KR101105655B1 - Contact for ic sockets - Google Patents

Abstract

PURPOSE: A contact is provided to eliminate separate heating processes for attachment or detachment between a socket and a circuit board, thereby preventing thermal fatigue from the circuit board and the socket. CONSTITUTION: A pair of fixing tips(5) is fixed to the upper side of a BGA(Ball Grid Array) ball. A pair of BGA ball contact portions(6) are expanded from the fixing tips. A pair of variable sides(7) are expanded from the BGA ball contact portions. A supporting member(100) is expanded from a lower rear side of the variable sides. A shock absorbing member(200) provides elasticity and supports electrical connection with a circuit board.

Description

CONTACT FOR IC SOCKETS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact of a type that fits a BGA ball, and more particularly, to a contact that does not require soldering in coupling a socket to a circuit board (PCB).

Soldering is an emerging technology in the circuit and mechanical fields.

Such soldering is an essential technique for interconnection between circuit boards or for interconnection between sockets and circuit boards.

However, due to the recent damage caused by lead, the US eliminated lead solders in 2004 and Europe in 2008.

According to this global trend, a number of technologies for Pb-free soldering are currently being developed and commercialized, and Sn-Ag-Cu system is mainly used for commercially available Pb-free soldering.

However, this lead-free soldering is more expensive than lead soldering.

Lead-free soldering also requires a relatively high melting point, which can damage the socket or the circuit board itself when the socket is joined to the circuit board or when the socket is removed from the board after soldering.

In addition, compared to the flexible solder, the lead-free solder has a low adhesiveness, which may cause problems such as lift off of the solder and the substrate and problems with whiskers.

In addition, since the expensive soldering device is required for the soldering, the overall manufacturing cost is inevitably increased.

In order to solve this problem, a number of applications have been filed and registered to enable the connection between circuit boards without soldering.

Prior art 'connector pin and tubular connector (Korean Patent No. 0912467)' also has a technical feature that does not require soldering between the circuit boards.

Specifically, the related art is a connecting pin applied to a connector for electrically connecting the main board and the sub board, wherein the connecting pin includes a main board insertion end inserted into the main board; A fixing part extending from the main board insertion end and inserted into a pin guide into which the connection pin is inserted and fixed; And a sub board insertion end extending from the fixing part and inserted into the sub board.

However, these prior arts have the following problems.

According to the related art, since the upper side of the fixing part is relatively thin in the connecting pin inserted into the main board, a bending phenomenon may occur due to the compressive stress when the fixing part of the connecting pin is inserted into the main board.

In addition, when an impact is applied to the circuit, contact failure may occur due to the bending of the upper part of the fixing part.

In addition, there may be a bad contact or non-contact depending on the outer diameter of the needle hole of the connecting pin and the size of the insertion end.

Therefore, due to such a problem, the related art is not only usable as a probe card for inspecting a state of a circuit board, but also has a problem as a connector for permanent fastening of a circuit board and a socket.

An object of the present invention for solving the problem according to the prior art,

In a contact type that fits a BGA ball, the socket includes a buffer member and a support member in the tail portion of the contact to provide a complete electrical connection between the socket and the circuit board without soldering. It provides a contact that can be compression bonded without soldering.

In order to solve the above technical problem, the present invention provides a contact type for inserting a V-A-ball, a pair of fixing tips fixed to the upper side of the V-A-B when fastening with the V-A-ball; A pair of rat-eye ball contact portions extending from the pair of fixing tips and having a brace shape to surround the rat-ball; A pair of variable sides formed to extend from the pair of mice in contact with the ball; A support member extending on the pair of lower sides of the variable sides; And a cushioning member engaged with the supporting member to provide an elastic force and electrical connection with the circuit board. Characterized in that it comprises a.

Preferably, the support member is the upper portion is integrally connected with the lower back of the pair of the variable side, the stop portion is fastened to the buffer member to secure the pair of variable sides and the buffer member; And a fastening ring extending from the lower side of the fixing plate to fix the buffer member. Characterized in that it comprises a.

More preferably, the shock absorbing member is fastened to the stop portion of the fixed plate and provides an elastic force in the compression coupling of the socket and the circuit board; And a substrate contact portion extending below the buffer portion to enable electrical connection between the socket and the circuit board. It characterized in that it comprises a integral.

Also more preferably, the buffer portion is characterized by having a zigzag shape.

Also more preferably, the buffer portion is characterized in that it has a spring shape.

Further preferably, the substrate contact portion has a rectangular buffer hole in the center, and when the compression coupling with the circuit board, the fastening ring can move up and down inside the buffer hole.

Further preferably, the substrate contact portion has a pin shape having a conical shape having a diameter larger than that of a truncated cone or a circuit board at the lowermost side.

And more preferably, the fixing plate is bent in the direction of the substrate contact portion from the upper side of the fastening ring is characterized in that the contact with the substrate contact portion.

On the other hand in the contact of the type to fit this ball in the rat rat A pair of fixing tips fixed to the upper side of the rat rat ball when fastened with the rat rat ball; A pair of rat-eye ball contact portions extending from the pair of fixing tips and having a brace shape to surround the rat-ball; A pair of variable sides formed to extend from the pair of mice in contact with the ball; A support member including a fixed plate extending from the lower rear surface of the pair of variable sides to fix the pair of variable sides, and a contact pin extending from the fixed plate to enable electrical connection between the socket and the circuit board; And a spring shape longer than the contact pin, the buffer member being inserted into the contact pin to provide an elastic force. Characterized in that it comprises a.

Preferably, the contact pin has a conical shape larger than the diameter of the through hole of the truncated cone or the circuit board at the lowermost side.

Also preferably, the buffer member is composed of two or more springs, characterized in that it comprises a cylindrical guide between each spring to prevent twisting of each spring when the compression coupling to the circuit board.

In addition, the buffer member is characterized in that consisting of an insulating material having elasticity.

And preferably, the buffer member is characterized in that attached to the contact pin.

As described above, the present invention includes a shock absorbing member that provides an elastic force when the socket and the circuit board are coupled. Due to this technical feature, the present invention does not require soldering when the socket and the circuit board are coupled.

Therefore, when the socket and the circuit board is bonded or detached, there is no need for a separate heat treatment, thereby reducing the thermal fatigue of the circuit board or the socket.

It also enables quick coupling or detachment of circuit boards and sockets.

In addition, since the through-hole for soldering to the circuit board is unnecessary, the cost of manufacturing the circuit board is reduced.

And since there is no need for a separate soldering device, the overall manufacturing cost of the product can be reduced.

1 is a front view according to an embodiment of the inventors contact.
2 is a side view of the contact shown in FIG. 1;
3 is a side view according to a modified embodiment of the contact shown in FIG.
Figure 4 is a front view according to another embodiment of the present invention contact.
5 is a coupled state diagram of the contact shown in FIG. 4.
6 is a state diagram of use of a contact according to the embodiment of FIG. 1 in a circuit board without a through hole;
7 is an enlarged partial view of a contact according to a variant embodiment of FIG. 4 in a circuit board with a through hole;

Ball Grid Array (BGA) is an aspect of the IC package shape, which is an innovative improvement in the size and thickness of the IC by arranging the terminals, or balls, of the IC over the entire bottom surface of the IC.

The present invention relates to a contact of the type to fit this ball in the rat, comprising a pair of fixed tip, a pair of rat aey ball contact, a pair of variable sides, a support member and a buffer member.

Hereinafter, the configuration, operation and effects will be described in detail with reference to the drawings.

Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only one of the most preferred embodiments of the present invention, and do not represent all of the technical idea of the present invention, they can be replaced at the time of the present application It should be understood that there may be various equivalents and variations.

A contact according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2 as follows.

1 and 2, FIG. 1 is a front view according to an embodiment of the present invention, and FIG. 2 is a side view of FIG. 1.

1 and 2, which is an embodiment of the present invention, the present invention is largely a pair of fixed tip 5, a pair of VAZA ball contact portion 6, a pair of variable side 7, the support member 100 ) And the buffer member 200 is configured.

Specifically, the pair of fixing tips 5, a pair of V. A. ball contact portion 6, a pair of variable side 7 and the support member 100 is integrally formed.

The pair of fixing tips 5 are embodied in a mutually symmetrical shape, and both ends are bent inward to fix the socket and the contact to be firmly fixed to the upper side of the BZA ball when engaged with the BZA ball. Do this.

On the other hand, the pair of VAZA ball contact portion 6 is implemented in a mutually symmetrical shape, has a parenthesis shape.

This parenthesis shape performs a function of forming a good electrical connection between the socket and the circuit board by wrapping the BZA ball when the pair of BZA ball contacts 6 are engaged with the BZA ball.

On the other hand, the pair of fixed side (7) is implemented in a mutually symmetrical shape, when viewed from the side has a shape in which the lower portion connected to the support member 100 is gently thinned.

On the other hand, the support member 100 is configured to include a fixed plate 110 and a fastening ring 120 formed on the lower side of the fixed plate 110 integrally.

In addition, the upper portion of the fixing plate 110 is connected to the lower back of the pair of the variable side (7), the stop portion is fastened to the buffer portion 210a of the buffer member 200 to be described later the pair of It functions to support the variable side 7 and the buffer member 200.

And the fastening ring 120 is implemented in a ring shape on the lowermost portion of the fixing plate 110 is fastened to the upper end of the buffer hole 300 formed in the substrate contact portion 220 to be described later has a fluid up and down.

On the other hand, the buffer member 200 is configured to include a zigzag-type buffer portion 210a and a substrate contact portion 220 to provide an elastic force during compression coupling of the socket and the circuit board.

The shock absorbing portion 210a is illustrated in a zigzag shape, but the present invention is not limited thereto, and thus the shock absorbing portion 210a may be embodied as a spring shape 210b, and it is obvious that a material having elasticity is used.

In addition, the zigzag-type shock absorbing portion (210a) may be fastened to one side of the middle portion of the fixing plate 110, except for a fastening portion with the fixing plate 110 and a slight distance from the fixing plate 110. I put it.

This interval is for the contact of the present invention to facilitate the buffering action.

On the other hand, the substrate contact portion 220 is integrally connected to the lower end of the zigzag-type buffer portion (210a), the buffer hole 300 is drilled in the center, a small pin on one side of the lower side to be in contact with the circuit board It is configured including the shape.

However, in the drawing, the pin shape of the substrate contact portion 220 is formed at one side of the lower side of the substrate contact portion, but may also be formed in the center, and may have a conical shape inclined to one side, but may be implemented in a cone shape or the like.

Meanwhile, the buffer hole 300 has a rectangular shape, and the fastening ring 120 is fastened to the upper end of the buffer hole 300 so that the socket and the circuit board are compressed up and down of the buffer hole 300. Move and adjust the buffer range.

A contact according to a modified embodiment of the present invention will be described with reference to FIG. 3.

3 is a side view according to a modified embodiment of the present inventors contact illustrated in FIGS. 1 and 2.

The contact shown in FIG. 3 has no difference in configuration from the contact of FIGS. 1 and 2, but there is a difference in that the shape of the fixing plate 110 of the support member 100 is deformed.

Specifically, referring to FIG. 3, the fixing plate 110 is bent in the direction of the substrate contact portion 220 from the upper side of the fastening ring 120 to contact the substrate contact portion 220.

This shape allows for faster electrical communication between the circuit board and the socket.

In addition, such a shape may alleviate electrical problems that may occur in the zigzag-type shock absorbing part 210a, that is, problems such as winding resistance and electromagnetic fields that may occur from a coil shape such as a spring or a zigzag shape.

A contact according to another embodiment of the present invention will be described with reference to FIGS. 4 and 5 as follows.

FIG. 4 is a front view according to another embodiment of the present invention, and FIG. 5 is a state diagram of the contact shown in FIG. 4.

4 and 5 is a contact according to another embodiment of the present invention is a pair of fixed tip (5), a pair of VijayA ball contact (6), a pair as shown in the contact configuration of Figure 1 and 2 The variable side 7, the support member 100 and the buffer member 200 is configured to include.

That is, although the technical concept is the same as that shown in FIGS. 1 and 2, there is a difference in the shape and structure of the support member 100 and the buffer member 200.

Specifically, the support member 100 has a different structure and shape than that of the contacts of FIGS. 1 and 2.

However, the support member 100 has a contact pin 130 extended to one side lower portion of the fixing plate 110 instead of the fastening ring 120 included in the contacts shown in FIGS. 1 and 2.

 4 and 5, the contact pin 130 is formed to have a cylindrical pin shape having the same thickness as the one variable side 7 and the lower side of the fixing plate 110, and the bottom is a truncated cone. It is shown as having a shape.

However, it is apparent that the shape of the contact pin 130 is not limited to the illustrated position and shape as in the substrate contact portion 220 described above with reference to FIGS. 1 and 2.

On the other hand, the buffer member 200 includes a buffer 210b implemented in a spring shape.

The shock absorbing portion 210b of FIGS. 4 and 5 is detachable and attachable differently from the shock absorbing portion 210a of FIG. 1 and may be fastened by being inserted into the contact pin 130.

In addition, the buffer member 200 is configured to have a longer length than the contact pin 130, so that the contact pin 130 is capable of buffering when the compression pin is coupled to the circuit board, one spring or two Can be configured by connecting the above spring.

When the shock absorbing portion 210b is formed of two or more springs, a cylindrical guide 230 may be included between both springs to prevent the socket from twisting when the socket is compressed to the circuit board.

On the other hand, if the buffer member 200 is made of an insulating material, the electrical path problem between the socket and the circuit board can be further improved.

The use state of the contact according to the embodiment of the present invention described above will be described with reference to FIGS. 1 and 6.

FIG. 6 is a state diagram illustrating a state in which a contact shown in FIG. 1 is coupled to a socket to which a contact shown in FIG. 1 is coupled in a circuit board without a through-hole.

As shown in Figure 1 and 6, the pair of fixing tip (5) is sandwiched in the ball B, the ball B ball contact (6) is wrapped around the ball B ball 1 socket And a good electrical connection with the circuit board 3.

Meanwhile, as shown, the socket 4 and the circuit board 3 may be compressed by fastening the screw 4. In this case, since the shock absorbing member 200 is compressed, the fastening ring 120 of the support member 100 is The buffer hole 300 is lowered from the upper side to the lower side.

Therefore, due to the cushioning function, the contact can maintain a good connection with the circuit board 3 by the appropriate elastic force of the buffer member 200.

Meanwhile, in the present embodiment, the screw 4 is used to compress the socket and the circuit board 3, but the compression means is not limited thereto.

In addition, since the lowermost side of the substrate contact portion 220 has a truncated cone shape, unlike the cone shape, since the contact portion is relatively wide, stable contact can be realized on a circuit board without a through hole.

On the other hand, the coupling of the contact and the circuit board 3 can lead to a suitable coupling point due to the lead guide (2).

In addition, although the embodiment illustrated in FIG. 6 implements the technical meaning of the present invention as a contact having the shape of FIG. 1, it is obvious that the embodiment may be implemented in the shape of the contact shown in FIGS. 4 and 5.

Due to the advantages of the present invention, since the circuit board 3 can realize the electrical connection between the socket and the circuit board 3 without the through hole, the manufacturing cost of the circuit board 3 is lowered.

The modified use state of the contact according to the embodiment of the present invention described above will be described with reference to FIG.

FIG. 7 is a partially enlarged view according to the modified embodiment of FIG. 6 in the circuit board 3 with through holes.

The method of compressing and coupling the contact of the present invention to the circuit board 3 is as described above in the description of FIG. 6, but the substrate contact part 220 has a conical shape for perfect coupling between the circuit board 3 having the through hole and the contact. There is a difference in the implementation.

In this case, the conical shape preferably has a larger diameter than the through hole for complete connection of the substrate contact portion 220 with the through hole.

Meanwhile, although the embodiment illustrated in FIG. 7 implements the technical meaning of the present invention as a contact having the shapes of FIGS. 1 and 2, it is obvious that the embodiment may be implemented in the shape of the contacts shown in FIGS. 4 and 5.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Various modifications and variations are possible within the scope of the appended claims.

1: BGA ball 2: Lead guide
3: circuit board 4: screw
5: Fixing Tip 6: VizA Ball Contact
7: variable side 100: support member
110: fixing plate 120: fastening ring
130: contact pin 200: buffer member
210a: zigzag shock absorber 210b: spring buffer
220: substrate contact portion 230: cylindrical guide
300: buffer hole

Claims (13)

In the contact of the type which fits this ball in a rat,
A pair of fixation tips fixed to the upper side of the visceral ball when engaged with the visceral ball;
A pair of rat-eye ball contact portions extending from the pair of fixing tips and having a brace shape to surround the rat-ball;
A pair of variable sides formed to extend from the pair of mice in contact with the ball;
A support member extending on the pair of lower sides of the variable sides; And
A cushioning member engaged with the support member to provide an elastic force and electrical connection with the circuit board; A contact comprising a.
The method of claim 1,
The support member,
An upper portion is integrally connected with the lower rear surface of the pair of variable sides, and the stop portion is fastened to the buffer member to fix the pair of variable sides and the buffer member; And
A fastening ring extending from the lower side of the fixing plate to fix the buffer member; A contact comprising a.
The method of claim 2,
The buffer member,
A buffer unit which is fastened to the stop portion of the fixing plate and provides an elastic force during compression coupling of the socket and the circuit board; And
A substrate contact portion extending below the buffer portion to enable electrical connection between the socket and the circuit board; The contact, characterized in that it comprises integrally.
The method of claim 3,
The buffer part,
A contact characterized by having a zigzag shape.
The method of claim 3,
The buffer part,
A contact, characterized by having a spring shape.
The method of claim 3,
The substrate contact portion,
It has a rectangular buffer hole in the center, when the compression coupling with the circuit board, characterized in that the fastening ring moves up and down inside the buffer hole.
The method of claim 3,
The substrate contact portion,
The lower side is formed to be inclined contact with the upper portion of the circuit board.
The method of claim 2,
The fixing plate,
The contact is bent in the direction of the substrate contact portion from the upper side of the fastening ring contact with the substrate contact portion.
In the contact of the type which fits this ball in a rat,
A pair of fixation tips fixed to the upper side of the visceral ball when engaged with the visceral ball;
A pair of rat-eye ball contact portions extending from the pair of fixing tips and having a brace shape to surround the rat-ball;
A pair of variable sides formed to extend from the pair of mice in contact with the ball;
A support member including a fixed plate extending from the lower rear surface of the pair of variable sides to fix the pair of variable sides, and a contact pin extending from the fixed plate to enable electrical connection between the socket and the circuit board; And
A buffer member having a spring shape longer than that of the contact pin, the buffer member being inserted into the contact pin to provide an elastic force; A contact comprising a.
10. The method of claim 9,
The contact pin,
And the inclined surface is in contact with the opening of the through hole formed in the circuit board.
10. The method of claim 9,
The buffer member,
The contact is composed of two or more springs, comprising a cylindrical guide between each spring to prevent the twist of each spring when the compression coupling to the circuit board.
10. The method of claim 9,
The buffer member,
A contact, characterized in that composed of an insulating material having elasticity.
10. The method of claim 9,
The buffer member,
A contactor, characterized in that attached to the contact pin.

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