JPH11224063A - Resin molding type display device and its manufacture - Google Patents

Resin molding type display device and its manufacture

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Publication number
JPH11224063A
JPH11224063A JP10025762A JP2576298A JPH11224063A JP H11224063 A JPH11224063 A JP H11224063A JP 10025762 A JP10025762 A JP 10025762A JP 2576298 A JP2576298 A JP 2576298A JP H11224063 A JPH11224063 A JP H11224063A
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JP
Japan
Prior art keywords
substrate
light
portion
resin
formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP10025762A
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Japanese (ja)
Inventor
Takayuki Ishihara
孝幸 石原
Original Assignee
Rohm Co Ltd
ローム株式会社
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Application filed by Rohm Co Ltd, ローム株式会社 filed Critical Rohm Co Ltd
Priority to JP10025762A priority Critical patent/JPH11224063A/en
Publication of JPH11224063A publication Critical patent/JPH11224063A/en
Application status is Pending legal-status Critical

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Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3023Segmented electronic displays
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

PROBLEM TO BE SOLVED: To simplify the manufacture process and to make the device inexpensive, thin, and small-sized by providing a substrate, light emission bodies constituting pixels on the surface of the substrate, and a transparent resin part which is molded covering each light emission part. SOLUTION: The substrate 1 is made of, for example, a liquid crystal polymer, BT resin, etc., and at a part where the respective light emission part 2 are formed, one through hole 11 is formed for each light emission part 2. Each light emission part 2 has electrode patterns 12 and 13 formed with patterns made of copper, gold, etc., respectively. The light emission part 2 is so constituted that, for example, a red LED chip 21 is connected to the electrode patterns 12 and 13 electrically and a current is applied for light emission. The transparent resin part 3 is made of epoxy resin or the like which is transparent to the light emitted by the light emission part 2 and molded by transfer molding in the shape of segments covering the light emission part 2 on the substrate 1.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、計測器やパチンコ台などの表示部に用いられる数字表示器やドットマトリクス表示器、キャラクタ表示器などの半導体発光素子チップを用いた樹脂モールド型表示装置に関する。 The present invention relates to the instruments and numeric displays used in a display unit such as a pachinko machine or a dot matrix display, a resin mold type display device using a semiconductor light-emitting device chip such as a character display . さらに詳しくは、製造が簡単で、かつ、小形薄型化が可能な樹脂モールド型表示装置に関する。 More specifically, production is simple, and relates to a resin molding type display device capable of small thickness.

【0002】 [0002]

【従来の技術】従来の半導体発光素子チップ(以下、L Conventional semiconductor light emitting element chip (hereinafter, L
EDチップという)を用いた7セグメント(数字表示器)などの表示器は、図4(a)〜(b)に概略の斜視図および1つのセグメント部の断面図が示されるような構造になっている。 Indicator, such as a 7-segment using the ED that the chip) (numeric displays) is structured as a cross-sectional view of a schematic perspective view in FIG. 4 (a) ~ (b) and one segment portion is shown ing. すなわち、基板51上にたとえば7 That is, for example, on the substrate 51 7
セグメントの各セグメントの発光部を構成するLEDチップ52が各セグメントの両電極53、54と図示しないダイボンディング材およびワイヤ55によりそれぞれ接続され、その周囲が各セグメントを区画する遮光壁を有するケース56により囲まれ、その内部に透明樹脂5 LED chips 52 constituting the light emitting portion of each segment of the segment are connected by die-bonding material and the wire 55 (not shown) with the electrodes 53, 54 of each segment, the case 56 having a light-shielding walls around it defining each segment surrounded by a transparent resin 5 therein
7が充填されることにより構成されている。 7 is constituted by being filled. 各セグメントの電極53、54は、基板51上に設けられる配線(図示せず)により基板51の端部に導出され、端部にまとめて端子電極60が設けられている。 Electrodes 53 and 54 of each segment is derived the edge of the substrate 51 by the wiring provided on the substrate 51 (not shown), the terminal electrode 60 is provided together in the end. すなわち、絶縁基板上に各セグメントを構成する発光部がLEDチップにより形成され、その各発光部を区画するように遮光壁を有するケースが基板表面に被せられて、遮光壁により囲まれた各発光部のみに透明樹脂が充填される構造になっている。 That is, a luminescence part included in each segment on an insulating substrate is formed by the LED chip, the case having a shielding wall to partition the light emitting portion is placed over the substrate surface, the light emitting surrounded by shielding walls parts only transparent resin has a structure to be filled.

【0003】また、図示されていないが、基板上に各セグメントの発光部を形成し、各セグメントの仕切りを白色樹脂で基板の裏面側まで被覆しながら形成し、発光部以外の表面を黒色にすると共に、基板の裏面側に各発光部のリードを延ばした構造のものもある。 [0003] Although not illustrated, to form a light emitting portion of each segment on the substrate, a partition of the segments formed with coated white resin to the back side of the substrate, the surface other than the light emitting portion to black while, also a structure in which extended the lead of the light emitting portion on the back side of the substrate.

【0004】 [0004]

【発明が解決しようとする課題】これらの従来のLED THE INVENTION Problems to be Solved] These conventional LED
チップを用いて数字などを表示する表示装置では、前述のように、各セグメントなどの画素が遮光壁により区画されてその内部に透明樹脂が充填される構造になっているため、遮光壁の厚さや幅をある程度設けざるを得ず、 In the display device for displaying the numerals using a chip, because that is, as described above, the structure in which pixels including each segment transparent resin therein are partitioned by the light shielding walls is filled, the thickness of the light shielding wall without obtaining a certain extent provided forced to the sheath width,
薄型の限界があったり、セグメント間の間隔が大きくなって繊細な表示をすることができない。 Or a thin limit, can not be a delicate display interval is large between the segments. そのため、小形化に限界があると共に、製造工数が増加してコストダウンを充分に行えないという問題がある。 Therefore, the there is a limit to the miniaturization, there is a problem that manufacturing steps can not be sufficiently performed cost increases.

【0005】一方、単体の半導体発光素子では、遮光壁で周壁を被覆しない構造のチップ型発光素子が小形に形成されている。 On the other hand, in the single semiconductor light emitting device, a chip-type light emitting element having a structure which does not cover the peripheral light shielding wall is formed to small. この構造を7セグメントなどの表示器に応用しようとすると、図3に示されるように、各セグメントをランナー58で連結して各セグメント部の透明樹脂部57を形成することになり、各セグメント間のランナー58によりセグメントを構成する透明樹脂部57が連結される。 If you try to apply this structure to a display device such as a 7-segment, as shown in FIG. 3, it will be linked to each segment by a runner 58 to form a transparent resin portion 57 of each segment portion, between each segment a transparent resin portion 57 constituting the segments are connected by the runner 58. そのため、隣接するセグメント間で光の漏れが生じて、点灯させないセグメントまで薄く点灯するという問題が発生し、1つの発光部単体のチップ型発光素子のように、基板上のセグメントを構成する発光部をそれぞれ直接透明樹脂により被覆する樹脂モールド型の表示装置を形成することができない。 Therefore, leakage of light between adjacent segments occurs, thin problem of lighting occurs until not turned segment, as in the one light emitting portion a single chip type light emitting element, a light-emitting portion constituting the segments on the substrate the inability to form a resin mold type display device for coating by direct transparent resin, respectively.

【0006】本発明は、このような問題を解決するためになされたもので、各発光部をそれぞれ直接透明樹脂で被覆することにより、製造工程が簡略化されると共に、 [0006] The present invention has been made to solve such problems, by covering the light emitting portion in direct transparent resin, respectively, the manufacturing process is simplified,
薄型化および小形化を達成することができる安価な樹脂モールド型表示装置およびその製法を提供することを目的とする。 And to provide an inexpensive resin molding type display device and a manufacturing method can achieve a thinner and smaller.

【0007】 [0007]

【課題を解決するための手段】本発明による樹脂モールド型表示装置は、基板と、該基板の表面に画素を構成すべく設けられる複数個の発光部と、該複数個の発光部の各発光部ごとに該発光部を被覆し、モールド成形により形成される透明樹脂部とからなっている。 Plastic molded display device according to the present invention SUMMARY OF THE INVENTION comprises a substrate and a plurality of light emitting section provided so as to constitute a pixel on the surface of the substrate, each light emission of several emission portion said plurality the light emitting portion covered per section, consists a transparent resin portion formed by molding.

【0008】ここに画素とは、7セグメントを構成する各セグメントや、ドットマトリクス表示器を構成する各ドットのように、数字や文字、絵柄の一部を構成し得る1つの要素を意味する。 [0008] The pixel here, and each segment constituting the 7 segment, as of each dot of the dot matrix display, means one element that may comprise numbers or letters, part of a picture.

【0009】この構成にすることにより、反射壁を有するケースを基板上に被せないで、各画素がそれぞれ別々に直接樹脂によるモールド成形により形成されているため、非常に薄型で小形の表示装置が得られる。 [0009] By this configuration, not covered with a case having a reflective wall on the substrate, since each pixel is formed by molding by separately resin directly respectively, it is very small display device thin can get.

【0010】前記各発光部の透明樹脂部の間隙部に不透明樹脂が充填されることにより、従来の各セグメント間に遮光壁が設けられているのと同様に、表示部と背景が平坦面でコントラストの優れた薄型の表示装置を形成することができる。 [0010] By the opaque resin into the gap portion of the transparent resin portion of the light emitting units are filled, just as a conventional light shielding wall between the segments is provided, the display unit and the background flat surface it is possible to form an excellent thin display device contrast.

【0011】前記基板の各発光部ごとに前記透明樹脂部を形成するための樹脂充填用のスルーホールが設けられることにより、基板の裏面から樹脂を注入して各発光部ごとに透明樹脂部を形成するのに都合がよい。 [0011] By the through holes of the resin filling for forming the transparent resin portion in each light-emitting portion of the substrate is provided, the transparent resin portion in each light-emitting portion by injecting resin from the rear surface of the substrate formation it is convenient to.

【0012】本発明の樹脂モールド型表示装置の製法は、(a)基板に、各画素を構成する発光部を形成するための電極パターン、該電極パターンと接続される配線パターン、および各発光部ごとにスルーホールを設け、 [0012] Preparation of the resin mold type display device of the present invention, (a) a substrate, the electrode pattern to form a luminescence part included in each pixel, the wiring pattern is connected to said electrode pattern, and the light emitting portion a through hole provided in each,
(b)前記各発光部に発光素子チップをマウントして電極パターンと電気的に接続し、(c)前記基板を前記各発光部上に空洞部を形成したモールド成形用の金型内に入れ、前記スルーホールの前記基板の裏面側に前記モールド金型のゲートを接続して樹脂を注入する、ことを特徴とする。 Mount the light emitting element chip (b) said each light emitting portion is connected to the electrode patterns electrically, placed in a mold for molding which forms a cavity part (c) the substrate on the light emitting units , injecting the mold resin to connect the gate of the back surface side of the substrate of the through hole, and wherein the.

【0013】 [0013]

【発明の実施の形態】つぎに、図面を参照しながら本発明の樹脂モールド型表示装置について説明をする。 DETAILED DESCRIPTION OF THE INVENTION Next, with reference to the accompanying drawings resin mold type display device of the present invention will be described.

【0014】本発明の樹脂モールド型表示装置は、図1 [0014] Plastic molded display device of the present invention, FIG. 1
(a)〜(b)にその一実施形態である7セグメント表示器の斜視説明図およびその一部のセグメント部の拡大説明図が示されるように、基板1の表面に画素(7セグメントの各セグメント)を構成すべく設けられる複数個の発光部2と、その複数個の発光部の各発光部2ごとにモールド成形により形成される透明樹脂部3とからなっている。 (A) ~ as (b) the perspective view of 7-segment display which is one embodiment thereof and an enlarged illustration of a part of segment portion are shown, each of the pixels (7 segments in the surface of the substrate 1 a plurality of light emitting portion 2 which is provided so as to constitute a segment), which is a transparent resin portion 3 which is formed by molding on each light-emitting portion 2 of the plurality of light emitting portions.

【0015】基板1は、たとえば液晶ポリマーや、BT [0015] The substrate 1 is, for example, a liquid crystal polymer, BT
レジン、ガラスエポキシ樹脂などからなっており、各発光部2が形成される部分には、各発光部2ごとに少なくと1個のスルーホール11が形成されている。 Resin, has become of glass epoxy resin, in a portion each of the light emitting portion 2 is formed, the less the each light-emitting unit 2 one through hole 11 is formed. そして、 And,
各発光部2の形成される所には、電極パターン12、1 The place is formed of the light-emitting unit 2, the electrode patterns 12, 1
3がそれぞれ銅や金などからなるパターンにより形成されている。 3 is formed by a pattern made of copper or gold, respectively. この電極パターン12、13は基板1の表面または、たとえばスルーホール11内を経由して基板1 The electrode patterns 12 and 13 the surface of the substrate 1 or, for example, via a through hole 11 substrate 1
の裏面に、電極パターンと同様に形成される配線パターン(図示せず)により基板の端部側に導出され、基板1 The back surface of the wiring pattern are formed in the same manner as the electrode pattern (not shown) are led out to the end of the substrate, the substrate 1
の端部に端子電極15が形成されている。 Terminal electrodes 15 are formed on the end portion. 前述のスルーホール11を介して基板1の裏面に配線パターンが形成されることにより、表面のセグメントの配置に影響を受けることなく配線パターンを形成することができ、各画素(セグメント)間の間隔を狭く表示品位の優れた表示装置とすることができる。 By back surface wiring pattern on the substrate 1 through the through hole 11 described above is formed, it is possible to form a wiring pattern without being affected by the arrangement of the segments of the surface, the spacing between each pixel (segment) it can be a narrow display quality excellent display device.

【0016】発光部2は、たとえば赤色のLEDチップ21が電極パターン12に一方の電極が接続されるようにダイボンディングされ、他方の電極が金線などのワイヤ22により電極パターン13と電気的に接続して、電流が印加されることにより発光するように形成されている。 The light emitting unit 2, for example, red LED chip 21 is die-bonded to one electrode connected to the electrode patterns 12, the wire 22 of the other electrode, such as gold electrode pattern 13 and the electrically connect is formed so as to emit light when a current is applied.

【0017】透明樹脂部3は、発光部2で発光する光に対して透明なエポキシ樹脂などからなり、トランスファモールドなどのモールド成形により、基板上の発光部2 The transparent resin portion 3 is made of transparent epoxy resin to light emitted from the light emitting unit 2, by molding such as transfer molding, the light emitting portion 2 on the substrate
を覆うようにセグメントの形状で形成されている。 It is formed in the shape of a segment to cover. その結果、この透明樹脂部3の中の発光部2で発光した光は、透明樹脂部3の全体に広がって、そのセグメントの透明樹脂部3の全体で発光し、その形状でセグメントとして光る。 As a result, the light emitted from the light emitting portion 2 in the transparent resin portion 3, spread throughout the transparent resin portion 3, emitted at the entire transparent resin portion 3 of the segment, shiny as a segment in the shape. この透明樹脂部3は、発光部2を被覆する必要があるため、発光部2の高さ(基板1の表面からワイヤを張る上端部までの寸法)の0.5mm程度よりやや高く、0.7〜2mm程度の高さに形成される。 The transparent resin portion 3, it is necessary to coat the light emitting portion 2, slightly higher than 0.5mm approximately the height of the light emitting portion 2 (the dimension from the surface of the substrate 1 to the top end tensioning a wire), 0. It is formed to a height of about 7~2Mm. この形状の透明樹脂部3を形成するには、後述するように、基板1の裏面のスルーホール11部につながるゲートが形成された下金型上に基板1を載せ、前述のセグメントの形状の空洞部が形成された上金型により基板1の上部を覆い、樹脂を流し込むことにより、図1(b)に矢印A To form the transparent resin portion 3 of this shape, as described below, placing the substrate 1 on the lower mold in which the gate is formed to lead to the through hole 11 portion of the back surface of the substrate 1, the shape of the aforementioned segments covering the upper portion of the substrate 1 by the cavity upper mold which is formed, by pouring the resin, arrows a in FIG. 1 (b)
で示されるように、基板1のスルーホール11の下側から樹脂が流入し、上金型の形状に沿った透明樹脂部3が形成される。 In As shown, the resin flows from the lower side of the through hole 11 of the substrate 1, the transparent resin portion 3 along the shape of the upper mold is formed.

【0018】この樹脂モールド型表示装置を製造するには、基板1を打抜金型により打ち抜くことにより、端子電極15を形成する部分のスルーホール16および発光部2に形成するスルーホール11を同時に形成する。 [0018] The resin mold type display device for producing, by punching the substrate 1 by punching 抜金 type, a through hole 11 formed in the through hole 16 and the light emitting portion 2 of the part forming the terminal electrodes 15 at the same time Form. そして、全面に銅などを蒸着などにより成膜し、ホトレジストなどのマスキングをしてエッチングすることにより、電極パターン12、13、図示しない配線パターン、および端子電極15を形成する。 Then, the entire surface such as is formed by such a vapor deposition copper, by etching the masking such photoresist, electrode patterns 12 and 13, to form a wiring pattern (not shown), and the terminal electrode 15. この際に、端子電極15の部分のスルーホール16内に金属パターンが残るようにし、基板1の裏面に設ける端子(裏面)電極(図示せず)と接続するようにして、回路基板上にマウントして直接ハンダ付けする表面実装をできるようになっている。 In this case, as the metal pattern is left in the through holes 16 of the portion of the terminal electrode 15, so as to connect the terminals provided on the back surface of the substrate 1 (back) electrode (not shown), mounted on the circuit board and to be able to surface mount soldered directly to. この際、基板1の裏面に配線パターンを形成する場合には、スルーホール11内にもパターンを同時に形成する。 At this time, in the case of forming a wiring pattern on the back surface of the substrate 1 simultaneously form a pattern in the through hole 11. そして、基板の裏面にも同様に銅膜などを成膜して裏面電極および必要な場合は配線パターンを基板1の裏面に形成する。 When the back electrode and the required deposited and copper as well on the back surface of the substrate to form a wiring pattern on the back surface of the substrate 1.

【0019】つぎに、各発光部2の電極パターン12上にLEDチップ21を導電性接着剤によりダイボンディングして一方の電極を電極パターンと電気的に接続し、 Next, by die bonding and connected to one electrode the electrode pattern and electrically with a conductive adhesive to the LED chip 21 on the electrode pattern 12 of the light emitting portion 2,
ワイヤ22により他方の電極を他の電極パターン13と電気的に接続することにより、発光部2を形成する。 By connecting the other electrode electrically to the other electrode pattern 13 by wire 22, forming a light-emitting unit 2.

【0020】つぎに、各セグメントの発光部のセグメント形状に相当する部分の空洞部が形成された上金型と、 Next, the upper mold cavities of the portion corresponding to the segment-shaped light-emitting portion of each segment is formed,
基板の裏側のスルーホール11部分に樹脂注入部が位置するようにゲートが形成された下金型からなるモールド金型に入れ、透明なエポキシ樹脂を注入する。 Placed in a mold consisting of a lower mold in which the gate is formed so that the resin injection portion is located on the back side of the through hole 11 portion of the substrate, injecting a transparent epoxy resin. そして樹脂を硬化させることにより、図1に示されるように、各セグメントを構成する透明樹脂部3が形成される。 And by curing the resin, as shown in FIG. 1, the transparent resin portion 3 constituting each segment is formed. その後、基板の裏面のゲート部分に付着した樹脂を除去することにより、裏面が平面で、裏面端部に端子電極15が形成され、かつ、各セグメントが樹脂部により連結されないで、セグメント間で光の漏れが生じない表面実装型の樹脂モールド型表示装置が得られる。 Thereafter, by removing the resin adhering to the gate portion of the back surface of the substrate, the back surface is a plane, the terminal electrodes 15 are formed on the back end, and, in each segment are not connected by the resin portion, the light between segments surface-mount of the resin mold type display device leakage does not occur is obtained.

【0021】本発明によれば、基板上に設けられたセグメントを構成する発光部ごとに透明樹脂により直接被覆された透明樹脂部が形成されているため、遮光壁が設けられたカバーなどを被せる必要がない。 According to the present invention, since the transparent resin part that is covered directly by the transparent resin for each light-emitting portion constituting the segments provided on the substrate are formed, covered with a cover which light shielding wall is provided there is no need. そのため、従来の遮光壁を有するケースを用いた構造では、基板の表面の高さが5mm程度が限度であったものが、1mm程度の高さで形成することができ、非常に低くすることができ、またセグメント間の間隔を小さくすることができ、 Therefore, in the structure using the casing having a conventional light barriers, that the height of the surface of the substrate was the limit of about 5mm may be formed at 1mm as high as, be very low can, also it is possible to reduce the distance between the segments,
薄型で小形の表示装置が得られる。 Small-sized display device can be obtained with a flat-screen. 一方において、各セグメントの透明樹脂部は、基板の裏面から樹脂が注入されることにより形成されているため、発光部側ではそれぞれ独立して形成されており、セグメント間で光が漏れて表示を不鮮明にすることはない。 On the other hand, the transparent resin portion of each segment, which is formed by the resin is injected from the rear surface of the substrate, the light emitting portion are formed independently of each other, the display light leaks between segments It will not be blurred. その結果、従来は遮光壁を有するカバー内にセグメント部の透明樹脂を流し込んだ厚形で大型の表示装置しか構成することができなかったものを、基板表面のセグメント部のみを透明樹脂部で被覆する非常に薄型で小形の樹脂モールド型表示装置を実現することができた。 As a result, conventionally covers the ones that could not be made only large display device poured the transparent resin of the segment portion in a cover having a light shielding wall thick section, only the segment portion of the substrate surface with a transparent resin portion very it can be realized compact resin molding type display device thin to.

【0022】前述の例では、基板の表面に各セグメントを構成する透明樹脂部を基板表面に形成するだけの構成であったが、透明樹脂部3の間隙に光を透過させない樹脂などをさらに充填することにより、従来の反射壁を有するケースと同様の遮光壁を形成することができる。 [0022] In the above example, the transparent resin portion constituting the respective segments on the surface of the substrate was only configuration is formed on the substrate surface, further filled with a resin which does not transmit light in the gap of the transparent resin portion 3 by, it is possible to form a similar light shielding wall and the case with conventional reflective wall. この場合でも、図1に示される構造で透明樹脂部3の表面を金型で閉塞して樹脂を流し込むだけでその間隙部に不透明樹脂が充填されて形成されるため、高さや横の寸法が変ることはなく、非常に薄型で小形の樹脂モールド型表示装置を得ることができる。 In this case, since the opaque resin in the gap portion just pouring resin clogged in structures mold surface of the transparent resin portion 3 in which is illustrated in Figure 1 is formed by filling, the height and lateral dimensions It never changes, very can be obtained thin in compact resin molding type display device.

【0023】また、前述の例は7セグメントの例であったが、7セグメントに限らず、ドットマトリクス表示器などの他の表示装置においても同様に直接各画素ごとに基板の裏面からスルーホールを介して樹脂を充填することにより薄型の樹脂モールド型表示装置を構成することができる。 Further, the foregoing example was the example of the 7 segment, 7 is not limited to the segment, the through-hole from the back surface of the substrate for each pixel directly also in other display devices such as a dot matrix display by filling the resin through it can constitute a thin resin mold type display device. ドットマトリクス表示装置を本発明の樹脂モールド型により形成した場合の一例を図2に斜視図で示す。 An example of a case of forming a resin mold of the present invention a dot matrix display device shown in perspective view in FIG. 図2において、発光部は図示されていないが、図1 2, a light-emitting portion is not shown, FIG. 1
(b)に示されるのと同様にLEDチップの各電極が電極パターンに接続されることにより形成される。 (B) Similarly LED chips each electrode of to that shown in is formed by being connected to the electrode pattern. なお、 It should be noted that,
図1と同じ部分には同じ符号を付してある。 The same parts as in FIG. 1 are denoted by the same reference numerals. この場合はとくに画素(ドット)の数が多いため、配線パターンを基板の裏面に形成することにより、配線によるドット間の間隔を広くする必要もなく、ドット間の狭い表示品位の優れたドットマトリクス表示装置が得られる。 Because a large number of this case, especially pixels (dots), by a wiring pattern formed on the back surface of the substrate, there is no need to widen the spacing between the dots due to the wiring, dot matrix excellent narrow display quality between dots display device can be obtained.

【0024】 [0024]

【発明の効果】本発明によれば、遮光壁を有するケースなどが必要でないため、部品点数が少なく、しかも組立も簡単で組立工数の少ない安価な表示装置が得られる。 According to the present invention, because it is not necessary such as a case having a shielding wall, fewer parts, yet assemble simple assembling steps less inexpensive display device can be obtained.
また、基板の表面を非常に薄型に形成することができ、 Also very it can be formed on the thin surface of the substrate,
表面実装が可能な薄型の表示装置が得られる。 Surface mounting capable thin display device can be obtained.

【0025】さらに、各画素を構成する透明樹脂部をそれぞれ独立して形成することができるため、画素に応じて指向性をもたせるなどのレンズ形状を自由に形成することができ、表示装置の応用範囲を広げることができる。 Furthermore, since the transparent resin portion constituting each pixel can be formed independently, the lens shape such as impart a directivity can be freely formed depending on the pixel, the application of the display device range can be widened.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の樹脂モールド型表示装置の一実施形態の説明図である。 1 is an illustration of an embodiment of the resin mold type display device of the present invention.

【図2】本発明の樹脂モールド型表示装置の他の形態の説明図である。 Figure 2 is an illustration of another embodiment of the resin mold type display device of the present invention.

【図3】樹脂モールドタイプにより表示装置を形成しようとする場合の問題点を説明する図である。 3 is a diagram for explaining problems of the case of forming a display device by a resin mold type.

【図4】従来の7セグメント表示器の構成の説明図である。 Figure 4 is an illustration of a structure of a conventional 7-segment displays.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 基板 2 発光部 3 透明樹脂部 11 スルーホール 21 LEDチップ 1 substrate 2 emitting portion 3 transparent resin portion 11 through hole 21 LED chips

Claims (4)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 基板と、該基板の表面に画素を構成すべく設けられる複数個の発光部と、該複数個の発光部の各発光部ごとに該発光部を被覆し、モールド成形により形成される透明樹脂部とからなる樹脂モールド型表示装置。 1. A coated substrate, a plurality of light emitting section provided so as to constitute a pixel on the surface of the substrate, the light-emitting portion in each light-emitting unit having light emitting units plurality, formed by molding Plastic molded display device comprising a transparent resin portion being.
  2. 【請求項2】 前記各発光部の透明樹脂部の間隙部に不透明樹脂が充填されてなる請求項1記載の樹脂モールド型表示装置。 Wherein said resin mold type display device according to claim 1, wherein the opaque resin in the gap portion is formed by filling of the transparent resin portion of the light-emitting portions.
  3. 【請求項3】 前記基板の各発光部ごとに前記透明樹脂部を形成するための樹脂充填用のスルーホールが設けられてなる請求項1または2記載の樹脂モールド型表示装置。 3. A resin molding type display device of the through hole is provided according to claim 1 or 2, wherein the resin filling for forming the transparent resin portion in each light-emitting portion of the substrate.
  4. 【請求項4】 (a)基板に、各画素を構成する発光部を形成するための電極パターン、該電極パターンと接続される配線パターン、および各発光部ごとにスルーホールをそれぞれ設け、(b)前記各発光部に発光素子チップをマウントして前記電極パターンと電気的に接続し、 4. A (a) a substrate, provided the electrode pattern to form a luminescence part included in each pixel, the wiring pattern is connected to the electrode patterns, and a through hole for each light-emitting portion, respectively, (b ) said mount the light emitting device chip in the light-emitting portions connected to the electrode pattern electrically,
    (c)前記基板を前記各発光部上に空洞部を形成したモールド成形用の金型内に入れ、前記スルーホールの前記基板の裏面側に前記金型のゲートを接続して樹脂を注入することを特徴とする樹脂モールド型表示装置の製法。 (C) putting the substrate into a mold for molding that forms a cavity portion on the light-emitting portions, and connecting the gate of the mold on the back side of the substrate of the through hole injecting resin preparation of the resin mold type display apparatus characterized by.
JP10025762A 1998-02-06 1998-02-06 Resin molding type display device and its manufacture Pending JPH11224063A (en)

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Application Number Priority Date Filing Date Title
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JPH11224063A true JPH11224063A (en) 1999-08-17

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031854A (en) * 2001-07-13 2003-01-31 Stanley Electric Co Ltd Seven segment led figure indicating unit and its manufacturing method
WO2008013097A1 (en) * 2006-07-25 2008-01-31 Showa Denko K.K. Light emitting apparatus, display apparatus and method for manufacturing light emitting apparatus
US9564567B2 (en) 2005-06-24 2017-02-07 Lg Innotek Co., Ltd. Light emitting device package and method of fabricating the same
WO2017061226A1 (en) * 2015-10-05 2017-04-13 ソニー株式会社 Light emitting device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031854A (en) * 2001-07-13 2003-01-31 Stanley Electric Co Ltd Seven segment led figure indicating unit and its manufacturing method
US9564567B2 (en) 2005-06-24 2017-02-07 Lg Innotek Co., Ltd. Light emitting device package and method of fabricating the same
WO2008013097A1 (en) * 2006-07-25 2008-01-31 Showa Denko K.K. Light emitting apparatus, display apparatus and method for manufacturing light emitting apparatus
JPWO2008013097A1 (en) * 2006-07-25 2009-12-17 昭和電工株式会社 Light emitting device, display device, and method of manufacturing light emitting device
US8157400B2 (en) 2006-07-25 2012-04-17 Showa Denko K.K. Light emitting apparatus, display apparatus and method for manufacturing light emitting apparatus
JP5121713B2 (en) * 2006-07-25 2013-01-16 昭和電工株式会社 Light emitting device, display device, and method of manufacturing light emitting device
WO2017061226A1 (en) * 2015-10-05 2017-04-13 ソニー株式会社 Light emitting device

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