JPH06349914A - Substrate - Google Patents

Abstract

PURPOSE:To provide a substrate which can easily but firmly come into contact with the mounted part such as an electronic part. CONSTITUTION:This substrate can be electrically conducted to the mounted part through the intermediary of an electrode, and the substrate 11 is composed of a substrate main body 12 which becomes the base, an inner layer wiring 13 wired inside the substrate main body 12, a conductive pattern part 14 which is a contact part with the mounted part, and an insulating layer 16 provided with a hole part 16a positioned on the conductive pattern part 14. Besides, a recessed type electrode is formed on the substrate 11 by the hole part 16a and the conductive pattern part 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode mounting technique for facilitating contact between a component mounted on a substrate, particularly an electronic component and a substrate on which the electronic component is mounted.

[0002]

2. Description of the Related Art An example of the structure of a conventional substrate is shown in a partial sectional view of FIG.

The structure of the substrate will be described with reference to FIG. 8. A substrate 1 for testing mounted components such as electronic components (not shown) is a substrate body 2 serving as a base and the substrate body 2
And the conductive pattern portion 4 which is a contact portion with the terminal of the mounted component.

Next, the contact between the mounted component and the substrate 1 when the mounted component is tested using the substrate 1 will be described. The contact is made through a connector (not shown), or Alternatively, the conductive pattern portion 4 provided on the surface of the substrate 1 is soldered or the spring pin 5 is pressed.

Here, since the substrate 1 to be tested, such as an LSI tester, is frequently replaced, the conductive pattern portion 4 which is the contact portion of the substrate 1 and the mounted component or the spring pin 5 are aligned with each other. For the sake of simplicity, the conductive pattern portion 4 is often formed to be slightly larger than the actual required size.

[0006]

However, in the prior art shown in FIG. 8, when the density of the conductive pattern portion 4 which is the contact portion of the substrate 1 is increased as the density of the LSI is increased, the conductive The area of the pattern portion 4 must be reduced.

As a result, it becomes difficult to align the contact portion between the substrate 1 and the mounted component.

Further, since the conductive pattern portion 4 is in a convex state and protrudes from the surface of the substrate body 2, when the fine pattern is formed, the spring pin 5 and the mounted component are connected to the conductive pattern portion. 4 may fall off and cause poor contact.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate that facilitates contact with a mounted component such as an electronic component and makes the substrate stronger.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, a substrate which can be electrically connected to a mounted component through an installed electrode,
A concave electrode is provided on the substrate.

The concave electrode is composed of a conductive pattern portion that comes into electrical contact with the terminals of the mounted component and an insulating layer provided with a hole located on the conductive pattern portion. It is a thing.

Further, the concave electrode comprises a substrate body having a tapered hole and the conductive pattern portion.

[0015]

According to the above-described means, since the concave electrode is provided on the substrate capable of electrically conducting with the mounted component, the contact portion of the electrode with the terminal of the mounted component is It is lower than the surrounding area.

Therefore, when the terminal and the spring pin of the mounted component are placed on the contact portion of the concave electrode, the self-aligning action allows natural alignment without using a special jig. Done.

[0017]

EXAMPLES Examples of the present invention will be described in detail below.

(Embodiment 1) FIG. 1 is a partial sectional view showing an example of the structure of a substrate which is an embodiment of the present invention.
FIG. 3 is a partial cross-sectional view showing an example of the contact state of the electrode portion when the spring pin 15 of the substrate according to FIG. 1 is used, and FIG. 3 is an example of the contact state of the electrode portion when the flat package of the substrate according to FIG. It is a fragmentary sectional view shown.

First, the structure of the board according to the present invention will be described with reference to FIG. 1. The board 11 is for testing mounted parts such as electronic parts (not shown). The board inner layer wiring 13 wired inside the board body 12, a conductive pattern portion 14 which is a contact portion with the mounted component, and the conductive pattern portion 1
4 and the insulating layer 16 having the holes 16a located on the upper surface of the insulating layer 16, and the substrate 11 according to the present invention further includes the holes 16a provided in the insulating layer 16 and the conductive pattern portion 14.
A concave electrode is formed by and.

Next, referring to FIG. 2, the spring pin 15
The operation of the substrate 11 in the case of performing a test using the above will be described. The contact between the spring pin 15 and the substrate 11, that is, electrical conduction is performed by the contact between the spring pin tip portion 15a and the conduction pattern portion 14 of the substrate 11. I,
At this time, since the conductive pattern portion 14 is located lower than the surface of the insulating layer 16, the spring pin tip portion 15a slides down the hole portion 16a by the pressure of a spring (not shown) built in the spring pin 15. , To the conductive pattern portion 14. As a result, contact between the substrate 11 and the spring pin 15, that is, electrical conduction is completed.

After the contact is completed, the spring pin tip portion 15a is surrounded by the hole 16a of the insulating layer 16, so that the substrate 11 and the spring pin 15 are easily displaced from each other and a contact failure may occur. Absent.

Next, the operation of the substrate 11 when the flat package 17 is mounted will be described with reference to FIG. 3. The contact between the flat package 17 and the substrate 11 is made by the leads 17a of the flat package 17 and the substrate 11 by contacting each other.
After the contact, the lead 17a is surrounded by the hole 16a of the insulating layer 16, so that the substrate 11 and the flat package 17 are easily displaced from each other to cause poor contact. There is no.

(Embodiment 2) FIG. 4 is a partial sectional view showing an example of the structure of a substrate which is another embodiment of the present invention.

A substrate 11 according to the second embodiment will be described with reference to FIG.
Explaining the configuration of the above, the substrate main body 12 serving as a base
And an inner layer wiring 1 of the substrate which is wired inside the substrate body 12.
3 and a conductive pattern portion 14 which is a contact portion with a mounted component (not shown).

In the substrate body 12, the conductive pattern portion 14 is formed at the location where the conductive pattern portion 14 is formed, and as a result, the conductive pattern portion 14 also has a tapered inner surface. It becomes a concave shape.

Therefore, in the substrate 11 according to the second embodiment, the tapered hole 16b provided in the substrate body 12 is provided.
The conductive pattern portion 14 forms a concave electrode.

Next, the operation of the substrate 11 according to the second embodiment when the spring pin 15 is used will be described. Since the conductive pattern portion 14 has a concave shape due to the tapered hole 16b provided in the substrate body 12, the above-described embodiment is used. Similar to the operation described in 1, the spring pin tip portion 15a
Slides down the inclined surface of the conductive pattern portion 14 and is aligned with the central portion thereof, whereby the substrate 11 and the spring pin 15 are brought into contact with each other and electrically connected.

After the contact, the spring pin tip portion 1
Since 5a is accommodated in the concave shape of the conductive pattern portion 14, the substrate 11 and the spring pin 15 are not easily displaced from each other and a contact failure or the like does not occur.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the boards described in Embodiments 1 and 2 are test boards (performance boards) for evaluating mounted components such as electronic parts, but the board according to the present invention is actually applied to products. It may be a substrate.

Further, the substrate body 12 described in the first and second embodiments may be made of resin or ceramic. Further, it may be made of metal as long as the necessary portion is insulated.

The concave electrode of the substrate according to the present invention is provided in the hole portion 16a of the electrode (see FIG. 1) shown in the first embodiment, and the electrode pattern 18 as shown in FIG.
The electrode may have a two-layer structure by attaching. With this structure, the contact between the spring pin 15 (see FIG. 2) or the mounted component and the substrate 11 can be made stronger.

Further, as shown in FIG. 6, the substrate 11 according to the present invention has the insulating layer 16 (see FIG.
Instead of the reference pattern), a concave electrode formed by applying the insulating resin 19 around the conductive pattern portion 14 may be provided.

Further, as shown in FIG.
The electrode of the substrate 11 for establishing electrical connection with 0 may be formed in a concave shape with a size to accommodate the substrate mounting component 20.

[0035]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1). Since the concave electrode is provided on the substrate that can be electrically connected to the mounted component, the alignment of the mounted component and the substrate at the time of contact becomes easy.

(2). Since the concave electrode is provided on the substrate that can be electrically connected to the mounted component, it is possible to prevent the positional displacement after the mounting component and the substrate are brought into contact with each other.

(3). Since the concave electrode is provided on the substrate that can be electrically connected to the mounted component, it is possible to protect the metal of the conductive pattern portion of the electrode.

(4). Since the positioning of the board and the mounted component at the time of contact is facilitated, it is not necessary to improve the positional accuracy of the electrodes provided on the board.

(5). Since the alignment when the substrate and the mounted component are in contact with each other is facilitated, the jig used in the conventional alignment can be simplified.

(6). When a spring pin is used to perform a test on the substrate according to the present invention, the tip of the spring pin is aligned with the concave electrode provided on the substrate by the pressure of the spring built in the spring pin. Therefore, it is very effective.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing an example of the structure of a substrate that is an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view showing an example of a contact state of an electrode portion when using a spring pin of a substrate which is an embodiment of the present invention.

FIG. 3 is a partial cross-sectional view showing an example of a contact state of electrode portions when a flat package is mounted on a substrate which is an embodiment of the present invention.

FIG. 4 is a partial cross-sectional view showing an example of the structure of a substrate according to a second embodiment of the present invention.

FIG. 5 is a partial cross-sectional view showing an example of the structure of a substrate according to another embodiment of the present invention.

FIG. 6 is a partial cross-sectional view showing an example of the structure of a substrate according to another embodiment of the present invention.

FIG. 7 is a partial cross-sectional view showing an example of the structure of a substrate according to another embodiment of the present invention.

FIG. 8 is a partial cross-sectional view showing an example of the structure of a conventional substrate.

[Explanation of symbols]

 1, 11 substrate 2, 12 substrate main body 3, 13 substrate inner layer wiring 4, 14 conduction pattern part 5, 15 spring pin 15a spring pin tip 16 insulating layer 16a hole 16b taper hole 17 flat package 17a lead 18 electrode pattern 19 Insulating resin 20 Board mounting parts

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Issuke Tsuji 5-20-1 Kamimizuhoncho, Kodaira-shi, Tokyo Hiratsuko ELS Engineering Co., Ltd. (72) Inventor Kenji Osawa Tokyo 5-20-1 Kamimizuhonmachi, Kodaira-shi Hitate Cho-LS Engineering Co., Ltd. (72) Inventor Shoichiro Harada 2326 Imai, Ome-shi, Tokyo Hitachi Device Development Center, Ltd.

Claims (3)

[Claims] 1. A substrate capable of being electrically connected to a mounted component through an electrode to be installed, wherein the substrate is provided with a concave electrode. 2. The concave electrode is composed of a conductive pattern portion that comes into electrical contact with a terminal of a mounted component and has an insulating layer provided with a hole located on the conductive pattern portion. The substrate according to claim 1, wherein: 3. The concave electrode comprises a conductive pattern portion that is in electrical contact with a terminal of a mounted component and has electrical conduction, and a tapered hole provided in a substrate body that serves as a base. The substrate according to claim 1.