TWI808090B - Probe and detection socket with the probe - Google Patents

Abstract

The problem to be solved by the present invention is to provide a probe that can be easily adapted to mass production, can reduce manufacturing costs, and can obtain a stable contact state with electrodes such as pads on a substrate for testing, and a detection socket including the same. In order to solve this problem, the probe (100) of the present invention has: a first contact terminal (10), which contacts the solder ball (5) of the object to be detected (4); a second contact terminal (20), which contacts the pad (7) of the printed substrate (6); and a coil spring (81), which energizes the contact terminals (10, 20) in a manner to separate them; wherein the first contact terminal (10) is formed by a first contact element (11) formed by using a rod-shaped metal member; The second contact terminal (20) is constituted by two contact elements (21A, 21B) formed of a plate-shaped metal member, and the two contact elements (21A, 21B) sandwich the first contact element (11) in a state of frictional contact with a part of the first contact element (11).

Description

Probe and detection socket with the probe

The present invention relates to a probe and a detection socket equipped with the probe.

When testing the electrical characteristics of a sample to be tested such as a semiconductor integrated circuit, a probe is used to electrically connect the sample to be tested to a detection substrate on the measuring device side. Such a probe includes: a first contact terminal that contacts an electrode provided on an object to be detected; a second contact terminal that contacts a land provided on a substrate for detection; and an elastic body that engages the first contact terminal and the second contact terminal and energizes so as to separate the first contact terminal from the second contact terminal. Also, a probe is known that includes: a first contact terminal having a cylindrical portion; and a second contact terminal having a cylindrical portion formed with a hole; and the probe is configured by inserting the cylindrical portion of the first contact terminal into the hole of the cylindrical portion of the second contact terminal (for example, refer to Patent Document 1).

[Prior Art Document] (Patent Document) Patent Document 1: Japanese Patent Laid-Open No. 2010-256251

In the probe described in Patent Document 1, the hole formed in the cylindrical portion of the second contact terminal is required to have a highly accurate inner diameter and coaxiality, and its inner peripheral surface is required to have high smoothness. Therefore, when such a hole is formed by cutting, the processing time becomes longer, which leads to problems in that the mass productivity is lowered and the manufacturing cost is increased. In addition, the probe described in the above-mentioned Patent Document 1 has only one contact portion of the second contact terminal that contacts the pad of the detection substrate. Therefore, for example, if an insulating foreign object is sandwiched between the contact portion and the pad of the detection substrate, the contact state may become unstable.

Therefore, an object of the present invention is to provide a probe that can be easily mass-produced, can reduce manufacturing costs, and can obtain a stable contact state with electrodes such as pads on a substrate for testing, and a detection socket including the same.

(1) The probe of the present invention is a probe that electrically connects the first electrode and the second electrode, and is characterized in that it includes: a first contact terminal that contacts the first electrode; a second contact terminal that contacts the second electrode; The first contact portion; the aforementioned second contact terminal is constituted by a plurality of second contact elements formed by using a plate-shaped metal member, and the plurality of second contact elements are set There is a second contact portion in contact with the second electrode, and clamps the first contact element in a state of frictional contact with a part of the first contact element; the first contact element and the second contact element can move relatively close to or away from the first electrode and the second electrode while being in frictional contact with each other; The aforementioned second contact portion of the second contact element elastically presses against the aforementioned second electrode.

With this configuration, the second contact terminal of the probe of the present invention is constituted by a plurality of second contact elements formed by a plate-shaped metal member, and the second contact elements clamp the first contact elements of the first contact terminal. Therefore, when manufacturing the second contact element, it is not necessary to perform hole processing like the previous second contact terminal having a cylindrical portion. Therefore, it can be easily manufactured using a processing technique such as press processing or etching processing, which is relatively cheap in manufacturing cost. As a result, mass production can be easily performed, and manufacturing cost can be reduced. Moreover, the second contact terminal of the probe of the present invention has a plurality of second contact elements, so there are also plural second contact portions that are in contact with electrodes such as pads of the detection substrate. Therefore, with the probe of the present invention, even when one second contact portion contacts the second electrode in an unstable state, other second contact portions can be reliably brought into contact with the second electrode, so a stable contact state with respect to the second electrode can be obtained.

(2) In the probe of the present invention, each of the second contact elements of the second contact terminal is formed of a planar metal plate.

With this configuration, the probe of the present invention, the second contact element constituting the second contact terminal is formed of a planar metal plate. Therefore, when manufacturing the second contact element, it is not necessary to perform hole processing like the conventional second contact terminal having a cylindrical portion. Therefore, for example, it can be easily manufactured using a processing technique such as punching or etching, which is relatively cheap in manufacturing cost. As a result, mass production can be easily performed, and the manufacturing cost can be reduced.

(3) In the probe of the present invention, the second contact terminal is constituted by two second contact elements arranged to sandwich the first contact element.

With this structure, the second contact terminal of the probe of the present invention is constituted by two second contact elements, so the second contact terminal has a simple structure, and thus can be easily mass-produced and can reduce manufacturing cost.

(4) In the probe of the present invention, the second contact terminal is constituted by three or more second contact elements arranged to surround and sandwich the first contact element.

With this configuration, the second contact terminal of the probe of the present invention is constituted by three or more second contact elements surrounding and sandwiching the first contact element, so the first contact element can be reliably and stably supported at a predetermined position without shaking.

(5) Regarding the probe of the present invention, wherein each of the second contact elements of the second contact terminal has a cross-sectional shape with a concave inner surface; and the second contact terminal is constituted by a plurality of the second contact elements arranged to surround and sandwich the first contact element.

With this configuration, the probe of the present invention is constituted by surrounding and sandwiching the first contact member with the plurality of second contact members having a concave cross-sectional shape on the inner surface, so that the first contact member can be reliably and stably supported at a predetermined position without shaking.

(6) Regarding the probe of the present invention, wherein the coil spring has: a tightly wound portion in which the wire is tightly wound; and a loosely wound portion in which the wire is separately wound at a larger pitch than the tightly wound portion; and the tightly wound portion is provided so as to surround a portion where the first contact element is clamped by the plurality of second contact elements.

With this configuration, in the probe of the present invention, in the coil spring, the tightly wound portion having stronger elasticity than the loosely wound portion surrounds the portion where the first contact element is clamped by the plurality of second contact elements, so the second contact element is not easily separated from the first contact element and the state of frictional contact between the first contact element and the second contact element can be more reliably obtained, and the inclination of the first contact element can be suppressed by the tightly wound portion.

(7) The detection socket of the present invention is characterized by comprising: the above-mentioned probe of the present invention; and a housing formed with a storage portion for storing the above-mentioned probe.

With this configuration, it is possible to provide a test socket according to the present invention in which the probes included in the test socket can be easily mass-produced, the manufacturing cost can be reduced, and a stable contact state can be obtained with electrodes such as pads of the test substrate.

According to the present invention, it is possible to provide a probe that can be easily adapted to mass production, can reduce manufacturing costs, and can obtain a stable contact state with electrodes such as pads on a substrate for testing, and a detection socket including the same.

(First Embodiment) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. First, the configuration will be described.

Fig. 1 (A) and Fig. 1 (B) show a detection socket 200 provided with the probe 100 according to the first embodiment. 2 shows a cross section along line a-a in FIG. 1(A), and FIG. 3 shows the first contact terminal 10 and the second contact terminal 20 constituting the probe 100 according to the first embodiment.

Also, FIG. 4 (A) and FIG. 4 (B) show the state of use of the detection socket 200 in the first embodiment, that is, the state in which the solder balls 5 of the object to be detected 4 are electrically connected to the pads 7 of the printed circuit board 6 by the probe 100 in the first embodiment, and the electrical characteristics of the object to be detected 4 are detected. Here, the solder ball 5 constitutes the first electrode in the present invention, and the pad 7 constitutes the second electrode in the present invention. In addition, the object 4 to be detected is a semiconductor integrated circuit or the like.

As shown in FIG. 4 , the object to be tested 4 is disposed above the testing socket 200 in FIG. 4 , and solder balls 5 are formed on the surface of the object to be tested 4 that faces the testing socket 200 . In addition, the printed circuit board 6 is disposed below the detection socket 200 in FIG. 4 , and the pads 7 are formed on the surface of the printed circuit board 6 that faces the detection socket 200 . Wiring from a current supply circuit and a voltage measurement circuit (not shown) are connected to the printed circuit board 6 .

As shown in FIG. 1 , the detection socket 200 according to the first embodiment includes: the probe 100; In addition, only one probe 100 is shown in FIG. 1 , but the detection socket 200 may have a configuration in which a plurality of probes 100 are supported in a common housing 300 .

As shown in FIG. 1 , the frame body 300 has a first frame body portion 31 and a second frame body portion 32 formed of an electrically insulating material. The first frame body part 31 and the second frame body part 32 are fixed by screws not shown. As shown in FIG. 4 , the first frame portion 31 is arranged on the subject 4 side, and the second frame portion 32 is arranged on the printed circuit board 6 side. In the first frame body part 31, a through hole 31a extending along the direction from the object to be detected 4 toward the printed circuit board 6 in Fig. 4 is formed; in the second frame body part 32, a through hole 32a concentric with the through hole 31a of the first frame body part 31 is formed. In the housing 300 , these through-holes 31 a and 32 a form a housing portion 33 that houses the probe 100 . Also, on the outer side of the through hole 31a of the first frame body part 31, that is, on the edge of the opening on the object to be detected 4 side, an annular protrusion 31b is formed; on the outer side of the through hole 32a of the second frame body part 32, that is, on the edge of the opening on the printed circuit board 6 side, an annular protrusion 32b is formed.

Next, a detailed configuration of the probe 100 according to the first embodiment will be described. As shown in FIG. 1 , the probe 100 of the first embodiment includes: a first contact terminal 10 that contacts the solder ball 5 of the object to be detected 4; a second contact terminal 20 that contacts the pad 7 of the printed circuit board 6;

As shown in FIGS. 1 and 3, the first contact terminal 10 is constituted by a first contact element 11 formed by utilizing a rod-shaped metal member, and a first contact portion 11e that contacts the solder ball 5 of the object to be detected 4 is provided on the first contact element 11. The first contact element 11, in the direction from top to bottom in Figures 1 and 3, that is, in the direction from the object to be detected 4 toward the printed circuit board 6 in Figure 4, has a large-diameter portion 11a, a middle-diameter portion 11b with a smaller diameter than the large-diameter portion 11a, and a small-diameter portion 11c with a smaller diameter than the middle-diameter portion 11b, and further has a flange portion 11d between the large-diameter portion 11a and the middle-diameter portion 11b. The large-diameter part 11a, the middle-diameter part 11b, the small-diameter part 11c, and the flange part 11d are formed concentrically. Moreover, the large-diameter part 11a and the middle-diameter part 11b have substantially the same length. The small-diameter portion 11c has a slightly longer length than the total length of the large-diameter portion 11a and the middle-diameter portion 11b.

The first contact element 11 has a first contact portion 11e that contacts the solder ball 5 at the tip of the large-diameter portion 11a. The first contact portion 11e has a plurality of sharp protrusions 11f formed in the circumferential direction, and the first contact portion 11e is configured to contact the solder ball 5 inside these protrusions 11f. The first contact element 11 is housed in the housing part 33 of the housing 300 so as to be movable along the extending direction of the housing part 33 in a state where the flange part 11d can be engaged with the protrusion part 31b.

As shown in FIGS. 1 to 4 , the second contact terminal 20 is constituted by a pair, that is, two second contact elements 21A, 21B having the same configuration. Each of the second contact elements 21A and 21B is formed of a flat metal plate, provided with a second contact portion 21e in contact with the pad 7 of the printed circuit board 6, and sandwiches the first contact element 11 while being in frictional contact with a part of the first contact element 11. These second contact elements 21A, 21B are arranged in the housing portion 33 of the housing 300 so as to sandwich the small-diameter portion 11c of the first contact element 11 .

As shown in FIG. 1 and FIG. 3, the second contact elements 21A, 21B each have a first plate portion 21a and a second plate portion 21b formed on the side of the printed circuit board 6 of the first plate portion 21a with a width larger than that of the first plate portion 21a, and further have a spring engagement portion 21c between the first plate portion 21a and the second plate portion 21b having the same width as the second plate portion 21b. In addition, the second contact elements 21A and 21B each have a front end plate portion 21d having a width smaller than that of the second plate portion 21b at the front end of the second plate portion 21b, and a semicircular second contact portion 21e is formed at the front end of the front end plate portion 21d, and step portions 21f are formed on both sides between the front end plate portion 21d and the second plate portion 21b.

As shown in FIGS. 1 and 2 , the second contact elements 21A and 21B are arranged such that, in the storage portion 33 of the frame body 300 , the first plate portion 21 a faces the first frame body portion 31 side and sandwiches the first contact element 11 in parallel, and the portion extending from the first plate portion 21 a to the spring engaging portion 21 c is sandwiched by the front end side of the small-diameter portion 11 c of the first contact element 11 . Furthermore, the second contact elements 21A and 21B are housed in the housing part 33 of the housing 300 so as to be movable along the extending direction of the housing part 33 in a state where the step part 21f can be engaged with the protrusion part 32b. As shown in FIG. 2 , in the probe 100 according to the first embodiment, the small-diameter portion 11c of the first contact element 11 can contact the central portion in the width direction of the second contact elements 21A, 21B.

In the use state of the detection socket 200 as shown in FIG. 4, the first contact element 11 and the second contact elements 21A, 21B can move in a manner of relatively approaching or moving away from the solder ball 5 of the object to be detected 4 and the solder pad 7 of the printed circuit board 6 while being in frictional contact with each other.

As shown in FIG. 1 , the elastic body 8 of the first embodiment is constituted by a coil spring 81 that elastically presses the first contact portion 11 e of the first contact element 11 against the solder ball 5 of the object 4 to be tested, and elastically presses the second contact portions 21 e of the second contact elements 21A, 21B against the pad 7 of the printed circuit board 6 . The coil spring 81 has a form in which the pitches (pitches) between the wound wires are almost equally spaced apart.

Regarding the probe 100 of the first embodiment, the first contact element 11 and the second contact elements 21A, 21B are electrically connected by the coil spring 81 . Accordingly, the probe 100 of the first embodiment is configured to conduct conduction between the solder balls 5 of the object to be tested 4 contacted by the first contact portions 11e of the first contact elements 11 and the pads 7 of the printed circuit board 6 contacted by the second contact portions 21e of the second contact elements 21A and 21B.

As shown in FIG. 1 , one end of the coil spring 81 is engaged with the flange portion 11 d of the first contact member 11 in a compressed state, and the other end is engaged with each spring engaging portion 21 c of the second contact members 21A, 21B. Accordingly, the coil spring 81 is provided to surround most of the first contact element 11 from the middle diameter portion 11b to the small diameter portion 11c, and to surround each first plate portion 21a of the second contact elements 21A, 21B. As shown in FIG. 4 , the first contact element 11 uses the energizing force (urging force) of the coil spring 81 to engage the flange portion 11d on the surface on the inner side of the protrusion 31b of the first frame portion 31, and make the large diameter portion 11a protrude from the first frame portion 31 toward the object 4 to be detected. In the second contact elements 21A and 21B, the stepped portions 21f are engaged with the inner edge of the protrusion 32b, and the second contact portion 21e protrudes from the second frame portion 32 toward the printed circuit board 6 .

Next, the operation will be described. The second contact terminal 20 of the probe 100 of the detection socket 200 according to the first embodiment configured as above is constituted by two second contact elements 21A, 21B formed of a planar metal plate, and the two second contact elements 21A, 21B sandwich the first contact element 11 of the first contact terminal 10 . Therefore, when manufacturing the second contact elements 21A, 21B, it is not necessary to perform hole processing like the conventional second contact terminal having a cylindrical portion, and can be easily manufactured using, for example, relatively cheap manufacturing techniques such as punching or etching. As a result, the probe 100 according to the first embodiment can be easily mass-produced, and the manufacturing cost can be reduced. Moreover, since the second contact terminal 20 of the probe 100 of the first embodiment is constituted by the two second contact elements 21A and 21B, the second contact terminal 20 has a simple structure. From this point of view, mass production can be easily performed, and the manufacturing cost can be reduced.

Moreover, since the second contact terminal 20 of the probe 100 of the first embodiment has two second contact elements 21A and 21B, it has two second contact portions 21e to contact the pads 7 of the printed circuit board 6 . Therefore, for example, even when an insulating foreign matter is caught between the second contact portion 21e of one second contact element 21A and the pad 7, causing the second contact portion 21e to come into contact with the pad 7 in an unstable state, the second contact portion 21e of the other second contact element 21B can surely contact the pad 7, so a stable contact state with respect to the pad 7 can be obtained.

Next, a modified example of the first embodiment will be described. The modified example described below is different from the above-mentioned first embodiment in the point of the second contact element constituting the second contact terminal 20 in the above-mentioned first embodiment. Therefore, in the following description, the same reference numerals are assigned to the same constituent elements as those of the above-mentioned first embodiment, and only the points of difference from the above-mentioned first embodiment will be described.

(Modification 1) Modification 1 will be described using FIG. 5 . In the above-mentioned first embodiment, the second contact terminal 20 is composed of two second contact elements 21A, 21B composed of planar metal plates, but the second contact terminal 20 of Modification 1 is composed of three aforementioned second contact elements 21A, 21B, 21C composed of planar metal plates arranged to surround and sandwich the first contact element 11 . The second contact element 21C has the same configuration as the second contact elements 21A and 21B. That is, the second contact terminal 20 of Modification 1 is configured by adding a second contact element 21C to the second contact terminal 20 of the first embodiment described above.

As shown in FIG. 5 , in Variation 1, three second contact elements 21A, 21B, and 21C are arranged in the shape of a regular triangle in plan view, and the central portions in the width direction of these second contact elements 21A, 21B, and 21C contact the small-diameter portion 11c of the first contact element 11 .

Variation 1 is composed of three second contact elements 21A, 21B, and 21C constituting the second contact terminal 20 that surround and clamp the first contact element 11, so that the first contact element 11 can be reliably and stably supported at a predetermined position without shaking.

In addition, the second contact terminal 20 of the aforementioned variation 1 is constituted by three second contact elements 21A, 21B, and 21C formed of a flat metal plate, but the second contact terminal of the probe of the present invention may also be formed by surrounding and sandwiching the first contact element 11 by four or more second contact elements composed of a flat metal plate.

(Variation 2) Variation 2 will be described using FIG. 6 . The second contact terminal 20 in Variation 2 is composed of two second contact elements 23A, 23B arranged so as to surround and sandwich the first contact element 11 and have a cross-sectional shape with a concave inner surface. The second contact elements 23A and 23B of the second modification example can bend the second contact element 21A of the above-mentioned first embodiment with the center line in the center in the width direction as the bending line so as to form a nearly right angle and have a V-shaped cross section. That is, although not shown, the second contact elements 23A, 23B of the second modification have the same first plate portion 21a, second plate portion 21b, spring engagement portion 21c, front end plate portion 21d, and step portion 21f as the second contact element 21A of the first embodiment, and second contact portions 21e that contact the pads 7 of the printed circuit board 6 at the front ends of the second contact elements 23A, 23B.

As shown in FIG. 6 , in Variation 2, the two second contact elements 23A, 23B are disposed so that the valley sides, that is, the inner sides thereof face each other to surround and sandwich the first contact element 11 . In addition, the top of the curved portion on the outer surface side and both side edges on the outer surface side of the second contact elements 23A, 23B contact the inner peripheral surface of the coil spring 81 .

Variation 2 is composed of two second contact elements 23A, 23B having concave inner surfaces in cross-section to surround and sandwich the first contact element 11, so that the first contact element 11 can be reliably and stably supported at a predetermined position without shaking.

In addition, the second contact elements 23A and 23B of the aforementioned modification 2 have a V-shaped cross-sectional shape, but as the second contact element having a concave inner surface cross-sectional shape related to the present invention, it is not limited to having a V-shaped cross-sectional shape, and the cross-sectional shape can also be various shapes, as long as at least the first contact element is sandwiched. The inner surface is a concave cross-sectional shape.

(Second Embodiment) Next, a second embodiment will be described with reference to FIG. 7 . The second embodiment is obtained by changing the form of the coil spring 81 in the above-mentioned first embodiment, and other configurations are the same, so in the following description, the same components as those in the above-mentioned first embodiment will be assigned the same symbols, and only the differences from the above-mentioned first embodiment will be described.

In the coil spring 81 in the above-mentioned first embodiment, the pitches between the coiled wires are separated at almost equal pitches, but the coil spring 81 in the second embodiment as shown in FIG. The loose winding portion 81b is arranged around the portion of the first contact element 11 that is not clamped by the second contact elements 21A, 21B; the tight winding portion 81a is arranged to surround the periphery of each first plate portion 21a of the second contact elements 21A, 21B, that is, surround the small diameter portion 11c of the second contact element 21A, 21B that clamps the first contact element 11. The second contact terminal 20 according to the second embodiment is arranged such that the outer side edges of the second contact elements 21A and 21B abut against the inner peripheral surface of the tightly wound portion 81 a of the coil spring 81 .

In the probe 100 according to the second embodiment, the tightly wound portion 81a having stronger elasticity than the loosely wound portion 81b in the coil spring 81 has a structure surrounding a portion where the first contact element 11 is sandwiched by the two second contact elements 21A, 21B. Therefore, in the probe 100 related to the second embodiment, the second contact elements 21A, 21B are not easily separated from the first contact element 11, and the frictional contact state between the first contact element 11 and the second contact elements 21A, 21B can be reliably obtained, and the inclination of the first contact element 11 can be suppressed by the closely wound portion 81a.

In addition, regarding the coil spring 81 of the second embodiment, the tightly wound portion 81a and the loosely wound portion 81b are integrally configured, but a tightly wound spring may be used instead of the tightly wound portion 81a, and a loosely wound spring may be used instead of the loosely wound portion 81b to form a structure divided into two objects.

(Third Embodiment) Next, a third embodiment will be described with reference to FIGS. 8 to 12 . In the third embodiment described below, the contact objects of the first contact terminal 10 and the second contact terminal 20 in the probe 100 related to the first embodiment and the second embodiment are provided inversely. Therefore, in the following description, the same reference numerals are assigned to the same constituent elements as those of the first embodiment and the second embodiment, and only the differences from the first embodiment and the second embodiment will be described.

8(A) and 8(B) show a detection socket 200 provided with the probe 100 according to the third embodiment. 9 shows a cross section along line f-f in FIG. 8(A), and FIG. 10 shows the first contact terminal 10 and the second contact terminal 20 constituting the probe 100 according to the third embodiment.

In the third embodiment, plate-shaped electrode pads 5B are provided instead of the solder balls 5 on the object to be detected 4 in the first and second embodiments described above. Moreover, the bonding pad 7B is provided on the printed circuit board 6 similarly to 1st Embodiment and 2nd Embodiment. In the probe 100 related to the above-mentioned first embodiment and the second embodiment, the first contact terminal 10 is configured to contact the solder ball 5 of the object 4 to be detected, and the second contact terminal 20 is configured to contact the pad 7 of the printed circuit board 6 . In the third embodiment, the pad 7B constitutes the first electrode in the present invention, and the electrode pad 5B constitutes the second electrode in the present invention.

As shown in FIGS. 8 and 10, the first contact terminal 10 of the third embodiment is constituted by a first contact element 110 formed of a rod-shaped metal member, and a first contact portion 110e that contacts the pad 7B of the printed circuit board 6 is provided on the first contact element 110. The first contact element 110 has a large-diameter portion 110a, a middle-diameter portion 110b with a smaller diameter than the large-diameter portion 110a, and a small-diameter portion 110c with a smaller diameter than the middle-diameter portion 110b in the direction from the printed circuit board 6 to the object 4 to be detected, and further has a flange portion 110d between the large-diameter portion 110a and the middle-diameter portion 110b. The large-diameter part 110a, the middle-diameter part 110b, the small-diameter part 110c, and the flange part 110d are formed concentrically. Furthermore, the middle diameter portion 110b has a length approximately twice that of the large diameter portion 110a, and the small diameter portion 110c has a length slightly longer than the total length of the large diameter portion 110a and the middle diameter portion 110b.

The first contact element 110 has a first contact portion 110e that contacts the pad 7B at the front end of the large-diameter portion 110a. As shown in FIG. 8, the front end portion of the large-diameter portion 110a on the pad 7B side is formed in a conical shape, and a first contact portion 110e is formed at the front end. The first contact element 110 is housed in the housing part 33 of the housing 300 so as to be movable along the extending direction of the housing part 33 in a state where the flange part 110d can be engaged with the protrusion part 32b.

As shown in FIGS. 8 and 10 , the second contact terminal 20 of the third embodiment is constituted by a pair, that is, two second contact elements 210A and 210B having the same configuration. Each of the second contact elements 210A and 210B is formed of a planar metal plate, is provided with a second contact portion 210e that contacts the electrode pad 5B of the object 4 to be detected, and is configured to sandwich the first contact element 110 while being in frictional contact with a part of the first contact element 110 . These second contact elements 210A, 210B are arranged in the housing portion 33 of the housing 300 so as to sandwich the small diameter portion 110 c of the first contact element 110 .

As shown in FIGS. 8 and 10, the second contact elements 210A and 210B each have a first plate portion 210a and a second plate portion 210b formed on the object-to-be-detected 4 side of the first plate portion 210a with a width larger than that of the first plate portion 210a, and between the first plate portion 210a and the second plate portion 210b, there is a spring engaging portion 210c having the same width as the second plate portion 210b. In addition, the second contact elements 210A and 210B each have a front end plate portion 210d having a width smaller than that of the second plate portion 210b at the front end of the second plate portion 210b, and a second contact portion 210e is formed at the front end of the front end plate portion 210d, and step portions 210f are formed on both sides between the front end plate portion 210d and the second plate portion 210b. The second contact portion 210e has two sharp protrusions 210g, and the second contact portion 210e is configured such that the electrode pad 5B comes into contact with these protrusions 210g.

As shown in FIG. 8 , the second contact elements 210A and 210B are arranged such that, in the storage portion 33 of the frame body 300 , the first plate portion 210 a faces the second frame body portion 32 side and sandwiches the first contact element 110 in parallel, and the portion extending from the first plate portion 210 a to the spring engaging portion 210 c is sandwiched by the front end side of the small-diameter portion 110 c of the first contact element 110 . In addition, the second contact elements 210A and 210B are housed in the housing part 33 of the housing 300 so as to be movable along the extending direction of the housing part 33 in a state where the step part 210f can be engaged with the protrusion part 31b. As shown in FIG. 9 , in the probe 100 according to the third embodiment, the small-diameter portion 110c of the first contact element 110 can contact the central portion in the width direction of the second contact elements 210A, 210B.

In the state of use of the detection socket 200 as shown in FIG. 8, the first contact element 110 and the second contact elements 210A, 210B of the third embodiment can move relatively close to or away from the pad 7B of the printed circuit board 6 and the electrode pad 5B of the object 4 to be detected while being in frictional contact with each other.

As shown in FIG. 8, the coil spring 81 constituting the elastic body 8 of the third embodiment is formed by elastically pressing the first contact portion 110e of the first contact element 110 against the pad 7B of the printed circuit board 6, and elastically pressing the second contact portions 210e of the second contact elements 210A and 210B against the electrode pad 5B of the object 4 to be detected.

Regarding the probe 100 of the third embodiment, the first contact element 110 and the second contact elements 210A, 210B are electrically connected by the coil spring 81 . Accordingly, the probe 100 of the third embodiment is configured to conduct conduction between the pad 7B of the printed circuit board 6 contacted by the first contact portion 110e of the first contact element 110 and the electrode pad 5B of the object to be tested 4 contacted by the second contact portions 210e of the second contact elements 210A and 210B.

As shown in FIG. 8, one end of the coil spring 81 is engaged with the flange portion 110d of the first contact member 110 in a compressed state, and the other end is engaged with each spring engaging portion 210c of the second contact member 210A, 210B. Accordingly, the coil spring 81 is provided to surround most of the first contact element 110 from the middle diameter portion 110b to the small diameter portion 110c and to surround the first plate portions 210a of the second contact elements 210A, 210B.

As shown in FIG. 8, the coil spring 81 of the third embodiment has, similarly to the second embodiment described above, a closely wound portion 81a in which the wire is tightly wound; and a loosely wound portion 81b in which the wire is wound separately at a larger pitch than the tightly wound portion 81a. In the third embodiment, the loosely wound portion 81b is provided around the portion of the first contact element 110 that is not sandwiched by the second contact elements 210A, 210B; the tightly wound portion 81a is provided around the respective first plate portions 210a of the second contact elements 210A, 210B. As shown in FIG. 9 , the second contact terminal 20 according to the third embodiment is arranged such that the outer side edges of the second contact elements 210A and 210B abut on the inner peripheral surface of the tightly wound portion 81 a of the coil spring 81 .

In addition, the coil spring 81 has a tightly wound portion 81a and a loosely wound portion 81b integrally formed. However, a tightly wound spring may be used instead of the tightly wound portion 81a, and a loosely wound spring may be used instead of the loosely wound portion 81b to form two separate objects.

Next, the operation will be described. The second contact terminal 20 of the probe 100 according to the third embodiment is constituted by two second contact elements 210A, 210B formed of a planar metal plate, and the two second contact elements 210A, 210B sandwich the first contact element 110 of the first contact terminal 10 . Therefore, when manufacturing the second contact elements 210A and 210B, drilling processing or the like is not required, and they can be easily manufactured using, for example, relatively inexpensive manufacturing techniques such as press processing and etching. Therefore, the probe 100 related to the third embodiment can be easily mass-produced, and the manufacturing cost can be reduced. In addition, since the second contact terminal 20 of the probe 100 of the third embodiment is constituted by two second contact elements 210A and 210B, the second contact terminal 20 has a simple structure, and from this point of view, it can be easily mass-produced and the manufacturing cost can be reduced.

Also, since the second contact terminal 20 of the probe 100 of the third embodiment has two second contact elements 210A and 210B, it has two second contact portions 210e for contacting the electrode pad 5B of the object 4 to be tested. Therefore, for example, even when an insulating foreign matter is caught between the second contact portion 210e of one second contact element 210A and the electrode pad 5B, causing the second contact portion 210e to contact the electrode pad 5B in an unstable state, the second contact portion 210e of the other second contact element 210B can surely contact the electrode pad 5B, so a stable contact state with respect to the electrode pad 5B can be obtained.

Further, in the probe 100 according to the third embodiment, the tightly wound portion 81a having stronger elasticity than the loosely wound portion 81b in the coil spring 81 has a configuration surrounding a portion where the first contact element 110 is sandwiched by the two second contact elements 210A, 210B. Therefore, in the probe 100 according to the third embodiment, the second contact elements 210A, 210B are not easily separated from the first contact element 110, and the frictional contact state between the first contact element 110 and the second contact elements 210A, 210B can be reliably obtained, and the inclination of the first contact element 110 can be suppressed by the closely wound portion 81a.

(Modifications) In the third embodiment, the first and second modifications of the above-mentioned first embodiment can be similarly applied. That is, as shown in FIG. 11 , in the third embodiment, three second contact elements 210A, 210B, and 210C formed of planar metal plates are arranged in a regular triangle shape in plan view, thereby forming a small-diameter portion 110c that sandwiches the first contact element 110 by the three second contact elements 210A, 210B, and 210C. The second contact element 210C has the same configuration as the second contact elements 210A and 210B.

In the modification shown in FIG. 11, the first contact element 110 is surrounded and clamped by the three second contact elements 210A, 210B, and 210C constituting the second contact terminal 20, so that the first contact element 110 can be reliably and stably supported at a predetermined position without shaking.

In addition, as shown in FIG. 12, in the third embodiment, the small-diameter portion 11c of the first contact member 110 can be sandwiched by two second contact members 230A and 230B, which have a V-shaped cross-section and are arranged so that the valley side, that is, the inner side, faces each other. The second contact elements 230A and 230B can bend the second contact element 210A of the above-mentioned third embodiment with the center line in the center of the width direction as the bending line to form a nearly right-angled angle. The tip of the 230B has a second contact portion 210e, and the two protrusions 210g included in the second contact portion 210e contact the electrode pad 5B of the object 4 to be detected.

In the modified example shown in FIG. 12, the first contact element 110 is surrounded and sandwiched by two second contact elements 230A and 230B having a concave cross-sectional shape on the inner surface, so that the first contact element 110 can be reliably and stably supported at a predetermined position without shaking.

[Industrial Applicability] The probe of the present invention and the detection socket equipped with the probe can be easily mass-produced, and the manufacturing cost can be reduced, and a stable contact state can be obtained with electrodes such as pads of the detection substrate, so it is beneficial to the probe used when testing the electrical characteristics of semiconductor integrated circuits and the like and the detection socket equipped with the probe.

4‧‧‧Subject to be detected 5‧‧‧Solder ball (first electrode) 5B‧‧‧Electrode pad (second electrode) 6‧‧‧Printed substrate 7‧‧‧Welding pad (second electrode) 7B‧‧‧Welding pad (first electrode) 8‧‧‧Elastic body 10‧‧‧First contact terminal 11, 110‧‧‧First contact element 11a, 110a‧‧‧Large diameter part 11b, 110b‧‧‧Medium diameter part 11c, 110c‧‧‧ Small diameter portion 11d, 110d‧‧‧flange portion 11e, 110e‧‧‧first contact portion 11f, 210g‧‧‧protrusion 20‧‧‧second contact terminal 21A, 21B, 21C, 23A, 23B, 210A, 210B, 210C, 230A, 230B‧‧‧second contact element 21a, 210a‧‧‧first plate portion 21b, 210 b‧‧‧Second plate portion 21c, 210c‧‧‧spring engaging portion 21d, 210d‧‧‧Front plate portion 21e, 210e‧‧‧Second contact portion 21f, 210f‧‧‧Step portion 31‧‧‧First frame body portion 31a‧‧‧Through hole 31b of the first frame body portion‧‧Protruding portion 32 of the first frame body portion‧‧‧Second frame body portion 32a‧‧‧Through-through of the second frame body portion Hole 32b‧‧‧Protruding portion 33 of the second frame body‧‧‧Accommodating portion 81‧‧‧Coil spring 81a‧‧‧Tightly wound portion 81b‧‧‧Loosely wound portion 100‧‧‧Probe 200‧‧‧Detecting socket 300‧‧‧Frame a-a, b-b, c-c, d-d, e-e, f-f‧‧‧hatching

Fig. 1 is a diagram showing a detection socket equipped with a probe according to a first embodiment of the present invention; wherein, Fig. 1 (A) is a longitudinal sectional view of the detection socket, and Fig. 1 (B) is a sectional view along line b-b of Fig. 1 (A). Fig. 2 is a sectional view along line a-a in Fig. 1 (A). Fig. 3 is a perspective view showing a first contact terminal and a second contact terminal constituting the probe according to the first embodiment of the present invention. Fig. 4 is a diagram showing the state of use of the detection socket according to the first embodiment of the present invention; wherein, Fig. 4 (A) is a longitudinal sectional view of the detection socket, and Fig. 4 (B) is a sectional view along line c-c of Fig. 4 (A). Fig. 5 is a diagram showing Modification 1 of the probe according to the first embodiment of the present invention, and is a cross-sectional view corresponding to line a-a in Fig. 1(A). Fig. 6 is a diagram showing a modified example 2 of the probe according to the first embodiment of the present invention, and is a cross-sectional view corresponding to the line a-a in Fig. 1(A). Fig. 7 is a diagram showing a state of use of a detection socket equipped with a probe according to a second embodiment of the present invention; wherein Fig. 7 (A) is a longitudinal sectional view of the detection socket, and Fig. 7 (B) is a sectional view along line d-d of Fig. 7 (A). Fig. 8 is a diagram showing a state of use of a detection socket equipped with a probe according to a third embodiment of the present invention; wherein Fig. 8 (A) is a longitudinal sectional view of the detection socket, Fig. 8 (B) is a sectional view along line e-e of Fig. 8 (A), and Fig. 9 is a sectional view along line f-f of Fig. 8 (A). Fig. 10 is a perspective view showing a first contact terminal and a second contact terminal constituting a probe according to a third embodiment of the present invention. Fig. 11 is a diagram showing a modified example of the probe according to the third embodiment of the present invention, and is a cross-sectional view corresponding to line f-f in Fig. 8(A). Fig. 12 is a diagram showing another modified example of the probe according to the third embodiment of the present invention, and is a cross-sectional view corresponding to line f-f in Fig. 8(A).

Domestic deposit information (please note in order of depositor, date, and number) None

Overseas storage information (please note in order of storage country, institution, date, number) None

4‧‧‧Species to be tested

5‧‧‧Solder ball (first electrode)

6‧‧‧Printed Substrate

7‧‧‧Pad (second electrode)

8‧‧‧Elastomer

10‧‧‧The first contact terminal

11‧‧‧First contact element

11a‧‧‧Large diameter department

11b‧‧‧Intermediate diameter part

11c‧‧‧Trail Department

11d‧‧‧flange

11e‧‧‧first contact part

11f‧‧‧Protrusion

20‧‧‧The second contact terminal

21A, 21B‧‧‧second contact element

21a‧‧‧The first board

21b‧‧‧The second board

21c‧‧‧Spring engaging part

21d‧‧‧Front plate part

21e‧‧‧second contact part

21f‧‧‧Segment difference department

31‧‧‧The first frame

31a‧‧‧Through hole of the first frame part

31b‧‧‧Protruding part of the first frame part

32‧‧‧The second frame part

32a‧‧‧Through hole of the second frame part

32b‧‧‧Protruding part of the second frame part

33‧‧‧Storage Department

81‧‧‧Coil spring

100‧‧‧probes

200‧‧‧Detection socket

300‧‧‧frame

c-c‧‧‧hatching

Claims (7)

A probe for electrically connecting a first electrode to a second electrode, characterized by comprising: a first contact terminal that contacts the first electrode; a second contact terminal that contacts the second electrode; and an elastic body that engages the first contact terminal and the second contact terminal and energizes the first contact terminal from the second contact terminal; wherein the first contact terminal is formed by a first contact element formed of a round rod-shaped metal member, and the first contact element is provided with a first contact portion that contacts the first electrode. The second contact terminal is constituted by a plurality of second contact elements formed by using a plate-shaped metal member, and the second contact elements are provided with a second contact portion in contact with the second electrode, and clamp the first contact element in a state of frictional contact with a part of the first contact element; At least a part of the contact element, the coil spring elastically presses the first contact portion of the first contact element against the first electrode, and elastically presses the second contact portion of the second contact element against the second electrode. The probe as described in claim item 1, wherein the aforementioned second interface The above-mentioned second contact elements of the contact terminal are formed by a planar metal plate. The probe according to claim 2, wherein the second contact terminal is constituted by two second contact elements arranged to sandwich the first contact element. The probe according to claim 2, wherein the second contact terminal is constituted by three or more second contact elements arranged to surround and sandwich the first contact element. The probe according to claim 1, wherein each of the second contact elements of the second contact terminal has a cross-sectional shape with a concave inner surface; and the second contact terminal is formed by a plurality of the second contact elements arranged to surround and sandwich the first contact element. The probe according to claim 1, wherein the coil spring has: a tightly wound portion, the wire of which is tightly wound; and a loosely wound portion, wherein the wire is separately wound at a larger pitch than the tightly wound portion; and the tightly wound portion is arranged to surround a portion where the first contact element is clamped by the plurality of second contact elements. A detection socket, characterized by comprising: the probe according to any one of Claims 1 to 6; and a frame body formed with a storage portion for storing the probe.