JP4065145B2 - Manufacturing method of socket for electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a socket for electronic components.It relates to the manufacturing method.
[0002]
[Prior art]
  The most widely used method for mounting a semiconductor element on a mounting board is to mount the semiconductor element on a lead frame or a circuit board (semiconductor package), and to provide connection terminals for mounting such as outer leads or external connection terminals. In this method, a semiconductor device is formed, and the semiconductor device is mounted on a mounting substrate. A wide variety of products are provided as semiconductor devices, but the method of using a lead frame or a circuit board for mounting semiconductor elements requires a manufacturing method that requires simpler and lower cost mounting methods. Has come to be.
[0003]
  As a method for simply mounting a semiconductor element, for example, a method of mounting a semiconductor element separated from a wafer as it is formed into a form having a mounting terminal mountable in a chip size at the wafer stage, Alternatively, there is a method of setting a semiconductor element having only a connection electrode in a socket and mounting the socket together with a mounting substrate. Of course, a method using a socket includes a method in which a semiconductor device having a semiconductor element mounted on a circuit board or the like is mounted on the socket and mounted.
[0004]
[Problems to be solved by the invention]
  FIG. 17 shows a conventional mounting structure in which a semiconductor element is mounted using a socket (Japanese Patent Laid-Open No. 11-126800). In this mounting structure, a socket 12 is joined to a mounting board 10 made of a printed board via a solder ball 14, and a semiconductor device 16 is mounted on the socket 12. The socket 12 is formed in a shape in which a support substrate 20 made of a resin substrate is bonded to the bottom of a frame 18 formed in a frame shape and an upper portion is opened. The support substrate 20 is provided with a through hole 22, a contact terminal 24 is provided on a land provided on the upper surface of the support substrate 20 and connected to the through hole 22, and a solder ball 14 is provided on a land provided on the lower surface of the support substrate 20. It is joined. In the contact terminal 24, the base end of the wire is bonded to the land, and the wire is bent and extended upward.
[0005]
  When the semiconductor device 16 is mounted on the socket 12, the semiconductor device 16 is inserted from above the socket 12, and the spring clip 26 is attached to the frame 18 so as to elastically press the semiconductor device 16 toward the support substrate 20. Do by. The contact terminals 24 are provided in the same plane arrangement as the land-grid-array type planar electrodes 16a provided on the lower surface of the substrate of the semiconductor device 16, and the semiconductor device 16 is pressed downward by the spring clip 26. Thus, the planar electrode 16a is pressed against the top of the contact terminal 24, and the semiconductor device 16 and the socket 12 are electrically connected.
[0006]
  In the mounting structure using the socket 12 shown in FIG. 17, the semiconductor device 16 can be detachably mounted, the semiconductor device 16 can be easily mounted, and the semiconductor device 16 is set in the socket 12 to provide a semiconductor. There is an advantage that the quality of the device 16 can be inspected. However, the conventional socket shown in FIG. 17 has a structure in which the through hole 22 is provided in the support substrate 20 and the solder ball 14 and the contact terminal 24 are joined to the lands formed at both ends of the through hole 22. However, there is a problem that the manufacturing cost is increased. In addition, in the process of manufacturing the socket 12, when heat treatment is performed to heat the contact terminal 24 to about 250 ° C. to 300 ° C., a resin having high heat resistance such as polyimide resin must be used as the support substrate 20. There is also a problem that the manufacturing cost is increased.
[0007]
  In the mounting structure using the electronic component socket, the electronic component socket functions as an interposer that electrically connects the mounting substrate and the semiconductor element. In the mounting structure shown in FIG. 17, contact terminals 24 are provided on one surface of the support substrate 20 and solder balls 14 are provided on the other surface, and a connection portion such as a pad is elastically only on one surface side of the support substrate 20. However, by providing contact terminals 24 on the other surface of the support substrate 20, the connection portions such as pads are elastically pressed and electrically connected on both surfaces of the support substrate 20. Can be formed. The socket for electronic components having such a configuration can be used as an interposer that is interposed between the electronic components and electrically connected to each other. However, it is difficult to form the contact terminals 24 on both surfaces of the support substrate 20 by a normal method, and there is a manufacturing problem that a special jig must be prepared.
[0008]
  Therefore, the present invention has been made to solve these problems, and the object of the present invention is to be able to detachably mount a semiconductor device or the like, and also as an interposer for electrically connecting electronic components. Sockets for electronic components that can be used, mass-produced, and have excellent electrical characteristicsTo provide a manufacturing method.
[0009]
[Means for Solving the Problems]
  The present invention has the following configuration in order to achieve the above object.
  That is,A method of manufacturing a socket for an electronic component in which an electronic component is detachably mounted between an electronic component such as a semiconductor element or a semiconductor device and a mounting substrate, and the electronic component and the mounting substrate are electrically connected. A step of covering both surfaces of the metal plate with an insulating film, and forming the insulating film on both surfaces of the metal plate into a mask pattern in which a portion of the metal plate serving as the metal terminal portion of the electronic component socket is exposed; Forming a conductive film made of metal that is not dissolved by an etching solution used when etching the metal plate on the exposed portion of the metal plate using the mask as a mask, and after removing the insulating coating, on the other surface of the metal plate A step of laminating a support plate made of an electrically insulating material by exposing only a portion where the conductor film is formed, and one side of the metal plate on which the support plate is laminated A step of exposing only the conductor film and forming a mask pattern for covering the conductor film on the other surface of the metal plate; and a base portion is joined to the conductor film exposed on the one surface of the metal plate; A step of forming a contact terminal that bends and extends into an upright shape; and after removing the mask pattern, the metal plate is etched using the conductive film deposited on one surface of the metal plate as a mask to make contact Form a metal terminal to support the terminal And a process.
[0010]
  Also, a method of manufacturing a socket for an electronic component, wherein the electronic component is detachably mounted between an electronic component such as a semiconductor element or a semiconductor device and the mounting substrate, and the electronic component and the mounting substrate are electrically connected. A step of laminating a support plate made of an electrical insulating material by exposing a portion to be a metal terminal portion of an electronic component socket on the other surface of the metal plate, and both surfaces of the metal plate on which the support plate is laminated Is formed into a mask pattern that covers a portion facing the portion to be the metal terminal portion, and the mask pattern on one surface of the metal plate is used as a mask. Etching a metal plate, removing the mask pattern to obtain a support plate having a metal terminal portion supported on one side, and sandwiching the metal terminal portion in the middle and facing the support plate to another support plate The Layering, exposing both end surfaces of the metal terminal portion and supporting the metal terminal portion with two support plates, and joining the base end to one surface of the metal terminal portion and bending the middle portion And a step of forming a contact terminal extending in an upright shape. In addition, after the metal terminal portion is supported by the two support plates, a plating power feeding layer is formed on the exposed surfaces of the support plate and the metal terminal portion, and a mask pattern that exposes only one surface of the metal terminal portion is formed. A step of forming a contact terminal by a step of forming a contact terminal, then plating the surface of the contact terminal by electrolytic plating using the plating power supply layer, removing the mask pattern, And a step of removing the plating power feeding layer exposed on the surface.
[0011]
  Also, a method of manufacturing a socket for an electronic component, wherein the electronic component is detachably mounted between an electronic component such as a semiconductor element or a semiconductor device and the mounting substrate, and the electronic component and the mounting substrate are electrically connected. The both sides of the metal plate are covered with an insulating coating, and the insulating coating is formed on one side of the metal plate in a mask pattern that exposes a portion to be a metal terminal portion of the socket for an electronic component. For the other surface, a process for forming a mask pattern that covers only the portion that becomes the metal terminal portion, and a resin molding for molding that includes a cavity that has a size that surrounds the region that becomes the socket body and the inner bottom surface is formed on a flat surface. The mask pattern formed on the other surface of the metal plate is clamped by bringing the mask pattern provided on the other surface of the metal plate into contact with the inner bottom surface by a mold. Filling the exposed portion with resin and curing; forming a conductive film made of metal that is not dissolved by an etching solution for etching the metal plate on the exposed portion of one surface of the metal plate; and the conductive film A step of forming a contact terminal whose base end is joined to bend and extending in an upright shape, a step of removing a mask pattern deposited on one surface of the metal plate, and a removal of the mask pattern Then, a step of etching the metal plate using the conductive film as a mask to form a metal terminal portion, and after forming the metal terminal portion, a mask pattern attached to the other surface of the metal terminal portion is removed to remove the socket. Forming an opening hole in the main body, and supporting the metal terminal portion on the opening periphery of the opening hole. Moreover, after forming a contact terminal by the process of forming the said contact terminal, it has the process of plating on the surface of a contact terminal by using a metal plate as a plating electric power feeding layer, It is characterized by the above-mentioned. In addition, the method is characterized by comprising a step of performing a heat treatment for increasing the elasticity of the contact terminal after the plating. Further, in the step of forming the contact terminal, the base end of the wire is joined to the conductor film, the wire is pulled up while being bent, and the contact end is formed by fusing the lifted end of the wire.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings. The manufacturing method of the socket for electronic components of this embodiment uses a metal material (copper board) as a base material which supports a contact terminal in a manufacture stage, finally removes a copper board, and a contact terminal is supported by resin. A socket for electronic parts is formed.
[0013]
(First embodiment)
  FIG. 1 shows a first embodiment of a manufacturing method for manufacturing an electronic component socket using a copper material as a base material. Fig.1 (a) shows the copper plate 30 used as a base material. The copper plate 30 is used for the purpose of being used as a support body such as a contact terminal in a manufacturing stage and as a part of a connection terminal to be bonded to a mounting board. Although the thickness of the copper plate 30 can be selected as appropriate, the thickness may normally be about 0.1 to 0.5 mm. In an actual manufacturing process, a large copper plate 30 on which a large number of individual electronic component sockets can be formed is manufactured as a workpiece. In FIG. 1, for the sake of explanation, the manufacturing process is shown for a single electronic component socket portion. The same applies to the following drawings.
[0014]
  FIG. 1B shows a state in which guide holes 31 are formed in the copper plate 30. The guide hole 31 is provided for positioning the copper plate 30 (workpiece). The guide hole 31 can be formed by etching the copper plate 30 or the like. In FIG. 1 (c), both sides of the copper plate 30 are covered with a photosensitive resist serving as an insulating film, and a portion (A portion) for forming a contact terminal is exposed on one side of the copper plate 30, and the other side of the copper plate 30 is exposed. Regarding the surface, a state is shown in which mask patterns 32a and 32b are formed in which portions (B portions) where external connection terminals are joined are exposed corresponding to the portions where contact terminals are formed. Note that an insulating film having a pattern shown in FIG. 1C can be formed by laminating a dry film instead of the photosensitive resist.
[0015]
  FIG. 1 (d) shows a state in which a conductor film 34 is formed by palladium plating or the like on the portion (A portion and B portion) where the copper plate 30 is exposed in FIG. 1 (c). Since the conductor film 34 forms contact terminals by a wire bonding method, the bonding property with the bonding wire is improved, and the copper plate 30 is etched in a subsequent process, so that it is not dissolved by the etching solution for etching the copper plate 30. Formed with metal. Palladium can be suitably used as the conductor film 34 in terms of bonding property with a bonding wire and not being dissolved by an etching solution for etching the copper plate 30, but is not limited to palladium. For example, palladium plating and gold plating are performed in this order. Other plating configurations or a plurality of plating layers may be used.
[0016]
  FIG. 1E shows a state in which the mask patterns 32a and 32b, which are insulating coatings formed on the surface of the copper plate 30, are dissolved and removed. By removing the mask patterns 32 a and 32 b, only the conductor film 34 is formed on the surface of the copper plate 30. FIG. 1 (f) next shows a state in which support plates 36 a and 36 b made of an electrical insulating material such as a glass epoxy material are laminated on both surfaces of the copper plate 30. The support plates 36a and 36b serve as support portions (substrates) for the electronic component socket. In the present embodiment, the support plates 36 a and 36 b made of a glass epoxy material are heated and bonded to both surfaces of the copper plate 30. The support plate 36a that is crimped to one surface of the copper plate 30 is provided so as to support the outer peripheral portion where the contact terminals of the electronic component socket are arranged, and the conductor film 34 is formed on the other surface of the copper plate 30. The support plate 36b in which the through hole 37 is formed is pressure-bonded to the part (part where the external connection terminal is joined) to expose the part where the conductor film 34 is formed. In FIG. 1 (g), a photosensitive resist is applied to the copper plate 30 and the conductor film 34 exposed from the support plates 36a and 36b, and a mask pattern 38a in which only the conductor film 34 is exposed on one surface of the copper plate 30 is formed. Then, a state in which a mask pattern 38b is provided on the other surface of the copper plate 30 so as to cover the conductor film 34 is shown.
[0017]
  FIG. 2 shows a process from forming contact terminals on the copper plate 30 to forming an electronic component socket. FIG. 2A shows a state in which the contact terminals 40 are formed on the conductor film 34 formed on the copper plate 30 by the wire bonding method. The contact terminal 40 is bonded to the conductor film 34 at the base end of the gold wire, and once the gold wire is pulled upward, the capillary for operating the gold wire is moved laterally to bend the gold wire into an L shape, It can be formed in the shape shown in the figure by bending upward and fusing the gold wire. The reason why the contact terminal 40 is formed by bending the gold wire into an L shape is to make the contact terminal 40 easily bent in the vertical direction and to have elasticity.
[0018]
  In the case of a gold wire, simply bending it in an L shape does not provide sufficient elasticity as the contact terminal 40. Therefore, after forming the contact terminal 40 by wire bonding to each conductor film 34, the contact terminal 40 is formed. A plating for imparting elasticity to the contact terminal 40 is applied to the surface of the substrate. FIG. 2B shows a state where the contact terminal 40 is plated. In the present embodiment, nickel-cobalt plating and gold plating are applied to the surface of the contact terminal 40 by electrolytic plating as plating for imparting elasticity to the contact terminal 40. Nickel-cobalt plating is plating for increasing the rigidity of the gold wire, and gold plating is protective plating for improving the weather resistance of the contact terminals 40. In FIG. 1G, mask patterns 38a and 38b provided on both surfaces of the copper plate 30 are for plating only the conductor film 34 and the contact terminal 40 on one surface of the copper plate 30. .
[0019]
  FIG. 2C shows a state in which the mask patterns 38a and 38b adhering to both surfaces of the copper plate 30 are dissolved and removed. By removing the mask patterns 38a and 38b, the contact terminals 40 are supported upright on the one surface of the copper plate 30 via the conductor film 34, and the through holes provided in the support plate 36b are provided on the other surface of the copper plate 30. The conductive film 34 is exposed in the state 37. FIG. 2D shows a state in which the copper plate 30 is etched to form the connection terminal 42 including the metal terminal portion 30 a and the contact terminal 40. As described above, since the conductor film 34 is not dissolved by the etching solution for etching the copper plate 30, by etching the copper plate 30, the portion of the copper plate 30 on which the conductor film 34 is formed as shown in FIG. Only the metal terminal part) can be left.
[0020]
  FIG. 2E shows a state in which the external connection terminal 44 is joined to the conductor film 34 exposed on the lower surface of the connection terminal 42 (the surface opposite to the surface on which the contact terminal 40 of the metal terminal portion 30a is joined). Indicates. For the external connection terminal 44, a solder paste is applied to the conductor film 34 exposed on the lower surface of the connection terminal 42 by printing or the like and bonded to each connection terminal 42 by reflow, or a solder ball is placed on the conductor film 34. It can be formed by a method of reflowing and bonding to the connection terminal 42. FIG. 2 (f) shows an individual frame in which the connection terminal 42 with the external connection terminal is supported on the support plate 36b by cutting the outer frame portion of the region where the connection terminal 42 is arranged in FIG. 2 (e). The state which obtained the socket for electronic components is shown. The connection terminal 42 supported by the electrically insulating support plate 36b includes a metal terminal portion 30a, a conductor film 34 attached to the upper surface of the metal terminal portion 30a, and a contact terminal 40 joined to the conductor film 34. The external connection terminal 44 is joined to the lower surface of the connection terminal 42.
[0021]
  3 shows a state in which the electronic component socket shown in FIG. 2 (f) is viewed from the surface side on which the contact terminals 40 are arranged. The socket for electronic parts of this embodiment is one in which the contact terminals 40 are supported by being arranged at regular intervals in the vertical and horizontal directions by an electrically insulating support plate 36b which is a socket body. The planar arrangement of the contact terminals 40 can be selected as appropriate, and may be a random arrangement without being aligned vertically and horizontally. In this electronic component socket, the contact terminal 40 and the external connection terminal 44 are electrically connected via the metal terminal portion 30a, and the socket is used when a semiconductor element or a semiconductor device is mounted on a mounting board or the like. It can be preferably used. Since the contact terminal 40 has a certain elasticity, there is an advantage that it can be reliably electrically connected to the electrode terminal of the semiconductor element or the electrode of the semiconductor device, and the contact terminal 40 and the connection terminal 42 are extremely fine. Therefore, there is an advantage that it can be suitably used for mounting multi-pin semiconductor elements and semiconductor devices.
[0022]
(Second Embodiment)
  5 and 6 show a second embodiment of a manufacturing method for manufacturing an electronic component socket using a copper material as a base material. FIG. 5A shows a copper plate 30 used as a base material, and FIG. 5B shows a state in which guide holes 31 are formed in the copper plate 30. FIG. 5C shows a state in which a support plate 50 made of an electrically insulating material is joined to the lower surface (the other surface) of the copper plate 30. The support plate 50 constitutes a support portion (substrate) for the electronic component socket. In the present embodiment, the support plate 50 made of a glass epoxy material is heated and pressure-bonded to the other surface of the copper plate 30. A through hole 52 is formed in the support plate 50 in accordance with a portion of the copper plate 30 that becomes the metal terminal portion of the electronic component socket, and the lower surface of the copper plate 30 is exposed to the outside at the portion where the through hole 52 is formed. To do. The material of the support plate 50 is not particularly limited as long as it is formed of an electrical insulating material.
[0023]
  In FIG. 5 (d), a photosensitive resist is applied to both surfaces of the copper plate 30, and the upper surface (one surface) of the copper plate 30 is exposed and developed to cover the portion for forming the metal terminal portion with the socket for electronic components. A state is shown in which a mask pattern 54a is formed as a coating, and a mask pattern 54b is formed as an insulating coating that covers the exposed portion of the copper plate 30 on the other surface of the copper plate 30. In the embodiment, the other surface of the copper plate 30 is covered with the mask pattern 54 a including the portion covered with the support plate 50. It is also possible to form an insulating coating using a dry film instead of the photosensitive resist.
[0024]
  FIG. 5E shows a state in which the copper plate 30 is etched using the mask patterns 54a and 54b formed on both surfaces of the copper plate 30 as masks. By this etching, a portion covered with the mask pattern 54a on one surface of the copper plate 30 remains as the metal terminal portion 30a. In addition, the metal terminal part 30a must be supported by the support plate 50 in the state which etched the copper plate 30. FIG. That is, the metal terminal portion 30 a is formed to have a larger diameter than the through hole 52 formed in the support plate 50, and the mask pattern 54 a is joined so that the peripheral portion of the metal terminal portion 30 a is joined to the opening peripheral edge of the through hole 52 of the support plate 50. Form.
[0025]
  FIG. 5 (f) shows a state where the mask patterns 54a and 54b are dissolved and removed from the state of FIG. 5 (e). By removing the mask patterns 54a and 54b, a substrate in which the metal terminal portion 30a is supported on the support plate 50 made of an electrically insulating material is obtained. FIG. 7 shows a plan view of the state in which the metal terminal portion 30a is supported on the support plate 50. FIG. As shown in the figure, the metal terminal portions 30a are supported on the support plate 50 in a line with a certain interval in the vertical and horizontal directions. A broken line indicates the position of the through hole 52 provided in the support plate 50.
[0026]
  In FIG. 5 (f), since the metal terminal portion 30a is supported only on one side of the support plate 50, it cannot be said that the metal terminal portion 30a is supported sufficiently reliably. For this reason, FIG. 5 (g) shows a state in which the metal terminal portion 30 a is sandwiched between the two support plates 50 and 51 and both end surfaces of the metal terminal portion 30 a are supported by the support plates 50 and 51. That is, the support plate 51 made of another electrical insulating material is covered from the upper surface side (one surface side) of the metal terminal portion 30a, and the support plate 50 and the support plate 51 supporting the metal terminal portion 30a are attached. By aligning and thermocompression bonding with each other, a substrate in which the metal terminal portion 30a is supported by the two support plates 50 and 51 shown in FIG. 5 (g) is obtained.
[0027]
  As for the support plate 51 to be crimped to the support plate 50, in the same manner as shown in FIG. 5C, a through hole is formed in advance according to the arrangement position of the metal terminal portion 30a, and the support plate 50 is crimped to the support plate 50. Both end surfaces of the metal terminal portion 30a are exposed. In the state where the metal terminal portion 30a is sandwiched between the support plate 50 and the support plate 51, the metal terminal portion 30a is sandwiched between the support plate 50 and the support plate 51 at the peripheral edge portions of both end faces. It is supported and firmly held by the support plates 50 and 51.
[0028]
  FIG. 6 shows a process of forming a socket for an electronic component by joining a contact terminal to the metal terminal portion 30a supported by the support plates 50 and 51. FIG. 6A shows a state in which electroless copper plating is applied as the plating power supply layer 56 to the support plates 50 and 51 that support the metal terminal portion 30a. The plating power feeding layer 56 is also formed on both surfaces of the metal terminal portion 30a. This electroless copper plating is for plating the contact terminals by electrolytic plating in a later step. The plating power feeding layer 56 may be formed by sputtering or the like instead of electroless copper plating.
[0029]
  FIG. 6B shows a mask pattern 58a as an insulating film in which a photosensitive resist is coated on the surface of the plating power supply layer 56 and the upper surface of the metal terminal portion 30a is exposed on one surface of the support plates 50 and 51. Is formed, and the other surface of the support plates 50 and 51 is provided with a mask pattern 58b covering the entire surface including the metal terminal portion 30a. The mask pattern 58a in which only the upper surface portion of the metal terminal portion 30a is exposed on one surface of the support plates 50, 51 is provided by wire bonding a gold wire to the exposed portion of the upper surface of the metal terminal portion 30a. This is to form a terminal. In the state shown in FIG. 6B, the exposed portion of the plating power supply layer 56 may be subjected to electrolytic plating for improving wire bonding properties such as palladium plating.
[0030]
  FIG. 6C shows a state in which the contact terminal 40 is formed by bonding a gold wire to the exposed portion (electroless copper plating layer) of the metal terminal portion 30a. In the same manner as in the first embodiment described above, the contact terminal 40 having a bent shape on the side surface of each metal terminal portion 30a can be formed. FIG. 6 (d) shows a state in which the contact terminal 40 is plated to give rigidity in order to give the contact terminal 40 elasticity. This plating can be formed by electrolytic plating using the plating power supply layer 56. Since the support plates 50 and 51 are covered with the mask patterns 58a and 58b except for the upper surface of the metal terminal portion 30a and the surface of the contact terminal 40, the plating power supply layer 56 and the contact terminal 40 exposed on the upper surface of the metal terminal portion 30a. A plating layer is formed on the surface. As plating for imparting elasticity to the contact terminal 40, the above-described nickel-cobalt plating or the like can be used.
[0031]
  FIG. 6E shows a state where the mask patterns 58a and 58b, which are insulating films, are removed. By removing the mask patterns 58 a and 58 b, the plating power feeding layer 56 formed by electroless copper plating is exposed on the outer surfaces of the support plates 50 and 51. FIG. 6F shows a state in which the plating power feeding layer 56 exposed on the outer surfaces of the support plates 50 and 51 is removed. Since the plating power feeding layer 56 is formed thin by electroless copper plating, only the plating power feeding layer 56 can be easily removed with an etching solution for etching copper. The outer surface of the metal terminal portion 30a to which the contact terminal 40 is bonded and the outer surface of the contact terminal 40 are plated for imparting elasticity to the contact terminal 40, and plating is performed as plating for imparting elasticity to the contact terminal 40. By using a plating metal that is not affected by the etching solution that dissolves and removes the power feeding layer 56, the plating provided on the contact terminal 40 in the step of removing the plating power feeding layer 56 does not become a problem. In this embodiment, the nickel-cobalt plating provided on the contact terminal 40 is not affected by the copper etchant.
[0032]
  6A to 6E are used to form a conductive film having good wire bonding properties on the surface of the metal terminal portion 30a, and the contact terminal 40 is plated to form the contact terminal 40. The purpose is to give the required elasticity. Therefore, in the case where the contact terminal 40 itself has the required elasticity and it is not necessary to perform plating for imparting elasticity, or when the contact terminal 40 is joined directly to the metal terminal portion 30a, FIG. ) To (e) can be omitted.
[0033]
  FIG. 6 (f) shows a substrate in which a connection terminal in which a bent contact terminal 40 is bonded to a metal terminal portion 30 a is supported by support plates 50 and 51. FIG. 6 (g) shows a state in which the external connection terminal 44 is joined to the other surface of the metal terminal portion 30a to form an electronic component socket. The external connection terminals 44 can be formed by applying a solder paste to the metal terminal portions 30a exposed on the lower surfaces of the support plates 50 and 51, and joining solder balls by reflow. The socket for electronic parts is obtained by cutting into pieces from the state of FIG.
[0034]
  In the electronic component socket of the present embodiment, the contact terminal 40 and the external connection terminal 44 are electrically connected via the metal terminal portion 30a, and the contact terminal 40 and the external connection terminal 44 are electrically connected in the shortest distance. Since the socket body that supports the metal terminal portion 30a is formed by the two support plates 50 and 51 that are bonded to each other by supporting the metal terminal portion 30a from both sides, it is sufficient as a socket body. There is an advantage that it can be provided with sufficient strength.
[0035]
(Third embodiment)
  8, 9, and 10 show a third embodiment of a manufacturing method for manufacturing a socket for an electronic component using a copper material as a base material. FIG. 8A shows a copper plate 30 used as a base material, and FIG. 8B shows a state in which guide holes 31 are formed in the copper plate 30. FIG. 8 (c) is an insulating film in which a dry film is laminated on both surfaces of the copper plate 30, exposed and developed to expose the portion (C portion) that becomes the metal terminal portion on the upper surface (one surface) of the copper plate 30. A state in which a certain mask pattern 60a is formed and a mask pattern 60b that covers only a portion (D portion) to be a metal terminal portion is formed on the lower surface (the other surface) of the copper plate 30 is shown. The C portion and D portion, which are metal terminal portions, are provided with a circular planar shape at the same plane position with the copper plate 30 in between, and are set so that the diameter dimension of the D portion is smaller than that of the C portion.
[0036]
  FIG. 8 (d) shows a state in which the work on which the mask patterns 60a and 60b are formed on both surfaces of the copper plate 30 is clamped by the resin molding die 62. 61 is a guide pin for positioning a workpiece. The workpiece is positioned with respect to the mold 62 by sliding the guide pin 61 into the guide hole 31. The mold 62 has a cavity 62a having a flat inner surface surrounding the socket body of the electronic component socket, and a mask pattern 60b formed on the lower surface of the copper plate 30 when the work is clamped by the mold 62. Is formed in contact with the bottom surface of the cavity 62a.
[0037]
  FIG. 8 (e) shows a state where the resin 62 is filled in the cavity 62 a of the mold 62. Since the mask pattern 60b is formed in an independent island shape when viewed in plan, the resin 64 is filled in a space in which these mask patterns 60b are not arranged. FIG. 8F shows a state where the work is taken out from the mold 62 after the resin 64 is filled and cured. A mask pattern 60 a is formed on one surface of the copper plate 30, and the other surface of the copper plate 30 is covered with a mask pattern 60 b and a resin 64.
[0038]
  The resin 64 serves as a socket body of the socket for electronic components, and needs a certain strength. For this reason, the thickness of the mask pattern 60 b that is an insulating film formed on the other surface of the copper plate 30 is set so that the resin 64 has a required thickness when the resin is molded using the mold 62. The mask pattern 60b defines the thickness of the resin 64, whereas the mask pattern 60a is intended to cover the copper plate 30 with a predetermined pattern, and therefore it does not need to be formed thick. In the present embodiment, the mask patterns 60a and 60b are formed using a dry film having a high thickness accuracy in order to reduce the variation in the thickness of the resin 64, and the purpose of forming the resin 64 to some extent thick, but instead of the dry film. The mask patterns 60a and 60b can be formed by applying a photosensitive resist and exposing and developing.
[0039]
  FIG. 9 shows a process from forming contact terminals on the copper plate 30 to which the resin 64 is adhered to forming an electronic component socket. FIG. 9A shows a state in which a conductive film 66 made of nickel plating and gold plating is provided on an exposed portion that is not covered with the mask pattern 60 a on one surface of the copper plate 30. The conductor film 66 is provided for the purpose of facilitating wire bonding of a gold wire on the copper plate 30 and for the purpose of forming a metal film that is not dissolved by an etching solution for etching the copper plate 30. The conductor film 66 can be formed by palladium plating or the like, in addition to laminating nickel plating and gold plating.
[0040]
  FIG. 9B shows a state in which a gold wire is bonded to an exposed portion of the copper plate 30 (a portion where the conductor film 66 is formed) on one surface of the copper plate 30 to form a contact terminal 40 whose middle portion is bent. Show. The formation method of the contact terminal 40 is the same as that of embodiment mentioned above. FIG. 9C shows a state in which the surface of the contact terminal 40 is plated in order to give elasticity to the contact terminal 40. The plating for imparting elasticity to the contact terminal 40 is formed, for example, by applying nickel-cobalt plating or the like by electrolytic plating. By applying this plating, a portion not covered with the mask pattern 60 a on one surface of the copper plate 30 is covered with the plating layer 67. After plating the surface of the contact terminal 40, gold plating is applied to increase the weather resistance of the contact terminal 40.
[0041]
  FIG. 9D shows a state in which the mask pattern 60a attached to one surface of the copper plate 30 in the state shown in FIG. 9C is removed. In this case, the mask pattern 60 b on the other surface of the copper plate 30 is left as it is, and the other surface of the copper plate 30 is covered with the mask pattern 60 b and the resin 64. FIG.9 (e) shows the state which etched the copper plate 30 from the state of FIG.9 (d). In the step of etching the copper plate 30, the copper plate 30 is etched using the plating layer 67 formed in the step shown in FIG. By this etching, as shown in FIG. 9 (e), the copper plate 30 is formed into an independent island-shaped metal terminal portion 30a, and the contact terminal 40 is joined to one surface (upper surface) of the metal terminal portion 30a. It becomes.
[0042]
  FIG. 9 (f) shows a state in which the mask pattern 60 b is dissolved and removed, and an opening hole 65 is formed in the socket body so that the lower surface of the metal terminal portion 30 a is exposed. The metal terminal portion 30a is supported by the opening periphery of the opening hole 65, and the connection terminal 42 is formed by the contact terminal 40 joined to the upper surface of the metal terminal portion 30a and the metal terminal portion 30a. In FIG. 8C, when the mask patterns 60a and 60b are provided on one surface and the other surface of the copper plate 30, the diameter dimension of the C portion is formed larger than the diameter dimension of the D portion. This is because the metal terminal portion 30 a is supported on the opening periphery of the opening hole 65 of the socket body made of the resin 64.
[0043]
  FIG. 10 shows a process of forming an electronic component socket by joining an external connection terminal such as a solder ball to the lower surface of the metal terminal portion 30a. FIG. 10A shows a state in which the metal terminal portion 30a is supported on the socket body formed of the resin 64, and the external connection terminal 44 is joined to the lower surface of the metal terminal portion 30a. FIG. 10 (b) shows a state in which a socket body for electronic parts is obtained by cutting a large socket body into pieces. In this electronic component socket, the contact terminal 40 and the external connection terminal 44 are electrically connected via a metal terminal portion 30 a supported by a socket body made of a resin 64. Similarly to the electronic component socket shown in FIG. 7, the electronic component socket shown in FIG. 10 (b) has the connection terminals 42 arranged in the socket body at regular intervals in the vertical and horizontal directions.
[0044]
  In each of the above embodiments, the gold wire is plated for the purpose of imparting elasticity to the contact terminal 40. However, after obtaining plating for imparting elasticity to the contact terminal 40 in order to obtain more reliable elasticity. It is also effective to subject the contact terminals 40 to heat treatment. Thus, even when the contact terminal 40 is formed using a soft metal such as a gold wire, the contact terminal can have a required elasticity. Moreover, although the gold wire was used as the contact terminal 40 in the said embodiment, the wire which forms the contact terminal 40 is not restricted to a gold wire, An iron wire, a copper wire, a platinum wire etc. can be used, and a wire Depending on the material, it is possible to obtain the contact terminal 40 having the required elasticity without applying rigid plating. In addition, a lead piece formed into a curved shape by pressing or etching a metal plate instead of a wire can be used as the contact terminal 40. FIG. 4 shows an example in which a lead piece 41 is joined to the conductor film 34 to form the contact terminal 40 in the first embodiment.
[0045]
(Mounting structure)
  FIG. 11 shows a mounting structure in which the semiconductor element 90 is mounted using the electronic component socket described above. In this mounting structure, the outer peripheral portion of the support plate 36b which is the socket body of the electronic component socket 80 in the first embodiment described above is fixed to the opening on the lower side of the frame body 70 formed in a rectangular shape, and the frame body The semiconductor element 90 is inserted into the frame body 70 using the inner surface of 70 as a guide surface, and the semiconductor element 90 is pressed against the contact terminal 40 of the electronic component socket 80 by the cap 72. Reference numeral 74 denotes an elastic pressing piece attached to the inner surface of the cap 72, and by locking the cap 72 to the frame body 70, the semiconductor element 90 is pressed toward the contact terminal 40 via the elastic pressing piece 74. 40 is elastically pressed against the electrode terminal 92 of the semiconductor element 90.
[0046]
  Since the contact terminal 40 of the electronic component socket 80 has elasticity, the contact terminal 40 is slightly bent by elastically pressing the semiconductor element 90 with the cap 72, and the contact terminal 40 and the electrode terminal 92 are connected. Made. Even if the height dimension of the contact terminal 40 varies slightly, the variation is absorbed by the deflection of the contact terminal 40, and the electrode terminal 92 of the semiconductor element 90 and the contact terminal 40 are reliably connected. In the present embodiment, the frame body 70, the cap 72, and the like constitute pressing means for aligning the semiconductor element 90 with the electronic component socket 80 and electrically connecting the semiconductor element 90 and the electronic component socket 80. . As a pressing meansFIG.A spring clip 26 as shown in FIG. In FIG. 11, reference numeral 100 denotes a mounting substrate, and reference numeral 102 denotes a connection electrode formed on the surface of the mounting substrate 100. The electronic component socket 80 can be joined to the mounting substrate 100 by soldering the external connection terminals 44 to the connection electrodes 102.
[0047]
  In the embodiment shown in FIG. 11, the mounting structure using the electronic component socket in the first embodiment described above is shown. However, the electronic component socket in the second embodiment or the third embodiment is used. A similar mounting structure can be configured. Further, in the embodiment shown in FIG. 11, the semiconductor element 90 is mounted using the electronic component socket 80, but it is also possible to mount a semiconductor device such as a chip size package instead of the semiconductor element. . In the present embodiment, the electronic component socket 80 is fixed to the frame body 70 and the semiconductor element 90 is accommodated in the frame body 70. However, the configuration of the frame body 70, the cap 72, and the like is the same as that of the above embodiment. It is not limited and can be changed as appropriate.
[0048]
  In addition, as a method of mounting the semiconductor element 90 using the electronic component socket, the electronic component socket 80 is bonded to the mounting substrate 100 in advance, and the electronic component socket 80 is bonded to the mounting with a socket. It is also possible to mount a semiconductor element or a semiconductor device on the substrate. Further, a mounting substrate with a socket formed by previously bonding an electronic component socket to a mounting substrate can be used for inspection for determining the quality of a semiconductor element. That is, it is possible to determine whether the semiconductor element is good or bad by previously bonding an electronic component socket to the inspection substrate and setting a semiconductor element in the socket.
[0049]
  The mounting structure using the electronic component socket 80 of the present embodiment can be provided as a mounting structure with excellent electrical characteristics because the contact terminal 40 and the external connection terminal 44 are connected at the shortest distance. In addition, recent semiconductor elements have become smaller in size, and the arrangement interval of electrode terminals has become extremely narrow. According to the mounting structure using the electronic component socket of the present embodiment, the contact terminals 40 are configured to be pressed and electrically connected to the electrode terminals 92 of the semiconductor element 90. The contact terminals 40 can be easily arranged in accordance with the arrangement of the electrode terminals 92 even if it is narrowed, and it is possible to surely mount even a semiconductor element in which the arrangement intervals of the electrode terminals 92 are extremely narrow. Similarly, the mounting structure of this embodiment can be suitably used for inspection of a semiconductor element in which the arrangement interval of the electrode terminals 92 is extremely narrow.
[0050]
(Interposer)
  13, 14, and 15 show examples of electronic component sockets that are used as interposers by using the electronic component sockets in the above-described embodiments. These electronic component sockets are provided by disposing contact terminals 40 on both sides of the socket body and electrically connecting the contact terminals 40 at symmetrical positions with the socket body interposed therebetween.
[0051]
  The electronic component socket 110 shown in FIG. 13 is formed by combining the electronic component socket of the first embodiment including the connection terminals 42 including the metal terminal portions 30a and the contact terminals 40 shown in FIG. 2 (d). Is. FIG. 12 shows a method in which the support plate 36b of the socket for electronic components is aligned to face each other, and the opposing metal terminal portions 30a are joined by the solder 112. A socket body is easily formed integrally by printing solder paste on the metal terminal portion 30a, aligning and supporting the socket for electronic components with a jig or the like, and soldering the opposing metal terminal portion 30a by reflow. be able to. Since the conductor film 34 is exposed on the surface of the metal terminal portion 30a, the metal terminal portion 30a can be reliably joined by the solder 112.
[0052]
  The socket 110 for an electronic component shown in FIG. 13 has a socket body formed of electrically insulating support plates 36a and 36b such as a glass epoxy material, and symmetrical positions on one and other surfaces of the socket body with the socket body interposed therebetween. The contact terminals 40 arranged in the electrical connection are electrically connected through the metal terminal portion 30a and the solder 112. Since the contact terminal 40 is bent in an L shape, in the electronic component socket 110 of the present embodiment, the contact terminal 40 is elastically pressed against the connection portion such as a pad on both sides of the socket body, and the Connection becomes possible.
[0053]
  A socket 114 for an electronic component shown in FIG. 14 is a support plate in which a connection terminal in which a bent contact terminal 40 is joined to a metal terminal portion 30a shown in FIG. 6 (f) is electrically insulating such as a glass epoxy material. The electronic component socket of the second embodiment supported by 50 and 51 is combined. A pair of electronic component sockets are arranged with the metal terminal portions 30a facing each other, and the opposing metal terminal portions 30a are joined by solder 112, whereby the contact terminals 40 are formed on both sides of the socket body formed in a flat plate shape. The formed electronic component socket 114 can be obtained.
[0054]
  The socket 116 for electronic parts shown in FIG. 15 supported the connection terminal 42 which consists of the metal terminal part 30a and the contact terminal 40 on the socket main body which consists of the resin 64 which has electrical insulation shown in FIG.9 (f). The electronic component socket of the third embodiment is formed in combination. An opening hole 65 is formed in the socket body made of the resin 64, and the metal terminal portion 30a is supported on the periphery of the opening hole 65. Therefore, by filling the opening hole 65 with solder 112 or a conductive adhesive, the socket The electronic component socket 116 shown in FIG. 15 is obtained in which the main body is integrated and the contact terminals 40 are arranged on both sides of the socket main body. The contact terminals 40 on both surfaces of the socket body are electrically connected via the metal terminal portion 30a and the solder 112.
[0055]
  The interposer is used to relay electrical connection by interposing between a semiconductor device and a mounting substrate. The above-described sockets for electronic components shown in FIGS. 13, 14, and 15 are provided with contact terminals 40 on both surfaces of the socket main body, and therefore have an effect of relaying electrical connection between the electronic components. Can be made. There are various examples in which the electronic component socket is used as an interposer. FIG. 16 shows an example in which a test apparatus for a semiconductor element or the like is configured as an example in which the electronic component socket is used as an interposer.
[0056]
  In the figure, reference numeral 120 denotes an inspection substrate, and 120a denotes an electrode terminal of the inspection substrate 120. Reference numeral 122 denotes a semiconductor element that is an object to be inspected, and reference numeral 122 a denotes an electrode terminal of the semiconductor element 122. The electronic component socket 110 is supported by being elastically pressed between the inspection substrate 120 and the semiconductor element 122 by an elastic pressing piece 124. The contact terminal 40 provided on the electronic component socket 110 is slightly bent and pressed into contact with the electrode terminal 120a of the inspection substrate 120 and the electrode terminal 122a of the semiconductor element 122 by the compressive force of the elastic pressing piece 124. The substrate 120 and the semiconductor element 122 can be reliably electrically connected.
[0057]
  In the test apparatus of this embodiment, even when the contact terminal 40 is reliably in contact with the electrode terminals 120a and 122a due to the elasticity of the contact terminal 40 and the inspection substrate 120 and the semiconductor element 122 are slightly tilted, the contact terminal 40 Due to this elasticity, the contact terminal 40 can be surely brought into contact with the electrode terminals 120a, 122a, and an accurate electrical connection can be made. Note that this test apparatus is not limited to a semiconductor element as an object to be inspected, and a semiconductor device having a semiconductor element mounted on a substrate can also be an inspection target. An interposer having contact terminals 40 provided on both sides of a socket body is difficult to manufacture by a normal method, but according to the method of this embodiment, an electronic component socket having contact terminals on one side is formed in combination. Therefore, there is an advantage that it can be easily manufactured and mass production can be easily performed.
[0058]
【The invention's effect】
  According to the present inventionAccording to the method for manufacturing a socket for electronic components, it is possible to manufacture a socket for electronic components at a low cost by using a copper plate as a base material, and efficiently mass-produce sockets for electronic components.be able to.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a first embodiment of a method for manufacturing an electronic component socket.
FIG. 2 is an explanatory view showing a first embodiment of a method for manufacturing an electronic component socket.
FIG. 3 is a plan view of the electronic component socket as viewed from the side on which the contact terminals are arranged.
FIG. 4 is an explanatory view showing an example in which a contact terminal is formed of a lead piece.
FIG. 5 is an explanatory view showing a second embodiment of a method for manufacturing an electronic component socket.
FIG. 6 is an explanatory view showing a second embodiment of a method for manufacturing an electronic component socket.
FIG. 7 is a plan view showing a state in which a metal terminal portion is supported on a support plate in the second embodiment.
FIG. 8 is an explanatory view showing a third embodiment of a method for manufacturing an electronic component socket.
FIG. 9 is an explanatory view showing a third embodiment of a method for manufacturing an electronic component socket.
FIG. 10 is an explanatory view showing a third embodiment of a method for manufacturing an electronic component socket.
FIG. 11 is an explanatory view showing an example of a mounting structure using a socket for electronic components.
FIG. 12 is an explanatory view showing a method for manufacturing an electronic component socket.
FIG. 13 is an explanatory view showing another embodiment of the electronic component socket.
FIG. 14 is an explanatory view showing still another embodiment of the electronic component socket.
FIG. 15 is an explanatory view showing still another embodiment of the electronic component socket.
FIG. 16 is an explanatory diagram showing an example in which an electronic component socket is used as an interposer.
FIG. 17 is a cross-sectional view showing a conventional configuration of a socket for electronic components.
[Explanation of symbols]
  26 Spring clip
  30 copper plate
  30a Metal terminal part
  32a, 32b mask pattern
  34 Conductor film
  36a, 36b Support plate
  37 Through hole
  38a, 38b Mask pattern
  40 Contact terminal
  41 Lead piece
  42 Connection terminal
  44 External connection terminals
  50, 51 Support plate
  52 Through hole
  54a, 54b Mask pattern
  56 Plating feeding layer
  58a, 58b Mask pattern
  60a, 60b mask pattern
  62 Mold
  62a cavity
  64 resin
  65 Opening hole
  66 Conductor film
  67 Plating layer
  70 frame
  72 cap
  74 Elastic pressing piece
  80 Socket for electronic parts
  90 Semiconductor elements
  92 Electrode terminal
  100 Mounting board
  102 Connection electrode
  110, 114, 116 Socket for electronic parts
  112Solder
  120  Inspection board
  122 Semiconductor device
  124 Elastic pressing piece

Claims (7)

A method of manufacturing a socket for an electronic component in which an electronic component is detachably mounted between an electronic component such as a semiconductor element or a semiconductor device and a mounting substrate, and the electronic component and the mounting substrate are electrically connected. And
Forming both sides of the metal plate with an insulating coating, and forming the insulating coating on both sides of the metal plate in a mask pattern that exposes the portion of the metal plate that becomes the metal terminal portion of the electronic component socket;
Forming a conductive film made of a metal that is not dissolved by an etching solution used when etching the metal plate on the exposed portion of the metal plate using the mask pattern as a mask;
After removing the insulating coating, exposing only the portion where the conductor film is formed on the other surface of the metal plate and laminating a support plate made of an electrical insulating material;
A step of exposing only the conductor film on one surface of the metal plate on which the support plate is laminated, and forming a mask pattern covering the conductor film on the other surface of the metal plate;
Forming a contact terminal whose base end is joined to a conductor film exposed on one surface of the metal plate and a midway portion is bent and extends into an upright shape; and
And removing the mask pattern, and then etching the metal plate using a conductive film deposited on one surface of the metal plate as a mask to form a metal terminal portion that supports the contact terminal. The manufacturing method of the socket for electronic components. A method of manufacturing a socket for an electronic component in which an electronic component is detachably mounted between an electronic component such as a semiconductor element or a semiconductor device and a mounting substrate, and the electronic component and the mounting substrate are electrically connected. And
Laminating a support plate made of an electrical insulating material by exposing a portion to be a metal terminal portion of the electronic component socket on the other surface of the metal plate;
The metal plate on which both sides of the support plate are laminated is covered with an insulating coating, and the insulating coating on one surface of the metal plate is formed in a mask pattern that covers a portion facing the portion to be the metal terminal portion, and the metal plate Etching the metal plate using the mask pattern on one side of the mask as a mask, removing the mask pattern, and obtaining a support plate with the metal terminal portion supported on one side;
Sandwiching the metal terminal portion in the middle and stacking another support plate facing the support plate to expose both end faces of the metal terminal portion and supporting the metal terminal portion with two support plates; ,
And a step of forming a contact terminal whose base end is joined to one surface of the metal terminal portion and a midway portion bends and extends into an upright shape. After the metal terminal portion is supported by the two support plates, a plating power feeding layer is formed on the exposed surfaces of the support plate and the metal terminal portion, and a mask pattern that exposes only one surface of the metal terminal portion is formed. Prepared,
After forming the contact terminal by the step of forming the contact terminal, plating the surface of the contact terminal by electrolytic plating using the plating power supply layer;
The method for manufacturing a socket for an electronic component according to claim 2 , further comprising a step of removing the mask pattern and removing a plating power feeding layer exposed on a surface of the support plate. A method of manufacturing a socket for an electronic component in which an electronic component is detachably mounted between an electronic component such as a semiconductor element or a semiconductor device and a mounting substrate, and the electronic component and the mounting substrate are electrically connected. And
Both surfaces of the metal plate are covered with an insulating coating, and the insulating coating is formed on one surface of the metal plate in a mask pattern that exposes a portion serving as a metal terminal portion of the socket for electronic parts, and on the other surface of the metal plate Is a step of forming a mask pattern that covers only the portion that becomes the metal terminal portion;
A mask pattern provided on the other surface of the metal plate is brought into contact with the inner bottom surface by a mold for resin molding provided with a cavity having a size that surrounds a region to be a socket body and an inner bottom surface formed on a flat surface. And clamping the metal plate, filling the resin exposed to a portion exposed from the mask pattern formed on the other surface of the metal plate, and curing the resin plate;
Forming a conductive film made of a metal that is not dissolved by an etching solution for etching the metal plate at an exposed portion of one surface of the metal plate;
Forming a contact terminal whose base end is joined to the conductor film and a middle portion is bent and extends into an upright shape; and
Removing a mask pattern deposited on one surface of the metal plate;
After removing the mask pattern, etching the metal plate using the conductor film as a mask to form a metal terminal portion; and
Forming a metal terminal portion, removing a mask pattern deposited on the other surface of the metal terminal portion, forming an opening hole in the socket body, and supporting the metal terminal portion on an opening periphery of the opening hole. The manufacturing method of the socket for electronic components characterized by the above-mentioned. 5. The electronic component socket according to claim 1, further comprising a step of plating the surface of the contact terminal using the metal plate as a plating power supply layer after the contact terminal is formed by the step of forming the contact terminal. Production method. 6. The method of manufacturing a socket for an electronic component according to claim 3, further comprising a step of performing a heat treatment for increasing the elasticity of the contact terminal after the plating. In the step of forming the contact terminals, the proximal end of the wire is bonded to conductive film, pulling while bending the wire, of claims 1 to 6 by fusing the pulling end of the wire and forming a contact terminal The manufacturing method of the socket for electronic components as described in any one.

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