CN102185086B - Light emitting diode (LED) bracket and LED with same - Google Patents
Light emitting diode (LED) bracket and LED with same Download PDFInfo
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- CN102185086B CN102185086B CN 201110115645 CN201110115645A CN102185086B CN 102185086 B CN102185086 B CN 102185086B CN 201110115645 CN201110115645 CN 201110115645 CN 201110115645 A CN201110115645 A CN 201110115645A CN 102185086 B CN102185086 B CN 102185086B
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Abstract
The invention discloses a light emitting diode (LED) bracket and an LED with the same. The LED bracket comprises two pins and a carrier with a cavity; the bottom of the cavity is provided with two metal areas; each pin comprises a metal area connecting part, an oblique part, a welding part and a light splitting test part connected sequentially; the metal area connecting part is laid below one metal area and horizontally extends to one end of the bottom of the cavity corresponding to the metal area; the oblique part passes through the carrier from one end of the bottom of the cavity and is obliquely extended and exposed out of the back of the carrier; and the welding part is horizontally extended to the corresponding end face of the carrier along the back of the carrier and bent to form the light splitting test part attached to the end face. The production cost of the bracket is saved by changing the setting mode of the pins, the accuracy of light splitting test is improved by increasing the size of the light splitting test part, the welding part and the light splitting test part are welded on the surface of a printed circuit board (PCB) together during mounting of a surface mounting technology (SMT), and effective contact and radiating area of the PCB and the pins is enlarged so as to improve the reliability of the LED.
Description
Technical field
The present invention relates to LED (light-emitting diode), especially a kind of led support and the LED with this support.
Background technology
Along with the development of semiconductor lighting technology, LED has been widely used in the fields such as panel computer, notebook computer, LCD, large scale liquid crystal TV and indoor and outdoor lighting as backlight.
Fig. 1 shows a kind of led support in the prior art, comprises carrier 1 and cavity 2, and cavity 2 is square cavities that the upper surface by carrier 1 forms to lower recess, and its base area is less than aperture area.The bottom of cavity 2 is provided with three separate metal areas, is respectively the crystal bonding area 31 and second metal area 32 and the 3rd metal area 33 that are positioned at crystal bonding area 31 both sides that is positioned at the mid portion of cavity 2 bottoms.Gu when brilliant, led chip is fixed on crystal bonding area 31, its two pins is electrically connected with second metal area 32 and the 3rd metal area 33 respectively by the mode of welding lead.If also be provided with the protection diode with the led chip reverse parallel connection among this LED; then protect diode can be fixed in the 3rd metal area 33; the protection diode adopts the single electrode form; its bottom electrode is electrically connected with the 3rd metal area 33 by elargol, and its top electrodes is electrically connected with second metal area 32 by lead-in wire.Because it is long to connect lead-in wire, very easily disconnect, cause the protection diode fails.
Fig. 2 and Fig. 3 show the a-a ' of Fig. 1 structure and b-b ' respectively to generalized section.Led support also comprises heat sink 5 and two pins 41,42 of the below, bottom that is positioned at cavity 2. Pin 41 and 42 is distributed in heat sink 5 both sides, and respectively by spacing block 61 and 62 and heat sink 5 at interval, because heat sink 5 and two pins 41 of block structure, 42 generally adopt thickness at the copper material alloy material of 0.25～0.3mm, has improved the support production cost.
In addition, need to carry out spectrophotometric test behind the packaged LED of this led support.During spectrophotometric test, if probe and pin 41,42 lateral parts contact and carry out light splitting, because the height of pin 41,42 side generally is no more than 0.3mm, area is less, comes in contact bad phenomenon easily; And the spacing block 61 in the middle of this structure LED and 62 causes LED to damage being subjected to very easily fracture under the external force situation.
Summary of the invention
The main technical problem to be solved in the present invention is, a kind of led support is provided and has the LED of this support, can reduce the production cost of support.
For solving the problems of the technologies described above, the invention provides a kind of led support, comprise two pins and the carrier with cavity, its described cavity bottom is provided with two metal areas, each pin includes the metal area connecting portion that links to each other successively, rake, weld part and spectrophotometric test portion, described metal area connecting portion is laid on a metal area below and extends horizontally to described cavity bottom and the corresponding end of this metal area, described rake passes the back side of exposing described carrier after the described carrier inclined extension from an end of described cavity bottom, and described weld part is bent to form the spectrophotometric test portion that is attached to this end face along the back side of described carrier behind the corresponding end face horizontal-extending of described carrier.
In a kind of execution mode, described metal area connecting portion is laid on a described metal area below and one-body molded with this metal area.
In a kind of execution mode, described metal area comprises separate and lays respectively at crystal bonding area and the wire welding area at described cavity bottom two ends, and the area of described crystal bonding area is greater than the area of described wire welding area and greater than half of described cavity base area.
In a kind of execution mode, described rake and described metal area connecting portion form 100 °～160 ° angle.
In a kind of execution mode, the back side of the described carrier of at least part of protrusion of described weld part, and protrusion height is 0.03～0.15mm.
In a kind of execution mode, the length of described weld part is 0.3～2.0mm.
In a kind of execution mode, the height of described spectrophotometric test portion is more than or equal to 0.4mm.
In a kind of execution mode, described spectrophotometric test portion comprises two separate spectrophotometric test districts, and described two spectrophotometric test districts all are connected with described weld part.
The present invention has also protected a kind of LED, comprise led support and led chip, described led support comprises two pins and has the carrier of cavity that the bottom of described cavity is provided with two metal areas, be respectively crystal bonding area and wire welding area, described led chip is fixed on the described crystal bonding area; Each pin includes metal area connecting portion, rake, weld part and the spectrophotometric test portion that links to each other successively, described metal area connecting portion is laid on a metal area below and extends horizontally to described cavity bottom and the corresponding end of this metal area, described rake passes the back side of exposing described carrier after the described carrier inclined extension from an end of described cavity bottom, and described weld part is bent to form the spectrophotometric test portion that is attached to this end face along the back side of described carrier behind the corresponding end face horizontal-extending of described carrier.
In a kind of execution mode, comprise also and the protection diode of described led chip reverse parallel connection that described protection diode is fixed on described wire welding area, described crystal bonding area and wire welding area are separate and lay respectively at the two ends of described cavity bottom; The area of described crystal bonding area is greater than described wire welding area and greater than half of described cavity bottom area.
The invention has the beneficial effects as follows: the pin in the led support comprises metal area connecting portion, rake, weld part and the spectrophotometric test portion that links to each other successively, this pin arranges in the carrier bending according to certain mode, realized that not only basic electrode draws function, and the copper material alloy of laminar (such as 0.15mm) or the material of other conductive and heat-conductive have been adopted, compare with the pin of block structure in the prior art, significantly reduce the production cost of the support of knowing clearly.
Description of drawings
Fig. 1 is the schematic appearance of a kind of led support of the prior art;
Fig. 2 is the a-a ' generalized section of structure shown in Figure 1;
Fig. 3 is the b-b ' generalized section of structure shown in Figure 1;
Fig. 4 is the led support schematic perspective view of one embodiment of the present invention;
Fig. 5 is the vertical view of Fig. 4 structure;
Fig. 6 is the A-A ' cross section view of structure shown in Figure 5;
Fig. 7 is the B-B ' cross section view of structure shown in Figure 5;
Fig. 8 is the upward view of Fig. 4 structure;
Fig. 9 is the led support schematic perspective view of another embodiment of the present invention;
Figure 10 is the vertical view of Fig. 9 structure
Figure 11 is the upward view of Fig. 9 structure;
Figure 12 is the angle of inclination schematic diagram of the rake of one embodiment of the present invention.
Embodiment
By reference to the accompanying drawings the present invention is described in further detail below by embodiment.
Embodiment 1:
Please refer to Fig. 4 to Fig. 8, a kind of led support of present embodiment comprises carrier 1, cavity 2 and pin 4.
Wherein, carrier 1 is plastic carrier or resin carrier, and it is shaped as rectangle, square or other shape.Cavity 2 is formed to lower recess by the upper surface of carrier 1, it is shaped as rectangle, square or other shape, the bottom area of cavity 2 is less than aperture area, be provided with two metal areas in the bottom of cavity 2, be respectively crystal bonding area 31 and wire welding area 32, these two zones are separate, and are positioned at the two ends of cavity bottom; Preferably, the area of crystal bonding area 31 is also greater than the area of wire welding area 32, and the area of crystal bonding area 31 is greater than half of cavity bottom area simultaneously.
In the led support during packaging LED chips, led chip is fixed on crystal bonding area 31, the electrode of led chip can be electrically connected with crystal bonding area 31 and wire welding area 32 by lead-in wire, particularly, select two lead-in wires that conduct electricity very well for use, such as gold thread, a wherein electrode welding of an end of a lead-in wire and led chip, the other end is welded on crystal bonding area 31; Another electrode welding of one end of another root lead-in wire and led chip, the other end is welded on wire welding area 32.
Protection diode with the led chip reverse parallel connection also can be set in the led support, is voltage stabilizing didoe such as the protection diode.Particularly, led chip is fixed on crystal bonding area 31, and two electrode is electrically connected with crystal bonding area 31 and wire welding area 32 by lead-in wire respectively; The protection diode is fixed on wire welding area 32, adopts the single electrode form, and its bottom electrode is electrically connected with wire welding area 32 by elargol, and top electrodes is electrically connected with crystal bonding area 31 by lead-in wire.In the present embodiment, because crystal bonding area 31 and wire welding area 32, realize that the length of the lead-in wire that the protection diode electrode is electrically connected with crystal bonding area 31 is shorter at a distance of nearer; be difficult for disconnecting; therefore shorten wire length, reduced the lead-in wire cost, also improved the reliability of protection diode.Simultaneously, because the area of crystal bonding area 31 is bigger, be equivalent to the crystal bonding area among Fig. 1 and second metal area are merged into crystal bonding area 31 among Fig. 5, increased the reflective area of led chip, improved the luminous intensity of LED to a certain extent.
The material of pin 4 is the material of copper or other conductive and heat-conductive, such as the copper material alloy.Each pin 4 comprises metal area connecting portion 41, rake 42, weld part 43 and the spectrophotometric test portion 44 that links to each other successively.
Wherein, metal area connecting portion 41 is laid on a metal area below and extends horizontally to cavity 2 bottoms and the corresponding end of this metal area.Metal area connecting portion 41 can be one-body molded with the metal area of its top, and is by diel that metal area connecting portion 41 and metal area is one-body molded such as during fabrication, perhaps forms metal area by the mode at the upper surface electroplated metal layer of metal area connecting portion 41.In a kind of execution mode, crystal bonding area 31 is one-body molded with the metal area connecting portion of one of them pin 4, and wire welding area 32 is one-body molded with the metal area connecting portion of another pin 4.Because crystal bonding area 31 is mainly used in fixed L ED chip, its area is bigger, and the metal area connecting portion 41 integrated with it that is positioned at its below can serve as heat sink, arranges heat sinkly separately in carrier thereby removed from, has saved and has made heat sink required production cost.
Please refer to Figure 12, rake 42 links to each other with metal area connecting portion 41, and rake 42 passes the back side of exposing carrier 1 after carrier 1 and the inclination extension from an end of cavity 2 bottoms.As shown in figure 12, rake 42 extends towards the corresponding end-faces near carrier 1, and the angle α that forms between the metal area connecting portion 41 is 100 °～160 °.
Please refer to Fig. 6, to carrier 1 corresponding end face horizontal-extending, preferably, weld part 43 parts protrude from the back side of carrier 1 to weld part 43 along the back side of carrier 1.Weld part 43 protrudes from the height h at carrier 1 back side between 0.03～0.15mm, and the length L of weld part 43 is between 0.3～2.0mm.Weld part 43 upwards is bent to form the spectrophotometric test portion 44 that is attached on this end face after extending to an end face of carrier 1.The height H of spectrophotometric test portion 44 is greater than or equal to 0.4mm.
When SMT mounted, weld part 43 or weld part 43 were welded on the PCB surface with spectrophotometric test portion 44 by tin cream.Weld part 43 parts protrude from carrier 1 back side, help the seam on weld part 43 and PCB surface; The length of weld part 43 is arranged between 0.3～2.0mm, has guaranteed the effective area of welding.The height of spectrophotometric test portion 44 is set to be greater than or equal to 0.4mm, and when spectrophotometric test, the effective contact area of probe and spectrophotometric test portion 44 increases, and contacts effectively, has guaranteed the accuracy of spectrophotometric test.Preferably, also silver coated on the surface of spectrophotometric test portion 44, because the height of spectrophotometric test portion is greater than or equal to 0.4mm, spectrophotometric test portion goes up also silver coated in 44 surfaces, so when spectrophotometric test, can further improve the effect that contacts with probe, overcome the bad phenomenon of spectrophotometric test.
The part of pin 4 and PCB seam has the effect of heat radiation, after spectrophotometric test portion 44 also arrives the PCB surface by the tin cream seam, when increasing efficient weld area, has also increased area of dissipation, has improved the reliability of LED.
As shown in Figure 6, two pins 4 of led support of the present invention are only realized separating by a spacer block 11, in conjunction with more firm, in Fig. 1, pass through two spacer blocks 61 and 62 with mode heat sink and that two pins is separated between pin 4 and the carrier 1, increased the external force resistance effect of support significantly.
Shown in Fig. 4 to 8, the spectrophotometric test portion 44 of each pin 4 of the present invention can be the complete body of a bulk, and perhaps shown in Figs. 9 to 11, spectrophotometric test portion 44 comprises spectrophotometric test two bulks and separate district 441 and 442.Spectrophotometric test district 441 all is connected with weld part 43 with 442 bottom.It mainly is to change two pins structure originally into four pin configuration that spectrophotometric test district 441 and 442 is set, and when the SMT paster, weld part 43 and spectrophotometric test portion 44 are by tin cream and pcb board seam.If spectrophotometric test portion 44 is for being set to a monoblock, its SMT mounts precision and can be lower than spectrophotometric test portion 44 and be set to two separate spectrophotometric test districts 441 and 442 mode so.Spectrophotometric test portion 44 is set to two separate spectrophotometric test districts 441 and 442 mode, when increasing bonding area and area of dissipation, improves welding accuracy and the reliability of LED.
Embodiment 2:
On the basis of embodiment 1 described led support structure, the invention also discloses a kind of LED with above-mentioned led support structure.
LED in a kind of execution mode comprises led support and led chip.Led support comprises two pins and has the carrier of cavity, the bottom of this cavity is provided with two metal areas, be respectively crystal bonding area and wire welding area, led chip is fixedly on the crystal bonding area, each pin includes the metal area connecting portion that links to each other successively, rake, weld part and spectrophotometric test portion, the metal area connecting portion is laid on a metal area below and extends horizontally to cavity bottom and the corresponding end of this metal area, rake exposes carrier after an end of cavity bottom passes carrier inclined extension the back side, weld part is bent to form the spectrophotometric test portion that is attached to this end face along the back side of carrier behind the corresponding end face horizontal-extending of carrier.
Further; this LED also comprises the protection diode with the led chip reverse parallel connection; the protection diode is fixed on the wire welding area; crystal bonding area and wire welding area are two ends separate and that lay respectively at cavity bottom, and the area of crystal bonding area is greater than the area of wire welding area and greater than half of cavity bottom area.
Above content be in conjunction with concrete execution mode to further describing that the present invention does, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. led support, comprise two pins (4) and have the carrier (1) of cavity (2), it is characterized in that, described cavity (2) bottom is provided with two metal areas, described pin is laminar, each pin (4) includes the metal area connecting portion (41) that links to each other successively, rake (42), weld part (43) and spectrophotometric test portion (44), described metal area connecting portion (41) is laid on a metal area below and extends horizontally to described cavity (2) bottom and the corresponding end of this metal area, described rake (42) passes the back side of exposing described carrier (1) after described carrier (1) tilts to extend from an end of described cavity (2) bottom, and described weld part (43) is bent to form the spectrophotometric test portion (44) that is attached to this end face along the back side of described carrier (1) behind the corresponding end face horizontal-extending of described carrier (1).
2. led support as claimed in claim 1 is characterized in that, described metal area connecting portion (41) is laid on a described metal area below and one-body molded with this metal area.
3. led support as claimed in claim 1, it is characterized in that, described metal area comprises separate and lays respectively at crystal bonding area (31) and the wire welding area (32) at two ends, described cavity (2) bottom, and the area of described crystal bonding area (31) is greater than the area of described wire welding area (32) and greater than half of described cavity (2) base area.
4. as each described led support in the claim 1 to 3, it is characterized in that described rake (42) forms 100 °～160 ° angle with described metal area connecting portion (41).
5. as each described led support in the claim 1 to 3, it is characterized in that, the back side of the described carrier of at least part of protrusion of described weld part (43) (1), and protrusion height is 0.03～0.15mm.
6. as each described led support in the claim 1 to 3, it is characterized in that the length of described weld part (43) is 0.3～2.0mm.
7. as each described led support in the claim 1 to 3, it is characterized in that the height of described spectrophotometric test portion (44) is more than or equal to 0.4mm.
8. as each described led support in the claim 1 to 3, it is characterized in that, described spectrophotometric test portion (44) comprises two separate spectrophotometric test districts (441,442), and described two spectrophotometric test districts (441,442) all are connected with described weld part (43).
9. LED, comprise led support and led chip, described led support comprises two pins (4) and has the carrier (1) of cavity (2), it is characterized in that, the bottom of described cavity (2) is provided with two metal areas, be respectively crystal bonding area (31) and wire welding area (32), described led chip is fixed on described crystal bonding area (31); Each pin (4) includes the metal area connecting portion (41) that links to each other successively, rake (42), weld part (43) and spectrophotometric test portion (44), described metal area connecting portion (41) is laid on a metal area below and extends horizontally to described cavity (2) bottom and the corresponding end of this metal area, described rake (42) passes the back side of exposing described carrier (1) after described carrier (1) tilts to extend from an end of described cavity (2) bottom, and described weld part (43) is bent to form the spectrophotometric test portion (44) that is attached to this end face along the back side of described carrier (1) behind the corresponding end face horizontal-extending of described carrier (1).
10. LED as claimed in claim 9, it is characterized in that, also comprise the protection diode with described led chip reverse parallel connection, described protection diode is fixed on described wire welding area (32), and described crystal bonding area (31) and wire welding area (32) are separate and lay respectively at the two ends of described cavity (2) bottom; The area of described crystal bonding area (31) is greater than described wire welding area (32) and greater than half of described cavity (2) bottom area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110115645 CN102185086B (en) | 2011-05-05 | 2011-05-05 | Light emitting diode (LED) bracket and LED with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110115645 CN102185086B (en) | 2011-05-05 | 2011-05-05 | Light emitting diode (LED) bracket and LED with same |
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| CN102185086A CN102185086A (en) | 2011-09-14 |
| CN102185086B true CN102185086B (en) | 2013-07-10 |
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| CN 201110115645 Active CN102185086B (en) | 2011-05-05 | 2011-05-05 | Light emitting diode (LED) bracket and LED with same |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102306697A (en) * | 2011-09-29 | 2012-01-04 | 昆山市华英精密模具工业有限公司 | Ultra-thin-type LED (light emitting diode) support with heat-radiation bottom |
| WO2013181896A1 (en) * | 2012-06-06 | 2013-12-12 | 深圳雷曼光电科技股份有限公司 | Led bracket for surface mounting, manufacturing method thereof and led lamp |
| CN102723428A (en) * | 2012-06-26 | 2012-10-10 | 田茂福 | Surface-mounted LED (Light-Emitting Diode) bracket and manufacturing method thereof |
| CN102820409A (en) * | 2012-08-13 | 2012-12-12 | 深圳市灏天光电有限公司 | High-power LED (Light Emitting Diode) bracket and high-power LED packaging structure |
| CN204879503U (en) * | 2014-11-19 | 2015-12-16 | 史伯梅 | LED support and LED luminescence unit |
| CN105514255B (en) * | 2015-12-31 | 2018-04-17 | 东莞市翔光光电科技有限公司 | Heavy plate type radiator LED support |
| CN113054081A (en) * | 2021-03-31 | 2021-06-29 | 佛山市国星光电股份有限公司 | LED support, support array, light-emitting device and backlight module |
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| US5339132A (en) * | 1991-07-16 | 1994-08-16 | Fujitsu Isotec Limited | Mount structure of a light emitting element array in electronic photographic apparatus |
| CN201117674Y (en) * | 2007-10-10 | 2008-09-17 | 李学霖 | Multifunctional LED bracket |
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| EP2169259A1 (en) * | 2008-09-26 | 2010-03-31 | Søren Lenander | Suspension and mounting bracket for suspension and securing strap, designed for suspension and mounting of various items |
| CN202034413U (en) * | 2011-05-05 | 2011-11-09 | 深圳市聚飞光电股份有限公司 | Light-emitting diode (LED) support and LED with same |
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2011
- 2011-05-05 CN CN 201110115645 patent/CN102185086B/en active Active
Patent Citations (5)
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| US5339132A (en) * | 1991-07-16 | 1994-08-16 | Fujitsu Isotec Limited | Mount structure of a light emitting element array in electronic photographic apparatus |
| CN201117674Y (en) * | 2007-10-10 | 2008-09-17 | 李学霖 | Multifunctional LED bracket |
| EP2169259A1 (en) * | 2008-09-26 | 2010-03-31 | Søren Lenander | Suspension and mounting bracket for suspension and securing strap, designed for suspension and mounting of various items |
| CN201293282Y (en) * | 2008-11-03 | 2009-08-19 | 弘凯光电(深圳)有限公司 | LED support and LED luminous structure |
| CN202034413U (en) * | 2011-05-05 | 2011-11-09 | 深圳市聚飞光电股份有限公司 | Light-emitting diode (LED) support and LED with same |
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| CN102185086A (en) | 2011-09-14 |
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Denomination of invention: The invention relates to an LED support and an LED with the support Effective date of registration: 20211110 Granted publication date: 20130710 Pledgee: Shenzhen Gaoxin Investment microfinance Co., Ltd Pledgor: Shenzhen Jufei photoelectric Co., Ltd Registration number: Y2021980012255 |
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