JP2006184061A - Electrical connection component and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrical connection component that will not undergo performance drop, even due to wear, and to provide a method for manufacturing the electrical connection component, regarding the electrical connection component that has a substrate made of a first conductive material and a plated layer of a second conductive material that is formed on the surface of the substrate and has a contact resistance smaller than that of the first conductive material, and obtains electrical connection by coming into contact with other components, and to provide a method for manufacturing the electrical connection component. <P>SOLUTION: A closed-end hole (recess) 151 is formed at the part of the substrate 131 that faces a part in contact with an electrode (other components) 111, and a second plated layer 135 is formed on a sidewall surface 151a of at least the closed-end hole 151. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention includes a base made of a first conductive material, and a plating layer of a second conductive material formed on the surface of the base and having a contact resistance smaller than that of the first conductive material. The present invention relates to an electrical connection part that obtains an electrical connection by contacting the part and a manufacturing method thereof.

  In order to electrically connect components to each other, electrical connection components such as various connectors and probe pins are used. In the connector and the probe pin, the surface is plated with gold in order to keep a good contact state with the counterpart component to be connected. On the other hand, the surface of the counterpart component with which the electrical connection component contacts is also treated with gold plating or solder. The mating component and the electrical connection component are electrically connected by being pressed against each other.

  Here, the configuration of a general probe will be described with reference to FIG. In the figure, the 1st recessed part 3 and the 2nd recessed part 5 are formed in the surrounding surface of the cylindrical case 1 whose both end surfaces are open surfaces along the circumferential direction.

  A conductive probe pin 7 is provided in the case 1 so as to be movable in the axial direction of the case 1. A large-diameter portion 9 that is disposed between the first concave portion 3 and the second concave portion 5 and has a diameter larger than the inner diameter of the second concave portion 5 is formed in the intermediate portion of the probe pin 7. Therefore, when the large-diameter portion 9 of the probe pin 7 comes into contact with the second concave portion 5 of the case 1, further protrusion of the probe pin 7 from the case 1 is prohibited. A probe pin main body 10 protruding from the case 1 is formed on one end side (lower side in the figure) across the large-diameter portion 9 of the probe pin 7. A contact portion 13 is formed at the tip of the probe pin main body 10 so as to abut on a contact 11 provided on a substrate or the like. A small-diameter portion 15 extending in the direction of the first recess 3 is formed on the other end side (upper side in the drawing) across the large-diameter portion 9 of the probe pin 7.

  The case 1 is wound around a small diameter portion of the probe pin 7 through a space, and one end portion (lower end portion in the figure) abuts on the large diameter portion 9 of the probe pin 7 and the other end portion (in the figure). A spring 17 that urges the probe pin 7 in a direction protruding from the case 1 is provided in contact with the first recess 3 at the upper end).

  In addition, one end of a conductive cylindrical plug 21 is fixed to the tip (upper side in the drawing) of the small diameter portion 15 of the probe pin 7 by a technique such as caulking. Furthermore, the core wire 25 of the connection wiring 23 connected to the tester or the like is fixed to the other end of the plug 21 by a caulking method or the like.

  Therefore, when the contact portion 13 of the probe pin 7 contacts the electrode 11, an electrical conduction path including the conductive probe pin 7, the conductive plug 21, and the connection wiring 23 is formed (for example, Patent Document 1). reference).

Next, the probe pin 7 will be described with reference to FIG.
The probe pin 7 is formed so as to cover the surface of the base 31 made of carbon tool steel (first conductive material) such as SK3, and a first plating layer 33 of nickel which is a conductive material. The second plating layer 35 is made of gold (second conductive material) so as to cover the surface of the first plating layer 33. The contact resistance with other parts decreases in the order of carbon tool steel, nickel, and gold. Further, the first plating layer 33 of nickel is used as a base plating.
JP 2004-117156 A (FIG. 4)

  However, in the case of the probe pin 7 having the structure shown in FIG. 10, when the connection (contact) is made many times, or when the contact surface of the counterpart component with which the probe pin 7 contacts is inclined, The contact portion 13 is heavily worn by pressing and sliding. For example, in the probe pin 7 having the shape shown in FIG. 10, as shown in FIG. 11A, the second plating layer 35 is worn out and disappears, and the first plating layer 33 is exposed, and the first plating layer 33 is exposed. The plating layer 33 is in contact with the counterpart component. Further, as shown in FIG. 11 (b), the first plating layer 33 is worn away and disappears, the base 31 is exposed, and the base 31 comes into contact with the counterpart component.

  The contact resistance with other parts of the carbon tool steel, which is the material of the base 31 and the nickel, which is the material of the first plating layer 33, is 2-3 times higher than the gold which is the material of the second plating layer 35, There is a problem that accurate measurement cannot be performed due to large variations in contact resistance.

  The present invention has been made in view of the above problems, and an object thereof is to provide an electrical connection component that does not deteriorate in performance even if it is worn, and a method for manufacturing the same.

  According to a first aspect of the present invention, there is provided a base made of the first conductive material, and a plating layer of the second conductive material formed on the surface of the base and having a smaller contact resistance with other parts than the base. In the electrical connection component that has an electrical connection by contacting with another component, a concave portion is formed in the portion of the base that faces the portion in contact with the other component, and the plating layer includes: An electrical connection component formed on at least a side wall surface in the recess.

The invention according to claim 2 is the electrical connection component according to claim 1, wherein there are a plurality of the recesses.
The invention according to claim 3 is the electrical connection component according to claim 1, wherein the recess is a bottomed hole having a bottom.

The invention according to claim 4 is the electrical connection part according to claim 1 or 2, wherein the recess is a through hole.
The invention according to claim 5 is the electrical connection component according to claim 1, wherein the second conductive material is one of gold and palladium.

  According to a sixth aspect of the present invention, there is provided a base made of the first conductive material, and a plating layer of the second conductive material formed on the surface of the base and having a smaller contact resistance with other parts than the base. A method of manufacturing an electrical connection component having electrical connection by contacting with another component, and forming a recess in a portion of the base that faces the portion in contact with the other component; Forming the plating layer on the side wall surface in the recess.

  In the present invention, the plating means electroplating, chemical plating, hot dipping, thermal spraying, physical vapor deposition, chemical vapor deposition, and permeation plating.

  According to the first and sixth aspects of the present invention, a recess is formed in the portion of the base that faces the portion that contacts the other component, and the plating layer is formed on at least a side wall surface in the recess. By being formed, even if a portion in contact with another component is worn, the plating layer formed on the side wall surface in the recess is always exposed to the portion in contact with the other component. Therefore, since the plating layer having a smaller contact resistance with other parts than the base always comes into contact with other parts, there is no deterioration in performance due to wear.

According to the invention which concerns on Claim 2, the part which contacts said other components increases because there are two or more recessed parts, and can obtain the stable contact.
According to the invention of claim 3, since the recess is a bottomed hole having a bottom, it is suitable for an electrical connection component having a thickness of the contact portion, for example, an electrical connection component such as a probe pin. .

According to the invention which concerns on Claim 4, since the said recessed part is a through-hole, it is suitable for electrical connection components without the thickness of a contact part, for example, electrical connection components like a connector.
According to the invention of claim 5, the second conductive material is either gold or palladium. In the case of gold, the contact resistance is small, and in the case of palladium, the friction resistance is excellent.

(First embodiment)
An example in which the probe pin is applied as an electrical connection component will be described. First, the probe provided with the probe pins of this embodiment will be described with reference to FIG.

  In the figure, a first recess 103 and a second recess 105 are formed along the circumferential direction on the peripheral surface of the cylindrical case 101 whose both end surfaces are open surfaces. A conductive probe pin 107 is provided in the case 101 so as to be movable in the axial direction of the case 101. A large-diameter portion 109 that is disposed between the first concave portion 103 and the second concave portion 105 and has a diameter larger than the inner diameter of the second concave portion 105 is formed in an intermediate portion of the probe pin 107. Accordingly, when the large-diameter portion 109 of the probe pin 107 abuts on the second recess 105 of the case 101, further protrusion of the probe pin 107 from the case 101 is prohibited. A probe pin main body 110 protruding from the case 101 is formed on one end side (lower side in the figure) across the large diameter portion 109 of the probe pin 107. At the tip of the probe pin main body 110, a contact portion 113 that abuts on the electrode 111 provided on the substrate or the like is formed. On the other end side (the upper side in the figure) across the large-diameter portion 109 of the probe pin 107, a small-diameter portion 115 extending in the direction of the first concave portion 103 is formed.

  The case 101 is wound around the small diameter portion 115 of the probe pin 107 through a space, and one end portion (the lower end portion in the figure) abuts on the large diameter portion 109 of the probe pin 107 and the other end portion (see the figure). A spring 117 that biases the probe pin 107 in a direction that protrudes from the case 101 is provided in contact with the first recess 103.

  Further, one end of a conductive cylindrical plug 121 is fixed to the tip (upper side in the figure) of the small diameter portion 115 of the probe pin 107 by a method such as caulking. Further, the core wire 125 of the connection wiring 123 connected to the tester or the like is fixed to the other end of the plug 121 by a caulking method or the like.

  Therefore, when the contact portion 113 of the probe pin 107 comes into contact with the electrode 111, an electrical conduction path including the conductive probe pin 107, the conductive plug 121, and the connection wiring 123 is formed.

Next, the probe pin 107, in particular, the probe pin main body 110 will be described with reference to FIG.
The probe pin 107 includes a base 131 made of carbon tool steel (first conductive material) such as SK3, and a first plating layer 133 of nickel that is a conductive material formed so as to cover the surface of the base 131. The second plating layer 135 is made of gold (second conductive material) so as to cover the surface of the first plating layer 133. The contact resistance with the electrode 111 as another component decreases in the order of carbon tool steel, nickel, and gold. Further, the first plating layer 133 of nickel is used as a base plating.

  A bottomed hole 151 is formed as a recess in the portion of the base 131 facing the contact portion 113, and the first plating layer 133 and the second plating layer 135 are formed on the side wall surface 151 a inside the bottomed hole 151. And the bottom surface 151b.

  Here, a manufacturing method of the probe pin 107 having the configuration shown in FIG. 1 will be described with reference to FIG. First, as shown in FIGS. 3A and 3B, a bottomed hole 151 is formed in a portion of the base 131 that faces the contact portion 113 (step 1). Next, as shown in FIG. 3C, a first plating layer 133 is formed on the surface of the base 131 and the side wall surface 151a and the bottom surface 151b inside the bottomed hole 151 (step 2). Finally, as shown in FIG. 3D, a second plating layer 135 is formed on the surface of the first plating layer 135.

  According to such a configuration, even if the contact portion 113 of the probe pin 107 is worn and the first plating layer 133 is exposed to the outside as shown in FIG. The second plating layer 135 formed on the side wall surface 151 a inside 151 is exposed to the contact portion 113.

  Further, as shown in FIG. 4B, even if the contact portion 113 of the probe pin 107 is further worn and the base 131 is exposed to the outside, it is formed on the side wall surface 151a inside the bottomed hole 151. The formed second plating layer 135 is exposed at the contact portion 113.

Therefore, since the second plating layer 135 having a smaller contact resistance with the electrode (other parts) 111 than the base 131 is always in contact with the electrode 111, there is no deterioration in performance due to wear.
The present invention is not limited to the above embodiment. In the above embodiment, the first plating layer 133 and the second plating layer 135 are formed on the entire surface of the base 131 and the side wall surface 151a and the bottom surface 151b inside the bottomed hole 151. If the second plating layer 135 formed on the side wall surface 151a of the bottomed hole 151 is always exposed to the contact portion 113, the performance degradation due to wear is eliminated. .

  The material of the second plating layer 135 is not limited to gold. Although the contact resistance with respect to the electrode 111 which is another component is the smallest, gold | metal | money may be palladium which was excellent in abrasion resistance rather than gold | metal | money.

Further, if the gold second plating layer 135 can be firmly formed on the substrate 131, the nickel first plating layer 133 is unnecessary.
Moreover, although the bottomed hole 151 was one, you may provide multiple. By providing a plurality, the number of parts in contact with the electrode 111 is increased, and stable contact can be obtained.

(Second Embodiment)
This embodiment is an example applied to a thin plate-like electrode provided in an IC socket as an electrical connection component and electrically connected to an IC lead pin.

As shown in FIG. 5, the IC socket 201 is provided with electrodes 207 corresponding to all of the lead pins 205 of the IC 203 sealed in the DIP type package to be mounted.
As shown in FIG. 6A, the electrode 207 is formed in a substantially U shape by bending a conductive thin plate. The two opposing pieces 209 and 211 are urged so as to approach each other by being bent in a U shape in this way. Then, as shown in FIG. 6B, the lead pins 205 of the IC 203 are inserted between the two pieces 209 and 211 so that the pieces 209 and 211 and the lead pins 205 are in contact with each other so that an electrical connection is obtained. It has become.

  Specifically, the bent portions 209 a and 211 a formed on the pieces 209 and 211 are contact portions with the lead pin 205. In this embodiment, as shown in FIG. 7 which is an enlarged view of portion A in FIG. 6B, through holes 209b and 211b as concave portions are formed in the bent portions 209a and 211a.

  The electrode 207 includes a base 231 made of a spring material (first conductive material) such as phosphor bronze, beryllium copper, and stainless steel, and a base 231 as shown in FIG. The first plating layer 233 of nickel, which is a conductive material formed so as to cover the surface of the first metal, and the second plating of gold (second conductive material) so as to cover the surface of the first plating layer 233 Layer 235. The contact resistance with the lead pin 205 of the IC 203, which is another component, decreases in the order of spring material, nickel, and gold. Further, the first plating layer 233 of nickel is used as a base plating. The first plating layer 233 and the second plating layer 235 are also formed on the side wall surface 211c inside the through hole 211b. Although not shown, the first plating layer 233 and the second plating layer 235 are also formed on the side wall surface inside the through hole 209b.

  According to such a configuration, even when the lead pin 205 of the IC 203 is pulled out and inserted many times with respect to the electrode 207 and the bent portion (contact portion) 211a is worn, the second contact resistance lower than that of the base 231 is smaller than that of the lead pin 205. Since the plating layer 235 is always in contact with the lead pin 205, there is no deterioration in performance due to wear.

  The present invention is not limited to the above embodiment. In the above embodiment, the through holes 209b and 211b are formed. However, the same effect can be obtained even if a convex recess (bottomed hole) is formed in a direction away from the lead pin 205.

  The first plating layer 233 and the second plating layer 235 are formed on the entire surface of the base 231 and on the side wall surface inside the through holes 209b and 211b, but at least on the side wall surface inside the through holes 2099b and 211b. If formed, the second plating layer 235 formed on the side wall surfaces inside the through holes 209b and 211b is always exposed to the bent portions 209a and 211a as contact portions, so that the performance degradation due to wear is eliminated.

Furthermore, although the number of through holes 209b and 211b is one, a plurality may be provided. By providing a plurality, the number of portions that come into contact with the lead pins 205 is increased, and stable contact can be obtained.
Conversely, the through-holes 209b and 211b are provided in the piece 209 and the piece 211, respectively, but if the bent portions 209a and 211a always contact the lead pin 205, at least one of the piece 209 and the piece 211 is provided. A through hole may be provided.

If the gold second plating layer 235 can be firmly formed on the substrate 231, the nickel first plating layer 233 is not necessary.
Furthermore, the present invention is not limited to the above two embodiments. Needless to say, the present invention can also be applied to electrode of a connector, blade of an outlet, and the like.

It is a figure explaining the probe pin of a 1st Example. It is a figure explaining the probe provided with the probe pin of the 1st Example. It is a figure explaining the process of manufacturing the probe pin of FIG. It is a figure explaining the probe pin of FIG. 1 with which the contact part was worn out. It is a figure explaining the IC socket provided with the electrode of the 2nd form example. It is a figure explaining the electrode of FIG. It is an enlarged view of the A part of FIG.6 (b). FIG. 8 is an enlarged view of a portion B in FIG. 7. It is a figure explaining the conventional probe. It is a figure explaining the probe pin of FIG. It is a figure explaining the probe pin of FIG. 10 with which the contact part was worn out.

Explanation of symbols

111 electrodes (other parts)
131 Substrate 133 First plating layer 135 Second plating layer 151 Bottomed hole (concave portion)
151a Side wall surface

Claims (6)

A substrate made of a first conductive material and a plating layer of a second conductive material formed on the surface of the substrate and having a smaller contact resistance with other components than the substrate, and in contact with other components In an electrical connection component that obtains an electrical connection by
A recess is formed in the portion of the base that faces the portion that contacts the other component,
The electrical connection component, wherein the plating layer is formed on at least a side wall surface in the recess.   The electrical connection component according to claim 1, wherein there are a plurality of the recesses.   The electrical connection component according to claim 1, wherein the recess is a bottomed hole having a bottom.   The electrical connection component according to claim 1, wherein the recess is a through hole. The second conductive material is:
The electrical connection component according to claim 1, wherein the electrical connection component is one of gold and palladium. A substrate made of a first conductive material and a plating layer of a second conductive material formed on the surface of the substrate and having a smaller contact resistance with other components than the substrate, and in contact with other components In the manufacturing method of the electrical connection part to obtain electrical connection by
Forming a recess in the portion of the base that faces the portion in contact with the other component;
Forming the plating layer on at least the side wall surface in the recess;
A method of manufacturing an electrical connection component, comprising: