WO2013061486A1 - Contact probe and inspection socket provided with same - Google Patents

Contact probe and inspection socket provided with same Download PDF

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Publication number
WO2013061486A1
WO2013061486A1 PCT/JP2012/001782 JP2012001782W WO2013061486A1 WO 2013061486 A1 WO2013061486 A1 WO 2013061486A1 JP 2012001782 W JP2012001782 W JP 2012001782W WO 2013061486 A1 WO2013061486 A1 WO 2013061486A1
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WO
WIPO (PCT)
Prior art keywords
contact
electrode
contact terminal
terminal
plate
Prior art date
Application number
PCT/JP2012/001782
Other languages
French (fr)
Japanese (ja)
Inventor
伸一 中村
文明 名波
古澤　昌之
Original Assignee
ユニテクノ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ユニテクノ株式会社 filed Critical ユニテクノ株式会社
Priority to TW101116518A priority Critical patent/TWI588494B/en
Publication of WO2013061486A1 publication Critical patent/WO2013061486A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points

Definitions

  • the present invention relates to, for example, a contact probe used when inspecting the electrical characteristics of a semiconductor integrated circuit and a test socket provided with the same.
  • FIG. 19 An exemplary configuration of an inspection socket for inspecting an IC or the like using the vertical contact probe disclosed in Patent Document 1 is shown in FIG.
  • the conventional vertical contact probe 80 includes plungers 81 and 82, a coil spring 83 and a case 84.
  • the plunger 81 contacts the solder ball 85 a of the IC 85
  • the plunger 82 contacts the electrode pad 86 a of the printed circuit board 86.
  • Wires 87 are soldered to the electrode pads 86a in order to connect to an inspection device (not shown).
  • the contact probe 80 relays a signal between the solder ball 85a of the IC 85 and the inspection apparatus via the printed circuit board 86.
  • the conventional vertical contact probe 80 has the following problems.
  • the plungers 81 and 82 of the conventional contact probe 80 are manufactured by cutting one by one from a cylindrical bar.
  • the plungers 81 and 82 are obtained by cutting a bar of ⁇ 0.8 mm and machining one by one to a thickness of about ⁇ 0.3 mm. Therefore, the conventional contact probe 80 has a problem that the number of productions is limited because a large number of manufacturing steps are required, and it can not cope with mass production. Further, in the conventional contact probe 80, there are also problems that manufacturing requires a large number of man-hours, and the material cost is also increased because the amount of cutting is relatively large, which makes it difficult to reduce the cost.
  • an organic material such as resin is generally used as the material of the printed board 86, but the organic material has a relatively large linear expansion coefficient, and the pattern interval depends on the ambient temperature Is easily changed, so it can not cope with the minimization of the inter-electrode pitch of an IC or the like. If the material of the printed circuit board 86 is ceramic, the linear expansion coefficient can be made smaller than that of the organic material, and it becomes possible to cope with the minimization of the pitch between electrodes such as IC. Will increase.
  • the present invention has been made to solve the conventional problems, can cope with mass production, can reduce the manufacturing cost, and can minimize the inter-electrode pitch of the test object, and a contact probe To provide a test socket with
  • the contact probe of the present invention comprises a first contact terminal and a second contact terminal, and a second electrode which is an external connection terminal of the first electronic component and an external connection terminal of the second electronic component.
  • a contact probe for electrically connecting the first electrode to one of the electrodes wherein the first contact terminal has a first contact portion contacting with the first electrode at one end, and a strip portion formed at the other end
  • the second contact terminal has a coupling portion at the center, and a plate-like member having two plate portions at both ends of the coupling portion such that the two plate portions face each other
  • the first contact terminal is pressed against the first electrode and the second contact terminal is
  • the spring pressing the touch terminal to said second electrode has a structure to be mounted.
  • the contact probe of the present invention is provided with the first and second contact terminals formed of planar metal plates, so that the chemical etching technique or the like can be performed without cutting one by one as in the prior art.
  • the die pressing technology mass production with high accuracy is possible, and the manufacturing cost can be reduced.
  • the vertical contact probe is used to cope with the reduction of the inter-electrode pitch of the inspection object without using the expensive ceramic substrate as in the prior art. can do.
  • the contact probe of the present invention can cope with mass production, and can cope with the reduction of the manufacturing cost and the minimization of the interelectrode pitch of the test object.
  • the first contact terminal has two protrusions formed in the first contact portion to be in contact with the first electrode, and the second contact terminal is the contact probe.
  • the connecting portion is formed by bending the connecting portion into a U-shape, and the opposing plate-like portion functions as a holding portion for holding at least a part of the strip, the connecting portion functions as a second contact portion, and the spring It comprises a closely wound spring mounted around at least a part of the holding portion, and a roughly wound spring mounted in series with the closely wound spring.
  • the second contact terminal can be formed by bending the plate-like member once in a U-shape.
  • the contact probe of the present invention has a configuration in which four protrusions are formed in the first contact portion to be in contact with the first electrode.
  • the first contact terminal more stably contacts the electrode.
  • the contact probe of the present invention has a configuration in which the first contact terminal is formed by overlapping planar metal plates each including two of the four protrusions.
  • the first contact terminal more stably contacts the electrode.
  • the first contact terminal has a configuration in which flat metal plates each including the two protrusions at the contact portion are spaced apart and opposed to each other.
  • the first contact terminal more stably contacts the electrode.
  • the second contact terminal has a shape in which the coupling portion is bent in a V-shape.
  • the contact probe of the present invention can obtain electrical conduction between the electrode and the land with a simple structure.
  • the second contact terminal has two plate-like members facing each other such that at least two protrusions extending from the plate-like portion are formed on both sides of the coupling portion.
  • the connecting portion is bent in a U-shape, and the protrusion is erected, and the plate-like portion functions as the holding portion, and the protrusion functions as a first contact portion.
  • the first contact terminal can be formed by bending the plate-like member once in a U-shape, and the manufacturing cost can be reduced.
  • the two plate-like members face each other in a plate-like member in which at least two protrusions extending from the plate-like portion are formed on both sides of the coupling portion.
  • the connecting portion is bent in an M shape, and the protrusion is erected, and the plate-like portion functions as the sandwiching portion, and the protrusion functions as a first contact portion.
  • the first contact terminal can be formed by bending the plate-like member twice in an M-shape, and the manufacturing cost can be reduced.
  • the second contact terminal bends the coupling portion in a W shape such that the two plate portions face each other, and the plate portion serves as a first contact portion in a W shape.
  • the central concave portion of the joint portion bent into two functions as the sandwiching portion.
  • the second contact terminal can be formed by bending the plate-like member twice in a W shape, and the manufacturing cost can be reduced.
  • the inspection socket comprises a contact probe, a housing in which a housing portion for housing the contact probe is formed, a test object holding portion for holding the test object provided with the electrode, and the land And the printed circuit board provided, wherein center lines of the electrodes and the lands are located on center lines of the contact probes.
  • the inspection socket of the present invention can cope with mass production, and can correspond to the reduction of manufacturing cost and the minimization of the inter-electrode pitch of the object to be inspected.
  • the present invention provides a contact probe and a test socket provided with the same, which have the effect of being able to cope with mass production, reducing the manufacturing cost and minimizing the interelectrode pitch of the test object. It is possible.
  • FIG 14 is a view showing modifications 2 to 4 in the second embodiment of the contact probe according to the present invention. It is a figure which shows the modification 5 in 2nd Embodiment of the contact probe which concerns on this invention. It is a block diagram in 3rd Embodiment of the contact probe which concerns on this invention. It is a perspective view of the components of 3rd Embodiment of the contact probe which concerns on this invention. It is a figure which shows the modification 1 in 3rd Embodiment of the contact probe which concerns on this invention. It is a block diagram of the conventional test
  • the first electronic component is an IC
  • the second electronic component is a printed circuit board.
  • the first electrode is a solder ball which is an external connection terminal of the IC
  • the second electrode is a land which is an external connection terminal of the printed circuit board.
  • the inspection socket 100 in the first embodiment has a BGA (Ball Grid Array) type IC 50 as an inspection object, and the IC 50 is electrically connected through solder balls 51 provided on the lower surface of the IC 50. It inspects the characteristics.
  • the solder ball 51 constitutes an electrode according to the present invention.
  • the inspection socket 100 includes a contact probe 10, a housing 20, an IC mounting unit 30, and a printed circuit board 40.
  • the IC mounting unit 30 constitutes an inspection object holding unit according to the present invention.
  • the contact probe 10 is a so-called vertical contact probe, and the metal electrode contact terminal 11 in contact with the solder ball 51, the metal land contact terminal 12 in contact with the land 41, the electrode contact terminal 11 and the land And a metal coil spring 13 provided between the contact terminal 12 and the contact terminal 12.
  • the electrode contact terminal 11 and the land contact terminal 12 respectively constitute first and second contact terminals according to the present invention.
  • the housing 20 includes an upper housing portion 21 and a lower housing portion 22 formed of an electrically insulating material.
  • the upper housing 21 and the lower housing 22 are fixed by screws (not shown).
  • a through hole 21 a is formed in the upper housing portion 21, and a through hole 22 a is formed in the lower housing portion 22.
  • the main portion of the contact probe 10 is accommodated in an accommodating portion formed by the through holes 21a and 22a.
  • the IC mounting portion 30 can move so that the solder ball 51 contacts the electrode contact terminal 11 while holding the IC 50.
  • the printed circuit board 40 is disposed on the lower surface side of the inspection socket 100, and wires (not shown) from the current supply circuit and the voltage measurement circuit are connected. Lands 41 are formed on the upper surface of the printed circuit board 40.
  • FIG. 2 shows the state under test of the IC 50 by the test socket 100.
  • the center lines of the lands 41 and the solder balls 51 are located on the center line of the contact probe 10.
  • the electrode contact terminal 11 is in contact with the solder ball 51
  • the land contact terminal 12 is in contact with the land 41.
  • Electrical conduction between the electrode contact terminal 11 and the land contact terminal 12 is secured by a coil spring 13.
  • the coil spring 13 biases the electrode contact terminal 11 against the solder ball 51 and biases the land contact terminal 12 against the land 41.
  • FIG. 3A is a front view of the contact probe 10
  • FIG. 3B is a side view of the contact probe 10.
  • the electrode contact terminal 11 is a strip extending from the one end of the electrode contact terminal 11 in the direction of the land 41 from the solder ball contact portion 11a contacting the solder ball 51. And 11b.
  • the solder ball contact portion 11a constitutes a contact portion according to the present invention.
  • the land contact terminal 12 includes a land contact portion 12 a in contact with the land 41 and a sandwiching portion 12 b sandwiching at least a part of the strip 11 b of the electrode contact terminal 11.
  • the electrode contact terminal 11 is formed of a flat metal plate shown in FIG. 4 (a). Further, the land contact terminal 12 is formed by bending the flat metal plate shown in FIG. 4B into a U shape with the land contact portion 12 a as a bottom. Therefore, the electrode contact terminal 11 and the land contact terminal 12 can be mass-produced with high accuracy by using the chemical etching technology and the die pressing technology, and the manufacturing cost can be reduced.
  • the coil spring 13 has, for example, a densely wound portion 13a in which a wire having a gold-plated surface is closely wound and wound, and a coarsely wound portion 13b wound at a coarser pitch than the closely wound portion 13a.
  • the densely wound portion 13 a is provided around at least a part of the sandwiching portion 12 b of the land contact terminal 12.
  • the coarsely wound portion 13 b is provided on the outer periphery of the strip portion 11 b of the electrode contact terminal 11.
  • the diameter of the coil spring 13 is uniform.
  • the closely wound portion 13a and the roughly wound portion 13b respectively constitute a first spring and a second spring according to the present invention.
  • the cross section AA of the contact probe 10 is shown at the top of FIG. 3 (b). Since the contact probe 10 is configured as described above, even when the electrode contact terminal 11 is inclined in the Y-axis direction during inspection of the IC 50, the inclination is limited by the closely wound portion 13a of the coil spring 13, and the electrode Electrical conduction between the contact terminal 11 and the land contact terminal 12 can be secured by the coil spring 13.
  • the electrode contact terminal 11 even when the electrode contact terminal 11 is inclined in the X-axis direction, as shown schematically in FIG. 5, the electrode contact terminal 11 contacts the sandwiching portion 12b of the land contact terminal 12 at two points of B and C portions.
  • the contact probe 10 can ensure electrical conduction between the electrode contact terminal 11 and the land contact terminal 12.
  • the above-described coil spring 13 is exemplified as an example in which the closely wound portion 13a and the roughly wound portion 13b are integrally configured, but a closely wound spring replacing the closely wound portion 13a and a roughly wound spring replacing the rough wound portion 13b It is good also as 2 body composition by.
  • the closely wound portion 13a and the roughly wound portion 13b have the same diameter and are disposed to face each other.
  • the contact probe 10 in the present embodiment is configured to include the electrode contact terminal 11 and the land contact terminal 12 formed of a flat metal plate, cutting is performed one by one as in the conventional case. There is no need for this, and by using chemical etching technology and die pressing technology, mass production with high accuracy is possible, and the manufacturing cost can be reduced.
  • the inspection socket 100 provided with the contact probe 10 of the present invention can cope with the minimization of the inter-electrode pitch of the inspection object without forming the printed circuit board 40 with an expensive ceramic substrate as in the prior art. it can.
  • the contact probe 10 of the present invention can cope with mass production, and can cope with the reduction of the manufacturing cost and the reduction of the inter-electrode pitch of the inspection object.
  • the electrode contact terminal 11 is described as the first contact terminal according to the present invention
  • the land contact terminal 12 is described as the second contact terminal according to the present invention, but the present invention is limited thereto I will not. That is, the electrode contact terminal 11 may be a second contact terminal according to the present invention, and the land contact terminal 12 may be a first contact terminal according to the present invention.
  • the solder ball contact portion 11 a of the electrode contact terminal 11 has the shape shown in FIG.
  • the solder ball contact portion 11a has four protrusions 11c, 11d, 11e and 11f. This shape can be obtained, for example, by making the V-shaped groove 11g shown in the drawing in advance with a die and forming it by pressing.
  • solder ball contact portion 11a contacts the solder ball 51 more stably.
  • the two metal plates 11A and 11B of the same shape are formed by overlapping, welding, caulking, bonding, etc. to form the shape shown in FIG. 6 (b). It can also be done.
  • the electrode contact terminal 15 in the second modification is formed of two metal plates having a shape shown in FIG. 4A. That is, the electrode contact terminal 15 is formed by bonding and overlapping two flat metal plates of the same shape by welding, caulking, adhesion, etc. And 15b.
  • planar metal plates in which the solder ball contact portions 15a are formed are mutually separated and opposed.
  • the two strip portions 15b are joined and overlapped with each other by welding, caulking, adhesion or the like.
  • the solder ball contact portion 15a contacts the solder ball 51 more stably. Furthermore, when the solder ball contact portion 15a contacts the solder ball 51, the solder ball contact portion 15a spreads along the shape of the solder ball 51, and it becomes possible to scrape off the oxide film on the surface of the solder ball 51 (hereinafter, wiping). . By this wiping, the contact resistance between the solder ball contact portion 15a and the solder ball 51 can be greatly reduced. The amount of wiping can be adjusted by appropriately setting the length L, the thickness t, and the distance d of the solder ball contact portion 15a.
  • the wiping amount can be secured by forming the solder ball contact portion 15a in a two-step folding shape. Is also possible.
  • the third modification will be described with reference to FIG.
  • the contact probe 16 in the third modification includes a land contact terminal 121 which replaces the land contact terminal 12 in the above-described embodiment.
  • the land contact terminal 121 is formed by bending a planar metal plate into a V shape with the land 41 side as an apex. Further, the land contact terminal 121 is a land contact portion in which the V-shaped tip is in contact with the land 41.
  • the electrode contact terminal 11 has inner surface contact parts 11 h and 11 i that contact the V-shaped inner surface of the land contact terminal 121 when the coil spring 13 contracts.
  • the contact probe 16 can obtain electrical continuity between the land 41 and the solder ball 51 with a simple structure.
  • the inspection socket 600 includes a contact probe 60, a housing 20, an IC mounting unit 30, and a printed circuit board 40.
  • the same components as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the contact probe 60 of the second embodiment is provided between the electrode contact terminal 61 in contact with the solder ball 51, the land contact terminal 62 in contact with the land 41, and the electrode contact terminal 61 and the land contact terminal 62. And a coil spring 63.
  • FIG. 10 (a) is a front view of the contact probe 60
  • FIG. 10 (b) is a side view of the contact probe 60. As shown in FIG. 10 (a) is a front view of the contact probe 60, and FIG. 10 (b) is a side view of the contact probe 60. As shown in FIG. 10 (a) is a front view of the contact probe 60, and FIG. 10 (b) is a side view of the contact probe 60. As shown in FIG.
  • the land contact terminal 62 includes a land contact portion 62a in contact with the land 41 and a strip portion 62b extending in a strip shape from one end of the land contact terminal 62 in the direction of the solder ball 51.
  • the electrode contact terminal 61 includes a solder ball contact portion 61a in contact with the solder ball 51, a sandwiching portion 61b sandwiching at least a part of the strip portion 62b of the land contact terminal 62, and a connection connecting the sandwiching portions 61b at both ends.
  • a unit 61c is provided. 10 (c) is a top view of the contact probe 60, and FIG. 10 (d) is a bottom view.
  • the land contact terminal 62 is formed of a flat metal plate shown in FIG. Further, the electrode contact terminal 61 is formed by bending the flat metal plate shown in FIG. 11B into a U shape with the connecting portion 61 c as the bottom. That is, the solder ball contact portions 61a are provided so as to extend from the sandwiching portion 61b on both sides of the connecting portion 61c.
  • the solder ball contact portion 61 a separates from the connecting portion 61 c and stands up and comes into contact with the solder ball 51. Also in the contact probe 60 according to the second embodiment, it is possible to remove the oxide film of the solder ball 51 by wiping when the solder ball contact portion 61 a contacts the solder ball 51.
  • FIG. 12 shows a first modification of the second embodiment, in which the erected length of the solder ball contact portion 61a can be increased. That is, as shown in FIG. 13, by providing the notch 61f from the branch position 61e of the solder ball contact portion 61a and the connection portion 61c, the erected length of the solder ball contact portion when the connection portion 61c is bent in a U shape is long. It is possible to In this case, the distance between the sandwiching portions 61b may be too large if the connecting portion is simply bent in a U-shape, so it is possible to adjust the distance by bending the connecting portion in an M-shape.
  • FIG. 14 shows the second to fourth modified examples of the second embodiment, in which the erected length of the solder ball contact portion 61a can be increased. That is, in the second modification (a), the solder ball contact portions 61a in the opposite direction are provided on both sides of the connection portion 61c of the electrode contact 61, and the connection portion 61c has a reverse U shape or M When it is bent in a letter shape, four solder ball contact portions 61a stand in a parallelogram shape. In the third modification (b), a downward solder ball contact portion 61a is formed outside the two connection portions 61c, and an upward solder ball contact portion 61a is formed inside the two connection portions 61c. When the connecting portion 61c is bent in an inverted U-shape or M-shape, three solder ball contact portions 61a stand up.
  • the fourth modification (c) two connecting portions 61c are provided outside, and four solder ball contact portions 61a are cut in the inside, regardless of the length of the connecting portion 61c.
  • the length of the solder ball contact portion 61a can be increased. Also in this modification, when the connecting portion 61c is bent in a U-shape, the four solder ball contact portions 61a stand up.
  • FIG. 15 shows a fourth modification of the second embodiment, which is an embodiment in which the solder ball contact portion 61a is folded in two steps as in FIGS. 7 (d) to 7 (f). The contactability can be secured even when the diameter of the is large.
  • FIG. 16 is a front view of the contact probe 70
  • FIG. 16 (b) is a side view of the contact probe 70.
  • the land contact terminal 72 includes a land contact portion 72a in contact with the land 41 and a strip portion 72b extending in a strip shape from one end of the land contact terminal 72 in the direction of the solder ball 51.
  • the electrode contact terminal 71 includes a solder ball contact portion 71a in contact with the solder ball 51, and a connecting portion 71c connecting the solder ball contact portion sandwiching portions 71b at both ends.
  • the land contact terminal 72 is formed of a flat metal plate shown in FIG. Further, the electrode contact terminal 71 is formed by bending the connecting portion 71c in a W-shape on the flat metal plate shown in FIG. 17 (b). Therefore, when the connecting portion 71c is bent in a W shape, the solder ball contact portion 71a is formed at both ends, and the holding portion 71b is formed at the center. Also in the contact probe 70 according to the third embodiment, it is possible to remove the oxide film of the solder ball 51 by wiping when the solder ball contact portion 71 a contacts the solder ball 51.
  • FIG. 18 shows a modification of the third embodiment, which is an embodiment in which the solder ball contact portion 71a is folded in two steps as in FIGS. 7 (d) to 7 (f). Contactability can be ensured even when the size is large.
  • the contact probe according to the present invention and the inspection socket provided with the same can cope with mass production, and can effectively reduce the manufacturing cost and minimize the inter-electrode pitch of the inspection object. And is useful as a contact probe used when testing an electrical property of an IC or the like and a test socket provided with the same.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

[Problem] To provide: a contact probe which can be mass-produced and enables reduction of the production cost and minimization of the pitch between electrodes of a subject to be inspected; and an inspection socket. [Solution] A contact probe (10) is provided with: an electrode contact terminal (11) which comes into contact with a solder ball of an IC; a land contact terminal (12) which comes into contact with a land of a printed board; and a coil spring (13) which is provided between the electrode contact terminal (11) and the land contact terminal (12). The electrode contact terminal (11) is provided with: a solder ball contact part (11a) which comes into contact with the solder ball; and a band-like part (11b) which extends like a band from one end of the solder ball contact part (11a) in the direction toward the land. The land contact terminal (12) is provided with: a land contact part (12a) which comes into contact with the land; and a sandwiching/holding part (12b) that sandwiches and holds the band-like part (11b) of the electrode contact terminal (11).

Description

コンタクトプローブおよびそれを備えた検査ソケットContact probe and inspection socket provided with the same
　本発明は、例えば、半導体集積回路の電気的特性を検査する際に使用されるコンタクトプローブおよびそれを備えた検査ソケットに関する。 The present invention relates to, for example, a contact probe used when inspecting the electrical characteristics of a semiconductor integrated circuit and a test socket provided with the same.
　近年、この種の検査ソケットを介して電気的特性が検査される半導体デバイスや半導体集積回路等（以下「ＩＣ等」という。）において、アナログＩＣ等ではアナログ信号の高周波数化が進み、デジタルＩＣ等ではデジタル信号の高速化が進んでいる。これに伴い、信号伝送経路の短縮化が図れ、外部ノイズに強い垂直型のコンタクトプローブが検査ソケットに多用されるようになってきている（例えば、特許文献１参照）。 In recent years, in semiconductor devices, semiconductor integrated circuits, etc. (hereinafter referred to as "IC etc.") whose electrical characteristics are inspected via this type of inspection socket, the frequency of analog signals has been increased in analog ICs etc. The speed of digital signals has been advanced in Japan. Along with this, the signal transmission path can be shortened, and a vertical contact probe resistant to external noise has come to be frequently used for the inspection socket (for example, see Patent Document 1).
　特許文献１に開示された垂直型のコンタクトプローブを用いてＩＣ等を検査する検査ソケットの構成例を図１９に示す。図１９に示すように、従来の垂直型のコンタクトプローブ８０は、プランジャ８１および８２、コイルばね８３、ケース８４を備えている。プランジャ８１はＩＣ８５の半田ボール８５ａに接触し、プランジャ８２はプリント基板８６の電極パッド８６ａに接触する。電極パッド８６ａには、図示しない検査装置と接続するため、ワイヤ８７が半田付けされている。この構成により、コンタクトプローブ８０は、プリント基板８６を介して、ＩＣ８５の半田ボール８５ａと検査装置との間の信号を中継するようになっている。 An exemplary configuration of an inspection socket for inspecting an IC or the like using the vertical contact probe disclosed in Patent Document 1 is shown in FIG. As shown in FIG. 19, the conventional vertical contact probe 80 includes plungers 81 and 82, a coil spring 83 and a case 84. The plunger 81 contacts the solder ball 85 a of the IC 85, and the plunger 82 contacts the electrode pad 86 a of the printed circuit board 86. Wires 87 are soldered to the electrode pads 86a in order to connect to an inspection device (not shown). With this configuration, the contact probe 80 relays a signal between the solder ball 85a of the IC 85 and the inspection apparatus via the printed circuit board 86.
特開２００９－０８５９４８号公報（［００３４］～［００３６］、図７）JP, 2009-085948, A ([0034]-[0036], Drawing 7)
　しかしながら、従来の垂直型のコンタクトプローブ８０には、以下に示すような課題があった。 However, the conventional vertical contact probe 80 has the following problems.
　（１）従来のコンタクトプローブ８０のプランジャ８１および８２は、円筒形状の棒材より１本ずつ切削加工にて製作される。例えば、プランジャ８１および８２は、φ０．８ミリメートルの棒材を切削してφ０．３ミリメートル程度の太さに１本ずつ加工されて得られる。そのため、従来のコンタクトプローブ８０では、製作に多大な工数を要するため生産本数に限界があり、大量の生産には対応できないという課題があった。また、従来のコンタクトプローブ８０では、製作に多大な工数を要するとともに、切削量が比較的多いため材料費もかさみ、コスト低減が困難であるという課題もあった。 (1) The plungers 81 and 82 of the conventional contact probe 80 are manufactured by cutting one by one from a cylindrical bar. For example, the plungers 81 and 82 are obtained by cutting a bar of φ 0.8 mm and machining one by one to a thickness of about φ 0.3 mm. Therefore, the conventional contact probe 80 has a problem that the number of productions is limited because a large number of manufacturing steps are required, and it can not cope with mass production. Further, in the conventional contact probe 80, there are also problems that manufacturing requires a large number of man-hours, and the material cost is also increased because the amount of cutting is relatively large, which makes it difficult to reduce the cost.
　（２）また、コンタクトプローブ８０を用いた検査ソケットでは、プリント基板８６の材質として一般的には樹脂等の有機材料を用いるが、有機材料では線膨張係数が比較的大きく、周囲温度によりパターン間隔が変化しやすいので、ＩＣ等の電極間ピッチの極小化に対応できない。プリント基板８６の材質をセラミックとすれば、線膨張係数を有機材料よりも小さくできてＩＣ等の電極間ピッチの極小化に対応可能となるが、プリント基板８６のコストアップにより検査ソケットの製造コストが増大してしまう。 (2) Also, in the inspection socket using the contact probe 80, an organic material such as resin is generally used as the material of the printed board 86, but the organic material has a relatively large linear expansion coefficient, and the pattern interval depends on the ambient temperature Is easily changed, so it can not cope with the minimization of the inter-electrode pitch of an IC or the like. If the material of the printed circuit board 86 is ceramic, the linear expansion coefficient can be made smaller than that of the organic material, and it becomes possible to cope with the minimization of the pitch between electrodes such as IC. Will increase.
　本発明は、従来の課題を解決するためになされたものであり、大量生産に対応でき、製造コストの低減化および被検査体の電極間ピッチの極小化に対応することができるコンタクトプローブおよびそれを備えた検査ソケットを提供することを目的とする。 The present invention has been made to solve the conventional problems, can cope with mass production, can reduce the manufacturing cost, and can minimize the inter-electrode pitch of the test object, and a contact probe To provide a test socket with
　本発明のコンタクトプローブは、第１の接触端子と第２の接触端子を備え、第１の電子部品の外部接続端子である第１の電極と第２の電子部品の外部接続端子である第２の電極とを電気的に接続するコンタクトプローブであって、前記第１の接触端子が、一方端に前記第１の電極と接触する第１接触部が、他方端に帯状部が形成された板状の部材であり、前記第２の接触端子が、中央に結合部を、前記結合部の両端に２つの板状部を有する板状の部材を２つの板状部が対向するように前記結合部を前記少なくとも一回折り曲げて、前記帯状部の少なくとも１部を挟持する挟持部と前記第２の電極と接触する第２の接触部が形成されるものであり、前記挟持部の周囲に、前記第１の接触端子を前記第１の電極に押し当てるとともに前記第２の接触端子を前記第２の電極に押し当てるばねが装着される構成を有している。 The contact probe of the present invention comprises a first contact terminal and a second contact terminal, and a second electrode which is an external connection terminal of the first electronic component and an external connection terminal of the second electronic component. A contact probe for electrically connecting the first electrode to one of the electrodes, wherein the first contact terminal has a first contact portion contacting with the first electrode at one end, and a strip portion formed at the other end The second contact terminal has a coupling portion at the center, and a plate-like member having two plate portions at both ends of the coupling portion such that the two plate portions face each other A bending portion for bending the portion at least once to form a holding portion for holding at least a portion of the belt-like portion and a second contact portion for contacting the second electrode; The first contact terminal is pressed against the first electrode and the second contact terminal is The spring pressing the touch terminal to said second electrode has a structure to be mounted.
　この構成により、本発明のコンタクトプローブは、平面状の金属板で形成された第１および第２の接触端子を備えるので、従来のように、１本ずつ切削加工することなく、ケミカルエッチング技術や金型プレス技術を使用することにより、高精度で大量生産が可能であり、製造コストを低減することができる。 According to this configuration, the contact probe of the present invention is provided with the first and second contact terminals formed of planar metal plates, so that the chemical etching technique or the like can be performed without cutting one by one as in the prior art. By using the die pressing technology, mass production with high accuracy is possible, and the manufacturing cost can be reduced.
　また、本発明のコンタクトプローブを備えた検査ソケットでは、従来のように、高価なセラミック基板でプリント基板を構成することなく、垂直型のコンタクトプローブにより被検査体の電極間ピッチの極小化に対応することができる。 Further, in the inspection socket provided with the contact probe of the present invention, the vertical contact probe is used to cope with the reduction of the inter-electrode pitch of the inspection object without using the expensive ceramic substrate as in the prior art. can do.
　したがって、本発明のコンタクトプローブは、大量生産に対応でき、製造コストの低減化および被検査体の電極間ピッチの極小化に対応することができる。 Therefore, the contact probe of the present invention can cope with mass production, and can cope with the reduction of the manufacturing cost and the minimization of the interelectrode pitch of the test object.
　本発明のコンタクトプローブは、前記第１の接触端子は、前記第１の接触部に前記第１の電極と接触する２つ突起が形成されたものであり、前記第２の接触端子は、前記結合部をＵ字状に折り曲げて形成され、対向する板状部が前記帯状部の少なくとも一部を挟持する挟持部として、前記結合部が第２の接触部として機能し、前記ばねが、前記挟持部の少なくとも１部の周囲に装着される密巻ばねと、前記密巻ばねと直列に装着される粗巻ばねとで構成されている。 In the contact probe of the present invention, the first contact terminal has two protrusions formed in the first contact portion to be in contact with the first electrode, and the second contact terminal is the contact probe. The connecting portion is formed by bending the connecting portion into a U-shape, and the opposing plate-like portion functions as a holding portion for holding at least a part of the strip, the connecting portion functions as a second contact portion, and the spring It comprises a closely wound spring mounted around at least a part of the holding portion, and a roughly wound spring mounted in series with the closely wound spring.
　この構成により、第２の接触端子は、板状部材をＵ字状に１回折り曲げて形成することができる。 With this configuration, the second contact terminal can be formed by bending the plate-like member once in a U-shape.
　本発明のコンタクトプローブは、前記第１の接触部に前記第１の電極と接触する４つ突起が形成された構成を有する。 The contact probe of the present invention has a configuration in which four protrusions are formed in the first contact portion to be in contact with the first electrode.
　この構成により、本発明のコンタクトプローブは、第１の接触端子がより安定的に電極に接触することとなる。 With this configuration, in the contact probe of the present invention, the first contact terminal more stably contacts the electrode.
　本発明のコンタクトプローブは、前記第１の接触端子は、前記４つの突起のうちの２つの突起をそれぞれ含む平面状の金属板を重ね合わせて形成されたものである構成を有している。 The contact probe of the present invention has a configuration in which the first contact terminal is formed by overlapping planar metal plates each including two of the four protrusions.
　この構成により、本発明のコンタクトプローブは、第１の接触端子がより安定的に電極に接触することとなる。 With this configuration, in the contact probe of the present invention, the first contact terminal more stably contacts the electrode.
　本発明のコンタクトプローブは、前記第１の接触端子は、前記接触部において前記２つの突起をそれぞれ含む平面状の金属板が互いに離隔して対向している構成を有している。 In the contact probe of the present invention, the first contact terminal has a configuration in which flat metal plates each including the two protrusions at the contact portion are spaced apart and opposed to each other.
　この構成により、本発明のコンタクトプローブは、第１の接触端子がより安定的に電極に接触することとなる。 With this configuration, in the contact probe of the present invention, the first contact terminal more stably contacts the electrode.
　本発明のコンタクトプローブは、前記第２の接触端子は、前記結合部がＶ字形状に折り曲げられた形状を有している。 In the contact probe of the present invention, the second contact terminal has a shape in which the coupling portion is bent in a V-shape.
　この構成により、本発明のコンタクトプローブは、簡易な構造で電極とランドとの間の電気的導通を得ることができる。 With this configuration, the contact probe of the present invention can obtain electrical conduction between the electrode and the land with a simple structure.
　本発明のコンタクトプローブは、前記第２の接触端子は、前記結合部の両側に前記板状部から延伸する少なくとも２本の突起が形成された板状部材を２つの板状部が対向するように前記結合部をＵ字状に折り曲げ、前記突起を屹立させた形状を有し、前記板状部が前記挟持部として、前記突起が第１の接触部として機能する構成を有している。 In the contact probe according to the present invention, the second contact terminal has two plate-like members facing each other such that at least two protrusions extending from the plate-like portion are formed on both sides of the coupling portion. The connecting portion is bent in a U-shape, and the protrusion is erected, and the plate-like portion functions as the holding portion, and the protrusion functions as a first contact portion.
　この構成により、第１の接触端子は、板状部材をＵ字状に１回折り曲げて形成することができ、製造コストを低減することができる。 With this configuration, the first contact terminal can be formed by bending the plate-like member once in a U-shape, and the manufacturing cost can be reduced.
　本発明のコンタクトプローブは、前記第２の接触端子が前記結合部の両側に前記板状部から延伸する少なくとも２本の突起が形成された板状部材を２つの板状部が対向するように前記結合部をＭ字状に折り曲げ、前記突起を屹立させた形状を有し、前記板状部が前記挟持部として、前記突起が第１の接触部として機能する構成を有している。 In the contact probe according to the present invention, the two plate-like members face each other in a plate-like member in which at least two protrusions extending from the plate-like portion are formed on both sides of the coupling portion. The connecting portion is bent in an M shape, and the protrusion is erected, and the plate-like portion functions as the sandwiching portion, and the protrusion functions as a first contact portion.
　この構成により、第１の接触端子は、板状部材をＭ字状に２回折り曲げて形成することができ、製造コストを低減することができる。 With this configuration, the first contact terminal can be formed by bending the plate-like member twice in an M-shape, and the manufacturing cost can be reduced.
　本発明のコンタクトプローブは、前記第２の接触端子が、２つの板状部が対向するように前記結合部をＷ字状に折り曲げ、前記板状部が第１の接触部として、Ｗ字状に折り曲げられた前記結合部の中央凹部が前記挟持部として機能する構成を有している。 In the contact probe according to the present invention, the second contact terminal bends the coupling portion in a W shape such that the two plate portions face each other, and the plate portion serves as a first contact portion in a W shape. The central concave portion of the joint portion bent into two functions as the sandwiching portion.
　この構成により、第２の接触端子は、板状部材をＷ字状に２回折り曲げて形成することができ、製造コストを低減することができる。 With this configuration, the second contact terminal can be formed by bending the plate-like member twice in a W shape, and the manufacturing cost can be reduced.
　本発明の検査ソケットは、コンタクトプローブと、前記コンタクトプローブを収納する収納部が形成された筐体と、前記電極が設けられた前記被検査体を保持する被検査体保持部と、前記ランドが設けられた前記プリント基板と、を備え、前記電極および前記ランドの各中心線が前記コンタクトプローブの中心線上に位置している構成を有している。 The inspection socket according to the present invention comprises a contact probe, a housing in which a housing portion for housing the contact probe is formed, a test object holding portion for holding the test object provided with the electrode, and the land And the printed circuit board provided, wherein center lines of the electrodes and the lands are located on center lines of the contact probes.
　この構成により、本発明の検査ソケットは、大量生産に対応でき、製造コストの低減化および被検査体の電極間ピッチの極小化に対応することができる。 According to this configuration, the inspection socket of the present invention can cope with mass production, and can correspond to the reduction of manufacturing cost and the minimization of the inter-electrode pitch of the object to be inspected.
　本発明は、大量生産に対応でき、製造コストの低減化および被検査体の電極間ピッチの極小化に対応することができるという効果を有するコンタクトプローブおよびそれを備えた検査ソケットを提供することができるものである。 The present invention provides a contact probe and a test socket provided with the same, which have the effect of being able to cope with mass production, reducing the manufacturing cost and minimizing the interelectrode pitch of the test object. It is possible.
本発明に係る検査ソケットの第１の実施形態における構成図である。It is a block diagram in 1st Embodiment of the test | inspection socket which concerns on this invention. 本発明に係る検査ソケットの第１の実施形態において、検査中の状態を示す構成図である。In 1st Embodiment of the test | inspection socket which concerns on this invention, it is a block diagram which shows the state in test | inspection. 本発明に係るコンタクトプローブの第１の実施形態における構成図である。It is a block diagram in 1st Embodiment of the contact probe which concerns on this invention. 本発明に係るコンタクトプローブの第１の実施形態の部品の斜視図である。1 is a perspective view of a part of a first embodiment of a contact probe according to the present invention. 本発明に係るコンタクトプローブの第１の実施形態において、電極接触端子が傾いた場合の模式的な説明図である。In 1st Embodiment of the contact probe which concerns on this invention, it is typical explanatory drawing when an electrode contact terminal inclines. 本発明に係るコンタクトプローブの第１の実施形態における変形例１を示す図である。It is a figure which shows the modification 1 in 1st Embodiment of the contact probe which concerns on this invention. 本発明に係るコンタクトプローブの第１の実施形態における変形例２を示す図である。It is a figure which shows the modification 2 in 1st Embodiment of the contact probe which concerns on this invention. 本発明に係るコンタクトプローブの第１の実施形態における変形例３を示す図である。It is a figure which shows the modification 3 in 1st Embodiment of the contact probe which concerns on this invention. 本発明に係る検査ソケットの第２の実施形態における構成図である。It is a block diagram in 2nd Embodiment of the inspection socket which concerns on this invention. 本発明に係るコンタクトプローブの第２の実施形態における構成図である。It is a block diagram in 2nd Embodiment of the contact probe which concerns on this invention. 本発明に係るコンタクトプローブの第２の実施形態の部品の斜視図である。It is a perspective view of the components of a second embodiment of the contact probe according to the present invention. 本発明に係るコンタクトプローブの第２の実施形態における変形例１を示す図である。It is a figure showing modification 1 in a 2nd embodiment of a contact probe concerning the present invention. 本発明に係るコンタクトプローブの第２の実施形態における変形例１の部品の斜視図である。It is a perspective view of parts of modification 1 in a 2nd embodiment of a contact probe concerning the present invention. 本発明に係るコンタクトプローブの第２の実施形態における変形例２～４を示す図である。FIG. 14 is a view showing modifications 2 to 4 in the second embodiment of the contact probe according to the present invention. 本発明に係るコンタクトプローブの第２の実施形態における変形例５を示す図である。It is a figure which shows the modification 5 in 2nd Embodiment of the contact probe which concerns on this invention. 本発明に係るコンタクトプローブの第３の実施形態における構成図である。It is a block diagram in 3rd Embodiment of the contact probe which concerns on this invention. 本発明に係るコンタクトプローブの第３の実施形態の部品の斜視図である。It is a perspective view of the components of 3rd Embodiment of the contact probe which concerns on this invention. 本発明に係るコンタクトプローブの第３の実施形態における変形例１を示す図である。It is a figure which shows the modification 1 in 3rd Embodiment of the contact probe which concerns on this invention. 従来の検査ソケットの構成図である。It is a block diagram of the conventional test | inspection socket.
［第１の実施形態］
　以下、本発明の第１の実施形態について図面を用いて説明する。
　なお、以下の実施形態にあっては、第１の電子部品はＩＣであり、第２の電子部品はプリント基板である。
　また、第１の電極はＩＣの外部接続端子である半田ボールであり、第２の電極はプリント基板の外部接続端子であるランドである。 First Embodiment
Hereinafter, a first embodiment of the present invention will be described using the drawings.
In the following embodiments, the first electronic component is an IC, and the second electronic component is a printed circuit board.
The first electrode is a solder ball which is an external connection terminal of the IC, and the second electrode is a land which is an external connection terminal of the printed circuit board.
　図１に示すように、第１の実施形態における検査ソケット１００は、ＢＧＡ（Ball Grid Array）タイプのＩＣ５０を被検査体とし、ＩＣ５０の下面に設けられた半田ボール５１を介してＩＣ５０の電気的特性を検査するものである。なお、半田ボール５１は、本発明に係る電極を構成する。 As shown in FIG. 1, the inspection socket 100 in the first embodiment has a BGA (Ball Grid Array) type IC 50 as an inspection object, and the IC 50 is electrically connected through solder balls 51 provided on the lower surface of the IC 50. It inspects the characteristics. The solder ball 51 constitutes an electrode according to the present invention.
　検査ソケット１００は、コンタクトプローブ１０、筐体２０、ＩＣ搭載部３０、プリント基板４０を備える。なお、ＩＣ搭載部３０は、本発明に係る被検査体保持部を構成する。 The inspection socket 100 includes a contact probe 10, a housing 20, an IC mounting unit 30, and a printed circuit board 40. The IC mounting unit 30 constitutes an inspection object holding unit according to the present invention.
　コンタクトプローブ１０は、いわゆる垂直型のコンタクトプローブであって、半田ボール５１に接触する金属製の電極接触端子１１と、ランド４１に接触する金属製のランド接触端子１２と、電極接触端子１１とランド接触端子１２との間に設けられた金属製のコイルばね１３と、を備える。なお、電極接触端子１１およびランド接触端子１２は、それぞれ、本発明に係る第１および第２の接触端子を構成する。 The contact probe 10 is a so-called vertical contact probe, and the metal electrode contact terminal 11 in contact with the solder ball 51, the metal land contact terminal 12 in contact with the land 41, the electrode contact terminal 11 and the land And a metal coil spring 13 provided between the contact terminal 12 and the contact terminal 12. The electrode contact terminal 11 and the land contact terminal 12 respectively constitute first and second contact terminals according to the present invention.
　筐体２０は、電気的絶縁材料で形成された上側筐体部２１および下側筐体部２２を含む。上側筐体部２１と下側筐体部２２とは、図示しないねじで固定されている。上側筐体部２１には貫通孔２１ａが形成され、下側筐体部２２には貫通孔２２ａが形成されている。貫通孔２１ａと２２ａとで形成される収容部内にコンタクトプローブ１０の主要部が収納されるようになっている。 The housing 20 includes an upper housing portion 21 and a lower housing portion 22 formed of an electrically insulating material. The upper housing 21 and the lower housing 22 are fixed by screws (not shown). A through hole 21 a is formed in the upper housing portion 21, and a through hole 22 a is formed in the lower housing portion 22. The main portion of the contact probe 10 is accommodated in an accommodating portion formed by the through holes 21a and 22a.
　ＩＣ搭載部３０は、ＩＣ５０を保持した状態で、半田ボール５１が電極接触端子１１に接触するよう移動できるようになっている。 The IC mounting portion 30 can move so that the solder ball 51 contacts the electrode contact terminal 11 while holding the IC 50.
　プリント基板４０は、検査ソケット１００の下面側に配置され、電流供給回路や電圧測定回路からの配線（図示省略）が接続されるようになっている。プリント基板４０の上面にはランド４１が形成されている。 The printed circuit board 40 is disposed on the lower surface side of the inspection socket 100, and wires (not shown) from the current supply circuit and the voltage measurement circuit are connected. Lands 41 are formed on the upper surface of the printed circuit board 40.
　図２は、検査ソケット１００によるＩＣ５０の検査中の状態を示している。図２に示すように、ランド４１および半田ボール５１の各中心線がコンタクトプローブ１０の中心線上に位置している。電極接触端子１１は半田ボール５１に接触し、ランド接触端子１２はランド４１に接触している。電極接触端子１１とランド接触端子１２との間の電気的導通は、コイルばね１３により確保されている。コイルばね１３は、電極接触端子１１を半田ボール５１に押圧するよう付勢するとともに、ランド接触端子１２をランド４１に押圧するよう付勢するようになっている。 FIG. 2 shows the state under test of the IC 50 by the test socket 100. As shown in FIG. 2, the center lines of the lands 41 and the solder balls 51 are located on the center line of the contact probe 10. The electrode contact terminal 11 is in contact with the solder ball 51, and the land contact terminal 12 is in contact with the land 41. Electrical conduction between the electrode contact terminal 11 and the land contact terminal 12 is secured by a coil spring 13. The coil spring 13 biases the electrode contact terminal 11 against the solder ball 51 and biases the land contact terminal 12 against the land 41.
　次に、コンタクトプローブ１０の詳細な構成について、図３を中心に、適宜図１を用いて説明する。図３（ａ）は、コンタクトプローブ１０の正面図、図３（ｂ）は、コンタクトプローブ１０の側面図である。 Next, the detailed configuration of the contact probe 10 will be described with reference to FIG. 3 as needed, with reference to FIG. FIG. 3A is a front view of the contact probe 10, and FIG. 3B is a side view of the contact probe 10.
　図３（ａ）および（ｂ）に示すように、電極接触端子１１は、半田ボール５１に接触する半田ボール接触部１１ａと、電極接触端子１１の一端からランド４１の方向に帯状に延びる帯状部１１ｂと、を備える。なお、半田ボール接触部１１ａは、本発明に係る接触部を構成する。 As shown in FIGS. 3A and 3B, the electrode contact terminal 11 is a strip extending from the one end of the electrode contact terminal 11 in the direction of the land 41 from the solder ball contact portion 11a contacting the solder ball 51. And 11b. The solder ball contact portion 11a constitutes a contact portion according to the present invention.
　ランド接触端子１２は、ランド４１に接触するランド接触部１２ａと、電極接触端子１１の帯状部１１ｂの少なくとも一部を挟持する挟持部１２ｂと、を備える。 The land contact terminal 12 includes a land contact portion 12 a in contact with the land 41 and a sandwiching portion 12 b sandwiching at least a part of the strip 11 b of the electrode contact terminal 11.
　電極接触端子１１は、図４（ａ）に示す平面状の金属板で形成される。
　また、ランド接触端子１２は、図４（ｂ）に示す平面状の金属板を、ランド接触部１２ａを底としてＵ字状に折り曲げて形成される。したがって、電極接触端子１１およびランド接触端子１２は、ケミカルエッチング技術や金型プレス技術を使用することにより、高精度で大量生産が可能であり、製造コストを低減することができる。 The electrode contact terminal 11 is formed of a flat metal plate shown in FIG. 4 (a).
Further, the land contact terminal 12 is formed by bending the flat metal plate shown in FIG. 4B into a U shape with the land contact portion 12 a as a bottom. Therefore, the electrode contact terminal 11 and the land contact terminal 12 can be mass-produced with high accuracy by using the chemical etching technology and the die pressing technology, and the manufacturing cost can be reduced.
　コイルばね１３は、例えば表面が金メッキされた線材が密着して巻かれている密巻き部１３ａと、密巻き部１３ａよりも粗いピッチで巻かれている粗巻き部１３ｂと、を有する。密巻き部１３ａは、ランド接触端子１２の挟持部１２ｂの少なくとも一部の周囲に設けられている。粗巻き部１３ｂは、電極接触端子１１の帯状部１１ｂの外周に設けられている。コイルばね１３の径は均一である。なお、密巻き部１３ａおよび粗巻き部１３ｂは、それぞれ、本発明に係る第１のばねおよび第２のばねを構成する。 The coil spring 13 has, for example, a densely wound portion 13a in which a wire having a gold-plated surface is closely wound and wound, and a coarsely wound portion 13b wound at a coarser pitch than the closely wound portion 13a. The densely wound portion 13 a is provided around at least a part of the sandwiching portion 12 b of the land contact terminal 12. The coarsely wound portion 13 b is provided on the outer periphery of the strip portion 11 b of the electrode contact terminal 11. The diameter of the coil spring 13 is uniform. The closely wound portion 13a and the roughly wound portion 13b respectively constitute a first spring and a second spring according to the present invention.
　図３（ｂ）の上部に、コンタクトプローブ１０の断面Ａ－Ａを示す。コンタクトプローブ１０は、前述のように構成されているので、ＩＣ５０の検査時に、電極接触端子１１がＹ軸方向に傾いた場合でも、コイルばね１３の密巻き部１３ａによって傾きが制限され、かつ電極接触端子１１とランド接触端子１２との間の電気的導通がコイルばね１３によって確保できる。 The cross section AA of the contact probe 10 is shown at the top of FIG. 3 (b). Since the contact probe 10 is configured as described above, even when the electrode contact terminal 11 is inclined in the Y-axis direction during inspection of the IC 50, the inclination is limited by the closely wound portion 13a of the coil spring 13, and the electrode Electrical conduction between the contact terminal 11 and the land contact terminal 12 can be secured by the coil spring 13.
　一方、電極接触端子１１がＸ軸方向に傾いた場合でも、図５に模式的に示すように、電極接触端子１１はＢ部およびＣ部の２箇所においてランド接触端子１２の挟持部１２ｂと接触するので、コンタクトプローブ１０は、電極接触端子１１とランド接触端子１２との間の電気的導通を確実に確保することができる。 On the other hand, even when the electrode contact terminal 11 is inclined in the X-axis direction, as shown schematically in FIG. 5, the electrode contact terminal 11 contacts the sandwiching portion 12b of the land contact terminal 12 at two points of B and C portions. Thus, the contact probe 10 can ensure electrical conduction between the electrode contact terminal 11 and the land contact terminal 12.
　なお、前述のコイルばね１３は、密巻き部１３ａと粗巻き部１３ｂとで一体構成した例を挙げたが、密巻き部１３ａに代わる密巻きばねと、粗巻き部１３ｂに代わる粗巻きばねとによる２体構成としてもよい。この場合、密巻き部１３ａおよび粗巻き部１３ｂは同径とし、相互に対向して配置する。 The above-described coil spring 13 is exemplified as an example in which the closely wound portion 13a and the roughly wound portion 13b are integrally configured, but a closely wound spring replacing the closely wound portion 13a and a roughly wound spring replacing the rough wound portion 13b It is good also as 2 body composition by. In this case, the closely wound portion 13a and the roughly wound portion 13b have the same diameter and are disposed to face each other.
　以上のように、本実施形態におけるコンタクトプローブ１０は、平面状の金属板で形成された電極接触端子１１およびランド接触端子１２を備える構成としたので、従来のように、１本ずつ切削加工する必要がなく、ケミカルエッチング技術や金型プレス技術を使用することにより、高精度で大量生産が可能であり、製造コストを低減することができる。 As described above, since the contact probe 10 in the present embodiment is configured to include the electrode contact terminal 11 and the land contact terminal 12 formed of a flat metal plate, cutting is performed one by one as in the conventional case. There is no need for this, and by using chemical etching technology and die pressing technology, mass production with high accuracy is possible, and the manufacturing cost can be reduced.
　また、本発明のコンタクトプローブ１０を備えた検査ソケット１００は、従来のように、高価なセラミック基板でプリント基板４０を構成することなく、被検査体の電極間ピッチの極小化に対応することができる。 Further, the inspection socket 100 provided with the contact probe 10 of the present invention can cope with the minimization of the inter-electrode pitch of the inspection object without forming the printed circuit board 40 with an expensive ceramic substrate as in the prior art. it can.
　したがって、本発明のコンタクトプローブ１０は、大量生産に対応でき、製造コストの低減化および被検査体の電極間ピッチの極小化に対応することができる。 Therefore, the contact probe 10 of the present invention can cope with mass production, and can cope with the reduction of the manufacturing cost and the reduction of the inter-electrode pitch of the inspection object.
　なお、第１の実施形態において、電極接触端子１１を本発明に係る第１の接触端子とし、ランド接触端子１２を本発明に係る第２の接触端子として説明したが、本発明はこれに限定されない。すなわち、電極接触端子１１を本発明に係る第２の接触端子とし、ランド接触端子１２を本発明に係る第１の接触端子としてもよい。 In the first embodiment, the electrode contact terminal 11 is described as the first contact terminal according to the present invention, and the land contact terminal 12 is described as the second contact terminal according to the present invention, but the present invention is limited thereto I will not. That is, the electrode contact terminal 11 may be a second contact terminal according to the present invention, and the land contact terminal 12 may be a first contact terminal according to the present invention.
　次に、第１の実施形態の変形例について、図面を用いて説明する。なお、以下の説明においては前述した実施形態との差異を中心に記述する。 Next, a modification of the first embodiment will be described using the drawings. In the following description, differences from the above-described embodiment will be mainly described.
　（変形例１）
　変形例１について、図６を用いて説明する。第１の実施形態では、電極接触端子１１の半田ボール接触部１１ａは図６（ａ）に示す形状としていた。電極接触端子１１の変形例１は、図６（ｂ）に示すように、半田ボール接触部１１ａが４つの突起１１ｃ、１１ｄ、１１ｅ、１１ｆを有している。この形状は、例えば、図示のＶ字溝１１ｇを予め金型で作製しておき、プレス加工により形成することにより得られる。 (Modification 1)
The first modification will be described with reference to FIG. In the first embodiment, the solder ball contact portion 11 a of the electrode contact terminal 11 has the shape shown in FIG. In the first modification of the electrode contact terminal 11, as shown in FIG. 6B, the solder ball contact portion 11a has four protrusions 11c, 11d, 11e and 11f. This shape can be obtained, for example, by making the V-shaped groove 11g shown in the drawing in advance with a die and forming it by pressing.
　この構成により、半田ボール接触部１１ａが、より安定的に半田ボール５１に接触することとなる。 With this configuration, the solder ball contact portion 11a contacts the solder ball 51 more stably.
　なお、図６（ｂ）に示した形状を、図６（ｃ）に示すように、同形状の２枚の金属板１１Ａおよび１１Ｂを重ね合わせ、溶接、かしめ、接着等により接合して形成することもできる。 As shown in FIG. 6 (c), the two metal plates 11A and 11B of the same shape are formed by overlapping, welding, caulking, bonding, etc. to form the shape shown in FIG. 6 (b). It can also be done.
　（変形例２）
　変形例２について、図７を用いて説明する。変形例２における電極接触端子１５は、図７（ａ）～（ｃ）に示すように、図４（ａ）に示す形状の２枚の金属板で形成されている。
　すなわち、電極接触端子１５は、同形状の２枚の平面状の金属板が、溶接、かしめ、接着等により接合されて重ね合わせて形成されたものであり、半田ボール接触部１５ａと、帯状部１５ｂと、を備える。 (Modification 2)
The second modification will be described with reference to FIG. As shown in FIGS. 7A to 7C, the electrode contact terminal 15 in the second modification is formed of two metal plates having a shape shown in FIG. 4A.
That is, the electrode contact terminal 15 is formed by bonding and overlapping two flat metal plates of the same shape by welding, caulking, adhesion, etc. And 15b.
　半田ボール接触部１５ａが形成された平面状の金属板は、互いに離隔して対向している。２つの帯状部１５ｂは、溶接、かしめ、接着等により互いに接合されて重ね合わされている。 The planar metal plates in which the solder ball contact portions 15a are formed are mutually separated and opposed. The two strip portions 15b are joined and overlapped with each other by welding, caulking, adhesion or the like.
　この構成により、半田ボール接触部１５ａが、より安定的に半田ボール５１に接触することとなる。
　さらに、半田ボール接触部１５ａが半田ボール５１に接触するとき半田ボール接触部１５ａは半田ボール５１の形状に沿って拡がり、半田ボール５１の表面の酸化膜を削り取る（以下ワイピング）ことも可能となる。
　このワイピングにより、半田ボール接触部１５ａと半田ボール５１の接触抵抗を大きく低減できることとなる。
　なお、ワイピング量は半田ボール接触部１５ａの長さＬ、厚さｔおよび間隔ｄを適宜に定めることにより、調整可能である。 With this configuration, the solder ball contact portion 15a contacts the solder ball 51 more stably.
Furthermore, when the solder ball contact portion 15a contacts the solder ball 51, the solder ball contact portion 15a spreads along the shape of the solder ball 51, and it becomes possible to scrape off the oxide film on the surface of the solder ball 51 (hereinafter, wiping). .
By this wiping, the contact resistance between the solder ball contact portion 15a and the solder ball 51 can be greatly reduced.
The amount of wiping can be adjusted by appropriately setting the length L, the thickness t, and the distance d of the solder ball contact portion 15a.
　また、図７（ｄ）、（ｅ）および（ｆ）に示すように、半田ボール５１の径が比較的大きい場合には、半田ボール接触部１５ａを二段折り形状としてワイピング量を確保することも可能である。 Further, as shown in FIGS. 7D, 7E and 7F, when the diameter of the solder ball 51 is relatively large, the wiping amount can be secured by forming the solder ball contact portion 15a in a two-step folding shape. Is also possible.
　（変形例３）
　変形例３について、図８を用いて説明する。変形例３におけるコンタクトプローブ１６は、前述の実施形態におけるランド接触端子１２に代わるランド接触端子１２１を備える。ランド接触端子１２１は、平面状の金属板がランド４１側を頂点とするＶ字形状に折り曲げられて形成されている。また、ランド接触端子１２１は、Ｖ字形状の先端がランド４１に接触するランド接触部となる。 (Modification 3)
The third modification will be described with reference to FIG. The contact probe 16 in the third modification includes a land contact terminal 121 which replaces the land contact terminal 12 in the above-described embodiment. The land contact terminal 121 is formed by bending a planar metal plate into a V shape with the land 41 side as an apex. Further, the land contact terminal 121 is a land contact portion in which the V-shaped tip is in contact with the land 41.
　電極接触端子１１は、コイルばね１３が収縮することによりランド接触端子１２１のＶ字形状の内面に接触する内面接触部１１ｈおよび１１ｉを有する。 The electrode contact terminal 11 has inner surface contact parts 11 h and 11 i that contact the V-shaped inner surface of the land contact terminal 121 when the coil spring 13 contracts.
　この構成により、コンタクトプローブ１６は、簡易な構造でランド４１と半田ボール５１との間の電気的導通を得ることができる。 With this configuration, the contact probe 16 can obtain electrical continuity between the land 41 and the solder ball 51 with a simple structure.
［第２の実施形態］
　次に、本発明の第２の実施形態について説明する。 Second Embodiment
Next, a second embodiment of the present invention will be described.
　図９に示すように、第２の実施形態の検査ソケット６００は、コンタクトプローブ６０、筐体２０、ＩＣ搭載部３０、プリント基板４０を備える。なお、第１の実施形態と同一の構成要素には同一の参照番号を付して、詳細な説明は省略する。 As shown in FIG. 9, the inspection socket 600 according to the second embodiment includes a contact probe 60, a housing 20, an IC mounting unit 30, and a printed circuit board 40. The same components as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
　第２の実施形態のコンタクトプローブ６０は、半田ボール５１に接触する電極接触端子６１と、ランド４１に接触するランド接触端子６２と、電極接触端子６１とランド接触端子６２との間に設けられたコイルばね６３と、を備える。 The contact probe 60 of the second embodiment is provided between the electrode contact terminal 61 in contact with the solder ball 51, the land contact terminal 62 in contact with the land 41, and the electrode contact terminal 61 and the land contact terminal 62. And a coil spring 63.
　次に、コンタクトプローブ６０の詳細な構成について、図１０を中心に、適宜図９を用いて説明する。図１０（ａ）はコンタクトプローブ６０の正面図、図１０（ｂ）はコンタクトプローブ６０の側面図である。 Next, the detailed configuration of the contact probe 60 will be described with reference to FIG. 10 as needed, with reference to FIG. 10 (a) is a front view of the contact probe 60, and FIG. 10 (b) is a side view of the contact probe 60. As shown in FIG.
　図１０（ａ）および（ｂ）に示すように、ランド接触端子６２は、ランド４１に接触するランド接触部６２ａと、ランド接触端子６２の一端から半田ボール５１の方向に帯状に延びる帯状部６２ｂとを備える。
　また、電極接触端子６１は、半田ボール５１に接触する半田ボール接触部６１ａと、ランド接触端子６２の帯状部６２ｂの少なくとも一部を挟持する挟持部６１ｂと、両端の挟持部６１ｂを連結する連結部６１ｃを備える。
　なお、図１０（ｃ）はコンタクトプローブ６０の上面図、図１０（ｄ）は下面図である。 As shown in FIGS. 10A and 10B, the land contact terminal 62 includes a land contact portion 62a in contact with the land 41 and a strip portion 62b extending in a strip shape from one end of the land contact terminal 62 in the direction of the solder ball 51. And
Further, the electrode contact terminal 61 includes a solder ball contact portion 61a in contact with the solder ball 51, a sandwiching portion 61b sandwiching at least a part of the strip portion 62b of the land contact terminal 62, and a connection connecting the sandwiching portions 61b at both ends. A unit 61c is provided.
10 (c) is a top view of the contact probe 60, and FIG. 10 (d) is a bottom view.
　ランド接触端子６２は、図１１（ａ）に示す平面状の金属板で形成される。
　また、電極接触端子６１は、図１１（ｂ）に示す平面状の金属板を、連結部６１ｃを底としてＵ字状に折り曲げて形成される。
　すなわち、半田ボール接触部６１ａは連結部６１ｃの両側に挟持部６１ｂから延伸して設けられている。 The land contact terminal 62 is formed of a flat metal plate shown in FIG.
Further, the electrode contact terminal 61 is formed by bending the flat metal plate shown in FIG. 11B into a U shape with the connecting portion 61 c as the bottom.
That is, the solder ball contact portions 61a are provided so as to extend from the sandwiching portion 61b on both sides of the connecting portion 61c.
　したがって、連結部６１ｃをＵ字状に折り曲げると、半田ボール接触部６１ａは連結部６１ｃから離れて屹立し、半田ボール５１と接触することとなる。
　なお、第２の実施形態に係るコンタクトプローブ６０でも、半田ボール接触部６１ａが半田ボール５１と接触する際にワイピングにより、半田ボール５１の酸化膜を除去することが可能となる。 Therefore, when the connecting portion 61 c is bent in a U-shape, the solder ball contact portion 61 a separates from the connecting portion 61 c and stands up and comes into contact with the solder ball 51.
Also in the contact probe 60 according to the second embodiment, it is possible to remove the oxide film of the solder ball 51 by wiping when the solder ball contact portion 61 a contacts the solder ball 51.
　図１２は第２の実施形態の第１の変形例であって、半田ボール接触部６１ａの屹立長さを長くすることができるものである。
　すなわち、図１３に示すように半田ボール接触部６１ａと連結部６１ｃの分岐位置６１ｅから切り込み６１ｆを設けることにより、連結部６１ｃをＵ字状に折り曲げたときの半田ボール接触部の屹立長を長くすることが可能となる。
　この場合、連結部をＵ字状に折り曲げただけでは、挟持部６１ｂの間隔が大き過ぎるおそれがあるため、連結部をＭ字状に中折れとし、間隔を調整することも可能である。 FIG. 12 shows a first modification of the second embodiment, in which the erected length of the solder ball contact portion 61a can be increased.
That is, as shown in FIG. 13, by providing the notch 61f from the branch position 61e of the solder ball contact portion 61a and the connection portion 61c, the erected length of the solder ball contact portion when the connection portion 61c is bent in a U shape is long. It is possible to
In this case, the distance between the sandwiching portions 61b may be too large if the connecting portion is simply bent in a U-shape, so it is possible to adjust the distance by bending the connecting portion in an M-shape.
　図１４は第２の実施形態の第２～４の変形例であって、半田ボール接触部６１ａの屹立長さを長くすることができるものである。
　すなわち、第２の変形例（ａ）は、電極接触子６１の連結部６１ｃを中心として両側に逆向きの半田ボール接触部６１ａを設けたものであり、連結部６１ｃを逆Ｕ字状あるいはＭ字状に折り曲げると、半田ボール接触部６１ａが平行四辺形状に４本屹立する。
　第３の変形例（ｂ）は、２本の連結部６１ｃの外側に下向きの半田ボール接触部６１ａを、２本の連結部６１ｃの内側に上向きの半田ボール接触部６１ａを形成したものであり、連結部６１ｃを逆Ｕ字状あるいはＭ字状に折り曲げると、半田ボール接触部６１ａが３本屹立する。 FIG. 14 shows the second to fourth modified examples of the second embodiment, in which the erected length of the solder ball contact portion 61a can be increased.
That is, in the second modification (a), the solder ball contact portions 61a in the opposite direction are provided on both sides of the connection portion 61c of the electrode contact 61, and the connection portion 61c has a reverse U shape or M When it is bent in a letter shape, four solder ball contact portions 61a stand in a parallelogram shape.
In the third modification (b), a downward solder ball contact portion 61a is formed outside the two connection portions 61c, and an upward solder ball contact portion 61a is formed inside the two connection portions 61c. When the connecting portion 61c is bent in an inverted U-shape or M-shape, three solder ball contact portions 61a stand up.
　第４の変形例（ｃ）は、外側に２本の連結部６１ｃを設け、内部に４本の半田ボール接触部６１ａの切り込みを入れたものであり、連結部６１ｃの長さに関係なく、半田ボール接触部６１ａの長さを長くすることができる。
　本変形例でも、連結部６１ｃをＵ字型に折り曲げると、４本の半田ボール接触部６１ａが屹立する。 In the fourth modification (c), two connecting portions 61c are provided outside, and four solder ball contact portions 61a are cut in the inside, regardless of the length of the connecting portion 61c. The length of the solder ball contact portion 61a can be increased.
Also in this modification, when the connecting portion 61c is bent in a U-shape, the four solder ball contact portions 61a stand up.
　図１５は第２の実施形態の第４の変形例であって、図７（ｄ）～（ｆ）と同様に、半田ボール接触部６１ａを二段折りとした実施例であり、半田ボール５１の径が大きいときにも接触性を確保することができる。 FIG. 15 shows a fourth modification of the second embodiment, which is an embodiment in which the solder ball contact portion 61a is folded in two steps as in FIGS. 7 (d) to 7 (f). The contactability can be secured even when the diameter of the is large.
　［第３の実施形態］
　次に、本発明の第３の実施形態について説明する。 Third Embodiment
Next, a third embodiment of the present invention will be described.
　第３の実施形態のコンタクトプローブ７０は、図１６に示すように、半田ボール５１に接触する電極接触端子７１と、ランド４１に接触するランド接触端子７２と、電極接触端子７１とランド接触端子７２との間に設けられたコイルばね７３とを備える。
　なお、図１６（ａ）はコンタクトプローブ７０の正面図、図１６（ｂ）はコンタクトプローブ７０の側面図である。 In the contact probe 70 according to the third embodiment, as shown in FIG. 16, an electrode contact terminal 71 in contact with the solder ball 51, a land contact terminal 72 in contact with the land 41, an electrode contact terminal 71 and a land contact terminal 72. And a coil spring 73 provided therebetween.
16 (a) is a front view of the contact probe 70, and FIG. 16 (b) is a side view of the contact probe 70.
　図１６（ａ）および（ｂ）に示すように、ランド接触端子７２は、ランド４１に接触するランド接触部７２ａと、ランド接触端子７２の一端から半田ボール５１の方向に帯状に延びる帯状部７２ｂとを備える。
　また、電極接触端子７１は、半田ボール５１に接触する半田ボール接触部７１ａと、両端の半田ボール接触部挟持部７１ｂを連結する連結部７１ｃを備える。 As shown in FIGS. 16A and 16B, the land contact terminal 72 includes a land contact portion 72a in contact with the land 41 and a strip portion 72b extending in a strip shape from one end of the land contact terminal 72 in the direction of the solder ball 51. And
Further, the electrode contact terminal 71 includes a solder ball contact portion 71a in contact with the solder ball 51, and a connecting portion 71c connecting the solder ball contact portion sandwiching portions 71b at both ends.
　ランド接触端子７２は、図１７（ａ）に示す平面状の金属板で形成される。
　また、電極接触端子７１は、図１７（ｂ）に示す平面状の金属板を、連結部７１ｃをＷ字状に折り曲げて形成される。
　したがって、連結部７１ｃをＷ字状に折り曲げると、両端に半田ボール接触部７１ａ、中央に挟持部７１ｂが形成されることとなる。
　なお、第３の実施形態に係るコンタクトプローブ７０でも、半田ボール接触部７１ａが半田ボール５１と接触する際にワイピングにより、半田ボール５１の酸化膜を除去することが可能となる。 The land contact terminal 72 is formed of a flat metal plate shown in FIG.
Further, the electrode contact terminal 71 is formed by bending the connecting portion 71c in a W-shape on the flat metal plate shown in FIG. 17 (b).
Therefore, when the connecting portion 71c is bent in a W shape, the solder ball contact portion 71a is formed at both ends, and the holding portion 71b is formed at the center.
Also in the contact probe 70 according to the third embodiment, it is possible to remove the oxide film of the solder ball 51 by wiping when the solder ball contact portion 71 a contacts the solder ball 51.
　図１８は第３の実施形態の変形例であって、図７（ｄ）～（ｆ）と同様に、半田ボール接触部７１ａを二段折りとした実施例であり、半田ボール５１の径が大きいときにも接触性を確保することができる。 FIG. 18 shows a modification of the third embodiment, which is an embodiment in which the solder ball contact portion 71a is folded in two steps as in FIGS. 7 (d) to 7 (f). Contactability can be ensured even when the size is large.
　以上のように、本発明に係るコンタクトプローブおよびそれを備えた検査ソケットは、大量生産に対応でき、製造コストの低減化および被検査体の電極間ピッチの極小化に対応することができるという効果を有し、ＩＣ等の電気的特性を検査する際に使用されるコンタクトプローブおよびそれを備えた検査ソケットとして有用である。 As described above, the contact probe according to the present invention and the inspection socket provided with the same can cope with mass production, and can effectively reduce the manufacturing cost and minimize the inter-electrode pitch of the inspection object. And is useful as a contact probe used when testing an electrical property of an IC or the like and a test socket provided with the same.
　１０　コンタクトプローブ
　１１　電極接触端子
　１１Ａ　金属板
　１１ａ　半田ボール接触部
　１１ｂ　帯状部
　１１ｃ、１１ｄ、１１ｅ、１１ｆ　突起
　１１ｇ　Ｖ字溝
　１１ｈ　内面接触部
　１２　ランド接触端子
　１２ａ　ランド接触部
　１２ｂ　挟持部
　１３ａ　密巻き部
　１３ｂ　粗巻き部
　１５　電極接触端子
　１５ａ　半田ボール接触部
　１５ｂ　帯状部
　１６　コンタクトプローブ
　２０、ＩＣ　筐体
　２０　筐体
　２０、ＩＣ　筐体
　２１　上側筐体部
　２１ａ　貫通孔
　２２　下側筐体部
　２２ａ　貫通孔
　３０　ＩＣ搭載部
　４０　プリント基板
　４１　ランド
　５０　ＩＣ
　５１　半田ボール
　６０　コンタクトプローブ
　６１　電極接触端子
　６１ａ　半田ボール接触部
　６１ｂ　挟持部
　６１ｃ　連結部
　６１ｅ　分岐位置
　６２　ランド接触端子
　６２ａ　ランド接触部
　６２ｂ　帯状部
　７０　コンタクトプローブ
　７１　電極接触端子
　７１ａ　半田ボール接触部
　７１ｂ　挟持部
　７１ｂ　半田ボール接触部挟持部
　７１ｃ　連結部
　７２　ランド接触端子
　７２ａ　ランド接触部
　７２ｂ　帯状部
　８０　コンタクトプローブ
　８１　プランジャ
　８２　プランジャ
　８４　ケース
　８５　ＩＣ
　８５ａ　半田ボール
　８６　プリント基板
　８６ａ　電極パッド
　８７　ワイヤ
　１００　検査ソケット
　１２１　ランド接触端子 DESCRIPTION OF SYMBOLS 10 contact probe 11 electrode contact terminal 11A metal plate 11a solder ball contact part 11b strip part 11c, 11d, 11f protrusion 11g V-shaped groove 11h inner surface contact part 12 land contact terminal 12a land contact part 12b pinching part 13a closely wound part 13b Roughly wound portion 15 Electrode contact terminal 15a Solder ball contact portion 15b Striped portion 16 Contact probe 20, IC case 20 Case 20, IC case 21 Upper case portion 21a Through hole 22 Lower case portion 22a Through hole 30 IC Mounting part 40 Printed circuit board 41 Land 50 IC
DESCRIPTION OF SYMBOLS 51 solder ball 60 contact probe 61 electrode contact terminal 61a solder ball contact portion 61b holding portion 61c connecting portion 61e branch position 62 land contact terminal 62a land contact portion 62b band portion 70 contact probe 71 electrode contact terminal 71a solder ball contact portion 71b holding portion 71b solder ball contact portion holding portion 71c connection portion 72 land contact terminal 72a land contact portion 72b band portion 80 contact probe 81 plunger 82 plunger 84 case 85 IC
85a solder ball 86 printed circuit board 86a electrode pad 87 wire 100 inspection socket 121 land contact terminal

Claims (10)

  1. 　第１の接触端子と第２の接触端子を備え、第１の電子部品の外部接続端子である第１の電極と第２の電子部品の外部接続端子である第２の電極とを電気的に接続するコンタクトプローブであって、
    　前記第１の接触端子が、一方端に前記第１の電極と接触する第１接触部が、他方端に帯状部が形成された板状の部材であり、
    　前記第２の接触端子が、中央に結合部を、前記結合部の両端に２つの板状部を有する板状の部材を２つの板状部が対向するように前記結合部を前記少なくとも一回折り曲げて、前記帯状部の少なくとも１部を挟持する挟持部と前記第２の電極と接触する第２の接触部が形成されるものであり、
    　前記挟持部の周囲に、前記第１の接触端子を前記第１の電極に押し当てるとともに前記第２の接触端子を前記第２の電極に押し当てるばねが装着されるコンタクトプローブ。     A first electrode which is provided with a first contact terminal and a second contact terminal and which is an external connection terminal of the first electronic component and a second electrode which is an external connection terminal of the second electronic component are electrically connected. Contact probe to connect,
    The first contact terminal is a plate-like member in which a first contact portion contacting with the first electrode at one end and a band-like portion at the other end,
    The second contact terminal has a plate-like member having a coupling portion at the center and two plate-like portions at both ends of the coupling portion so that the two plate-like portions face each other at least once A holding portion for holding at least a portion of the strip portion and a second contact portion for contacting the second electrode are formed by bending.
    A contact probe in which a spring pressing the first contact terminal against the first electrode and pressing the second contact terminal against the second electrode is mounted around the sandwiching portion.
  2. 　前記第１の接触端子は、前記第１の接触部に前記第１の電極と接触する２つ突起が形成されたものであり、
    　前記第２の接触端子は、前記結合部をＵ字状に折り曲げて形成され、対向する板状部が前記帯状部の少なくとも一部を挟持する挟持部として、前記結合部が第２の接触部として機能し、
    　前記ばねが、前記挟持部の少なくとも１部の周囲に装着される密巻ばねと、前記密巻ばねと直列に装着される粗巻ばねとで構成される請求項１に記載のコンタクトプローブ。     The first contact terminal has two projections formed in the first contact portion to be in contact with the first electrode,
    The second contact terminal is formed by bending the connecting portion in a U-shape, and the opposing plate-like portion serves as a holding portion for holding at least a portion of the strip portion, and the connecting portion is the second contact portion Act as
    The contact probe according to claim 1, wherein the spring comprises a closely wound spring mounted around at least a part of the holding portion, and a roughly wound spring mounted in series with the closely wound spring.
  3. 　前記第１の接触端子は、前記第１の接触部に前記第１の電極と接触する４つ突起が形成されたものである請求項２に記載のコンタクトプローブ。 The contact probe according to claim 2, wherein the first contact terminal has four protrusions formed in the first contact portion to be in contact with the first electrode.
  4. 　前記第１の接触端子は、前記４つの突起のうちの２つの突起をそれぞれ含む平面状の金属板を重ね合わせて形成されたものである請求項３に記載のコンタクトプローブ。 The contact probe according to claim 3, wherein the first contact terminal is formed by overlapping planar metal plates each including two of the four protrusions.
  5. 　前記第１の接触端子は、前記接触部において前記２つの突起をそれぞれ含む平面状の金属板が互いに離隔して対向している請求項４に記載のコンタクトプローブ。 5. The contact probe according to claim 4, wherein planar metal plates respectively including the two protrusions at the contact portion of the first contact terminal are opposed to and separated from each other.
  6. 　前記第２の接触端子は、前記結合部がＶ字状に折り曲げられるものである請求項２から請求項５までのいずれか１項に記載のコンタクトプローブ。 The contact probe according to any one of claims 2 to 5, wherein the connection portion of the second contact terminal is bent in a V-shape.
  7. 　前記第２の接触端子は、前記結合部の両側に前記板状部から延伸する少なくとも２本の突起が形成された板状部材を２つの板状部が対向するように前記結合部をＵ字状に折り曲げ、前記突起を屹立させた形状を有し、前記板状部が前記挟持部として、前記突起が第１の接触部として機能する請求項１に記載のコンタクトプローブ。 The second contact terminal is a plate-like member having at least two protrusions extending from the plate-like portion formed on both sides of the connection portion in a U-shaped manner such that the two plate-like portions face each other. The contact probe according to claim 1, wherein the contact probe has a shape in which the protrusion is bent and erected, and the plate-like portion functions as the sandwiching portion, and the protrusion functions as a first contact portion.
  8. 　前記第２の接触端子は、前記結合部の両側に前記板状部から延伸する少なくとも２本の突起が形成された板状部材を２つの板状部が対向するように前記結合部をＭ字状に折り曲げ、前記突起を屹立させた形状を有し、前記板状部が前記挟持部として、前記突起が第１の接触部として機能する請求項１に記載のコンタクトプローブ。 The second contact terminal has an M-shaped connecting portion such that the two plate-shaped portions face each other in a plate-like member in which at least two protrusions extending from the plate-like portion are formed on both sides of the connecting portion. The contact probe according to claim 1, wherein the contact probe has a shape in which the protrusion is bent and erected, and the plate-like portion functions as the sandwiching portion, and the protrusion functions as a first contact portion.
  9. 　前記第２の接触端子は、２つの板状部が対向するように前記結合部をＷ字状に折り曲げ、前記板状部が第１の接触部として、Ｗ字状に折り曲げられた前記結合部の中央凹部が前記挟持部として機能する請求項１に記載のコンタクトプローブ。 In the second contact terminal, the coupling portion is bent in a W shape such that two plate portions face each other, and the plate portion is bent in a W shape as a first contact portion. The contact probe according to claim 1, wherein a central concave portion of the second electrode functions as the holding portion.
  10. 　請求項１から請求項９までのいずれか１項に記載のコンタクトプローブと、
    　前記コンタクトプローブを収納する収納部が形成された筐体と、
    　前記第１の電極が設けられた前記被検査体を保持する被検査体保持部と、
    　前記第２の電極が設けられた前記プリント基板と、
    　を備え、
    　前記第１の電極および前記第２の電極の各中心線が前記コンタクトプローブの中心線上に位置していることを特徴とする検査ソケット。     A contact probe according to any one of claims 1 to 9;
    A housing in which a storage unit for storing the contact probe is formed;
    An inspection object holding unit for holding the inspection object provided with the first electrode;
    The printed circuit board on which the second electrode is provided;
    Equipped with
    An inspection socket, wherein center lines of the first electrode and the second electrode are located on center lines of the contact probe.
PCT/JP2012/001782 2011-10-26 2012-03-14 Contact probe and inspection socket provided with same WO2013061486A1 (en)

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TWI588494B (en) 2017-06-21

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