JP7473810B2 - Probes and Inspection Equipment - Google Patents

Probes and Inspection Equipment Download PDF

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JP7473810B2
JP7473810B2 JP2020133356A JP2020133356A JP7473810B2 JP 7473810 B2 JP7473810 B2 JP 7473810B2 JP 2020133356 A JP2020133356 A JP 2020133356A JP 2020133356 A JP2020133356 A JP 2020133356A JP 7473810 B2 JP7473810 B2 JP 7473810B2
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隆史 小薮
正輝 堀
尚徳 小野
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ダイトロン株式会社
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Description

本発明は、被検査体の電極に対して電気的な接続を行うプローブ及び、そのプローブを用いた検査装置に関する。 The present invention relates to a probe that electrically connects to an electrode of an object under test, and to a testing device that uses the probe.

レーザやIC等の半導体素子は、製造後に性能を評価するため、被検査対象の半導体素子の電極にプローブを接触させて通電し、半導体素子を動作させて性能評価や各種の電気特性測定といった検査が行われている。 In order to evaluate the performance of semiconductor elements such as lasers and ICs after manufacturing, a probe is placed in contact with the electrodes of the semiconductor element being tested, electricity is passed through the semiconductor element, and the semiconductor element is operated to evaluate its performance and measure various electrical characteristics.

このような検査では、電極にプローブを接触させる際にプローブの形状が変形してキャパシタンスが変化しやすいため、パルス状の駆動電源を入力する検査について正確な評価ができないおそれがある。 In this type of testing, the shape of the probe is easily deformed when it is brought into contact with the electrode, which can change the capacitance, making it difficult to accurately evaluate tests that use a pulsed driving power supply.

これに対して、一対の平状配線材の面を対面配置し、各平状配線材を通じて半導体素子の電極に正電位及び負電位を与える検査装置が提案されている(例えば、特許文献1参照)。 In response to this, an inspection device has been proposed in which a pair of flat wiring members are arranged with their surfaces facing each other, and a positive potential and a negative potential are applied to the electrodes of a semiconductor element through each of the flat wiring members (see, for example, Patent Document 1).

特開2012-225867号公報JP 2012-225867 A

しかしながら、特許文献1の検査装置では、複数のプローブがスプリングによって伸縮自在に設けられたプローブユニットと半導体素子の電極との距離を調整することで、電極にプローブを所定の押圧力で押し付けるため、プローブを電極に接触させるための構造が複雑となりやすい。 However, in the inspection device of Patent Document 1, the distance between the probe unit, in which multiple probes are provided so as to be freely stretched and contracted by springs, and the electrodes of the semiconductor element is adjusted to press the probes against the electrodes with a predetermined pressure force, which can easily result in a complex structure for contacting the probes with the electrodes.

本発明は、上記の点に鑑みてなされたものであり、簡単な構成によって電極にプローブを接触させる際にキャパシタンスが変化しにくく正確に被検査対象物を検査することができるプローブ及び検査装置を提供することを目的とする。 The present invention has been made in consideration of the above points, and aims to provide a probe and inspection device with a simple configuration that is less likely to change capacitance when the probe is brought into contact with the electrode, and that can accurately inspect an object to be inspected.

本発明にかかるプローブは、複数の板状の導電性部材が絶縁状態で積層された本体部と、1の前記導電性部材が他の前記導電性部材と重ならないように前記本体部から突出した接点部を前記導電性部材毎に設けたコンタクト部とを備え、1の前記導電性部材に前記接点部が複数設けられ、他の前記導電性部材に設けられた前記接点部が、1の前記導電性部材に前記接点部の間に配置され、前記本体部及び前記コンタクト部の少なくとも一方を弾性変形させて前記接点部を被検査対象物に接触させるプローブ。
The probe of the present invention comprises a main body portion in which a plurality of plate-shaped conductive members are stacked in an insulated state, and a contact portion in which a contact portion protruding from the main body portion is provided for each of the conductive members so that one of the conductive members does not overlap with the other conductive members , wherein a plurality of the contact portions are provided on one of the conductive members, and the contact portions provided on the other conductive members are disposed between the contact portions on the one of the conductive members, and the probe elastically deforms at least one of the main body portion and the contact portion to bring the contact portions into contact with an object to be inspected.

本発明にかかる検査装置は、被検査対象物に接触するプローブと、前記プローブを被検査対象物に押し付ける押圧部とを備える検査装置において、前記プローブは、複数の板状の導電性部材が絶縁状態で積層された本体部と、1の前記導電性部材が他の前記導電性部材と重ならないように前記本体部から突出した接点部を前記導電性部材毎に設けたコンタクト部とを備え、前記押圧部は、前記本体部及び前記コンタクト部の一方を押圧して弾性変形させて前記接点部を前記被検査対象物に接触させるものである。 The inspection device according to the present invention is an inspection device that includes a probe that contacts an object to be inspected and a pressing unit that presses the probe against the object to be inspected, and the probe includes a main body in which multiple plate-shaped conductive members are stacked in an insulated state, and a contact unit in which a contact portion protruding from the main body is provided for each conductive member so that one conductive member does not overlap with another conductive member, and the pressing unit presses one of the main body and the contact portion to elastically deform it and bring the contact portion into contact with the object to be inspected.

本発明によれば、簡単な構成によって電極にプローブを接触させる際にキャパシタンスが変化しにくく正確に被検査対象物を検査することができる。 The present invention has a simple configuration that makes it difficult for capacitance to change when the probe is brought into contact with the electrode, allowing the test object to be tested accurately.

本発明の第1実施形態にかかる検査装置の要部を示す断面斜視図FIG. 1 is a cross-sectional perspective view showing a main part of an inspection device according to a first embodiment of the present invention; 本発明の第1実施形態にかかる検査装置の要部を拡大して示す断面図FIG. 1 is an enlarged cross-sectional view showing a main part of an inspection device according to a first embodiment of the present invention. (a)は本発明の第1実施形態にかかるプローブの斜視図、(b)は同プローブの分解斜視図FIG. 2A is a perspective view of a probe according to a first embodiment of the present invention; FIG. 2B is an exploded perspective view of the probe; (a)は本発明の第2実施形態にかかるプローブの斜視図、(b)は同プローブの分解斜視図FIG. 1A is a perspective view of a probe according to a second embodiment of the present invention; FIG. 本発明の第2実施形態にかかる検査装置の要部を示す斜視図FIG. 13 is a perspective view showing a main part of an inspection device according to a second embodiment of the present invention. 本発明の変更例1にかかるプローブの斜視図FIG. 1 is a perspective view of a probe according to a first modified example of the present invention; 本発明の変更例2にかかるプローブの斜視図FIG. 11 is a perspective view of a probe according to a second modified example of the present invention;

(第1実施形態)
以下、本発明の第1実施形態について図面を参照して説明する。
First Embodiment
A first embodiment of the present invention will now be described with reference to the drawings.

本実施形態では、被検査対象物50としてキャンパッケージ型の半導体レーザを検査する検査装置10を例として説明する。この検査装置10は、コンタクト装置20がステージ12に載置された被検査対象物50のリード端子51、52から検査用の駆動電源を入力することで、被検査対象物50の電気特性を測定する。 In this embodiment, an inspection device 10 that inspects a can-package type semiconductor laser as the object to be inspected 50 will be described as an example. This inspection device 10 measures the electrical characteristics of the object to be inspected 50 by inputting an inspection drive power supply from the lead terminals 51 and 52 of the object to be inspected 50 placed on the stage 12 by the contact device 20.

コンタクト装置20は、図1及び図2に示すように、被検査対象物50のリード端子51、52と接触するプローブ22と、プローブ22の下部を保持するベース部30と、プローブ22を押圧する押圧機構32とを備える。 As shown in Figures 1 and 2, the contact device 20 includes a probe 22 that contacts the lead terminals 51 and 52 of the object to be inspected 50, a base portion 30 that holds the lower portion of the probe 22, and a pressing mechanism 32 that presses the probe 22.

プローブ22は、図2、図3(a)及び(b)に示すように、複数(本実施形態では2枚)の板状の導電性部材23,24が絶縁状態で積層された本体部22aと、本体部22aの一端部から突出するように設けられたコンタクト部22bとを備える。プローブ22は、ベース部30から上方に延び上端部が折れ曲がった、全体として略L字状をなしている。 2, 3(a) and 3(b), the probe 22 includes a main body 22a in which a plurality of (two in this embodiment) plate-shaped conductive members 23, 24 are stacked in an insulated state, and a contact portion 22b provided to protrude from one end of the main body 22a. The probe 22 extends upward from the base portion 30 with a bent upper end, forming a generally L-shape.

導電性部材23,24は、いずれも銅に金メッキした金属板等の導電性を有する板バネからなる。導電性部材23,24は、ベース部30から上方に延びる部分の少なくとも一部がプローブ22の本体部22aを構成する。本体部22aでは、互いに直接接触することがないように、導電性部材23,24の少なくとも一部が絶縁層25を介して積層されている。 The conductive members 23, 24 are each made of a conductive leaf spring such as a gold-plated copper metal plate. At least a portion of the conductive members 23, 24 that extend upward from the base portion 30 constitutes the main body portion 22a of the probe 22. In the main body portion 22a, at least a portion of the conductive members 23, 24 is laminated via an insulating layer 25 so that they do not come into direct contact with each other.

絶縁層25は、例えば、テープ状の絶縁材を一方の導電性部材23に巻き付けて設けられている。なお、絶縁層25は、テープ状の絶縁材を巻き付けて設ける以外にも、例えば、導電性部材23,24の少なくとも一方をスリーブ状の絶縁材で覆ったり、導電性部材23,24の対向面に絶縁性の塗料を塗布することで設けたり、任意の方法で導電性部材23,24の間に絶縁層25を設けることができる。 The insulating layer 25 is provided, for example, by wrapping a tape-like insulating material around one of the conductive members 23. Note that the insulating layer 25 can be provided between the conductive members 23 and 24 in any manner other than by wrapping a tape-like insulating material, for example, by covering at least one of the conductive members 23 and 24 with a sleeve-like insulating material, or by applying an insulating paint to the opposing surfaces of the conductive members 23 and 24.

導電性部材23,24の上端部は、間隔をあけて対向し絶縁状態を保ったままL字状に折れ曲がっている。この折れ曲がった部分の付け根側は、導電性部材23,24が間隔をあけて対向し、折れ曲がった部分の先端側には、被検査対象物50のリード端子51、52と接触する接点部26,28が形成されている。 The upper ends of the conductive members 23, 24 are bent in an L-shape while facing each other with a gap between them and maintaining an insulated state. At the base side of the bent portion, the conductive members 23, 24 face each other with a gap between them, and at the tip side of the bent portion, contact portions 26, 28 are formed to come into contact with the lead terminals 51, 52 of the object to be inspected 50.

つまり、本実施形態では、ベース部30から上方に延びる部分とL字状に折れ曲がった部分の付け根側が、導電性部材23,24が絶縁状態で積層された本体部22aを構成し、折れ曲がった部分の先端側が、本体部22aから突出する接点部26,28を備えるコンタクト部22bを構成する。 In other words, in this embodiment, the portion extending upward from the base portion 30 and the base side of the L-shaped bent portion constitute the main body portion 22a in which the conductive members 23, 24 are stacked in an insulated state, and the tip side of the bent portion constitutes the contact portion 22b having the contact portions 26, 28 protruding from the main body portion 22a.

接点部26,28は、導電性部材23,24の幅方向Wの少なくとも一部が、導電性部材23,24の厚さ方向に互いに重なり合わないように、幅方向Wにずらして設けられている。 The contact portions 26, 28 are offset in the width direction W so that at least a portion of the width direction W of the conductive members 23, 24 do not overlap each other in the thickness direction of the conductive members 23, 24.

具体的には、一方の導電性部材23の先端部には、幅方向Wの一方側に切欠部27が形成され、幅方向Wの他方側に寄せて接点部26が形成されている。また、他方の導電性部材24の先端部には、幅方向Wの他方側に切欠部29が形成され、幅方向Wの一方側に寄せて接点部28が形成されている。 Specifically, a notch 27 is formed on one side of the width direction W at the tip of one conductive member 23, and a contact portion 26 is formed near the other side of the width direction W. A notch 29 is formed on the other side of the width direction W at the tip of the other conductive member 24, and a contact portion 28 is formed near the other side of the width direction W.

このような導電性部材23,24を重ね合わせると、プローブ22の本体部22aでは、導電性部材23,24が互いに絶縁された状態で積層される。また、プローブ22のコンタクト部22bでは、一方の導電性部材23の接点部26が、他方の導電性部材24の切欠部29と対向するように本体部22aから突出し、他方の導電性部材24の接点部28が、一方の導電性部材23の接点部26に接触することなく絶縁された状態で、一方の導電性部材23の切欠部27と対向するように本体部22aから突出する。 When such conductive members 23, 24 are stacked on top of each other, the conductive members 23, 24 are stacked in a state insulated from each other in the main body 22a of the probe 22. In addition, in the contact portion 22b of the probe 22, the contact portion 26 of one conductive member 23 protrudes from the main body 22a so as to face the notch 29 of the other conductive member 24, and the contact portion 28 of the other conductive member 24 protrudes from the main body 22a so as to face the notch 27 of the one conductive member 23, in a state insulated without contacting the contact portion 26 of the one conductive member 23.

ベース部30は、プローブ22が押圧機構32から外力を受けていない状態において、プローブ22に設けられた接点部26,28の先端が、ステージ12に載置された被検査対象物50のリード端子51、52と所定間隔をあけて対向するように、プローブ22の本体部22aを保持する。 The base portion 30 holds the main body portion 22a of the probe 22 so that, when the probe 22 is not receiving an external force from the pressing mechanism 32, the tips of the contact portions 26, 28 provided on the probe 22 face the lead terminals 51, 52 of the object to be inspected 50 placed on the stage 12 at a predetermined distance.

ベース部30は、検査用の駆動電源信号を生成する不図示の電源回路に接続された電極38、39が設けられている。ベース部30は、プローブ22の本体部22aを保持すると、電極38、39がプローブ22を構成する導電性部材23,24に電気接続される。これにより、電源回路から電極38を介して一方の導電性部材23に正電位及び負電位の一方が与えられ、電極39を介して他方の導電性部材24に正電位及び負電位の他方が与えられる。なお、図2及び図3に示すように、一方の導電性部材23に絶縁層25が巻き付けられている場合、一方の導電性部材23は、電極38と対向する位置において絶縁層25によって被覆されず、電極38と導通可能に接触するようになっている。 The base portion 30 is provided with electrodes 38 and 39 connected to a power supply circuit (not shown) that generates a driving power supply signal for testing. When the base portion 30 holds the main body portion 22a of the probe 22, the electrodes 38 and 39 are electrically connected to the conductive members 23 and 24 that constitute the probe 22. As a result, one of the positive potential and the negative potential is applied from the power supply circuit to one conductive member 23 via the electrode 38, and the other of the positive potential and the negative potential is applied to the other conductive member 24 via the electrode 39. Note that, as shown in Figures 2 and 3, when an insulating layer 25 is wrapped around one conductive member 23, the one conductive member 23 is not covered by the insulating layer 25 at a position facing the electrode 38, and is in conductive contact with the electrode 38.

押圧機構32は、プローブ22の本体部22aに近接して設けられた円柱状の押圧部34と、押圧部34を移動させる移動部36とを備える。押圧機構32は、移動部36が押圧部34を移動させてプローブ22の本体部22aを押圧する。これにより、本体部22aが弾性変形してプローブ22の接点部26,28をリード端子51、52に接触させ、検査用の駆動電源を被検査対象物50に入力する。 The pressing mechanism 32 includes a cylindrical pressing part 34 provided adjacent to the main body part 22a of the probe 22, and a moving part 36 that moves the pressing part 34. In the pressing mechanism 32, the moving part 36 moves the pressing part 34 to press the main body part 22a of the probe 22. This causes the main body part 22a to elastically deform, bringing the contact parts 26, 28 of the probe 22 into contact with the lead terminals 51, 52, and inputting the driving power for the inspection to the object 50 to be inspected.

上記した本実施形態のプローブ22では、本体部22aにおいて絶縁層25を介して導電性部材23,24が積層されている。そのため、接点部26,28がリード端子51、52に接触する際にプローブ22を弾性変形させても、正電位及び負電位を与える導電性部材23,24の間隔が本体部22aにおいて一定に維持され、プローブ22の変形によるプローブ22のキャパシタンスの変動を抑えることができる。また、本実施形態では、導電性部材23,24に発生する磁界が打ち消し合うことで、パルス駆動時のリンギングを抑えることができる。その結果、大電流や高周波数の駆動電源を入力する検査であっても正確に評価することができる。 In the probe 22 of the present embodiment described above, the conductive members 23, 24 are laminated in the main body 22a via the insulating layer 25. Therefore, even if the probe 22 is elastically deformed when the contact portions 26, 28 contact the lead terminals 51, 52, the distance between the conductive members 23, 24 that provide positive and negative potentials is maintained constant in the main body 22a, and fluctuations in the capacitance of the probe 22 due to deformation of the probe 22 can be suppressed. In addition, in this embodiment, the magnetic fields generated in the conductive members 23, 24 cancel each other out, thereby suppressing ringing during pulse driving. As a result, even tests that input a large current or high-frequency drive power source can be accurately evaluated.

また、プローブ22は、導電性を有する板バネからなる導電性部材23,24を絶縁層25を介して積層する簡単な構成であるため、低コストで製造することができる。しかも、本実施形態では、押圧部34がプローブ22を押圧することで、プローブ22の接点部26,28をリード端子51、52に接触させることができるため、押圧機構32の構成も簡素化することができる。 The probe 22 has a simple structure in which conductive members 23, 24 made of conductive leaf springs are laminated via an insulating layer 25, and therefore can be manufactured at low cost. Moreover, in this embodiment, the pressing portion 34 presses the probe 22, so that the contact portions 26, 28 of the probe 22 can be brought into contact with the lead terminals 51, 52, and therefore the structure of the pressing mechanism 32 can also be simplified.

本実施形態では、接点部26,28をリード端子51、52に接触させる際に、押圧部34がプローブ22の本体部22aを押圧してこれを弾性変形させるため、コンタクト部22bの変形を極力抑えつつ、本体部22aを弾性変形することができ、プローブ22の変形によるキャパシタンスの変動やパルス駆動時のリンギングを抑えることができる。 In this embodiment, when the contact portions 26, 28 are brought into contact with the lead terminals 51, 52, the pressing portion 34 presses the main body portion 22a of the probe 22, causing it to elastically deform. This allows the main body portion 22a to elastically deform while minimizing deformation of the contact portion 22b, thereby suppressing capacitance fluctuations due to deformation of the probe 22 and ringing during pulse driving.

また、本実施形態では、本体部22aが折れ曲がり、その先端に接点部26,28が設けられているため、プローブ22において導電性部材23,24が絶縁状態で積層された本体部22aの割合が高くなり、プローブ22の変形によるキャパシタンスの変動やパルス駆動時のリンギングを抑えることができる。 In addition, in this embodiment, the main body portion 22a is bent and has contact portions 26, 28 at its tip, so that the proportion of the main body portion 22a in which the conductive members 23, 24 are stacked in an insulating state in the probe 22 is increased, and capacitance fluctuations due to deformation of the probe 22 and ringing during pulse driving can be suppressed.

(第2実施形態)
第2実施形態の検査装置110について、主に図4(a)(b)及び図5に基づいて第1実施形態と異なる部分を中心に説明する。なお、第1実施形態と同一の構成のものについては、同一の符号を付し、詳細な説明を省略する。
Second Embodiment
The inspection device 110 of the second embodiment will be described with a focus on the parts that are different from the first embodiment, mainly with reference to Figures 4(a), (b) and 5. Note that the same components as those in the first embodiment are given the same reference numerals, and detailed descriptions thereof will be omitted.

上記した第1実施形態では、導電性部材23,24にそれぞれ1つの接点部26,28を設けたが、本実施形態のプローブ122では1の導電性部材123に複数の接点部126、126bが設けられている。 In the first embodiment described above, one contact portion 26, 28 is provided on each of the conductive members 23, 24, but in the probe 122 of this embodiment, multiple contact portions 126, 126b are provided on one conductive member 123.

具体的には、図4(a)(b)に示すように、一方の導電性部材123の先端部には、幅方向Wの中央部に切欠部127が形成され、幅方向Wの両側に接点部126a、126bが形成されている。また、他方の導電性部材124の先端部には、幅方向Wの両側に切欠部129a,129bが形成され、幅方向Wの中央部に接点部128が形成されている。 Specifically, as shown in Fig. 4(a) and (b), a notch 127 is formed in the center of the width direction W at the tip of one conductive member 123, and contact portions 126a, 126b are formed on both sides in the width direction W. Also, notches 129a, 129b are formed in the tip of the other conductive member 124 on both sides in the width direction W, and a contact portion 128 is formed in the center of the width direction W.

このような導電性部材123,124を絶縁層125a,125bを介して重ね合わせると、プローブ122の本体部122aでは、導電性部材123,124が互いに絶縁された状態で積層される。なお、本実施形態では、導電性部材123,124の周囲に絶縁層125a,125bを設けたが、導電性部材123,124のいずれか一方の周囲に絶縁層を設けたり、導電性部材123,124の間のみに絶縁層を設けてもよい。 When such conductive members 123, 124 are stacked with insulating layers 125a, 125b between them, the conductive members 123, 124 are stacked in a mutually insulated state in the main body 122a of the probe 122. In this embodiment, the insulating layers 125a, 125b are provided around the conductive members 123, 124, but an insulating layer may be provided around either one of the conductive members 123, 124, or an insulating layer may be provided only between the conductive members 123, 124.

プローブ122のコンタクト部122bでは、一方の導電性部材123の接点部126a、126bが、他方の導電性部材124の切欠部129a、129bと対向するように本体部22aから突出する。他方の導電性部材124の接点部128は、一方の導電性部材123の接点部126a、126bに接触することなく絶縁された状態で、一方の導電性部材123の切欠部127と対向するように本体部22aから突出する。 In the contact portion 122b of the probe 122, the contact portions 126a, 126b of one conductive member 123 protrude from the main body portion 22a so as to face the notches 129a, 129b of the other conductive member 124. The contact portion 128 of the other conductive member 124 protrudes from the main body portion 22a so as to face the notch 127 of the one conductive member 123 while being insulated without contacting the contact portions 126a, 126b of the one conductive member 123.

プローブ122には、電源回路から電極38を介して一方の導電性部材123に正電位及び負電位の一方(例えば、正電位)が与えられ、電極39を介して他方の導電性部材124に正電位及び負電位の他方(例えば、負電位)が与えられる。これにより、正電位の接点部126a、126bの間に負電位の接点部128が位置するように、接点部126a、126b、128が導電性部材123,124の幅方向Wに並んで配置される。 In the probe 122, one of a positive potential and a negative potential (e.g., a positive potential) is applied to one conductive member 123 via an electrode 38 from a power supply circuit, and the other of a positive potential and a negative potential (e.g., a negative potential) is applied to the other conductive member 124 via an electrode 39. As a result, the contact parts 126a, 126b, and 128 are arranged side by side in the width direction W of the conductive members 123 and 124 so that the negative potential contact part 128 is located between the positive potential contact parts 126a and 126b.

このような本実施形態のプローブ122は、図5に示すように、一方の導電性部材123の接点部126aが被検査対象物50のリード端子51と対向し、他方の導電性部材124の接点部128がリード端子52と対向するように、ベース部30に保持される。 The probe 122 of this embodiment is held on the base portion 30 so that the contact portion 126a of one conductive member 123 faces the lead terminal 51 of the object to be inspected 50, and the contact portion 128 of the other conductive member 124 faces the lead terminal 52, as shown in FIG. 5.

そして、押圧機構32の押圧部34がプローブ122の本体部122aを押圧して弾性変形させる。これにより、接点部126aがリード端子51に接触して正電位を与え、接点部128がリード端子52に接触して負電位を与えて、被検査対象物50を検査する。 The pressing portion 34 of the pressing mechanism 32 presses the main body portion 122a of the probe 122 to elastically deform it. As a result, the contact portion 126a comes into contact with the lead terminal 51 to apply a positive potential, and the contact portion 128 comes into contact with the lead terminal 52 to apply a negative potential, thereby inspecting the object to be inspected 50.

被検査対象物50の検査が終わると、押圧部34によるプローブ122の本体部122aの押圧を解除して、接点部126a、128をリード端子51,52から離隔させる。その後、他方の導電性部材124の接点部128が被検査対象物50のリード端子51と対向し、一方の導電性部材124の接点部126bがリード端子52と対向するように、不図示の移動機構によってベース部30を幅方向Wへ移動させる。 When the inspection of the object 50 to be inspected is completed, the pressure applied by the pressing portion 34 to the main body 122a of the probe 122 is released, and the contact portions 126a and 128 are separated from the lead terminals 51 and 52. Thereafter, the base portion 30 is moved in the width direction W by a moving mechanism (not shown) so that the contact portion 128 of the other conductive member 124 faces the lead terminal 51 of the object 50 to be inspected, and the contact portion 126b of one conductive member 124 faces the lead terminal 52.

そして、押圧機構32の押圧部34がプローブ122の本体部122aを押圧して弾性変形させる。これにより、接点部128がリード端子51に接触して正電位を入力し、接点部126bがリード端子52に接触して負電位を入力して、被検査対象物50を検査する。 The pressing portion 34 of the pressing mechanism 32 presses the main body portion 122a of the probe 122 to elastically deform it. As a result, the contact portion 128 contacts the lead terminal 51 to input a positive potential, and the contact portion 126b contacts the lead terminal 52 to input a negative potential, thereby inspecting the object 50 to be inspected.

このような本実施形態では、検査用の駆動電源信号を生成する電源回路を変更することなく、プローブ122を幅方向Wへ移動させるだけで、リード端子51、52に正電位及び負電位を入れ替えて入力することができる。 In this embodiment, the positive and negative potentials can be switched and input to the lead terminals 51 and 52 simply by moving the probe 122 in the width direction W, without changing the power supply circuit that generates the driving power signal for the inspection.

なお、その他の構成及び作用効果は上記した第1実施形態と同様であり、詳細な説明は省略する。 The rest of the configuration and effects are the same as those of the first embodiment described above, so detailed explanations will be omitted.

(変更例)
以上、本発明の実施形態を説明したが、これらの実施形態は例として提示したものであり、発明の範囲を限定することを意図していない。これらの実施形態は、その他の様々な形態で実施されることが可能であり、発明の趣旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これらの実施形態やその変形は、発明の範囲や要旨に含まれると同様に、特許請求の範囲に記載された発明とその均等の範囲に含まれるものである。
(Example of change)
Although the embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope of the invention and its equivalents described in the claims, as well as in the scope and gist of the invention.

例えば、上記した第1実施形態及び第2実施形態では、本体部22aが折れ曲がり、その先端に接点部26,28が設けられている場合について説明したが、例えば、図6、図7に示すように、コンタクト部222b、322bの上端部において折れ曲がっていても良い。 For example, in the first and second embodiments described above, the main body 22a is bent and the contact portions 26, 28 are provided at its tip, but as shown in Figures 6 and 7, the contact portions 222b, 322b may be bent at their upper ends.

つまり、図6に示すプローブ222では、ベース部30から上方に延びる部分に、導電性部材223,224が絶縁層225を介して積層された本体部222aと、コンタクト部222bとが設けられている。 In other words, in the probe 222 shown in FIG. 6, a body portion 222a in which conductive members 223 and 224 are laminated with an insulating layer 225 interposed therebetween, and a contact portion 222b are provided in a portion extending upward from the base portion 30.

コンタクト部222bでは、一方の導電性部材223の幅方向Wの一方側に切欠部327が形成され、幅方向Wの他方側に接点部226が形成されている。また、他方の導電性部材224の先端部には、幅方向Wの他方に切欠部229が形成され、幅方向Wの一方側に接点部228が形成されている。これにより、コンタクト部222bでは、導電性部材223,224の幅方向Wの少なくとも一部が、導電性部材223,224の厚さ方向に互いに重なり合わないように幅方向Wにずらして設けられている。コンタクト部222bの上端部は、L字状に折れ曲がり、その先端部にリード端子51、52と接触するようになっている。 In the contact portion 222b, a notch 327 is formed on one side of the width direction W of one conductive member 223, and a contact portion 226 is formed on the other side of the width direction W. In addition, a notch 229 is formed on the other side of the width direction W at the tip of the other conductive member 224, and a contact portion 228 is formed on one side of the width direction W. As a result, in the contact portion 222b, at least a part of the width direction W of the conductive members 223, 224 is shifted in the width direction W so that they do not overlap each other in the thickness direction of the conductive members 223, 224. The upper end of the contact portion 222b is bent in an L-shape, and its tip is adapted to contact the lead terminals 51, 52.

図7に示すプローブ322では、ベース部30から上方に延びる部分に、導電性部材323,324が絶縁層325を介して積層された本体部322aと、コンタクト部322bとが設けられている。コンタクト部322bでは、一方の導電性部材323の幅方向Wの中央部に切欠部327が形成され、幅方向Wの両側に接点部326a、326bが形成されている。また、他方の導電性部材324の先端部には、幅方向Wの両側に切欠部329a,329bが形成され、幅方向Wの中央部に接点部328が形成されている。これにより、コンタクト部322bでは、導電性部材232、324の幅方向Wの少なくとも一部が、導電性部材323,324の厚さ方向に互いに重なり合わないように幅方向Wにずらして設けられている。コンタクト部322bの上端部は、L字状に折れ曲がり、その先端部がリード端子51、52と接触するようになっている。 In the probe 322 shown in FIG. 7, a body portion 322a in which conductive members 323 and 324 are laminated via an insulating layer 325, and a contact portion 322b are provided in a portion extending upward from the base portion 30. In the contact portion 322b, a notch 327 is formed in the center of the width direction W of one conductive member 323, and contact portions 326a and 326b are formed on both sides of the width direction W. In addition, notches 329a and 329b are formed on both sides of the width direction W at the tip of the other conductive member 324, and a contact portion 328 is formed in the center of the width direction W. As a result, in the contact portion 322b, at least a part of the width direction W of the conductive members 232 and 324 is shifted in the width direction W so that they do not overlap each other in the thickness direction of the conductive members 323 and 324. The upper end of the contact portion 322b is bent in an L-shape, and its tip is adapted to contact the lead terminals 51 and 52.

このような変更例のプローブ222,322では、本体部222a、322aを確保することで、プローブ222の変形によるキャパシタンスの変動やパルス駆動時のリンギングを抑えつつ、接点部226,228、3261,326b、328をある程度個別に弾性変形させることができるようになり、リード端子51、52との接続抵抗を抑えることができる。 In these modified probes 222 and 322, the main body 222a and 322a are secured, which makes it possible to suppress capacitance fluctuations due to deformation of the probe 222 and ringing during pulse driving, while allowing the contacts 226, 228, 3261, 326b, and 328 to be elastically deformed individually to a certain degree, thereby suppressing the connection resistance with the lead terminals 51 and 52.

なお、図6及び図7に示すようなプローブ222,322を被検査対象物50のリード端子51、52に接触させるために、押圧部34がプローブ222,322の本体部222a,322aを押圧しても良く、また、コンタクト部222b,322bを押圧してもよい。コンタクト部222b,322bの変形を抑えつつプローブ222,322を被検査対象物50のリード端子51、52に接触させることができることから、本体部222aを押圧して被検査対象物50のリード端子51、52にプローブ222,322を接触させることが好ましく、本体部222a,322aのコンタクト部222b、322b近傍を押圧することがより好ましい。 In order to bring the probes 222, 322 as shown in Figs. 6 and 7 into contact with the lead terminals 51, 52 of the object to be inspected 50, the pressing portion 34 may press the main body portions 222a, 322a of the probes 222, 322, or may press the contact portions 222b, 322b. Since the probes 222, 322 can be brought into contact with the lead terminals 51, 52 of the object to be inspected 50 while suppressing deformation of the contact portions 222b, 322b, it is preferable to press the main body portion 222a to bring the probes 222, 322 into contact with the lead terminals 51, 52 of the object to be inspected 50, and it is more preferable to press the vicinity of the contact portions 222b, 322b of the main body portions 222a, 322a.

また、上記した第1実施形態及び第2実施形態では、2枚の導電性部材を絶縁状態で積層したプローブについて説明したが、3枚以上の導電性部材を絶縁状態で積層してプローブを構成してもよい。 In addition, in the first and second embodiments described above, a probe in which two conductive members are stacked in an insulated state has been described, but a probe may be configured by stacking three or more conductive members in an insulated state.

また、上記した第1実施形態及び第2実施形態では、導電性部材を折り曲げた部分の先端に接点部を設ける場合について説明したが、導電性部材を折り曲げること無くプローブ全体を平板状に設けてもよい。 In addition, in the first and second embodiments described above, a contact portion is provided at the tip of the bent portion of the conductive member, but the entire probe may be provided in a flat plate shape without bending the conductive member.

10…検査装置、12…ステージ、20…コンタクト装置、22…プローブ、22a…本体部、22b…コンタクト部、23…導電性部材、24…導電性部材、25…絶縁層、26…接点部、27…切欠部、28…接点部、29…切欠部、30…ベース部、32…押圧機構、34…押圧部、36…移動部、38…電極、39…電極、50…半導体レーザ、51…リード端子、52…リード端子 10...inspection device, 12...stage, 20...contact device, 22...probe, 22a...main body, 22b...contact part, 23...conductive member, 24...conductive member, 25...insulating layer, 26...contact part, 27...notch, 28...contact part, 29...notch, 30...base, 32...pressing mechanism, 34...pressing part, 36...moving part, 38...electrode, 39...electrode, 50...semiconductor laser, 51...lead terminal, 52...lead terminal

Claims (5)

複数の板状の導電性部材が絶縁状態で積層された本体部と、
1の前記導電性部材が他の前記導電性部材と重ならないように前記本体部から突出した接点部を前記導電性部材毎に設けたコンタクト部とを備え、
1の前記導電性部材に前記接点部が複数設けられ、他の前記導電性部材に設けられた前記接点部が、1の前記導電性部材に前記接点部の間に配置され、
前記本体部及び前記コンタクト部の少なくとも一方を弾性変形させて前記接点部を被検査対象物に接触させるプローブ。
A main body portion in which a plurality of plate-shaped conductive members are laminated in an insulated state;
a contact portion provided for each of the conductive members, the contact portion protruding from the main body portion so that one of the conductive members does not overlap with another of the conductive members;
a plurality of the contact portions are provided on one of the conductive members, and the contact portions provided on the other conductive members are disposed between the contact portions on the one of the conductive members;
A probe in which at least one of the main body portion and the contact portion is elastically deformed to bring the contact portion into contact with an object to be inspected.
前記本体部を弾性変形させて前記接点部を被検査対象物に接触させる請求項1に記載のプローブ。 The probe according to claim 1, in which the main body is elastically deformed to bring the contact portion into contact with the object to be inspected. 前記本体部が折れ曲がっている請求項1又は2に記載のプローブ。 The probe according to claim 1 or 2, wherein the main body is bent. 前記コンタクト部が折れ曲がっている請求項1又は2に記載のプローブ。 The probe according to claim 1 or 2, in which the contact portion is bent. 被検査対象物に接触するプローブと、前記プローブを被検査対象物に押し付ける押圧部とを備える検査装置において、
前記プローブは、複数の板状の導電性部材が絶縁状態で積層された本体部と、1の前記導電性部材が他の前記導電性部材と重ならないように前記本体部から突出した接点部を前記導電性部材毎に設けたコンタクト部とを備え、
前記押圧部は、前記本体部及び前記コンタクト部の一方を押圧して弾性変形させて前記接点部を被検査対象物に接触させる検査装置。
An inspection device including a probe that contacts an object to be inspected and a pressing unit that presses the probe against the object to be inspected,
The probe includes a main body in which a plurality of plate-shaped conductive members are stacked in an insulated state, and a contact portion in which a contact portion protruding from the main body is provided for each of the conductive members so that one of the conductive members does not overlap with another of the conductive members,
The pressing portion presses one of the main body portion and the contact portion to elastically deform it, thereby bringing the contact portion into contact with an object to be inspected.
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US20080111571A1 (en) 2001-08-21 2008-05-15 Cascade Microtech, Inc. Membrane probing system
US20070200578A1 (en) 2006-02-19 2007-08-30 Gunsei Kimoto Probe assembly
JP2011142015A (en) 2010-01-07 2011-07-21 Yamaichi Electronics Co Ltd Electric contactor and electric connection device using the same
JP2013120065A (en) 2011-12-06 2013-06-17 Yamaichi Electronics Co Ltd Contact probe and semiconductor element socket including the same
US20190041428A1 (en) 2017-08-04 2019-02-07 Leeno Industrial Inc. Test probe and test device using the same
US20190064215A1 (en) 2017-08-23 2019-02-28 Leeno Industrial Inc. Mems probe and test device using the same
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