JPH0883656A - Socket for measuring ball grid array semiconductor - Google Patents

Abstract

PURPOSE: To improve contact reliability by punching a specific sheet metal having a spring function to a tuning fork shape for use as a contact pin having two-point contact with a solder ball. CONSTITUTION: A branch contact pin 36 is formed out of a sheet metal having a spring function such as beryllium bronze and phosphor bronze punched into a tuning fork shape. Also, the end of an elastic branch section has the housing 31 of a BGA package measurement socket 30 made by machining a plate material, where in contact with the solder ball of a BGA package 10. In addition, receiving holes reaching from the upper surface of a housing 31 to the lower surface thereof are drilled and arrayed, so as to correspond to balls 12 arranged and positioned in a matrix on the lower surface of the package 10 laid on the surface 32. According to this construction, the branch contact pins 30 of the socket 30 for measuring a ball grid array BGA semiconductor comes to have the elastic branch section in two-point contact with the solder balls, thereby improving contact reliability.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION This invention relates to a ball grid grid
Array semiconductor (Ball Grid Array I)
C, BGA package) Measuring socket, especially
The present invention relates to a BGA package measuring socket which is applied to an IC tester and electrically connects a solder ball, which is a terminal or an electrode of a BGA package, to the IC tester side.

[0002]

2. Description of the Related Art When the density of an IC is increased, a large number of leads for drawing the internal circuit of the IC to the outside are required. Can no longer be accommodated. Here, referring to FIG. 5, for the reasons described above, the balls 12 made of solder that act as terminals or electrodes are two-dimensionally arranged in a matrix on the bottom surface of the IC mounting substrate 13 of the IC package 10. Those that are surface-mounted on the substrate 13 are being put to practical use. An IC package including such a solder ball 12 that operates as a terminal or an electrode is called a BGA package. The internal circuit of the BGA package 10 is sealed by a mold indicated by 11, and is electrically connected to the solder ball 12 via a printed wiring formed on the substrate 3.

Here, the BGA package 1 as described above
0 is tested by an IC tester, the solder balls 12 which are terminals or electrodes of the BGA package 10 and the IC
Although it must be electrically connected to the tester side, this connection is made by a BGA package measuring socket interposed between the BGA package 10 and the IC tester.

Referring to FIG. 6 (a), here, a BGA is used.
A conventional example of a package measuring socket is shown. That is, 10 is a BGA package, and 20 is a printed circuit board that constitutes a part of the IC tester side, and these are electrically interconnected via a BGA package measuring socket indicated by 30. The printed board 20 is provided with an opening 21. The openings 21 are provided on the bottom surface of the BGA package 10 and arranged in a matrix in the solder balls 12.
Correspondingly, a large number of arrays are similarly drilled. Reference numeral 30 denotes the entire BGA package measuring socket. Reference numeral 31 denotes a housing of the BGA package measuring socket 30, which is formed by processing a plate-shaped body made of an insulating material. A mounting recess 32 is formed on the upper surface of the housing 31 for mounting the BGA package during a test. Reference numeral 33 is a housing hole that extends from the mounting recess 32 to near the lower surface of the housing 31. The accommodating holes 33 are similarly arranged and drilled corresponding to the solder balls 12 arranged and arranged in a matrix on the lower surface of the BGA package 10 to be mounted in the mounting recess 32. Three
Reference numeral 4 is a contact pin arranged in the accommodation hole 33. FIG. 6B is a perspective view of the contact pin 34. The contact pin 34 is formed of a sheet metal having a spring property such as beryllium copper or phosphor bronze as a raw material to form an elongated piece, and is bent and deformed by press working as shown by a cross section in FIG. 6A. And 34 ₁ is BGA
A contact portion for contacting the solder ball 12 of the package, 34
Reference numeral ₂ is a curved portion that imparts a spring property to the contact pin 34 in the vertical direction, and reference numeral 34 ₃ is a terminal portion that fits into an opening 21 formed in the printed circuit board 20 that constitutes a part of the IC tester side. The contact pin 34 is fixed to the housing 31 by integrally molding the upper portion of the terminal portion 34 ₃ thereof with the lower portion of the housing 31. Contact part 34 _{1 of the} contact pin 34
As shown in FIG. 6 (b), a circular hole is formed in this.

Here, the BGA package measuring socket 30 is a printed circuit board 2 which constitutes a part of the IC tester side.
0, the terminal portion 34 _{3 of} the contact pin 34 is placed in a state of being inserted and fitted into the opening 21 of the printed circuit board 20, and the terminal portion 34 ₃ of the contact pin 34 and the printed wiring near the opening 21 are placed. And are soldered. In this state, the BGA package 10 is mounted in the mounting recess 32 of the BGA package measuring socket 30,
The package 10 is pressed and held downward, and the solder balls 12 on the lower surface of the BGA package 10 are brought into engagement pressure contact with the circular holes of the contact portions 34 ₁ of the contact pins 34 of the BGA package measuring socket 30. BG is the pressure force
This is caused by the reaction of the curved portion 34 ₂ of the contact pin 34 caused by pressing the A package 10 downward. In this way, when the solder ball 12 on the lower surface of the BGA package 10 is pressed against the contact portion 34 ₁ of the contact pin 34 of the BGA package measuring socket 30, B
The GA package 10 is electrically connected to the IC tester side, and the test can be performed here.

The BGA package measuring socket 30 uses the contact pins 34 as described above. In this socket 30, since the pressure contact force between the solder ball 12 on the lower surface of the BGA package 10 and the contact portion 34 ₁ of the contact pin 34 is generated by the curved portion 34 ₂ of the contact pin 34, the required pressure contact is required. To obtain the force, the length of the bend 34 ₂ cannot be reduced below a certain limit. In order to secure the required pressure contact force, the total length of the contact pin 34 must be relatively long. The fact that the contact pin 34 has a long overall length leads to an increase in the degree of bending of the bending portion 34 ₂ with the height of the housing 31 being constant, and is perpendicular to the length direction of the contact pin. As a result, the mounting density of the contact pins 34 decreases as a result of the increase in the dimension in the direction of. Further, due to the increase in the total length of the contact pin 34, various restrictions are added to the shape structure of the housing 31 and the manufacturing cost thereof is increased. In addition, the fact that the contact pin 34 has a long overall length means that the inductance and capacitance of the stray are increased accordingly, and it is not electrically preferable, and it cannot withstand a high frequency test of about 100 MHz. .

A conventional example of the BGA package measuring socket is shown in FIG. 7 (a). This BGA package measuring socket also has a housing 31
The shape structure itself is substantially the same as that of the conventional example shown in FIG. That is, the housing 31 is formed by processing a plate-shaped body made of an insulating material. A mounting recess 32 is formed on the upper surface of the housing 31 for mounting the BGA package during a test. Reference numeral 33 is a through hole that extends from the mounting recess 32 to the lower surface of the housing 31. Through hole 33
Are arranged and drilled in a matrix similar to the solder balls 12 arranged and arranged in a matrix on the lower surface of the BGA package 10 mounted in the mounting recess 32.
Reference numeral 35 is a probe pin fitted and fixed in the through hole 33. FIG. 7B is a sectional view of the probe pin 35.

In FIG. 7 (b), 35 ₁ is a cylindrical tube made of conductive metal. A flange is formed on the upper end of the cylindrical tube 35 ₁ by plastic working, and its center is a circular hole 35 ₂ having a smaller diameter than the cylindrical tube.
Numeral 35 ₃ is a plunger made of a conductive metal, one end of which is a flange. 35 ₄ is a coil spring made of a conductive metal having a spring property. Here, the outer diameter of the flange portion of the cylindrical tube 35 ₁ of the inner diameter and the plunger 35 _3, configured so as to hold the electrical contact along with the flange portion of the plunger 35 ₃ to the cylindrical tube 35 ₁ inner surfaces can slide To be done. Then, both the plunger 35 ₃ accommodated in the coil spring 35 ₄ in the cylindrical tube 35 ₁ as interposed between the flange portion, to form a flange the upper and lower ends of the cylindrical tube 35 ₁ by plastic working, both plunger These three are confined in the state that 35 ₃ and the coil spring 35 ₄ are compressed.

Here, the BGA package measuring socket 30 is a printed circuit board 2 which constitutes a part of the IC tester side.
It is placed and positioned at 0. At the time of this positioning, the tip of the lower plunger 35 ₃ of the probe pin 35 is brought into contact with a predetermined printed wiring of the printed circuit board 20 on the IC tester side. In this state, the BGA package 10 is mounted in the mounting recess 32 of the BGA package measuring socket 30, and the BGA package 10 is pressed and held downward.
Is brought into engagement pressure contact with the tip of the upper plunger 35 ₃ of the probe pin 35. The force for bringing the pressure contact state is generated by the reaction of the probe pin 35 by the coil spring 35 ₄ caused by pressing the BGA package 10 downward. In this state, the BGA package 10 is electrically connected to the IC tester side, and the test can be performed here.

The BGA package measuring socket 30 uses the probe pin 35 as described above. In this socket 30, the solder ball 12 on the lower surface of the BGA package 10 and the upper plunger 35 of the probe pin 35
₃ , the pressure contact force with the tip of ₃ , the predetermined printed wiring of the printed circuit board 20 on the IC tester side and the lower plunger 35.
_Since the pressure contact force with the tip of ₃ is generated by the coil spring 35 ₄ of the probe pin 35, the length of the coil spring 35 ₄ is shortened to a certain limit or less in order to obtain the required pressure contact force. It is not possible. When the required pressure contact force is secured, the total length of the coil spring 35 ₄ becomes relatively long. That the overall length of the coil spring 35 ₄ is long is to increase correspondingly stray inductance, capacitance, rather than electrically desirable, not stand the test of high frequency of about 100 MHz. Then, the probe pin 35, the diameter of the cylindrical tube 35 ₁ is intended following very thin 1 mm, due to the overall length becomes long, various restrictions on the shape structural member constituting the probe pin 35 Therefore, the manufacturing processing cost becomes high.

Further, the probe pin 35 is shown in FIG.
This is as illustrated and described in more detail. Probe pin 3
The conductive path in 5 is the upper plunger 35₃From the tip of
Through the plunger and its outer peripheral surface and cylindrical tube 3
5₁Reach the contact area with the inner surface of the
This and the lower plunger 35 this time through the tube ₃
Lower plunger 3 through the contact part between the outer peripheral surface of the collar part of
5₃To the tip of. Conduction via the probe pin 35
There will be a total of four contact points on the road. Immediately
The solder ball 12 and the upper plunger 35₃With the tip of
Between the upper plunger 35₃Outer peripheral surface of the collar and cylindrical tube
Boo 35₁Between the inner peripheral surface of the cylindrical tube 35₁Inner surface of
And lower plunger 35₃Between the outer circumference of the collar of the
Side plunger 35₃Print tip on the tip of the IC tester
There are four places between the board 20 and predetermined printed wiring. When
With the rollers, the contact condition of these four contact parts is sufficiently good.
Not only that, but it is also unstable. Guidance as described above
The upper plunger 35 is formed without forming an electric path.₃From carp
Lubane 35_FourThrough the lower plunger 35₃Conductivity
A route may be formed.

[0012]

SUMMARY OF THE INVENTION The present invention provides a BGA package measuring socket which solves the above problems.

[0013]

A ball grid array semiconductor measuring socket having a branch contact pin 36 formed by punching out a sheet metal having a spring property in a tuning fork shape is constructed. Then, the branch contact pin 36 is obtained by forming an elastic branch portion 36 ₂ by punching a metal plate made of beryllium copper or phosphor bronze having spring properties, the distal end portion of the elastic branch portion 36 ₂ and the contact portions 36 ₁ A socket for ball grid array semiconductor measurement was constructed.

Further, the housing 3 made of an insulating material in which the accommodation hole 33 for accommodating the branch contact pin 36 is formed.
1. A ball grid array semiconductor measuring socket characterized by comprising 1. Further, the accommodation hole 33
Constitutes a ball grid array semiconductor measuring socket in which a region for accommodating the elastic branch portion 36 ₂ of the branch contact pin 36 is formed in a facing direction which is inclined with respect to the arrangement direction of the accommodating holes 33.

Further, a ball grid array semiconductor measuring socket is constructed in which the region for accommodating the elastic branching portion 36 ₂ is formed in a facing direction inclined by 45 ° with respect to the arrangement direction of the accommodating holes 33.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a view for explaining the positional relationship between the BGA package measuring socket of the present invention and the BGA package, which is a view as seen from above. FIG. 2 is a view showing a cross section taken along the line AA in FIG. FIG. 3 is a view showing a cross section taken along line BB in FIG. FIG. 4 is a perspective view of a contact pin used in the ball grid array semiconductor measuring socket of the present invention.

The BGA package 10 has its mounting substrate 13
The back surface of the solder ball 12 is provided with solder balls 12 arranged two-dimensionally in a matrix. The internal circuit of the BGA package 10 is sealed by the mold 11, and is electrically connected to the solder ball 12 via the printed wiring formed on the substrate 13. Reference numeral 30 denotes a BGA package measuring socket of the present invention, which electrically connects the BGA package 10 to a printed circuit board 20 which constitutes a part of the IC tester side. That is, an elongated opening 22 is formed in the printed board 20, and a connector indicated by 21 is inserted and fixed in the opening 22. After all, BGA package 10
The internal circuit of is electrically connected to the connector 21 of the printed circuit board 20. The openings 22 are arranged on the back surface of the BGA package 10 in a matrix to form the solder balls 12.
Are drilled in an array corresponding to.

Here, 31 is a housing of the BGA package measuring socket 30, which is constructed by processing a plate-like body made of an insulating material. The BGA package 10 is mounted on the upper surface 32 of the housing 31 during the test. Reference numeral 33 is a housing hole that extends from the upper surface 32 to near the lower surface of the housing 31. The accommodation holes 33 are arranged and drilled corresponding to the solder balls 12 arranged and arranged in a matrix on the lower surface of the BGA package 10 mounted on the upper surface 32. Reference numeral 36 is a branch contact pin of the present invention which is accommodated in the accommodation hole 33. FIG. 4 shows a branch contact pin 36.
It is a perspective view of. The branch contact pin 36 is formed by punching out a sheet metal having a spring property such as beryllium copper or phosphor bronze having a spring property into a tuning fork shape as shown in FIG. Reference numeral 36 ₂ denotes an elastic branch portion of the branch contact pin 36, which are parallel to each other. Elastic branches 36 parallel to each other
The dimension between the outer surfaces of ₂ is about 1 mm. A tip portion of the elastic branch portion 36 ₂ is a contact portion 36 ₁ that contacts the solder ball 12 of the BGA package 10. Contact part 3
The contact surface of ₆₁ are formed to be inclined in a direction away from the branch contact pin center axis directed upwardly from the lower end. The angle formed by the contact surface of the contact portion 36 ₁ is about 28 °.
36 ₃ constitutes a terminal portion of the branch contact pin 36.
The distal end of the terminal portion 36 ₃ is a portion that inserts fitted into the connector 21 is inserted and fixed to the hole 22 of the printed circuit board 20 which constitutes a part of the IC tester side.

Regarding the shape structure of the accommodation hole 33, the upper opening of the upper surface 32 of the housing 31 indicated by 33 ₁ is in contact with the contact portion 36 ₁ by the solder ball 12 of the BGA package 10 entering. By the way, its diameter is slightly larger than the diameter of the solder ball 12, and its depth is an opening slightly deeper than the diameter of the solder ball 12. And what is indicated by 33 ₂ is a slit formed by cutting in the radial direction on the inner surface of the upper opening 33 _{1 so} as to face each other in the radial direction, and these slits 33 ₂ are formed in the upper opening 33 ₁ . It is cut deeper and deeper than the bottom. This slit 33 in which the elastic branch portion 36 ₂ of the branch contact pin 36 is accommodated
_The direction in which the _second cut is formed is the opposite direction that is inclined with respect to the arrangement direction of the accommodation holes 33. That is, the slit 33 ₂ are symmetrical with respect to the center axis of the receiving hole 33, perpendicular to the central axis from one of the slits 33 ₂ other slit 33 ₂ to reach the horizontal line is inclined to the arrangement direction of the receiving hole 33. The depth measured from the inner surface of the upper opening 33 ₁ of the slit 33 ₂ is
The contact portion 34 ₁ at the tip of the elastic branch portion 36 ₂ is formed to have a depth such that the contact portion 34 ₁ does not contact the housing 31 when expanded by the solder ball 12. Slit 3
3 _second width slightly greater than the thickness of the branch contact pins 36. The length of the slit 33 ₂ is substantially equal to the length of the elastic branch portion 36 ₂ of the branch contact pin 36. Reference numeral 33 ₃ is an opening portion into which the base portion of the terminal portion 36 ₃ is fitted and integrally fixed.

The BGA package measuring socket 30 is completed when the branch contact pin 36 is housed in the housing hole 33 of the housing 31 and is integrally fixed to the housing 31. Terminal portion 3 of the branch contact pin 36 of the completed BGA package measurement socket 30
6 _{3 The} BGA package 10 is mounted on the BG with the tip portion inserted and fitted in the connector 21 which is inserted and fixed in the opening 22 of the printed circuit board 20 which constitutes a part of the IC tester side.
Mounted on the upper surface 32 of the A package measurement socket 30,
The BGA package 10 is pressed and held downward, and the solder balls 12 on the lower surface of the BGA package 10 are brought into engagement pressure contact with the contact portions 36 ₁ of the branch contact pins 36 of the BGA package measuring socket 30. The pressure force is BG
This is caused by the inward reaction of the elastic branch portion 36 ₂ of the branch contact pin 36 caused by pressing the A package 10 downward. In this way, when the solder balls 12 on the lower surface of the BGA package 10 are pressed against the contact portions 36 ₁ of the branch contact pins 36 of the BGA package measuring socket 30, the BGA package 10 is electrically connected to the IC tester side. The test can be conducted.

[0021]

As described above, the branch contact pin 36 of the ball grid array semiconductor measuring socket 30 of the present invention has the elastic branch portion 3 having its spring property.
6 ₂ comes into contact with the solder ball 12 at two points, and compared with the conventional case where the contact between the contact pin 34 or the probe pin 35 and the solder ball 12 is only one point. Improves reliability. Elastic branch 36 against the elastic bifurcation 36 ₂ having a spring property
_{As the} solder ball 12 pushes ₂ and contacts while opening,
Elastic branch 36 ₂ and the solder balls 12 both contact surfaces and thus be self-cleaning.

The tip of the elastic branch portion 36 ₂ is the solder ball 1
Since it is the contact portion 34 ₁ for 2
When the BGA package is mounted on the A package measuring socket 30, even if the center axis of the branch contact pin 36 and the center of the solder ball 12 are slightly deviated from each other in the vertical direction, one of the two elastic branch portions 36 ₂ is The force that presses the solder ball 12 toward the other side produces the effect that the BGA package is self-aligned with the socket 30.

The branch contact pin 36 of the present invention is a bullet
Sex branch 36₂The tip of the contact part 36 ₁What is said
Therefore, the contact pressure to the solder ball 12 is
Generate it in a direction perpendicular to the length direction of the ktopin 36.
The configuration is Length of branch contact pin 36
Has nothing to do with increasing contact pressure
Therefore, the length of the branch contact pin 36 is independent of the contact pressure.
It can be designed to the minimum length required for the person in charge. this
Points, the stray inductance of the branch contact pin 36,
Capacitance can be reduced and high frequency
It is suitable for testing.

Since the branch contact pin 36 of the present invention has the above-described shape and structure, it can be manufactured extremely simply by punching a sheet metal having a spring property, and the manufacturing cost can be reduced. It is very advantageous. The branch contact pins 36 corresponding to the fine pitch BGA package in which the solder balls 12 are arranged at a high density can be easily manufactured.

In the ball grid array semiconductor measuring socket 30 of the present invention, the housing hole 33 formed in the housing 31 has the elastic branch portion 36 of the branch contact pin 36.
_{Since the} direction in which the slit 33 ₂ in which ₂ is accommodated is formed to face the arrangement direction of the accommodating holes 33, in particular 45 °, the upper opening without connecting adjacent slits 33 ₂ is formed. It is possible to pierce the members 33 ₁ close to each other, and as a result, the packaging density of the branch contact pins 36 can be improved.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an embodiment of the present invention.

FIG. 2 is a view showing a cross section taken along line AA in FIG.

FIG. 3 is a diagram showing a cross section taken along line BB in FIG.

FIG. 4 is a perspective view of a contact pin used in the embodiment of the present invention.

FIG. 5 is a diagram illustrating a conventional example of a BGA package.

6A and 6B are diagrams illustrating a conventional example, in which FIG. 6A is a sectional view thereof, and FIG. 6B is a perspective view of a contact pin thereof.

7A and 7B are views for explaining another conventional example, in which FIG. 7A is a sectional view thereof, and FIG. 7B is a probe pin thereof.

[Explanation of symbols]

31 housing 33 accommodation hole 36 branch contact pin 36 ₁ contact part 36 ₂ elastic branch part

Claims (5)

[Claims] 1. A ball grid array semiconductor measuring socket comprising a branch contact pin formed by punching a spring metal plate into a tuning fork shape. 2. The ball grid array semiconductor measuring socket according to claim 1, wherein the branch contact pin is formed by punching out a sheet metal having a spring property such as beryllium copper or phosphor bronze to form an elastic branch portion. And
A socket for measuring a ball grid array semiconductor, characterized in that the tip of the elastic branch portion is used as a contact portion. 3. The ball grid array semiconductor measuring socket according to claim 2, further comprising a housing made of an insulating material in which a housing hole for housing the branch contact pin is formed. Grid array semiconductor measurement socket. 4. The ball grid array semiconductor measuring socket according to claim 3, wherein the accommodation hole is in a facing direction in which a region in which the elastic branch portion of the branch contact pin is accommodated is inclined with respect to the arrangement direction of the accommodation holes. A socket for ball-grid-array semiconductor measurement, characterized in that 5. The ball grid array semiconductor measuring socket according to claim 4, wherein the region for accommodating the elastic branch portion is formed in a facing direction inclined by 45 ° with respect to the arrangement direction of the accommodating holes. A ball grid array semiconductor measurement socket characterized in that