KR200244654Y1 - Probe card for testing semiconductor - Google Patents

Abstract

The present invention relates to a probe card for semiconductor inspection, the present invention and the main substrate; A reinforcing plate for preventing deformation of the main substrate; A mounting block for fastening the main substrate and the reinforcement plate at the same time; A lower cover plate attached to a bottom surface of the mount block; a needle extending one end of which is inserted into the settling groove and the fitting hole of the lower cover plate while the other end thereof is inclined upward; A guide block to prevent the needle from flowing upward and downward; A guide plate for guiding the vertically upwardly extending portion of the needle to prevent lateral flow; A sub-substrate having an upper end portion of the needle projecting upwardly and a connecting hole electrically connected thereto, wherein a circuit pattern is formed from the connecting hole to an upper surface thereof; A plurality of terminals protrude downward from the bottom surface to be connected to the terminal on the sub-substrate side, and an interface rubber press-fixed between the sub-substrate and the main board while the upper surface protrudes from the terminal to the main board-side terminal. It is characterized in that it is provided as.

Description

Probe card for testing semiconductor

The present invention relates to a probe card for semiconductor inspection, and more particularly, a semiconductor inspection that enables a highly integrated and compact semiconductor device inspection by miniaturizing the needle that comes into contact with the pattern of the semiconductor device and greatly reducing the distance between the needles. For a probe card.

In general, a semiconductor device is manufactured by performing a fabrication process of forming a pattern on a wafer and an assembly process of assembling the wafer on which the pattern is formed into each chip.

In addition, between the fabrication process and the assembly process, an electronic die sorting process (hereinafter, referred to as 'EDS') is performed to inspect electrical characteristics of each chip constituting the wafer.

This EDS process is performed to identify defective chips among the chips constituting the wafer.

In this case, the EDS process mainly uses an inspection apparatus that applies an electrical signal to the chips constituting the wafer and determines a defect based on a signal checked from the applied electrical signal.

The electrical inspection of the chips constituting the wafer mainly uses an inspection apparatus called a probe card having a plurality of needles that apply electrical signals while being in contact with the pattern of each of these chips.

If the result of the test using the probe card is determined to be good, the semiconductor device is manufactured as a finished product by a post process such as packaging.

In the electrical property inspection of a semiconductor wafer, the needle of the probe card is normally brought into contact with the electrode pad of each device of the wafer, and a specific current is energized through the needle to measure the electrical characteristics at that time.

On the other hand, as semiconductor devices have recently been developed to be highly integrated and miniaturized, an inspection apparatus that can appropriately respond to the inspection of such semiconductor devices is required.

As such a semiconductor wafer inspection apparatus, FIGS. 1 and 2 show a conventional probe card.

As shown in the drawing, a conventional probe card includes a circular main printed circuit board 1 having a through hole 1a formed at its center, a reinforcement plate 2 provided at the center of an upper surface of the main printed circuit board 1, It consists of a fixed plate 3 provided in the center of the bottom surface of the main printed circuit board 1 to correspond to the reinforcement plate 2 and the needle 5 fixed to the fixed plate 3 by the insulator 4.

Needle 5 is usually formed symmetrically on both sides of the fixing plate 3, the upper end is joined by welding to the wiring pattern formed on the outer periphery of the fixing plate 3 at the bottom of the main printed circuit board (1) The lower end forms a gentle inclination angle toward the center of the fixing plate 3, and the end portion is bent downward to almost vertical.

In this case, the inclined portion of the needle 5 is fixed by the method of being attached to the fixing plate 3 by the insulator 4, and in particular, the ends bent downward have a vertical elasticity by slightly bending in opposite directions. have.

Needles 5, which are formed symmetrically with each other on both sides, are provided as the same number as the electrode pads of the semiconductor device to be contacted in the front-rear direction.

On the other hand, the decoupling capacitor 6 is attached to the upper surface of the main printed circuit board 1 directly on the upper end of the needle 5 joined to the main printed circuit board 1.

The conventional probe card configured as described above is installed under the test head of the inspection equipment, and the pogo pin of the test head contacts the circuit pattern formed on the upper surface of the main printed circuit board 1 during the inspection process. The downwardly bent contact end 5a of 5) is in contact with the inspection pad formed on the upper surface of the wafer, so that each semiconductor device of the wafer is energized to perform electrical property inspection.

However, in the conventional probe card, the contact ends 5a connected to the semiconductor device of the wafer are symmetrical with each other, so that the interval between the contact ends 5a on both sides gradually becomes narrower when the semiconductor inspection is repeated for a long time, and the supply pad is the inspection pad. There is a problem that the contact with the misalignment causes a poor contact.

To this end, the present applicant reduced the length of the needle through patent application No. 2000-31240 (name: probe card), while simplifying the connection structure between the pattern of the main printed circuit board and the needle to improve the transmission efficiency of high frequency signals. There is a bar.

In addition, the needle was prevented from interfering with the external structure as much as possible, and the stable connection with the pattern of the semiconductor device was made at all times, thereby increasing the efficiency of inspection.

However, although the length of the probe card has been shortened to allow the needle to be vertically raised and lowered, it has a structural limit that can be formed only in one direction as in the conventional needle arrangement while inclining at a predetermined angle.

That is, some semiconductor devices have patterns formed in parallel in one direction, while some semiconductor devices have patterns formed in all directions, so that a separate probe card has to be used for inspection of such semiconductor devices.

In particular, the needle in the prior application design makes the needle firmly bonded by epoxy to ensure that the upper end portion is stably connected to the pattern of the circuit board.

It is a very difficult task to fill the epoxy into the needle insertion hole formed in the needle fixture for the needle bonding.

Therefore, there is a need for an inspection apparatus that is simple to assemble and applicable to semiconductor devices having more diverse circuit patterns.

Therefore, the present invention was created in view of the problems and necessity of the above-described prior art. The main purpose of the present invention is to form a guide hole to prevent needle flow using wafer processing technology, and the needle is greatly reduced in length. The width between the needles is shortened to enable inspection of highly integrated and micro semiconductor devices.

In addition, the present invention has another object to be applicable to the inspection of the semiconductor device to form a pattern in all directions.

1 is a side cross-sectional view of a typical probe card,

2 is a plan view of FIG.

3 is a side cross-sectional view of a probe card according to the present invention,

Figure 4 is a side cross-sectional view of the separated state of the probe card according to the present invention,

Figure 5 is a partially cutaway perspective view showing the configuration of the lower fixing plate according to the present invention,

6 is a partially cutaway perspective view of the guide block according to the present invention;

Figure 7 is a partially cutaway perspective view showing the configuration of the guide plate according to the present invention,

8 is a partially cutaway perspective view showing an example of a sub-substrate according to the present invention;

9 is a partially cutaway perspective view showing another example of the sub-substrate according to the present invention.

Explanation of symbols on the main parts of the drawings

10 main board 20 reinforcement plate

30: mounting block 40: lower cover plate

41: settled groove 42: fitting hole

50: needle 60: guide block

70: guide plate 80: sub substrate

90: interface rubber

In order to achieve the above object, the present invention includes a main substrate on which a plurality of circuits are printed on a plate surface; A reinforcing plate provided at the center of the upper surface to prevent deformation of the main substrate; A mounting block on the bottom surface of the main substrate, the mounting block for fastening the main substrate and the reinforcement plate simultaneously by a fastening means and having an insertion hole penetrating downward in the center thereof; A lower cover plate having an outer periphery attached to the bottom surface of the mount block, and having one end of the settling groove vertically penetrated at a predetermined interval on an upper surface thereof; At the same time, one end of the connecting end is vertically bent downward and inserted into the fitting hole formed as one end of the settling groove, and the other end extends in a shape that is inclined upward toward the upper side of the connecting end, and the end thereof extends vertically upward. A needle having a shape; A guide block attached to the upper surface of the insertion hole side of the mount block of the lower cover plate at a predetermined interval to prevent the needle from flowing upward and downward; A guide plate attached to the upper surface of the guide block at regular intervals and guiding the vertically extending portion of the needle to prevent lateral flow; A sub-substrate bonded to an upper portion of the guide plate, and having a connection hole for inserting an upper end of the needle protruding upwardly and electrically connected thereto, wherein a circuit pattern is formed from the connection hole to an upper surface thereof; A plurality of terminals protrude downward from the bottom surface to be connected to the terminal on the sub-substrate side, and an interface rubber press-fixed between the sub-substrate and the main board while the upper surface protrudes from the terminal to the main board-side terminal. It is characterized by the configuration provided as.

Hereinafter, a preferred embodiment of the present invention will be described in more detail with reference to the accompanying drawings.

The present invention improves the structure so that it can appropriately cope with semiconductor devices which are recently integrated as wafer processing technology by using the same silicon as the conventional wafer and material.

That is, the present invention has a main board 10, a reinforcing plate 20, a mounting block 30, a lower cover plate 40, a needle 50, a guide block 60, and a guide as shown in FIGS. 3 and 4. The plate 70, the sub board | substrate 80, and the interface rubber 90 are comprised.

The main board 10 has a terminal connected to the pogo pin of the test head on the outer periphery of the upper surface as before, and the decoupling capacitor 11 is attached to the inner periphery of the connection terminals of the main board 10, Circuits are printed on the plate surface from each connection terminal toward the center in various ways.

The reinforcing plate 20 is a reinforcing member provided in the center at the top of the main substrate 10 so as to prevent the bending deformation of the main substrate 10.

The main substrate 10 and the reinforcement plate 20 are simultaneously fastened by the fastening means 100 fitted from the bottom surface of the mount block 30 provided with a surface corresponding to the reinforcement plate 20.

The mount block 30 is formed of a material having a high heat resistance against external heat while forming a fastening hole 32 into which the fastening means 100 is inserted, as described above, together with the insertion hole 31 penetrating downward toward the center. To be provided as, but the most preferred material at this time is a ceramic.

The lower cover plate 40 is a flat plate covering the bottom side insertion hole 31 of the mounting block 30.

As shown in FIG. 5, the lower cover plate 40 forms a settled groove 41 of a long hole at a predetermined interval on an upper surface thereof, and one end of the settled groove 41 is vertically penetrated to form a fitting hole 42. It is a configuration as possible.

On the other hand, the settled groove 41 and the fitting hole 42 formed in the lower cover plate 40 are formed by an etching process using a wafer processing technology, but for this purpose, the lower cover plate 40 is made of silicon having the same material as that of the wafer. Most desirable.

The needle 50 is a connecting means for directly transmitting the electrical signal applied from the main substrate 10 of the present invention to the circuit pattern of the semiconductor device.

The needle 50 of the present invention is vertical to one end of the settle groove 41 by causing the horizontal portion to be seated in the settling groove 41 formed on the upper surface of the lower cover plate 40 and one end of the horizontal portion bent downward. While being inserted into the fitting hole 42 to be penetrated into the end portion thereof to protrude downward, the other end is bent with a predetermined inclination angle to the upper side of the connecting end 51 is inserted into the fitting hole 42 at its end Is a shape that extends vertically upward.

The guide block 60 is a support member for preventing the vertical flow of the needle 50 attached to the upper surface of the lower cover plate 40, one side is the same inclined surface as the inclined portion of the needle 50 as shown in FIG. It is a configuration made.

The guide block 60 has needles on the same line while being placed in parallel between the settle grooves 41 of the lower cover plate 40, that is, the ends of each side are positioned at both ends in the longitudinal direction of the settled groove 41. Support 50 at the same time.

In particular, when attaching the guide block 60 is inserted from the top through the insertion hole 31 formed in the center of the mount block 30 to be attached.

The guide plate 70 is a support member for preventing lateral flow of the upper end of the needle 50 extending upward from the top of the guide block 60.

The guide plate 70 is configured as a thin plate having a narrow width as shown in FIG. 7, and a guide hole 71 is formed in one end surface to allow the needle 50 to penetrate vertically.

At this time, the guide hole 71 is most preferably provided in a shape that is open to the cross-sectional side.

The sub-substrate 80 is a plate on which a circuit is printed so that an electrical signal is transmitted from the main substrate 10 to each of the needles 50, and the upper surface of the needle 50 is partially inserted into the plate surface as shown in FIG. The hole 81 is formed, and the circuit pattern 82 and the connection terminal 83 which are connected with these connection holes 81 are formed in the upper surface.

In the sub-substrate 80, the circuit pattern 82 and the connection terminal 83 may be formed side by side as shown in FIG. 8, but in order to have a more dense pattern, the circuit pattern 82 may be formed as shown in FIG. It is also preferable to differentiate the connection length with the connection terminal 83 so that the connection terminal 83 is located in a zigzag manner.

Meanwhile, like the lower cover plate 40, the guide plate 70 and the sub-substrate 80 form a pattern required by etching used for wafer processing, and for this purpose, the material is made of silicon. desirable.

The interface rubber 90 is inserted between the sub board 80 and the main board 10.

The interface rubber 90 has a plurality of terminals protruding downward on the bottom and an upper surface thereof so as to be connected to the terminals of the sub-substrate 80, respectively, and allowing the terminals of the interface rubber 90 to protrude upwardly so as to be accessible to the terminals of the main board 10 side. It is a structure which is crimped and fixed between the sub board | substrate 80 and the main board | substrate 10. FIG.

Looking at the assembly and operation of the probe card according to the present invention of such a configuration as follows.

In the present invention, the lower cover plate 40, the guide plate 70, and the sub-substrate 80 made of a silicon material are first manufactured in a shape required by an etching process applied to wafer processing during semiconductor manufacturing as described above. .

When manufactured by the etching process, it is possible to form a very dense and accurate pattern of various shapes formed on the plate surface of each component.

In particular, since the required pattern can be formed at a time, the time required for work can be significantly shortened compared to mechanical processing.

After some parts have been processed by etching, the bottom cover plate 40 is already attached to the bottom of the mount block 30.

In this case, the lower cover plate 40 has a plurality of settled grooves 41 and fitting holes 42 are formed on the plate surface so that the outer circumferential side where they are not formed is attached to the bottom surface of the mount block 30.

From the top of the lower cover plate 40 to which the mounting block 30 is attached, the needle 50 is inserted into the settling groove 41 and the fitting hole 42 of each lower cover plate 40 through the insertion hole 31. Allow them to rest one by one.

The needle 50 seated in this way is prevented from flowing to the side.

Meanwhile, from the top of the needle 50, the guide block 60 is attached to the upper surface of the lower cover plate 40 at regular intervals.

That is, the guide block 60 is attached in parallel at intervals between both ends in the longitudinal direction of the settling groove 41 formed in the lower cover plate 40.

When the guide block 60 is attached in this way, the needle 50 can prevent side flow in the lower cover plate 40 and at the same time prevent flow in the vertical direction.

Meanwhile, a part of the connection end 51 of the needle 50 inserted into the fitting hole 42 of the lower cover plate 40 protrudes to the bottom of the lower cover plate 40, and such a connection end 51 is fitted. Up and down flow is possible by the external force in the hole 42.

However, when the inclined portion of the needle 50 is in contact with the inclined surface of the guide block 60 during the up and down flow, upward flow is prevented.

In the state supported by the guide block 60, the upper end of the needle 50 is inserted into the connection hole 81 of the sub-substrate 80 through the guide hole 61 of the guide plate 70.

In the sub-substrate 80, a circuit pattern is formed along each connection hole 81 and on the upper surface, so that an electrical signal can be stably transmitted at all times through the needle 50 inserted into the connection hole 81.

Meanwhile, an interface rubber 90 is provided between the main board 10 and the sub board 80 so that the terminals are connected to each of the circuit patterns.

As such, the simplified configuration of transmitting the electrical signal from the main substrate 10 to the needle 50 through the sub-substrate 80 may further improve the transmission efficiency of the high frequency signal.

In particular, the needle 50, the sub-substrate 80 for applying an electrical signal to the needle 50, the guide plate supporting the needle 50, and the lower cover plate 40 are subjected to an etching process, which is a wafer processing technique. Since the needle 50 can be arranged very densely, it is possible to appropriately cope with the inspection of the highly integrated semiconductor device.

In addition, when the needles 50 are disposed to face each other, as shown in FIG. 4, it is possible to apply to the inspection of the C4 type semiconductor device provided with circuit terminals on all sides, thereby enabling inspection of various semiconductor devices.

As described above, the present invention further simplifies the signal transmission path from the main substrate 10 to the needle 50 to be connected with the semiconductor device, so that the needle 50 as these signal transmission means can be formed very densely. This makes it possible to inspect the characteristics of highly integrated semiconductor devices and very small semiconductor devices.

In addition, since the connecting end 51 which is in contact with the semiconductor device of the needle 50 is provided with a structure having a tension up and down, the deformation of the needle 50 can be completely prevented even when used for a long time, thereby further extending the service life. It also provides economic benefits that can be made.

Claims (8)

A main board on which a plurality of circuits are printed; A reinforcing plate provided at the center of the upper surface to prevent deformation of the main substrate; A mounting block on the bottom surface of the main substrate, the mounting block for fastening the main substrate and the reinforcement plate simultaneously by a fastening means and having an insertion hole penetrating downward in the center thereof; An outer periphery is attached to the bottom surface of the mount block, the upper surface and the lower cover plate to form a settling groove of the long hole at regular intervals so that one end of the settling groove penetrates vertically: At the same time it is horizontally settled in the settling groove of the lower cover plate, one end of the connecting end is vertically bent downwardly inserted into the fitting hole formed as one end of the settling groove, and the other end is inclined upward toward the upper side of the connecting end. A needle having a shape in which its end portion extends vertically upward while being extended; A guide block attached to the upper surface of the insertion hole side of the mount block of the lower cover plate at a predetermined interval to prevent the needle from flowing upward and downward; A guide plate attached to the upper surface of the guide block at regular intervals and guiding the vertically extending portion of the needle to prevent lateral flow; A sub-substrate bonded to an upper portion of the guide plate, and having a connection hole for inserting an upper end of the needle protruding upwardly and electrically connected thereto, wherein a circuit pattern is formed from the connection hole to an upper surface thereof; A plurality of terminals protrude downward from the bottom surface to be connected to the terminal on the sub-substrate side, and an interface rubber press-fixed between the sub-substrate and the main board while the upper surface protrudes from the terminal to the main board-side terminal. ; Probe card for semiconductor inspection provided with. The probe card of claim 1, wherein a mounting hole is formed in the main substrate to allow a fastening means to pass from the mounting block. The probe card of claim 1, wherein a screw coupling groove is formed in the reinforcing plate to fasten the fastening means through the mount block and the main substrate. The probe card of claim 1, wherein the mount block is made of a ceramic material. The probe card of claim 1, wherein the lower cover plate is made of a silicon material, and forms a settling groove and a fitting hole by etching. The probe card for semiconductor inspection according to claim 1, wherein the guide block is made of ceramic which is a non-conductor. The probe card of claim 1, wherein the guide plate is made of a silicon material, and a guide hole at one end surface thereof is formed by etching. The probe card of claim 1, wherein the sub substrate is made of a silicon material, and the connection hole and the circuit pattern are patterned by etching.