JPH096259A - Led display - Google Patents

Led display

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Publication number
JPH096259A
JPH096259A JP7151823A JP15182395A JPH096259A JP H096259 A JPH096259 A JP H096259A JP 7151823 A JP7151823 A JP 7151823A JP 15182395 A JP15182395 A JP 15182395A JP H096259 A JPH096259 A JP H096259A
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JP
Japan
Prior art keywords
led
light emitting
emitting diode
insulating layer
electrode portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7151823A
Other languages
Japanese (ja)
Inventor
正康 ▲よし▼浦
Tatsuya Motoike
Masami Yasumoto
Masayasu Yoshiura
正美 保本
本池  達也
Original Assignee
Sanyo Electric Co Ltd
Tottori Sanyo Electric Co Ltd
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Tottori Sanyo Electric Co Ltd, 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical Sanyo Electric Co Ltd
Priority to JP7151823A priority Critical patent/JPH096259A/en
Publication of JPH096259A publication Critical patent/JPH096259A/en
Application status is Pending legal-status Critical

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Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/20Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent

Abstract

PURPOSE: To provide an LED display having a high display grade. CONSTITUTION: The LED display is equipped with a board 1 on the surface of which a large number of LED electrode parts are arranged, light emitting diode elements 7 which are arranged on electrodes of the electrode parts and are wired via metal fine wires, a white first insulation layer 12a arranged in an area on the electrode parts excluding the arranged area of the light emitting diode elements 7 and the metal fine wires, a black second insulation layer 13 arranged so as to fill the space among the electrode parts, and light transmissible resin 11 which is arranged over the electrode parts so as to cover the light emitting diode elements 7 and the first insulation layer 12a. Thereby, the height of molding resin is heightened by the insulation layers 12a, 13, and also the light generated from the light emitting diode elements 7 is effectively reflected by the white insulation layer 12a so that color mixing performance can be excellent in the case of different luminescent colors. Contours of LED parts can be clear by the black insulation layer 13 so that a display grade can be heightened.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、基板上に直接多数個のLED部を形成したLED表示器に関する。 The present invention relates to a LED indicator forming a plurality of LED unit directly on the substrate.

【0002】 [0002]

【従来の技術】LEDを文字や図柄の表示に用いる場合、従来は既製のLEDを用い、これらを基板上にマトリックス状に配置して表示器を構成していた(特開平1 When using the Related Art LED for displaying characters and figures, the prior art uses off-the-shelf LED, these constituted the indicator disposed in a matrix on a substrate (JP-A-1
−194479号公報等)。 -194,479 JP, etc.). しかしながら、既製のLE However, off-the-shelf LE
Dを用いるので、その組立て作業性が悪いとともに、発光方向が不揃いになりやすく安定した表示を行うことができなかった。 Since use of D, with its assembling workability is poor, the light emitting direction could not perform display easily stabilized irregular. そこで、最近は、LED部を基板上に直接形成して上記問題点を解決した表示器が開発されている。 Therefore, recently, display in which the above-described problems of the LED unit formed directly on the substrate has been developed.

【0003】 [0003]

【発明が解決しようとする課題】上記のようにLED部を直接基板上に形成する場合は、次のような解決すべき課題がある。 THE INVENTION Problems to be Solved] When forming on a substrate of the LED unit as described above directly, there is problems to be solved as follows. まず、発光ダイオード素子を配置し接続するための所定形状の電極群から成るLED用電極部を基板表面に多数形成し、これらを接続するための配線も基板表面に形成しているので、LED用電極部の周囲が前記配線の存在によって凸凹になり易い。 First, the LED electrode portion made of the electrode group of a predetermined shape for the light emitting diode elements are arranged connected to form a large number on the surface of the substrate, since the formed wiring even substrate surface for connecting them, for LED It tends to irregularities around the electrode part by the presence of the wiring. この凸凹は数十μm程度と小さいが、電極上に配置される発光ダイオード素子の大きさ(300μm角程度)に比べるとかなり大きな値であるため、発光ダイオード素子の光がこの凸凹に沿って逸散し易く、表示のための光量不足、輪郭不良を生じやすい。 This unevenness is small and several tens μm approximately, because compared to the size of the light emitting diode elements arranged on the electrode (about 300μm square) is a fairly large value, the light emitting diode element along the unevenness Yat easy Shi dispersion, insufficient light, prone contour defects for display. 特に、LED用電極部周囲の反射枠を省略する場合は、LED用電極部に発光ダイオード素子を覆う樹脂をモールドするに際して、前記凸凹に沿って樹脂が周囲に流れ出すことによって樹脂の形状が安定せず、発光方向にムラが生じやすい。 In particular, when omitting the reflective frame around the electrode section for the LED, when molding the resin covering the light emitting diode element to the electrode portions for LED, the resin is unstable shape of the resin by flowing around along said irregularities not, unevenness is likely to occur in the direction of light emission. また、基板表面に反射枠を設ける場合においても、隣接するLED部が上記凸凹を介して反射枠の裏側部分で連絡し、この連絡部分を介して隣のLED部の光が漏れ出すことが生じる。 Further, in the case of providing the reflecting frame to the substrate surface is also, LED portion adjacent to contact with rear portion of the reflector frame through the unevenness occurs that leakage of light in the LED portion adjacent through this contact portion . そしてまた、金メッキ等が施された電極部を覆うように樹脂を滴下してモールドする際、電極部の表面張力が比較的小さいので、樹脂の高さを高くすることができないとともに、発光色の異なる複数の発光ダイオード素子を設ける場合、透明樹脂の下面が金メッキ電極であると混色性が悪い。 And also, when the mold by dropping the resin so as to cover the gold plating or the like electrode portion which has been subjected, since the surface tension of the electrode portion is relatively small, with not possible to increase the height of the resin, the emission color of when providing a plurality of different light emitting diode element, poor color mixing properties when the lower surface of the transparent resin is gold-plated electrode. そしてまた、基板の裏側に駆動用の回路基板などが配置されるが、これらの回路から発生する不要電波のシールド対策が十分成されていない。 And also, such as a circuit board for driving the back side of the substrate but is arranged, a shield measure unwanted radio waves generated from these circuits is not performed sufficiently.

【0004】 [0004]

【課題を解決するための手段】本発明は上記の点を考慮して成されたもので、所定形状の電極群から成るLED SUMMARY OF THE INVENTION The present invention has been made in view of the above, LED consisting of electrodes having a predetermined shape
用電極部を表面に多数配列したLED表示用基板と、該LED用電極部の電極上に配置して金属細線を介して配線された発光ダイオード素子と、前記発光ダイオード素子と金属細線を囲むように前記LED用電極部上に配置した白色系の第1絶縁層と、前記LED用電極部の間を埋めるように配置した黒色系の第2絶縁層と、前記発光ダイオード素子及び前記第1絶縁層を覆うように前記L A substrate for LED display in arranging a large number of use the electrode portion on the surface, a light emitting diode device is wired via a thin metal wire placed on the electrode of the LED electrode portion, so as to surround the light emitting diode element and the thin metal wire wherein a first insulating layer disposed on the LED electrode portion of the white, and a second insulating layer of blackish arranged so as to fill between the LED electrode portion, the light emitting diode element and said first insulated the covering layer L
ED用電極部上に配置した透光性樹脂とを備えて構成したものである。 It is constructed by a translucent resin which is disposed on the ED electrode portion.

【0005】また、本発明は、表面に、所定形状の電極群から成る多数個のLED用電極部と該LED用電極部と絶縁して該多数個のLED用電極部の間を埋めるように配置した共通電極部とを有し、これらを略同一厚みの導電層によって構成した基板と、前記LED用電極部の電極上に配置して金属細線を介して配線された発光ダイオード素子と、前記発光ダイオード素子と金属細線の配置領域を除く前記LED用電極部上の領域及び前記共通電極部の略全面を覆う領域に配置した白色系の第1絶縁層と、前記共通電極部上の前記第1絶縁層上に積層配置した黒色系の第2絶縁層と、前記発光ダイオード素子及び前記第1絶縁層を覆うように前記LED用電極部上に配置した透光性樹脂とを備えて構成したものである。 [0005] The present invention relates to a surface, so as to fill between the number consisting of the electrode group number of the LED electrode portion and said insulated from the LED electrode part several LED electrode portion multi of predetermined shape and a placement the common electrode unit, these and a substrate constituted by a conductive layer having substantially the same thickness, a light emitting diode device is wired via a thin metal wire placed on the electrode of the LED electrode portion, wherein a light emitting diode element and white first insulating layer disposed in a region that covers substantially the whole surface area and the common electrode portion on the LED electrode portions except for the arrangement region of the thin metal wire, said on the common electrode portion first 1 and a second insulating layer of blackish laminated disposed on the insulating layer, was constructed and a translucent resin disposed on the light emitting diode element and the first to cover the insulating layer and the LED electrode portion on it is intended.

【0006】 [0006]

【作用】本発明は上記のように、発光ダイオード素子と金属細線を囲むようにLED用電極部上に白色系の第1 DETAILED DESCRIPTION OF THE INVENTION The present invention as described above, the light emitting diode element and the first white on the LED electrode portion so as to surround the thin metal wire
絶縁層を配置したので、LED用電極部にモ−ルド用樹脂を配置する際、第1絶縁層の表面張力によって樹脂の高さを高めることができるとともに、透光性樹脂の下面外周部に白色系の第1絶縁層が位置し、発光ダイオード素子から発生する光を効果的に反射することができる。 Having placed the insulating layer, mode to the electrode portions for LED - when placing shield resin, it is possible to increase the height of the resin by the surface tension of the first insulating layer, on the lower surface outer peripheral portion of the translucent resin and first insulating layer located whitish, light generated from the light emitting diode element can be effectively reflected.
発光色の異なる複数の発光ダイオード素子を配置する場合は、白色系の第1絶縁層によって混色性を良好にすることができる。 When placing a plurality of different light emitting diode elements having light emitting colors, it is possible to improve the color mixing performance by white first insulating layer. また、前記LED用電極部の間を埋めるように黒色系の第2絶縁層を配置することにより、LE Further, by disposing the second insulating layer blackish to fill between the LED electrode portion, LE
D部輪郭を鮮明にして表示品位を高めることができる。 In the sharp part D contour can improve the display quality.

【0007】また、本発明は上記のように、隣接するL Further, the present invention is as described above, the adjacent L
ED用電極部の間を埋めるように共通電極部を配置したので、LED用電極部の周囲が平坦化され、また、一定の高さで囲まれるので、不所望の光漏れを防ぐとともに、LEDモ−ルド用樹脂を配置して成形するに際して樹脂の安定した成形を可能とする。 Since placing the common electrode portion so as to fill the space between the electrode portions for ED, around the LED electrode portion is flattened, and since surrounded by a constant height, while preventing unwanted light leakage, LED mode - to enable stable molding of the resin during molding by placing a shield resin. また、共通電極部は、不要電波を吸収するシールド層として有効に機能する。 Further, the common electrode portion effectively functions as a shield layer for absorbing unnecessary radio waves. さらにまた、LED用電極部と共通電極部とを略同一厚みの導電層によって構成し、共通電極部の略全面を第1、第2の絶縁層によって覆うことにより、LED用電極部の周囲が共通電極部と絶縁層によって所定の高さで囲まれ、不所望の光漏れを防ぐとともに、LED用電極部にモ−ルド用樹脂を配置する際の樹脂の流れ出しを共通電極部と絶縁層によって抑制することができる。 Furthermore, the an LED electrode portion and the common electrode portion constituted by a conductive layer having substantially the same thickness, the first substantially the whole surface of the common electrode section, by covering the second insulating layer, is around the LED electrode portion surrounded by a predetermined height by the common electrode portion and the insulating layer, it prevents the unwanted light leakage, to the electrode portions for LED mode - the outflow of the resin at the time of arranging the shield resin and the common electrode portion by an insulating layer it can be suppressed.

【0008】 [0008]

【実施例】以下本発明の実施例を図面を参照して説明する。 Example will be described with reference to the drawings the following examples the present invention. 基板1は、黒く着色されたガラスエポキシ樹脂等の絶縁性基材2で構成され、その表面には、図2(a)に示すように複数個のLED用電極部3を互いに独立してマトリックス状(24行24列)に配置し、その裏面には、図3に透視図を示すように前記各LED用電極部3 Substrate 1 is an insulating substrate 2 such as a black colored glass epoxy resin, and on the surface thereof, independently from each other a plurality of LED electrode portion 3 as shown in FIG. 2 (a) Matrix Jo placed (24 rows 24 columns), the rear surface thereof, wherein each LED electrode portion 3 as shown in the perspective view in FIG. 3
の電気的接続配線を行う配線部を構成する銅箔製の配線パターン4を設けている。 It is provided an electrical connection copper-made wiring patterns 4 forming the wiring portion for performing wiring. 各LED用電極部3と配線パターン4の接続は、図1に示すように基材2を貫通するスルーホール5を介して基材2の内部で行われ、裏面の配線パターン4は、黒色の絶縁層によって覆われている。 Connection of the wiring pattern 4 and the electrode unit 3 for each LED is made internally through the through holes 5 which penetrate the base material 2 of the substrate 2 as shown in FIG. 1, the back surface of the wiring pattern 4 is black It is covered by an insulating layer.

【0009】各LED用電極部3は、所定形状の導電金属箔製の電極群、すなわち図2(b)に示すように、全体で円形状を成し、必要に応じて表面に金メッキが施された3つの銅箔製リード電極3a,3b,3cで構成されている。 [0009] Each LED electrode 3, the conductive metal foil made of the electrode group of a predetermined shape, i.e. as shown in FIG. 2 (b), a circular shape in total gold on the surface as needed facilities are three copper foil manufactured by the lead electrodes 3a, 3b, are composed of 3c. 各リード電極3a,3b,3cには、基材2 Each lead electrodes 3a, 3b, the 3c, the substrate 2
を貫通する前記スル−ホール5が形成され、図1に示すように、スルーホール5に設けた配線用銅箔を介して裏面の配線パターン4への配線が行われる。 The sul penetrating - a hole 5 is formed, as shown in FIG. 1, the wiring to the back surface of the wiring pattern 4 is performed via the wiring copper foil provided in the through-hole 5. 各LED用電極部3は、このように基材2を貫通する配線用銅箔と基材2裏面の配線パターン4によってそれぞれ電気的な接続を行い、基材2表面側での接続は行っていないので、 Each LED electrode unit 3 is thus performed electrically connected to each other by wiring copper foil and the substrate 2 the back surface of the wiring pattern 4 through the substrate 2, the connection with the base material 2 surface is gone Since there is no,
基材2表面側では互いに独立している。 They are independent of one another in the substrate 2 surface. そして、図1, Then, as shown in FIG. 1,
図4に示すLED部6を構成するに際し、図1,5,6 Upon constituting the LED unit 6 shown in FIG. 4, FIG. 1, 5, 6
に点線で示すように、所定のリード電極には、1個〜複数個の発光ダイオード素子7が導電性接着剤を介して取り付けられ、この発光ダイオード素子7は他のリード電極に金やアルミニウムなどの金属細線8を用いたワイヤ−ボンデイング配線によって電気的に接続される。 In as indicated by the dotted line, the predetermined lead electrodes, one to a plurality of light emitting diode element 7 is attached via a conductive adhesive, the light emitting diode element 7 to the other lead electrode gold or aluminum, etc. wire using a thin metal wires 8 - are electrically connected by bonding wires.

【0010】基板1の表面には、図2、特に同図(b) [0010] On the surface of the substrate 1, 2, particularly FIG. (B)
に示すように、隣接する各LED用電極部3の間を埋めるように共通電極部9を形成している。 As shown in, to form a common electrode portion 9 so as to fill between the LED electrode portions 3 adjacent. この共通電極部9は、LED用電極部3を構成するリード電極3a,3 The common electrode portion 9, the lead electrodes 3a, 3 constituting the LED electrode portion 3
b,3cと同じ材料である銅箔をエッチングして構成しているので、LED用電極部3と略同じ厚みを有する。 b, since the copper foil of the same material as 3c constitute by etching, and has substantially the same thickness as the LED electrode unit 3.
共通電極部9と各LED用電極部3の間には、互いに電気的絶縁を保つための環状の絶縁領域10が銅箔をエッチングして設けられている。 Between the common electrode 9 and the respective LED electrode portion 3, an annular insulation region 10 for maintaining electrical insulation from each other it is provided by etching a copper foil. このように、LED用電極部3の周囲は、単一厚みの共通電極部9が環状に囲むので凸凹のない平坦面とすることができ、また、共通電極部9の縁が環状に同一高さで囲むので、LEDを構成するに際して、透光性樹脂11をLED用電極部3に流し込んでモ−ルドする際、透光性樹脂11をより均一に成形することができる。 Thus, around the LED electrode unit 3, since the common electrode 9 of a single thickness to annularly surround can be no uneven flat surface, also the same high edge of the common electrode 9 is annularly because enclosed in is, when composing the LED, by pouring translucent resin 11 to the LED electrode portion 3 mode - when field, it is possible to form the translucent resin 11 more uniformly. また、共通電極部9は、LED用電極部3の間を埋めるように基板1に広範囲に形成しているので、基板1もしくは基板1に別途取り付けられる駆動基板から発生する不要電波を吸収するシールド層として有効に機能させることができる。 Further, the common electrode portion 9, since the widely formed on the substrate 1 so as to fill the space between the LED electrode unit 3, absorbing the unnecessary radio waves generated from the driving substrate that is separately attached to the substrate 1 or the substrate 1 Shield it can function effectively as a layer.

【0011】発光ダイオード素子7と金属細線8を囲むように各LED用電極部3の上面外周部に位置する領域12aと、前記共通電極部9の略全面を覆う領域12b [0011] light emitting diode element 7 and the region 12a is located in the outer peripheral part of the upper surface of the LED electrode portion 3 so as to surround the metal thin wires 8, a region 12b that covers substantially the whole surface of the common electrode 9
には、図5に斜線で示すように電気的絶縁性を有し、光反射性が良く、また、LED用電極部3よりも大きな表面張力を有する白色系絶縁層12(12a,12b) To have an electrically insulating property as indicated by hatching in FIG. 5 may light reflectivity, also white insulating layer having a larger surface tension than LED electrode portion 3 12 (12a, 12b)
を、スクリーン印刷などによって形成し、略均一な厚み(共通電極部9の厚みよりも2〜3倍程度厚く設定)を有して配置している。 And was formed by a screen printing, are arranged with a substantially uniform thickness (2-3 times than the thickness of the common electrode 9 thicker setting). このように、各LED用電極部3 Thus, the electrode unit 3 for each LED
の上面外周部に発光ダイオード素子7と金属細線8を囲むように、光反射性が良く、また、LED用電極部3よりも大きな表面張力を有する白色系絶縁層12aを配置することにより、透光性樹脂11を成形する際、粘度の低い状態の透光性樹脂の裾野部分に白色系絶縁層12a So as to surround the light emitting diode element 7 and the metal thin wires 8 on the upper surface outer peripheral portion of the well light reflectivity, also by than LED electrode unit 3 to arrange the white insulating layer 12a having a larger surface tension, Toru when molding an optical resin 11, the white-based insulating layer 12a on the tail part of the translucent resin of low viscosity state
の表面張力が作用することによって、透光性樹脂の全体高さを高く維持して成形することができる。 By the surface tension of the acts can be molded while maintaining a high overall height of the translucent resin. また、透光性樹脂11の下面となる部分に白色系絶縁層12aが存在するので、発光ダイオード素子7から発せられる光の反射効率を良くすることができるとともに、発光色の異なる発光ダイオード素子を用いた場合の混色性を良くすることができる。 Further, since the white insulating layer 12a is present in the portion of the lower surface of the translucent resin 11, it is possible to improve the reflection efficiency of light emitted from the light emitting diode element 7, the emission color of the different light emitting diode element it is possible to improve the color mixing properties when used. 尚、共通電極部9の略全面を覆う絶縁層12bは、製造工程を簡素化するために絶縁層12a The insulating layer 12b that covers substantially the whole surface of the common electrode portion 9, the insulating layer 12a in order to simplify the manufacturing process
と同じ材料によって形成したが、他の材料によって構成することもでき、後述する黒色系絶縁層13の形成と同時に形成することもできる。 And was formed by the same material, can also be constituted by other materials, it can be formed simultaneously with the formation of the black-based insulating layer 13 to be described later.

【0012】共通電極部9の略全面を覆う領域には、図6に交差斜線で示すように電気的絶縁性を有し、光吸収性が良く、また、LED用電極部3よりも大きな表面張力を有する黒色系絶縁層13を、スクリーン印刷などによって形成し、略均一な厚み(共通電極部9の厚みよりも2〜3倍程度厚く設定)を有して配置している。 [0012] The region covering substantially the whole surface of the common electrode 9 has an electrically insulating property as indicated by the cross hatching in FIG. 6, good light absorbing properties, also larger surface than LED electrode portion 3 the black-based insulating layer 13 having a tension is formed by screen printing, are arranged with a substantially uniform thickness (2-3 times than the thickness of the common electrode 9 thicker setting). このように、黒色系絶縁層13を設けることにより、LED Thus, by providing a black-based insulating layer 13, LED
用電極部3を囲む領域を平坦にすることができるとともに、図1に示すように共通電極部9と白色系絶縁層12 With the region surrounding the use electrode portion 3 can be made flat, white insulating layer 12 and the common electrode 9 as shown in FIG. 1
b及び黒色系絶縁層13の端縁の高さ、すなわち、LE b and the black-based insulating layer 13 edge height, i.e., LE
D用電極部3の周囲を環状絶縁領域10を介して環状に囲む壁14として機能する部分の高さを高くして透光性樹脂11の流れ出しを有効に防止するとともに、発光ダイオード素子7の光漏れ路を塞ぐことができる。 The periphery of the D electrode unit 3 is prevented effectively flowing out of the annular insulating region 10 serves as a wall 14 which surrounds annularly via a portion of the height and higher translucent resin 11, the light emitting diode element 7 it can block the light leakage path. また、 Also,
黒色系絶縁層13を共通電極部9の上に設けることにより、不要反射光の吸収効果を高めることができ、LED By providing a black-based insulating layer 13 on the common electrode 9, it is possible to enhance the absorbing effect of the unnecessary reflected light, LED
部6を点灯した場合の色合いを鮮明にすることができる。 Hue when the part 6 lights up can be sharper. 尚、共通電極部9を覆う絶縁層は、黒色系絶縁層1 The insulating layer covering the common electrode portion 9, the black-based insulating layer 1
3のみで構成することもでき、この場合、黒色系絶縁層13の上面が白色系絶縁層12aの上面と同等の高さ、 3 only can be configured, in this case, the upper surface of the black-based insulating layer 13 is equivalent to the top surface of the white-based insulating layer 12a height,
好ましくは白色系絶縁層12aより高くなるように形成するとよい。 Preferably it may be formed to be higher than the white-based insulating layer 12a.

【0013】そして、上記基板1の各LED用電極部3 [0013] Each LED electrode portions 3 of the substrate 1
に発光ダイオード素子7を上述のように導電性接着剤によって取り付けた後、金属細線8を用いたボンデイングによって配線し、このボンデイング部分を覆うように例えばノズルから透光性樹脂11を滴下して樹脂モ−ルド成形し、あるいは、必要に応じて、例えば図4に対応するような円形の窓をマトリックス状に設けた反射枠(図示せず)を基板1に配置して上記ボンデイング部分を覆うように透光性樹脂11を流し込んで樹脂モ−ルド成形し、LED部6を基板1上に直接形成することによって、マトリックス状のLED部6を有するLED表示器を構成することができる。 Emitting After the diode element 7 mounted by a conductive adhesive as described above, and wiring by bonding using thin metal wires 8, dropping translucent resin 11 for example from the nozzles so as to cover the bonding portion to the resin mode - and field shaping, or, if necessary, for example, reflection frame provided in a matrix of circular window that corresponds to FIG. 4 (not shown) to the cover the bonding portion is disposed on the substrate 1 the infused with translucent resin 11 resin mode - with field shaping, the LED unit 6 by directly formed on the substrate 1, it is possible to configure the LED indicator having a matrix of LED section 6. 反射枠を配置する場合は、各LED用電極部3の周囲が黒色系樹脂層13の存在によって平坦化されているので、基板1と反射枠との密着性がよく光漏れ路が形成されない。 When placing the reflecting frame, around each LED electrode unit 3 since it is flattened by the presence of the black resin layer 13, the adhesion is good light leakage path between the substrate 1 and the reflective frame is not formed. また、反射枠を配置しないで透光性樹脂11をモ−ルド成形すると、発光ダイオード素子7の光を透光性樹脂11を介して広範囲に出力することができるので、視認性を良好とすることができる。 Further, the translucent resin 11 not place reflective frame mode - when field shaping, since the light emitting diode element 7 can be output over a wide range through the translucent resin 11, and good visibility be able to.

【0014】また、各LED用電極部3の上面外周部に大きな表面張力を有する白色系絶縁層12aを配置しているので、透光性樹脂11を成形する際、粘度の低い状態の透光性樹脂の裾野部分を白色系絶縁層12aの表面張力作用によって盛り上げ、透光性樹脂の全体高さを高く維持して成形することができる。 Further, since the arrangement of white-based insulating layer 12a having a larger surface tension on the upper surface outer peripheral portion of the LED electrode section 3, when forming the translucent resin 11, the low viscosity state translucency the tail part of rESIN raised by surface tension effects of the white-based insulating layer 12a, can be molded while maintaining a high overall height of the translucent resin. そして、樹脂がLE Then, the resin is LE
D用電極部3の周囲に流れ出したとしても、各LED用電極部3の周囲が、図1に示すように、環状絶縁領域1 Even flows around the D electrode 3, around each LED electrode unit 3, as shown in FIG. 1, the annular insulating region 1
0、及び共通電極部9と絶縁層12b、13の端縁によって構成される環状の壁14によって囲まれるので、この環状絶縁領域10と壁14が透光性樹脂モールド時の樹脂の流れ出しを防止する溝、並びに堰として機能し、 0, and so is surrounded by the wall 14 of the formed annular by the edge of the common electrode 9 and the insulating layer 12b, 13, the annular insulation region 10 and the wall 14 is prevented from flowing out of the resin during the light-transmitting resin molding groove, and acts as a weir,
透光性樹脂11が硬化した時の形状を一定な形状にしてLED部6の品質を均一に揃えることができる。 The quality of the LED unit 6 may be uniformly aligned in the shape when the translucent resin 11 has cured to a predetermined shape.

【0015】 [0015]

【発明の効果】上述のように本発明によれば、発光ダイオード素子と金属細線を囲むようにLED用電極部上に白色系の第1絶縁層を配置したので、LED用電極部にモ−ルド用樹脂を配置する際、第1絶縁層の表面張力によって樹脂の高さを高めることができるとともに、透光性樹脂の下面外周部に白色系の第1絶縁層が位置し、発光ダイオード素子から発生する光を効果的に反射することができる。 Effects of the Invention According to the present invention as described above, since the arrangement of the first insulating layer of the white light emitting diode element and the LED electrode portions on so as to surround the metal thin wire, the electrode portion for LED mode - when placing the shield resin, it is possible to increase the height of the resin by the surface tension of the first insulating layer, a first insulating layer of white on the lower surface outer peripheral portion of the translucent resin is located, the light emitting diode element it is possible to effectively reflect light generated from. 発光色の異なる複数の発光ダイオード素子を配置する場合は、白色系の第1絶縁層によって混色性を良好にすることができる。 When placing a plurality of different light emitting diode elements having light emitting colors, it is possible to improve the color mixing performance by white first insulating layer. また、前記LED用電極部の間を埋めるように黒色系の第2絶縁層を配置することにより、LED部輪郭を鮮明にして表示品位を高めることができる。 Further, by disposing the second insulating layer blackish to fill between the LED electrode unit, the LED unit profile in the clear it is possible to increase the display quality.

【0016】また、本発明は上記のように、隣接するL Further, the present invention is as described above, the adjacent L
ED用電極部の間を埋めるように共通電極部を配置したので、LED用電極部の周囲が平坦化され、また、一定の高さで囲まれるので、不所望の光漏れを防ぐとともに、LEDモ−ルド用樹脂を配置して成形するに際して樹脂の安定した成形を可能とする。 Since placing the common electrode portion so as to fill the space between the electrode portions for ED, around the LED electrode portion is flattened, and since surrounded by a constant height, while preventing unwanted light leakage, LED mode - to enable stable molding of the resin during molding by placing a shield resin. また、共通電極部は、不要電波を吸収するシールド層として有効に機能する。 Further, the common electrode portion effectively functions as a shield layer for absorbing unnecessary radio waves. さらにまた、LED用電極部と共通電極部とを略同一厚みの導電層によって構成し、共通電極部の略全面を第1、第2の絶縁層によって覆うことにより、LED用電極部の周囲が共通電極部と絶縁層によって所定の高さで囲まれ、不所望の光漏れを防ぐとともに、LED用電極部にモ−ルド用樹脂を配置する際の樹脂の流れ出しを共通電極部と絶縁層によって抑制することができる。 Furthermore, the an LED electrode portion and the common electrode portion constituted by a conductive layer having substantially the same thickness, the first substantially the whole surface of the common electrode section, by covering the second insulating layer, is around the LED electrode portion surrounded by a predetermined height by the common electrode portion and the insulating layer, it prevents the unwanted light leakage, to the electrode portions for LED mode - the outflow of the resin at the time of arranging the shield resin and the common electrode portion by an insulating layer it can be suppressed.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の一実施例に係わる表示器の要部拡大断面図である。 1 is an enlarged cross-sectional view of a display device according to an embodiment of the present invention.

【図2】本発明の一実施例に係わる基板(絶縁層なし) Substrate according to an embodiment of the present invention; FIG (no insulating layer)
の平面図で、(a)は全体平面図、(b)は部分拡大平面図である。 A plan view of, (a) represents an overall plan view, and (b) is partially enlarged plan view.

【図3】本発明の一実施例に係わる基板の裏面に施した配線パターンを透視した平面図である。 3 is a plan view seen through the wiring pattern subjected to the back surface of the substrate according to an embodiment of the present invention.

【図4】本発明の一実施例に係わる表示器の平面図である。 4 is a plan view of a display device according to an embodiment of the present invention.

【図5】本発明の一実施例に係わる基板の第1絶縁層を施した状態の部分拡大平面図である。 5 is a first partial enlarged plan view of a state which has been subjected to an insulating layer of a substrate according to an embodiment of the present invention.

【図6】本発明の一実施例に係わる基板の第1,第2絶縁層を施した状態の部分拡大平面図である。 A first substrate according to an embodiment of the invention; FIG is a partially enlarged plan view of a state subjected to the second insulating layer.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 基板 2 基材 3 LED用電極部 6 LED部 7 発光ダイオード素子 8 金属細線 9 共通電極部 10 環状絶縁領域 11 透光性樹脂 12 白色系樹脂層 13 黒色系樹脂層 1 substrate 2 substrate 3 LED electrode portions 6 LED unit 7 light-emitting diode element 8 thin metallic wires 9 common electrode section 10 annular insulating region 11 translucent resin 12 white resin layer 13 black resin layer

フロントページの続き (72)発明者 本池 達也 鳥取県鳥取市南吉方3丁目201番地 鳥取 三洋電機株式会社内 Of the front page Continued (72) inventor Tatsuya Motoike Tottori Prefecture Tottori Minamiyoshikata 3-chome 201 address Tottori Sanyo Electric Co., Ltd. in

Claims (2)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 所定形状の電極群から成るLED用電極部を表面に多数配列したLED表示用基板と、前記LE 1. A and the substrate for LED display in arranging a large number of LED electrode portion on the surface consisting of the electrode group of a predetermined shape, the LE
    D用電極部の電極上に配置して金属細線を介して配線された発光ダイオード素子と、前記発光ダイオード素子と金属細線の配置領域を除く前記LED用電極部上の領域に配置した白色系の第1絶縁層と、前記LED用電極部の間を埋めるように配置した黒色系の第2絶縁層と、前記発光ダイオード素子及び前記第1絶縁層を覆うように前記LED用電極部上に配置した透光性樹脂とを備えることを特徴とするLED表示器。 A light emitting diode device is wired via a thin metal wire placed on the electrode of the electrode unit for D, whitish disposed in regions on the LED electrode portions except for the arrangement region of the light emitting diode element and the thin metal wire a first insulating layer, a second insulating layer of blackish arranged so as to fill between the LED electrode portion, disposed on the light emitting diode element and the first on the LED electrode portion so as to cover the insulating layer LED indicator, characterized in that it comprises a the translucent resin.
  2. 【請求項2】 表面に、所定形状の電極群から成る多数個のLED用電極部と該LED用電極部と絶縁して該多数個のLED用電極部の間を埋めるように配置した共通電極部とを有し、これらを略同一厚みの導電層によって構成した基板と、前記LED用電極部の電極上に配置して金属細線を介して配線された発光ダイオード素子と、 To 2. A surface, a common electrode which is disposed insulated from the number consisting of electrodes having a predetermined shape number of LED electrode portion and the LED electrode portion so as to fill between the several LED electrode portion multi and a part, these and a substrate constituted by a conductive layer having substantially the same thickness, a light emitting diode device is wired via a thin metal wire placed on the electrode of the LED electrode portion,
    前記発光ダイオード素子と金属細線の配置領域を除く前記LED用電極部上の領域及び前記共通電極部の略全面を覆う領域に配置した白色系の第1絶縁層と、前記共通電極部上の前記第1絶縁層上に積層配置した黒色系の第2絶縁層と、前記発光ダイオード素子及び前記第1絶縁層を覆うように前記LED用電極部上に配置した透光性樹脂とを備えることを特徴とするLED表示器。 Said light emitting diode element and the first insulating layer of white that is disposed in the region covering the substantially entire surface of the LED electrode portion on region and the common electrode portions except for the arrangement region of the thin metal wire, said on the common electrode portion a second insulating layer of blackish were stacked on the first insulating layer, further comprising a translucent resin disposed on the light emitting diode element and the first to cover the insulating layer and the LED electrode portion on LED indicator characterized.
JP7151823A 1995-06-19 1995-06-19 Led display Pending JPH096259A (en)

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Application Number Priority Date Filing Date Title
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003005674A (en) * 2001-06-18 2003-01-08 Sony Corp Display element and image display device
JP2008010791A (en) * 2006-06-30 2008-01-17 Matsushita Electric Works Ltd Light-emitting device
JP2008091864A (en) * 2006-09-08 2008-04-17 Nichia Chem Ind Ltd Light emitting device
JP2009076949A (en) * 2009-01-15 2009-04-09 Nichia Corp Led display device, and usage therefor
WO2014010354A1 (en) * 2012-07-09 2014-01-16 シャープ株式会社 Light emission device, illumination device, and insulating substrate
JP2016167518A (en) * 2015-03-09 2016-09-15 パナソニックIpマネジメント株式会社 Light emission device and luminaire
US10115875B2 (en) 2016-04-26 2018-10-30 Nichia Corporation Light-emitting device and method of manufacturing the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003005674A (en) * 2001-06-18 2003-01-08 Sony Corp Display element and image display device
JP2008010791A (en) * 2006-06-30 2008-01-17 Matsushita Electric Works Ltd Light-emitting device
JP2008091864A (en) * 2006-09-08 2008-04-17 Nichia Chem Ind Ltd Light emitting device
JP2009076949A (en) * 2009-01-15 2009-04-09 Nichia Corp Led display device, and usage therefor
WO2014010354A1 (en) * 2012-07-09 2014-01-16 シャープ株式会社 Light emission device, illumination device, and insulating substrate
CN104428911A (en) * 2012-07-09 2015-03-18 夏普株式会社 Light emission device, illumination device, and insulating substrate
JP2016167518A (en) * 2015-03-09 2016-09-15 パナソニックIpマネジメント株式会社 Light emission device and luminaire
US10115875B2 (en) 2016-04-26 2018-10-30 Nichia Corporation Light-emitting device and method of manufacturing the same

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