JP2003035745A - Inspection tool of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection tool for electronic components that further miniaturizes a probe that is elastically brought into contact with an electronic component 12 to be inspected and is improved to have smaller inductance component. SOLUTION: The electronic component 12 to be inspected where a solder ball 14 is arranged on an opposite face is brought closer or separated relatively to or from an inspection tool member 16, one end section side of a conductive leaf spring 10 is bent in a Y shape for forming an elastic contact section 10a, the other end section side and middle section of the conductive leaf spring 10 are arranged at a position where the solder ball 14 of the inspection tool member 16 faces so that the length direction is nearly an approach/separation direction, a substrate 20 having a terminal where the other terminal of the conductive leaf spring 10 is brought into contact with the surface at the opposite side of the electronic component 12 to be inspected in the inspection tool member 16 is provided, and an Y-shaped inclination surface of the elastic contact section 10a of the conductive leaf spring 10 is elastically brought into contact with the side surface excluding the top of the solder ball 14 due to relative approach.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for inspecting electronic parts, in which a probe elastically contacted with an electronic part to be inspected is made smaller and improved so as to have a smaller inductance component.

[0002]

2. Description of the Related Art Various conventional jigs for inspecting electronic parts have been proposed in which a plunger of a spring connector is elastically contacted with a solder ball provided in an electronic part to be inspected. In such a conventional technique, when the plunger is elastically contacted with the top of the solder ball, the top of the solder ball may be damaged. Therefore, a technique has been proposed in which the tip of the plunger is devised in various ways to prevent the top from being damaged.

[0003]

In any of the above-mentioned conventional techniques, the use of the spring connector limits the miniaturization of the jig for inspecting electronic parts. Further, the spring connector has a complicated structure and has a large inductance component, and the inductance component of the spring connector cannot be ignored in the inspection of electronic parts handling high frequency signals.

The present invention has been made in view of the above circumstances of the prior art, and it is an object of the present invention to provide a jig for inspecting an electronic component which has a probe with a small inductance component and which can be easily miniaturized. To do.

[0005]

In order to achieve such an object, the inspection jig for electronic parts according to the present invention has an inspection jig member in which solder balls are disposed on the surface facing the inspection jig member. The electronic parts are arranged so as to be relatively close to each other, and one end of the conductive leaf spring is bent in an oblique direction to form an elastic contact portion, and the conductive member is placed at a position facing the solder ball of the inspection jig member. The other end side and the intermediate part of the flexible leaf spring are arranged such that the length direction thereof is substantially the approaching and separating direction, and the conductive material is provided on the surface of the inspection jig member opposite to the electronic component to be inspected. Arrange a substrate provided with a terminal that the other end of the leaf spring abuts,
Due to the relative approach, the inclined surface of the elastic contact portion of the conductive leaf spring is elastically contacted with the side surface of the solder ball except the top.

Further, the electronic parts to be inspected having the solder balls arranged on the surfaces opposed to the inspection jig member are arranged to be relatively close to and separated from each other, and one end of the conductive leaf spring is Y-shaped. To form an elastic contact portion, and at the position of the inspection jig member facing the solder ball, the other end side and the intermediate portion of the conductive leaf spring are arranged so that the length direction thereof is substantially the approach separation direction. And a board provided with a terminal to which the other end of the conductive leaf spring abuts on the surface of the inspection jig member opposite to the electronic component to be inspected. Due to
The Y-shaped inclined surface of the elastic contact portion of the conductive leaf spring may be elastically contacted with the side surface of the solder ball except the top.

The inspected electronic component having terminals arranged on the surface facing the inspecting jig member is arranged to be relatively close to and separated from each other, and one end of the conductive leaf spring is Y-shaped. A conductive pin having a hemispherical end that abuts the Y-shaped elastic contact portion and the conductive leaf spring are bent to form an elastic contact portion, and the conductive plate spring is substantially in the approaching and separating direction to the inspection jig member. And the other end of the conductive leaf spring is projected from the inspection jig member to the electronic component to be inspected side, and the opposite side of the electronic component to be inspected of the inspection jig member. A board having a terminal with which the other end of the conductive pin abuts is disposed on the surface of the board, and the other end of the conductive leaf spring is elastically contacted with the terminal of the electronic component to be inspected by the relative approach. It can also be configured to.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will now be described with reference to FIG.
It will be described with reference to FIGS. FIG. 1 is a structural view of a first practical example of an electronic component inspection jig of the present invention, (a)
Shows a state where the solder ball is in contact with the elastic contact portion of the conductive leaf spring, and FIG. 9B shows a state in which the electronic parts to be inspected are closer to each other and the side surface of the solder ball elastically contacts the elastic contact portion. 2A and 2B are views showing a conductive leaf spring, FIG. 2A is a front view before double folding, and FIG. 2B is a side view of FIG.
(C) is a perspective view completed by double folding. FIG. 3 is an exploded perspective view showing a structure in which the conductive leaf spring is arranged on the inspection jig member. FIG. 4 is a plan view in which the conductive leaf spring is arranged on the inspection jig member. FIG. 5 is a table in which the inductance component for each frequency of the conductive leaf spring as the probe in the present invention and the conventional spring connector is measured. FIG. 6 is a plan view showing an example in which conductive leaf springs are arranged with respect to the pitch of the solder balls.

First, the conductive leaf spring 10 acting as a probe is formed by pressing a plate material such as adjacent bronze or beryllium copper having excellent conductivity and elasticity as shown in FIGS. 2 (a) and 2 (b). Further, this is mountain-folded along the broken line in FIG. 2 (a) and double-folded to obtain a shape as shown in FIG. 2 (c). That is, a Y-shaped elastic contact portion 10a is formed on one end side of the conductive leaf spring 10 by bending it in an oblique direction so that the tips thereof are separated from each other. The opening dimension W of this Y-shaped tip
1 is a solder ball 14 provided on the electronic component 12 to be inspected.
Is set to accept. In addition, a wide portion 10b is formed near the other end of the conductive leaf spring 10 or in the middle. The width W2 of the wide portion 10b is equal to the Y-shaped elastic contact portion 1
It is sufficient if it is larger than the width W3 of 0a. In addition, as an example, the conductive leaf spring is formed of a sheet metal having a plate thickness t of 0.05 to 0.1 mm and a length dimension H of 1.5 to 2.0 mm. The opening dimension W1 of the Y-shaped elastic contact portion 10a is 0.5 m.
m, the wide portion W2 is 0.5 mm, and the width W3 of the elastic contact portion 10a is 0.3 mm, which can be formed in an extremely small size.

As shown in FIG. 3, the inspection jig member 16 is made of an insulating resin and is made of an upper jig plate 16a and a lower jig plate 1.
It is divided into two layers 6b. Moreover, the upper jig plate 16a is provided with the first rectangular hole 18a having a long shape in the direction in which the Y-shape of the elastic contact portion 10a can be further expanded. This first square hole 18
The width of a is W3 or more, but narrower than the width W2 of the wide portion 10b. In addition, the lower jig plate 16b is provided with a second square hole 18b into which the wide portion 10b can be inserted. The second rectangular hole 18b is displaced from the first rectangular hole 18a by 90 degrees in the direction of its long shape, as shown in FIG. Therefore, the conductive leaf spring 10 is provided in the second square hole 18b of the lower jig plate 16b.
The upper jig plate 16a is laminated on the lower jig plate 16b in a state where the wide portion 10b is inserted. First of the upper jig plate 16a
It goes without saying that the elastic contact portion 10a of the conductive leaf spring 10 is inserted into the square hole 18a. Further, a substrate 20 provided with terminals (not shown) with which the other end of the conductive leaf spring 10 can abut is provided on the lower surface of the lower jig plate 16b. Inspection and measurement device (tester) whose terminals are not shown by this substrate 20
Is electrically connected appropriately. It should be noted that the inspected electronic component 12
The inspection jig member 1 facing the solder balls 14 provided on the
Needless to say, the conductive leaf spring 10 is provided at 6.

In such a structure, the conductive leaf spring 10
Means that the wide portion 10b is the first square hole 18a of the upper jig plate 16a.
The inspection jig member 16 does not come out of the inspection jig member 16. Here, the dimensions of each part of the conductive leaf spring 10 are set with respect to the inspection jig member 16 so that they can be displaced to some extent in the approaching and separating direction of the electronic component 12 to be inspected. And
When the electronic parts 12 to be inspected are brought relatively close to each other, first, as shown in FIG.
As shown in (a), the solder ball 14 is inserted between the Y-shaped portions of the elastic contact portion 10 a of the conductive leaf spring 10,
The side surface of the abuts against the conductive leaf spring 10. Further, when the electronic component 12 to be inspected is relatively approached, as shown in FIG. 1B, the solder ball 14 elastically deforms the Y-shape of the elastic contact portion 10a by the wedge effect and pushes it wide to insert it deeper. As a result, the dimensional variation in the approaching direction is absorbed. In such a state,
Due to the elastic force of the elastic contact portion 10a, the conductive leaf spring 10 and the solder ball 14 come into contact with each other to ensure electrical conduction. Further, due to the further relative approach of the electronic component 12 to be inspected, a force pressing the other end of the conductive leaf spring 10 against the substrate 20 acts, and the other end of the conductive leaf spring 10 is surely electrically connected to the terminal of the substrate 20. Be connected. Therefore, the solder balls 14 of the electronic component 12 to be inspected are reliably electrically connected to the terminals of the substrate 20 via the conductive leaf springs 10. In addition, since the solder ball 14 elastically abuts and spreads the Y-shape of the elastic contact portion 10a and relatively moves in the approaching direction, the solder ball 14 and the elastic contact portion 10a at which the solder ball 14 elastically contacts have a self-cleaning action, and are reliably It enables excellent electrical continuity. Also,
As shown in the table of FIG. 5, in the range of 100 to 1000 MHz, the conductive plate bar 10 as the probe of the present invention has 650.
~ 690 PH, whereas the shortest size (3.2 mm) sprung connector currently achievable is 870-9
It is 90 PH, and the inductance component is reduced.

Therefore, the conductive leaf spring 10 used as the probe in the present invention has a simple structure as compared with the conventional spring connector, so that it is easier to miniaturize and the inductance component is reduced. It Therefore, it is possible to manufacture an inspection jig member in which probes are arranged more densely than in the past, and it is possible to use an inspection jig for an electronic component that can inspect even a high-frequency signal.

Here, as a structure in which the conductive leaf springs 10 used as probes are more densely arranged on the inspection jig member 16, as shown in FIG. 6, the solder balls 14, 14 ... Are arranged vertically and horizontally. The elastic contact part 10 with respect to the P direction
The Y-shaped opening direction of a may be arranged so as to be shifted by about 45 degrees.

In the first embodiment, the conductive leaf spring 10 is overlapped by bending the portion corresponding to the wide portion 10b. However, the present invention is not limited to this, and the other end of the conductive leaf spring 10 is That is, the portions of the board 20 that come into contact with the terminals may be bent and overlapped.

Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 7 is a structural view of the second embodiment of the jig for inspecting electronic parts of the present invention. FIG. 7A shows a state where the solder ball is in contact with the elastic contact portion of the conductive leaf spring,
(B) shows a state in which the electronic component to be inspected is brought closer and the side surface of the solder ball makes elastic contact with the elastic contact portion. FIG. 8 is an exploded perspective view showing a structure in which the conductive leaf spring is arranged on the inspection jig member. FIG. 9 is a plan view in which the conductive leaf spring is arranged on the inspection jig member. 7 to 9, members that are the same as or equivalent to those in FIGS. 1 to 4 are given the same reference numerals and redundant description will be omitted.

The conductive leaf spring 30 of the second embodiment is made of a single plate material, and one end side thereof is bent obliquely to form an elastic contact portion 30a. Further, a wide portion 30b is formed on the other end side of the conductive leaf spring 30. Then, similarly to the first embodiment, the upper jig plate 16a is laminated with the wide portion 30b inserted in the second square hole 18b of the lower jig plate 16b, and the conductive leaf spring 30 does not come out. Structured.

In the conductive leaf spring 30 of the second embodiment, it is elastically contacted with one side surface of the solder ball 14. Therefore, a lateral force acts on the solder ball 14. In order to cancel each other so that the inspected electronic components 12 are not displaced by the action of these lateral forces, as shown in FIG. 7, the conductive leaf springs 30, 3 elastically contacting the solder balls 14, 14 ...
It is only necessary to make the diagonal bending direction of the elastic contact portion 30a the same side in approximately half of 0 ... and the diagonal bending direction of the elastic contact portion 30a in the other half.

The conductive leaf spring 30 of the second embodiment is
The shape is one side of the conductive leaf spring 10 of the first embodiment, and the structure is simple and the size can be reduced accordingly, and it is possible to arrange the inspection jig members 16 more densely.

Further, a third embodiment of the present invention will be described with reference to FIGS. 10 and 11. FIG. 10 shows the structure of the third embodiment of the electronic component inspection jig of the present invention. Figure 11
FIG. 6 is an exploded perspective view showing a structure in which a conductive leaf spring and a conductive pin are arranged on an inspection jig member. 10 and 1
In FIG. 1, the same or equivalent members as those in FIGS. 1 to 4 are designated by the same reference numerals, and overlapping description will be omitted.

In the third embodiment, the conductive leaf spring 40 and the conductive pin 42 are arranged on the inspection jig member 16. In the conductive leaf spring 40, two elastically folded plate-like one end portions are bent in a Y shape to form an elastic contact portion 40a. The wide portion is not formed in the conductive leaf spring 40.
Then, in the elastic contact portion 40a bent in the Y shape,
The hemispherical contact portion 42a on one end side of the conductive pin 42 contacts. Then, the other end side and the intermediate portion of the conductive pin 42 are inserted into the second hole 46b formed in the one lower jig plate 44b into which the inspection jig member 44 is divided into two.
Is formed so that the other end thereof can protrude from the lower jig plate 44b. On the lower surface of the lower jig plate 44b, the substrate 20 provided with terminals (not shown) with which the other ends of the conductive pins 42 abut is provided. Further, the elastic contact portion 40a and the intermediate portion of the conductive leaf spring 40 are inserted into the first hole 46a formed in the upper jig plate 44a on the other side of the inspection jig member 44 which is divided into two parts. The other end of the leaf spring is formed so as to project from the upper jig plate 44a. The first hole 46a is formed in a narrow size in which the other end of the conductive leaf spring 40 can be inserted, but the middle portion and the elastic contact portion 40a cannot be inserted, and the conductive leaf spring 40 is moved upward. It is formed so as not to come out. Then, as shown in FIG. 10, the other end of the conductive leaf spring 40 protruding from the inspection jig member 44 contacts the terminal 50 of the electronic component 48 to be inspected.

In the third embodiment having such a structure, the conductive leaf spring 4 is moved by the relative approach of the electronic parts 48 to be inspected.
The Y-shape of the elastic contact portion 40a of 0 corresponds to the contact portion 42 of the conductive pin 42.
a spreads and elastically contacts to absorb the dimensional variation in the approaching direction, and the conductive leaf spring 40 and the conductive pin 42 are surely electrically connected. Moreover, the relative movement of the inspected electronic component 48 causes the other end of the conductive leaf spring 40 to elastically contact the terminal of the inspected electronic component 48 to ensure electrical conduction, and the conductive pin 42. The other end elastically contacts the terminal of the substrate 20 to ensure electrical continuity. Therefore, the conductive leaf spring 40
And the terminal 5 of the electronic component 48 to be inspected via the conductive pin 42.
0 and the terminal of the substrate 20 are electrically connected. The third embodiment is suitable as a probe that comes into contact with the planar terminal 50 and is electrically connected thereto.

The conductive leaf spring 1 of the first and third embodiments
It is explained that 0 and 40 are formed by appropriately folding one plate material, but the present invention is not limited to this, and two plate materials are integrally attached to each other by resistance welding or the like in close contact with each other without forming a Y shape. You may make it.

[0023]

Since the present invention is configured as described above, the following special effects are exhibited.

In the jig for inspecting electronic parts according to the first aspect of the invention, the shape of the conductive leaf spring which acts as a probe and elastically contacts the solder ball is extremely simple, so that it can be easily miniaturized and densely packed. It is possible to arrange. Moreover,
Since the structure is simple and the overall length can be made short, the inductance component is small accordingly, and it is suitable for the inspection of the electronic parts to be inspected using a high frequency signal.

In the electronic component inspection jig of the second aspect, since the solder ball elastically contacts the Y-shaped elastic contact portion of the conductive leaf spring so as to push and expand the Y-shaped solder, The forces that move the balls laterally are offset, and the solder balls do not come off from the electronic component under test. In addition, since the two side surfaces of the solder ball make elastic contact with the conductive leaf springs, electrical conduction is assured due to the large number of elastic contacts. Moreover, as in the first aspect, the structure is simple and the size can be easily reduced.
It has a small inductance component and is suitable for inspecting electronic parts to be inspected using high frequency signals.

According to a third aspect of the present invention, there is provided a jig for inspecting an electronic component, wherein one conductive leaf spring is folded and doubled to bend one end portion thereof at an angle, and a Y-shaped elastic contact portion is formed. Since it is formed, it can be manufactured by press working and is suitable for mass production.

According to the fourth aspect of the present invention, there is provided a jig for inspecting an electronic component, wherein the conductive leaf spring is pulled out of the jig member by the wide portion provided on the other end side or the middle portion of the conductive leaf spring. There is no such thing. The structure for disposing the conductive leaf spring on the inspection jig member is extremely simple, and the assembly is easy.

In the jig for inspecting electronic parts according to the present invention, the conductive leaf spring elastically contacts one side surface of the solder ball and a lateral force acts on the solder ball itself. Since approximately half of the flexible leaf springs have the same diagonal bending direction and the other half have the opposite diagonal bending directions, the lateral force of the inspected electronic component is offset and It is possible to prevent the electronic component to be inspected from being relatively displaced laterally with respect to the component member.

In the jig for inspecting electronic parts according to claim 6, in the pitch direction in which the solder balls are arranged,
Since the conductive leaf springs are arranged on the inspection jig member so that the Y-shaped bending direction of the elastic contact portion is approximately 45 degrees, even if the elastic contact portion has a large opening dimension, the pitch is smaller than this opening dimension. It is possible to arrange with.

According to a seventh aspect of the present invention, there is provided a jig for inspecting an electronic component, wherein a flat terminal of the electronic component to be inspected is a terminal of the substrate by a conductive leaf spring and a conductive pin elastically contacting the elastic contact portion thereof. It can be electrically connected. Further, the structure is simple and the size can be easily reduced.

[Brief description of drawings]

FIG. 1 is a structural diagram of a first practical example of an electronic component inspection jig of the present invention, in which (a) shows a state in which a solder ball is in contact with an elastic contact portion of a conductive leaf spring, and (b) ) Indicates a state in which the electronic component to be inspected is brought closer and the side surface of the solder ball makes elastic contact with the elastic contact portion.

2A and 2B are views showing a conductive leaf spring, FIG. 2A is a front view before double folding, FIG. 2B is a side view of FIG. 2A, and FIG. It is a perspective view completed by folding.

FIG. 3 is an exploded perspective view showing a structure in which a conductive leaf spring is arranged on an inspection jig member.

FIG. 4 is a plan view in which a conductive leaf spring is arranged on an inspection jig member.

FIG. 5 is a table in which an inductance component for each frequency of a conductive leaf spring as a probe in the present invention and a conventional spring connector is measured.

FIG. 6 is a plan view showing an example in which conductive leaf springs are arranged with respect to the pitch of solder balls.

FIG. 7 is a structural view of a second embodiment of an electronic component inspection jig of the present invention, in which (a) shows a state in which a solder ball is in contact with an elastic contact portion of a conductive leaf spring, ) Indicates a state in which the electronic component to be inspected is brought closer and the side surface of the solder ball makes elastic contact with the elastic contact portion.

FIG. 8 is an exploded perspective view showing a structure in which a conductive leaf spring is arranged on an inspection jig member.

FIG. 9 is a plan view in which a conductive leaf spring is arranged on an inspection jig member.

FIG. 10 is a structure of a third embodiment of an electronic component inspection jig of the present invention.

FIG. 11 is an exploded perspective view showing a structure in which a conductive leaf spring and a conductive pin are arranged on an inspection jig member.

[Explanation of symbols]

10,30,40 Conductive leaf spring 10a, 30a, 40a Elastic contact part 10b, 30b wide part 12,48 Inspected electronic parts 14 Solder balls 16,44 Inspection jig member 16a, 44a Upper jig plate 16b, 44b Lower jig plate 18a First square hole 18b Second square hole 20 substrates 42 Conductive pin 42a contact part 46a First hole 46b Second hole

Claims (7)

[Claims] 1. An electronic component to be inspected having a solder ball arranged on a surface opposed to the inspection jig member is relatively close to and separated from one another. And the elastic contact portion is formed by bending the same to the other end side and the intermediate portion of the conductive leaf spring at a position facing the solder ball of the inspection jig member, and the length direction thereof is substantially the approach separation direction. And a terminal provided with a terminal with which the other end of the conductive leaf spring abuts on the surface of the inspection jig member opposite to the electronic component to be inspected. A jig for inspecting an electronic component, characterized in that an inclined surface of the elastic contact portion of the conductive leaf spring is elastically contacted with a side surface of the solder ball except the top. 2. An electronic device to be inspected having solder balls arranged on the surface facing the inspection jig member is made to relatively approach and separate from each other, and one end side of the conductive leaf spring is Y-shaped. To form an elastic contact portion, and at the position of the inspection jig member facing the solder ball, the other end side and the intermediate portion of the conductive leaf spring are arranged so that the length direction thereof is substantially the approach separation direction. And a board provided with a terminal to which the other end of the conductive leaf spring abuts on the surface of the inspection jig member opposite to the electronic component to be inspected. Thus, the jig for inspecting an electronic component is configured such that the Y-shaped inclined surface of the elastic contact portion of the conductive leaf spring is elastically contacted with the side surfaces of the solder ball except the top. 3. The electronic component inspection jig according to claim 2, wherein the Y-shaped elastic contact portion is doubled by folding a single conductive leaf spring, and one end side thereof is formed. A jig for inspecting electronic parts, wherein the jigs are bent in an oblique direction so that their tips are separated from each other. 4. The inspection jig for an electronic component according to claim 1, wherein a wide portion is formed at an intermediate portion or the other end portion of the conductive leaf spring, and the inspection jig member is placed on top. The jig plate and the lower jig plate are divided into two layers, and the upper jig plate of the electronic component to be inspected is provided with a hole through which the wide portion cannot pass, and the lower jig plate has the wide portion. A jig for inspecting an electronic component, characterized in that a hole into which the electrical component is inserted is formed, and the upper jig plate prevents the conductive leaf spring from coming out toward the electronic component to be inspected. 5. The jig for inspecting electronic parts according to claim 1, wherein substantially half of the conductive leaf springs elastically contacting the solder balls and the oblique bending directions of the elastic contact portions are on the same side, A jig for inspecting electronic parts, characterized in that the remaining approximately half of the elastic contact parts are configured so that the oblique bending directions are opposite to each other. 6. The jig for testing an electronic component according to claim 2, wherein a Y-shaped bending direction of the elastic contact portion of the conductive leaf spring is set in a pitch direction in which the solder balls are arranged. A jig for inspecting electronic parts, characterized in that the conductive leaf springs are arranged on the inspection jig member so as to be approximately 45 degrees. 7. An electronic component to be inspected having terminals arranged on the surface facing the inspection jig member is arranged to be relatively close to and separated from each other, and one end side of the conductive leaf spring is Y-shaped. A conductive pin having a hemispherical end that abuts against the Y-shaped elastic contact portion and the conductive leaf spring,
The inspection jig member is disposed so as to be substantially in the approaching and separating direction, and the other end of the conductive leaf spring is protruded from the inspection jig member to the electronic component to be inspected side. A substrate provided with a terminal with which the other end of the conductive pin abuts is provided on the surface of the jig member opposite to the electronic component to be inspected, and the terminal of the electronic component to be inspected by the relative approach. A jig for inspecting electronic parts, characterized in that the other end of the conductive leaf spring is elastically contacted.