symmetric state so as to provide a set interval l3 between the opposed terminals 2 to provide a unit measuring terminal A' and this terminal A' is fitted in the unit measuring terminal fitting hole 8 of a holder 5. Therefore, a small measuring terminal suitable for mass productivity and excellent in durability is extremely inexpensively obtained with high accuracy.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] The present invention relates to a measuring terminal for a chip-type electronic component (hereinafter referred to as a chip), for example, a terminal for measuring a resistance value used in a tester for a chip resistor. The present invention relates to a measurement terminal of a multi-chip type in which two or more single chips are combined (with a common ceramic substrate), and also relates to a method of manufacturing the measurement terminal.

0002

[Prior Art and Problems] In the manufacturing process, taping process, mounting process, etc. of a chip (e.g., chip resistor), there is a process to measure and inspect the electrical characteristics (e.g., resistance value) of the chip. The terminals are pressure-connected to the chip and electrical measurements are taken to determine whether the chip passes or fails.

In addition to the standard type single chip t as shown in FIG. 3, recently there has been a multi-chip type chip t' in which two or more single chips t are combined in parallel as shown in FIG.
(The figure shows a four-wire type), and a single chip t, for example a chip resistor t, has electrodes 1, 1 on both ends of a ceramic substrate 3,
These are connected by a resistor 4, and the quadruple chip (resistor) t in Figure 3 has four sets of electrodes 1, 1 arranged in parallel on both ends of a common ceramic substrate 3, The electrodes are connected by each resistor 4.

The conventional method for measuring chip resistors t is generally a two-terminal measurement method in which one terminal is connected to both electrodes of the chip, and the electrically measured values are used for inspection and selection. Recently, higher precision of chips is required, and therefore a highly accurate inspection and selection method is required.The four-terminal measurement method involves contacting two terminals each to both electrodes of the chip and obtaining an average measurement value. There is a growing demand for employment of

However, in recent years, the miniaturization of chips has progressed rapidly.
Ultra-small chips such as the 1608 type (1.6 mm in height x 0.8 mm in width) are becoming widely used. The width of the electrode 1 of the 1005 type chip is 0.3 mm, and the width of the electrode 1 of the 1608 type chip is 0.4 mm, and the width of the electrode 1 of the 1005 type chip is 0.4 mm.
If you want to accurately contact two terminals in the area, the gap between the two terminals (setting interval l1
) can only be about 0.1 mm, and the dimension between the parallel measurement terminals (set interval l) in the multi-chip t
2) is also only about 0.2 mm, so the measuring terminal of the above conventional configuration cannot handle it.

[0006] Conventionally, a linear measurement terminal a formed by bending a thin wire as shown in FIG. This device is not used to measure chips, but is used to measure chips t already mounted on the printed circuit board 16, and the device equipped with the wire terminals is moved onto the printed circuit board 16 and each terminal 2' After precisely adjusting the position of the tip and the electrode 1 of the tip t using a microscope, a terminal 2' shaped like a needle tip bent at a right angle is attached.
However, this method had the following drawbacks.

In order to cope with the miniaturization of chips, the diameter of the wire must be made smaller and smaller.As a result, it is difficult to set and maintain the correct gap between the terminal tips because it is easily deformed by external force. This adjustment work is done manually using a microscope, which is difficult and has low precision, as well as extremely low manufacturing efficiency, making it unsuitable for mass production.

[0008] Although the distance between the tips of the wire terminals is extremely small, the unended portion requires a wide distance because it is necessary to connect it to the outside wire.
The measurement terminal a as a whole is large.

[0009] Because the wire diameter is small, the pressure force against the electrode during measurement is small, resulting in poor contact, and alignment is extremely difficult because the wire must descend from above to contact the top surface of the electrode on the tip. , which requires peripheral precision equipment.

[0010] For the reasons mentioned above, it is extremely expensive.

[0011]

[Object of the present invention] The present invention solves the above-mentioned conventional problems by the following methods and means, and thereby achieves excellent performance, high product precision, easy manufacturing, suitable for mass production, and compared to conventional methods. However, it is an object of the present invention to provide an extremely inexpensive measurement terminal for measuring ultra-small chips.

0012

[Means for Solving the Problems] The present invention provides a terminal piece made of a thin conductive metal plate in the form of a narrow plate, whose upper end surface serves as a terminal that contacts the electrode of a chip-type electronic component, and whose lower part serves as a lead. The terminals of each terminal piece in preparation for the established state are set at intervals l1
Alternatively, they are arranged in parallel with a distance of l2, and the paralleled devices are buried in a holder made of a dielectric material such as plastic or silicon, with the parallel terminals placed symmetrically with a set interval of l3 between the opposing terminals. This problem was solved by using a measurement terminal for a chip-type electronic component.

Further, the present invention provides a terminal piece with a terminal on the upper end surface and a lead on the lower part, and a fitting hole for fitting each terminal piece in the dielectric material such as plastic, in the vertical direction and in each case. A holder is provided in which the fitting holes are passed through in parallel at a set interval l1 or l2, and the fitting holes are also passed through in parallel at symmetrical positions with a set interval l3, and a terminal piece is inserted into each fitting hole of the holder. This problem has been solved by a method of manufacturing a measurement terminal for a chip-type electronic component, which is characterized in that the top surface of the holder and each terminal are fitted flush with each other.

Furthermore, in the present invention, jigs having terminal piece insertion holes are attached to the upper and lower surfaces of the short cylindrical dielectric body, and after the terminal pieces are inserted and set into the respective terminal piece insertion holes of the upper and lower jigs. A dielectric material such as silicon is injected into the short cylindrical dielectric body, each terminal piece is buried in the dielectric material, and after the dielectric material has hardened, the upper and lower jigs are removed and the terminals protrude from the top surface. After cutting the piece, the dielectric material on the top surface and the terminal are polished flush, a unit measurement terminal is provided, and the unit measurement terminal is fitted into the unit measurement terminal fitting hole of the holder. This problem has been solved by a method for manufacturing measurement terminals for chip-type electronic components, which is characterized by:

0015
]

[Example] Terminal 2 whose upper end surface contacts electrode 1 of chip t
A terminal piece 2a made of a narrow plate-shaped conductive metal thin plate with a lead 2b at the lower part is provided, and the terminals 2 of each terminal piece 2a prepared for the established state are arranged in parallel at a set interval l1 or l2. , the parallel ones are arranged symmetrically with a set interval 13 between the opposing terminals 2, and are buried in a holder 5 made of a dielectric material such as plastic or silicon to obtain the measurement terminal A of the chip type electronic component. It is composed of

In the measurement terminal A, the parallel setting interval between the terminals of the single chip t is l1, and the parallel setting interval between adjacent single chips t in the multiple chip t is l2.
shall be.

Therefore, in the case of a single chip t, naturally 4
Two terminal pieces 2a are installed symmetrically in parallel on the left and right at a set interval l2 with a set interval l1 between the terminals 2 and 2, and depending on the increase or decrease in the number of chips,
The number of terminal pieces 2a will be increased or decreased by four pieces.

Note that the terminal piece 2a has a thickness of 0.1 mm, for example.
, provided with a phosphor bronze plate with a width of 0.2 to 0.3 mm. The set interval 11 between the parallel terminals 2, 2 is set at about 0.1 mm, and the set interval 12 between the terminals 2, 2 between the chips in the case of a quadruple chip t among the parallel terminals is set at about 0.2 mm. Also, the setting interval l3 between the opposing terminals 2 and 2 is 0.6 to 0.
．． Set it to about 8mm.

Further, if necessary, by making a notch in the lead 2b portion of the terminal piece 2a, an elastic portion 6 that resiliently responds to the vertical load on the terminal 2 (pressure contact of the measuring tip t) can be formed.
form. The elastic portion 6 is formed by, for example, chemical etching or wire-cut electrical discharge machining.

Reference numeral 15 indicates a mounting hole for the holder 5.

[0021]

[Example 1 of the manufacturing method] A terminal piece 2a is provided with a terminal 2 on the upper end surface and a lead 2b on the lower part,

The fitting holes 7 for fitting each terminal piece 2a into the cylindrical dielectric body are arranged in the vertical direction and each fitting hole 7 is set at a set interval l1 or l2.
Core holders 5a are provided by plastic molding process, and core holders 5a are inserted through the fitting holes 7 in parallel at symmetrical positions with a set interval l3.

A unit measurement terminal A' is provided by fitting the terminal piece 2a into each fitting hole 7 of the core holder 5a so that the upper surface of the core holder 5a and each terminal piece 2a are flush with each other,

0
[024] By bonding the leads 2b of each terminal piece 2a protruding from the bottom surface of the core holder 5a of the unit measurement terminal A' with adhesive 9, each terminal piece 2a is attached to the core holder 5a.
sticks to a,

The unit measuring terminal A' is fitted and fixed into the unit measuring terminal fitting hole 8 of the trapezoidal holder 5, which is also formed by molding plastic, to produce the measuring terminal A of the chip-type electronic component of the present invention. This is what I did.

[0026]

[Embodiment 2 of manufacturing method] Upper and lower jigs 12 and 13 each having a terminal piece insertion hole 11 are attached to the upper and lower surfaces of a short cylindrical dielectric body 10,

Each terminal piece insertion hole 1 of the upper and lower jigs 12 and 13
After inserting and setting the terminal piece 2a into 1,

A dielectric material 14 such as silicon is injected into the short cylindrical dielectric 10 so that each terminal piece 2a is buried in the dielectric material 14,

After curing the dielectric material 14, the upper and lower jigs 12, 1
Remove 3,

After cutting the terminal piece 2a protruding from the top surface, the dielectric material 14 on the top surface and the terminal 2 are polished to be flush with each other.
A unit measurement terminal A' is provided,

The unit measurement terminal A' was fitted and fixed into the unit measurement terminal fitting hole 8 of the holder 5, thereby manufacturing the measurement terminal A of the chip type electronic component of the present invention.

Furthermore, by making the set intervals l1, l2, and l3 of each terminal piece insertion hole 11 of the lower jig 13 larger than that of the upper jig 12, the mutual interval between the ends of the leads 2b is increased. This facilitates the connection of the external wire to the end of the lead 2b.

Furthermore, by using silicone or the like as the dielectric material 14, which remains flexible and elastic even after injection hardening, the vertical load on the terminal 2 can be applied to the terminal piece 2a embedded in the dielectric material 14. The terminal piece 2a is made to have spring elasticity so that it can be slightly bent and restored when the measuring chip is pressed into contact with the measuring chip.

[0034]

[Operation and Effect] Measurement terminal A is connected to electrode 1 of chip t.
When making a measurement by touching the terminal 2 of the chip t, there are three surfaces of the electrode of the chip t, that is, the top surface, the side surface, and the bottom surface, as shown in FIG. In many cases, the electrode 1 surface becomes narrow due to protrusion, and the resistor 4 is raised, so it collides with the resistor 4 and the terminal 2
is undesirable because it may become unreachable (the above

000
6] and the conventional example shown in FIG. 7, in order to accommodate this, the terminal 2 is bent at a right angle so that only the tip of the terminal, such as a needle tip, makes contact. )

[0035] Furthermore, the side surface is often used as the working surface of a jig for supporting the measurement chip in a fixed position.

003
6. Therefore, the electrode 1 is always exposed flat on the bottom surface, the area is large, and there is no obstacle such as the resistor 4, making it ideal for contacting the terminal 2.

The measurement terminal A of the present invention is used for measurement by contacting the electrode 1 of the chip t from the bottom side, and the chip t, which is being moved in the steps described at the beginning, is placed on each terminal 2 of the measurement terminal A. When the chip t is slightly pressed down from above, the terminal 2 on the upper end surface of the terminal piece 2a comes into pressure contact with the electrode 1, and the terminal piece 2a slightly bends or bends, but at the same time it is repelled by the elastic part etc. Therefore, contact can be maintained accurately and energization measurement can be performed in a stable state.

Furthermore, since the measurement terminal of the present invention has each terminal piece 2a formed of a metal thin plate such as phosphor bronze, it is suitable for mass production and also allows for the production of extremely narrow terminals of 0.1 mm or less. It can be easily done with great precision.

In order to embed each terminal piece 2a obtained as described above in the holder 5 or core holder 5a, since the above manufacturing method is used, it is extremely difficult to embed it by hand using a microscope as in the past. Terminal 2 without any work
, 2, and other gaps are set with high accuracy, it is possible to manufacture the measurement terminal A very easily.

That is, since the measurement terminal is constructed by embedding the terminal piece in the dielectric material in an established state, the gap between the parallel terminals can be set to an extremely small size due to the interposition of the dielectric material, and, It can be installed with extremely high precision without causing erroneous contact between terminals.

[0041] Therefore, it is possible to provide a measurement terminal that is compatible with ultra-small chips such as 1005 type and 1608 type chips and their multiple chips, which have been difficult to handle with conventional wire terminals. .

In the case of conventional measurement terminals, as the chips become smaller, their wire diameters, etc. are naturally restricted, and their dimensions have to become extremely small.As a result, the contact pressure of the chips during measurement also increases. This had serious drawbacks, such as poor contact because it had to be carried out within limits that would not cause deformation, and insufficient current capacity for measurement due to the small cross-sectional area of the terminal.

In this regard, in the present invention, since the terminal pieces are embedded in the dielectric material in an upright state, it is possible not only to minimize the gap between the terminals as described above, but also to avoid a large vertical load on the terminals, that is, pressure welding during chip measurement. Even if a load is applied, the elastic part of the terminal piece can respond accurately to the elastic part, ensuring a strong and reliable contact between the tip electrode and the terminal, and the cross-sectional area of the terminal is much larger than before. Since the current capacity is large, a large current capacity can be obtained.

Furthermore, according to the present invention, two or more measurement terminals can be arranged in parallel with a small interval between them without any problem, so that measurement terminals for two or more multi-chip types can be easily constructed.

Since the terminal pieces are arranged side by side in an erected state and their leads protrude from the bottom surface of the holder, the external wires can be easily connected by appropriately bending the leads. There has never been a problem with securing.

[0046] Conventional wire-shaped measuring terminals and the flat plate-like measuring terminals that the applicant previously applied for had the disadvantage of lacking durability due to frictional wear with the chip, but the present invention uses terminals that are embedded vertically in a holder. Since the top end surface of the piece is used as a terminal, when the terminal wears out, for example, the top surface of the unit measurement terminal can be re-polished, making it an excellent product that can be reused as many times as you like. There are some advantages.

From the above, the present invention has the excellent feature of providing a measurement terminal that is small, highly accurate, suitable for mass production, and has excellent durability at an extremely low cost.

[Brief explanation of the drawing]

FIG. 1 is a plan view and a cross-sectional view taken along the line B-B showing a schematic configuration of a measurement terminal (for four-chip type) according to an embodiment of the present invention.

FIG. 2 is a front view and a plan view of a terminal piece.

FIG. 3 is a front view, a top view, and a bottom view of a single chip.

FIG. 4 is a front view, a top view, and a bottom view of a quadruple chip.

FIG. 5 is an explanatory diagram of the manufacturing method of Example 1 of the present invention.

FIG. 6 is an explanatory diagram of the manufacturing method of Example 2 of the present invention.

FIG. 7 is a plan view and a cross-sectional view of a conventional linear measurement terminal for a four-chip type.

[Explanation of symbols]

A Measurement terminal of the present invention A' Unit measurement terminal a Conventional measurement terminal l1, l2, l3 Set dimension t between terminals
Chip-type electronic components (single chip, multiple chip) 1
Electrode 2 Terminal 2' Conventional wire terminal 2a Terminal piece 2b Lead 3 Ceramic substrate 4 Resistor 5 Holder 5a Core holder 6 Elastic part 7 Fitting hole 8 Unit measurement terminal fitting hole 9 Adhesive 10 Short cylindrical dielectric 11 Terminal insertion hole 12 Upper jig 13 Lower jig 14 Dielectric material 15 Mounting hole 16 Printed circuit board

Claims (10)

[Claims] Claim 1: Each terminal piece is provided with a terminal piece made of a narrow plate-shaped conductive metal thin plate, the upper end surface of which is a terminal that contacts the electrode of a chip-type electronic component, and the lower part of which is a lead, and each terminal piece is prepared in an established state. A holder made of a dielectric material such as plastic or silicon is used to hold the terminals arranged in parallel with a set interval l1 or l2, and the paralleled terminals are arranged symmetrically with a set interval l3 between each opposing terminal. A measurement terminal for a chip-type electronic component configured by being embedded in the . 2. The parallel setting interval between the measurement terminals of the single chip electronic component is l1, and the parallel setting interval between adjacent single chip electronic components at the measurement terminal of the multiple chip electronic component is l2. A measurement terminal for a chip-type electronic component according to claim 1. 3. The measurement terminal for a chip-type electronic component according to claim 1, wherein an elastic portion is formed by making a notch in the lead portion of the terminal piece so as to be resilient to a vertical load on the terminal. 4. A terminal piece is provided with the upper end surface as a terminal and the lower part as a lead, and fitting holes for fitting each terminal piece in a dielectric material such as plastic are provided in the vertical direction, and each fitting hole is In parallel installation with a set interval l1 or l2,
A holder is provided with fitting holes extending in parallel at symmetrical positions with a set interval l3, and a terminal piece is fitted into each fitting hole of the holder so that the top surface of the holder and each terminal are flush with each other. A method for manufacturing a measurement terminal for a chip-type electronic component, characterized by comprising: 5. The method for manufacturing a measurement terminal for a chip-type electronic component according to claim 4, wherein each terminal piece is fixed to the holder by bonding the lead of each terminal piece protruding from the lower surface of the holder with an adhesive. . 6. The method for manufacturing a measurement terminal for a chip-type electronic component according to claim 4, wherein the holder with the fitting hole is provided by molding plastic. 7. A core holder is provided by penetrating a cylindrical dielectric body with a fitting hole for each terminal piece, and a unit measurement terminal is provided by fitting the terminal piece into the fitting hole of the core holder. 5. The method of manufacturing a measurement terminal for a chip-type electronic component according to claim 4, wherein the unit measurement terminal is fitted into a unit measurement terminal fitting hole of the holder. 8. The method for manufacturing a measurement terminal for a chip-type electronic component according to claim 4, wherein the holder and the core holder are provided by molding plastic. 9. Attach a jig with a terminal piece insertion hole to the upper and lower surfaces of the short cylindrical dielectric, and insert and set the terminal piece into each terminal piece insertion hole of the upper and lower jigs. A dielectric material such as silicon was injected into the dielectric material, and each terminal piece was buried in the dielectric material. After the dielectric material had hardened, the upper and lower jigs were removed and the terminal pieces protruding from the top were cut. Afterwards, the dielectric material and the terminal on the upper surface are polished flush, a unit measurement terminal is provided, and the unit measurement terminal is fitted into the unit measurement terminal fitting hole of the holder. A method for manufacturing measurement terminals for chip-type electronic components. Claim 10: Setting interval l1 of each terminal piece insertion hole of the lower jig.
, l2, and l3 are made larger than those of the upper jig, thereby increasing the distance between the lead ends and providing unit measurement terminals that allow easy connection of external wires to the lead ends. A method for manufacturing measurement terminals for chip-type electronic components.