JP2005300366A - Inspection device of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately measure to reduce an inductance value even when measuring high frequency characteristics by performing excellent connection with an inspection circuit substrate without eliminating damage to a head top part of a soldering ball electrode in a semiconductor device. <P>SOLUTION: An inspection device of the semiconductor device arranges and forms a plurality of electrode pads 21 by dealing with the soldering ball electrode 7 of the BGA semiconductor device 6 on one face of a substrate 20, and arranges an assembling means 22 on one face of the substrate 20. The inspection device through-forms insertion holes 23 at positions opposed to the electrode pads 21 in the assembling means 22 respectively, and radially forms storing grooves 24 on the circumference. A contact 25 is arranged in each storing groove 24 and is brought into contact with the electrode pads 21 at a position applied on the electrode pads by a part. An elastic body 26 is arranged in contact with the contacts 25 on one end of the storing grooves 24. Excellent contact can be obtained by sliding the contacts 25 on the electrode pads 21 and can be obtained for moving while rubbing the soldering ball electrode 7 and contacts 25. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a configuration of an inspection device for electrically connecting a semiconductor device and a measurement device for electrical inspection in a measurement device for performing electrical characteristic inspection of a semiconductor device, and particularly to a connection electrode. The present invention relates to an inspection apparatus for a semiconductor device provided with solder ball electrodes.

  In recent years, inspection of electrical characteristics of semiconductor devices having solder ball electrodes such as BGA (Ball Grid Array) and CSP (Chip Size Package) and semiconductor devices having lead electrodes such as QFP (Quad Flat Package) as connection electrodes has been conducted. To do this, generally, an inspection device is used to electrically connect the semiconductor device and the inspection circuit board of the measuring device.

  As one of the inspection apparatuses, there is an inspection apparatus using a pogo pin (spring built-in contact pin) type contact pin shown in FIG. FIG. 6 is a cross-sectional view showing the shape of an inspection apparatus using a pogo pin type contact pin. The pogo pin type contact pin 1 is provided with a coiled compression spring 3, an upper plunger 4 and a lower plunger 5 inside a cylindrical body 2, and the tip of each plunger protrudes from the cylindrical body 2 so as to expand and contract outward. Then, the upper plunger 4 is pressed against the solder ball electrode 7 of the BGA semiconductor device 6 by expansion and contraction of the compression spring 3, so that the solder ball electrode 7 passes through the upper and lower plungers and the cylindrical body 2 and the land electrode of the test circuit board 8 of the measuring device. 9 is electrically connected.

  As another configuration of the inspection apparatus, there is an inspection apparatus using a leaf spring type contact pin shown in FIG. FIG. 7 is a cross-sectional view schematically showing a configuration of an inspection apparatus using a leaf spring type contact pin. The leaf spring type contact pin 10 is fixed to the electrode pattern 11 of the inspection circuit board 8 of the measuring apparatus by solder 12 or the like, and the leaf spring is brought into contact with the contact portion 13 by pressing the lead electrode 15 of the QFP semiconductor device 14. The lead electrode 15 is electrically connected to the electrode pattern 11 of the inspection circuit board 8 of the inspection apparatus through the leaf spring contact pin 10 due to the elasticity of the curved portion 16 formed on the method contact pin 10.

  Further, as another configuration of the inspection apparatus, there is one using a plate-shaped contact pin formed in a J-shape. FIG. 8 is a cross-sectional view schematically showing the configuration of an inspection apparatus using J-shaped contact pins. In the inspection apparatus using the J-shaped contact pin 17, a plate-shaped contact pin formed in a J-shape is disposed sideways, and the arc-shaped inner central portion is pressed by a rod-shaped electrically insulating elastic material 18. When the lead electrode 15 of the QFP semiconductor device 14 is pressed against the tip portion 19 of the J-shaped contact pin 17, the J-shaped contact pin 17 is elastically deformed so that the radius of curvature of the J-shaped contact pin 17 is increased, and the elastic material 18 is compressed and deformed. By elastically deforming in this way, the tip portion 19 of the J-shaped contact pin 17 is displaced and brought into contact with the lead electrode 15 of the QFP semiconductor device 14 so as to rub, thereby allowing the inspection device to pass through the J-shaped contact pin 17. It is electrically connected to the electrode pattern 11 of the inspection circuit board 8.

  The inspection apparatus used as described above is required to have electrical performance corresponding to the high speed, that is, low inductance, with the progress of the high speed of the semiconductor device.

Further, in an inspection apparatus that inspects a semiconductor device having a solder ball electrode such as BGA or CSP as a connection electrode, the solder ball electrode of the semiconductor device is electrically connected to the wiring of the substrate correctly when mounted on the substrate. It is also required that the solder ball electrode is not damaged by the contact.
JP 2001-208793 A Japanese Patent Laid-Open No. 10-270140 Japanese Patent Laid-Open No. 11-162605

  However, when the inspection apparatus using the contact pin having the above-described configuration is used for the electrical characteristic inspection, there are the following problems.

  First, in the inspection apparatus using the pogo pin type contact pin shown in FIG. 6, the total length of the contact pin is determined by the total length of the three parts of the compression spring 3, the upper plunger 4 and the lower plunger 5 constituting the contact pin. Because the total length of the contact pin is relatively long, the contact pin has a large inductance component, the frequency characteristic is deteriorated, and it is difficult to accurately inspect the high frequency characteristic. Further shortening has physical limitations.

  In the inspection apparatus using the leaf spring type contact pin shown in FIG. 7, the distance from the contact portion 13 of the QFP semiconductor device 14 with the lead electrode 15 to the inspection circuit board 8 of the inspection apparatus becomes long. Increases the inductance component, resulting in poor frequency characteristics.

  Further, in the inspection apparatus using the J-shaped contact pin shown in FIG. 8, the tip portion 19 of the contact pin is displaced so that the lead electrode 15 of the QFP semiconductor device 14 is rubbed in the horizontal direction. When used for inspection of a semiconductor device having a solder ball electrode 7 on a connection electrode such as a CSP, the tip 19 of the contact pin rubs and contacts the top of the solder ball electrode, and the top of the solder ball electrode is damaged and soldered. The height dimension differs for each ball electrode.

  The present invention is directed to solving the problems of the prior art, and with a relatively simple configuration, the test circuit board is placed on the top of the solder ball electrode via the solder ball electrode of the semiconductor device and the test device. In addition to being able to eliminate damage and make a good connection, it is possible to reduce the inductance value even when measuring the high frequency characteristics by simplifying the configuration, so that it is possible to accurately measure the high frequency characteristics of the semiconductor device and solder the semiconductor device It is an object of the present invention to provide a semiconductor device inspection apparatus capable of preventing damage to a ball electrode due to a contact.

  To achieve this object, an inspection apparatus for a semiconductor device according to the present invention is an inspection apparatus for a semiconductor device that connects an inspection circuit board of a semiconductor measurement device and a solder ball electrode of the semiconductor device so as to cause electrical continuity. A substrate on which a plurality of electrode pads are arranged corresponding to the arrangement of the solder ball electrodes of the semiconductor device, and an insertion hole into which the solder ball electrodes can be inserted at positions facing the electrode pads arranged on the substrate, Electrically insulating assembly means in which a housing groove is formed on the outer periphery of the insertion hole, a contact that is movably disposed in the housing groove and is in contact with the electrode pad, and an elastic body made of an elastic material corresponding to the contact The solder ball electrode and the electrode pad are electrically connected through the contact, and the contact is arranged in parallel and slidable with respect to the substrate.

  Furthermore, a plurality of contacts are arranged radially on the outer periphery of the insertion hole of the inspection device for one of the solder ball electrodes.

  According to the above configuration, the height of the contact can be reduced due to the configuration in which the contact is slid in parallel with the substrate, the high frequency characteristics of the semiconductor device can be accurately measured, and the elastic body portion can be deformed. The solder ball electrode of the semiconductor device can be satisfactorily connected with the pressing force due to the contact, and since the contact does not contact the top of the solder ball electrode, damage to the top of the head can be prevented. Since the contact area between the child and the solder ball electrode of the semiconductor device increases, the contact can be stabilized and the inspection can be performed more accurately.

  As described above, according to the present invention, the solder ball electrode of the semiconductor device and the inspection circuit board of the inspection device can be connected with a relatively simple configuration without damaging the top of the solder ball electrode. In addition, the inductance value can be reduced when measuring the high frequency characteristics, and the high frequency characteristics of the semiconductor device can be accurately measured.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1A is a cross-sectional view and FIG. 1B is a top view showing the main part of an inspection apparatus according to Embodiment 1 of the present invention. Here, components having the same functions corresponding to the components described in FIG. 6 showing the conventional example are denoted by the same reference numerals.

  As shown in FIG. 1, in the first embodiment, a plurality of electrode pads 21 corresponding to the solder ball electrodes 7 of the BGA semiconductor device 6 are arrayed on one surface of the substrate 20 and assembled on one surface of the substrate 20. A means 22 is arranged. In the assembling means 22, through holes 23 are formed penetratingly at positions facing the gold-plated electrode pads 21 of the substrate 20, and receiving grooves 24 are formed radially on the circumference thereof.

  As shown in FIG. 1A, contacts 25 are arranged in the respective housing grooves 24, and these contacts 25 are positioned so as to partially cover the electrode pads 21 and are in contact with the electrode pads 21. Yes. Further, an elastic body portion 26 is disposed at one end of the housing groove 24 away from the insertion hole 23 so as to contact the contact 25. In this example, as shown in FIG. 1B, one contact 25 is arranged in each insertion hole 23.

  For example, copper or a copper alloy is used for the contact 25. The surface is first nickel-plated and then gold-plated to cover it. The elastic body portion 26 has a spherical or cylindrical shape, and silicon rubber or the like is used as the material thereof.

  FIG. 2 is a perspective view showing an overall schematic configuration of the inspection apparatus 27 having the above-described contact configuration. The assembly means 22 that accommodates and holds the contact is fixed to the substrate 20 by screws 29. The substrate 20 is formed of a multilayer printed wiring board, and the terminal electrodes 28 led out from the electrode pads 21 located under the respective insertion holes 23 of the assembling means 22 via the wiring patterns (not shown) form a square shape. An array is formed along each of the 20 sides.

  Next, a state in which the BGA semiconductor device 6 is loaded and the solder ball electrode 7 is electrically connected to the inspection device 27 having such a configuration will be described with reference to FIG.

  When the BGA semiconductor device 6 positioned on the inspection device 27 is lowered, each solder ball electrode 7 enters the insertion hole 23 as shown in FIG. 3A, and when the BGA semiconductor device 6 is further pressed from above, The contact 25 in contact with the solder ball electrode 7 moves in the accommodation groove 24 in the peripheral direction while sliding on the electrode pad 21, and the elastic body portion is pressed by the pressing force of the solder ball electrode 7 as shown in FIG. 26, the vicinity of the maximum diameter portion 30 of the solder ball electrode 7 comes into contact with the inclined portion 31 of the contact 25 in the insertion hole 23. At that time, the contact point between the solder ball electrode 7 and the contact 25 moves downward from above the inclined portion 31 of the contact 25. Further, the contact 25 pressed against the elastic body portion 26 receives the elastic force due to the reaction force from the elastic body portion 26 and thereby contacts the solder ball electrode 7 with a good contact pressure.

  Thus, since the contact 25 slides on the electrode pad 21, the surface of the electrode pad 21 is rubbed, so that a good contact between the contact 25 and the electrode pad 21 can be obtained. Further, when the solder ball electrode 7 and the contactor 25 come into contact with each other, the contact point on the contactor 25 side also moves while rubbing, so that a good contact between the solder ball electrode 7 and the contactor 25 can be obtained. Furthermore, since the contact 25 does not touch the top 32 of the solder ball electrode 7 when contacting the solder ball electrode 7, there is no damage to the top 32.

  In the first embodiment, as shown in FIG. 3, the edge of the upper surface of the insertion hole 23 has an acute angle. However, the edge can be chamfered, and the solder ball electrode 7 when the semiconductor device is loaded. Can prevent damage. Further, as described above, the contact 25 for electrically connecting the solder ball electrode 7 and the electrode pad 21 is extremely small. The contact between the solder ball electrode 7 and the contact 25, the contact 25, and the electrode pad 21. Since the distance from the contact point, that is, the electrical line length can be shortened, the inductance can be made very small.

  4A and 4B show a main part of the inspection apparatus according to the second embodiment of the present invention, in which FIG. 4A is a cross-sectional view, FIG. 4B is a top view, and FIG. It is the perspective view which showed.

  In the example shown in the first embodiment, one contact 25 is arranged in each insertion hole 23, and contact with the solder ball electrode 7 can be obtained by a one-point contact configuration. However, the number and arrangement of the contacts 25 arranged in the insertion hole 23 are not limited to this, and the insertion hole 23 ′ of the second embodiment is opposed to the solder ball electrode 7 as shown in FIG. 4. By arranging two, a very stable contact state can be obtained. Further, three or more contacts 25 may be arranged radially around the insertion hole 23 '.

  INDUSTRIAL APPLICABILITY The inspection apparatus according to the present invention can accurately measure the high frequency characteristics of a semiconductor device having solder ball electrodes, and can measure without damaging the solder ball electrodes, and is useful as an inspection apparatus for semiconductor devices.

(A) which shows the principal part of the inspection apparatus in Embodiment 1 of this invention is sectional drawing, (b) is a top view The perspective view which shows the whole structure of the test | inspection apparatus in this Embodiment 1. The figure explaining a mode (a), (b) with which a BGA semiconductor device is loaded with respect to the inspection apparatus in this Embodiment 1, and a solder ball electrode is electrically connected. (A) which shows the principal part of the inspection apparatus in Embodiment 2 of this invention is sectional drawing, (b) is a top view. The perspective view which shows the whole structure of the test | inspection apparatus in this Embodiment 2. Sectional view of a conventional pogo pin type contact pin using an inspection device Sectional view showing a conventional inspection device using a leaf spring contact pin Sectional drawing which shows the inspection apparatus using the conventional J-shaped contact pin

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pogo pin system contact pin 2 Cylinder 3 Compression spring 4 Upper plunger 5 Lower plunger 6 BGA semiconductor device 7 Solder ball electrode 8 Inspection circuit board 9 Land electrode 10 Leaf spring system contact pin 11 Electrode pattern 12 Solder 13 Contact part 14 QFP semiconductor device 15 Lead electrode 16 Curved portion 17 J-shaped contact pin 18 Elastic material 19 Tip portion 20 Substrate 21 Electrode pad 22 Assembly means 23, 23 ′ Insertion hole 24 Housing groove 25 Contact 26 Elastic body portion 27 Inspection device 28 Terminal electrode 29 Screw 30 Maximum diameter part 31 Inclined part 32 Head part

Claims (2)

A semiconductor device inspection device for connecting an inspection circuit board of a semiconductor measuring device and a solder ball electrode of a semiconductor device so as to cause electrical conduction,
A substrate on which a plurality of electrode pads are arranged corresponding to the arrangement of the solder ball electrodes of the semiconductor device, and an insertion hole into which the solder ball electrodes can be inserted at positions facing the electrode pads arranged on the substrate, An electrically insulating assembly means in which a housing groove is formed on the outer periphery of the insertion hole; a contactor movably disposed in the housing groove and in contact with the electrode pad; and an elastic material disposed in correspondence with the contactor An elastic body part
An inspection apparatus for a semiconductor device, wherein the solder ball electrode and the electrode pad are electrically connected to each other through the contact, and the contact is arranged parallel to and slidable with respect to the substrate.   2. The inspection apparatus for a semiconductor device according to claim 1, wherein a plurality of contacts are arranged radially around an insertion hole of the inspection apparatus for one of the solder ball electrodes.

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