JP2003149288A - Conductor inspecting apparatus having contact sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor inspection apparatus which prevents the positional deviation of thin metal wires due to heat expansion of a contact sheet, caused by heat of a semiconductor chip during measuring of electric characteristics of the chip, thereby stably measuring the electric characteristics. SOLUTION: The apparatus comprises a pressing head 11 for holding and pressing a semiconductor chip 1, an inspecting board 5 having conductive protrusions 6 corresponding to outer terminals 2 of a semiconductor chip, and a contact sheet 3 of an elastic material mounted between the head 11 and the inspecting board 5 with thin metal wires 4 buried in the sheet 3 for electrically connecting the outer terminals 2 of the chip located at the opposite position with the protrusions 6 on the inspection board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip, a contact sheet used in a semiconductor inspection device for measuring electrical characteristics of the semiconductor chip, and an inspection substrate. The present invention relates to a semiconductor inspection device having a contact sheet that prevents misalignment.

[0002]

2. Description of the Related Art FIG. 5 shows a conventional semiconductor inspection apparatus using a contact sheet 3. The contact sheet 3 is obtained by embedding a thin metal wire 4 made of phosphor bronze, BeCu, brass or the like in a silicone resin having elasticity. Such a contact sheet 3 is placed on the inspection substrate 5.

The semiconductor chip 1 to be inspected is, for example, a bare chip, a CSP (chip scale package) or the like, and has solder bumps 2 as external terminals. Such a semiconductor chip 1 is placed on the contact sheet 3 and pressed by the pressing head 11. At this time, the external terminals (solder bumps) 2 of the semiconductor chip 1 are pressed by the contact sheet 3, the contact sheet 3 is dented, and the external terminals 2 and the thin metal wires 4 come into contact with each other.

As shown in the partially enlarged view of FIG. 6, the upper end of the thin metal wire 4 pierces the external terminal 2 of the semiconductor chip 1,
Fixed. On the other hand, the lower end of the thin metal wire 4 is also pressed by the inspection substrate 5 and comes into contact with the electrode 7 on the inspection substrate 5. But,
The electrode 7 is generally made of an alloy (N
i, Au, Cu alloy), the tip of the thin metal wire 4 does not pierce the electrode, and the lower end of the thin metal wire 4 is not fixed.

In the semiconductor inspection apparatus using the contact sheet 3, the external terminals (solder bumps) 2 of the semiconductor chip 1 and the electrodes 7 on the inspection substrate 5 are connected by the thin metal wires 4 in this manner, so that the semiconductor chip Electrical characteristics are being measured.

[0006]

The coefficient of thermal expansion of the contact sheet is large as compared with the coefficient of thermal expansion of semiconductor chips and inspection substrates. In a semiconductor inspection device that uses a contact sheet in which fine metal wires are embedded, heat is generated in the semiconductor chip when measuring the electrical characteristics of the semiconductor chip.
Compared to semiconductor chips and inspection boards, contact sheets
It greatly expands. However, the upper end of the thin metal wire of the contact sheet is pierced and fixed to the external terminal (solder bump) of the semiconductor chip, but the lower end is only in contact with the electrode of the inspection board and is not fixed. Along with the expansion, the lower end of the thin metal wire is displaced, and the electrical contact between the semiconductor chip and the substrate electrode for inspection becomes unstable. As a result, there has been a problem that the measurement of electrical characteristics becomes unstable.

Therefore, an object of the present invention is to provide an elastic contact sheet in which fine metal wires are embedded between the semiconductor chip and the inspection substrate in order to stably obtain electrical contact between the semiconductor chip and the inspection substrate. In the semiconductor inspection device mounted with, it is possible to prevent the positional deviation of the thin metal wires due to the thermal expansion of the contact sheet, which is induced by the heat generation of the semiconductor chip during the measurement of the electrical properties of the semiconductor chip, so that the electrical properties can be measured stably. It is to be.

[0008]

A feature of the present invention is that it has a pressure head for holding a semiconductor chip and pressing the semiconductor chip, and a conductive projection corresponding to an external terminal of the semiconductor chip for inspection. A metal thin wire, which is placed between the substrate and the pressure head and the inspection substrate and electrically connects the external terminal of the semiconductor chip and the protrusion on the inspection substrate at the opposite position, is embedded. And a contact sheet made of an elastic material. here,
The conductive protrusions may be solder bumps.

Another feature of the present invention is that a pressure head for holding a semiconductor chip and pressing the semiconductor chip, an inspection substrate having a recessed electrode corresponding to an external terminal of the semiconductor chip, and the pressure An elastic contact sheet, which is placed between the head and the inspection substrate, and in which fine metal wires for electrically connecting the external terminals of the semiconductor chip and the electrodes on the inspection substrate, which are located opposite to each other, are embedded. And a semiconductor inspection device equipped with. Here, the recess may have a conical shape.

Another feature of the present invention is a pressure head for holding a semiconductor chip and pressing the semiconductor chip, an inspection substrate having electrodes corresponding to the external terminals of the semiconductor chip and protrusions on portions other than the electrodes. An elastic metal wire that is placed between the pressure head and the inspection board and that electrically connects an external terminal of the semiconductor chip and an electrode on the inspection board, which are located at opposite positions, to each other. A semiconductor inspection device equipped with a body contact sheet. Here, the protrusions may be resist protrusions. In addition, a part of the protrusion may enter the contact sheet.

Still another aspect of the present invention is a pressure head for holding a semiconductor chip and pressing the semiconductor chip, an inspection substrate having electrodes corresponding to external terminals of the semiconductor chip, and the pressure head. An elastic contact sheet, which is placed between the inspection board and in which metal thin wires for electrically connecting the external terminals of the semiconductor chip and the electrodes on the inspection board at opposite positions are embedded, There is provided a semiconductor inspection device comprising a frame which can be attached to the inspection substrate and which restrains deformation of the contact sheet in a horizontal direction with respect to a surface of the inspection substrate which comes into contact with the contact sheet.

[0012]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a semiconductor inspection apparatus according to a first embodiment of the present invention, which corresponds to a pressure head for holding a semiconductor chip and pressing the semiconductor chip, and an external terminal of the semiconductor chip. An inspection board having solder bumps at positions, and is placed between the pressure head and the inspection board,
It is provided with an elastic contact sheet in which metal thin wires for electrically connecting the external terminals of the semiconductor chip and the solder bumps on the inspection substrate at the opposite positions are embedded.

That is, this semiconductor inspection apparatus is configured to have the contact sheet 3 and the inspection substrate 5 having the electrodes of the solder bumps 6 attached to the upper surface, instead of the conventional electrodes. When the semiconductor chip 1 is pressed by the pressure head 11, the solder bumps 2 of the semiconductor chip penetrate into the contact sheet from the upper surface of the contact sheet 3 and the solder bumps 6 of the inspection substrate penetrate into the contact sheet from the lower surface of the contact sheet 3.
Both the upper and lower ends of the semiconductor chip 1 are pierced by the solder bumps (2, 6), and the semiconductor chip 1 and the inspection substrate 5 are electrically contacted with each other by the fine metal wires 4.

Since both the upper end and the lower end of the thin metal wire 4 are fixed in this manner, the thin metal wire 4 can be stably provided with electric characteristics without being displaced due to thermal expansion.

FIG. 2 is a sectional view showing a semiconductor inspection apparatus according to a second embodiment of the present invention, which corresponds to a pressure head for holding a semiconductor chip and pressing the semiconductor chip, and an external terminal of the semiconductor chip. An inspection substrate having an electrode with a recess at a position, is placed between the pressure head and the inspection substrate, and electrically connects an external terminal of a chip at an opposing position to an electrode on the inspection substrate. An elastic contact sheet in which fine metal wires are embedded.

That is, this semiconductor inspection apparatus is composed of a contact sheet 3 and an electrode 10 having a concave surface, that is, an inspection substrate 5 having a concave electrode 10 on its upper surface, instead of the conventional electrode. It When the semiconductor chip is pressed by the pressing head 11, the solder bumps 2 of the semiconductor chip penetrate into the contact sheet 3 from the upper surface of the contact sheet 3, and the upper ends of the thin metal wires 4 are pierced and fixed to the solder bump 2. The electrode 10 is pressed against the contact sheet 4 from the lower surface, and the thin metal wire 4 is
It is pushed in the concave part of and is restrained. Here, it is preferable that the concave portion of the electrode 10 has a conical shape so that the thin metal wire 4 can be easily inserted and located at the center of the electrode 10.

With such a structure, it is possible to stably inspect the electrical characteristics of the semiconductor without the metallic thin wire 4 being displaced due to thermal expansion.

FIG. 3 is a sectional view showing a semiconductor inspection apparatus according to a third embodiment of the present invention. A pressure head for holding a semiconductor chip and pressurizing the semiconductor chip, and a semiconductor chip for holding the semiconductor chip. A pressure head for applying pressure, an inspection substrate having electrodes and protrusions corresponding to the external terminals of the semiconductor chip, and an external terminal of the chip placed between the pressure head and the inspection substrate and facing each other. An elastic contact sheet in which fine metal wires for electrically connecting the electrodes on the inspection substrate are embedded is provided.

That is, in this semiconductor inspection apparatus, the contact sheet 3 and the inspection substrate 5 having the resist projections 8 are provided.
And is configured. Semiconductor chip 1 is pressure head 1
By being pressed by 1, the solder bumps 2 of the semiconductor chip 1 bite into the contact sheet 3 from the upper surface of the contact sheet 3, and the upper ends of the thin metal wires 4 pierce the solder bumps 2 and are fixed. At the same time, the projection 8 of the register bites into the lower surface of the contact sheet 3 and restrains the lower surface of the contact sheet 3 to indirectly restrain the movement of the lower end of the thin metal wire 4.

With the above construction, the upper and lower ends of the metal thin wire 4 are fixed, so that the metal thin wire 4 can be stably inspected for electrical characteristics without being displaced due to thermal expansion. Becomes

FIG. 4 is a sectional view showing a semiconductor inspection apparatus according to a fourth embodiment of the present invention. A pressure head for holding a semiconductor chip and pressurizing the semiconductor chip, and a semiconductor chip for holding the semiconductor chip. A head for pressing, an inspection substrate having electrodes corresponding to the external terminals of the semiconductor chip, an external terminal of the chip placed at a position facing the pressing head and the inspection substrate, and an inspection substrate. It is possible to attach the elastic contact sheet with the embedded metal wires that electrically connect the electrodes to the inspection board, and the contact sheet can be deformed in the horizontal direction with respect to the surface of the inspection board that contacts the contact sheet. And a frame for restraining.

That is, this semiconductor inspection apparatus is configured to have the contact sheet 3 and the inspection substrate 5 having the frame 9 surrounding the contact sheet 3. When the semiconductor chip is pressed by the pressing head 11, the solder bumps 2 of the semiconductor chip are exposed from the upper surface of the contact sheet 3.
Bites into the contact sheet 3, and the upper end of the thin metal wire 4 pierces the solder bump and is fixed. At the same time, the wire 9 of the inspection substrate 5 restrains the side surface of the contact sheet 3 and indirectly restrains the thin metal wire 4.

With the above-described structure, the metal fine wire 4 is restrained by the solder dump 2 of the semiconductor chip and the wire 9 of the inspection substrate 5, so that the metal fine wire 4 does not shift in position due to thermal expansion and the electrical characteristics of the semiconductor are improved. It becomes possible to carry out stably.

[0025]

According to the present invention, in order to obtain stable electrical contact between the semiconductor chip and the inspection substrate, a contact of an elastic body in which a thin metal wire is embedded between the semiconductor chip and the inspection substrate. In a semiconductor inspection device on which a sheet is placed, it is possible to prevent the positional deviation of the thin metal wires due to the thermal expansion of the contact sheet, which is induced by the heat generation of the semiconductor when measuring the electrical characteristics of the semiconductor, so that the electrical characteristics can be measured stably. be able to.

[Brief description of drawings]

FIG. 1 is a sectional view of a semiconductor inspection device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a semiconductor inspection device according to a second embodiment of the present invention.

FIG. 3 is a sectional view of a semiconductor inspection device according to a third embodiment of the present invention.

FIG. 4 is a sectional view of a semiconductor inspection device according to a fourth embodiment of the present invention.

FIG. 5 is a cross-sectional view of a conventional semiconductor inspection device in which a contact sheet is placed between a semiconductor and an inspection substrate.

FIG. 6 is a partially enlarged view of a conventional semiconductor inspection device.

[Explanation of symbols]

1 semiconductor chip 2 Solder bump 3 contact sheets 4 thin metal wires 5 Inspection board 6 Solder bump 7 electrodes 8 protrusions 9 Waku 10 recessed electrode 11 Pressure head

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2G003 AD09 AG07 AG08 AG12 AG20                       AH05                 2G011 AA15 AA21 AB06 AB07 AB08                       AC06 AC14 AE03 AF07                 2G132 AE04 AF02 AF06 AF10 AJ00                       AJ05 AL00 AL03                 4M106 DD03 DD09 DD13

Claims (8)

[Claims] 1. A pressure head for holding a semiconductor chip and pressing the semiconductor chip, an inspection substrate having an electrically conductive protrusion corresponding to an external terminal of the semiconductor chip, the pressure head and the inspection. And an elastic contact sheet embedded with thin metal wires for electrically connecting the external terminals of the semiconductor chip and the projections on the inspection substrate, which are placed between the external substrate and the inspection substrate. A semiconductor inspection device characterized by the above. 2. The semiconductor inspection apparatus according to claim 1, wherein the conductive protrusion is a solder bump. 3. A pressure head for holding a semiconductor chip and pressing the semiconductor chip, an inspection substrate having a recessed electrode corresponding to an external terminal of the semiconductor chip, the pressure head and the inspection substrate. And an elastic contact sheet embedded with thin metal wires for electrically connecting the external terminals of the semiconductor chip and the electrodes on the inspection substrate, which are placed between the external terminals of the semiconductor chip and the external terminals of the semiconductor chip, which are located opposite to each other. Characteristic semiconductor inspection equipment. 4. The semiconductor inspection apparatus according to claim 3, wherein the recess has a conical shape. 5. A pressure head for holding a semiconductor chip and pressing the semiconductor chip, an electrode corresponding to an external terminal of the semiconductor chip, and an inspection substrate having a protrusion on a portion other than the electrode, and the pressure head. An elastic contact sheet, which is placed between the inspection substrate and a metal thin wire embedded to electrically connect the external terminals of the semiconductor chip and the electrodes on the inspection substrate, which are located at opposing positions, to each other. A semiconductor inspection device characterized by being provided. 6. The semiconductor inspection apparatus according to claim 5, wherein the protrusion is a protrusion of a resist. 7. The semiconductor inspection apparatus according to claim 5, wherein a part of the protrusion is inserted into the contact sheet. 8. A pressure head for holding a semiconductor chip and pressing the semiconductor chip, an inspection substrate having electrodes corresponding to external terminals of the semiconductor chip, and between the pressure head and the inspection substrate. An elastic contact sheet having metal wires embedded therein for electrically connecting the external terminals of the semiconductor chip and the electrodes on the inspection substrate, which are placed and facing each other, and can be attached to the inspection substrate. A semiconductor inspection device, comprising: a frame which is capable of restraining deformation of the contact sheet in a horizontal direction with respect to a surface of the inspection substrate which comes into contact with the contact sheet.