JP2003297507A - Socket for electronic components and its manufacturing method as well as mounting structure using the socket for the electronic components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide as a socket of excellent electric characteristics and easy to manufacture, for use in mounting a semiconductor element or a semiconductor device. <P>SOLUTION: With the socket for electronic components mounting the electronic components in free demounting in interposition between the electronic components such as semiconductor elements or semiconductor devices and a mounting board and electrically connecting the electronic components and the mounting board, connecting terminals 52 with a conductive film 36 formed on the outer surface of resin bump 51a fitted in protrusion from a socket main body 51 integrated with it are arranged on a mounting side of the socket main body made of resin, and a contact terminal 40 each is arranged with a base end joined with an inside face of the conductive film 36, and the base end side sealed by being buried in the resin bump 52 and the socket main body 51, and at the same time, with its tip side formed in extension in a curved shape from a side contrary to the mounting face of the socket main body. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component socket, a method of manufacturing the same, and a mounting structure using the electronic component socket.

[0002]

2. Description of the Related Art The most widely used method for mounting a semiconductor element on a mounting board is to mount the semiconductor element on a lead frame or a circuit board (semiconductor package), and to mount it on outer leads or external connection terminals. Is a method of forming a semiconductor device having the connection terminal of and mounting the semiconductor device on a mounting board. Although a great variety of products are provided as semiconductor devices, the method of using a lead frame or a circuit board for mounting a semiconductor element requires a manufacturing cost, and thus a simpler and lower-cost mounting method is required. It has come to be demanded.

As a simple method for mounting a semiconductor element, for example, at a wafer stage, a chip size is formed to have a mounting terminal that can be mounted, and the individual semiconductor elements are mounted as they are from the wafer. Or a method in which a semiconductor element having only a connecting electrode is set in a socket and the entire socket is mounted on a mounting board. Of course, as a method of using a socket, there is also a method of mounting a semiconductor device having a semiconductor element mounted on a circuit board or the like in the socket.

[0004]

FIG. 10 shows a conventional mounting structure in which a semiconductor element is mounted using a socket (Japanese Patent Laid-Open No. 11-126800). In this mounting structure, the socket 12 is joined to the mounting board 10 made of a printed board through the solder balls 14, and the semiconductor device 1 is connected to the socket 12.
It is equipped with 6. The socket 12 is a support substrate 2 made of a resin substrate on the bottom of a frame 18 formed in a frame shape.
0 is joined to form an opening at the top. Through holes 22 are provided in the supporting substrate 20, contact terminals 24 are provided on lands provided on the upper surface of the supporting substrate 20 so as to be connected to the through holes 22, and solder balls are provided on lands provided on the lower surface of the supporting substrate 20. 14 are joined. The contact terminal 24 bonds the base end of the wire to the land,
The wire is bent and extended upward.

When the semiconductor device 16 is mounted on the socket 12, the semiconductor device 16 is inserted from above the socket 12 and the spring clip 26 is attached to the frame 18 so as to elastically press the semiconductor device 16 toward the support substrate 20. By attaching to. The contact terminal 24 is the semiconductor device 16
Is provided in the same plane arrangement as the land grid array type planar electrode 16a provided on the lower surface of the substrate of FIG. 1, and the semiconductor device 16 is pressed downward by the spring clip 26 so that the planar electrode 16a contacts the contact terminal. The semiconductor device 16 and the socket 12 are electrically connected to each other by pressure contact with the top of 24.

In the mounting structure using the socket 12 shown in FIG. 10, the semiconductor device 16 can be detachably mounted, the semiconductor device 16 can be easily mounted, and the semiconductor device 16 is set in the socket 12. Then, the semiconductor device 16 can be tested. However, in the conventional socket shown in FIG. 10, the through hole 22 is provided in the support substrate 20, and the solder ball 14 and the contact terminal 24 are joined to the lands formed at both ends of the through hole 22, thereby constructing the socket 12. However, there is a problem that it becomes complicated and the manufacturing cost is high. In addition, in the process of manufacturing the socket 12, in order to secure the elasticity of the contact terminal 24, when performing a heat treatment of about 250 ℃,
A resin having a high heat resistance such as a polyimide resin must be used as the supporting substrate 20, which causes a problem of increasing manufacturing cost.

In the mounting structure using the electronic component socket, the electronic component socket functions as an interposer for electrically connecting the mounting substrate and the semiconductor element. In the mounting structure shown in FIG. 10, the contact terminals 24 are provided on one surface of the support substrate 20, and the solder balls 14 are provided on the other surface, so that only one surface side of the support substrate 20 is elastically connected to a connecting portion such as a pad. However, by providing the contact terminal 24 also on the other surface of the support substrate 20,
It can be formed so that the connecting portions such as pads are elastically pressed and electrically connected to each other on both sides of the supporting substrate 20.
The electronic component socket having such a configuration can be used as an interposer that is interposed between electronic components and electrically connected to each other. However, it is difficult to form the contact terminals 24 on both surfaces of the support substrate 20 by a normal method, and there is a manufacturing problem that a special jig has to be prepared.

Therefore, the present invention has been made to solve these problems, and an object of the present invention is to allow a semiconductor device or the like to be detachably mounted and to electrically connect electronic components. An object of the present invention is to provide an electronic component socket which can be used as an interposer, can be mass-produced, and has excellent electrical characteristics, a method for manufacturing the same, and a mounting structure using the electronic component socket.

[0009]

The present invention has the following constitution in order to achieve the above object. That is, it is an electronic component socket that detachably mounts an electronic component interposed between an electronic component such as a semiconductor element or a semiconductor device and a mounting board and electrically connects the electronic component and the mounting board. On the mounting surface side of the socket body made of resin, a connection terminal formed by coating a conductor film on the outer surface of a resin bump provided integrally with the socket body and protruding from the socket body is provided. The base end is joined to the inner surface, the base end side is buried and sealed in the resin bump and the socket body, and the tip end side is formed to extend in a bent shape from the side opposite to the mounting surface of the socket body. It is characterized in that a contact terminal is provided.

An external connection terminal is joined to the connection terminal. Further, the electronic component socket, the connection terminals are assembled facing each other,
The connection terminals are integrally joined and electrically connected. Further, a supporting frame for supporting the socket body integrally with the socket body is provided on an outer peripheral edge of the socket body. Further, the contact terminal is formed of a wire.
In addition, an iron wire, a copper wire, a platinum wire, or the like can be used as the wire, and it is also effective to subject the wire to rigid plating in order to impart elasticity to the wire. Further, the contact terminal is formed by a lead piece. The lead piece can be formed by pressing or etching a metal plate.

Further, there is provided a mounting structure using an electronic component socket in which the electronic component socket is interposed between the electronic components and the electronic components are electrically connected to each other, wherein the electrode terminals of the electronic component and the electronic component are provided. While aligning the contact terminal of the electronic socket, the electronic component is elastically pressed toward the electronic component socket to electrically connect the electrode terminal of the electronic component and the contact terminal of the electronic component socket. It is characterized by

Further, an electronic component socket for detachably mounting the electronic component by interposing it between the electronic component such as a semiconductor element or a semiconductor device and the mounting substrate and electrically connecting the electronic component and the mounting substrate. And a step of forming the insulating coating on one surface of the metal plate in a resist pattern exposing a portion where a contact terminal of an electronic component socket is to be formed. ,
Etching the exposed portion of the metal plate using the resist pattern as a mask to form a recess on one surface of the metal plate, and the inner surface of the recess is not dissolved by the etching solution used when etching the metal plate The step of forming a conductor film made of metal and the contact terminal having the base end joined to the conductor film covering the inner bottom surface of the recess, the middle part being bent, and the tip side extending from the recess are Including a step of forming a standing frame in a standing state, a step of joining a support frame surrounding an area to be a socket body of the electronic component socket to one surface of the metal plate, and the recess surrounded by the support frame. Filling the resin in the region, curing the resin to seal the base end side of the contact terminal with the resin, and after sealing the base end side of the contact terminal with the resin,
A step of removing the insulating coating adhered to the other surface of the metal plate, and then etching and removing the metal plate. An appropriate metal material such as a copper plate can be used as the metal plate.

Further, the present invention is characterized in that the base end of the wire is joined to a conductor film covering the inner bottom surface of the recess, the wire is pulled up while being bent, and the pull-up end of the wire is melted to form a contact terminal. Further, after the contact terminal is formed, before the step of sealing the base end side of the contact terminal with a resin, the contact terminal is subjected to rigidity plating. In addition, after the rigid plating is performed, a heat treatment for increasing elasticity of the contact terminal is performed before the step of sealing the base end side of the contact terminal with a resin. Further, after the metal plate is removed by etching, the resist pattern deposited on one surface of the metal plate is removed.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The method for manufacturing an electronic component socket according to the present embodiment uses a metal plate as a base material used in a manufacturing step to support a contact terminal formed in a wire shape, and finally supports the contact terminal with a resin. And is used as a socket for electronic parts. In FIG. 1, a copper plate 30 is used as a metal material, and a copper plate 3 is used.
An embodiment of a manufacturing method for manufacturing an electronic component socket using 0 as a base material is shown.

FIG. 1A shows a copper plate 30 used as a base material in the manufacturing stage. The copper plate 30 is used as a support for contact terminals and the like, and is also used for the purpose of forming bumps of connection terminals to be joined to a mounting substrate when forming an electronic component socket. Although the thickness of the copper plate 30 can be selected as appropriate, it is usually about 0.1 to 0.5 mm. In an actual manufacturing process, a large-sized copper plate 30 on which a large number of individual sockets for electronic components can be formed is used as a work, and the whole work is subjected to processing such as exposure and development, and is manufactured. Figure 1
Then, for the sake of explanation, the manufacturing process is shown for a single electronic component socket.

FIG. 1 (b) shows a state in which both surfaces of the copper plate 30 are covered with a photosensitive resist which serves as an insulating film and exposed and developed to form resist patterns 32a and 32b. The resist pattern 32a formed on the upper surface (one surface) of the copper plate 30 has a portion corresponding to a portion where a contact terminal is formed in the electronic component socket, that is, a portion where a connection electrode for mounting is formed in the electronic component socket. It is formed by being exposed. In the figure, the portion A corresponds to the portion forming the contact terminal. Since the contact terminals are formed on the upper surface of the copper plate 30, the lower surface of the copper plate 30 is entirely covered with the resist pattern 32b. In this embodiment,
Since the guide hole is formed at the end of the copper plate 30, the resist patterns 32a and 32b are formed so as to expose the guide hole forming portion (B portion), but the guide hole may be provided if necessary. .

FIG. 1C shows a state where the exposed portions of the copper plate 30 are chemically etched by using the resist patterns 32a and 32b provided on both surfaces of the copper plate 30 as masks to form the recesses 34 on the upper surface of the copper plate 30. . The concave portion 34 becomes a portion where the connection electrode for mounting is formed in a bump shape when the socket for electronic parts is formed. The depth of the recess 34 can also be selected as appropriate. Usually, it may be about 0.1 to 0.3 mm. By this etching process, the recesses 34 are formed on the upper surface of the copper plate 30 in a plane arrangement and aligned in the vertical and horizontal directions at regular intervals.

FIG. 1D shows a state in which the conductor film 36 is formed on the inner surface of the recess 34 by plating as a pre-process for forming contact terminals by wire bonding. The conductor film 36 is preferably formed of a metal, such as palladium, which has good bonding properties when the contact terminals are formed by wire bonding. The copper plate 30 is finally chemically etched and removed, and the conductor film 36 becomes a portion exposed to the outer surface as a connection electrode of the electronic component socket. Therefore, the conductor film 36 needs to be formed of a metal that is not dissolved by an etchant that chemically etches the copper plate 30. From these points, palladium is suitable as a metal for forming the conductor film 36.
In consideration of being exposed to the outer surface as a connection electrode, for example, palladium plating and gold plating may be performed in this order to form the conductor film 36 in a plurality of layers.

Next, FIG. 1 (e) shows a state in which the support frame 38 is joined to the upper surface of the copper plate 30. The support frame 38 is formed into a rectangular frame shape in a plan view for each region where a single electronic component socket is formed, and is joined to the copper plate 30. The support frame 38 has a function of supporting the outer peripheral portion of the electronic component socket by keeping its shape, and the material thereof is not particularly limited as long as it has a certain strength and shape retaining property. In the present embodiment, a frame body made of a glass epoxy material is attached and attached to the upper surface of the copper plate 30. The support frame 38 also acts as a dam when potting the resin material forming the socket body of the electronic component socket. Therefore, the support frame 38 having a predetermined thickness is used in consideration of the thickness dimension of the socket body of the electronic component socket. The operation of adhering the support frame 38 to the upper surface of the copper plate 30 is performed by plating the conductive film 3
It may be performed before the step of forming 6 or after the step of forming the contact terminal 40 described below.

FIG. 1 (f) shows a recess 34 formed in the copper plate 30.
The state in which the contact terminal 40 is formed is shown. The contact terminal 40 is formed by a wire bonding method using a gold wire. That is, the base end of the gold wire is bonded to the inner bottom surface of the recess 34, the gold wire is pulled up from the recess 34, the capillary for operating the gold wire is once moved in the lateral direction to bend the gold wire into an L-shape, and then again. Bend upward to melt the gold wire. This makes it possible to obtain a contact terminal 40 having a laterally bent shape as shown in FIG. The reason why the contact terminal 40 is formed by bending the gold wire into an L shape is that the contact terminal 40 is easily bent in the vertical direction and has elasticity.

When the gold wire is bent and formed,
Since the contact terminal 40 does not have sufficient elasticity, after the contact terminals 40 are formed in all the recesses 34, in the present embodiment, the surfaces of the contact terminals 40 are nickel-cobalt plated and gold plated in this order to contact terminals. 40 was given elasticity (restoration). The nickel-cobalt plating is a rigid plating applied to increase the rigidity of the gold wire, and the gold plating is a protective plating for imparting the weather resistance of the contact terminal 40.

The elasticity of the contact terminal 40 becomes more effective by performing heat treatment after nickel-cobalt plating. This heat treatment may be performed after nickel-cobalt plating and before sealing the contact terminals 40 with the resin 42 described later. In this embodiment, the copper plate 3 is used as the base material.
Since 0 is used and the heat treatment is performed in the previous step of sealing the contact terminal 40 with the resin 42, there is an advantage that it is not necessary to use a material having high heat resistance for the resin 42. Note that this heat treatment can be performed simultaneously by utilizing the heating in this sealing step depending on the heating temperature in the step of sealing the base end side of the contact terminal 40 with the resin 42. In the present embodiment, nickel-cobalt plating is applied as the rigid plating that enhances the rigidity of the contact terminal 40, but other plating is also possible.

FIG. 2 shows a state in which the contact terminal 40 is formed in the recess 34 formed in the copper plate 30 as viewed from the upper surface side of the copper plate 30. In the present embodiment, as shown in the figure, the recesses 34 are arranged in the vertical and horizontal directions at regular intervals, and each recess 3
The contact terminals 40 are provided in a shape that is bent in an L shape in the same direction from 4 and stands up. Since the conductor film 36 having good bonding property is formed on the inner surface of the recess 34 by palladium plating or the like, the contact terminal 40 is reliably bonded to the conductor film 36.

FIG. 1 (g) shows that the gold wire is bonded by standing up on the inner bottom surface of the concave portion 34, and the gold wire is subjected to the rigid plating to form the contact terminal 40, and then within the area surrounded by the support frame 38. The state where the resin 42 is filled by potting and the resin 42 is cured is shown. By applying the resin 42 in the area surrounded by the support frame 38,
The resin 42 is filled in the recess 34 formed on the upper surface of the copper plate 30, and the base end side of the contact terminal 40 is buried in the resin 42 and sealed. In the present embodiment, the resin 42 is filled to the same height position as the upper surface of the support frame 38 to cure the resin 42, and the cured resin 42 and the support frame 38 are integrated. The contact terminal 40 has an L-shaped bent portion extending to the outside sealed by the resin 42.

In FIG. 1 (h), the resist pattern 32b adhered to the lower surface (the other surface) of the copper plate 30 of FIG. 1 (g) is removed by etching, and the copper plate 30 is further removed by etching. As a result, a state in which the electronic component socket 50 is formed is shown. By etching the resist pattern 32b and the copper plate 30, a resin bump whose outer surface is covered with the conductor film 36 is integrally formed with the socket body 51 to obtain the electronic component socket 50. As described above, since the conductor film 36 is made of a metal, such as palladium, which is not attacked by the etching solution for etching and removing the copper plate 30, the copper plate 30 is etched to form a conductor on the outer surface of the resin bump. The connection terminal 52 in which the film 36 is exposed and the conductor film 36 is adhered to the outer surface of the resin bump is obtained. In addition, the socket body 51 excluding the connection terminal 52
A resist pattern 32a is attached to the lower surface of the socket main body 51 and the socket main body 51 is attached to the outer peripheral edge of the socket main body 51.
It is held by a support frame 38 that is integrally provided with 1.

FIG. 3A shows another embodiment of the socket for electronic parts, which is the socket 5 for electronic parts shown in FIG. 1H.
The electronic component socket 50 in which the resist pattern 32a attached to the lower surface of the socket body 51 of No. 0 is removed by etching is shown. This electronic component socket is also shown in FIG.
Similar to the electronic component socket 50 shown in (h), the outer peripheral edge of the socket body 51 is supported by the support frame 38, and the resin bumps 51a protruding from the socket body 51 integrally with the socket body 51 are provided. A conductive film 36 is deposited on the outer surface of the connection terminal 52 to form the connection terminal 52.

FIG. 4 shows an enlarged structure of the connection terminal 52 of the electronic component socket 50. The resin bump 51a is a portion formed integrally with the socket body 51 and formed in a protruding shape, and the conductor film 36 covers the outer surface of the resin bump 51a facing the mounting substrate. The contact terminal 40 formed by wire-bonding a gold wire has a conductive film 36 at the base end.
Is bonded to the inner surface of the contact terminal 40, and the base end side of the contact terminal 40 is sealed and held by the resin bump 51a and the socket body 51. When palladium plating and gold plating are applied as the conductor film 36, the palladium plating layer is exposed on the outer surface of the conductor film 36 of the connection terminal 52.

FIG. 5 is a plan view of the electronic component socket 50 formed in the individual piece shown in FIG. 3 (a). The outer peripheral edge of the socket main body 51 is supported by the support frame 38, and the tip side of the contact terminal 40, which is sealed and supported by the socket main body 51 and is bent in an L-shape, is spaced at regular intervals in the vertical and horizontal directions. It is arranged to project from. In the manufacturing process, as described above, a large-sized work is used to perform the process of each process, and finally the work is cut into individual pieces to obtain individual electronic component sockets 50. Is.

FIG. 3B shows a state in which solder balls are joined as the external connection terminals 54 to the connection terminals 52 of the electronic component socket 50 shown in FIG. 3A. The external connection terminals 54 can be formed on each of the connection terminals 52 by printing or coating, and the external connection terminals 54 can be joined to each of the connection terminals 52 by reflow. External connection terminal 5 to connection terminal 52
By joining 4 to each other, the electronic component socket 50
It is possible to easily mount the semiconductor device or the like on the mounting board.

As described above, the electronic component socket 50
In the present embodiment, as a method of manufacturing the
The copper plate 30 is used as a base material for forming.
The copper plate 30 is removed by etching in a later process, but the material cost is much lower than that of a resin material such as polyimide, and in this respect, the manufacturing cost of the electronic component socket can be effectively reduced. .

Further, as shown in FIG. 3B, the electronic component socket 50 obtained by the above-described manufacturing method has a structure in which the contact terminal 40 and the external connection terminal 54 are connected with the conductor film 36 interposed therebetween. Therefore, there is an advantage that the contact terminal 40 and the external connection terminal 54 are connected to each other at the shortest distance, which makes it possible to improve the electrical characteristics during mounting. Moreover, since the contact terminal 40 is sealed by embedding the base end side in the resin bump 51a, the substantial height of the contact terminal 40 can be reduced, and the socket for electronic parts can be made thin. become.

The electronic component socket 50 shown in FIGS. 1 (h) and 3 is mounted on the socket body 5 by the support frame 38.
The electronic component socket 50 is reinforced by supporting the outer peripheral edge of the socket 1. However, when the socket body 51 itself has a sufficient strength, the socket frame 51 is supported by the support frame 38.
Need not be configured to hold. In this case, the support frame 38 acts as a dam when the resin 42 is filled.

In the electronic component socket 50 of the above embodiment, the gold wire is wire-bonded to the conductor film 36 provided on the inner surface of the recess 34 to form the contact terminal 40. However, the wire used in the wire bonding is the gold wire. However, iron wire, copper wire, platinum wire and the like can be used. Depending on the material of the wire, it is possible to provide the required elasticity without applying rigid plating. Further, as shown in FIG. 6, a lead piece 41 formed by pressing or etching a metal plate instead of the wire is joined to the conductor film 36 provided on the inner surface of the recess 34 to form the contact terminal 40. It is also possible to do so.

FIG. 7 shows a mounting structure for mounting the semiconductor element 60 using the electronic component socket 50 shown in FIG. 3B. In this mounting structure, the electronic component socket 50 is bonded and fixed to the opening on the lower side of the rectangular frame body 70, and the semiconductor element 60 is fixed to the frame body 70 using the inner surface of the frame body 70 as a guide surface.
The semiconductor element 60 is mounted by being pressed into the contact terminal 40 by the cap 72 with the cap 72. 74 is a cap 72
The elastic pressing piece attached to the inner surface of the semiconductor element 60 is pressed through the elastic pressing piece 74 by locking the cap 72 to the frame 70, and the electronic component socket 50
The electrode terminal 62 of the semiconductor element 60 is elastically pressed against the contact terminal 40 of.

The contact terminal 40 of the electronic component socket 50 has elasticity, and the semiconductor element 60 is covered by the cap 72.
By elastically pressing the contact terminal 40, the contact terminal 40 is slightly bent and the contact terminal 40 and the electrode terminal 62 are connected. Even if the height dimension of the contact terminal 40 varies slightly or the height position of the electrode terminal 62 of the semiconductor element 60 varies slightly, these variations are absorbed by the deflection of the contact terminal 40, and each of the semiconductor elements 60 is The electrode terminal 62 and the contact terminal 40 can be reliably connected. Of course, the electrode terminals 62 of the semiconductor element 60 and the contact terminals 40 of the electronic component socket 50 are designed so that the arrangement positions thereof match in advance. In this embodiment,
The frame 70, the cap 72, etc. align the semiconductor element 60 with the socket 50 for electronic parts, and mount it.
0 and the electronic component socket 50 are electrically connected to each other to constitute a supporting means (pressing means). A spring clip 26 as shown in FIG. 10 may be used as the pressing means.

In FIG. 7, reference numeral 80 is a mounting substrate, and 82 is a connection electrode formed on the surface of the mounting substrate 80. In the electronic component socket 50, the external electrode 5 is connected to the connection electrode 82.
It is possible to join to the mounting substrate 80 by solder joining to the connecting electrode 82 via the wiring 4. The mounting structure in which the semiconductor element is mounted using the electronic component socket 50 of the present embodiment is a mounting structure having excellent electrical characteristics because the contact terminal 40 and the external connection terminal 54 are connected at the shortest distance. Can be provided.

In the embodiment shown in FIG. 7, the semiconductor element 60 is mounted by using the electronic component socket 50. However, instead of the semiconductor element, the electronic component socket 50 has a structure such as a chip size package. It is also possible to mount a semiconductor device. In this case, the electronic component socket 50 acts as an interposer. Further, in the present embodiment, the electronic component socket 50 is fixed to the frame body 70 so that the semiconductor element 60 is accommodated in the frame body 70. However, the configurations of the frame body 70, the cap 72, etc. are similar to those of the above-described embodiment. The number is not limited and can be changed as appropriate.

As a method of mounting the semiconductor element 60,
It is also possible to previously bond the electronic component socket 50 to the mounting substrate 80 and mount the semiconductor element or the semiconductor device on the mounting substrate with the socket, to which the electronic component socket 50 is bonded. Further, in the case of a mounting board with a socket, it can be used as an inspection for judging the quality of a semiconductor element. That is, the electronic component socket is mounted in advance on the inspection board,
A semiconductor element can be set in this socket to determine the quality of the semiconductor element.

As the semiconductor element becomes smaller, the interval between the electrode terminals of the semiconductor element becomes extremely narrow.
It is difficult for the conventional inspection apparatus using the contact pins to make the pin interval narrower than a certain degree, and it may not be possible to inspect the semiconductor element in which the arrangement interval of the electrode terminals is narrower than a certain value. On the other hand, in the case of the inspection device using the electronic component socket of the present embodiment, the wire-shaped contact terminal 40 is configured to be pressed against the electrode terminal 62 of the semiconductor element 60 for inspection, and therefore the electrode terminal 62 is used. The contact terminals 40 can be arranged according to the arrangement of the electrode terminals 62 even if the arrangement interval of the electrode terminals is narrowed, and it is possible to reliably inspect even a semiconductor element in which the arrangement intervals of the electrode terminals 62 are extremely narrow. .

FIG. 8 shows the electronic component socket 50 described above.
The method of forming the socket for electronic parts used for an interposer using this, and the structure of the socket for electronic parts are shown. In this electronic component socket, contact terminals 40 are arranged on both sides of a flat plate-shaped socket body 91, respectively, and the contact terminals 40 at symmetrical positions with the socket body 91 sandwiched therebetween are electrically connected. is there.

The electronic component socket 90 of this embodiment is
The electronic component socket 50 shown in FIG.
The two are opposed to each other so that they face each other (FIG. 8A), and the connection terminals 52 at the opposing positions are joined and integrated.
To electrically connect and join the connection terminals 52, a solder paste is applied to the connection terminals 52, and a jig is used to make the connection terminals 52 abut each other so that the electronic component socket 50
And the connection terminal 52 may be joined by reflow. Since the conductor film 36 is exposed on the outer surface of the connection terminal 52, the connection terminal 52 can be easily joined by soldering. It is also possible to join the connection terminals 52 using an electrically conductive adhesive or the like other than solder.

The socket body 9 is sandwiched by the socket body 91.
1. Contact terminals 4 arranged symmetrically on one surface and the other surface
0 is electrically connected via the conductor film 36 and the solder 92. As shown in FIG. 8B, the electronic component socket 90 according to the present embodiment is bent in an L shape on both surfaces of a socket body 91 formed of a resin having electrical insulation and formed in a flat plate shape. The contact terminal 40 is formed to have an exposed tip. In the present embodiment, the contact terminals 40 are bent in the same direction on both sides of the socket body 91, but the bending direction of the contact terminals 40 can be appropriately selected. The contact terminal 40 is similar to that shown in FIG.
They are arranged in the one plane area at predetermined intervals in the vertical and horizontal directions.

As described above, the electronic component socket 50 can be easily manufactured by using the copper plate 30 as the base material, and the electronic component socket 50 is combined to contact both sides of the socket body 91. It is also easy to manufacture the electronic component socket 90 including the terminal 40. In the above embodiment, the electronic component socket 50 shown in FIG. 3 (a) is used when forming the electronic component socket 90. However, the lower surface of the socket body 51 shown in FIG. 1 (h) is used. The electronic component socket 50 to which the resist pattern 32a is attached may be used.

FIG. 9 shows an example in which a test device is formed as an example of using the electronic component socket 90. 100 in the figure
Is a substrate for inspection, and 100a is an electrode terminal of the substrate for inspection 100. 93a is a semiconductor element which is an object to be inspected, 93a
Is an electrode terminal of the semiconductor element 93. The electronic component socket 90 is elastically pressed and supported by the elastic pressing piece 74 between the semiconductor element 93 and the inspection substrate 100. The contact terminal 40 provided on the electronic component socket 90 is
Due to the compressive force of the elastic pressing piece 74, the electrode terminals 93a of the semiconductor element 93 and the electrode terminals 100a of the inspection substrate 100 are slightly bent and pressed against each other, so that the semiconductor element 93 and the inspection substrate 100 are securely electrically connected. Can be connected.

In the test apparatus of this embodiment, the elasticity of the contact terminal 40 is used to electrically connect to the connecting portion. Therefore, even when the inspection substrate 100 or the semiconductor element 93 is slightly bent during the test, It is possible to follow the deflection and make an accurate electrical connection. The test apparatus is not limited to a semiconductor element as an object to be inspected, but a semiconductor device having a semiconductor element mounted on a substrate can be an inspection target. The mounting structure of the present embodiment shows an example in which the electronic component socket 90 is used as an interposer as a testing device for semiconductor elements and the like, but the electronic component socket 90 is interposed in the middle of the electronic components to relay electrical connection. It can be used in various forms as an interposer.

[0046]

The socket for electronic parts according to the present invention can be suitably used as a socket for mounting a semiconductor element or a semiconductor device on a mounting board, and can be provided as a thin and compact socket for various purposes. It is possible to use. Further, according to the method for manufacturing an electronic component socket of the present invention, since the copper plate is used as the base material, the electronic component socket can be manufactured at low cost, and the electronic component socket can be mass-produced efficiently. You can Further, according to the mounting structure using the socket for electronic parts according to the present invention, it is possible to easily mount a semiconductor element or a semiconductor device and to provide a mounting structure having excellent electrical characteristics. It works.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a method for manufacturing an electronic component socket according to the present invention.

FIG. 2 is a plan view showing a state in which a contact terminal is bonded to a copper plate.

FIG. 3 is a cross-sectional view showing a configuration of an electronic component socket according to the present invention.

FIG. 4 is an enlarged cross-sectional view showing a configuration of a connection terminal.

FIG. 5 is a plan view of the electronic component socket as seen from the surface side on which the contact terminals are formed.

FIG. 6 is an explanatory diagram when a lead piece is used as a contact terminal.

FIG. 7 is a sectional view showing a mounting structure in which a semiconductor element is mounted using an electronic component socket.

FIG. 8 is an explanatory diagram showing a configuration of another embodiment of an electronic component socket.

FIG. 9 is an explanatory diagram showing an example of using an electronic component socket as an interposer.

FIG. 10 is a cross-sectional view showing a conventional configuration of an electronic component socket.

[Explanation of symbols]

Flat electrode 12 socket 30 copper plate 32a, 32b resist pattern 34 recess 36 Conductor film 38 Support frame 40 contact terminals 42 resin 50 Socket for electronic parts 51 socket body 51a Resin bump 52 Connection terminal 54 External connection terminal 60 Semiconductor element 62 electrode terminals 70 frame 72 cap 74 Elastic pressing piece 80 mounting board 82 Connection electrode 90 Socket for electronic parts 91 Socket body 93 Semiconductor device 100 inspection board

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01R 43/00 H01R 43/00 B (72) Inventor Masahiro Keizuka 711 Address, Kurita, Nagata, Nagano Prefecture Shinko Electric Industry Co., Ltd. (72) Inventor Akinori Shiraishi 711, Torita, Kurita character, Nagano City, Nagano Shinko Electric Industry Co., Ltd. F term (reference) BA08 BB02

Claims (12)

[Claims] 1. An electronic component socket for detachably mounting an electronic component, which is interposed between an electronic component such as a semiconductor element or a semiconductor device and a mounting substrate, and electrically connecting the electronic component and the mounting substrate. In the mounting surface side of the socket body made of resin, a connection terminal is formed by coating a conductor film on the outer surface of a resin bump provided integrally with the socket body and protruding from the socket body, The base end is joined to the inner surface of the conductor film, the base end side is buried and sealed in the resin bump and the socket body, and the tip end side extends in a bent shape from the side opposite to the mounting surface of the socket body. A socket for electronic parts, which is provided with a contact terminal formed as described above. 2. The socket for electronic parts according to claim 1, wherein an external connection terminal is joined to the connection terminal. 3. The socket for electronic parts according to claim 1,
A socket for electronic parts, characterized in that connecting terminals are combined so as to face each other, and the connecting terminals are integrally joined and electrically connected. 4. The socket for electronic parts according to claim 1, wherein a supporting frame for supporting the socket body integrally with the socket body is provided on an outer peripheral edge of the socket body. 5. The socket for electronic parts according to claim 1, 2, 3, or 4, wherein the contact terminal is formed of a wire. 6. The socket for electronic parts according to claim 1, 2, 3 or 4, wherein the contact terminal is formed by a lead piece. 7. A mounting structure using an electronic part socket in which the electronic part socket according to claim 1 is interposed between electronic parts and the electronic parts are electrically connected to each other. , Aligning the electrode terminal of the electronic component and the contact terminal of the socket for electronic component, and elastically pressing the electronic component toward the socket for electronic component, for the electrode terminal of the electronic component and the electronic component A mounting structure using a socket for electronic parts, which is characterized in that a contact terminal of the socket is electrically connected. 8. An electronic component socket for removably mounting an electronic component interposed between an electronic component such as a semiconductor element or a semiconductor device and a mounting substrate and electrically connecting the electronic component and the mounting substrate. And a step of forming an insulating coating on both surfaces of the metal plate, and forming an insulating coating on one surface of the metal plate in a resist pattern that exposes a portion where a contact terminal of an electronic component socket is to be formed, A step of etching an exposed portion of the metal plate by using the resist pattern as a mask to form a recess on one surface of the metal plate, and the inner surface of the recess may be dissolved depending on an etching solution used for etching the metal plate. And a step of forming a conductor film made of a metal, the base end of which is joined to the conductor film covering the inner bottom surface of the recess,
Forming a contact terminal in which a midway portion is bent and a tip end side of which extends from the recess in a state of standing in each of the recesses; and on one surface of the metal plate, a socket body of an electronic component socket is formed. A step of joining a support frame surrounding the area, a step of filling a resin in an area including the recess surrounded by the support frame, curing the resin, and sealing the base end side of the contact terminal with the resin. After the base end side of the contact terminal is sealed with a resin, the insulating film adhered to the other surface of the metal plate is removed, and then the metal plate is etched and removed. A method for manufacturing an electronic component socket, comprising: 9. A contact terminal is formed by joining a base end of a wire to a conductor film covering an inner bottom surface of a recess, pulling the wire while bending it, and fusing the pulling end of the wire. 8. A method for manufacturing an electronic component socket according to item 8. 10. The rigid plating is applied to the contact terminal after the contact terminal is formed and before the step of sealing the base end side of the contact terminal with resin.
A method for manufacturing a socket for an electronic component as described above. 11. The heat treatment for increasing the elasticity of the contact terminal is performed after the rigid plating and before the step of sealing the base end side of the contact terminal with a resin. Manufacturing method of electronic component socket. 12. After removing the metal plate by etching,
The resist pattern deposited on one surface of the metal plate is removed.
1. A method for manufacturing an electronic component socket according to 1.