WO2016186468A1

WO2016186468A1 - Transparent pcb-based flexible led display device

Info

Publication number: WO2016186468A1
Application number: PCT/KR2016/005337
Authority: WO
Inventors: 박상민; 최성호
Original assignee: (주)레온
Priority date: 2015-05-20
Filing date: 2016-05-19
Publication date: 2016-11-24

Abstract

A transparent PCB-based flexible LED display device according to the present invention is characterized by comprising: a transparent member formed of a flexible material and having a first surface and an opposing second surface; a first pattern part stacked on the first surface of the transparent member and patterning electrodes formed of conductors into a data line and a power line; a second pattern part stacked on the second surface of the transparent member and patterning electrodes formed of a conductor to form a data line and a power line; an LED chip mounted on and electrically connected to the first pattern part; a mold formed of a transparent material for molding the LED chip; an adhesive layer provided with an adhesive component, for filling the outside gaps between the molds; an insulating layer stacked on the second pattern part; and a via hole formed through the transparent member, for electrically connecting the first pattern part and the second pattern part. According to the transparent PCB-based flexible LED display device according to the present invention, the inherent properties of a COB-type transparent flexible LED display device are retained, while having the availability to be able to manufacture the display in a large size, convenience in the manufacturing process is retained by virtue of a double-sided circuit structure, and an environment that can promote three-dimensional designing may be provided.

Description

Transparent P C B Based Flexible L E D Display Device

The present invention relates to a transparent PCB based flexible LED display device, and more particularly, to provide a structure in which a chip-on-board (COB) type LED chip is efficiently disposed on a transparent flexible printed circuit board (PCB) to directly display each display pixel. COB LED transparency that not only provides transparency and ease of attachment while preserving transparency in areas and objects, but also ensures durability and promotes the efficiency of manufacturing process, pursues versatility / convenience of use, and realizes dramatic reduction in price and weight. The present invention relates to a display device that satisfies all the flexible structures.

There are many methods and structures for mounting LEDs or implementing circuits as a display device. One of them is a SMD (surface mount device) for mounting an LED package on a rigid printed circuit board. Types are widely used.

However, this technology can guarantee the stability and durability of the product, but it has a disadvantage that the range of application is not so wide and the heat dissipation function is inferior as compared with the bulky and heavy weight, the price is expensive.

At present, many researches on transparent substrates and flexible substrates have been published, and various technologies have been published, and technologies for mounting LEDs and their applications have also been widely disclosed through a simpler structure using SMD and other chip on board (COB) methods. It is a state.

Korean Patent Laid-Open No. 10-2011-0011044 relates to a flexible LED lighting module and a flat panel display device, and includes a plurality of light emitting diodes formed on the flexible printed circuit board, a connecting electrode stacked on the light emitting diodes, and , A transparent electrode formed on the plurality of connection electrodes and implementing an electrical pattern, and a flexible film formed on the transparent electrode and electrically connected to the transparent electrode, thereby highlighting portability. It is posted.

However, according to this technology, the conductor of the board circuit is based on ITO, which is a transparent conductor, and the price of the product is high, and the ITO circuit alone cannot raise the amount of current so that the size of the board and the number of light emitting diodes are limited. The structure is suitable for a small LED display and its use is limited.

In addition, this technology uses PC, PVC, PET as a transparent flexible substrate, but such a film has heat resistance that its heat resistance does not withstand 1 to 3 hours of processing temperature of 100 to 160 degrees Celsius of the COB process. Bar, in the production of the product there is a disadvantage that the mass production of the product is impossible due to various defects such as bending, twisting, discoloration, shrinkage, etc. Furthermore, the light emitting diode is formed between the substrate and the electrode by stacking electrodes on the light emitting diode As a result, the electrodes are exposed to the outside and vulnerable to external forces, but they do not provide the proper means to solve them.

As mentioned above, it is true that the transparent flexible substrate is commercialized, so that the LED display device can be extended to various industrial applications while ensuring portability and convenience of installation, but it is solved to commercialize the transparent flexible LED display device. There are not many problems to do.

For example, the circuit structure for direct chip bonding to ensure the convenience of the process when manufacturing the LED display device as a large size based on COB type or COF (Chip On Flexible board) rather than STD, light and portable There is a need for detailed research to improve the structure that can be easily and detached at the installation site while ensuring the convenience of installation, and the minimum / three-dimensional circuit design structure for ensuring transparency on the transparent substrate.

Therefore, there is an urgent need to propose a new and advanced transparent flexible LED display device that can solve the above problems.

The present invention has been made in order to overcome the problems of the above technology, the COB type LED display device is designed to have a transparent / flexible properties, but has a double-sided circuit structure to ensure the convenience and durability of the manufacturing process while maintaining a glass window or other various places The main object of the present invention is to provide an LED display device that can be conveniently used repeatedly.

Another object of the present invention is to process the R / G / B LED device based on the COB design module to control each device individually to perform a variety of lighting.

Another object of the present invention is to facilitate the process by utilizing both sides of the circuit, and to plan the three-dimensional design of the circuit pattern.

A further object of the present invention is to provide a convenient physical structure for the mold and the adhesive layer encapsulating the LED chip to ensure durability as well as to enhance adhesion and usability.

It is a further object of the present invention to provide a stable buffering role by providing a buffer between the mold and the adhesive layer.

A further object of the present invention is to ensure the stability of the circuit and the convenience of pattern processing with the stable design structure of the via hole for the double-sided circuit.

It is a further object of the present invention to further propose a structure capable of ensuring the clarity of LED light.

In order to achieve the above object, the transparent PCB-based flexible LED display device according to the present invention comprises a transparent material, a transparent material having a first surface and a second surface thereof opposite; A first pattern portion laminated on the first surface of the transparent material and patterned with electrodes for data lines and power lines; A second pattern portion stacked on the second surface of the transparent material and formed by patterning an electrode made of a conductor into a data line and a power line; An LED chip mounted on the first pattern part and electrically connected to the first pattern part; A mold made of a transparent material and molding the LED chip; An adhesive layer having an adhesive component and filling outer spaces between the molds; An insulating layer laminated on the second pattern portion; It is formed through the transparent material, the via hole for electrically connecting the first pattern portion and the second pattern portion; characterized in that it comprises a.

The LED chip may include an LED module in which a plurality of RGB devices are combined, and the respective RGB devices may be individually controlled because the respective RGB devices are connected to different data lines.

In addition, the mold is characterized in that the outer surface is extended evenly covers the LED chip and the wire, the adhesive layer is characterized in that it extends flat to the same height as the height of the mold.

Additionally, at least one of the adhesive layer and the insulating layer around the LED chip, a color matrix of a specific color is further formed.

According to the transparent PCB based flexible LED display device according to the present invention,

1) With the inherent characteristics of the COB type transparent flexible LED display device,

2) The double-sided circuit structure provides convenience for the manufacturing process and pattern design, while providing transparency and ensuring the space utilization due to the three-dimensional design.

3) It maximizes the ease of installation and portability that can be installed at the installation place without any housing or case.

4) At the same time guaranteeing durability against breakage and electrical short-circuit that may be caused by flexible properties,

* 5) Ease and stability of the electrical pattern connection relationship of the double-sided circuit design,

6) LED light becomes more clear and provides the effect of securing light source discernment.

1 is a conceptual view showing a schematic appearance of a display device according to the present invention.

2 is a cross-sectional view showing the LED arrangement of the display device according to the present invention.

3 is a plan view showing an example of a double-sided circuit arrangement according to the present invention;

4 is a plan view showing the LED arrangement of the display device according to the present invention.

5 is a cross-sectional view showing a modified embodiment according to the present invention.

FIG. 6 is a cross-sectional view illustrating a structure in which a color matrix is additionally stacked on various portions around an LED chip. FIG.

The present invention provides a flexible PCB-based flexible LED display device, comprising: a transparent material having a first surface and a second surface opposite to the second surface; A first pattern portion laminated on the first surface of the transparent material and patterned with electrodes for data lines and power lines; A second pattern portion stacked on the second surface of the transparent material and formed by patterning an electrode made of a conductor into a data line and a power line; An LED chip mounted on the first pattern part and electrically connected to the first pattern part; A mold made of a transparent material and molding the LED chip; An adhesive layer having an adhesive component and filling outer spaces between the molds; An insulating layer laminated on the second pattern portion; It is formed through the transparent material, the via hole for electrically connecting the first pattern portion and the second pattern portion; includes a best form.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The accompanying drawings are not drawn to scale, and like reference numerals in each of the drawings refer to like elements.

1 is a conceptual diagram illustrating a schematic appearance of a display device according to the present invention.

As can be seen from Figure 1, the display device of the present invention is a LED chip (1) arranged on a substrate made of a transparent and flexible material, by such a transparency, flexibility (flexible properties) of the general lighting device It offers the flexibility of flexibility and flexibility without having to be mounted in a housing / case, and can function as a lighting device of its own.

In particular, as will be described later, the adhesive property provided by the surface of the display device according to the present invention can be easily adhered to various installation objects on which glass windows or other lights can be installed, and can be utilized for various industrial purposes, Convenience can also be provided.

The display device of the present invention is provided by arranging the LED chip 1 on a transparent flexible substrate, wherein the LED can be disposed / mounted in a chip on board (COB) type.

COB LED seeks miniaturization compared to SMD (Surface Mount Device) LEDs by packaging multiple LED chips as one module or by direct die-bonding to a substrate to integrate multiple components for lighting on a single substrate. Provides excellent heat dissipation effect and easy to manufacture in a large size bar, the display device of the present invention also combines the characteristics of COB type LED by integrating a plurality of LED chips into a single die or module on the substrate. Can be.

That is, the display device of the present invention can provide a feature that enables the reduction of cost and size of the device by using a copper-based circuit board that can increase the size of the substrate and the amount of current and thus increase the number of light emitting diodes.

In addition, the control unit (IC chip, etc.) and the LED provided on one side of the display device of the present invention is electrically connected to the LED flashing / pattern control, as well as to implement a variety of lighting patterns using the LED, and is connected to a separate power supply Of course, it can be powered.

2 is a cross-sectional view showing the LED arrangement of the display device according to the present invention, Figure 3 is a plan view showing an example of a double-sided circuit arrangement according to the present invention.

As can be seen from Figure 2, the transparent material 10 is made of a film form made of a flexible (flexible) material having transparency, serves as a base frame in the present invention.

The transparent material 10 does not matter the thickness, but requires a level that satisfies the durability according to the heat of the LED bar, PEN, PA, PI, PEET, etc. by using a high heat-resistant high-transparency film is produced with sufficient mass production and durability At the same time, they offer the advantage that sales are possible quickly.

The pattern portion 20 is formed by patterning an electrode made of a conductor to electrically connect the LED chip 1 and the controller, that is, forming a data line 23 and a power line 24 to implement a role as a PCB. will be.

The pattern portion 20 is formed at the same time as the first surface 11 and the second surface 12 of the transparent material 10 according to the characteristics that the display device of the present invention is made of a double-sided circuit. Here, for example, when the upper surface of the transparent material 10 is the first surface 11, it can be understood that the lower surface is the second surface 12, based on the first surface 11 of the transparent material 10 The formed pattern portion may be referred to as a second pattern portion 22 by forming the first pattern portion 21 and the pattern portion formed on the second surface 12 of the transparent material 10.

The pattern portion 20 is made of a conductive material such as copper and transparent electrode material (ITO) to be laminated and formed by bonding or applying to the transparent material 10, and the transparent material 10 and the pattern part 20. It is possible to further form a laminate by bonding a sheet further between the (). At this time, the bonding sheet may be transparent while providing a bonding property, there is no discoloration, and at the same time, it may have a thermosetting property. Furthermore, the bonding sheet may use a thermally conductive ink without a separate adhesive component.

The LED chip 1 is mounted on one side of the first pattern portion 21 in a COB design manner, that is, directly bonded to the first pattern portion 21, and on one side of the first pattern portion 21. Bonding with the extended wire 30 results in an electrical connection with the pattern portion 20. However, the method of electrically connecting the LED chip 1 to the pattern unit 20 is not limited thereto, but a separate wire / connecting line connected to the LED module having a plurality of LED chips 1 according to the COB design structure and method. Or the like.

In the case of wires, conventional LED wire bonding has generally used gold wire bonding, but in the present invention, it is more preferable to use WEDGE BONDING which can proceed the process without thermally affecting the flexible circuit board. Wedge bonding is generally 7% lower in brightness than gold bonding. However, in the characteristics of the application in which the present invention is used, the difference in brightness is not a big issue and the wedge bonding is important because light uniformity is important. Provides unique features to use.

As can be seen from Figure 3, such an LED chip (1) is a plurality of LED elements, such as R, G, B or R1, G, B, R2 in the form of LED die or LED module (2) according to the COB design structure Can be arranged.

In particular, FIG. 3 provides a structure in which the data lines 23 are connected to each of the LED chips 1, and thus, each of the LED chips 1 configuring the details in one LED module 2 is separately provided. It can be controlled, and it realizes the characteristics that can produce various lighting effects and effects while taking advantage of the LED module by COB type.

Referring back to FIG. 2, it can be seen that the mold 40 is formed around the upper portion of the LED chip 1 on the first surface 11 side of the transparent material 10. The mold 40 provides a basic encapsulation to protect the LED chip 1 and the wire 30, and has a volume and a structure capable of covering the LED chip 1 and the wire 30.

Although the mold 40 mainly uses epoxy series, it is preferable that the mold 40 is made of silicon in order to secure transparency and ductility. The mold 40 may not only provide a role as a lens through structural modification so as to have a space therein, but may also act as a white light expression by introducing a phosphor.

In particular, the mold 40 of the present invention, as can be seen from Figure 2 is projected a predetermined distance apart from the LED chip 1, but the outer surface is made of a flat structure, that is, the display device of the present invention is to be attached / installed It not only ensures the convenience of installation in the object (most often made of flat surface) but also serves to minimize distortion of LED light expression.

The adhesive layer 50 is provided in the space between the LED chip 1 and the first surface 11 of the transparent material without the mold 40, that is, the mold 40.

The adhesive layer 50 may be coated or laminated in a film or ink type, and may also be selected from a material having transparent properties. In particular, the adhesive layer 50 may have the same height as that of the mold 40. By providing a flat structure, it provides the property of achieving excellent adhesion by being in close contact with the installation object / place without play or unnecessary step.

By such a flat structure, the display device of the present invention is relatively light in weight and flexible, so that it can be conveniently attached to various installation objects such as glass and walls without a bracket or any other fixing means to provide a lighting function immediately. To ensure the characteristics.

In addition, the adhesive layer 50 has a role of preventing the phenomenon in which the pattern portion 20 is exposed to the outside and oxidized or current leaks.

On the other hand, on the second pattern portion 22 formed on the second surface 12 side of the transparent material 10, the insulating layer 60 is formed to protrude to a certain height and the outer surface is flatly formed, so that a known heat transfer property is known. And a role of preventing oxidation or leakage of the second pattern portion 22, and additionally applying / laminating an adhesive or an adhesive sheet on the outer surface of the insulating layer 60 to provide a display device of the transparent material 10. It is also possible to provide a base that can be easily attached to the object to be installed in the lighting in both directions on the first and

second surfaces

11 and 12.

As mentioned above, the display device of the present invention proposes a double-sided circuit structure in order to ensure stability while preventing the problem of electrical short-circuit and convenience of the manufacturing process for performing direct chip bonding.

To this end, the first and

second pattern parts

21 and 22 may be electrically connected by a plurality of via holes 15 formed through the transparent material 10. That is, the via hole 15 serves as a path through which the data line 23 of the first and

second pattern parts

21 and 22 and the extension line of the power supply line 24 can be connected to each other.

FIG. 4 is a pattern arrangement structure designed by way of example through the double-sided circuit of the present invention, and clearly shows that a line (pattern) indicated by a dotted line is disposed on the second surface 12 of the transparent material 10.

For example, the first pattern portion 21 on the first surface 11 side mainly arranges the power supply line 24 horizontally (horizontally) on the basis of the transparent material 10, and the second surface 12 side. The second pattern portion 22 of the structure can be arranged mainly in the vertical (vertical) arrangement of the data line 23 to prevent the short circuit between the patterns, and in addition to the pattern design can derive various three-dimensional structure As a result, the circuit space can be maximized.

As a result, in particular, the short circuit between patterns, which can easily occur in a flexible substrate, can be reduced, and the transparency of the display device can be more ensured according to the distributed arrangement rather than the concentrated circuit arrangement, while ensuring the convenience of the process. It can provide various characteristics.

FIG. 5 (a) shows an example in which the buffer 70 is additionally provided covering the outer circumferential surface of the mold 40, in particular, the circumference of the side surface of the mold 40.

The buffer 70 of the present invention has a predetermined thickness and is wrapped around the side portion of the mold 40 and has the same height as the mold 40 and the adhesive layer 50. In particular, the elasticity of the mold 40 is increased. It is made of a material with a smaller modulus of elasticity than the modulus.

That is, since the elasticity is higher than that of the mold 40, it provides a cushioning role elastically stretched and contracted by an external force, and at the same time, serves as a medium for bonding the two between the adhesive layer 50 and the mold 40, thereby providing flexible properties. When the display device of the present invention is bent or bent, it prevents unnecessary external force from being biased on the area of the LED chip 1 / LED module 2 and also serves as an adhesive medium, thereby providing a mold 40 and an adhesive layer ( 50) Try to avoid the problem of excitation.

FIG. 5B illustrates a modified embodiment of the via hole 15, in which corner portions generated at the boundary portions of the via holes 15 and the first and

second surfaces

11 and 12 of the transparent material 10 are cut off. A rounding chamfer portion 16 further chamfered rounded is further provided.

The rounding chamfer portion 16 is a structure that is expressed as a separate processing process after the through hole 15 is passed in the display device manufacturing process of the present invention, thereby penetrating the first and

second pattern portions

21 and 22. In addition, the connection between the data line 23 and the power supply line 24 may be facilitated, and at the same time, a convenient function of forming the first and

second pattern portions

21 and 22 may be performed.

FIG. 6 is a cross-sectional view illustrating a structure in which a color matrix is additionally stacked on various areas around an LED chip.

As can be seen from FIG. 6, the adhesive layer 50 on the first surface 11 of the portion around the LED chip 1, the insulating layer 60 on the second surface 12, and the inner circumferential surface of the via hole 15 are shown. Or a color matrix 80 is further stacked in at least one of the peripheral through holes.

The colored matrix 80 of the present invention is colored, i.e., in the form of a band of closed curve shape or a block / piece / film / fragment shape in a state of being made to reflect or absorb rather than transmit LED light. It means a kind of layer consisting of.

That is, the color matrix 80 may be formed in a structure including a specific color by printing a specific color or by combining or overlaying a plurality of dots, or attaching a layer made of various materials separately manufactured. It is not limited.

6 (a) shows that the color matrix 80 is laminated on the adhesive layer 50, FIG. 6 (b) shows the state laminated on the insulating layer 60, and FIG. 6A and 6D, the adhesive layer 50 and the insulating layer 60 are formed at the same time. FIG. 6 (d) shows a hole penetrating from the inner circumferential surface of the via hole 15 or the upper surface of the transparent material 10 to the lower surface, that is, the inner circumference of the through hole. The state formed in the surface is shown.

As such, the color matrix 80 may be formed at various portions around the LED chip 1, and particularly, the color matrix 80 may be formed at a position capable of separating the LED light from the adjacent light. It is preferable to be manufactured in a small size, for example, a closed curve shape or structure surrounding the LED chip 1 as shown in the enlarged plan view of FIG.

The color matrix 80 serves to make the light emitted from the LED chip 1 more clear, and consequently, serves to provide light source discrimination.

As described above, the color matrix 80 may be applied in various colors except for transparent colors, that is, light reflection and light absorbing properties. It is more desirable to further enhance the light scattering role.

As described so far, the configuration and operation of the transparent PCB-based flexible LED display device according to the present invention have been expressed in the above description and drawings, but this is merely an example, and the spirit of the present invention is not limited to the above description and the drawings. And, of course, various changes and modifications are possible within the scope without departing from the spirit of the present invention.

According to the transparent PCB-based flexible LED display device according to the present invention, while utilizing the inherent characteristics of the COB-type transparent flexible LED display device has the usability to be produced in a large size, the double-sided circuit structure to save the convenience of the manufacturing process The industrial availability is sufficient by providing an environment for three-dimensional design.

Claims

Transparent PCB based flexible LED display device,

A transparent material made of a flexible material and having a first surface and a second surface opposite thereto;

A first pattern portion laminated on the first surface of the transparent material and patterned with electrodes for data lines and power lines;

A second pattern portion stacked on the second surface of the transparent material and formed by patterning an electrode made of a conductor into a data line and a power line;

An LED chip mounted on the first pattern part and electrically connected to the first pattern part;

A mold made of a transparent material and molding the LED chip;

An adhesive layer having an adhesive component and filling outer spaces between the molds;

An insulating layer laminated on the second pattern portion;

And a via hole formed through the transparent material and electrically connecting the first pattern part and the second pattern part.
The method of claim 1,

The LED chip,

A plurality of RGB elements are composed of LED modules,

A transparent PCB based flexible LED display device, characterized in that each of the RGB devices are individually controlled by being connected to the different data line, respectively.
The method of claim 1,

Any one of the data line and the power line of the first pattern portion is formed of a first pattern extending in one direction,

Any one of the data line and the power line of the second pattern portion is formed of a second pattern extending perpendicular to the first pattern, a transparent PCB based flexible LED display device.
The method of claim 1,

The mold,

Cover the LED chip and the wire but the outer surface is extended flat,

The adhesive layer, characterized in that the flat extending to the same height as the height of the mold, a transparent PCB based flexible LED display device.
The method of claim 4, wherein

The display device,

Covering the sides of the mold along the circumference of the mold,

And a buffer formed to have the same height as the mold with a material having a lower elastic modulus than the mold.
The method of claim 1,

In a boundary portion of the via hole and the first and second pattern portions,

A transparent PCB-based flexible LED display device, characterized in that a further rounded chamfered by chamfering the boundary portion to form a rounded paper.
The method of claim 1,

At least one of the adhesive layer and the insulating layer around the LED chip,

Transparent PCB-based flexible LED display device, characterized in that the color matrix is further formed of a specific color.