CN102468398B - LED (Light Emitting Diode) packaging structure - Google Patents
LED (Light Emitting Diode) packaging structure Download PDFInfo
- Publication number
- CN102468398B CN102468398B CN201010538241.3A CN201010538241A CN102468398B CN 102468398 B CN102468398 B CN 102468398B CN 201010538241 A CN201010538241 A CN 201010538241A CN 102468398 B CN102468398 B CN 102468398B
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- Prior art keywords
- arm
- chute
- conductive region
- led
- weld pad
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Abstract
The invention relates to an LED (Light Emitting Diode) packaging structure, which comprises LED crystal grains, a conductive substrate, a first welding pad and a second welding pad. The conductive substrate comprises a first conductive region and a second conductive region which are mutually insulated, the LED crystal grains are fixed on the conductive substrate, the first conductive region is provided with a first sliding slot, the second conductive region is provided with a second sliding slot, the first welding pad comprises a first buckling part, the second welding pad comprises a second buckling part, the first buckling part is contained in the first sliding slot in a sliding manner, the first welding pad is in contact with the first conductive region, the second welding pad comprises a second buckling part, the second buckling part is contained in the second sliding slot in a sliding manner, and the second welding pad is in contact with the second conductive region. The first welding pad and the second welding pad of the LED packaging structure can respectively slide corresponding to the conductive substrate, thus the welding position of a circuit board can be matched by regulating the positions of the first welding pad and the second welding pad when the LED packaging structure is arranged on the circuit board.
Description
Technical field
The present invention relates to a kind of semiconductor light-emitting elements, particularly a kind of package structure for LED.
Background technology
Conventionally, the weld pad of package structure for LED is plated on substrate, and weld pad relatively substrate slides, and completes after package structure for LED, and the position of weld pad can not be adjusted.
Summary of the invention
In view of this, be necessary to provide a kind of package structure for LED that can adjust bond pad locations.
A kind of package structure for LED, comprise LED crystal particle, electrically-conductive backing plate, the first weld pad and the second weld pad, electrically-conductive backing plate comprises the first conductive region and second conductive region of mutually insulated, LED crystal particle is fixed on electrically-conductive backing plate, the first conductive region is offered the first chute, the second conductive region is offered the second chute, the first weld pad comprises the first buckling parts, the second weld pad comprises the second buckling parts, the first buckling parts is slidably contained in the first chute, the first weld pad contacts with the first conductive region, the second buckling parts is slidably contained in the second chute, the second weld pad contacts with the second conductive region, the first chute comprises vertically section of the first horizontal segment and first, the first conductive region forms the first shoulder in the first horizontal segment of the first chute and the intersection of the first vertical section, the second chute comprises vertically section of the second horizontal segment and second, the second conductive region forms the second shoulder in the second horizontal segment of the second chute and the intersection of the second vertical section, the first buckling parts comprises the first horizontal part and the first vertical portion, the first horizontal part is contained in the first horizontal segment of the first chute, the first vertical portion is contained in the first vertical section of the first chute, the first horizontal part is resisted against the first shoulder, the second buckling parts comprises the second horizontal part and the second vertical portion, the second horizontal part is contained in the second horizontal segment of the second chute, the second vertical portion is contained in the second vertical section of the second chute, the second horizontal part is resisted against the second shoulder.
The first weld pad and second weld pad of above-mentioned package structure for LED can slide with respect to electrically-conductive backing plate respectively, and the first weld pad contacts to realize the first weld pad with the first conductive region of electrically-conductive backing plate and is electrically connected to the first conductive region, the second weld pad contacts to realize the second weld pad with the second conductive region of electrically-conductive backing plate and is electrically connected to the second conductive region, thereby when package structure for LED is installed to circuit board, can be by adjusting the position of the first weld pad and the second weld pad, with the welding position of match circuit plate.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Accompanying drawing explanation
Fig. 1 is the vertical view of the package structure for LED of one embodiment of the invention.
Fig. 2 is the generalized section of package structure for LED in Fig. 1.
Fig. 3 is the first weld pad of package structure for LED in Fig. 1 and the vertical view after the slip of the second weld pad.
Main element symbol description
Package structure for LED 10
LED crystal particle 11
The first electrode 111
The second electrode 112
Electrically-conductive backing plate 12
The first weld pad 13
The first arm 131
The second arm 132
The first connecting portion 133
The first buckling parts 135
The first horizontal part 136
The first vertical portion 137
The first receiving space 138
The second weld pad 14
The 3rd arm 141
The 4th arm 142
The second connecting portion 143
The second buckling parts 145
The second horizontal part 146
The second vertical portion 147
The second receiving space 148
Packaging body 15
The first conductive region 16
The first chute 161
The first vertical section 162
The first horizontal segment 163
The first shoulder 164
The second conductive region 17
The second chute 171
The second vertical section 172
The second horizontal segment 173
The second shoulder 174
Insulating material 18
Embodiment
Refer to Fig. 1 and Fig. 2, a kind of package structure for LED 10 that embodiment of the present invention provides comprises LED crystal particle 11, electrically-conductive backing plate 12, the first weld pad 13, the second weld pad 14 and packaging body 15.
Electrically-conductive backing plate 12 comprises between the first conductive region 16 of mutually insulated and the second conductive region 17, the first conductive regions 16 and the second conductive region 17 and being connected by insulating material 18.The first conductive region 16 offers that the first chute 161, the second conductive regions 17 are offered the second chute 171, the first chutes 161 and the second chute 171 is parallel to each other.The outer narrow inner width of the first chute 161, the first chute 161 comprises that the first horizontal segment 163 and the first vertical section 162, the first conductive regions 16 form the first shoulder 164 in the first horizontal segment 163 of the first chute 161 and the intersection of the first vertical section 162.The outer narrow inner width of the second chute 171, the second chute 171 comprises that the second horizontal segment 173 and the second vertical section 172, the second conductive regions 17 form the second shoulder 174 in the second horizontal segment 173 of the second chute 171 and the intersection of the second vertical section 172.
The first weld pad 13 comprises the first arm 131, the second arm 132, the first connecting portion 133 and the first buckling parts 135, the first arm 131 and the second arm 132 lay respectively at the two ends of the first connecting portion 133, the first arm 131, the second arm 132 and the first connecting portion 133 form U-shaped, and the first arm 131, the second arm 132 and the first connecting portion 133 surround and form the first receiving space 138.The first buckling parts 135 integral body are inverted T shape, and the first buckling parts 135 is protruded out and forms to the first receiving space 138 by the first arm 131.The first buckling parts 135 comprises that the first vertical portion 137 and the first horizontal part 136, the first vertical portions 137 are extended and form vertically downward by the first arm 131, and the first horizontal part 136 is positioned at the bottom of the first vertical portion 137.
The first conductive region 16 of electrically-conductive backing plate 12 stretches in the first receiving space 138 of the first weld pad 13, and the first buckling parts 135 is slidably contained in the first chute 161, and the first weld pad 13 contacts with the first conductive region 16.Particularly, the first horizontal segment 163, the first vertical portions 137 that the first horizontal part 136 of the first buckling parts 135 is contained in the first chute 161 be contained in the first chute 161 first vertically section 162, the first horizontal parts 136 be resisted against the first shoulder 164.
The second weld pad 14 also comprises the 3rd arm 141, the 4th arm 142, the second connecting portion 143 and the second buckling parts 145, the 3rd arm 141 and the 4th arm 142 lay respectively at the two ends of the second connecting portion 143, the 3rd arm 141, the 4th arm 142 and the second connecting portion 143 form U-shaped, and the 3rd arm 141, the 4th arm 142 and the second connecting portion 143 surround and form the second receiving space 148.The second buckling parts 145 integral body are inverted T shape, and the second buckling parts 145 is protruded out and forms to the second receiving space 148 by the 3rd arm 141.The second buckling parts 145 comprises that the second vertical portion 147 and the second horizontal part 146, the second vertical portions 147 are extended and form vertically downward by the 3rd arm 141, and the second horizontal part 146 is positioned at the bottom of the second vertical portion 147.
The second conductive region 17 of electrically-conductive backing plate 12 stretches in the second receiving space 148 of the second weld pad 14, and the second buckling parts 145 is slidably contained in the second chute 171, and the second weld pad 14 contacts with the second conductive region 17.Particularly, the second horizontal segment 173, the second vertical portions 147 that the second horizontal part 146 of the second buckling parts 145 is contained in the second chute 171 be contained in the second chute 171 second vertically section 172, the second horizontal parts 146 be resisted against the second shoulder 174.
LED crystal particle 11 is fixed on electrically-conductive backing plate 12, LED crystal particle 11 comprises the first electrode and the second electrode, the first electrode is electrically connected to the first conductive region 16 of electrically-conductive backing plate 12 by the first gold thread, and the second electrode is electrically connected to the second conductive region 17 of electrically-conductive backing plate 12 by the second gold thread.Packaging body 15 is made by transparent material, the coated LED crystal particle 11 of packaging body 15.
As shown in Figure 3, the first weld pad 13 slides backwards on the rear end of the first chute 161 along the bearing of trend of the first chute 161, and the second weld pad 14 slides into forward the front end of the second chute 171 along the bearing of trend of the second chute 171.
The first weld pad 13 of package structure for LED 10 of the present invention and the second weld pad 14 can slide with respect to electrically-conductive backing plate 12 respectively, and the first weld pad 13 contacts to realize the first weld pad 13 with the first conductive region 16 of electrically-conductive backing plate 12 and is electrically connected to the first conductive region 16, the second weld pad 14 contacts to realize the second weld pad 14 with the second conductive region 17 of electrically-conductive backing plate 12 and is electrically connected to the second conductive region 17, thereby when package structure for LED 10 is installed to circuit board, can be by adjusting the position of the first weld pad 13 and the second weld pad 14, welding position with match circuit plate.
Claims (9)
1. a package structure for LED, comprise LED crystal particle, electrically-conductive backing plate, the first weld pad and the second weld pad, electrically-conductive backing plate comprises the first conductive region and second conductive region of mutually insulated, LED crystal particle is fixed on electrically-conductive backing plate, it is characterized in that: the first conductive region is offered the first chute, the second conductive region is offered the second chute, the first weld pad comprises the first buckling parts, the second weld pad comprises the second buckling parts, the first buckling parts is slidably contained in the first chute, the first weld pad contacts with the first conductive region, the second buckling parts is slidably contained in the second chute, the second weld pad contacts with the second conductive region, the first chute comprises vertically section of the first horizontal segment and first, the first conductive region forms the first shoulder in the first horizontal segment of the first chute and the intersection of the first vertical section, the second chute comprises vertically section of the second horizontal segment and second, the second conductive region forms the second shoulder in the second horizontal segment of the second chute and the intersection of the second vertical section, the first buckling parts comprises the first horizontal part and the first vertical portion, the first horizontal part is contained in the first horizontal segment of the first chute, the first vertical portion is contained in the first vertical section of the first chute, the first horizontal part is resisted against the first shoulder, the second buckling parts comprises the second horizontal part and the second vertical portion, the second horizontal part is contained in the second horizontal segment of the second chute, the second vertical portion is contained in the second vertical section of the second chute, the second horizontal part is resisted against the second shoulder.
2. package structure for LED as claimed in claim 1, is characterized in that: the outer narrow inner width of this first chute and the second chute.
3. package structure for LED as claimed in claim 1, it is characterized in that: the first weld pad also comprises the first arm, the second arm and the first connecting portion, the first arm and the second arm lay respectively at the two ends of the first connecting portion, the first arm, the second arm and the first connecting portion are U-shaped, the first arm, the second arm and the first connecting portion surround and form the first receiving space, and the first conductive region stretches in the first receiving space.
4. package structure for LED as claimed in claim 3, is characterized in that: the first buckling parts is protruded out and forms to the first receiving space by the first arm.
5. package structure for LED as claimed in claim 1, it is characterized in that: the second weld pad also comprises the 3rd arm, the 4th arm and the second connecting portion, the 3rd arm and the 4th arm lay respectively at the two ends of the second connecting portion, the 3rd arm, the 4th arm and the second connecting portion are U-shaped, the 3rd arm, the 4th arm and the second connecting portion surround and form the second receiving space, and the second conductive region stretches in the second receiving space.
6. package structure for LED as claimed in claim 5, is characterized in that: the second buckling parts is protruded out and forms to the second receiving space by the 3rd arm.
7. package structure for LED as claimed in claim 1, is characterized in that: the first conductive region is connected by insulating material with the second conductive region.
8. package structure for LED as claimed in claim 1, is characterized in that: LED crystal particle comprises the first electrode and the second electrode, and the first electrode is electrically connected to the first conductive region, and the second electrode is electrically connected to the second conductive region.
9. package structure for LED as claimed in claim 1, is characterized in that: also comprise packaging body, this packaging body coats LED crystal particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010538241.3A CN102468398B (en) | 2010-11-09 | 2010-11-09 | LED (Light Emitting Diode) packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010538241.3A CN102468398B (en) | 2010-11-09 | 2010-11-09 | LED (Light Emitting Diode) packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102468398A CN102468398A (en) | 2012-05-23 |
| CN102468398B true CN102468398B (en) | 2014-10-15 |
Family
ID=46071772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010538241.3A Expired - Fee Related CN102468398B (en) | 2010-11-09 | 2010-11-09 | LED (Light Emitting Diode) packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102468398B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005300366A (en) * | 2004-04-13 | 2005-10-27 | Matsushita Electric Ind Co Ltd | Inspection device of semiconductor device |
| CN1753200A (en) * | 2004-09-24 | 2006-03-29 | 斯坦雷电气株式会社 | Light emitting diode device |
| CN201562692U (en) * | 2009-10-12 | 2010-08-25 | 金芃 | LED paster type encapsulation with roughened surface |
| CN102376854A (en) * | 2010-08-09 | 2012-03-14 | Lg伊诺特有限公司 | Light emitting device and lighting system having the same |
-
2010
- 2010-11-09 CN CN201010538241.3A patent/CN102468398B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005300366A (en) * | 2004-04-13 | 2005-10-27 | Matsushita Electric Ind Co Ltd | Inspection device of semiconductor device |
| CN1753200A (en) * | 2004-09-24 | 2006-03-29 | 斯坦雷电气株式会社 | Light emitting diode device |
| CN201562692U (en) * | 2009-10-12 | 2010-08-25 | 金芃 | LED paster type encapsulation with roughened surface |
| CN102376854A (en) * | 2010-08-09 | 2012-03-14 | Lg伊诺特有限公司 | Light emitting device and lighting system having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102468398A (en) | 2012-05-23 |
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