KR101299204B1 - Contact pin complex and semi conductor device socket comprising the same - Google Patents

Contact pin complex and semi conductor device socket comprising the same Download PDF

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Publication number
KR101299204B1
KR101299204B1 KR1020120039056A KR20120039056A KR101299204B1 KR 101299204 B1 KR101299204 B1 KR 101299204B1 KR 1020120039056 A KR1020120039056 A KR 1020120039056A KR 20120039056 A KR20120039056 A KR 20120039056A KR 101299204 B1 KR101299204 B1 KR 101299204B1
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KR
South Korea
Prior art keywords
pin
contact pin
contact
socket
composite
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KR1020120039056A
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Korean (ko)
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전진국
박성규
전민철
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주식회사 오킨스전자
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE: A contact pin complex body and a semiconductor device test socket including the same are provided to economically and strongly fix a contact pin. CONSTITUTION: A contact pin complex body includes a contact pin, a bottom plate (10), and a top plate (20). The contact pin is composed of a pin head (30a) touching a bottom terminal, a central electric unit (30b) formed on the pin head, and a pin leg (30c). The contact pin forms a bent protrusion (31). The bottom plate is matched with a shape of the bent protrusion and includes a pin leg through hole having a fixing groove for the bent protrusion. The top plate forms a through hole of the pin head and covers the bottom plate.

Description

컨택핀 복합체 및 이를 포함하는 반도체 디바이스 테스트 소켓{CONTACT PIN COMPLEX AND SEMI CONDUCTOR DEVICE SOCKET COMPRISING THE SAME}CONTACT PIN COMPLEX AND SEMI CONDUCTOR DEVICE SOCKET COMPRISING THE SAME

본 발명은 컨택핀 복합체 및 이를 포함하는 반도체 디바이스 테스트 소켓에 관한 것으로, 더욱 상세하게는 반도체 디바이스를 테스트하기 위한 소켓의 제작에 사용되며, 적은수의 부품만으로도 컨택핀 복합체를 간단하게 조립할 수 있어 경제적이며, 동시에 컨택핀을 견고하게 고착시킬 수 있고, 자삽도 가능하여 대량 생산에 유리한 효과를 제공하는 컨택핀 복합체 및 이를 포함하는 반도체 디바이스 테스트 소켓에 관한 것이다.
The present invention relates to a contact pin composite and a semiconductor device test socket including the same. More particularly, the present invention is used in the manufacture of a socket for testing a semiconductor device, and the contact pin composite can be easily assembled with only a few components. The present invention relates to a contact pin composite and a semiconductor device test socket including the same, wherein the contact pin can be firmly fixed and self-insertable to provide an advantageous effect on mass production.

일반적인 반도체 디바이스 테스트용 소켓의 경우, 각각의 소켓에 적용되는 디바이스의 전극단자 배열 형태가 다르거나 그 피치가 달라 전용의 소켓을 사용하고 있으나, 이 경우에는 디바이스 별로 전용의 소켓을 구비하여야 하므로 비용이 증가하는 문제점이 있다. In the case of a general semiconductor device test socket, a dedicated socket is used because the electrode terminal arrangement of the device applied to each socket is different or the pitch thereof is different, but in this case, a dedicated socket must be provided for each device. There is an increasing problem.

또한 동일한 외부형상과 전극 단자의 피치가 동일한 경우라도 실질적인 반도체 디바이스의 단자 배열은 상이가 경우가 발생하여 상기와 같은 문제를 그대로 가지게 된다.In addition, even when the same external shape and the pitch of the electrode terminals are the same, the actual terminal arrangement of the semiconductor device may be different, and the above problems are maintained.

따라서 이러한 문제를 해결하기 위하여, 동일한 매트릭스 형태에서 반도체 디바이스의 단자 배치만 변하는 경우에 이에 대응하는 유니버설 소켓을 개발하는 연구가 이루어졌으며, 특히 대한민국 공개특허 공보 제2003-22736호, "번인 시험 소켓"의 경우에는 디바이스의 단자에 대응하는 복수개의 콘택트 핀을 지지할 수 있어서 상이한 단자배열을 갖는 각종 반도체 디바이스를 처리할 수 있고, 이러한 소켓을 단순한 몰딩기술로도 제작이 가능한 소켓이 제안되었다.Therefore, in order to solve this problem, studies have been made to develop a universal socket corresponding to the case where only the terminal arrangement of the semiconductor device is changed in the same matrix form. In the case of the present invention, there has been proposed a socket capable of supporting a plurality of contact pins corresponding to the terminals of the device, so that various semiconductor devices having different terminal arrangements can be processed, and such a socket can be manufactured by a simple molding technique.

그러나 이와 같은 구성은 도 1에 도시한 바와 같이, 하나의 지지판에 컨택핀을 얹어놓은 형태로 이를 구성하게 되므로 콘택트 핀을 얹은 후에 외부에서 충격을 주는 경우에 콘택트 핀이 쉽게 이탈하거나 이동하는 문제점이 있어서, 취급에 세심한 주의가 필요하고 생산성이 떨어지는 문제점이 있다.However, as shown in FIG. 1, since the contact pin is placed on one support plate, the contact pin is easily detached or moved when the contact pin is impacted from the outside. Therefore, there is a problem in that careful handling is required and productivity is low.

이를 보완하기 위해 도 2에 도시한 바와 같은 컨택핀 복합체가 개시되어 있지만, 조립을 위해 요구되는 부품(엔드플레이트(3) 2개, 중앙 플레이트(1) 30개, 더미플레이트(4) 1개, 컨택핀(2) n개, 샤프트(5) 4개)의 개수가 많고, 조립과정에 나타낸 바와 같이 자삽(자동삽입)이 어려운 한계를 가진다. 따라서, 적은수의 부품만으로도 컨택핀 복합체를 간단하게 조립할 수 있어 경제적이면서, 동시에 컨택핀을 견고하게 고착시킬 수 있고, 자삽도 가능하여 대량 생산에 유리한 새로운 컨택핀 복합체에 대한 연구가 요구되고 있는 실정이다.
In order to compensate for this, a contact pin composite as shown in FIG. 2 is disclosed, but parts required for assembly (2 end plates 3, 30 central plates 1, 1 dummy plate 4, The number of n contact pins (2) and the shafts (4) is large, and as shown in the assembly process, self-insertion (automatic insertion) has a difficult limitation. Therefore, the contact pin composite can be easily assembled with only a small number of parts. Therefore, research on a new contact pin composite that is economical, can firmly secure the contact pin, and can be inserted by itself is advantageous for mass production. to be.

상기와 같은 종래기술의 문제점을 해결하고자, 본 발명은 반도체 디바이스를 테스트하기 위한 소켓의 제작에 사용되며, 적은수의 부품만으로도 컨택핀 복합체를 간단하게 조립할 수 있어 경제적이면서, 동시에 컨택핀을 견고하게 고착시킬 수 있고, 자삽도 가능하여 대량 생산에 유리한 효과를 제공하는 컨택핀 복합체 및 이를 포함하는 반도체 디바이스 테스트용 소켓을 제공하는 것을 목적으로 한다.
In order to solve the above problems of the prior art, the present invention is used in the manufacture of a socket for testing a semiconductor device, it is possible to simply assemble a contact pin composite with only a small number of parts, economical and at the same time firmly It is an object of the present invention to provide a contact pin composite and a socket for testing a semiconductor device including the same, which can be fixed and self-insertable to provide an advantageous effect on mass production.

상기한 바와 같은 기술적 과제는 본 발명에 따른 다음과 같은 구성에 의해 달성된다.
The technical problem as described above is achieved by the following configuration according to the present invention.

(1) 반도체 디바이스 하부단자와 접촉하는 핀헤드, 상기 핀헤드에 연장형성되는 중앙 탄성부 및 핀다리로 이루어지며, 상기 핀다리에 좌우대칭이 되는 절곡돌출부가 형성된 컨택핀;(1) a contact pin formed of a pin head in contact with a lower terminal of a semiconductor device, a central elastic portion extending from the pin head and a pin leg, and having a bent protrusion that is symmetrical with the pin leg;

상기 핀다리의 절곡돌출부의 형상에 정합되고, 상기 컨택핀의 절곡돌출부가 압입되어지는 고정홈이 형성된 핀다리 관통홀을 갖는 하부플레이트;A lower plate having a pin leg through-hole formed in a groove formed in the groove to be matched to the shape of the bent protrusion of the pin leg, and to which the bent protrusion of the contact pin is pressed;

상기 핀헤드의 관통홀이 형성되고 상기 하부플레이트를 덮는 상부플레이트를 포함하는 컨택핀 복합체.
The contact pin composite of the pin head is formed through the upper plate is formed and covers the lower plate.

(2) 제1항에 있어서,(2) The method of claim 1,

상기 탄성부는 만곡부로 이루어진 것을 특징으로 하는 컨택핀 복합체.
The elastic pin is a contact pin composite, characterized in that consisting of the curved portion.

(3) 제1항에 있어서,(3) The method of paragraph 1,

고정홈은 상부에 아래로 내려갈 수록 폭이 좁아지도록 경사면을 갖고, 그 말단에 걸림턱을 갖는 것을 특징으로 하는 컨택핀 복합체.
The fixing groove has an inclined surface so that the width becomes narrower as it goes down to the upper portion, the contact pin composite characterized in that it has a locking jaw at its end.

(4) 제1항에 있어서,(4) The method of paragraph 1,

핀다리는 좌우 한쌍의 절곡돌출부가 형성된 것을 특징으로 하는 컨택핀 복합체.
The pin leg is a contact pin composite, characterized in that a pair of left and right bent protrusions formed.

(5) 제1항 내지 제4항 중 선택된 어느 한 항에 의한 컨택핀 복합체를 포함하는 반도체 디바이스 테스트용 소켓.
(5) A socket for testing a semiconductor device, comprising the contact pin composite according to any one of claims 1 to 4.

(6) 제5항에 있어서,(6) the method of paragraph 5,

상기 소켓은 번인소켓인 것을 특징으로 하는 반도체 디바이스 테스트용 소켓.
And said socket is a burn-in socket.

본 발명에 의하면, 반도체 디바이스를 테스트하기 위한 소켓의 제작에 사용되며, 적은수의 부품만으로도 컨택핀 복합체를 간단하게 조립할 수 있어 경제적이면서, 동시에 컨택핀을 견고하게 고착시킬 수 있고, 자삽도 가능하여 대량 생산에 유리한 효과를 제공한다.
According to the present invention, it is used to manufacture a socket for testing a semiconductor device, and it is possible to simply assemble a contact pin composite with only a few parts, which is economical, and at the same time firmly secures the contact pin, and also allows self-insertion. Provides a beneficial effect on mass production.

도 1은 종래 기술에 따른 반도체 디바이스 테스트용 소켓의 구성도이다.
도 2는 종래 기술에 따른 반도체 디바이스 테스트용 소켓의 다른 구성도이다.
도 3은 본 발명에 따른 컨택핀 복합체의 조립과정도이다.
도 4는 본 발명에 따른 컨택핀의 구성도이다.
도 5는 본 발명에 따른 컨택핀 복합체의 단면도이다.
도 6은 본 발명에 따른 컨택핀의 절곡돌출부가 고정홈에 압입된 상태도이다.
도 7은 본 발명에 따른 컨택핀 복합체를 포함하는 반도체 디바이스 테스트용 소켓의 분해사시도를 나타낸다.1 is a block diagram of a socket for testing a semiconductor device according to the prior art.
2 is another configuration diagram of a socket for testing a semiconductor device according to the related art.
3 is an assembly process of the contact pin composite according to the present invention.
4 is a block diagram of a contact pin according to the present invention.
5 is a cross-sectional view of a contact pin composite according to the present invention.
6 is a state diagram in which the bent protrusion of the contact pin according to the present invention is pressed into the fixing groove.
7 is an exploded perspective view of a socket for testing a semiconductor device including a contact pin composite according to the present invention.

본 발명은 반도체 디바이스 하부단자와 접촉하는 핀헤드, 상기 핀헤드에 연장형성되는 중앙 탄성부 및 핀다리로 이루어지며, 상기 핀다리에 좌우대칭이 되는 절곡돌출부가 형성된 컨택핀;According to an aspect of the present invention, there is provided a semiconductor device including: a pin head contacting a lower terminal of a semiconductor device;

상기 핀다리의 절곡돌출부의 형상에 정합되고, 상기 컨택핀의 절곡돌출부가 압입되어지는 고정홈이 형성된 핀다리 관통홀을 갖는 하부플레이트;A lower plate having a pin leg through-hole formed in a groove formed in the groove to be matched to the shape of the bent protrusion of the pin leg, and to which the bent protrusion of the contact pin is pressed;

상기 핀헤드의 관통홀이 형성되고 상기 하부플레이트를 덮는 상부플레이트를 포함하는 컨택핀 복합체를 제공한다.
A through-hole of the pin head is formed and provides a contact pin composite including an upper plate covering the lower plate.

이하 본 발명에 대하여 도 3 내지 7을 참고하여 상세하게 설명한다. Hereinafter, the present invention will be described in detail with reference to FIGS. 3 to 7.

도 3은 본 발명에 따른 컨택핀 복합체의 조립과정도로서, 본 발명에 따른 컨택핀 복합체는 하부 플레이트(10), 상부 플레이트(20) 및 컨택핀(30)으로 이루어진다.3 is an assembly process diagram of the contact pin composite according to the present invention, the contact pin composite according to the present invention consists of a lower plate 10, the upper plate 20 and the contact pin 30.

하부 플레이트(10)에는 컨택핀의 핀다리가 삽입관통되어지는 관통홀(12)이 형성되고, 상기 관통홀(12)의 상부는 컨택핀의 절곡돌출부(31)를 수용하는 고정홈(11)과 연통되어 있다.The lower plate 10 is formed with a through hole 12 through which the pin leg of the contact pin is inserted, and an upper portion of the through hole 12 receives a fixing groove 11 for receiving the bent protrusion 31 of the contact pin. In communication.

컨택핀(30)을 탑재되는 반도체 디바이스의 하부단자의 배열과 일치되는 패턴으로 상기 고정홈(11)에 핀다리를 압입한다. 컨택핀의 압입이 완료되면, 상면에 관통홀(21)을 갖는 상부 플레이트(20)를 덮어 마감한다. 이때 컨택핀의 핀헤드(30a)는 상기 관통홀(21)을 관통하여 상부로 돌출되어진다.
The pin leg is press-fitted into the fixing groove 11 in a pattern consistent with the arrangement of the lower terminals of the semiconductor device on which the contact pin 30 is mounted. When the indentation of the contact pin is completed, the upper plate 20 having the through-hole 21 on the upper surface is covered with the finish. At this time, the pin head 30a of the contact pin protrudes upward through the through hole 21.

도 4는 본 발명에 따른 컨택핀의 구성도로서, 본 발명에 따른 컨택핀(30)은 반도체 디바이스 하부단자(예로, 땜납볼)와 접촉하는 핀헤드(30a), 상기 핀헤드에 연장형성되는 중앙 탄성부(30b) 및 핀다리(30c)로 이루어지며, 상기 핀다리에 좌우대칭이 되는 절곡돌출부(31)가 형성되어진다.4 is a configuration diagram of a contact pin according to the present invention, the contact pin 30 according to the present invention is a pin head (30a) in contact with the lower terminal (for example, solder ball) of the semiconductor device, is formed to extend to the pin head It is composed of a central elastic portion (30b) and the pin legs (30c), the bent projections 31 are formed in the pin legs are symmetrical.

핀헤드(30a)의 말단팁이 반도체 디바이스 하부단자(미도시)와 결합하는 과정에서 중앙 탄성부(30b)가 휘면서 핀헤드(30a)와 핀다리(30c)를 가압하여 단자와의 접촉력을 증대시켜준다.In the process where the end tip of the pin head 30a is coupled with the lower terminal (not shown) of the semiconductor device, the central elastic portion 30b is bent to press the pin head 30a and the pin leg 30c to contact the terminal. Increase.

또, 핀다리(30c)에 형성된 절곡돌출부(31)는 한쌍이 좌우 대칭으로 꺾인 "ㄷ"자 형으로 형성되어 도 5 및 도 6에 도시된 바와 같이 하부플레이트(10)에 이를 수용하는 형상인 "ㄷ"자 형의 고정홈(11a)에 압입된다. In addition, the bent protrusions 31 formed on the pin legs 30c are formed in a "c" shape in which a pair is bilaterally symmetrically folded to have a shape that accommodates them in the lower plate 10 as shown in FIGS. 5 and 6. It is press-fitted into the "c" shaped fixing groove 11a.

상기 고정홈(11)은 입구에서 내려갈수록 폭이 감소하도록 경사면(11a)을 두어 절곡돌출부(31)의 삽입을 용이하게 하고, 동시에 절곡돌출부(31)의 상부에는 경사부(31a)를 두어 상기 경사부가 고정홈의 경사면 하단의 걸림턱(11b)을 가압하는 방법으로 압입이 이루어진다. 이 과정에 의해 컨택핀(30)은 견고하게 하부플레이트(10)에 고정되어질 수 있게 된다.
The fixing groove 11 has an inclined surface 11a so as to decrease in width as it goes down from the inlet to facilitate the insertion of the bent projections 31, and at the same time, the inclined portion 31a is placed at the upper part of the bent projections 31. The inclined portion is press-fitted in such a way as to press the locking step (11b) of the bottom of the inclined surface of the fixing groove. By this process, the contact pin 30 can be firmly fixed to the lower plate 10.

도 7은 상기 본 발명에 따른 컨택핀 복합체(400)을 포함하는 반도체 디바이스 테스트용 소켓의 일실시예로서 분해사시도를 나타낸다. 7 is an exploded perspective view of an embodiment of a socket for a semiconductor device test including the contact pin composite 400 according to the present invention.

상기 소켓은 커버(100), 어뎁터(200), 래치(300), 컨택핀 복합체(400), 베이스(500) 및 리드 가이드(600)가 순차적으로 결합을 이루게 된다. 이와 같은 구성은 공지의 다양한 형상이 이에 적용될 수 있으며, 특이점은 컨택트 복합체(400)에 있는 것으로, 이하, 컨택트 복합체(400)를 중심으로 기술하기로 하고, 통상적인 소켓의 구성에 대하여는 그 일예로 대한민국 공개특허 공보 제2003-22736호, "번인 시험 소켓"에 대한 기술을 참고할 수 있다.
The socket is coupled to the cover 100, the adapter 200, the latch 300, the contact pin composite 400, the base 500 and the lead guide 600 in sequence. Such a configuration can be applied to a variety of known shapes, the singularity is in the contact composite 400, hereinafter will be described with respect to the contact composite 400, as an example for the configuration of a conventional socket Reference may be made to Korean Unexamined Patent Publication No. 2003-22736, "Burn In Test Socket."

상기와 같은 본 발명의 구성에 의하면, 적은수의 부품만으로도 컨택핀 복합체를 간단하게 조립할 수 있어 경제적이면서, 동시에 컨택핀을 견고하게 고착시킬 수 있고, 자삽도 가능하여 대량 생산에 유리한 효과를 제공할 수 있다.
According to the configuration of the present invention as described above, it is possible to simply assemble the contact pin composite with only a small number of parts is economical, at the same time firmly fixed contact pins, it is possible to insert itself can provide an advantageous effect for mass production Can be.

이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의하여 한정되는 것은 아니고, 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 해당 기술분야의 당업자가 다양하게 수정 및 변경시킨 것 또한 본 발명의 범위 내에 포함됨은 물론이다.
The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various modifications and changes made by those skilled in the art without departing from the spirit and scope of the present invention described in the claims below. Changes are also included within the scope of the invention.

10: 하부 플레이트
11: 고정홈
11a: 경사부
11b: 걸림턱
12: 관통홀
20: 상부 플레이트
21: 관통홀
30: 컨택핀
31: 절곡돌출부
400: 컨택핀 복합체10: lower plate
11: fixing groove
11a: slope
11b: jamming jaw
12: Through hole
20: top plate
21: through hole
30: contact pin
31: bending protrusion
400: contact pin complex

Claims (6)

반도체 디바이스 하부단자와 접촉하는 핀헤드, 상기 핀헤드에 연장형성되는 중앙 탄성부 및 핀다리로 이루어지며, 상기 핀다리에 좌우대칭이 되는 절곡돌출부가 형성된 컨택핀;
상기 핀다리의 절곡돌출부의 형상에 정합되고, 상기 컨택핀의 절곡돌출부가 압입되어지는 고정홈이 형성된 핀다리 관통홀을 갖는 하부플레이트;
상기 핀헤드의 관통홀이 형성되고 상기 하부플레이트를 덮는 상부플레이트를 포함하는 컨택핀 복합체.A contact pin formed of a pin head in contact with a lower terminal of the semiconductor device, a central elastic portion extending from the pin head, and a pin leg, and having a bent protrusion formed to be symmetrical to the pin leg;
A lower plate having a pin leg through-hole formed in a groove formed in the groove to be matched to the shape of the bent protrusion of the pin leg, and to which the bent protrusion of the contact pin is pressed;
The contact pin composite of the pin head is formed through the upper plate is formed and covers the lower plate. 제1항에 있어서,
상기 탄성부는 만곡부로 이루어진 것을 특징으로 하는 컨택핀 복합체.The method of claim 1,
The elastic pin is a contact pin composite, characterized in that consisting of the curved portion. 제1항에 있어서,
고정홈은 상부에 아래로 내려갈 수록 폭이 좁아지도록 경사면을 갖고, 그 말단에 걸림턱을 갖는 것을 특징으로 하는 컨택핀 복합체.The method of claim 1,
The fixing groove has an inclined surface so that the width becomes narrower as it goes down to the upper portion, the contact pin composite characterized in that it has a locking jaw at its end. 제1항에 있어서,
핀다리는 좌우 한쌍의 절곡돌출부가 형성된 것을 특징으로 하는 컨택핀 복합체.The method of claim 1,
The pin leg is a contact pin composite, characterized in that a pair of left and right bent protrusions formed. 제1항 내지 제4항 중 선택된 어느 한 항에 의한 컨택핀 복합체를 포함하는 반도체 디바이스 테스트용 소켓.A socket for testing a semiconductor device comprising a contact pin composite according to any one of claims 1 to 4. 제5항에 있어서,
상기 소켓은 번인소켓인 것을 특징으로 하는 반도체 디바이스 테스트용 소켓.The method of claim 5,
And said socket is a burn-in socket.
KR1020120039056A 2012-04-16 2012-04-16 Contact pin complex and semi conductor device socket comprising the same KR101299204B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101650134B1 (en) * 2015-02-27 2016-08-24 주식회사 오킨스전자 Comtact member and semiconductor package test socket comprising the same
KR101912710B1 (en) 2017-10-20 2018-12-28 주식회사 오킨스전자 low insertion force connector
KR101954002B1 (en) 2017-12-29 2019-03-04 조항일 Device for assembling contact pin of semiconductor ic test socket

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200244654Y1 (en) * 2001-06-08 2001-10-29 주식회사 유림하이테크산업 Probe card for testing semiconductor
KR20090106034A (en) * 2008-04-04 2009-10-08 (주)마이크로컨텍솔루션 Socket for testing BGA
KR20100052721A (en) * 2008-11-11 2010-05-20 이종욱 Test socket of semiconductor package
KR101032648B1 (en) * 2011-02-10 2011-05-06 주식회사 아이에스시테크놀러지 Socket for electrical test

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200244654Y1 (en) * 2001-06-08 2001-10-29 주식회사 유림하이테크산업 Probe card for testing semiconductor
KR20090106034A (en) * 2008-04-04 2009-10-08 (주)마이크로컨텍솔루션 Socket for testing BGA
KR20100052721A (en) * 2008-11-11 2010-05-20 이종욱 Test socket of semiconductor package
KR101032648B1 (en) * 2011-02-10 2011-05-06 주식회사 아이에스시테크놀러지 Socket for electrical test

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101650134B1 (en) * 2015-02-27 2016-08-24 주식회사 오킨스전자 Comtact member and semiconductor package test socket comprising the same
KR101912710B1 (en) 2017-10-20 2018-12-28 주식회사 오킨스전자 low insertion force connector
KR101954002B1 (en) 2017-12-29 2019-03-04 조항일 Device for assembling contact pin of semiconductor ic test socket

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