CN215342579U - LED display unit, LED display assembly and LED display screen - Google Patents

Abstract

The utility model relates to the technical field of display screens, in particular to an LED display unit, an LED display assembly and an LED display screen. The LED display unit comprises an LED drive IC, a first conductive substrate, at least one second conductive substrate and LED light-emitting chips, wherein all the second conductive substrates are arranged at intervals with the first conductive substrate respectively, the LED drive IC is arranged on the first conductive substrate, the LED light-emitting chips are arranged on the second conductive substrate respectively, and the LED drive IC is connected with the LED light-emitting chips. The LED display unit avoids the use of a PCB, and the first conductive substrate and the second conductive substrate are used as carriers, so that the cost is reduced; the LED driving IC and the LED light-emitting chip are prevented from being simultaneously mounted on the same PCB, so that crossed wiring caused by the fact that the LED driving IC and the LED light-emitting chip are mounted on the same PCB is avoided, the separation of current wiring and data wiring is realized, and the wiring is more regular; compared with the LED driving IC and the LED light-emitting chip which are simultaneously arranged on the same conductive substrate, the width of the conductive substrate is narrower, and the overall permeability of the LED display unit is better.

Description

LED display unit, LED display assembly and LED display screen

Technical Field

The utility model relates to the technical field of display screens, in particular to an LED display unit, an LED display assembly and an LED display screen.

Background

In the existing grating screen, at present, most of the LED display units are assembled in a cob (chip On board) mode, each display unit includes a PCB board, and an LED light emitting chip and an LED driving chip fixed On the PCB board, the light emitting chip and the driving chip are welded On the PCB board, and the wiring inside the PCB board is complex and the cost is relatively high.

SUMMERY OF THE UTILITY MODEL

The utility model solves the technical problem of overhigh cost caused by adopting a PCB to install a light-emitting chip and a driving chip.

In order to solve the above problems, the present invention provides an LED display unit, which includes an LED driver IC, a first conductive substrate, at least one second conductive substrate, and LED light emitting chips, wherein all the second conductive substrates are respectively disposed at intervals from the first conductive substrate, the LED driver IC is disposed on the first conductive substrate, the LED light emitting chips are respectively disposed on the second conductive substrates, and the LED driver IC is connected to the LED light emitting chips.

Optionally, the display device further comprises an insulating transparent substrate, wherein the first conductive base and the second conductive base are mounted on the insulating transparent substrate, and the first conductive base and all the second conductive bases partially cover the insulating transparent substrate.

Optionally, there are two second conductive substrates, each of the first conductive substrate and the second conductive substrate is a strip structure, the first conductive substrate and the second conductive substrate are parallel to each other, and the first conductive substrate is located between the two second conductive substrates.

Optionally, the VDD pin and the GND pin of the LED driver IC are respectively connected to the two second conductive substrates, and the data input pin of the LED driver IC is connected to the first conductive substrate.

Optionally, a plurality of the LED light emitting chips are disposed along a length direction of the second conductive base.

Optionally, the LED light emitting chip includes a red light emitting chip, a green light emitting chip, and a blue light emitting chip, the green light emitting chip, the red light emitting chip, and the blue light emitting chip are disposed along a length direction of the second conductive substrate, and the green light emitting chip, the red light emitting chip, and the blue light emitting chip are respectively connected to the LED driver IC.

Optionally, the red light emitting chip is located between the green light emitting chip and the blue light emitting chip, the green light emitting chip and the blue light emitting chip adopt a double-electrode light emitting chip, the red light emitting chip adopts a single-electrode light emitting chip, a position where the green light emitting chip is electrically connected with the second conductive base is located on a side where the green light emitting chip is far away from the blue light emitting chip, and a position where the blue light emitting chip is electrically connected with the second conductive base is located on a side where the blue light emitting chip is far away from the green light emitting chip.

Optionally, the LED driver IC is an unpackaged bare die.

Optionally, the LED lighting device further comprises an insulating glue structure, the LED lighting chip is connected to the second conductive substrate through the insulating glue structure, and the LED driver IC is connected to the first conductive substrate through the insulating glue structure.

Optionally, the insulating transparent substrate is made of glass, silica gel, resin, PVC, PC, PE, or acryl.

Optionally, the insulating transparent substrate is provided with a plurality of grooves, and the second conductive substrate or the first conductive substrate is at least partially accommodated in the grooves respectively.

Optionally, the thickness of the LED light emitting chip is greater than or equal to the thickness of the LED driving IC.

Optionally, the distance between the first conductive base and the second conductive base is twice the minimum distance between the second conductive base and the width-direction edge of the insulating transparent substrate.

Optionally, the light emitting diode further comprises a transparent encapsulating adhesive layer, the transparent encapsulating adhesive layer is connected with the insulating transparent substrate, the transparent encapsulating adhesive layer covers the surfaces of the LED light emitting chip and the LED drive IC, and two ends of the first conductive base body and two ends of the second conductive base body are respectively exposed out of the transparent encapsulating adhesive layer.

Optionally, the insulating transparent substrate further includes a substrate body and two protruding structures, the protruding structures are respectively disposed at the edge of the substrate body, the protruding structures are disposed along the length direction of the substrate body, and the transparent potting adhesive layer is located between the protruding structures.

Optionally, the material of the transparent encapsulating glue layer has the same refractive index as the insulating transparent base material.

Compared with the prior art, the LED display unit has the beneficial effects that:

the LED display unit avoids the use of a PCB, the LED driving IC and the LED light-emitting chip are respectively arranged on the first conductive substrate and the second conductive substrate, the light-emitting control of the LED light-emitting chip is realized through the LED driving IC, and the first conductive substrate and the second conductive substrate are used as carriers, so that the cost is reduced; the LED driving IC and the LED light-emitting chip can be prevented from being simultaneously arranged on the same PCB, so that crossed wiring caused by the fact that the LED driving IC and the LED light-emitting chip are arranged on the same PCB can be avoided, and wiring of the LED display unit can be simplified. In addition, all the second conductive substrates are respectively arranged at intervals with the first conductive substrates, so that short circuit caused by contact of the second conductive substrates and the first conductive substrates is avoided; the separation of current routing and data routing can be realized, so that the routing is more regular; compared with the LED driving IC and the LED light-emitting chip which are simultaneously arranged on the same conductive substrate, the width of the conductive substrate is narrower, and the overall permeability of the LED display unit is better.

The utility model provides an LED display assembly comprising a plurality of LED display units as described in any one of the above. Compared with the prior art, the LED display component is the same as the LED display unit, and the description is omitted here.

Optionally, the LED display units are sequentially connected along a length direction thereof, first conductive substrates adjacent to the LED display units are connected, and second conductive substrates adjacent to the LED display units are connected.

Optionally, the LED display unit has two second conductive substrates, wherein the two second conductive substrates of one of the LED display units are respectively adapted to be connected to a VDD terminal and a ground terminal of a power supply, and the first conductive substrate of one of the LED display units is adapted to be connected to a controller.

The utility model provides an LED display screen which comprises a plurality of LED display components, wherein all the LED display components are arranged along the width direction of the LED display components. Compared with the prior art, the LED display screen is the same as the LED display component, and the description is omitted here.

Optionally, the VDD pin, the GND pin or the data input pin of the LED display units in adjacent LED display assemblies are connected in parallel and/or in series.

Optionally, the LED display module further comprises a transparent sealing layer, and the transparent sealing layer covers all the LED display modules.

Optionally, the material of the transparent sealing layer has the same refractive index as the material of the transparent potting adhesive layer and/or the insulating transparent substrate in the LED display unit.

Drawings

FIG. 1 is a front view of an LED display unit in an embodiment of the present invention;

FIG. 2 is a cross-sectional view of an LED display unit in an embodiment of the present invention;

FIG. 3 is a schematic diagram of an LED display assembly in an embodiment of the utility model;

FIG. 4 is a schematic diagram of an LED display screen in an embodiment of the present invention;

fig. 5 is a cross-sectional view of an LED display screen in an embodiment of the utility model.

Description of reference numerals:

1-an insulating transparent substrate, 2-a second conductive matrix, 3-an LED drive IC, 4-an LED light-emitting chip, 5-a first conductive matrix, 6-a transparent encapsulating adhesive layer, 11-a substrate body, 12-a groove and 13-a bump structure.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description herein, references to the terms "an embodiment," "one embodiment," and "one implementation," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or implementation is included in at least one embodiment or example implementation of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or implementation. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or implementations.

It should also be noted that the Z-axis, Y-axis, and X-axis representations in the drawings are intended only to facilitate the description of the utility model and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must be constructed and operated in a particular orientation and therefore should not be considered as limiting the utility model.

The utility model provides an LED display unit, as shown in fig. 1 and 2, comprising an LED driving IC3, a first conductive substrate 5, at least one second conductive substrate 2 and LED light-emitting chips 4, wherein all the second conductive substrates 2 are respectively arranged at intervals with the first conductive substrate 5, the LED driving IC3 is arranged on the first conductive substrate 5, the LED light-emitting chips 4 are respectively arranged on the second conductive substrate 2, and the LED driving IC3 is connected with the LED light-emitting chips 4.

Specifically, there may be one, two or more second conductive substrates 2, and each of the second conductive substrates 2 is provided with the LED light emitting chip 4. When there are two second conductive substrates 2, the first conductive substrate 5 is located between the two second conductive substrates 2, and a certain gap is left between the first conductive substrate 5 and the second conductive substrate 2. The number of the LED light emitting chips 4 may be one, two or more. Preferably, each of the second conductive substrates 2 is provided with a plurality of LED light emitting chips 4, and the light emission of the plurality of LED light emitting chips 4 is controlled by one LED driving IC 3. Preferably, the LED driver IC3 is an unpackaged bare chip, and an insulating layer is disposed on a surface of the bare chip.

The LED light emitting chip 4 may be a single-color LED light emitting chip or a multi-color LED light emitting chip, and the multi-color LED light emitting chip may include a red light emitting chip, a green light emitting chip, and a blue light emitting chip, or may include a red light emitting chip, a green light emitting chip, a blue light emitting chip, and a white light emitting chip. The LED light-emitting chip 4 and the second conductive substrate 2 can be connected in a binding or routing manner.

The LED driver IC3 may be mounted on the first conductive substrate 5 by bonding or soldering, the LED light emitting chip 4 may be mounted on the second conductive substrate 2 by bonding or soldering, and the LED driver IC3 is in communication connection with the LED light emitting chip 4, so as to control light emission of the LED light emitting chip 4. Here, the communication connection between the LED driver IC3 and the LED light emitting chip 4 can be realized by bonding or wire bonding.

In this embodiment, the first conductive substrate 5 and the second conductive substrate 2 may be made of a metal conductive material or other conductive materials, and the first conductive substrate 5 and the second conductive substrate 2 may have a transparent structure, a semi-transparent structure, or an opaque structure. The first conductive substrate 5 and the second conductive substrate 2 may be made of copper, silver or other materials having relatively high conductivity.

Preferably, the thickness of the LED light emitting chip 4 is greater than or equal to the thickness of the LED driving IC 3. Here, the thickness direction of the LED light emitting chip 4 and the LED driving IC3 is the Z-axis direction in the drawing. When the LED light emitting chip 4 and the LED driving IC3 are mounted on the first conductive substrate 5 and the second conductive substrate 2, respectively, the height of the LED light emitting chip 4 may not be lower than the height of the LED driving IC3, so that the LED light emitting chip 4 may be prevented from being shielded by the LED driving IC 3.

The LED display unit in the embodiment avoids the use of a PCB, the LED drive IC3 and the LED light-emitting chip 4 are respectively mounted on the first conductive substrate 5 and the second conductive substrate 2, the LED drive IC3 is used for realizing the light-emitting control of the LED light-emitting chip 4, and the first conductive substrate 5 and the second conductive substrate 2 are used as carriers, so that the cost is reduced. The crossed wiring caused by simultaneously mounting the LED driver IC3 and the LED light emitting chip 4 on the same PCB can be avoided, and the wiring of the LED display unit can be simplified. In addition, all the second conductive substrates 2 are respectively arranged at intervals with the first conductive substrate 5, so that short circuit caused by contact of the second conductive substrates and the first conductive substrate is avoided; the separation of current routing and data routing can be realized, so that the routing is more regular; compared with the LED drive IC3 and the LED light-emitting chip 4 which are simultaneously arranged on the same conductive substrate, the width of the conductive substrate is narrower, and the overall permeability of the LED display unit is better.

In the prior art, the LED driver IC3 and the LED light emitting chip 4 may also be mounted on a transparent conductive film group, but the resistance of the transparent conductive film is relatively high, and the conductivity of the transparent conductive film is relatively low, in this embodiment, the LED driver IC3 and the LED light emitting chip 4 are respectively mounted on the first conductive substrate 5 and the second conductive substrate 2, the material of the conductive substrates is not limited, and the conductivity of the conductive substrates may be increased by using conductive substrates with relatively low resistance. In addition, as shown in fig. 1 and 2, the LED display unit further includes an insulating transparent substrate 1, the first conductive base 5 and the second conductive base 2 are mounted on the insulating transparent substrate 1, and the first conductive base 5 and all of the second conductive bases 2 partially cover the insulating transparent substrate 1. Here, the insulating transparent substrate 1 is made of a transparent insulating material such as glass, silicone, resin, PVC, PC, PE, or acryl. The first conductive base 5 and the second conductive base 2 can be mounted on the insulating transparent substrate 1 by means of bonding or screw fastening, and after the first conductive base 5 and all the second conductive bases 2 are mounted on the insulating transparent substrate 1, the first conductive base 5 and all the second conductive bases 2 do not completely cover the insulating transparent substrate 1, so that the insulating transparent substrate 1 still has a certain permeability. In one embodiment, the insulating transparent substrate 1 may be obtained by casting, molding, or machining. Thus, the first conductive base 5 and the second conductive base 2 are fixed through the insulating transparent substrate 1, so that the LED driver IC3, the first conductive base 5, the at least one second conductive base 2 and the LED light emitting chip 4 can be modularized together with the insulating transparent substrate 1, and assembly among different LED display units is facilitated.

As shown in fig. 1 and 2, there are two second conductive substrates 2, the first conductive substrate 5 is located between the two second conductive substrates 2, the VDD pin and the GND pin of the LED driver IC3 are respectively connected to the two second conductive substrates 2, and the data input pin of the LED driver IC3 is connected to the first conductive substrate 5.

It should be noted that the LED driver IC3 includes a VDD pin and a GND pin, the VDD pin is electrically connected to a VDD terminal of a power supply through one of the second conductive substrates 2, and the GND pin is electrically connected to a ground terminal through the other second conductive substrate 2. In one embodiment, the LED driver IC3 may have only data input pins, and signal transmission is achieved through the first conductive base 5. In one embodiment, the LED driver IC3 may have data input pins and data output pins, but only the data input pins are connected to the first conductive base 5 and the data output pins may not be connected to other structures.

Therefore, the second conductive substrates 2 are arranged between the two second conductive substrates 2, so that the LED driving IC3 is conveniently connected with the LED light-emitting chips 4 on the two second conductive substrates 2, the space utilization is more reasonable, and the whole volume of the LED display unit is reduced. In addition, the VDD pin and the GND pin of the LED driver IC3 are respectively connected to the two second conductive substrates 2, so that the parallel connection between the adjacent LED light-emitting chips 4 is also realized, and the interference of the single LED light-emitting chip 4 to other LED light-emitting chips due to the damage of the single LED light-emitting chip 4 is avoided.

As shown in fig. 1, the first conductive substrate 5 and the second conductive substrate 2 are both strip-shaped structures, the first conductive substrate 5 and the second conductive substrate 2 are parallel to each other, and the plurality of LED light emitting chips 4 are arranged along the length direction of the second conductive substrate 2. It should be noted that the first conductive substrate 5 and the second conductive substrate 2 have the same length direction, that is, the X-axis direction in the drawing, a strip-shaped gap is formed between the adjacent first conductive substrate 5 and the second conductive substrate 2, the number of the LED light emitting chips 4 is multiple, and at least two LED light emitting chips 4 are disposed on each second conductive substrate 2. Therefore, by arranging the plurality of LED light emitting chips 4 in the longitudinal direction of the second conductive base 2, an increase in the entire width of the second conductive base 2 caused by arranging the plurality of LED light emitting chips 4 in the width direction of the second conductive base 2 is avoided.

As shown in fig. 1, R represents a red light emitting chip, G represents a green light emitting chip, and B represents a blue light emitting chip. The LED light-emitting chip 4 comprises a red light-emitting chip R, a green light-emitting chip G and a blue light-emitting chip B, the green light-emitting chip G, the red light-emitting chip R and the blue light-emitting chip B are arranged along the length direction of the second conductive base body 2, and the green light-emitting chip G, the red light-emitting chip R and the blue light-emitting chip B are respectively connected with the LED drive IC 3. In one embodiment, the green light emitting chip G and the blue light emitting chip B are respectively disposed on two sides of the red light emitting chip R, and specifically, no limitation is imposed on which side of the red light emitting chip R the green light emitting chip G and the blue light emitting chip B are disposed, and the green light emitting chip G, the red light emitting chip R and the blue light emitting chip B are sequentially disposed along the length direction of the second conductive base 2. Thus, an increase in the overall width of the second conductive base 2 caused by disposing the green light-emitting chip G, the red light-emitting chip R, and the blue light-emitting chip B in the width direction of the second conductive base 2, respectively, is avoided.

Preferably, as shown in fig. 1, the red light emitting chip is located between the green light emitting chip and the blue light emitting chip, the green light emitting chip and the blue light emitting chip adopt a dual-electrode light emitting chip, the red light emitting chip adopts a single-electrode light emitting chip, a position where the green light emitting chip G is electrically connected to the second conductive base 2 is located on a side of the green light emitting chip G away from the blue light emitting chip B, and a position where the blue light emitting chip B is electrically connected to the second conductive base 2 is located on a side of the blue light emitting chip B away from the green light emitting chip G. The red light-emitting chip can be connected with the second conductive base body 2 by adopting conductive die bond adhesive, and the green light-emitting chip and the blue light-emitting chip are connected with the second conductive base body 2 by adopting insulating die bond adhesive. Thereby, the width of the second conductive base 2 can be reduced, resulting in a reduction in the overall width of the LED display unit. The distance among the red light-emitting chip, the green light-emitting chip and the blue light-emitting chip is prevented from being increased due to routing, and the distance among the red light-emitting chip, the green light-emitting chip and the blue light-emitting chip is indirectly reduced, so that the integral resolution is improved.

As shown in fig. 2, the LED display unit further includes an insulating paste structure, the LED light emitting chip 4 is connected to the second conductive substrate 2 through the insulating paste structure, and the LED driver IC3 is connected to the first conductive substrate 5 through the insulating paste structure. That is, the LED light emitting chip 4 is bonded to the second conductive substrate 2 by an insulating adhesive, and the LED driving IC3 is bonded to the first conductive substrate 5 by an insulating adhesive. Through the setting of insulating cement structure, avoid the LED send out optical chip 4 with take place the short circuit between the second conductive matrix body 2, avoid LED driver IC3 with take place the short circuit between the first conductive matrix body 5.

As shown in fig. 2, a plurality of grooves 12 are formed on the insulating transparent substrate 1, and at least a portion of the second conductive substrate 2 or the first conductive substrate 5 is accommodated in the grooves 12. Here, the number of the grooves 12 is equal to the sum of the numbers of the second conductive base 2 and the first conductive base 5, and the grooves 12 may or may not penetrate through the substrate body 11. The second conductive substrate 2 or the first conductive substrate 5 may be partially or completely accommodated in the groove 12, where the depth of the groove 12 and the thickness of the second conductive substrate 2 or the first conductive substrate 5 are not limited, and the resistance of the second conductive substrate 2 or the first conductive substrate 5 with different thicknesses may be changed, but the specific size may be different according to different materials. Thereby, by the arrangement of the groove 12, a positioning of the second conductive base body 2 or the first conductive base body 5 is achieved.

As shown in fig. 2, the LED display unit further includes a transparent encapsulating adhesive layer 6, the transparent encapsulating adhesive layer 6 is connected to the insulating transparent substrate 1, the transparent encapsulating adhesive layer 6 covers the surfaces of the LED light emitting chip 4 and the LED driver IC3, and the transparent encapsulating adhesive layer 6 is exposed at two ends of the first conductive substrate 5 and the second conductive substrate 2 respectively. That is, the LED light emitting chip 4 and the LED driver IC3 are encapsulated by a potting adhesive, which is a transparent insulating adhesive, so that the LED display unit forms a whole, and the first conductive substrate 5 and the second conductive substrate 2 are electrically or communicatively connected through the exposed first conductive substrate 5 and the exposed second conductive substrate 2, where the two ends of the first conductive substrate 5 and the second conductive substrate 2 in the length direction are respectively exposed out of the transparent potting adhesive layer 6. Therefore, through the arrangement of the transparent potting adhesive layer 6, the whole pouring and fixing of the LED display unit are realized, and meanwhile, the permeability of the LED display unit can also be increased.

Preferably, the material of the transparent encapsulating adhesive layer 6 has the same refractive index as the material of the insulating transparent substrate 1. Here, the material of the transparent potting adhesive layer 6 may be the same as that of the insulating transparent substrate 1, the material of the transparent potting adhesive layer 6 may be different from that of the insulating transparent substrate 1, and it is only necessary that the refractive indexes of the material of the transparent potting adhesive layer 6 and that of the insulating transparent substrate 1 are the same, so that the feeling of gap between the transparent potting adhesive layer 6 and the insulating transparent substrate 1 can be reduced.

As shown in fig. 2, the insulating transparent substrate 1 further includes a substrate body 11 and at least two protruding structures 13, the protruding structures 13 are respectively disposed at the edge of the substrate body 11, the protruding structures 13 are disposed along the length direction of the substrate body 11, and the transparent potting adhesive layer 6 is located between the regions surrounded by the protruding structures 13. Preferably, there are two protruding structures 13, the two protruding structures 13 are respectively disposed at two ends of the substrate body 11 in the width direction, and the width direction of the substrate body 11 is the same as the width direction of the second conductive base 2 or the first conductive base 5. Therefore, the arrangement of the convex structure 13 can facilitate the encapsulation of the LED light-emitting chip 4 and the LED driver IC3, and avoid the outflow of the encapsulation adhesive. Here, the shape of the protruding structure 13 is not particularly limited, the protruding structure 13 is integrally formed with the base body 11, and a joint of the protruding structure 13 and the base body 11 may be chamfered.

The present embodiment provides an LED display assembly, as shown in fig. 3, including a plurality of LED display units as described above. Compared with the prior art, the LED display component is the same as the LED display unit, and the description is omitted here.

As shown in fig. 3, fig. 3 shows a schematic connection diagram of only two LED display units, and actually, a plurality of LED display units may be connected in sequence. In one embodiment, the LED display units are connected in sequence along the length direction (i.e., the X-axis direction in the drawing), the first conductive substrates 5 of adjacent LED display units are connected, and the second conductive substrates 2 of adjacent LED display units are connected. Specifically, the first conductive substrates 5 adjacent to each other can be connected by welding, and the second conductive substrates 2 adjacent to each other can be connected by routing, binding or welding. Therefore, the LED display units are sequentially connected along the length direction of the LED display units, so that the width of the LED display assembly is the same as that of the LED display units. Here, since the first conductive substrate 5 and the second conductive substrate 2 are disposed at an interval, the connection between the adjacent LED display units can be facilitated, and the short circuit between the first conductive substrate 5 and the second conductive substrate 2 can be avoided.

As shown in fig. 3, the LED display unit has two second conductive substrates 2, wherein the two second conductive substrates 2 of one of the LED display units are respectively adapted to be connected to a VDD terminal and a ground terminal of a power supply, and the first conductive substrate 5 of one of the LED display units is adapted to be connected to a controller. Because the adjacent first conductive base bodies 5 of the LED display units are connected and the adjacent second conductive base bodies 2 of the LED display units are connected, namely, all the LED display units are connected in a parallel connection mode, and the LED light-emitting chips in the same LED display unit are also connected in a mutually parallel connection mode, the damage of a single LED light-emitting chip to other normal LED light-emitting chips is avoided. Preferably, the two second conductive substrates 2 of the LED display unit at the edge of one end of the LED display assembly in the length direction are respectively adapted to be connected to a VDD terminal and a ground terminal of a power supply, and the first conductive substrate 5 is adapted to be connected to a controller. Optionally, the two second conductive substrates 2 of the other LED display units may be respectively adapted to be connected to a VDD terminal and a ground terminal of a power supply, and the first conductive substrate 5 is adapted to be connected to a controller, so as to control the light emitting intensities of the different LED light emitting chips through the controller to realize different displays. The LED light-emitting chip is connected with the second conductive substrate 2, and the LED light-emitting chip on the second conductive substrate 2 connected with the power supply VDD end is driven by adopting a current source; and the LED light-emitting chip on the second conductive base body 2 connected with the GND end is driven by adopting pot current. The LED light-emitting chips of all other LED display units are prevented from being affected due to the damage of the LED light-emitting chips of the single LED display unit.

In the present embodiment, as shown in fig. 1, the distance d2 between the first conductive base 5 and the second conductive base 2 is twice the minimum distance d1 between the second conductive base 2 and the edge of the insulating transparent substrate 1 in the width direction (i.e., the Y-axis direction in the drawing). Here, the distance d1 between the first conductive base 5 and the second conductive base 2, i.e., the gap d1 between the first conductive base 5 and the second conductive base 2; the minimum distance d2 from the second conductive base 2 to the edge of the insulating transparent substrate 1 in the width direction is the distance d2 from the second conductive base 2 to the edge of the insulating transparent substrate 1 near one end in the width direction. Therefore, when the adjacent LED display units are attached, the distances between the adjacent conductive substrates are equal, wherein the conductive substrates comprise the first conductive substrate 5 or the second conductive substrate 2, so that the light transmission is more uniform. Preferably, the widths of the first conductive base 5 and the second conductive base 2 may be equal.

As shown in fig. 4, in order to avoid the inconvenience of long figures, fig. 4 only shows a schematic diagram including four LED display modules arranged in an array along the width direction (i.e., the Y-axis direction in the drawing), and actually, a plurality of LED display modules may be arranged in an array along the width direction. The present embodiment provides an LED display screen, which includes a plurality of LED display modules as described in any one of the above, all of the LED display modules being arranged along a width direction thereof. The adjacent LED display components can be attached to each other, so that seamless connection among different display components is realized; the LED display modules can be arranged at intervals, specific numerical values of the intervals between the adjacent LED display modules are not particularly limited, the display effect of the LED display modules is different along with the change of different intervals, and the intervals between the adjacent LED display modules are different under different application scenes.

In this embodiment, the VDD pin, the GND pin or the data input pin of the LED display units in adjacent LED display assemblies are connected in parallel and/or in series. That is, the VDD pins of the LED display units of the adjacent LED display assemblies may be connected in series, in parallel, or in a series-parallel combination, the GND pins of the LED display units of the adjacent LED display assemblies may be connected in series, in parallel, or in a series-parallel combination, and the data input pins of the LED display units of the adjacent LED display assemblies may be connected in series, in parallel, or in a series-parallel combination. Specifically, the VDD terminal of the first conductive substrate 5 of the adjacent LED display assembly may be connected in series, in parallel, or in a series-parallel combination, the GND terminal of the first conductive substrate 5 of the adjacent LED display assembly may be connected in series, in parallel, or in a series-parallel combination, and the DATA terminal of the first conductive substrate 5 of the adjacent LED display assembly may be connected in series, in parallel, or in a series-parallel combination.

As shown in fig. 5, the LED display screen further includes a transparent sealing layer 7, and the transparent sealing layer 7 covers all the LED display modules. That is to say, the LED display module is encapsulated in the form of transparent potting adhesive, the potting adhesive is transparent insulating adhesive, so that the LED display module forms a whole, and the first conductive substrate 5 and the second conductive substrate 2 exposed form an electrical connection or a communication connection with an external controller, where the two ends in the length direction of the first conductive substrate 5 and the second conductive substrate 2 are respectively exposed out of the transparent sealing layer 7. Therefore, the whole LED display assembly is poured and fixed through the transparent sealing layer 7.

Preferably, the material of the transparent sealing layer 7 has the same refractive index as the material of the transparent potting adhesive layer 6 and/or the insulating transparent substrate 1. Here, the transparent sealing layer 7, the transparent potting adhesive layer 6 and the insulating transparent substrate 1 may be made of the same material, and the transparent sealing layer 7, the transparent potting adhesive layer 6 and the insulating transparent substrate 1 may also be made of different materials, and it is only necessary that the transparent sealing layer 7, the transparent potting adhesive layer 6 and the insulating transparent substrate 1 have the same refractive index, and thus, the gap feeling between the transparent sealing layer 7 and the LED display module can be reduced.

Although the present disclosure has been described above, the scope of the present disclosure is not limited thereto. Various changes and modifications may be effected therein by one of ordinary skill in the pertinent art without departing from the spirit and scope of the present disclosure, and these changes and modifications are intended to be within the scope of the present disclosure.

Claims (23)

1. The LED display unit is characterized by comprising an LED drive IC (3), a first conductive base body (5), at least one second conductive base body (2) and LED light-emitting chips (4), wherein the second conductive base bodies (2) and the first conductive base body (5) are arranged at intervals, the LED drive IC (3) is arranged on the first conductive base body (5), the LED light-emitting chips (4) are arranged on the second conductive base body (2), and the LED drive IC (3) is connected with the LED light-emitting chips (4).

2. The LED display unit of claim 1, further comprising an insulating transparent substrate (1), the first conductive base (5) and the second conductive base (2) being mounted on the insulating transparent substrate (1), the first conductive base (5) and all of the second conductive base (2) partially covering the insulating transparent substrate (1).

3. The LED display unit of claim 2, wherein there are two of the second conductive substrates (2), the first conductive substrate (5) and the second conductive substrate (2) are each a stripe structure, the first conductive substrate (5) and the second conductive substrate (2) are parallel to each other, and the first conductive substrate (5) is located between the two second conductive substrates (2).

4. The LED display unit according to any of claims 1 to 3, wherein the VDD pin and GND pin of the LED driver IC (3) are connected to the two second conductive bases (2), respectively, and the data input pin of the LED driver IC (3) is connected to the first conductive base (5).

5. The LED display unit of any one of claims 1 to 3, wherein a plurality of said LED light emitting chips (4) are arranged along the length of said second conductive substrate (2).

6. The LED display unit of claim 1, wherein the LED light emitting chips (4) comprise a red light emitting chip, a green light emitting chip, and a blue light emitting chip, the green light emitting chip, the red light emitting chip, and the blue light emitting chip being disposed along a length direction of the second conductive base (2), the green light emitting chip, the red light emitting chip, and the blue light emitting chip being respectively connected to the LED driving IC (3).

7. The LED display unit according to claim 6, wherein the red light emitting chip is located between the green light emitting chip and the blue light emitting chip, the green light emitting chip and the blue light emitting chip are two-electrode light emitting chips, the red light emitting chip is a single-electrode light emitting chip, the green light emitting chip is electrically connected to the second conductive substrate (2) at a position on the side of the green light emitting chip away from the blue light emitting chip, and the blue light emitting chip is electrically connected to the second conductive substrate (2) at a position on the side of the blue light emitting chip away from the green light emitting chip.

8. The LED display unit according to claim 1, wherein the LED driver IC (3) is an unpackaged bare die.

9. The LED display unit according to claim 1, further comprising an insulating paste structure through which the LED light-emitting chip (4) is connected to the second conductive base (2), and the LED driver IC (3) is connected to the first conductive base (5).

10. The LED display unit according to claim 2, characterized in that the insulating transparent substrate (1) is made of glass, silicone, resin, PVC, PC, PE or acryl.

11. The LED display unit of claim 2, wherein the insulating transparent substrate (1) has a plurality of grooves (12) formed therein, and the second conductive substrate (2) or the first conductive substrate (5) is at least partially received in the grooves (12).

12. The LED display unit according to claim 2, wherein the thickness of the LED light emitting chip (4) is greater than or equal to the thickness of the LED driving IC (3).

13. The LED display unit according to claim 3, wherein the distance between the first conductive base (5) and the second conductive base (2) is twice the minimum distance between the second conductive base (2) and the widthwise edge of the insulating transparent substrate (1).

14. The LED display unit according to any one of claims 2 to 3 or 10 to 13, further comprising a transparent encapsulating adhesive layer (6), wherein the transparent encapsulating adhesive layer (6) is connected with the insulating transparent substrate (1), the transparent encapsulating adhesive layer (6) covers the surfaces of the LED light-emitting chip (4) and the LED driving IC (3), and two ends of the first conductive substrate (5) and the second conductive substrate (2) are respectively exposed out of the transparent encapsulating adhesive layer (6).

15. The LED display unit of claim 14, wherein the insulating transparent substrate (1) further comprises a substrate body (11) and two protruding structures (13), the protruding structures (13) are respectively disposed on the edges of the substrate body (11), the protruding structures (13) are disposed along the length direction of the substrate body (11), and the transparent potting adhesive layer (6) is located between the protruding structures (13).

16. The LED display unit of claim 14, wherein the material of the transparent encapsulating glue layer (6) has the same refractive index as the material of the insulating transparent substrate (1).

17. An LED display assembly comprising a plurality of LED display units according to any one of claims 1 to 16.

18. The LED display assembly of claim 17, wherein the LED display units are connected in series along their length, the first conductive bases (5) of adjacent LED display units being connected, the second conductive bases (2) of adjacent LED display units being connected.

19. The LED display assembly of claim 17, wherein the LED display unit has two second conductive bases (2), wherein the two second conductive bases (2) of one of the LED display units are adapted to be connected to VDD terminal and ground terminal of a power supply, respectively, and wherein the first conductive base (5) of one of the LED display units is adapted to be connected to a controller.

20. An LED display screen comprising a plurality of LED display modules according to any one of claims 17 to 19, all of said LED display modules being disposed along the width thereof.

21. The LED display screen of claim 20, wherein the VDD pin, the GND pin or the data input pin of the LED display units in adjacent LED display assemblies are connected in parallel and/or in series.

22. The LED display screen of claim 20, further comprising a transparent sealing layer (7), wherein the transparent sealing layer (7) covers all of the LED display components.

23. LED display screen according to claim 22, characterised in that the material of the transparent sealing layer (7) has the same refractive index as the material of the transparent potting layer (6) and/or the insulating transparent substrate (1) of the LED display unit in the LED display assembly.

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