CN212571695U - Light source device and light source module - Google Patents
Light source device and light source module Download PDFInfo
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- CN212571695U CN212571695U CN202021665314.0U CN202021665314U CN212571695U CN 212571695 U CN212571695 U CN 212571695U CN 202021665314 U CN202021665314 U CN 202021665314U CN 212571695 U CN212571695 U CN 212571695U
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Abstract
The utility model discloses a light source device and light source module, light source device contains: the light emitting device comprises a substrate, an upper electrode layer arranged on the substrate, and a plurality of light emitting units arranged on the upper electrode layer. The light emitting units are arranged in M rows along a first direction and in N columns along a second direction at intervals, and M and N are positive integers larger than 1. The plurality of light emitting cells of any one row are electrically connected in parallel to each other through the upper electrode layer, and the plurality of light emitting cells of any one column are electrically connected in series to each other through the upper electrode layer. Accordingly, the light source device enables the plurality of light emitting units to be arranged in a matrix shape through the upper electrode layer, and the light emitting units are electrically connected in series and in parallel at the same time, so that the past technical bias is broken through, and the light source device can be suitable for more different requirements. Accordingly, the light source device enables the plurality of light emitting units to be arranged in a matrix shape through the upper electrode layer and to be electrically connected in series and in parallel at the same time, so as to break through the past technical bias.
Description
Technical Field
The present invention relates to a light source device, and more particularly to a light source device and a light source module having a plurality of light emitting units connected in series and parallel.
Background
The three-dimensional (3D) sensing market has risen very rapidly, however, the existing light source devices have not been able to meet the requirements of today. Therefore, the inventor thinks that the above-mentioned defects can be improved, and the inventor is careful to study and cooperate with the application of scientific principles, and finally proposes a reasonable design and the utility model which can effectively improve the above-mentioned defects.
SUMMERY OF THE UTILITY MODEL
An embodiment of the present invention provides a light source device and a light source module, which can effectively improve the defects possibly generated by the existing light source device.
The embodiment of the utility model discloses light source device, include: a substrate including a first plate surface and a second plate surface on opposite sides; the upper electrode layer is arranged on the first plate surface of the substrate; and a plurality of light emitting units mounted on the upper electrode layer; the light-emitting units are arranged in M rows along a first direction at intervals and in N columns along a second direction, and M and N are positive integers larger than 1; the plurality of light emitting units in any row are electrically connected in parallel through the upper electrode layer, and the plurality of light emitting units in any column are electrically connected in series through the upper electrode layer.
Preferably, the upper electrode layer includes a plurality of metal pads disposed at intervals and arranged along the second direction, the plurality of metal pads includes: the first metal pad is provided with a first welding pad area and a plurality of first die bonding areas connected with the first welding pad area, and the plurality of first die bonding areas of the first metal pad respectively bear a plurality of light-emitting units in one row; and the second metal pad is provided with a second welding pad area and a plurality of second routing areas connected with the second welding pad area, and the plurality of second routing areas of the second metal pad are connected with the plurality of light-emitting units in one row through routing.
Preferably, the light source device includes a plurality of solder pads disposed on the first metal pad and the second metal pad, and the solder pads are respectively located at a boundary between the first solder pad area and the first die attach areas and a boundary between the second solder pad area and the second wire bond areas.
Preferably, the plurality of metal pads includes at least one third metal pad located between the first metal pad and the second metal pad, and includes an extension region, a plurality of third die attach regions connected to one side of the extension region and facing the second pad region, and a plurality of third wire bonding regions connected to the other side of the extension region and facing the first pad region, and the shape of the at least one third metal pad is complementary to the shape of the first metal pad and the second metal pad.
Preferably, the plurality of first solid crystal regions and the plurality of third solid crystal regions are located in a space surrounded by the second metal pad or at least one third metal pad, and a U-shaped gap can be formed between each first solid crystal region and each third solid crystal region and the adjacent second metal pad or at least one third metal pad.
Preferably, the first bonding pad area and the second bonding pad area are rectangular, the length direction of the first bonding pad area and the length direction of the second bonding pad area are parallel to the first direction, each first die bonding area and each second wire bonding area are rectangular, each first die bonding area is vertically connected with the first bonding pad area, and each second wire bonding area is vertically connected with the second bonding pad area.
Preferably, the light source device further includes a lower electrode layer disposed on the second plate surface, and a plurality of conductive pillars embedded in the substrate; the two ends of any conductive column are respectively connected with the upper electrode layer and the lower electrode layer, so that the upper electrode layer and the lower electrode layer are electrically connected with each other.
Preferably, a space is left between two adjacent light emitting units in any one row in the first direction, and the width of any one light emitting unit in the first direction is not less than the space.
Preferably, the first direction is perpendicular to the second direction, M is not less than N, and each of the light emitting cells is further defined as a vertical cavity surface emitting laser.
The embodiment of the utility model discloses light source module, include: the light source device as described above; and the light source device is arranged on the circuit board, a hole is formed in the circuit board, the hole is in a penetrating shape or a blind hole shape, the upper electrode layer is electrically coupled to the circuit board through the first bonding pad area and the second bonding pad area, and at least part of the substrate and the plurality of light-emitting units are positioned in the hole.
To sum up, the embodiment of the utility model provides a disclosed light source device and light source module, it passes through it makes a plurality ofly to go up the electrode layer luminous element can be the matrix form and arrange and electric property series connection and electric property are parallelly connected simultaneously to break through past technical bias, and then can be applicable to the requirement of more differences.
For a further understanding of the features and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are only intended to illustrate the present invention, and not to limit the scope of the present invention.
Drawings
Fig. 1 is a schematic perspective view of a light source device according to a first embodiment of the present invention.
Fig. 2 is an exploded view of fig. 1.
Fig. 3 is a schematic top view of fig. 1.
Fig. 4 is a schematic view of a variation of fig. 1.
Fig. 5 is a schematic perspective view of a light source device according to a second embodiment of the present invention.
Fig. 6 is a schematic view (a) illustrating the external connection of the three light source devices according to the embodiment of the present invention.
Fig. 7 is a schematic view (two) illustrating the external connection of the three light source devices according to the embodiment of the present invention.
Fig. 8 is a schematic view (iii) illustrating the external connection of the three light source devices according to the embodiment of the present invention.
Detailed Description
The following description is provided for the embodiments of the "light source device and light source module" disclosed in the present invention by specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present invention. The present invention may be practiced or carried out in other different embodiments, and various modifications and changes may be made in the details of this description based on the different points of view and applications without departing from the spirit of the present invention. The drawings of the present invention are merely schematic illustrations, and are not drawn to scale, but are described in advance. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
[ example one ]
Please refer to fig. 1 to 4, which illustrate a first embodiment of the present invention. The present embodiment discloses a light source device 100, and particularly relates to a light source device 100 applied to various types of optical radars (e.g., an unmanned aerial vehicle radar, a sweeping robot radar, or a three-dimensional scanning radar), but the present invention is not limited thereto. When the light source device 100 is applied to the optical radar (not shown), the light source device 100 of the present embodiment can be accurately configured to an optical component (such as a collimating lens, a diffractive optical lens, or a diffuser) through its precise structural design, so that the optical radar has a better precision.
As shown in fig. 1 to 3, the light source device 100 includes a substrate 1, an upper electrode layer 2 disposed on the substrate 1, a plurality of solder pads 3 disposed on the upper electrode layer 2, and a plurality of light emitting units 4 mounted on the upper electrode layer 2. It should be noted that a plurality of the light emitting cells 4 are arranged in M rows along a first direction D1 and N columns along a second direction D2 at intervals, where M and N are positive integers greater than 1. Wherein the first direction D1 is preferably perpendicular to the second direction D2, and M is not less than N. In the embodiment, M is 3 and N is 2, but the present invention is not limited thereto.
In the present embodiment, the substrate 1 is illustrated as a ceramic plate, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the substrate 1 may also be a plastic plate. Furthermore, the substrate 1 includes a first board surface 11 and a second board surface 12 located on opposite sides, the upper electrode layer 2 is disposed on the first board surface 11 of the substrate 1, and the upper electrode layer 2 includes a plurality of metal pads 20 disposed at intervals and arranged along the second direction D2.
More specifically, the metal pads 20 substantially cover at least 70% of the area of the first board surface 11, and the metal pads 20 in this embodiment include a first metal pad 21, a second metal pad 22, and two third metal pads 23 located between the first metal pad 21 and the second metal pad 22. The two third metal pads 23 are respectively adjacent to the first metal pad 21 and the second metal pad 22, and the first metal pad 21, the second metal pad 22, and the two third metal pads 23 are in complementary shapes along the second direction D2 in this embodiment, but the invention is not limited thereto.
The first metal pad 21 has a first pad area 211 and a plurality of first die attach areas 212 (e.g., two first die attach areas 212 in this embodiment) connected to the first pad area 211. In the present embodiment, the first pad area 211 is rectangular and the length direction thereof is parallel to the first direction D1, each first die attach area 212 is also rectangular and is vertically connected to the first pad area 211, and the first die attach areas 212 are spaced apart from each other along the first direction D1. Furthermore, each of the first die bonding regions 212 can be used to connect one of the light emitting units 4.
The second metal pad 22 has a second pad area 221 and a plurality of second wire bonding areas 222 (e.g., three second wire bonding areas 222 in this embodiment) connected to the second pad area 221. In the present embodiment, the second pad area 221 is rectangular and the length direction thereof is parallel to the first direction D1, each of the second wire bonding areas 222 is also rectangular and is vertically connected to the second pad area 221, and the plurality of second wire bonding areas 222 are disposed at intervals along the first direction D1.
Since the configurations of the plurality of third metal pads 23 are substantially the same in the present embodiment, the configuration of a single third metal pad 23 will be described, and then the connection relationship between the third metal pad 23 and other components will be described. The third metal pad 23 includes an extension region 231, a plurality of third die attach regions 232 (e.g., two third die attach regions 232 in this embodiment) connected to one side of the extension region 231 and facing the second pad region 221, and a plurality of third wire bonding regions 233 (e.g., three third wire bonding regions 233 in this embodiment) connected to the other side of the extension region 231 and facing the first pad region 211.
In this embodiment, the extension area 231 is rectangular and the length direction thereof is parallel to the first direction D1, and the length of the extension area 231 is substantially equal to the length of the first pad area 211 and also substantially equal to the length of the second pad area 221. Furthermore, the third die bonding regions 232 and the third wire bonding regions 233 are vertically connected to the extension region 231, and the third die bonding regions 232 and the third wire bonding regions 233 are respectively connected to different sections of the extension region 231 separated along the first direction D1. Furthermore, each of the third die bonding regions 232 can be used to connect one of the light emitting units 4.
Furthermore, in the first metal pad 21 and the third metal pad 23 adjacent to the first metal pad 21, the plurality of first die bonding regions 212 are located in a space surrounded by the third metal pad 23 (i.e., in a space surrounded by the extension region 231 and the plurality of third wire bonding regions 233), so that one first die bonding region 212 is disposed between any two third wire bonding regions 233. In other words, a U-shaped gap can be formed between each first die bonding region 212 and the adjacent third metal pad 23.
In the second metal pad 22 and the third metal pad 23 adjacent to the second metal pad 22, the third die attach regions 232 are located in a space surrounded by the second pad region 221 and the second wire attach regions 222, so that one third die attach region 232 is disposed between any two second wire attach regions 222. In other words, each of the third die attach regions 232 can form a U-shaped gap with the adjacent second metal pad 22.
In two adjacent third metal pads 23, the third die bonding regions 232 of one of the third metal pads 23 are located in a space surrounded by the extension region 231 and the third wire bonding regions 233 of the other of the third metal pads 23. In other words, each of the third die attach regions 232 of one of the third metal pads 23 can form a U-shaped gap with another portion of the third metal pad 23 adjacent to and surrounding the outside of the third metal pad.
The first solid crystal regions 212 and the third solid crystal regions 232 are arranged in M rows along the first direction D1 and N columns along the second direction D2 at intervals from each other, as viewed from the entire upper electrode layer 2; the second wire bonding regions 222 and the third wire bonding regions 233 are spaced apart from each other and arranged in M rows along the first direction D1 and N +1 columns along the second direction D2.
The solder mask pads 3 are disposed on the first metal pad 21 and the second metal pad 22, and the solder mask pads 3 are respectively located at a boundary between the first solder pad area 211 and the first die attach areas 212 and a boundary between the second solder pad area 221 and the second wire bonding areas 222. In this embodiment, the solder pads 3 are disposed on the first die bonding areas 212 adjacent to the first bonding pad area 211 and the second wire bonding areas 222 adjacent to the second bonding pad area 221, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, a plurality of the solder pads 3 may be disposed on the first pad areas 211 adjacent to the first die bonding areas 212 and the second pad areas 221 adjacent to the second wire bonding areas 222; alternatively, a plurality of the anti-soldering pads 3 can be omitted according to design requirements.
Accordingly, when the first bonding pad area 211 and the second bonding pad area 221 of the light source device 100 are connected to an electronic component by a connecting member (not shown), such as conductive paste or solder, the plurality of anti-bonding pads 3 can be used to prevent the connecting member from spreading to the adjacent first die bonding area 212 or the adjacent second wire bonding area 222.
In the present embodiment, each of the light emitting units 4 is illustrated as a Vertical Cavity Surface Emitting Laser (VCSEL), but the present invention is not limited thereto. In the present embodiment, the light emitting units 4 in any row are die-bonded in one of the die bonding areas (i.e., the first die bonding area 212 and the third die bonding area 232) and wire-bonded to the adjacent wire bonding areas (i.e., the second wire bonding area 222 and the third wire bonding area 233), so that the light emitting units 4 in any row are electrically connected in parallel through the upper electrode layer 2, and the light emitting units 4 in any column are electrically connected in series through the upper electrode layer 2.
In more detail, the first die attach regions 212 of the first metal pad 21 respectively support the light emitting cells 4 in one row, and the third die attach regions 232 of any one of the third metal pads 23 respectively support the light emitting cells 4 in another row. Furthermore, the second wire bonding regions 222 of the second metal pad 22 are connected to the light emitting units 4 in one row by wire bonding, and the third wire bonding regions 233 of any one of the third metal pads 23 are connected to the light emitting units 4 in another row by wire bonding.
In this embodiment, a gap Ga is left between two adjacent light emitting cells 4 in any row in the first direction D1, and the width Wa of any one of the light emitting cells 4 in the first direction D1 is not less than the gap Ga. Furthermore, a pitch Gb is left between two adjacent light emitting cells 4 in any one row in the second direction D2, and a width Wb of any one of the light emitting cells 4 in the second direction D2 is not smaller than the pitch Gb.
As mentioned above, the light source device 100 of the present embodiment can make the plurality of light emitting units 4 arranged in a matrix shape and electrically connected in series and in parallel through the upper electrode layer 2, so as to break through the past technical bias and further adapt to more different requirements. Further, in the present embodiment, the light source device 100 is designed by the structure of the upper electrode layer 2, so that the plurality of light emitting units 4 can be precisely matched with the corresponding metal pads 20, and thus, the light source device is favorable for being accurately matched with optical components in an optical radar, and the optical radar has better precision.
In addition, the light source device 100 shown in fig. 1 is a structure where M is 3 and N is 2, but it can be adjusted and varied according to design requirements. For example, the light source device 100 shown in fig. 4 belongs to a configuration in which M is 2 and N is 2. In addition, in other embodiments not shown in the present invention, M may be greater than 2 and N may also be greater than 2. In other words, the number of the third metal pads 23 of the upper electrode layer 2 may be at least one.
Furthermore, in the present embodiment, the upper electrode layer 2 is formed by matching the first metal pad 21 and the second metal pad 22 with at least one third metal pad 23 to realize electrical series connection and electrical parallel connection of a plurality of light emitting units 4, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the structure of the first metal pad 21 and the second metal pad 22 can be changed or adjusted according to design requirements for the upper electrode layer 2, so as to realize the electrical series connection and the electrical parallel connection of the plurality of light emitting units 4, and further omit the third metal pad 23.
[ example two ]
Please refer to fig. 5, which illustrates a second embodiment of the present invention. Since this embodiment is similar to the first embodiment, the same parts of the two embodiments are not described again, and the differences between this embodiment and the first embodiment are roughly described as follows:
in this embodiment, the light source device 100 further includes a lower electrode layer 5 disposed on the second plate surface 12, and a plurality of conductive pillars 6 embedded in the substrate 1. Two ends of any one of the conductive posts 6 are respectively connected to the upper electrode layer 2 and the lower electrode layer 5, so that the upper electrode layer 2 and the lower electrode layer 5 are electrically connected to each other.
In more detail, the bottom electrode layer 5 includes two electrode pads 51 with different polarities, and the two electrode pads 51 are electrically coupled to the first metal pad 21 and the second metal pad 22 through the plurality of conductive pillars 6, respectively.
[ third example ]
Please refer to fig. 6 to 8, which are schematic views illustrating the external connection of the light source device 100 according to the present invention. The present embodiment discloses a light source module, which includes the light source device 100 according to the first embodiment or the second embodiment and a circuit board 7. The light source device 100 is mounted on a circuit board 7, and the circuit board 7 is formed with a hole 71. The upper electrode layer 2 is electrically coupled to the circuit board 7 through the first pad area 211 and the second pad area 221, and at least a portion of the substrate 1 and the plurality of light emitting units 4 are located in the holes 71.
In more detail, as shown in fig. 6, the hole 71 of the circuit board 7 may be through-shaped, the upper electrode layer 2 is soldered to the circuit board 7 by the first pad area 211 and the second pad area 221, and the light emitting units 4 are located in the hole 71. Alternatively, as shown in fig. 7 of this embodiment, the hole 71 of the circuit board 7 may be a blind hole, the substrate 1 is located in the hole 71, the upper electrode layer 2 is wire-bonded to the circuit board 7 through the first pad area 211 and the second pad area 221, and the plurality of light emitting units 4 are located outside the hole 71. Alternatively, as shown in fig. 8 of the present embodiment, the light source device 100 is connected to the circuit board 7 through the two electrode pads 51 of the lower electrode layer 5.
[ technical effects of the embodiments of the present invention ]
To sum up, the embodiment of the utility model provides a disclosed light source device and light source module, it passes through it makes a plurality ofly to go up the electrode layer luminous element can be the matrix form and arrange and electric property series connection and electric property are parallelly connected simultaneously to break through past technical bias, and then can be applicable to the requirement of more differences. Furthermore, the light source device in this embodiment is designed by the structure of the upper electrode layer, so that the plurality of light emitting units can be precisely matched with the corresponding metal pads, thereby facilitating accurate matching of optical components in the optical radar, and further enabling the optical radar to have better accuracy.
Furthermore, when the first pad area and the second pad area of the light source device disclosed in the embodiments of the present invention are connected to an electronic component by a connecting member (e.g., conductive adhesive or solder), the plurality of anti-pads can be used to prevent the connecting member from spreading to the adjacent light emitting unit or the adjacent third metal pad.
In addition, the embodiment of the present invention discloses a light source device, wherein the second plate surface of the substrate is provided with an electrical coupling to the lower electrode layer of the upper electrode layer, so that the light source device can be selectively connected to the electronic component by the upper electrode layer or the lower electrode layer according to the user's requirement.
The above disclosure is only a preferred and practical embodiment of the present invention, and is not intended to limit the scope of the present invention, so all the modifications of the equivalent technology made by the disclosure and drawings are included in the scope of the present invention.
Claims (10)
1. A light source device, characterized in that the light source device comprises:
a substrate including a first plate surface and a second plate surface on opposite sides;
the upper electrode layer is arranged on the first plate surface of the substrate; and
a plurality of light emitting cells mounted on the upper electrode layer; the light-emitting units are arranged in M rows along a first direction at intervals and in N columns along a second direction, and M and N are positive integers larger than 1;
the light emitting units in any row are electrically connected in parallel through the upper electrode layer, and the light emitting units in any column are electrically connected in series through the upper electrode layer.
2. The light source device of claim 1, wherein the top electrode layer comprises a plurality of metal pads spaced apart from each other and arranged along the second direction, the plurality of metal pads comprising:
the first metal pad is provided with a first bonding pad area and a plurality of first die attach areas connected with the first bonding pad area, and the first die attach areas of the first metal pad respectively bear a plurality of light emitting units in one row; and
and the second metal pad is provided with a second bonding pad area and a plurality of second routing areas connected with the second bonding pad area, and the second routing areas of the second metal pad are connected with the plurality of light-emitting units in one row through routing.
3. The light source device of claim 2, wherein the light source device comprises a plurality of solder pads disposed on the first metal pad and the second metal pad, and the solder pads are respectively located at a boundary between the first pad area and the first die attach areas and a boundary between the second pad area and the second wire attach areas.
4. The light source device as claimed in claim 2, wherein the plurality of metal pads includes at least one third metal pad located between the first metal pad and the second metal pad, and including an extension region, a plurality of third die attach regions connected to one side of the extension region and facing the second pad region, and a plurality of third wire bonding regions connected to the other side of the extension region and facing the first pad region, wherein a shape of the at least one third metal pad is complementary to a shape of the first metal pad and a shape of the second metal pad.
5. The light source device according to claim 4, wherein a plurality of the first die bonding regions and a plurality of the third die bonding regions are located in a space surrounded by the second metal pad or at least one of the third metal pads, and a U-shaped gap is formed between each of the first die bonding regions and each of the third die bonding regions and the adjacent second metal pad or at least one of the third metal pads.
6. The light source device according to claim 2, wherein the first pad area and the second pad area are each rectangular, and a length direction of the first pad area and a length direction of the second pad area are parallel to the first direction, each of the first die attach areas and each of the second wire attach areas are each rectangular, and each of the first die attach areas is vertically connected to the first pad area, and each of the second wire attach areas is vertically connected to the second pad area.
7. The light source device according to claim 1, further comprising a bottom electrode layer disposed on the second plate surface, and a plurality of conductive pillars embedded in the substrate; two ends of any one of the conductive columns are respectively connected to the upper electrode layer and the lower electrode layer, so that the upper electrode layer and the lower electrode layer are electrically connected with each other.
8. The light source device according to claim 1, wherein a space is left between two adjacent light emitting units in any one row in the first direction, and a width of any one of the light emitting units in the first direction is not smaller than the space.
9. The light source device according to claim 1, wherein the first direction is perpendicular to the second direction, M is not less than N, and each of the light emitting cells is further defined as a vertical cavity surface emitting laser.
10. A light source module, comprising:
the light source device of claim 2; and
the light source device is arranged on the circuit board, a hole is formed in the circuit board, the hole is in a penetrating shape or a blind hole shape, the upper electrode layer is electrically coupled to the circuit board through the first bonding pad area and the second bonding pad area, and at least part of the substrate and the plurality of light-emitting units are located in the hole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| US201962892396P | 2019-08-27 | 2019-08-27 | |
| US62/892,396 | 2019-08-27 |
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| CN212571695U true CN212571695U (en) | 2021-02-19 |
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| CN202021665314.0U Active CN212571695U (en) | 2019-08-27 | 2020-08-11 | Light source device and light source module |
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