JP3017180B1 - Contact pins and sockets - Google Patents

Abstract

An object of the present invention is to provide a contact pin and a socket for an electronic component with a conductive ball, and to obtain a good contact without damaging the conductive ball. SOLUTION: The socket 1 for testing the BGA package 10 of the present invention is provided with a spring accommodation hole 51 of a ball guide 50.
, A contact pin 20 composed of a spiral coil spring 20a is housed therein, and a positioning pedestal 40 is provided. Thereby, without damaging the conductive balls 11,
And good contact can be obtained. The contact pin 20 of the helical coil spring 20a is
When the contact is made, a spiral contact portion is formed, the contact area increases, and good connection is performed. The same effect can be obtained by an application example such as the upper helical compression coil spring 20b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact pin and a socket for contacting a conductive ball mounted on an electronic component such as a wiring board or a semiconductor chip, for example, for inspection.

[0002]

2. Description of the Related Art BGA having conductive balls as external terminals
The (Ball Grid Array) package is inspected using a socket for IC inspection, for example, to inspect its performance. As a contact method for the conductive ball at this time, a pogo pin type contact pin or a leaf spring type is generally used.

In a pogo pin type contact pin, in a normal state, a conductive ball is brought into contact with a pin tip, and when further pressed, a shaft connected to the pin tip slides, and a spring force corresponding to the amount of sliding causes the conductive ball to become conductive. Press the ball.
However, when the sliding of the shaft connected to the pin tip does not slide at all, the conductive ball is pressed not by the spring force but by the force of pressing the BGA package, damaging the conductive ball and the contact pin. There is a problem that, when the rash occurs, damage is similarly caused depending on the degree.

In the leaf spring system, the conductive ball comes into point contact with the flat leaf spring, and there is a problem that contact cannot be made securely due to adhesion of foreign matter at the contact point, resulting in poor contact. Further, in the contact method using a conical pin tip, there is a problem that a contact failure occurs due to an insufficient shape of the pin tip, adhesion of foreign matter, and the like.

Various inventions have been made to improve the problem of this contact method.
No. 273, JP-A-9-219267, JP-A-10-1
There is a technique proposed in Japanese Patent No. 44438 and JP-A-10-189191. As described above, with the spread of BGA packages, countermeasures against such damage and poor contact have become a major issue in the production of electronic components.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and does not cause damage and does not cause conduction failure due to poor contact when contacting a conductive ball. An object of the present invention is to provide a contact pin and a socket using the contact pin.

[0007]

In order to achieve the above object, a contact pin according to claim 1 of the present invention comprises a wiring pin.
Contact with conductive balls of electronic components including boards and semiconductor chips
Spiral contact pin
Of the compression coil spring
The winding diameter of the spring is gradually increased over the entire length of the conductive boad.
It has a helical configuration that spreads out to the left. This
Contact with the conductive ball
It becomes a spiral contact part by the number of turns, and the contact area
And the conduction failure can be improved.

According to a second aspect of the present invention, there is provided a wiring board and a semiconductor.
Contours in contact with conductive balls of electronic components including chips
Helical compression coil
And the compression coil spring
A spiral whose diameter gradually increases from the middle to the conductive ball side
It is in the form of a shape. As a result, the spring force setting
It is easy to manufacture and easy to manufacture coil springs.
Thus, an inexpensive contact pin can be manufactured.

According to a third aspect of the present invention, there is provided a wiring board and a semiconductor.
Contours in contact with conductive balls of electronic components including chips
Helical compression coil
And the end of this compression coil spring
The upper part has a receiving part with a sharp convex part
There is a configuration to do. As a result, the contact pins
At least one of conductive balls or test board contacts
To either side without being affected by oxidation of the contact surface
Good contact.

According to a fourth aspect of the present invention, there is provided a socket
For conductive balls of electronic components including substrates and semiconductor chips.
Claims 1 to 5 are sockets which are in contact with and electrically connected to each other.
3. The contact pin according to claim 3, wherein
Test board with contacts at positions corresponding to sexual balls
And the contact at a position corresponding to the conductive ball.
A ball guide having a storage hole for storing a pin;
And a positioning pedestal for positioning the child parts.
There is it.

[0011] The invention according to claim 5 is the same as that of claim 4.
In the bracket, the contact guide is attached to the ball guide.
It has a configuration that protrudes.

Thus, the electronic components are damaged.
Conductive balls without
Electronic components to be tested. In addition, the coil spring
Fully freely expands and contracts, damaging electronic components
Danger can be reliably eliminated.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. A first embodiment of a contact pin will be described with reference to FIG. 1A and 1B are schematic diagrams of contact pins according to the first embodiment. FIG. 1A is an enlarged view and FIG. 1B is an enlarged view at the time of contact. In the figure, reference numeral 20 denotes a contact pin, which is formed by a helical compression coil spring 20a whose winding diameter gradually widens toward the conductive ball 11 as a whole. The end on the side where the winding diameter is widened contacts the conductive ball 11, and the other end contacts the contact of the test board, for example.

As shown in FIG. 1 (b), the spiral compression coil spring 20a has a plurality of winding portions of the spiral compression coil spring 20a because the winding diameter is increased toward the conductive ball 11 side. Contact the surface of the conductive ball 11.
That is, as shown in FIG. 5 (a), the spiral compression coil spring 20a has a spiral
Contact 1 The larger the contact area between the spiral coil spring 20a and the conductive ball 11, the more reliable the contact. For example, the contact area of the spiral contact portion by the helical coil spring 20a is larger than that of a single contact portion by a conical pin tip, and reliable contact is performed.
Preferably, the maximum outer diameter of the helical compression coil spring 20a is made larger than the diameter of the conductive ball 11 in order to increase the contact portion.

When the contact pin of the straight compression coil spring contacts the conductive ball 11,
As shown in FIG. 5B, the shape of this contact portion is an arc-shaped contact portion. That is, the contact area of the arc-shaped contact portion is larger than that of a single contact portion formed by the conical pin tip, and reliable contact is performed. However, the spiral coil spring 20a
The contact area of the spiral contact portion is larger than the area of the arc contact portion, and the contact by the helical coil spring 20a is performed more reliably.

Since the helical compression coil spring 20a has a large contact area, reliable contact can be made without contacting the conductive ball 11 with a strong force. That is, since it is not necessary to apply a strong force to the conductive balls 11, the risk of damaging the conductive balls 11 can be reduced. Further, in a structure in which the contact pin itself has a sliding portion like a pogo pin type contact pin and slides, if there is an abnormality in the sliding portion, the conductive ball 11 will be damaged. . However,
The spiral compression coil spring 20a is safe because there is no sliding portion.

As described above, by using the helical compression coil spring 20a as the contact pin 20, the contact portion with the conductive ball 11 can be made large, and reliable contact can be made. Further, the risk of damaging the conductive balls 11 can be reduced. That is,
The contact portion of the conductive ball 11 is not damaged such as a scratch, and the danger of the joint portion between the BGA package 10 and the conductive ball 11 such as a crack can be reduced.

A second embodiment of the contact pin will be described with reference to FIG. 2A and 2B are schematic diagrams of contact pins according to the second embodiment, wherein FIG. 2A is an enlarged view and FIG. 2B is an enlarged view at the time of contact. In the figure, reference numeral 20 denotes a contact pin, which is an upper spiral compression coil spring 20b.
It is formed with. Upper spiral compression coil spring 20b
Is formed of a spiral compression coil spring portion and a straight compression coil spring portion whose winding diameter gradually increases toward the conductive ball from the middle of the compression coil spring. The end on the side where the winding diameter is widened contacts the conductive ball 11, and the other end contacts the contact of the test board, for example.

Here, the upper helical compression coil spring 20
Since b has a larger winding diameter on the conductive ball 11 side, when it comes into contact with the conductive ball 11, good contact can be performed as in the first embodiment. Further, since the spring force of the straight compression coil spring portion can be easily set, the upper spiral compression coil spring 20 can be easily set.
The force abutting on the conductive ball 11b can be easily set by a straight compression coil spring portion. Further, similarly to the first embodiment, the structure is such that the conductive balls 11 are not damaged.

As described above, by forming the upper spiral coil spring 20b as the contact pin 20,
The force of contact with the contact conductive ball 11 can be easily set, and the production becomes easy, so that an inexpensive coil spring can be produced.

A third embodiment of the socket will be described with reference to FIG. 3A and 3B are schematic views of a socket according to the third embodiment. FIG. 3A is an enlarged view, and FIG. 3B is an enlarged view at the time of contact. In the figure, socket 1 is
Contact pin 2 formed by helical coil spring 20a
0, a test board 30, a positioning pedestal 40, and a ball guide 50.

The test board 30 is a wiring board having contacts 31 and external connection terminals (not shown). The contact 31 is a circular pad, and is provided at a position corresponding to the conductive ball 11 of the BGA package 10. further,
The contact 31 is connected to an external connection terminal of the socket 1.

The ball guide 50 is a BGA package 1
The spring storage hole 51 is provided at a position corresponding to the
And a square or rectangular plate-like structure made of a non-conductive material. The thickness of the ball guide 50 is such that the contact pin 20 does not protrude from the ball guide 50 when the contact pin 20 is housed in the spring housing hole 51. The spring storage hole 51 is a circular through hole larger than the maximum outer diameter of the spiral coil spring 20a, and the spiral coil spring 20a can freely expand and contract within the spring storage hole 51. The ball guide 50 is mounted on the test board 3 so that the spring storage hole 51 corresponds to the contact 31.
It is attached to 0.

The positioning pedestal 40 has a rectangular plate shape with a corner above the guide surface chamfered. further,
A plurality of positioning pedestals 40 are attached to the test board 30 corresponding to each side of the BGA package 10 so that the position of the BGA package 10 is determined. Also, preferably, the positioning pedestal 40 is the BGA package 10.
Is set, a stepped portion 41 for determining a downward position of the BGA package 10 is provided. Thereby, the amount of pushing of the contact pin 20 can be made horizontal and constant.

The contact pins 20 are merely accommodated in the spring accommodating holes 51, are not fixed, and have a structure capable of freely expanding and contracting. Here, since the contact pin 20 does not protrude from the ball guide 50, the tip of the contact pin 20 protrudes from the upper surface of the ball guide 50, so that free expansion and contraction of the contact pin 20 is not hindered.

The test operation of the embodiment configured as described above will be described. In the BGA package 10, the conductive ball 11 contacts the ball guide 50 without being damaged by the positioning pedestal 40, and
Is inserted into. Here, the conductive ball 11 partially enters the inside of the spring housing hole 51, and is placed on the contact pin 20, that is, the spiral coil spring 20a. As described above, the BGA package 10 is not damaged by being guided by the positioning pedestal 40 and placed on the contact pins 20.

Thereafter, as shown in FIG.
When the BGA package 10 is pressed, the contact pins 20 are compressed, and the plurality of turns of the spiral coil spring 20a come into contact with the conductive balls 11. That is, as shown in FIG.
In a, the spiral contact portion comes into contact with the conductive ball 11.

Since the maximum diameter of the spiral coil spring 20a is larger than the diameter of the conductive ball 11, the spiral coil spring 20a contacts the side surface of the spring receiving hole 51. Accordingly, the conductive ball 11 is located at the center of the spiral coil spring 20a, and the diameter of the conductive ball 11 is smaller than that of the spiral coil spring 20a. Not be damaged by contact with the side of

The contact pin 20 freely expands and contracts in the spring receiving hole 51. Here, the contact pin 20
May come into contact with the side surface in the spring receiving hole 51, but even if it does, the spiral coil spring 20a
And the frictional resistance is very small, and does not hinder the free expansion and contraction of the contact pin 20. Thus, since the contact pins 20 freely expand and contract, the conductive balls 11 are not damaged.

As described above, in this embodiment, the conductive balls 11 are not damaged. Also,
Since the contact area between the contact pin 20 and the conductive ball 11 increases, good contact is made.

A fourth embodiment of the socket will be described with reference to FIG. 4A and 4B are schematic views of a main part of a socket according to a fourth embodiment, wherein FIG. 4A is an enlarged sectional view, and FIG. 4B is an enlarged top view of a receiving part. The socket 1 includes a test board 30, a positioning pedestal 40, a ball guide 50, and contact pins 20.

The contact pin 20 comprises a receiving portion 21 and a straight compression coil spring 20c.
It is stored in the spring storage hole 51. The receiving portion 21 has a shape capable of moving within the spring housing hole 51.
As shown in (b), four sharp ridges 21a are provided radially and at equal intervals on the upper surface. Since the ridges 21 a are provided, for example, at an angle of 30 degrees with respect to the center of the conductive ball 11, the four ridges 21 a contact the conductive ball 11. Further, since the ridge 21a is sharp, it is possible to prevent the surface of the conductive ball 11 from being adversely affected by adhesion of foreign matter or the like.

The test board 30 has a structure capable of moving up and down with respect to the ball guide 50 by a fixed amount, and the positioning pedestal 40 is connected to the ball guide 50.
Other structures are the same as in the third embodiment.

The test operation of the embodiment configured as described above will be described. When setting the BGA package 10, the BGA package 10 is fixed to the stepped portion 41 of the positioning pedestal 40 by being pressed from above. Here, the conductive ball 11 is moved by the positioning pedestal 40 so that the spring storage hole 51 is formed.
, And abuts the contact pin 20. At this time, the test board 30 is located at the lower position of the vertical movement. At this position, the spring force is not applied to the straight compression coil spring 20c, but the receiving portion 21 is electrically conductive ball. 11 is in contact.

To perform a test, the test board 30 is moved to the upper point of the vertical movement. By this movement, the contact pin 20 comes into contact with the conductive ball 11 with a spring force corresponding to the movement amount. Here, since the receiving portion 21 is already in contact with the conductive ball 11 and does not move, the risk of damage to the conductive ball 11 due to poor movement of the receiving portion 21 is reduced. Further, when the straight compression coil spring 20c is damaged or has an abnormal expansion or contraction, the contact force of the conductive ball 11 is weakened.
No damage to 1

That is, for example, when the straight compression coil spring 20c is broken, the contact force is weakened and a test failure occurs, but the conductive ball 11 is not damaged.

After the test, the BGA package 10 is removed after the test board 30 moves to the lower point.

As described above, in the present embodiment, the contact pin 20 is moved without the receiving portion 21 moving.
It comes into contact with the conductive ball 11. That is, since the receiving portion 21 does not cause a movement failure, the risk of damaging the conductive ball 11 can be reduced. Further, the contact pins 20 are in good contact with the conductive balls 11 by the ridges 21a of the receiving portions 21.

In the above-described embodiment, an example in which the present invention is configured under specific conditions has been described. However, the present invention includes various embodiments. In the above embodiment, the test board 30 is not limited to the wiring board, and may be, for example, a test board 30 having a structure in which the contact 30 having a connection part to the outside is embedded. Further, a structure in which the contact 31 and the contact pin 20 are joined may be used. Further, the present invention is not limited to the contact with the conductive ball 11, and can be used, for example, for the contact in the test of the electronic component 10 having a conductive column similar to the conductive ball 11.

Further, the socket 1 in the third embodiment
In the above, the contact pin 20 is
Is stored in the spring storage hole 51, but is not limited to this structure. That is, the socket 1 may have a structure in which the contact pins 20 protrude from the ball guide 50. Here, the portion of the contact pin 20 protruding from the upper surface of the ball guide 50 can freely expand and contract, so that the contact pin 20 comes into contact with the conductive ball 11 without damage.

[0041]

As described above, according to the contact pin of the present invention, by using the contact pin utilizing the compression coil spring or the spiral compression coil spring, the arc-shaped or spiral-shaped contact portion is made conductive. Contact with the ball can be ensured. Further, the compression coil spring can freely expand and contract without any possibility of occurrence of abnormality in the sliding portion, and therefore does not damage the conductive ball.

As described above, according to the socket of the present invention, a good connection to the conductive ball can be made by effectively utilizing the features of the contact pin according to the present invention. Further, the conductive balls are not damaged.

[Brief description of the drawings]

FIG. 1 is a schematic view of a contact pin according to a first embodiment, in which (a) is an enlarged view and (b) is an enlarged view at the time of contact.

FIGS. 2A and 2B are schematic diagrams of contact pins according to a second embodiment, wherein FIG. 2A is an enlarged view and FIG. 2B is an enlarged view at the time of contact.

3A and 3B are schematic views of a socket according to a third embodiment, in which FIG. 3A is an enlarged sectional view of a main part, and FIG. 3B is an enlarged sectional view at the time of contact.

4A and 4B are schematic views of a socket according to a fourth embodiment, in which FIG. 4A is an enlarged sectional view of a main part, and FIG. 4B is an enlarged sectional view at the time of contact.

FIGS. 5A and 5B are schematic diagrams of trajectories formed by contact portions of a coil spring. FIG. 5A is a schematic diagram of a contact portion of a spiral coil spring, and FIG. 5B is a schematic diagram of a contact portion of a straight compression coil spring. FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket 10 BGA package 11 Conductive ball 20 Contact pin 20a Helical compression coil spring 20b Upper spiral compression coil spring 20c Straight compression coil spring 21 Receiving part 21a Protrusions 30 Test board 31 Contact 40 Positioning base 41 Stepped part 50 Ball guide 51 Spring storage hole F Pressing force

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI H01R 13/11 H01R 13/11 G K 13/24 13/24

Claims (5)

(57) [Claims] 1. An electronic component including a wiring board and a semiconductor chip.
Contact pins that contact the conductive balls of When the contact pin is formed by a spiral compression coil spring
In both cases, the winding diameter of this compression coil spring is
Spiral shape that gradually spreads to the conductive ball side
Contact pin characterized by the following. 2. Electronic components including a wiring board and a semiconductor chip.
Contact pins that contact the conductive balls of When the contact pin is formed by a spiral compression coil spring
In both cases, gradually increase the winding diameter of this compression coil spring
A spiral shape extending toward the conductive ball.
Contact pin. 3. An electronic component including a wiring board and a semiconductor chip.
Contact pins that contact the conductive balls of When the contact pin is formed by a spiral compression coil spring
Both have a sharp convex on the top surface at the end of this compression coil spring.
It is characterized by having a receiving part with a part provided radially
Contact pin. 4. An electronic component including a wiring board and a semiconductor chip.
A socket that is electrically connected to the conductive ball of the
And The contact pin according to claim 1.
When, A tester having a contact at a position corresponding to the conductive ball
Board and The contact pin is located at a position corresponding to the conductive ball.
A ball guide having a storage hole for storing A positioning pedestal for positioning the electronic component.
A socket characterized by doing. 5. The contact guide is provided on the ball guide.
The socket according to claim 4, wherein the socket is protruded.
G.