CN102468398A

CN102468398A - LED (Light Emitting Diode) packaging structure

Info

Publication number: CN102468398A
Application number: CN2010105382413A
Authority: CN
Inventors: 罗杏芬; 柯志勋; 詹勋伟
Original assignee: Rongchuang Energy Technology Co ltd; Zhanjing Technology Shenzhen Co Ltd
Current assignee: Rongchuang Energy Technology Co ltd; Zhanjing Technology Shenzhen Co Ltd
Priority date: 2010-11-09
Filing date: 2010-11-09
Publication date: 2012-05-23
Anticipated expiration: 2030-11-09
Also published as: CN102468398B

Abstract

The invention relates to an LED (Light Emitting Diode) packaging structure, which comprises LED crystal grains, a conductive substrate, a first welding pad and a second welding pad. The conductive substrate comprises a first conductive region and a second conductive region which are mutually insulated, the LED crystal grains are fixed on the conductive substrate, the first conductive region is provided with a first sliding slot, the second conductive region is provided with a second sliding slot, the first welding pad comprises a first buckling part, the second welding pad comprises a second buckling part, the first buckling part is contained in the first sliding slot in a sliding manner, the first welding pad is in contact with the first conductive region, the second welding pad comprises a second buckling part, the second buckling part is contained in the second sliding slot in a sliding manner, and the second welding pad is in contact with the second conductive region. The first welding pad and the second welding pad of the LED packaging structure can respectively slide corresponding to the conductive substrate, thus the welding position of a circuit board can be matched by regulating the positions of the first welding pad and the second welding pad when the LED packaging structure is arranged on the circuit board.

Description

Package structure for LED

Technical field

The present invention relates to a kind of semiconductor light-emitting elements, particularly a kind of package structure for LED.

Background technology

Usually, the weld pad of package structure for LED is plated on the substrate, and weld pad substrate relatively slides, and behind the package structure for LED that completes, the position of weld pad can not be adjusted.

Summary of the invention

In view of this, be necessary to provide a kind of package structure for LED that can adjust bond pad locations.

A kind of package structure for LED comprises LED crystal particle, electrically-conductive backing plate, first weld pad and second weld pad, and electrically-conductive backing plate comprises first conductive region and second conductive region of mutually insulated; LED crystal particle is fixed on the electrically-conductive backing plate, and first conductive region is offered first chute, and second conductive region is offered second chute; First weld pad comprises first buckling parts, and second weld pad comprises second buckling parts, and first buckling parts slidably is contained in first chute; First weld pad contacts with first conductive region; Second weld pad comprises second buckling parts, and second buckling parts slidably is contained in second chute, and second weld pad contacts with second conductive region.

First weld pad and second weld pad of above-mentioned package structure for LED can slide with respect to electrically-conductive backing plate respectively; And first weld pad contacts with first conductive region of electrically-conductive backing plate to realize that first weld pad is electrically connected with first conductive region; Second weld pad contacts with second conductive region of electrically-conductive backing plate to realize that second weld pad is electrically connected with second conductive region; Thereby when package structure for LED is installed to circuit board; Can be through the position of adjustment first weld pad and second weld pad, with the welding position of match circuit plate.

With reference to the accompanying drawings, in conjunction with specific embodiment the present invention is done further description.

Description of drawings

Fig. 1 is the vertical view of the package structure for LED of one embodiment of the invention.

Fig. 2 is the generalized section of package structure for LED among Fig. 1.

Fig. 3 is first weld pad of package structure for LED among Fig. 1 and the vertical view after the slip of second weld pad.

The main element symbol description

Package structure for LED 10

LED crystal particle 11

First electrode 111

Second electrode 112

Electrically-conductive backing plate 12

First weld pad 13

First arm 131

Second arm 132

First connecting portion 133

First buckling parts 135

First horizontal part 136

The first vertical portion 137

First receiving space 138

Second weld pad 14

The 3rd arm 141

The 4th arm 142

Second connecting portion 143

Second buckling parts 145

Second horizontal part 146

The second vertical portion 147

Second receiving space 148

Packaging body 15

First conductive region 16

First chute 161

The first vertical section 162

First horizontal segment 163

First shoulder 164

Second conductive region 17

Second chute 171

The second vertical section 172

Second horizontal segment 173

Second shoulder 174

Insulating material 18

Embodiment

See also Fig. 1 and Fig. 2, a kind of package structure for LED 10 that embodiment of the present invention provides comprises LED crystal particle 11, electrically-conductive backing plate 12, first weld pad 13, second weld pad 14 and packaging body 15.

Be connected through insulating material 18 between first conductive region 16 and second conductive region, 17, the first conductive regions 16 that electrically-conductive backing plate 12 comprises mutually insulated and second conductive region 17.First conductive region 16 offers that first chute, 161, the second conductive regions 17 are offered second chute, 171, the first chutes 161 and second chute 171 is parallel to each other.First chute, 161 outer narrow inner widths, first chute 161 comprise that first horizontal segment 163 and first vertical section 162, the first conductive regions 16 form first shoulder 164 in first horizontal segment 163 of first chute 161 and the intersection of the first vertical section 162.Second chute, 171 outer narrow inner widths, second chute 171 comprise that second horizontal segment, 173 second vertical section 172, the second conductive regions 17 form second shoulder 174 in second horizontal segment 173 of second chute 171 and the intersection of the second vertical section 172.

First weld pad 13 comprises first arm 131, second arm 132, first connecting portion, 133 first buckling partss 135; First arm, 131 second arms 132 lay respectively at the two ends of first connecting portion 133; First arm 131, second arm, 132 first connecting portions 133 form the U types, and first arm 131, second arm, 132 first connecting portions 133 surround and form first receiving space 138.First buckling parts, 135 integral body are inverted T shape, and first buckling parts 135 is protruded out to first receiving space 138 by first arm 131 and forms.First buckling parts 135 comprises that first 137 first horizontal parts, 136, the first vertical portions 137 of vertical portion are extended by first arm 131 vertically downward and forms that first horizontal part 136 is positioned at the bottom of the first vertical portion 137.

First conductive region 16 of electrically-conductive backing plate 12 stretches in first receiving space 138 of first weld pad 13, and what first buckling parts 135 slided is contained in first chute 161, and first weld pad 13 contacts with first conductive region 16.Particularly, first horizontal part 136 of first buckling parts 135 first horizontal segment, 163, the first vertical portions 137 that are contained in first chute 161 be contained in first chute 161 first vertically section 162, the first horizontal parts 136 be resisted against first shoulder 164.

Second weld pad 14 also comprises the 3rd arm 141, the 4th arm 142, second connecting portion 143 and second buckling parts 145; The 3rd arm 141 and the 4th arm 142 lay respectively at the two ends of second connecting portion 143; The 3rd arm 141, the 4th arm 142 and second connecting portion 143 form the U types, and the 3rd arm 141, the 4th arm 142 and second connecting portion 143 surround and form second receiving space 148.Second buckling parts, 145 integral body are inverted T shape, and second buckling parts 145 is protruded out to second receiving space 148 by the 3rd arm 141 and forms.Second buckling parts 145 comprises that the second vertical portion 147 and second horizontal part, 146, the second vertical portions 147 are extended by the 3rd arm 141 vertically downward and forms that second horizontal part 146 is positioned at the bottom of the second vertical portion 147.

Second conductive region 17 of electrically-conductive backing plate 12 stretches in second receiving space 148 of second weld pad 14, and second buckling parts 145 slidably is contained in second chute 171, and second weld pad 14 contacts with second conductive region 17.Particularly, second horizontal part 146 of second buckling parts 145 second horizontal segment, 173, the second vertical portions 147 that are contained in second chute 171 be contained in second chute 171 second vertically section 172, the second horizontal parts 146 be resisted against second shoulder 174.

LED crystal particle 11 is fixed on the electrically-conductive backing plate 12; LED crystal particle 11 comprises first electrode and second electrode; First electrode is electrically connected with first conductive region 16 of electrically-conductive backing plate 12 through first gold thread, and second electrode is electrically connected with second conductive region 17 of electrically-conductive backing plate 12 through second gold thread.Packaging body 15 is processed by transparent material, and packaging body 15 coats LED crystal particles 11.

As shown in Figure 3, the bearing of trend of first weld pad, 13 edges, first chute 161 slides backwards on the rear end of first chute 161, and second weld pad 14 slides into the front end of second chute 171 forward along the bearing of trend of second chute 171.

First weld pad 13 of package structure for LED 10 of the present invention and second weld pad 14 can slide with respect to electrically-conductive backing plate 12 respectively; And first weld pad 13 contacts with first conductive region 16 of electrically-conductive backing plate 12 to realize that first weld pad 13 is electrically connected with first conductive region 16; Second weld pad 14 contacts with second conductive region 17 of electrically-conductive backing plate 12 to realize that second weld pad 14 is electrically connected with second conductive region 17; Thereby when package structure for LED 10 is installed to circuit board; Can be through the position of adjustment first weld pad 13 and second weld pad 14, with the welding position of match circuit plate.

Claims

1. a package structure for LED comprises LED crystal particle, electrically-conductive backing plate, first weld pad and second weld pad, and electrically-conductive backing plate comprises first conductive region and second conductive region of mutually insulated; LED crystal particle is fixed on the electrically-conductive backing plate; It is characterized in that: first conductive region is offered first chute, and second conductive region is offered second chute, and first weld pad comprises first buckling parts; Second weld pad comprises second buckling parts; First buckling parts slidably is contained in first chute, and first weld pad contacts with first conductive region, and second weld pad comprises second buckling parts; Second buckling parts slidably is contained in second chute, and second weld pad contacts with second conductive region.

2. package structure for LED as claimed in claim 1; It is characterized in that: the respectively outer narrow inner width of this first chute and second chute; First chute comprises vertically section of first horizontal segment and first; First conductive region forms first shoulder in first horizontal segment of first chute and the intersection of the first vertical section, and second chute comprises vertically section of second horizontal segment and second, and second conductive region forms second shoulder in second horizontal segment of second chute and second vertical section intersection.

3. package structure for LED as claimed in claim 2; It is characterized in that: first buckling parts comprises first horizontal part and the first vertical portion; First horizontal part is contained in first horizontal segment of first chute, and the first vertical portion is contained in the first vertical section of first chute, and first horizontal part is resisted against first shoulder; Second buckling parts comprises second horizontal part and the second vertical portion; Second horizontal part is contained in second horizontal segment of second chute, and the second vertical portion is contained in the second vertical section of second chute, and second horizontal part is resisted against second shoulder.

4. package structure for LED as claimed in claim 3; It is characterized in that: first weld pad also comprises first arm, second arm and first connecting portion; First arm and second arm lay respectively at the two ends of first connecting portion; First arm, second arm and first connecting portion are the U type, and first arm, second arm and first connecting portion surround and form first receiving space, and first conductive region stretches in first receiving space.

5. package structure for LED as claimed in claim 4 is characterized in that: first buckling parts is protruded out to first receiving space by first arm and forms.

6. package structure for LED as claimed in claim 3; It is characterized in that: second weld pad also comprises the 3rd arm, the 4th arm and second connecting portion; The 3rd arm and the 4th arm lay respectively at the two ends of second connecting portion; The 3rd arm, the 4th arm and second connecting portion are the U type, and the 3rd arm, the 4th arm and second connecting portion surround and form second receiving space, and second conductive region stretches in second receiving space.

7. package structure for LED as claimed in claim 6 is characterized in that: second buckling parts is protruded out to second receiving space by the 3rd arm and forms.

8. package structure for LED as claimed in claim 1 is characterized in that: first conductive region is connected through insulating material with second conductive region.

9. package structure for LED as claimed in claim 1 is characterized in that: LED crystal particle comprises first electrode and second electrode, and first electrode is electrically connected with first conductive region, and second electrode is electrically connected with second conductive region.

10. package structure for LED as claimed in claim 1 is characterized in that: also comprise packaging body, this packaging body coats LED crystal particle.