KR20090043168A - A connection pin for a pin-type connector and a pin-type connector - Google Patents

Abstract

The present invention relates to a connecting pin and a pin-type connector for a pin-type connector, and when the main board and other circuit boards (sub-boards) need to be connected, there is no limitation on the number of objects to be connected, and stable electrical connection is possible even when deformed by external causes of the board. To be possible, the pin-shaped connector according to the present invention is a connecting pin applied to the connector for electrically connecting the main board and the sub board of the probe card, the connecting pin is a main board insertion end which is inserted into the main board; A fixing part extending from the main board insertion end and inserted into a pin guide into which the connection pin is inserted and fixed; And a sub board insertion end extending from the fixing part and inserted into the sub board.

Probe card, board, connecting pin, spring, strain

Description

Connector pin and a pin-type connector {A connection pin for a pin-type connector and A pin-type connector}

The present invention relates to a connector connecting pin and a pin-type connector, and more specifically, the pin is applied when connecting the main board and the sub board of the probe card, and it is possible to electrically connect to the correct position without deflecting using a multi-pin, strong coupling force Through the connector pins and related technologies that can be electrically connected to the deformation of the board reliably.

The individual chips in which circuits are integrated through various processes on a silicon wafer obtained by thinly cutting a silicon rod, which is a semiconductor, are called wafer chips. A probe card is used to inspect the state inside the wafer chip by directly contacting the defects on the individual wafer chips before dicing the wafer chip.

The first probe card was a probe card (epoxy type probe card) manufactured by molding an epoxy resin in a needle formed of tungsten and used in contact with a tester.

However, such an epoxy-type probe card is manufactured by hand, it is difficult to ensure the accuracy, there is a disadvantage that the required precision decreases as the degree of integration increases. In addition, since the tungsten probe deeply penetrates and contacts the aluminum pad which is the signal line of the wafer chip, there is a problem that deformation of the aluminum pad occurs.

In order to solve the shortcomings of the epoxy type probe card, instead of the tungsten probe, the MEMS type probe card was developed and applied in the MEMS process. . In this type of probe card, a probe is generally formed on a substrate, which substrate is selected from a plastic or ceramic based material, and an interposer is used for electrical connection between the substrate and the main board of the probe card. Such interposers are manufactured in various ways according to the design and structure of the card, and two of the following two types are generally applied.

One example is the use of anisotropic conductive rubber to form an electrical path including conductive particles or wires in order to increase conductivity in the upper and lower contact areas of the rubber. In order to maintain, conductive particles must be densely formed, must be contacted at high pressure, and creep phenomenon can cause problems in contact reliability when continuously loaded at an elevated temperature.

Another example is the application of a spring-type contact sheet, which uses a sheet to control the inherent elasticity of the sheet to form a contact, enabling electrical connection at low pressures, and by adjusting the size of the contact, the degree of deformation and settling pressure. Adjustable type, reliable type for mass production, but limited to disposing contactor by forming contactor on one large metal sheet, limiting contact height, limiting material selection and changing spring during use There are disadvantages such as flexibility problems may occur.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems according to the prior art, and an object of the present invention is to allow a plurality of pins interconnecting two substrates to be aligned at a fine pitch to enable electrical connection.

Another object of the present invention is to provide a technique for easily connecting a plurality of pins without limiting the size and shape of the substrate to be connected.

It is still another object of the present invention to provide a technique capable of maintaining a stable electrical connection even with thermal, structurally deformed boards.

It is yet another object of the present invention to provide a technique that can be implemented at low cost through a simplified design and assembly method of a high cost substrate connection method.

In order to achieve the above object, the connector connecting pin according to the embodiment of the present invention is a connecting pin applied to the connector for electrically connecting the main board and the sub-board of the probe card, the connecting pin is inserted into the main board The main board insertion end; A fixing part extending from the main board insertion end and inserted into a pin guide into which the connection pin is inserted and fixed; And a sub board insertion end extending from the fixing part and inserted into the sub board.

In the present invention, the fixing portion is elliptical in shape, a needle hole through which the center can be formed.

In the present invention, an outer diameter of the needle hole may be larger than a diameter of the main board insertion end and the sub board insertion end.

In the present invention, the connecting pin may be formed by etching of the beryllium copper plate.

In the present invention, the connecting pin may be formed of any one material of stainless steel, molybdenum, tungsten, nickel alloy and amorphous alloy material.

In the present invention, the connection pin may be manufactured by MEMS or electro-forming process.

In order to achieve the above object, the pin-shaped connector according to the embodiment of the present invention is characterized in that it comprises the connecting pin for the connector described above to electrically connect the main board and the sub board.

In the present invention, a sub-substrate having a substrate side through hole corresponding to the diameter of the sub-substrate insertion end so that the sub-substrate insertion end of the connection pin is inserted; And a pin guide having a guide side through hole corresponding to the outer diameter of the needle hole formed in the fixing part so that the fixing part of the connection pin is inserted and fixed.

In the present invention, the end of the sub-substrate insertion end is passed through the substrate side through-holes and soldered in a state coinciding with the outer surface, and the needle hole is coupled in a state where it is located in the guide-side through-hole, the main The board insertion end may be inserted into the needle hole of the main board.

According to the present invention, the main board and the sub board can be electrically connected by a connecting pin consisting of a main board insertion end inserted into the main board, a fixing part inserted into the pin guide, and a sub board insertion end inserted into the sub board. It will provide a connection pin for the connector.

In addition, according to the present invention, the fixing portion of the connecting pin is formed in an oval shape, a needle hole is formed in the center thereof, the needle hole of the connecting pin is not only a spring action due to elasticity but also acts as an anchor to the deformation of the board It is possible to maintain strong bonds that are difficult to break off, providing a technology for performing a stable electrical connection.

In particular, the outer diameter of the needle hole is larger than the diameter of the main board insertion end and the sub board insertion end, making it more difficult to depart from deformation of the board, making it more stable. It is aligned to allow the interconnection of the substrate without the separate alignment of the pins due to the combination of the multi-pin.

 In addition, since the connection pin is used, it is possible to cope with the connection between the substrate having the fine pattern formed by tight signal pad pitch and compliance, that is, the small pitch of the substrate, and thus it can be applied to the shape and position of the flexible substrate. .

In particular, when the connecting pin is connected, no external pressure (contact pressure) is required to maintain conductivity, and since the connecting pin is used, it can be combined and separated, and selection pin replacement and recycling can also be considered.

Further, according to the present invention, the connecting pin is formed by the etching of the beryllium copper plate, the elasticity is high, and a large number of pins can be formed through the etching operation to simply insert and use, so that the manufacturing process is simple and the manufacturing cost is high. There is an inexpensive advantage.

In addition, the connecting pin material may be formed of any one of stainless steel, molybdenum, tungsten, nickel alloys and amorphous alloys, and may be manufactured by MEMS or electro-forming. A variety of materials can be used to make suitable connecting pins.

In the following, embodiments of the present invention are described with reference to the accompanying drawings.

In the following description of the present invention, if it is determined that detailed descriptions of related known functions or configurations may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, the terms to be described later are terms set in consideration of functions in the present invention, and these terms may vary according to the intention or custom of the producer producing the product, and the definition of the terms should be made based on the contents throughout the present specification.

(Example)

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

1 is a perspective view of a pin-shaped connector according to an embodiment of the present invention, Figure 2 is a side view of a pin-shaped connector according to an embodiment of the present invention.

First, the pin-type connector 100 according to an embodiment of the present invention with reference to the accompanying drawings, the main board 140 and the sub-substrate 110 of the probe card, the connecting pin (electrical connection between the boards) ( 120 and pin guide 130.

The connecting pin 120 is formed in a needle shape as a whole, and is preferably manufactured by etching a high elastic beryllium copper plate. However, the present invention is not particularly limited thereto, and the material of the connecting pin may be any one of stainless steel, molybdenum, tungsten, nickel alloy and amorphous alloy material.

In addition, the manufacturing method of the connecting pin may be manufactured by MEMS or electro-forming process.

The connecting pin 120 has a main board insertion end 122 at an upper portion thereof, and a sub board insertion end 124 at a lower portion thereof, and a fixing part 126 is inserted between the pins 120 and fixed to the pin guide.

The fixing part 126 is formed with a needle hole 128 through the center. Here, the outer diameter of the needle hole 128 is preferably larger than the diameter of the sub-substrate insertion end 124 and the main substrate insertion end 122.

When the needle hole 128 is inserted into the pin guide 130, the main board insertion end 122 naturally points to the center to help the alignment work, and the needle hole 128 acts as an elastic member by itself. It helps to make stable electrical connection even in vibration, shock and board deformation.

Sub-substrate 110 is formed with a substrate-side through hole 112 corresponding to the diameter of the main substrate insertion end 122.

The pin guide 130 has guide side through holes 132 corresponding to outer diameters of the needle holes 128.

The pin-shaped connector 100 having such a configuration allows the end of the sub-board insertion end 124 to pass through the board-side through-hole 112 and solder in a state where the jig coincides with the external surface through the jig, and fixes the fixing part 126. It is located in the guide side through-hole 132.

The state at this time is shown in FIG.

3 shows a state of use of the pin-shaped connector according to the embodiment of the present invention.

Here, since the connection pin 120 is aligned by the sub board and the pin guide 130, it can be easily inserted into the needle hole 142 of the main board without any additional alignment work.

In the state coupled to the through-hole of the guide, the main board insertion end 122 is located in the needle hole of the main board 140, and then the surface of the sub board is pressed and inserted.

Here, the sub-substrate insertion end 124 may be connected to the sub-substrate 110 by inserting the fixing part and the guide in the same way as the main substrate insertion end, in addition to the method of fixing the solder to the sub-substrate 110.

The embodiments of the present invention have been described above with reference to the accompanying drawings.

However, it is to be noted that the present invention is not particularly limited only to the above-described embodiments, and as necessary, various modifications and changes can be made by those skilled in the art within the spirit and spirit of the appended claims.

1 is a perspective view of a pin-shaped connector according to an embodiment of the present invention.

2 is a side view of a pin-shaped connector according to an embodiment of the present invention.

3 shows a state of use of the pin-shaped connector according to the embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: connector connecting pin 110: sub-board

120: connecting pin 130: pin guide

140: main substrate

Claims (9)

A connecting pin applied to a connector for electrically connecting the main board and the sub board of the probe card. The connecting pin may include a main board insertion end inserted into the main board; A fixing part extending from the main board insertion end and inserted into a pin guide into which the connection pin is inserted and fixed; And a sub board insertion end extending from the fixing part and inserted into the sub board. The connector pin of claim 1, wherein the fixing part has an elliptical shape and a needle hole penetrating the center thereof is formed. The connector pin of claim 2, wherein an outer diameter of the needle hole is larger than a diameter of the main board insertion end and the sub board insertion end. The connecting pin according to claim 3, wherein the connecting pin is formed by etching a beryllium copper plate. The connector pin according to claim 3, wherein the connection pin is formed of any one material of stainless steel, molybdenum, tungsten, nickel alloy and amorphous alloy material. The connecting pin of claim 3, wherein the connecting pin is manufactured by a MEMS or electro-forming process. The pin-type connector, characterized in that for electrically connecting the main board and the sub-substrate including the connector pins according to any one of claims 1 to 6. The method of claim 7, further comprising: a sub-substrate having a substrate side through hole corresponding to a diameter of the sub-substrate insertion end to insert the sub-substrate insertion end of the connection pin; And And a pin guide having a guide side through hole corresponding to the outer diameter of the needle hole formed in the fixing portion to insert and fix the fixing portion of the connection pin. The method of claim 8, wherein the end of the sub-substrate insertion end is passed through the substrate side through hole and soldered in a state coinciding with an external surface, and the needle hole is coupled in a state where it is positioned in the guide side through hole. And inserting the main board insertion end into the needle hole of the main board.

Images