JP2008077988A - Contact terminal and socket for semiconductor device equipped with it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact terminal in which a correct contact force can be obtained without increasing a manufacturing cost even when the position along the extension direction of a movable contact part in a contact portion fluctuates in a prescribed range. <P>SOLUTION: The angle α of a contact end 16e in the contact parts 16a, 16b of a contact terminal 16ai is established in a range 5° or more and 20° or less when the contact length is made 0.4 mm. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a contact terminal having a pair of movable pieces and a semiconductor device socket including the contact terminal.

  In a semiconductor device such as an integrated circuit or a bare chip provided with various semiconductor packages mounted on an electronic device or the like, the potential defects are removed by performing various tests before the mounting. A socket for a semiconductor device used for such a test is generally called an IC socket, and is supplied with a predetermined test signal and sends an abnormality detection signal indicating a short circuit from a semiconductor device as an object to be inspected. It is arranged on a test board or burn-in board as a printed wiring board having an input / output unit.

  For example, as disclosed in Patent Documents 1 to 3, the semiconductor device socket includes a plurality of contact terminals that electrically connect the terminals of the semiconductor device and the electrode portions of the printed wiring board described above. For example, in a form in which a semiconductor device is built in a BGA (Ball Grid Array) type package having a plurality of bumps (solder balls), for example, as shown in FIGS. Contact terminal 2 is used. In FIG. 9, a part of one contact terminal 2 of the plurality of contact terminals is shown.

  In FIG. 9A, the contact terminal 2 includes a soldering fixed terminal portion fixed to the socket body portion and a pair of movable contact portions 2A and 2B connected to the soldering fixed terminal portion. Each of the movable contact portions 2A and 2B having elasticity protrudes toward the bump 4B of the semiconductor device 4 mounted on the socket main body portion, and has one end of the hook-shaped contact portions 2a and 2b that selectively hold in cooperation. Have. As shown in FIGS. 9A and 9B, the portions of the contact portions 2a and 2b that contact the spherical surface of the bump 4B pass through the central axis passing through the position of the maximum outer diameter of the bump 4B, respectively. The semiconductor device 4 is arranged so as to be opposed to each other with a bump 4 </ b> B interposed on a common plane that is substantially parallel to the lower surface of the semiconductor device 4. At that time, the portions of the contact portions 2a and 2b that contact the spherical surface of the bump 4B face each other substantially in parallel.

In such a configuration, when attaching and detaching the semiconductor device 4, the movable contact portions 2A and 2B of the contact terminal 2 is away from the bump 4B of the semiconductor device 4. In this case, at least one of the movable contact portions 2A and 2B is moved away from each other by the movement of a pressing portion (not shown) of a movable plate provided in the socket main body portion. The pressing portion of the moving plate is disposed between the movable contact portions 2A and 2B and is moved in both directions along the direction indicated by the arrow M in FIG. On the other hand, when electrical connection is made to the bump 4B of the mounted semiconductor device 4, the movable contact portions 2A and 2B of the contact terminal 2 are brought close to the bump 4B of the semiconductor device 4. In this case, one of the above-mentioned spaced apart movable contacts is moved to the initial position with the movement of the pressing portion of the moving plate due to the elastic restoring force. As a result, as shown in FIG. 9A, the movable contact portions 2A and 2B cooperate to hold the bump 4B with a predetermined appropriate contact force.

Japanese Unexamined Patent Publication No. 2000-9752 JP 2003-297514 A JP 2000-311756 A

  In the socket for a semiconductor device including the contact terminal 2 as described above, the contact portions 2a and 2b of the movable contact portions 2A and 2B in the contact terminal 2 have a common central axis as shown in FIG. It is conceivable that they are arranged on the line and arranged in the direction indicated by the arrow due to a manufacturing error or the like as shown in FIG. That is, the contact portions 2a and 2b are arranged in a direction close to the fixed portion of the hem having a smaller diameter than the maximum diameter portion of the bump 4B of the semiconductor device 4 along the extending direction of the movable contact portions 2A and 2B. The Rukoto. In this case, the portions of the contact portions 2a and 2b that contact the spherical surface of the bump 4B sandwich the portion having a smaller diameter than the maximum diameter portion of the bump 4B. There is a risk of pinching with a contact force of less than that.

  On the other hand, considering the positional deviation along the extending direction of the movable contact portions 2A and 2B as described above, as shown in Patent Document 1, the contact portion of the movable contact portion extends in the extending direction of the movable contact portion. In order to securely hold the maximum diameter portion of all the bumps of the semiconductor device, a plurality of contact portions (protrusions) of one movable contact portion are required. There is a risk that the manufacturing cost increases.

  In consideration of the above problems, a contact terminal having a pair of movable pieces and a socket for a semiconductor device including the contact terminal, the position along the extending direction of the movable contact portion in the contact portion without increasing the manufacturing cost It is an object of the present invention to provide a contact terminal capable of obtaining an appropriate contact force even when there is a variation within a predetermined range, and a semiconductor device socket including the contact terminal.

  In order to achieve the above object, a contact terminal according to the present invention includes a pair of movable contact portions each having a contact end that selectively sandwiches a spherical terminal portion having a predetermined standoff height in a semiconductor device, A fixed terminal portion connected to the base end portions of the pair of movable contact portions, and the contact end is a standoff of the spherical terminal portion so as to hold the maximum diameter portion of the spherical terminal portion with a predetermined contact length. A gradient of 5 ° or more and 20 ° or less is formed with respect to a plane including a central axis extending through the maximum diameter portion in a direction orthogonal to the height direction.

    Further, a semiconductor device socket according to the present invention is a socket body portion provided with the above-described contact terminals, and a semiconductor device mounting portion on which the semiconductor device having a spherical terminal portion is detachably mounted. And a movable contact portion drive mechanism portion that is movably provided in the socket body portion and that operates to move at least one of the pair of movable contact portions of the contact terminal close to or away from the spherical terminal portion. Composed.

  As is apparent from the above description, according to the contact terminal and the socket for a semiconductor device including the contact terminal according to the present invention, the contact end sandwiches the maximum diameter portion of the spherical terminal portion with a predetermined contact length. The spherical terminal portion has a slope of 5 ° or more and 20 ° or less with respect to a plane including a central axis extending through the maximum diameter portion in a direction orthogonal to the standoff height direction. Thereby, even if the position along the extending direction of the movable contact portion in the contact portion varies within a predetermined range without increasing the manufacturing cost because the contact end sandwiches the maximum diameter portion of the spherical terminal portion. Appropriate contact force can be obtained.

  FIG. 4 shows the external appearance of a socket for a semiconductor device provided with an example of a contact terminal according to the present invention.

  In FIG. 4, a socket for a semiconductor device is fixed on a printed wiring board PB, and includes a socket main body portion 14 having a housing portion that detachably houses a semiconductor device 12 described later, and each terminal of the mounted semiconductor device 12. A pair of movable pieces of a contact terminal group CG that is electrically connected to each electrode portion of the printed wiring board PB and a contact terminal 16ai that will be described later and that is provided above the socket main body portion 14 so as to be movable up and down. And a cover member 10 that selectively abuts or separates the contact portion of the contact portion from the spherical surface of the bump of the semiconductor device 12.

  Two elongated grooves are formed on each side of the outer peripheral surface of the socket body 14 so as to be parallel to each other and substantially perpendicular to the surface of the printed wiring board PB. Respective claws of the cover member 10 described later are slidably engaged with the grooves. A step portion is formed at one end of each groove so that the tip of each claw portion is locked when the cover member 10 takes the uppermost position.

  As shown in FIG. 3, the socket main body portion 14 includes a substantially square positioning member 18 having a housing portion 18 </ b> A for housing the semiconductor device 12 to be used for the test in the center. The semiconductor device 12 is a substantially square semiconductor device having a BGA type or FBGA type package, for example.

  The positioning member 18 is supported by an inner base portion in the socket main body portion 14. The accommodating portion 18A of the positioning member 18 is formed by a flat surface portion on which the package of the semiconductor device 12 is placed, and side wall portions formed around the flat surface portion. The flat surface portion is formed substantially parallel to the surface of the printed wiring board PB below the flat surface portion. Positioning portions 18 a that engage with the four corners of the package of the mounted semiconductor device 12 are formed at the four corners inside each side wall portion. Therefore, each corner of the package of the semiconductor device 12 to be mounted is engaged with the positioning portion 18a, whereby the bump contact terminal is positioned with respect to the movable piece portion.

  The flat surface portion is formed with vertical and horizontal fine holes into which the contact portions of the pair of movable pieces of the contact terminals and the respective bumps described above are inserted.

  The positioning member 18 may be supported so as to be relatively movable with respect to the socket body 14.

  At a position directly below the positioning member 18 in the socket main body 14, the movable piece actuating member 20 is disposed on the socket main body 14 so as to be capable of reciprocating along the coordinate axis X in FIG. The coordinate axis X coincides with the arrangement direction of the contact terminals 16ai in each same column to be described later.

  The movable piece actuating member 20 is configured to selectively approach or separate one of the contact portions of the pair of movable piece portions of the contact terminal 16ai in conjunction with the up and down movement of the cover member 10. The movable piece actuating member 20 is moved through, for example, a link mechanism including a lever member provided in the socket body 14 or a cam mechanism formed in the cover member 10. The movable piece actuating member 20 has a plurality of elongated opening rows corresponding to the plurality of holes of the positioning member 18 described above. Each adjacent opening row is delimited by a partition along the arrangement direction. Further, in the same opening row, as shown in FIGS. 5A and 5B, as one of the pair of movable piece portions of the contact terminal is pushed and moved in accordance with the movement of the movable piece actuating member 20, the pressure is moved. It is delimited by the part 20ai (i = 1 to n, n is a positive integer). The pair of movable piece portions of the contact terminal are arranged to face each other with the pressing portion 20ai interposed therebetween. Thereby, the contact part of a pair of movable piece part each protrudes toward the hole of the upper positioning member 18 from the inside of an opening row | line | column.

  An opening 14bi (i = 1 to n, where n is a positive integer) into which the fixed portion of the contact terminal is press-fitted is printed on the portion of the socket body 14 that slidably supports the lower end of the movable piece actuating member 20. It is formed substantially perpendicular to the surface of the wiring board PB. Each opening 14bi is formed by being partitioned by a partition wall 14w.

  The cover member 10 has a substantially square opening 10a at the center thereof through which the semiconductor device 12 to be attached and detached passes. In addition, a coil spring (not shown) is provided between the cover member 10 and the socket body 14 as a biasing member that biases the cover member 10 in a direction away from the socket body 14.

  As shown in FIGS. 5A and 5B, the contact terminal 16ai made of a sheet metal material has a fixed portion 16K having a claw portion press-fitted into the opening 14bi, and one end side of the fixed portion 16K. The soldering terminal portion 16F extends and the movable piece portions 16A and 16B extend to the other end side of the fixed portion 16K.

  The movable pieces 16A and 16B that are elastically displaceable have contact portions 16a and 16b at their tips as shown in FIGS. 1A and 1B and FIG.

  The widths wa of the contact portions 16a and 16b are set smaller than the width on the base end side so as to be tapered. One end of the contact portion 16a is formed with an abutting end 16e that forms a predetermined angle α with respect to the coordinate axis Z orthogonal to the coordinate axis X and is inclined upward. When the contact length with respect to the spherical surface of the bump 12ai having the maximum diameter of 0.6 mm at the contact end 16e is 0.4 mm, the angle α of the contact end 16e is set in a range of 5 ° to 20 °, for example. Further, at one end of the contact portion 16b, a contact end 16e is formed which forms a predetermined angle α with respect to the coordinate axis Z orthogonal to the coordinate axis X and is inclined upward. When the contact length with respect to the spherical surface of the bump 12ai having the maximum diameter of 0.6 mm at the contact end 16e is 0.4 mm (the contact length is about 60% of the maximum diameter), the angle α of the contact end 16e is, for example, It is set in the range of 5 ° to 20 °. The contact length is the length along the contact end 16e of the scar formed on the spherical surface of the bump 12ai when the contact end 16e contacts and bites into the spherical surface of the bump 12ai.

  The reason why the angle α is set in the range of 5 ° to 20 ° is as follows.

  In order to obtain an appropriate contact pressure that ensures electrical connection at the contact end 16e of the contact portions 16a and 16b when the contact portions 16a and 16b of the movable piece portions 16A and 16B sandwich the bump 12ai, It is necessary that the contact end 16e abuts at a position where the maximum diameter of the spherical surface of the bump 12ai is obtained.

  At this time, the standoff height H2 of the bump 12ai of the semiconductor device 12 is standardized according to, for example, the distance between adjacent bumps 12ai and the maximum diameter of the bump 12ai, as shown in FIG. ing. Further, the predetermined allowable tolerance of the standoff height H2 is, for example, ± 0.05 mm when the maximum diameter is 0.6 mm.

  When the standoff height H2 is a predetermined value in a range within a predetermined allowable tolerance, when the semiconductor device 12 is placed at a predetermined position, the semiconductor device 12 is separated from the central axis passing through the maximum diameter of the bump 12ai. The distance H1 to the lower surface of the package is a constant value.

  On the other hand, the position of the contact end 16e in the contact portions 16a and 16b is, for example, ± 0.02 mm with respect to the reference dimension along the above-mentioned coordinate axis Y with respect to a predetermined regular position when manufacturing errors and the like are considered. Within acceptable tolerance range.

  In such a case, as shown in FIG. 8A, when the angle α of the contact end 16′e at which the contact length is set to 0.4 mm is zero, the contact end 16′e becomes the bump 12ai. When it lies on a plane including the central axis passing through the maximum diameter, an appropriate contact force can be obtained.

  However, if the position of the contact end 16′e is at a position shorter than the distance H1, or if the position of the contact end 16′e is longer than the distance H1, the contact end 16′e becomes the maximum of the bump 12ai. Since contact is made at a portion having a diameter smaller than the diameter, an appropriate contact force cannot be obtained. In addition, when the angle α of the contact end 16′e at which the contact length is 0.4 mm is 1 °, 3 °, and 4 °, the center axis line through which the contact end 16′e passes through the maximum diameter, respectively. A range Δh that can intersect with the plane to include is set to 0.01, 0.02, 0.03 mm along the coordinate axis Y described above. As described above, the position of the contact end 16e in the contact portions 16a and 16b is within a range of ± 0.02 mm along the coordinate axis Y with respect to a predetermined regular position, for example, when manufacturing errors are taken into account. As a result, there is a possibility that an appropriate contact force cannot be obtained. Therefore, as shown in FIG. 6A, the angle α is preferably 5 ° or more so that the above-described range Δh is 0.04 mm. For example, when the angle α is 10 ° and 15 °, the range Δh is 0.07 and 0.11 mm, respectively.

  When the contact edge 16e has an angle α of 20 ° and the contact length is 0.4 mm, the above range Δh is 0.15 mm as shown in FIG. Contact force can be obtained reliably. However, when the angle α of the contact end 16′e with a contact length of 0.4 mm exceeds 20 °, the contact end 16e is placed on the lower surface of the package of the semiconductor device 12 depending on the value of the standoff height H2. Since there is a possibility of interference, the angle α is preferably 20 ° or less.

  Therefore, as described above, the angle α of the contact end 16e having a contact length of 0.4 mm is set in a range of 5 ° to 20 °.

  In addition, when the above-mentioned standoff height H2 is, for example, a maximum diameter of 0.6 mm, a contact length of 0.4 mm is taken into consideration when it is considered that the standoff height H2 varies within a range of ± 0.005 mm The angle α of the end 16e is set in a range of 7.10 ° to 20 °.

  That is, as shown in FIG. 6E, the angle α is preferably 7.10 ° or more so that the above range Δh is 0.05 mm. The reason why the angle α of the contact end 16e having a contact length of 0.4 mm is set within a range of 20 ° or less is that the contact end 16e interferes with the lower surface of the package of the semiconductor device 12 as described above. It is because there is a possibility of doing.

  Further, in the case of the contact end 16e having a contact length of 0.20 mm (when the contact length is about 30% of the maximum diameter), the angle α is the maximum diameter of 0.6 mm in the semiconductor device 12 described above. The bumps 12ai are set to 5 ° or more and 50 ° or less. The angle α is set to 5 ° or more and 50 ° or less for the following reason.

  When the angle α is less than 5 °, as described above, the position of the contact end 16e in the contact portions 16a and 16b is, for example, on the above-described coordinate axis Y with respect to a predetermined regular position when manufacturing error is considered. This is because there is a possibility that an appropriate contact force may not be obtained because there is a possibility of variation within a range of ± 0.02 mm. On the other hand, when the angle α exceeds 50 °, the contact end 16e may interfere with the lower surface of the package of the semiconductor device 12 depending on the value of the standoff height H2, and therefore the angle α is preferably 50 ° or less. . For example, when the angle α is 35 °, 45 °, and 50 °, the ranges Δh are 0.100, 0.141, and 0.153 mm, respectively, so that an appropriate contact force can be reliably obtained. . Therefore, as described above, in the case of the contact end 16e having a contact length of 0.20 mm, the angle α is set to 5 ° or more and 50 ° or less.

  Therefore, in the above-described example, the contact terminal 16ai has an appropriate contact force with respect to the bump 12ai in the semiconductor device 12 even when the position along the extending direction of the contact end 16e varies within a predetermined range. Can be obtained.

  In such a configuration, when the cover member 10 is lowered to the predetermined lowermost position against the urging force of the coil spring, as shown by a two-dot chain line in FIG. As shown in FIG. 5A, the part 20ai is moved to the left via the above-described link mechanism or cam mechanism. Accordingly, one of the pair of movable pieces of the contact terminal is separated from the other movable piece.

  Next, after the semiconductor device 12 is placed in the accommodating portion 18A of the positioning member 18, the cover member 10 is moved from the lowermost position to the uppermost position by the biasing force of the coil spring when the pressing force is released. Can be raised. Thereby, as shown in FIG. 5B, the movable piece actuating member 20 and the pressing portion 20ai are moved rightward by the restoring force of the contact terminal and the urging force of the urging member (not shown). Therefore, one of the pair of movable pieces of the contact terminal is again brought close to the other movable piece. As a result, the bumps 12ai of the semiconductor device 12 attached to the accommodating portion 18A are electrically connected to the contact terminals.

  On the other hand, when the semiconductor device 12 is removed from the accommodating portion 18A of the positioning member 18, the movable piece actuating member 20 and the pressing portion are pressed by performing the pressing operation of the cover member 10 against the urging force of the coil spring. 20ai is moved in the same manner as described above.

  In the example described above, the contact ends 16e of the contact portions 16a and 16b in the contact terminal 16ai are inclined at a predetermined angle in the same direction. However, the present invention is not limited to such an example. For example, the contact portions 16a and 16b The abutting end 16e may be inclined at a predetermined angle in opposite directions. In such a case, not only with respect to the height direction of the socket body portion in the bump (the coordinate axis Y direction shown in FIG. 1A), but also in the width direction of the socket body portion (the coordinate axes shown in FIG. 1A). Positioning in the (Z direction) is also possible.

(A) is the side view which expands and shows the principal part of an example of the contact terminal which concerns on this invention partially with the bump of a semiconductor device, (B) is a front view of the example shown by (A) It is. It is a front view which expands and shows the principal part of an example of the contact terminal which concerns on this invention partially. It is a top view which shows an example of the socket for semiconductor devices which concerns on this invention. It is a front view in the example shown by FIG. (A) And (B) is a fragmentary sectional view with which it uses for operation | movement description in the example shown by FIG. 3, respectively. (A), (B), (C), (D), and (E) are diagrams used for explaining the setting of the angle of the contact end in the contact terminal shown in FIG. is there. (A), (B), and (C) are the figures which are provided for the description for the angle setting of the contact edge in the contact terminal shown by FIG. 1 (A), respectively. (A), (B), (C), and (D) are each a figure provided for explanation for setting the angle of the contact end in the contact terminal shown in FIG. 1 (A). (A) is a front view with which the positional relationship between the movable contact portion of the conventional contact terminal and the bumps of the semiconductor device is provided, and (B) is a plan view in the example shown in (A). . (A) is a front view with which the positional relationship between the movable contact portion of the conventional contact terminal and the bumps of the semiconductor device is provided, and (B) is a plan view in the example shown in (A). .

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Cover member 12 Semiconductor device 12ai Bump 14 Socket main-body part 16A, 16B Movable contact part 16ai Contact terminal 16e Contact end 20 Movable piece actuating member

Claims (4)

A pair of movable contact portions each having a contact end for selectively sandwiching a spherical terminal portion having a predetermined stand-off height in the semiconductor device;
A fixed terminal portion connected to the base end portion of the pair of movable contact portions,
The contact end extends through the maximum diameter portion in a direction perpendicular to the standoff height direction of the spherical terminal portion so as to sandwich the maximum diameter portion of the spherical terminal portion with a predetermined contact length. A contact terminal having a gradient of 5 ° to 20 ° with respect to a plane including a central axis. A pair of movable contact portions each having a contact end for selectively sandwiching a spherical terminal portion having a predetermined stand-off height in the semiconductor device;
A fixed terminal portion connected to the base end portion of the pair of movable contact portions,
The contact end has a central axis extending through the maximum diameter portion in a direction perpendicular to the standoff height direction of the spherical terminal portion so as to sandwich the maximum diameter portion of the spherical terminal portion with a predetermined contact length. A contact terminal having a slope of 5 ° or more and 50 ° or less with respect to a plane including. A socket body comprising the contact terminal according to claim 1;
A semiconductor device mounting portion provided in the socket body portion, on which a semiconductor device having a spherical terminal portion is detachably mounted;
A movable contact portion drive mechanism that is movably provided in the socket body, and that operates to move at least one of the pair of movable contact portions of the contact terminal close to or away from the spherical terminal portion;
A socket for a semiconductor device comprising: A socket body comprising the contact terminal according to claim 2;
A semiconductor device mounting portion provided in the socket body portion, on which a semiconductor device having a spherical terminal portion is detachably mounted;
A movable contact portion drive mechanism that is movably provided in the socket body, and that operates to move at least one of the pair of movable contact portions of the contact terminal close to or away from the spherical terminal portion;
A socket for a semiconductor device comprising:

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