JPH05235413A - Illuminant - Google Patents

Abstract

PURPOSE:To provide an illuminant, which is miniaturized as a whole, can be manufactured in a thin type and is produced easily. CONSTITUTION:A metallic lead frame 18A, on which three chip type light- emitting elements 12A are soldered so as to be connected in series or parallel, is buried with a light-transmitting resin so that the external electrical connecting sections 16 are exposed, thus forming and constituting a molded form 20. Accordingly, an illuminant 10 is miniaturized as a whole and can be formed in a thin type, and can be manufactured easily only by injection molding-working the light-transmitting resin so as to cover the metallic lead frame 18A, on which the light-emitting elements 12A are soldered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a light emitting body suitable for being used as a back light for an illuminator of various office automation equipment or a sheet key, and for a back light of various display bodies such as machine tools. is there.

[0002]

2. Description of the Related Art In general, a light emitting body of this type has a translucent insulating case formed by soldering one or more chip type light emitting elements to a metal lead frame and covering the chip type light emitting elements. Formed by deriving the terminal portion of the metal lead frame from the above, or by soldering one or more ordinary discrete type light emitting elements to the terminal portion of the circuit pattern of the printed wiring board to cover the discrete type light emitting element. The terminal portion of the printed wiring board is formed so as to extend from a translucent insulating case that covers the terminal.

[0003]

However, in all of the prior art light emitters, the light emitting element is housed in a translucent insulating case, so that the overall size is large and a thin surface light emitter is used. I couldn't get it. In addition, the light-emitting body is assembled by soldering the light-emitting element to the metal lead frame or the printed wiring board and covering the metal lead frame or the printed wiring board with the insulating cover so as to expose the external terminal portions, which is troublesome to assemble. There was a drawback that it was expensive.

An object of the present invention is to provide a light-emitting body which can avoid the above-mentioned drawbacks and can be manufactured in a small size and a thin shape as a whole.

Another object of the present invention is that it is easy to manufacture,
An object is to provide a light-emitting body that can be manufactured at low cost.

[0006]

A first object of the present invention is to provide at least one light emitting element, an internal terminal portion electrically connected to a terminal portion of the light emitting element, and an external electrical connection portion. Light emission characterized by comprising a connecting conductor and a light-transmissive molding molded from a translucent resin by embedding the light-emitting element and the connection conductor so that the external electrical connection portion is exposed. To provide the body.

A second means for solving the problems of the present invention is the above first means.
According to another aspect of the present invention, there is provided a light emitting body in which a connecting conductor is composed of a metal lead frame, and a terminal portion of the light emitting element is soldered to a corresponding terminal portion of the metal lead frame. ..

A third means for solving the problems of the present invention is the above-mentioned first embodiment.
According to another aspect of the present invention, there is provided a luminous body in which a connecting conductor is formed of a printed wiring board, and a terminal portion of a light emitting element is soldered to a corresponding terminal portion of the printed wiring board. ..

[0009]

As described above, at least one light emitting element and the connection conductor to which the light emitting element is soldered are embedded in a transparent resin so that the external electrical connection portion is exposed to form a transparent molded body. It is understood that, when molded, the light emitting body can be formed to be small and thin as a whole.

Further, since the light emitting element is manufactured only by injection-molding the translucent resin so as to cover the soldered connection conductor, the light emitting element and the connection conductor can be led out by the external electrical connection portion. It can be seen that the manufacturing becomes easy without the need for the troublesome work of storing in the insulating case.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, an embodiment of the present invention will be described in detail. FIG. 1 shows a light emitting body 10 according to the present invention. The light emitting body 10 includes three light emitting elements 12 and these light emitting elements. 1
A connection conductor 18 having an internal terminal portion 14 to which the second terminal portion is electrically connected and an external electrical connection portion 16, a light emitting element 12 and a connection conductor 18 so that the external electrical connection portion 16 is exposed. And a light-transmissive molded body 20 molded from a translucent resin. In the embodiment shown in FIG. 1, the light emitting element 12 is a chip type light emitting element (LED) 12A, and the connection conductor 18 is a metal lead frame 18A. The three light emitting elements 12 are connected in series or in parallel.

2 to 4 show a process of manufacturing a light emitting body 10 composed of three chip type light emitting devices 12A connected in series. As shown in FIG. 2, the metal lead frame 18A has a grid-shaped main strip portion 2 that extends vertically and horizontally.
2, 24 and a lateral auxiliary strip portion 26 which extends laterally from the vertical main strip portion 22 and serves as an external electrical connection portion 16.
And a vertical auxiliary strip portion 28 extending in the vertical direction from the horizontal main strip portion 24, and the four conductive portions 30 constituting the internal terminal portion 14 to which the light emitting element 12 is to be soldered.
Are supported by these auxiliary strip portions 26, 28.

The three chip-type light emitting elements 12A are soldered to and electrically connected to the conductive portions 30 of the metal lead frame 18A so as to straddle the adjacent conductive portions 30. Then, this metal lead frame 18A
Is a translucent resin formed by injection molding a translucent resin with an injection molding machine so as to expose the lateral auxiliary strip portion 26 to be the external electrical connection portion 16 and bury the conductive portion 30 and the light emitting element 12A. The molded body 20 is formed.

Finally, as shown in FIG. 3, the metal lead frame 18A is connected to the translucent molded body 20 and the external electrical connecting portion 1.
The lateral auxiliary strip portion 26 to be 6 is cut so as to be cut off, and the lateral auxiliary strip portion 26 is bent to form the external electrical connection portion 16 to complete the light emitting body 10 of the present invention. It can be seen that the light emitting body 10 thus completed is one in which three chip light emitting elements 12 are connected in series as shown in FIG.

FIG. 5 and FIG. 6 show a process of manufacturing a light emitting body 10 including three chip type light emitting devices 12A connected in parallel. As shown in FIG. 5, the metal lead frame 18A has a grid-like main strip portion 3 extending vertically and horizontally.
2, 34 and the lateral auxiliary strip portion 36 which extends laterally from the vertical main strip portion 32 and serves as the external electrical connection portion 16.
And a pair of conductive portions 40, which constitute the internal terminal portion 14 to which the light emitting element 12A is to be attached, are formed of the vertical auxiliary strip portions 38 extending in the vertical direction from the horizontal main strip portion 34. Supported by.

The three chip-type light emitting elements 12A are soldered to and electrically connected to the pair of conductive portions 40 of the metal lead frame 18A so as to extend over the pair of conductive portions 40. Thereafter, the metal lead frame 18A is attached to the lateral auxiliary strip portion 36 to be the external electrical connection portion 16.
The translucent resin is injection-molded to form the translucent molded body 20 so that the conductive part 40 and the light emitting element 12A are buried.

Finally, the metal lead frame 18A is cut so as to separate the translucent molded body 20 and the lateral auxiliary strip portion 36, which is to be the external electrical connection portion 16, and the lateral auxiliary strip portion 36 is bent to external electric power. The light-emitting body 10 of the present invention is completed by forming the physical connection portion 16. It can be seen that the light-emitting body 10 thus completed has three chip light-emitting elements 12 connected in parallel as shown in FIG.

As can be seen from FIG. 1, this luminous body 10 is
The printed wiring board 44 has the external electrical connection portion 16 disposed inside the translucent or semi-translucent cover 42 of OA equipment or the like.
Is soldered onto a predetermined circuit pattern and is attached so as to be electrically connected. Therefore, the OA device performs a predetermined operation, and the light-emitting body 1 to be turned on in response to this operation
When 0 is connected to the power source through the circuit of the printed wiring board 44, the three chip type light emitting elements 12A are turned on and emit light through the translucent or semitranslucent cover 42 to display its function. ..

FIG. 7 shows another embodiment of the present invention. In this embodiment, the connecting conductor 18 is made of a metal lead frame 18A, but the three light emitting elements 12 are not chip type but discrete type light emitting element. Made of 12B,
This is substantially the same as the embodiment of FIG. 1 except that the discrete type light emitting device 12B is soldered to the metal lead frame 18A. The same parts as those in FIG. 1 are designated by the same reference numerals.

8 to 12 show still another embodiment of the present invention, and the light emitting body 10 according to this embodiment will be described together with its manufacturing method. The connection conductor 18 is composed of a printed wiring board 18B having two copper foils 46 and 46 'as shown in FIG. 11, and each copper foil 46 and 46' is a terminal land 46a and 46 to be the external electrical connection portion 16. 'a and three soldering lands 46b, 46'b facing each other.

Three discrete light emitting elements 12B
Are soldered across opposite soldering lands 46b, 46'b of the pair of printed conductive layers 46, 46 '. After that, as shown in FIGS. 8 to 10, both ends of the printed wiring board 18B including the terminal lands 46a and 46'a are exposed, and the other portion of the printed wiring board 18B including the light emitting element 12B is embedded so as to be transparent. The light-transmitting molded body 20 is formed by injection molding a transparent resin to complete the light-emitting body 10 of the present invention.

The luminous body 10 thus formed is
The three light emitting elements 12B are connected in parallel. The light-emitting body 10 has the terminal lands 46a and 46'a, which are the external electrical connection portions 16 of the printed wiring board 18B, OA.
It is used as a backlight by connecting to the circuit assembly in the equipment.

In the above embodiment, the light-emitting body assembled by using three light-emitting elements is shown, but the number of the light-emitting elements may be one, two, four or more. It may be. Further, although the light emitting element is shown to have two terminals (one color type) in the above-mentioned embodiments, it may be a multicolor type of two or more colors and has three or more terminals. In this case, the conductive portion of the metal lead frame and the circuit pattern of the printed wiring board are formed in a corresponding pattern.

In FIGS. 1 and 7, reference numeral 20a is a hole formed by removing a support pin for supporting the terminal portion of the connecting conductor 18 from the molded body 20 after molding when the transparent molded body 20 is injection molded. Indicates.

[0025]

According to the present invention, as described above, at least one light emitting element and the connecting conductor to which the light emitting element is soldered are made of a transparent resin so that their external electrical connection portions are exposed. Since it is formed by embedding and molding a molded body, the light-emitting body can be formed to be small and thin as a whole.

Further, since the light emitting element is manufactured only by injection-molding the translucent resin so as to cover the soldered connection conductor, the light emitting element and the connection conductor can be led out by the external electrical connection portion. In addition, there is a practical advantage that the manufacturing is easy without requiring a troublesome work of storing in the insulating case.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a usage state of a light emitter according to an embodiment of the present invention.

FIG. 2 is a plan view showing a part of a process of manufacturing a light emitting body according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing another part of the manufacturing process of the light-emitting body according to the present invention.

4 is a circuit diagram of a light emitter manufactured by the method of FIGS. 2 and 3. FIG.

FIG. 5 is a plan view showing a part of a process of manufacturing another light emitting body according to an embodiment of the present invention.

FIG. 6 is a circuit diagram of a light emitter manufactured by the method of FIG.

FIG. 7 is a sectional view of a light emitting body according to another embodiment of the present invention.

FIG. 8 is a plan view of a light emitting body according to another embodiment of the present invention.

9 is a side view of the light emitter of FIG. 8. FIG.

10 is a front cross-sectional view of the light emitting body of FIG.

11 is a rear view of a printed wiring board used for the light emitting body of FIG.

FIG. 12 is a side view of a printed wiring board used for the light emitting body of FIG. 8 and having a light emitting element attached thereto.

[Explanation of symbols]

 10 Light-Emitting Body 12 Light-Emitting Element 12A Chip-Type Light-Emitting Element 12B Discrete-Type Light-Emitting Element 14 Internal Terminal Section 16 External Electrical Connection Section 18 Connection Conductor 18A Metal Lead Frame 18B Printed Wiring Board 20 Translucent Molded Body 22 Vertical Main Strip Section 24 Horizontal main strip portion 26 Horizontal auxiliary strip portion 28 Vertical auxiliary strip portion 30 Conductive portion 32 Vertical main strip portion 34 Horizontal main strip portion 36 Horizontal auxiliary strip portion 38 Vertical auxiliary strip portion 40 Conductive portion 46 Copper foil 46 'Copper foil 46a Terminal land 46'a Terminal land 46b Soldering land 46'b Soldering land

Claims (3)

[Claims] 1. At least one light emitting element, a connection conductor having an internal terminal portion electrically connected to a terminal portion of the light emitting element and an external electrical connection portion, and the external electrical connection portion being exposed. 2. A light-emitting body, comprising: a light-transmitting molded body formed by molding a light-transmitting resin in which the light-emitting element and the connection conductor are embedded. 2. The light emitting device according to claim 1, wherein the connection conductor comprises a metal lead frame, and a terminal portion of the light emitting element is soldered to a corresponding terminal portion of the metal lead frame. Luminous body. 3. The light-emitting body according to claim 1, wherein the connection conductor comprises a printed wiring board, and a terminal portion of the light emitting element is soldered to a corresponding terminal portion of the printed wiring board. Luminous body.