KR101391794B1 - probe unit and probe card - Google Patents

Abstract

There is disclosed a probe card capable of reducing a signal transmission path from a main substrate to a probe so as to have less influence on an external noise signal and coping with highly integrated devices. The probe card 100 includes a probe 110 contacting the electrode pad of the semiconductor chip to determine whether the semiconductor chip is defective or not. A first guide 120 for supporting the probe 110; a first guide 120 having a hole 122 through which the probe 110 is inserted; A second guide 130 for receiving a predetermined portion of the probe 110; A bar 140 supporting the first guide 120 while receiving the probe 110 passing through the first guide 120; And a main substrate 150 connected to the probe 110 to transmit an electric signal to the probe 110. The probe 110 is directly connected to the terminal 152 formed on the main substrate 150 .

Probe card, probe

Description

[0001] PROBE UNIT AND PROBE CARD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a probe card that is in contact with an electrode pad of a semiconductor chip to determine whether or not a semiconductor chip is defective. More particularly, the present invention relates to a probe card capable of reducing a signal transmission path from a main substrate to a probe, thereby receiving less influence on an external noise signal.

Generally, a semiconductor device is fabricated through a fabrication process for forming a pattern on a wafer and an assembly process for assembling a wafer on which a pattern is formed to each chip, and between such a fabrication process and an assembly process An electrical dicing (EDS) process is performed to check the electrical characteristics of each chip constituting the wafer.

The EDS process is a process for discriminating defective chips among the chips constituting the wafer, that is, an electric signal is applied to each chip constituting the wafer, and it is judged whether or not the defect is caused by a signal checked from the applied electric signal For this purpose, it is necessary to provide a probe card including a probe which directly contacts the pattern of each chip on the wafer and applies an electrical signal.

Generally, the probe card includes a main substrate, a sub-substrate (or a ceramic substrate called a space transformer), an interface means for interfacing a main substrate and a sub-substrate (or a probe), a probe As shown in Fig.

Recently, semiconductor devices are increasingly highly integrated, and accordingly, development of probe cards for highly integrated semiconductor devices is essential. In the probe card for a highly integrated semiconductor device, the interface means for connecting the main substrate and the sub substrate is very important. The interface means should be such that the circuit pattern is gradually reduced from the main substrate to the sub-substrate while accurate electrical signal transmission from the main substrate to the sub-substrate is required.

In the conventional probe card, the interface means is usually a rod or a wire having a circular or elliptical cross section, and its upper and lower ends are connected to the main board and the sub board by welding or soldering, respectively, so that an electrical signal is transmitted. But. Such conventional interface means has a problem in that damage due to an impact that may occur during the contact process between the probe and the pad (i.e., welding or soldering between the substrate and the interface unit) may occur due to the lack of connection flexibility.

A probe card for solving the above-mentioned problems has been disclosed in Korean Utility Model Registration No. 0394134.

1 is a view showing a configuration of a probe card according to the related art. And FIG. 2 is a view showing a configuration of a needle block applied to the probe card of FIG.

The conventional probe card includes a main substrate member 10, a flexible substrate member 20 detachably coupled to the main substrate member 10, an upper stiffening plate member 30, a flexible substrate member 20, A plurality of socket members 50 through which the flexible substrate member passes and both side ends thereof are screwed to the guide plate member 40; A needle block 60 having a plurality of needles 62 embedded therein so as to protrude finely up and down respectively, a circuit pattern connected to the other end side pattern of the flexible substrate member is formed, A connecting pattern is formed so as to be electrically connected to the upwardly projecting connection end of the needle 62 of the needle block while the connecting pattern of the upper and lower surfaces is electrically connected to each other, And a reinforcing plate member (80).

However, the conventional probe card configured as described above has a problem that it is difficult to appropriately cope with the tendency of high integration of semiconductors. That is, in the probe card for highly integrated semiconductor inspection, the density of the probe increases as the area of the wafer to be inspected increases. In this case, if a flexible substrate is used as the interface means, There is a problem that there is a limit.

In addition, since a flexible substrate is used as a propagation medium in transmitting a signal between the probe and the main substrate member, there is a problem in that a signal propagation path becomes long, so that noise may be generated or external noise may be affected during signal transmission.

In addition, since a socket is required for each flexible board used in the probe card, the space occupied by the socket used becomes large, which is difficult to apply to a highly integrated device.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a probe card capable of minimizing the influence of a noise signal by reducing a signal transmission path from a probe to a main substrate.

It is another object of the present invention to provide a probe card which can be used in highly integrated devices by not using a flexible substrate and a socket unlike a conventional probe card.

It is another object of the present invention to provide a probe unit in which a probe can be easily brought into contact with a terminal of a highly integrated device because the position control of the probe can be finely adjusted by fixing the probe fixedly supported by the guide, unlike the conventional probe unit .

According to an aspect of the present invention, there is provided a probe card comprising: a probe which contacts an electrode pad of a semiconductor chip to determine whether the semiconductor chip is defective; A first guide for supporting the probe, the first guide having a hole through which the probe is inserted; A second guide for receiving a predetermined portion of the probe; A bar supporting the first guide while receiving a probe penetrating the first guide; And a main substrate connected to the probe so that an electric signal is transmitted to the probe, wherein the probe is directly connected to a terminal formed on the main substrate.

Wherein the probe comprises a body having an "a" shape passing through the first guide; A post portion formed at one end of the body portion; And a tip portion formed at one end of the post portion and contacting a pad of the semiconductor chip. A protrusion may be formed on a side surface of the body portion so that the body portion is not separated downward from the first guide.

The body and the protrusion may be fixed to the first guide with an epoxy.

The probe and the main substrate may be connected by inserting a contact portion formed at a lower end of the body portion into a groove formed in the terminal.

The materials of the first and second guides may include silicon.

The material of the bar may include invar.

A reinforcing member for preventing deformation of the main board may be connected to the main board.

In order to accomplish the above object, a probe card according to the present invention includes: a probe which is brought into contact with an electrode pad of a semiconductor chip to determine whether the semiconductor chip is defective; A guide for receiving a predetermined portion of the probe; A ceramic substrate connected to the probe so that an electric signal is transmitted to the probe; An interposer including an interconnect body connected to the ceramic substrate to transmit electrical signals to the ceramic substrate; And a main substrate connected to the interposer of the interposer so that an electric signal is transmitted to the interposer.

In order to achieve the above object, a probe unit according to the present invention includes: a probe which is brought into contact with an electrode pad of a semiconductor chip to determine whether a semiconductor chip is defective; A first guide for supporting the probe, the first guide having a hole through which the probe is inserted; A second guide for receiving a predetermined portion of the probe; And a bar supporting the first guide while receiving a probe passing through the first guide.

Wherein the probe comprises a body having an "a" shape passing through the first guide; A post portion formed at one end of the body portion; And a tip portion formed at one end of the post portion and contacting a pad of the semiconductor chip. A protrusion may be formed on a side surface of the body portion so that the body portion is not separated downward from the first guide.

In order to achieve the above object, a probe unit according to the present invention includes: a probe which is brought into contact with an electrode pad of a semiconductor chip to determine whether the semiconductor chip is defective; And a guide for receiving a predetermined portion of the probe.

The probe includes a body portion having an "a" shape; A post portion formed at one end of the body portion; And a tip portion formed at one end of the post portion and contacting a pad of the semiconductor chip.

According to the present invention, since the signal line connected to the probe is connected to the sub-substrate, the propagation path of the signal is shorter than that of the conventional technology using the flexible substrate, thereby reducing the influence of external noise.

In addition, unlike the conventional probe card, since the flexible substrate and the socket for the flexible substrate are not used, the present invention can be used in a highly integrated device because the overall size is reduced.

Further, according to the present invention, since the probe is fixedly supported by the guide, unlike the conventional probe unit, the position control of the probe can be finely controlled, so that the probe can easily contact the terminal of the highly integrated device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, in order to facilitate a person skilled in the art to easily carry out the technical idea of the present invention. do.

3 and 4 are a cross-sectional view and an exploded perspective view showing the configuration of the probe card 100 according to an embodiment of the present invention.

3 and 4, the probe card 100 includes a probe 110, first and second guides 120 and 130, a bar 140, a main substrate 150, and a reinforcing member 160, Respectively.

The probe 110 is brought into contact with the electrode pads of the semiconductor chip to determine whether or not the semiconductor chip is defective. Here, the material used for manufacturing the probe 110 may include tungsten (W), copper (Cu), nickel-cobalt (Ni-Co) alloy, beryllium-copper (Be-Cu)

In the present invention, the probe 110 includes a body portion 112, a post portion 114, a tip portion 116, and a protruding terminal portion 118.

The body portion 112 is formed in a shape of "A" in which the vertical portion 112a and the horizontal portion 112b are connected to each other and a post portion 114 having a predetermined length is formed at the end of the horizontal portion 112b The end portion of the post portion 114 is formed in a polygonal pyramid or a conical shape with the horizontal cross-sectional area being gradually reduced to form a tip portion 116 that is in direct contact with the pad of the semiconductor chip. A protruding terminal portion 118 protruding from the body portion 112 is formed near the middle of the body portion 112. The protruding terminal portions 118 protrude in opposite directions from each other with respect to the body portion 112 of the probe 110. The protruding terminal portions 118 are preferably formed in the same shape and size.

The body part 112, the post part 114, the tip part 116 and the projecting terminal part 118 constituting the probe 110 are integrally formed by using an electroplating method or a fine patterning method. The probe 110 is preferably fabricated to have a thickness ranging from 30 to 50 mu m.

The probes 110 and the protruding terminals 152 of the main substrate 150 to be described later are concavely engaged with the ends of the vertical portion 112a of the body portion 112 constituting the probe 110, Is formed.

The first guide 120 serves to fix and support the probe 110. Referring to FIG. 4, a plurality of probes 110 are inserted into the first guide 120 in two rows, and the probes 110 in each column are opposed to each other.

Generally, a guide used in a probe card is fixed and fixed to prevent the probe from moving in the X-axis or Y-axis direction due to the pressure generated when the probe and the electrode pad of the semiconductor chip come into contact with each other, As the semiconductor chip is highly integrated, the spacing between the pads of the semiconductor chip is reduced. As a result, the spacing between the probes may be reduced to cause electrical contact between the probes, so that the guide may serve as an insulating film between the probes.

The vertical portion 112a of the body portion 112 is penetrated through the through hole 122 and supported by the first guide 120. [ At this time, since the protruding terminal portion 118 contacts the upper surface of the first guide 120, the degree of penetration of the probe 110 is limited, and as a result, the probe 110 does not drop downward from the first guide 120 . The protruding terminal portion 118 is firmly fixed to the upper surface of the first guide 120 by the epoxy molding 170. In this process, the epoxy molding 170 is brought into contact with the body portion 112, 1 guide 120, as shown in Fig. The horizontal portion 112b is spaced apart from the upper surface of the first guide 120 in a state where the projecting terminal portion 118 is fixed to the first guide 120. [

In the present invention, a plurality of first guides 120 may be provided, and a plurality of probes 110 may be fixedly supported on the first guides 120. For example, five DUTs (Device Under Test), that is, a plurality of probes 110 capable of measuring the electrical characteristics of five semiconductor chips are inserted and accommodated in one first guide 120, A plurality of guides 120 may be assembled to manufacture a probe card. As a result, even if some probes are broken, only the guide in which the probes are installed can be separated from the probe card, which makes it easy to repair the probe card.

The second guide 130 serves to minimize the interference between the probes 110 by limiting the movable range of the probes 110. The second guide 130 is disposed in a spaced space between the horizontal portion 112b of the body portion 112 and the upper surface of the first guide 120 and particularly the tip portion 116 is in contact with the electrode pad A predetermined portion of the probe 110 can be easily accommodated. The second guide 130 is formed with a receiving groove 132 in which a predetermined portion of the probe 110, that is, the horizontal portion 112b and a portion of the post portion 114, is accommodated. That is, since the probe 110 is accommodated in the receiving groove 132 of the second guide 130, the range of the probe 110 can be limited. Particularly, when the probes 110 are brought into contact with the electrode pads of the semiconductor chip, it is possible to suppress the movement in the left and right directions as much as possible, thereby minimizing the influence between the probes 110. In addition, the second guide 130 can mitigate the impact when the probe 110 comes into contact with the electrode pads of the semiconductor chip. As described above, according to the present invention, since the probe 110 is fixedly supported by the first 120 and the second 120, the position control of the probe can be finely controlled, so that the probe can easily contact the terminal of the highly integrated device There is an advantage.

The first and second guides 120 and 130 are preferably made of silicon. This is because micrometer-scale unit structures can be fabricated because silicon can be microfabricated, and it is easy to form an insulating film, which may be needed in an electronic device such as a probe card.

The first and second guides 120 and 130 may be manufactured separately and then joined together or may be integrally manufactured. In the former case, the first and second guides 120 and 130 are bonded using an epoxy molding (not shown).

The bar 140 serves to support the first guide 120 while receiving the probe 110 passing through the first guide 120. The bar 140 is disposed below the first guide 120 and the bar 140 is formed with a hole 142 through which the probe 110 can be received. The diameter of the hole 142 is formed to be sufficiently larger than that of the vertical portion 112a of the body portion 112 so that the outer circumference of the vertical portion 112a of the body portion 112 is spaced from the inner circumference of the hole 142 . The bar 140 is bonded to the first guide 120 using an epoxy molding 170.

The material of the bar 140 is preferably Invar. This is because the variation of the probe card characteristics according to the temperature change can be minimized. The bar 140 is bonded to the lower portion of the first guide 120 using an epoxy molding 170.

As described above, in the present invention, since the signal transmission path is shorter than that of the conventional probe card using a flexible substrate by directly connecting to a main substrate to be described later through a contact portion formed on the probe 110, there is an advantage of being less affected by external noise have. Further, since the flexible substrate is not used in the present invention, a socket is not required, so that it can be applied to electrode pads having a fine pitch, so that the present invention can be applied to highly integrated devices.

5 is a perspective view showing the configuration of the probe unit 110A, and shows one end of the probe unit 110A. As shown in the figure, the probe unit 110A is a basic unit constituting the probe card 100, which is composed of a plurality of probes 110 / first and second guides 120 and 130 / bars 140. That is, the probe card 100 is manufactured by assembling a plurality of probe units 110A to a main substrate 150 to be described later.

The main substrate 150 corresponds to, for example, a printed circuit board (PCB), and is a substrate on which a circuit pattern for applying an electrical signal to the probe 110 is formed.

A convex shaped contact terminal 152 is formed on the main substrate 150 and contacts the contact portion 112c formed at the lower end of the probe 110. [ In order to improve the contactability of the contact portion 112c and the contact terminal 152, it is preferable that the contact portion 112c and the contact terminal 152 are formed in a close contact shape when they are coupled to each other.

In the embodiment of the present invention, the contact portion 112c is formed in a concave groove shape and the contact terminal 152 is formed in a convex shape in a semicircular shape in which the contact portion 112c and the contact terminal 152 have the same curvature But they can be formed in other forms as long as they can be combined with each other. 6, the lower end of the vertical part 112a of the probe 110 is horizontally formed and the contact terminal 152 has a width corresponding to the thickness of the vertical part 112a of the probe 110 When the lower end of the vertical part 112a is inserted into the groove after the straight groove is formed, the lower end of the vertical part 112a is inserted into the groove and then closely contacted with the signal through the contact terminal 152 .

In this way, the probe may be formed in a different shape as long as the lower end of the probe is coupled to the contact terminal and then closely contacted with each other so that the signal can be transmitted.

The contact terminal 152 is connected to a circuit pattern (not shown) of the main board 150 by a lead wire interposed in the main board 150.

Therefore, when the probe unit 110A and the main board 150 are coupled to each other via the contact portion 112c and the contact terminal 152, the contact portion 112c and the contact terminal 152 are pressed against each other to form a signal section .

The electrical signal from the probe card 110 is finally applied to the electrode pad of the semiconductor chip through the circuit pattern of the main board 150 / the contact terminal 152 of the main board 150 / probe 110.

A reinforcing member 160 for supporting the main substrate 150 and preventing the main substrate from being bent down due to external force is disposed under the main substrate 150. The reinforcing member 160 is coupled to the main board 150 using bolts 162.

FIG. 7 is a perspective view showing a state in which the probe unit 110A and the main board 150 are engaged. As shown in the figure, the probe unit 110A is coupled to the main board 150 with a bolt 162.

FIG. 8 is a perspective view showing a final completed state of the probe card 100 according to an embodiment of the present invention. As shown in the figure, the probe card 100 is manufactured by assembling a plurality of probe units 110A matching the specifications of the probe card on the main board 150. [

Meanwhile, according to the embodiment of the present invention, the probes 110 are directly connected to the main substrate 150, but the present invention is not limited thereto. The probe 110 may be directly attached to the multilayer ceramic substrate 200 and the multilayer ceramic substrate 200 may be connected to the main substrate 400 through the interposer 300 ). Here, the multilayer ceramic substrate 200 is a substrate for forming the circuit pattern of the main substrate 400 to be more dense and highly integrated and high-density so that an electric signal from the main substrate 400 is transmitted to the probe 110, ). The interposer 300 is a means for interfacing the multilayer ceramic substrate 200 and the main substrate 400. The interposer 300 is a means for interfacing the main substrate 400 to the multilayer ceramic substrate 200, And an interconnect body 320 serving as a medium. At this time, the connection terminal 320 connected to the interconnecting body 320 and the opening circuit pattern 420 are provided on the multilayer ceramic substrate 200 and the main substrate 400, respectively. A probe card assembly in which probes are connected to a main board through a multilayer ceramic substrate is a well-known technology, and a detailed description thereof will be omitted herein. In another embodiment of the probe card of the present invention, which comprises probe 110, multi-layer ceramic substrate 200, interposer 300, and main substrate 400, (130).

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Various variations and modifications are possible. Such variations and modifications are to be considered as falling within the scope of the invention and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a configuration of a probe card according to the related art; Fig.

Fig. 2 is a view showing a configuration of a needle block used in the probe card of Fig. 1; Fig.

3 is a cross-sectional view showing a configuration of a probe card according to an embodiment of the present invention.

4 is an exploded perspective view showing a configuration of a probe card according to an embodiment of the present invention;

5 is a perspective view showing a configuration of a probe unit;

6 is a view showing a connection relation between a probe and a main substrate;

7 is a perspective view showing a state in which the probe unit and the main board are engaged;

FIG. 8 is a perspective view showing a final completed state of a probe card according to an embodiment of the present invention; FIG.

9 is an exploded perspective view showing a configuration of a probe card according to another embodiment of the present invention.

Description of the Related Art

100: Probe card

110: Probe

110A: Probe unit

112:

114: Post part

116: Tip

118: projecting terminal portion

120: First guide

122: Through hole

130: Second Guide

132: receiving groove

140: Bar

142: hole

150, 400: main substrate

152: protruding terminal

160: reinforcing member

162: Bolt

170: Epoxy Molding

200: multilayer ceramic substrate

220: connection terminal

300: interposer

320:

420: Open circuit pattern

Claims (12)

A probe contacting the electrode pad of the semiconductor chip to determine whether the semiconductor chip is defective; A first guide for supporting the probe, the first guide having a hole through which the probe is inserted; A second guide for receiving a predetermined portion of the probe; A bar supporting the first guide while receiving a probe penetrating the first guide; And A main substrate connected to the probe so that an electric signal is transmitted to the probe; / RTI > Wherein the probe is directly connected to a terminal formed on the main substrate, Wherein the probe comprises: An "a" shaped body portion passing through the first guide; A post portion formed at one end of the body portion; And And a tip portion formed at one end of the post portion and contacting a pad of the semiconductor chip, Wherein a protrusion is formed on a side surface of the body so that the body is not separated from the first guide. delete The method according to claim 1, Wherein the body and the protrusion are fixed to the first guide by epoxy. The method according to claim 1, And the probe is connected to the main substrate by inserting a contact portion formed at a lower end of the body portion into a groove formed in the terminal. The method according to claim 1, Wherein the material of the first and second guides comprises silicon. The method according to claim 1, Wherein the bar material comprises invar. ≪ RTI ID = 0.0 > 11. < / RTI > The method according to claim 1, And a reinforcing member for preventing deformation of the main board is connected to the main board. A probe contacting the electrode pad of the semiconductor chip to determine whether the semiconductor chip is defective; A guide for receiving a predetermined portion of the probe; A ceramic substrate connected to the probe so that an electric signal is transmitted to the probe; An interposer including an interconnect body connected to the ceramic substrate to transmit electrical signals to the ceramic substrate; And A main substrate connected to the interposer of the interposer so that an electric signal is transmitted to the interposer; The probe card comprising: A probe contacting the electrode pad of the semiconductor chip to determine whether the semiconductor chip is defective; A first guide for supporting the probe, the first guide having a hole through which the probe is inserted; A second guide for receiving a predetermined portion of the probe; And A probe supporting the first guide while receiving a probe penetrating the first guide; , ≪ / RTI & Wherein the probe comprises a body having an "a" shape passing through the first guide; A post portion formed at one end of the body portion; And a tip portion formed at one end of the post portion and contacting a pad of the semiconductor chip, And a protrusion is formed on a side surface of the body so that the body is not separated from the first guide. delete A probe contacting the electrode pad of the semiconductor chip to determine whether the semiconductor chip is defective; And A guide for receiving a predetermined portion of the probe , ≪ / RTI & Wherein the probe comprises: An "a" shaped body portion; A post portion formed at one end of the body portion; And And a tip portion formed at one end of the post portion and contacting a pad of the semiconductor chip, Wherein a protrusion is formed on a side surface of the body so that the body is not separated downward from the guide. delete

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