JPH1187740A - Formation method for surface mounted component - Google Patents
Formation method for surface mounted componentInfo
- Publication number
- JPH1187740A JPH1187740A JP25412397A JP25412397A JPH1187740A JP H1187740 A JPH1187740 A JP H1187740A JP 25412397 A JP25412397 A JP 25412397A JP 25412397 A JP25412397 A JP 25412397A JP H1187740 A JPH1187740 A JP H1187740A
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- forming
- semiconductor elements
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えばプリント回
路基板などに取付孔を設けることなく面で実装すること
を可能とした構成の面実装部品に係り、特に半導体素子
どうしの間に遮光壁を有する面実装部品の形成方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounted component having a structure enabling mounting on a surface of a printed circuit board or the like without providing a mounting hole, and more particularly to a light-shielding wall between semiconductor elements. The present invention relates to a method for forming a surface mount component having the same.
【０００２】[0002]
【従来の技術】従来この種の面実装部品９０の製造方法
を工程の順に示すのが図１２であり、先ず最初の工程と
しては図１２（ａ）に示すように例えばガラスエポキシ
など絶縁性基材の表裏面に銅箔パターン９２がエッチン
グなどにより所定形状で形成されたプリント回路基板な
どの基板９１を用意し、適宜の間隔で半導体素子である
発光素子９３及び受光素子９４をそれぞれ導電性接着剤
などにより一方の極を基板９１の銅箔パターン９２上に
マウントし、他方の極は金線などのワイヤ９６で前記銅
箔パターン９２と切離された他の前記銅箔パターン９２
へ接続する。2. Description of the Related Art FIG. 12 shows a conventional method of manufacturing a surface mount component 90 of this type in the order of steps. First, as shown in FIG. A substrate 91 such as a printed circuit board having a copper foil pattern 92 formed in a predetermined shape on the front and back surfaces of the material by etching or the like is prepared, and a light emitting element 93 and a light receiving element 94, which are semiconductor elements, are conductively bonded at appropriate intervals. One pole is mounted on the copper foil pattern 92 of the substrate 91 by an agent or the like, and the other pole is separated from the copper foil pattern 92 by a wire 96 such as a gold wire.
Connect to
【０００３】又、不透明樹脂などからなり略板状に形成
された遮光板９５を発光素子９３と受光素子９４の間の
基板９１上に接着剤により接着する。Further, a light-shielding plate 95 made of an opaque resin or the like and formed in a substantially plate shape is bonded to a substrate 91 between a light-emitting element 93 and a light-receiving element 94 with an adhesive.
【０００４】この後図１２（ｂ）に示すように、これら
発光素子９３、受光素子９４、遮光板９５を覆うように
金型９８をセットし、この金型９８内に透明樹脂を注入
してモールド部９７を形成し、透明樹脂が硬化後、金型
９８をはずすと図１２（ｃ）に示す面実装部品９０が完
成する。Thereafter, as shown in FIG. 12B, a mold 98 is set so as to cover the light emitting element 93, the light receiving element 94, and the light shielding plate 95, and a transparent resin is injected into the mold 98. After the mold 97 is formed and the transparent resin is cured, the mold 98 is removed to complete the surface mount component 90 shown in FIG.
【０００５】図１３はこのようにして形成された表面実
装部品９０の斜視図である。FIG. 13 is a perspective view of the surface mount component 90 thus formed.
【０００６】なお、本従来例では、面実装部品９０を１
つのみ表しその製造方法を説明しているが、大型の基板
上に整列して複数の銅箔パターン９２、発光素子９３、
受光素子９４及び遮光板９５を設け、モールド部９７を
形成し、最後に前記の大型の基板を各面実装部品９０ご
とにダイシングすることにより複数の面実装部品９０を
形成することが一般的に行われている。In this conventional example, the surface mount component 90 is
Although only one of them is described and its manufacturing method is described, a plurality of copper foil patterns 92, light emitting elements 93,
Generally, a plurality of surface mount components 90 are formed by providing a light receiving element 94 and a light shielding plate 95, forming a mold portion 97, and finally dicing the large substrate for each surface mount component 90. Is being done.
【０００７】このようにして形成された面実装部品９０
は、検出物の有無を判別する光センサーとして用いら
れ、その作用は発光素子９３より放出された光が、検出
物により反射され、受光素子９４に入射することにより
検出物の有無を判別する。その際、発光素子９３より放
出された光が直接受光素子９４に入射してしまうのを防
止するために遮光壁９５が形成されている。The surface mount component 90 thus formed
Is used as an optical sensor for determining the presence or absence of a detected object. The function of the light sensor is to determine the presence or absence of a detected object by the light emitted from the light emitting element 93 being reflected by the detected object and entering the light receiving element 94. At this time, a light shielding wall 95 is formed to prevent light emitted from the light emitting element 93 from directly entering the light receiving element 94.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、前記し
た従来の面実装部品９０の製造方法においては、前記遮
光板９５を成形後、発光素子９３と受光素子９４の間の
基板９１上に接着するため、前記遮光板９５を比較的大
型に形成しなくてはならず、前記発光素子９３と受光素
子９４の間隔も広めにとる必要があるため、これにより
面実装部品９０が大型のものとなってしまう問題点が生
じていた。However, in the above-described conventional method of manufacturing the surface mount component 90, the light shielding plate 95 is formed and then adhered onto the substrate 91 between the light emitting element 93 and the light receiving element 94. The light-shielding plate 95 must be formed relatively large, and the distance between the light-emitting element 93 and the light-receiving element 94 needs to be widened. As a result, the surface mount component 90 becomes large. A problem has arisen.
【０００９】また、前記したように遮光板９５を接着に
より固定するという工程が必要となり、煩雑な作業が増
え結果として面実装部品９０がコストアップするという
問題点も生じ、これらの点の解決が課題とされるものと
なっていた。Further, as described above, the step of fixing the light-shielding plate 95 by bonding is required, which leads to a problem that complicated work is increased and the cost of the surface-mounted component 90 is increased, thereby solving these problems. Had to be an issue.
【００１０】[0010]
【課題を解決するための手段】本発明は、前述の課題解
決のために、基板の両端部近傍に他端と一対となる複数
の貫通孔を列状に設ける工程と、前記一対の貫通孔を結
ぶ線を仮定し前記仮定線を挟むようにして一対の半導体
素子を複数設ける工程と、前記一対の半導体素子のそれ
ぞれの側の複数の半導体素子を第一の樹脂により一体的
にモールドしモールド部を形成するとともに、各モール
ド部はスリット部となる間隔を開けて配置する工程と、
前記貫通孔より端部のスリット部を封止する封止部を形
成する工程と、前記スリット部の上部開口を封鎖し、前
記スリット部内の一方の前記貫通孔から第二の樹脂を流
し込み遮光壁を形成する工程と、前記複数の半導体素子
を搭載した前記基板、モールド部及び遮光壁を一対の半
導体素子以上の単位でダイシングすることにより形成す
ることを特徴とする面実装部品の形成方法を提供するも
のである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a step of providing a plurality of through holes in a pair with the other end near the both ends of a substrate; Providing a plurality of pairs of semiconductor elements so as to sandwich a line connecting the plurality of semiconductor elements, and integrally molding a plurality of semiconductor elements on each side of the pair of semiconductor elements with a first resin to form a molded portion. A step of forming and arranging each mold part with an interval to be a slit part,
Forming a sealing portion for sealing a slit portion at an end from the through hole; closing an upper opening of the slit portion; pouring a second resin through one of the through holes in the slit portion; Forming a surface mounting component, and forming the substrate, the mold portion, and the light shielding wall on which the plurality of semiconductor elements are mounted by dicing in units of a pair of semiconductor elements or more. Is what you do.
【００１１】また、前記貫通孔より端部のスリット部を
封止する封止部を、前記モールド部を形成する際複数の
前記モールド部端部を一体とすることにより形成する。In addition, a sealing portion for sealing a slit portion at an end from the through hole is formed by integrating a plurality of ends of the mold portion when forming the mold portion.
【００１２】また、前記一対の半導体素子に発光素子及
び受光素子を用いる。A light emitting element and a light receiving element are used as the pair of semiconductor elements.
【００１３】また、前記第一の樹脂が透明材料であり、
前記第二の樹脂が不透明材料とすることを特徴とするも
のであり、これらにより課題を解決するものである。Further, the first resin is a transparent material,
The second resin is an opaque material, which solves the problem.
【００１４】[0014]
【発明の実施形態】次に、本発明に係る面実装部品の製
造方法を図に示す実施形態に基づいて詳細に説明する。Next, a method for manufacturing a surface mount component according to the present invention will be described in detail based on an embodiment shown in the drawings.
【００１５】先ず、図１に示すものは本発明による面実
装部品２０の製造方法に用いられるガラスエポキシなど
の絶縁材料からなる基板１であり、この基板１の表裏の
両面には銅箔などにより導電パターン３を所定形状で形
成している。First, FIG. 1 shows a substrate 1 made of an insulating material such as glass epoxy used for a method of manufacturing a surface-mounted component 20 according to the present invention. The conductive pattern 3 is formed in a predetermined shape.
【００１６】基板１の表面の導電パターン３と裏面の導
電パターン３の接続は図示はしないが、スルーホールな
どを設け、このスルーホールの内面に銅箔等を形成する
ことにより行っている。Although not shown, the connection between the conductive pattern 3 on the front surface of the substrate 1 and the conductive pattern 3 on the back surface is made by providing a through hole or the like and forming a copper foil or the like on the inner surface of the through hole.
【００１７】また、基板１の両端近傍には、複数の貫通
孔２をそれぞれ列状に基板端部に対して平行となるよう
に形成し、それぞれの貫通孔２は他端の貫通孔２と相対
する位置に設けられている。In the vicinity of both ends of the substrate 1, a plurality of through-holes 2 are formed in a row so as to be parallel to the end of the substrate. They are provided at opposing positions.
【００１８】続いて、基板１の導電パターン３上に発光
素子４及び受光素子５を導電性接着剤によりマウントす
る。この発光素子４及び受光素子５は両端の貫通孔２の
間であり、かつ相対する貫通孔２を結ぶ線を仮定し、こ
の仮定線１６の両側に複数が列状に配置されるよう導電
パターン３が基板１に所定形状で設けられている。Subsequently, the light emitting element 4 and the light receiving element 5 are mounted on the conductive pattern 3 of the substrate 1 with a conductive adhesive. The light emitting element 4 and the light receiving element 5 are located between the through holes 2 at both ends, and assume a line connecting the opposing through holes 2. A plurality of conductive patterns are arranged on both sides of the assumed line 16 in a row. 3 is provided on the substrate 1 in a predetermined shape.
【００１９】そして発光素子４及び受光素子５の他端を
金線などのワイヤ１４により導電パターン３にボンディ
ングする。The other ends of the light emitting element 4 and the light receiving element 5 are bonded to the conductive pattern 3 by a wire 14 such as a gold wire.
【００２０】次に図２に示すように発光素子４、受光素
子５及びワイヤ１４をモールドするため、金型（図示せ
ず）をセットし、金型内に第一の樹脂である透明樹脂１
９を注入し、モールド部６を形成する。Next, as shown in FIG. 2, a mold (not shown) is set for molding the light emitting element 4, the light receiving element 5 and the wire 14, and the transparent resin 1 as the first resin is set in the mold.
9 is injected to form a mold portion 6.
【００２１】このモールド部６は、仮定線１６の両側に
載置される発光素子４及び受光素子５のうちそれぞれの
側を一体に形成するとともに、発光素子４及び受光素子
５が載置されていない貫通孔２よりも基板端部にまで延
長し、モールド端部６ａを形成している。さらにこのモ
ールド部６どうしは、適宜な間隔を有しスリット部７を
形成している。The molded part 6 integrally forms each side of the light emitting element 4 and the light receiving element 5 mounted on both sides of the assumption line 16 and also has the light emitting element 4 and the light receiving element 5 mounted thereon. The mold end 6a is formed to extend to the end of the substrate rather than the through hole 2 which does not exist. Further, the mold parts 6 have slits 7 at appropriate intervals.
【００２２】続いて、図３に示すように前記モールド端
部６ａどうしのスリット部７に、このスリット部７を閉
鎖するようにディスペンサー８より樹脂を滴下し、封止
部９を形成する。Subsequently, as shown in FIG. 3, a resin is dropped from a dispenser 8 into the slits 7 between the mold ends 6a so as to close the slits 7, thereby forming a sealing portion 9.
【００２３】次に図４に示すようにポリエステルテープ
などからなる密閉板１０を前記モールド部６に密着さ
せ、前記スリット部７の上部開口１８を閉鎖する。な
お、この密閉板１０は、前記モールド部６に対し着脱可
能とされている。このようにすることにより、スリット
部７は封止部９、密閉板１０により閉鎖され、貫通孔２
のみで外気と連通するものとなる。Next, as shown in FIG. 4, a sealing plate 10 made of a polyester tape or the like is brought into close contact with the mold section 6 and the upper opening 18 of the slit section 7 is closed. The sealing plate 10 is detachable from the mold section 6. By doing so, the slit portion 7 is closed by the sealing portion 9 and the sealing plate 10, and the through hole 2 is closed.
Only with the outside air.
【００２４】図５〜図７は、前記の閉鎖されたスリット
部７内に遮光板１７となる第二の樹脂である不透明樹脂
１３を注入する工程を示す図である。まず、図５に示す
ように基板１の裏面より貫通孔２の一方に減圧ノズル１
１を、他方の貫通孔２に樹脂注入ノズル１２を挿入す
る。そして図６に示すように減圧ノズル１１よりスリッ
ト部７内の空気を吸引し、注入ノズル１２より遮光板１
７の材料となる不透明樹脂１３を注入することによりス
リット部７に不透明樹脂１３が充填される。FIGS. 5 to 7 are views showing a step of injecting the opaque resin 13 which is the second resin to be the light shielding plate 17 into the closed slit portion 7. FIG. First, as shown in FIG.
1 and the resin injection nozzle 12 is inserted into the other through hole 2. Then, as shown in FIG. 6, the air in the slit portion 7 is sucked from the decompression nozzle 11 and the light shielding plate 1 is
By injecting the opaque resin 13 which is the material of No. 7, the slit portion 7 is filled with the opaque resin 13.
【００２５】そして、図７に示すように不透明樹脂１３
の充填が完了し硬化したのち、密閉板１０、減圧ノズル
１１及び注入ノズル１２を取り除き、遮光板１７の形成
が完了する。Then, as shown in FIG.
After the filling and curing are completed, the sealing plate 10, the decompression nozzle 11, and the injection nozzle 12 are removed, and the formation of the light shielding plate 17 is completed.
【００２６】最後に図８に示すように基板１、モールド
部６及び遮光板１７を発光素子４及び受光素子５を囲う
ように適宜ヶ所で切断することにより、図９に示す面実
装部品２０が完成する。Finally, as shown in FIG. 8, the substrate 1, the mold section 6, and the light shielding plate 17 are cut at appropriate places so as to surround the light emitting element 4 and the light receiving element 5, whereby the surface mount component 20 shown in FIG. Complete.
【００２７】以上のようにして形成された面実装部品２
０は従来例でも説明したように、検出物の有無を判別す
る光センサーとして用いられ、発光素子４から放出され
た光が直接受光素子５に入射してしまうのを防止するた
めに遮光壁１７が形成されている。The surface mount component 2 formed as described above
0 is used as an optical sensor for determining the presence or absence of a detection object, as described in the conventional example, and a light shielding wall 17 is used to prevent light emitted from the light emitting element 4 from directly entering the light receiving element 5. Are formed.
【００２８】次いで上記の製造方法とした本発明の作用
及び効果について説明を行なえば、まず第一には、遮光
壁１７の形成が樹脂の注入により行われているため、従
来例のように遮光壁を基板へ接着するという煩雑な作業
が省略でき、安価な方法で高速に形成することができ
る。さらに、遮光壁１７を形成する空間が少なくてす
み、又、遮光壁１７自体も小型化（薄型化）できるもの
となる。Next, the operation and effect of the present invention as described above will be described. First, since the light shielding wall 17 is formed by injecting a resin, the light shielding wall 17 is formed as in the conventional example. The complicated operation of bonding the wall to the substrate can be omitted, and the wall can be formed at a high speed by an inexpensive method. Further, the space for forming the light-shielding wall 17 can be reduced, and the light-shielding wall 17 itself can be downsized (thinned).
【００２９】そして第二には、モールド部６の形状の変
更によりスリット部７の形状を変え、遮光壁１７の形状
を種々の形状に形成することが可能である。Second, it is possible to change the shape of the slit portion 7 by changing the shape of the mold portion 6 and to form the light shielding wall 17 into various shapes.
【００３０】次に図１０に示すものは本発明による第二
実施例であり、前記した第一実施例と相違する点は、基
板１に凹部１５を形成したことであり、他の製造方法に
ついては、前記第一実施例と同様であり、説明は省略す
る。この凹部１５は、前記仮定線１６の位置に溝状に設
けられ、前記スリット部７とほぼ同じ幅に設けられてい
る。このように基板１に凹部１５を形成することにより
遮光板１７が基板１の内部に入り込むため、基板１と遮
光板１７の境においての漏光を一層防止することができ
る。Next, FIG. 10 shows a second embodiment according to the present invention. The difference from the first embodiment is that a concave portion 15 is formed in the substrate 1. Is the same as in the first embodiment, and the description is omitted. The concave portion 15 is provided in a groove shape at the position of the hypothetical line 16, and is provided with substantially the same width as the slit portion 7. Since the light shielding plate 17 enters the inside of the substrate 1 by forming the concave portion 15 in the substrate 1 in this manner, light leakage at the boundary between the substrate 1 and the light shielding plate 17 can be further prevented.
【００３１】さら図１１に示すものは本発明の第三実施
例であり、本実施例では、モールド部６の端部のモール
ド端部６ａを他のモールド端部６ａと一体に設けること
により、スリット部７を封止する封止部９としたもので
ある。FIG. 11 shows a third embodiment of the present invention. In this embodiment, the mold end 6a at the end of the mold portion 6 is provided integrally with the other mold end 6a. The sealing portion 9 seals the slit portion 7.
【００３２】なお、他の製造方法については前記の第一
実施例と同様であるため、説明は省略する。The other manufacturing method is the same as in the first embodiment, and the description is omitted.
【００３３】このようにすることにより、モールド部６
の形成工程と、スリット部７を封止する封止部９を形成
する工程とを１つの工程にて行うことができるものとな
り、より一層面実装部品２０の形成を簡易化できるもの
となる。By doing so, the mold portion 6
And the step of forming the sealing portion 9 for sealing the slit portion 7 can be performed in one step, and the formation of the surface mount component 20 can be further simplified.
【００３４】なお、上記各実施例では一対の半導体素子
として発光素子及び受光素子を用いた光センサーの例で
説明したが、この一対の半導体素子は発光素子どうし、
受光素子どうしの組合わせでも良い。このような場合に
は、遮光壁１７によりモールド部６内での光の干渉がな
くなり、必要に応じた複数の半導体素子を有する面実装
部品を形成することができ、本発明はこの半導体素子の
種類に限定されるものではない。又、モールド部６、遮
光壁１７に用いる樹脂材料は、面実装部品２０に用いら
れる半導体素子の種類により適宜選ばれるものであり、
例えば発光素子４に赤外線を発するものを用いれば、モ
ールド部６は赤外線を透過するものであれば不透明樹脂
でも良く、遮光壁１７は赤外線を遮光するものであれ
ば、透明樹脂を用いることができる。In each of the above embodiments, an example of an optical sensor using a light-emitting element and a light-receiving element as a pair of semiconductor elements has been described.
A combination of light receiving elements may be used. In such a case, light interference in the mold portion 6 is eliminated by the light-shielding wall 17, and a surface-mounted component having a plurality of semiconductor elements as required can be formed. It is not limited to the type. The resin material used for the mold portion 6 and the light shielding wall 17 is appropriately selected depending on the type of the semiconductor element used for the surface mount component 20.
For example, if a device that emits infrared light is used for the light emitting element 4, the mold portion 6 may be made of an opaque resin as long as it transmits infrared light, and the light shielding wall 17 may be made of a transparent resin as long as it can shield infrared light. .
【００３５】さらに、上記の実施例では発光素子４及び
受光素子５の２つの半導体素子により形成される面実装
部品２０の例を示したが、これに限らず、３つ以上の半
導体素子を搭載した面実装部品を形成する際にも適応が
可能である。Further, in the above embodiment, the example of the surface mount component 20 formed by the two semiconductor elements of the light emitting element 4 and the light receiving element 5 has been described, but the present invention is not limited to this, and three or more semiconductor elements are mounted. It can also be applied when forming a surface-mounted component.
【００３６】そして、上記各実施例を適宜組合わせて実
施することが可能であることは言うまでもない。It is needless to say that the above embodiments can be appropriately combined and implemented.
【００３７】[0037]
【発明の効果】以上に説明したように本発明により、面
実装部品２０の遮光板１７は液状の樹脂を注入すること
により形成されているため、遮光板１７を小型にできる
とともに、形成する空間も少なくなるため、面実装部品
２０自体も小型なものとすることができる。また、遮光
板１７を別工程にて形成する必要がなく、面実装部品２
０を形成する過程で容易に形成することができるため、
歩留りが上がるとともにコストを抑えることができる。As described above, according to the present invention, since the light-shielding plate 17 of the surface mount component 20 is formed by injecting a liquid resin, the light-shielding plate 17 can be reduced in size, and the space for forming the light-shielding plate 17 can be reduced. Therefore, the surface mount component 20 itself can be made small. Further, it is not necessary to form the light shielding plate 17 in a separate step,
Since it can be easily formed in the process of forming 0,
The yield can be increased and the cost can be reduced.
【図１】本発明に係る面実装部品の製造方法に用いる基
板を示す説明図である。FIG. 1 is an explanatory view showing a substrate used in a method of manufacturing a surface mount component according to the present invention.
【図２】本発明に係る面実装部品の製造方法のモールド
部を形成する工程を示す説明図である。FIG. 2 is an explanatory view showing a step of forming a mold part in the method of manufacturing a surface mount component according to the present invention.
【図３】本発明に係る面実装部品の製造方法の封止部を
形成する工程を示す説明図である。FIG. 3 is an explanatory view showing a step of forming a sealing portion in the method for manufacturing a surface mount component according to the present invention.
【図４】本発明に係る面実装部品の製造方法のスリット
部の上部開口を閉鎖する工程を示す説明図である。FIG. 4 is an explanatory view showing a step of closing an upper opening of a slit portion in the method for manufacturing a surface mount component according to the present invention.
【図５】本発明に係る面実装部品の製造方法の遮光壁を
形成する工程を示する工程を示す説明図である。FIG. 5 is an explanatory view showing a step of forming a light-shielding wall in the method of manufacturing a surface-mounted component according to the present invention.
【図６】同じく本発明に係る面実装部品の製造方法の遮
光壁を形成する工程を示する工程を示す説明図である。FIG. 6 is an explanatory view showing a step of forming a light-shielding wall in the method of manufacturing a surface-mounted component according to the present invention.
【図７】同じく本発明に係る面実装部品の製造方法の遮
光壁を形成する工程を示する工程を示す説明図である。FIG. 7 is an explanatory view showing a step of forming a light-shielding wall in the method of manufacturing a surface-mounted component according to the present invention.
【図８】本発明に係る面実装部品の製造方法の切断する
工程を示す説明図である。FIG. 8 is an explanatory view showing a cutting step of the method for manufacturing a surface mount component according to the present invention.
【図９】本発明に係る製造方法により形成される面実装
部品の一実施例を示す斜視図である。FIG. 9 is a perspective view showing one embodiment of a surface mount component formed by the manufacturing method according to the present invention.
【図１０】同じく本発明に係る製造方法により形成され
る面実装部品の第二実施例を示す斜視図である。FIG. 10 is a perspective view showing a second embodiment of the surface mount component formed by the manufacturing method according to the present invention.
【図１１】本発明に係る面実装部品の製造方法の封止部
を形成する工程を示す第三実施例の説明図である。FIG. 11 is an explanatory view of a third embodiment showing a step of forming a sealing portion in the method of manufacturing a surface mount component according to the present invention.
【図１２】従来の面実装部品の製造方法において、基板
上に半導体素子及び遮光壁を搭載する工程（ａ）、モー
ルド部を形成する工程（ｂ）、完成した状態（ｃ）、を
示す要部断面図である。FIG. 12 is a view showing a step (a) of mounting a semiconductor element and a light-shielding wall on a substrate, a step (b) of forming a molded part, and a completed state (c) in a conventional method of manufacturing a surface-mounted component. It is a fragmentary sectional view.
【図１３】従来の面実装部品を示す斜視図である。FIG. 13 is a perspective view showing a conventional surface mount component.
１ 基板 ２ 貫通孔 ３ 導電パターン ４ 発光素子 ５ 受光素子 ６ モールド部 ６ａ モールド端部 ７ スリット部 ８ ディスペンサー ９ 封止部 １０ 密閉板 １１ 減圧ノズル １２ 注入ノズル １３ 不透明樹脂 １４ ワイヤ １５ 凹部 １６ 仮定線 １７ 遮光壁 １８ 開口 １９ 透明樹脂 ２０ 面実装部品 DESCRIPTION OF SYMBOLS 1 Substrate 2 Through-hole 3 Conductive pattern 4 Light-emitting element 5 Light-receiving element 6 Mold part 6a Mold end part 7 Slit part 8 Dispenser 9 Sealing part 10 Sealing plate 11 Decompression nozzle 12 Injection nozzle 13 Opaque resin 14 Wire 15 Depression 16 Assumption line 17 Shielding wall 18 Opening 19 Transparent resin 20 Surface mount component
Claims (4)
数の貫通孔を列状に設ける工程と、前記一対の貫通孔を
結ぶ線を仮定し前記仮定線を挟むようにして一対の半導
体素子を複数設ける工程と、前記一対の半導体素子のそ
れぞれの側の複数の半導体素子を第一の樹脂により一体
的にモールドしモールド部を形成するとともに、各モー
ルド部はスリット部となる間隔を開けて配置する工程
と、前記貫通孔より端部のスリット部を封止する封止部
を形成する工程と、前記スリット部の上部開口を封鎖
し、前記スリット部内の一方の前記貫通孔から第二の樹
脂を流し込み遮光壁を形成する工程と、前記複数の半導
体素子を搭載した前記基板、モールド部及び遮光壁を一
対の半導体素子以上の単位で切断することにより形成す
ることを特徴とする面実装部品の形成方法。1. A step of providing a plurality of through-holes in a row in the vicinity of both ends of a substrate and a pair of semiconductor elements by assuming a line connecting the pair of through-holes and sandwiching the assumed line. A plurality of steps, and a plurality of semiconductor elements on each side of the pair of semiconductor elements are integrally molded with a first resin to form a mold portion, and each mold portion is spaced apart from a slit portion. Arranging and forming a sealing portion for sealing a slit portion at an end from the through hole, closing an upper opening of the slit portion, and a second from the one through hole in the slit portion. Forming a light-shielding wall by pouring a resin, and forming the light-shielding wall by cutting the substrate on which the plurality of semiconductor elements are mounted, the mold portion, and the light-shielding wall in units of a pair of semiconductor elements or more. The method of forming components.
する封止部を、前記モールド部を形成する際複数の前記
モールド部端部を一体とすることにより形成することを
特徴とする請求項１記載の面実装部品の形成方法。2. A sealing portion for sealing a slit portion at an end from the through hole is formed by integrating a plurality of ends of the mold portion when forming the mold portion. A method for forming a surface-mounted component according to claim 1.
光素子であることを特徴とする請求項１又は２記載の面
実装部品の形成方法。3. The method according to claim 1, wherein the pair of semiconductor elements are a light emitting element and a light receiving element.
第二の樹脂が不透明材料であることを特徴とする請求項
１又は２又は３記載の面実装部品の形成方法。4. The method according to claim 1, wherein the first resin is a transparent material, and the second resin is an opaque material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25412397A JPH1187740A (en) | 1997-09-04 | 1997-09-04 | Formation method for surface mounted component |
| KR1019980036566A KR19990029558A (en) | 1997-09-04 | 1998-09-04 | Method of Forming Surface Mount Components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25412397A JPH1187740A (en) | 1997-09-04 | 1997-09-04 | Formation method for surface mounted component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1187740A true JPH1187740A (en) | 1999-03-30 |
Family
ID=17260555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25412397A Pending JPH1187740A (en) | 1997-09-04 | 1997-09-04 | Formation method for surface mounted component |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH1187740A (en) |
| KR (1) | KR19990029558A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002005738A (en) * | 2000-06-23 | 2002-01-09 | Matsushita Electric Works Ltd | Illuminance sensor |
| US6608334B1 (en) * | 1999-12-09 | 2003-08-19 | Rohm Co., Ltd. | Light-emitting chip device with case and method of manufacture thereof |
| JP2004071734A (en) * | 2002-08-05 | 2004-03-04 | New Japan Radio Co Ltd | Method of manufacturing light receiving and emitting device |
| JP2005116670A (en) * | 2003-09-18 | 2005-04-28 | New Japan Radio Co Ltd | Manufacturing method for light receiving/emitting device |
| JP2006005141A (en) * | 2004-06-17 | 2006-01-05 | Citizen Electronics Co Ltd | Optical semiconductor package and method of manufacturing the same |
| JP2007013050A (en) * | 2005-07-04 | 2007-01-18 | Citizen Electronics Co Ltd | Reflective photosensor |
| JP2007286050A (en) * | 2006-04-14 | 2007-11-01 | Avago Technologies General Ip (Singapore) Private Ltd | Flat top reflective optical encoder |
| JP2009088520A (en) * | 2007-09-27 | 2009-04-23 | Samsung Electro Mech Co Ltd | Method of manufacturing light-emitting diode package |
| JP2014099468A (en) * | 2012-11-13 | 2014-05-29 | Pioneer Electronic Corp | Semiconductor device manufacturing method and semiconductor device |
| JP2017011030A (en) * | 2015-06-18 | 2017-01-12 | 豊田合成株式会社 | Method for manufacturing light-emitting device |
| JP2017092352A (en) * | 2015-11-13 | 2017-05-25 | ローム株式会社 | Light-receiving/emitting device and manufacturing method of light-receiving/emitting device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016186468A1 (en) * | 2015-05-20 | 2016-11-24 | (주)레온 | Transparent pcb-based flexible led display device |
-
1997
- 1997-09-04 JP JP25412397A patent/JPH1187740A/en active Pending
-
1998
- 1998-09-04 KR KR1019980036566A patent/KR19990029558A/en not_active Application Discontinuation
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6608334B1 (en) * | 1999-12-09 | 2003-08-19 | Rohm Co., Ltd. | Light-emitting chip device with case and method of manufacture thereof |
| JP2002005738A (en) * | 2000-06-23 | 2002-01-09 | Matsushita Electric Works Ltd | Illuminance sensor |
| JP2004071734A (en) * | 2002-08-05 | 2004-03-04 | New Japan Radio Co Ltd | Method of manufacturing light receiving and emitting device |
| JP2005116670A (en) * | 2003-09-18 | 2005-04-28 | New Japan Radio Co Ltd | Manufacturing method for light receiving/emitting device |
| JP2006005141A (en) * | 2004-06-17 | 2006-01-05 | Citizen Electronics Co Ltd | Optical semiconductor package and method of manufacturing the same |
| JP2007013050A (en) * | 2005-07-04 | 2007-01-18 | Citizen Electronics Co Ltd | Reflective photosensor |
| JP2007286050A (en) * | 2006-04-14 | 2007-11-01 | Avago Technologies General Ip (Singapore) Private Ltd | Flat top reflective optical encoder |
| JP2009088520A (en) * | 2007-09-27 | 2009-04-23 | Samsung Electro Mech Co Ltd | Method of manufacturing light-emitting diode package |
| US8202746B2 (en) | 2007-09-27 | 2012-06-19 | Samsung Led Co., Ltd. | Method of manufacturing LED package for formation of molding member |
| JP2014099468A (en) * | 2012-11-13 | 2014-05-29 | Pioneer Electronic Corp | Semiconductor device manufacturing method and semiconductor device |
| JP2017011030A (en) * | 2015-06-18 | 2017-01-12 | 豊田合成株式会社 | Method for manufacturing light-emitting device |
| JP2017092352A (en) * | 2015-11-13 | 2017-05-25 | ローム株式会社 | Light-receiving/emitting device and manufacturing method of light-receiving/emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR19990029558A (en) | 1999-04-26 |
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