KR20020093381A - Probe card for testing semiconductor - Google Patents

Abstract

PURPOSE: A probe card for testing a semiconductor device is provided to allow a high integrated semiconductor device to be tested by scaling down a thickness of needle by using a wafer fabrication process. CONSTITUTION: A probe card for testing a semiconductor device includes a main substrate(10) printed thereon a plurality of circuits and formed thereon a plurality of pin holes, a reinforce plate(20), a pin holder(30) formed on a bottom surface of the main substrate(10) corresponding to the reinforce plate(20) for forming a guide hole, an interface pin(40) soldered in such a way that a top portion thereof is connected to the circuit patterns of the main substrate(10) with inserting through the main substrate(10), the pin holder(30) and the guide hole, a sub-substrate(50) vertically printed thereon a circuit and connected to a bottom portion of the interface pin(40) by soldering, a mount block(60), a first thin plate(70), a plurality of needles, a second thin plate(90) and a cover plate(10) connected to the bottom surface of the mount block(60) with enclosing peripheral surfaces of the first and the second thin plates(70,90). The mount block(60) forms a bolt inserting hole vertically penetrating at the peripheral portion with covering the peripheral surfaces of the pin holder(30) and the sub-substrate(50). Therefore, the mount block(60) is fixed by connecting a bolt with the bolt insertion hole, the main substrate(10) and the reinforce plate(20).

Description

Probe card for testing semiconductor

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card for semiconductor inspection. More specifically, the probe for semiconductor inspection can be applied to inspection of finer patterns of semiconductor chips by simply improving the microminiaturized and thinned needle and the interface configuration to the needle. It's about the card.

In general, semiconductor devices are manufactured by performing a fabrication process of forming a pattern on a wafer and an assembly process of assembling the wafer on which the pattern is formed into each chip.

In addition, between the fabrication process and the assembly process, an electronic die sorting process (hereinafter, referred to as an "EDS") process of inspecting electrical characteristics of each chip constituting the wafer is performed.

This EDS process is performed to determine the defective chip among the chips constituting the wafer.

In this case, the EDS process mainly uses an inspection apparatus that applies an electrical signal to the chips constituting the wafer and determines a defect by a signal checked from the applied electrical signal.

Such inspection mainly uses an inspection apparatus including a probe card having needles for contacting the wafer and applying an electrical signal to inspect the electrical state of the chips constituting the wafer.

The semiconductor device whose result of the test using a probe card is judged good quality is manufactured as a finished product by a post process, such as packaging.

In the electrical property inspection of the semiconductor wafer, the needle of the probe card is usually brought into contact with the electrode pad of the semiconductor wafer, and the electrical property at that time is measured while energizing a specific current through the needle.

Meanwhile, as semiconductor devices are gradually reduced to finer sizes, the degree of integration of circuits is also increased, so that electrode pads of semiconductor devices in contact with the needles of probe cards are becoming more fine.

The conventional probe card used for such a semiconductor wafer inspection is as shown in FIGS. 1 and 2.

As shown in the drawing, a conventional probe card includes a circular main printed circuit board 1 having a through hole 1a formed at its center, a reinforcement plate 2 provided at the center of an upper surface of the main printed circuit board 1, It consists of a fixed plate 3 provided in the center of the bottom surface of the main printed circuit board 1 to correspond to the reinforcement plate 2 and the needle 5 fixed to the fixed plate 3 by the insulator 4.

Needle 5 is usually formed symmetrically on both sides of the fixing plate 3, the upper end is joined by welding to the wiring pattern formed on the outer periphery of the fixing plate 3 at the bottom of the main printed circuit board (1) The lower end is provided with a shape in which the end portion is bent downward almost vertically while forming a gentle inclination angle toward the center of the fixing plate 3.

In this case, the inclined portion of the needle 5 is fixed to the fixing plate 3 by the method of being embedded in the insulator 4, and in particular, the ends bent downward have a vertical elasticity by slightly bending in opposite directions. .

Needles 5, which are formed symmetrically on both sides, are provided with the same number as electrode pads of the semiconductor device to be contacted in the front-rear direction.

On the other hand, the decoupling capacitor 6 is attached to the upper surface of the main printed circuit board 1 directly on the upper end of the needle 5 joined to the main printed circuit board 1.

The conventional probe card configured as described above is installed under the test head of the inspection equipment, and the pogo pin of the test head contacts the circuit pattern formed on the upper surface of the main printed circuit board 1 during the inspection process. The downwardly bent contact end 5a of 5) is in contact with the inspection pad formed on the upper surface of the wafer, so that each semiconductor device of the wafer is energized to perform electrical property inspection.

However, in the conventional probe card, the contact ends 5a connected to the semiconductor device of the wafer are symmetrical with each other, so that the interval between the contact ends 5a on both sides gradually becomes narrower when the semiconductor inspection is repeated for a long time, and the supply pad is the inspection pad. There is a problem that the contact with the misalignment causes a poor contact.

To this end, Patent Application No. 2000-31240 (named: probe card), which is previously applied, reduces the length of the needle and improves the transmission efficiency of high frequency signals by simplifying the connection structure between the pattern and the needle of the main printed circuit board. The needle was made to prevent interference with the external structure as much as possible, so that the connection with the pattern of the semiconductor device was always made and the efficiency of inspection was increased.

On the other hand, the recent trend of miniaturization is accentuated as semiconductor devices become extremely fast.

However, the needle currently applied to the probe card has a rod-like configuration, so there is a limit to reducing the diameter thereof.

That is, since the rod-shaped needle has a limitation in processing to a required diameter, it is impossible to further reduce the diameter, so that there is a problem that inspection of a semiconductor device with high integration is impossible.

Accordingly, the present invention is to solve the above-described problems of the prior art, the main object of the present invention is to enable the inspection of high density and compact semiconductor devices by thinning the needle thickness using a wafer processing technology.

1 is a side cross-sectional view of a typical probe card,

2 is a plan view of FIG.

3 is a side cross-sectional view of a probe card according to the present invention;

Figure 4 is a side cross-sectional view of the separated state of the probe card according to the invention

5 is a plan view showing a part of the needle insertion hole in the first thin plate according to the present invention;

Figure 6 is a plan view showing a part of the needle hole in the second thin plate according to the present invention.

Explanation of symbols on the main parts of the drawings

10 main board 11 pinhole

20: reinforcement plate 30: pin holder

31: guide hole 40: interface pin

50: sub-substrate 60: mounting block

70: first thin plate 71: needle insertion hole

80: needle 81: contact end

90: second thin plate 91: needle hole

100: cover plate

In order to achieve the above object, the present invention includes a main substrate on which a plurality of circuits are printed on a plate surface, and a plurality of pinholes are formed in the center thereof; A reinforcing plate provided at the center of the upper surface to prevent deformation of the main substrate; A pin holder provided on a bottom surface of the main substrate corresponding to the reinforcement plate, the plate surface forming a guide hole on the same line as the pin hole of the main substrate; An interface pin which is inserted through the pin hole and the guide hole of the main substrate and the pin holder and is soldered to be connected to a circuit pattern of the main substrate; A circuit board printed vertically on the plate surface, and a circuit terminal of the upper surface connected to the lower end of the interface pin by soldering; A mounting block for covering the pin holder and the outer circumferential surface of the sub substrate and forming a bolt insertion hole vertically penetrated at an outer periphery thereof to fasten and fasten the fastening bolt from the bottom to the bolt insertion hole and the main substrate and the reinforcement plate; A first thin plate having a long hole-shaped needle insertion hole attached to the plate surface and attached to the bottom surface of the sub substrate; A needle of a thin plate inserted into the needle insertion hole of the first thin plate, and having a lower end connecting portion protruding vertically and having a zigzag shape; A second thin plate having vertically formed through-holes such that the connecting end of the needle is partially projected downward while the connecting end of the needle is inserted into the plate surface; It is characterized by the configuration provided by.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention improves the structure so that the same material as that of a conventional wafer can be used to appropriately cope with the pattern integration degree of a semiconductor device using a wafer processing technique.

That is, in the present invention, as shown in FIGS. 3 and 4, the main board 10, the reinforcing plate 20, the pin holder 30, the interface pin 40, the sub board 50, the mounting block 60, The thin plate 70, the needle 80, the second thin plate 90, and the cover plate 100 are configured.

As in the past, the main board 10 is configured such that a terminal is connected to the pogo pin of the test head on the upper surface, and a circuit is printed on the plate surface from the terminal.

In addition, vertical pinholes 11 are formed in the main substrate 10 at regular intervals in the center, and vertical through holes 12 are formed outside the pinholes 11.

The reinforcing plate 20 is a reinforcing member which is mounted to the center of the upper portion of the main substrate 10 to prevent bending deformation of the main substrate 10.

In particular, the reinforcement plate 20 is formed with a recess 22 which is recessed upwardly to a size that accommodates all the pinholes 11 formed in the main substrate 10 at the bottom thereof, and has a predetermined depth at the outer periphery of the recess 22. The screw coupling hole 21 which is recessed upwardly is formed.

The pin holder 30 is a surface in close contact with the bottom surface of the main substrate 10 corresponding to the reinforcing plate 20, so that the outer diameter of the cross section of the main substrate 10 side stepped to be larger than the outer diameter of the lower side cross section. It is a shape and is an insulating member in which the guide hole 31 which penetrates perpendicularly on the same vertical line as the pinhole 11 formed in the main board | substrate 10 is formed in the board surface.

The guide hole 31 is particularly preferably such that the lower end portion is formed by expanding the inner diameter more.

The interface pin 40 is a rod-shaped pin having conductivity, and is inserted into the guide hole 31 and the pin hole 11 of the main board 10 from the bottom of the pin holder 30, and the upper end of the interface pin 40 of the main board 10. In the upper end of the pinhole 11 side, a circuit formed from the main substrate 10 to the pinhole 11 side is joined to each other by soldering.

More preferably, the lower end of the interface pin 40 has a larger outer diameter than the inner diameter of the guide hole 31 so that the interface pin 40 is not excessively raised.

The sub-substrate 50 is a substrate printed with a circuit like the main substrate 10 but has the same outer diameter as the bottom surface of the pin holder 30 and is attached by epoxy. Allow the circuit to be formed perpendicular to the position where it can contact the lower end.

At this time, the upper substrate of the vertical printed circuit and the lower end of the interface pin 40 are bonded to the sub-substrate 50 by soldering so as to be in an electrically connected state.

The mount block 60 is vertically penetrated so that the center is stepped to the same inner diameter as the outer diameter of the pin holder 30 so that the pin holder 30 can be seated, and the lower portion has a smaller outer diameter of the pin holder 30. The sub-substrate 50 together with the lower portion is formed to have a length that can be accommodated at the same time, so that these pin holders 30 and the sub-substrate 50 are covered from the outside.

The mount block 60 has a bolt insertion hole 61 vertically penetrating the outer periphery thereof, and inserts the bolt from the bottom to penetrate through the through hole 12 of the main substrate 10 to screw the reinforcing plate 20. Is fastened to the ball 21 is fixed configuration.

The first thin plate 70 has a configuration in which a plurality of needle-shaped hole insertion holes 71 are formed vertically through the plate surface as shown in FIG. 5, and in particular, is bonded to the sub-substrate 50 by epoxy. One end of the needle insertion hole 71 is in communication with the bottom side terminal of the sub-substrate 50 during bonding.

In order to form an epoxy bond with the sub-substrate 50, a filling hole 72 is formed in the plate surface between the needle insertion holes 71 of the first thin plate 70 to vertically fill epoxy.

The needle 80 is inserted into the needle insertion hole 71 of the first thin plate 70, and one end portion of which protrudes upwardly is elastically connected to the bottom terminal of the sub substrate 50, and the other side is bent downward. The end portion thereof is connected to the pattern of the semiconductor device, and the connection end portion 81 has a vertical elastic force.

The needle 80 is particularly produced by the same process as the patterning process on the wafer.

As the process for manufacturing the needle 80, the etching process is most preferred.

The second thin plate 90 is formed to have the same size as the first thin plate 70, and the needle hole into which the downwardly extending connection end 81 of the needle 80 is inserted into the plate surface is finely lifted and lowered as shown in FIG. It is the structure in which 91 is formed.

In addition, similar to the first thin plate 70, the second thin plate 90 allows the filling hole 92 to be vertically penetrated to the plate surface on the same vertical line as the filling hole 72 of the first thin plate 70.

On the other hand, the cover plate 100 is configured to hold the sub-substrate 50 horizontally, and the inner diameter is large enough to accommodate the first thin plate 70 and the second thin plate 90.

Therefore, the cover plate 100 is configured to hold the first thin plate 70 and the second thin plate 90 so as not to flow sideways at the same time.

In the above configuration, in particular, the printed circuit or the first thin plate 70 and the second thin plate 90 formed in the sub-substrate 50 are made of a silicon material such as a wafer, and thus the needle insertion holes 71 to be formed therein. The needle holes 91 and the filling holes 72 and 92 are formed through the same etching process as the process performed during the wafer processing.

In addition, the mounting block 60 and the cover plate 100 is most preferably provided with a ceramic material.

In particular, the first thin plate 70 and the second thin plate 90 may be provided in an integrated state when the thin plate is manufactured.

Looking at the assembly and the operation of the probe card according to the present invention configured as described above are as follows.

In the present invention, the interface pins 40 are inserted into the guide holes 31 of the pin holder 30, respectively, and the sub substrate 50 is bonded to the bottom of the pin holder 30 by epoxy bonding.

At this time, a lower amount of solder is attached to the lower end of the interface pin 40 at the lower end of the guide hole 31 of the pin holder 30, and the sub substrate 50 is bonded to the pin holder 30.

When the sub-substrate 50 is bonded, the lower end of the interface pin 40 is in contact with the circuit terminal formed on the upper surface of the sub-substrate 50 or the lower end of the interface pin 40 is positioned directly above the circuit terminal. .

When the bottom of the sub-substrate 50 is heated while the sub-substrate 50 is bonded in this way, the solder attached to the lower end of the interface pin 40 is melted at the lower end of the guide hole 31 and the interface pin 40 is melted. And the circuit terminals of the sub board | substrate 50 are connected.

As such, when the coupling structure between the pin holder 30, the interface pin 40, and the sub board 50 is seated on the mount block 60, the pin holder 30 and the sub board ( 50) This outer diameter surface is in close contact with each other, and in this state, the surfaces are bonded by epoxy or the like.

In the coupling structure, the needle 80 is inserted into the needle insertion hole 71 and the needle hole 91 having the structure in which the first thin plate 70 and the second thin plate 90 are coupled to each other. 50) and then epoxy is filled in each of the filling holes 72 and 92 to be firmly bonded to the sub-substrate 50.

In this way, when the interface pin 40, the sub board 50, the first thin plate 70, the second thin plate 90, and the needle 80, including the pin holder 30, are coupled to the mounting block 60, the main board The upper part of the 10 allows the reinforcing plate 20 to be seated while bringing these coupling structures into close contact with the bottom surface of the main substrate 10 from the bottom.

In this case, the interface pins 40 protruding from the upper portion of the pin holder 30 are inserted into the pinholes 11 of the main board 10, respectively, and the upper surface side circuit terminals of the main board 10 and the upper ends of the interface pins 40. The joints are joined by soldering, and fastening bolts are inserted from the lower part of the mounting block 60 through the through holes 12 of the main substrate 10 by inserting the bolt insertion holes 61 of the mounting block 60. It is to be firmly fastened to the screw coupling hole 21 of the plate (20).

In this way, when the cover plate 100 is bonded to the bottom of the mounting block 60 by epoxy molding while almost all the components are coupled to the main substrate 10, all assembly is completed.

The cover plate 100 may be coupled to the mounting block 60 immediately after the first thin plate 70, the second thin plate 90, and the needle 80 are coupled to the sub substrate 50.

At this time, the through hole 110 is formed in the outer periphery of the cover plate 100 so that the plate surface penetrates vertically larger than the outer diameter of the fastening bolt on the same vertical line as the bolt insertion hole 61 of the mount block 60.

As described above, the probe card having the combined structure includes the needle insertion hole 71 and the needle hole 91 formed in the first thin plate 70 and the second thin plate 90 by an etching process, which is a wafer processing process. As a result, their size can be made very fine.

In addition, since the needle insertion hole 71 and the needle 80 inserted into the needle hole 91 are also manufactured by patterning the thin plate material by etching, it is possible to overcome the limitations of the reduction of the outer diameter as previously, and to make it very small. It is possible to make.

Therefore, the present invention enables the inspection of highly integrated semiconductors, and is particularly applicable to semiconductors in which circuit patterns are formed in all directions due to improved needle integration.

As described above, the present invention provides a needle for supplying power to a needle 80 connected to a circuit of a semiconductor and a first thin plate 70, a second thin plate 90, and a needle 80 to guide the needle 80. Since the substrate 50 can be highly integrated by an etching process, which is a wafer processing process, it is possible to inspect characteristics of highly integrated and extremely small semiconductors.

In addition, since the deformation of the needle 80 due to long time use is completely prevented, it also provides an economic advantage that can significantly extend the service life.

Claims (10)

A main substrate having a plurality of circuits printed on the plate surface, and having a plurality of pinholes vertically penetrating in the center thereof; A reinforcing plate provided at the center of the upper surface to prevent deformation of the main substrate; A pin holder provided on a bottom surface of the main substrate corresponding to the reinforcement plate, the plate surface forming a guide hole on the same line as the pin hole of the main substrate; An interface pin which is inserted through the pin hole and the guide hole of the main substrate and the pin holder and is soldered to be connected to a circuit pattern of the main substrate; A circuit board printed vertically on the plate surface, and a circuit terminal of the upper surface connected to the lower end of the interface pin by soldering; A mounting block for covering the pin holder and the outer circumferential surface of the sub substrate and forming a bolt insertion hole vertically penetrated at an outer periphery thereof to fasten and fasten the fastening bolt from the bottom to the bolt insertion hole and the main substrate and the reinforcement plate; A first thin plate having a long hole-shaped needle insertion hole attached to the plate surface and attached to the bottom surface of the sub substrate; A needle of a thin plate inserted into the needle insertion hole of the first thin plate, and having a lower end connecting portion protruding vertically and having a zigzag shape; A second thin plate having a through hole vertically formed such that a portion of the needle is protruded downward while the connection end of the needle is inserted into the plate surface; and Cover plate bonded to the bottom surface of the mount block while surrounding the outer peripheral surface of the first thin plate and the second thin plate: Probe card for semiconductor inspection provided by. The probe card of claim 1, wherein the main board forms a through hole through which a fastening bolt fastened from the mount block passes. The probe card of claim 1, wherein the reinforcing plate forms a screw coupling hole in which the fastening bolt fastened through the mount block and the main substrate is fastened. The probe card of claim 1, wherein the reinforcing plate is formed to have a recess so that a portion of a bottom thereof is upwardly recessed in a size that accommodates all the pinholes formed in the main substrate. The probe card of claim 1, wherein an upper portion of the pin holder that is in close contact with the main substrate is formed to be stepped larger than an outer diameter of the lower portion thereof. The probe card for semiconductor inspection according to claim 1, wherein the pin holder is made of an insulator. The probe card of claim 1, wherein the sub substrate is made of a silicon material. The probe card of claim 1, wherein the mount block is made of ceramic. The probe card of claim 1, wherein the first thin plate and the second thin plate are made of a silicon material. The probe card of claim 1, wherein the first thin plate and the second thin plate are integrally coupled to each other.