JPH11274550A - Surface mount type photo interrupter and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a low-cost ultrasmall-size surface mount type photo interrupter wherein the manufacturing man-hour is less because an LED and P-Tr(photo transistor) are processed on the same substrate, and the optical axis alignment is easy. SOLUTION: An LED 3 and P-Tr 4 are die-bonded or wire-bonded on the same surface of a glass epoxy resin or similar circuit board 21 with through-hole electrodes 22a, 22b formed on the side face, and a metal- or plastic-made box 24 having a light shield for the outside, slits 24a, 24b forming light paths of both elements, light reflecting faces 24c, 24d and specified gap G is adhered to the photo interrupter body sealed with an epoxy resin or similar seal resin 8. If necessary, an Ni plating layer or the like is formed on the reflecting faces to raise the reflection efficiency. Since it is manufactured in the collective condition of molding in multiple cavities in the most steps, the manufacturing cost is low.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount photointerrupter for detecting the presence or absence of an object without contact, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, photo-interrupters capable of detecting a presence or absence of an object without contact and obtaining a switching signal have been widely used in facsimile machines, printers, floppy disk drives, and the like. As shown in FIG. 14, the structure of a general photo-interrupter is such that a photo-interrupter 1 has a light-emitting element 3 (for example, an infrared LED) and a light-receiving element 4 (for example, a phototransistor; Tr) is attached, and the light emitting element 3
Is received by the light receiving element 4 via the gap G. With the above configuration, when an object enters the gap G and the light is blocked, the output of the light receiving element 4 changes, and this output change is used as a switching signal.

In the structure of the photointerrupter,
The case 2 is formed of a plastic mold. After the light-emitting element 3 and the light-receiving element 4 are stored in the opposing element storage sections, the position of the optical axis passing through the slit is adjusted to maintain the position where the optical axes coincide. While sealing the element housing portion with epoxy resin, it was fixed. Therefore, it is very difficult to increase the accuracy of adjusting the position of the optical axis in the slit that determines the detection accuracy in molding.

Japanese Patent Application Laid-Open No. 5-110129 discloses a technique for manufacturing a photointerrupter using a metal slit plate in order to improve the position adjustment accuracy of the optical axis in the slit which determines the detection accuracy. I have. The outline will be described with reference to FIGS.

FIG. 15 is a perspective view of a photo-interrupter, and FIG.
It is sectional drawing which shows the state inserted in the next mold. In the figure, a lead terminal 5 is connected to a light emitting element LE.
D3 or P-Tr4 which is a light receiving element is die-bonded, wire-bonded to the other lead terminal 6 with a bonding wire 7 such as a gold wire, and cast or transfer molded with a thermosetting sealing resin 8 such as an epoxy resin. Each primary molded body on the light receiving / emitting side is formed by the method.

Next, a slit 9 serving as a light passage in a metal plate.
The slit plate 9 provided with a is formed. The slit plate 9 has a bent lead portion 9b for insert molding into a secondary mold. Each one of the light receiving and emitting sides
The secondary mold body and the slit plate are positioned and inserted into the secondary mold, and injection molding is performed with a thermoplastic light-shielding resin 10, for example, polyphenylene sulfide, and each primary mold body and the slit plate are integrated. Become After injection molding, release from the secondary mold, cut and separate,
A single photo interrupter 11 as shown in FIG. 15 is obtained.

[0007]

However, the above-described method for manufacturing a photointerrupter has the following problems. Since the manufacturing process of the LED and the P-Tr must be performed separately, it is difficult to adjust the position of the optical axis when combining the primary mold and the secondary mold, and the manufacturing cost is high. In addition, the mold becomes more complicated, and the positional accuracy of the slits of the molded body is reduced due to the bending accuracy of the slit plate. Mold manufacturing cost and mold maintenance cost for molding are required. Since the insert molding of the LED and the P-Tr into the mold body is required, the number of steps is increased and the manufacturing cost is expensive.
In addition, LED, P-Tr
There is a problem that stress such as heat stress is applied to the device, adversely affecting reliability.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to realize an extremely inexpensive surface mounting device which realizes high accuracy and high resolution, is compact, has a long life, and has high productivity. And a method of manufacturing the same.

[0009]

In order to achieve the above object, a surface mount type photo interrupter according to the present invention comprises:
In a surface-mount photointerrupter in which light from a light emitting element is received by a light receiving element via a gap and the presence or absence of an object is detected in a contactless manner, the light emitting element or the light receiving element is mounted on an insulating substrate, and a sealing resin is provided. And a slit provided with a light reflecting surface serving as an optical path of both elements, and a combination of light shielding to the outside and a housing provided with a predetermined gap.

Further, the insulating substrate is provided with a through-hole electrode as an external electrode on a side surface.

Further, the housing is formed of metal or plastic material.

Further, the present invention is characterized in that a plating layer is formed on a light reflection surface serving as an optical path of both elements formed in the housing to improve the reflection efficiency.

Further, the plating layer is nickel-plated.

Further, the present invention is characterized in that an insulating substrate in which the two elements are resin-sealed and the casing are fixed with an adhesive.

Further, the angle of the reflection surface formed on the housing is within 45 ° ± 10 °.

[0016] Further, the top shape of the housing facing and parallel to the insulating substrate is a substantially square shape having a wide top surface.

Further, in a method of manufacturing a surface mount type photointerrupter in which light from a light emitting element is received by a light receiving element via a gap and the presence or absence of an object is detected without contact.
A through-hole processing step of drilling a plurality of rows of through holes in a collective circuit board made of a large number of insulating substrates, such as glass epoxy resin, and mounting a plurality of rows of light emitting elements and light receiving elements on the upper surface of the collective circuit board An electrode pattern forming step for forming a mounting electrode pattern and a through-hole electrode connected to a printed board such as a mother board in the through-hole, and die-bonding and wire-bonding a plurality of light emitting elements and light receiving elements on the collective circuit board. Bonding mounting process, a mask member such as a dry film is stuck on the through hole, a mold is set, and a sealing resin such as an epoxy resin is filled in the mold, and the resin is cured and cured. Step, or a resin sealing step by potting without using a mold, and the assembled circuit board that has been completed up to the resin sealing step, A cutting process of dividing into a single circuit board by dicing or slicing along an intersecting cut line is advanced in advance, while a light reflecting surface and a slit serving as an optical path of the two elements are provided, and After the shading, the press forming step of the casing formed of metal or plastic material or the like provided with a predetermined gap, or the plastic forming step, and the plating step of forming a plating layer on the reflection surface of the casing as necessary A casing is formed, and then, the casing is put on a single circuit board divided in the cutting step, combined with the casing, and integrated by a fixing means such as an adhesive to form a completed product. It is characterized by having.

Further, in a method of manufacturing a surface mount type photointerrupter in which light from a light emitting element is received by a light receiving element through a gap and the presence or absence of an object is detected without contact.
A through-hole processing step of drilling a plurality of rows of through holes in a collective circuit board made of a large number of insulating substrates, such as glass epoxy resin, and mounting a plurality of rows of light emitting elements and light receiving elements on the upper surface of the collective circuit board An electrode pattern forming step for forming a mounting electrode pattern and a through-hole electrode connected to a printed board such as a mother board in the through-hole, and die-bonding and wire-bonding a plurality of light emitting elements and light receiving elements on the collective circuit board. Bonding mounting process, a mask member such as a dry film is stuck on the through hole, a mold is set, and a sealing resin such as an epoxy resin is filled in the mold, and the resin is cured and cured. Process, or a resin sealing step by potting without using a mold, to form an assembled circuit board that has been completed up to resin sealing. Meanwhile, on the other hand, a housing assembly formed of a metal or plastic material or the like, which is provided with a light reflecting surface and a slit serving as an optical path of the two elements, and is provided with light shielding to the outside and a predetermined gap provided. Forming a housing assembly by pressing the body, or plastic molding, and, if necessary, forming a plating layer on a reflection surface of each housing of the housing assembly; After the assembly process is completed, the housing assembly is put on the assembled circuit board, assembled, and integrated through a fixing means such as an adhesive, and then subjected to dicing or slicing along the orthogonal cut line. And a cutting step of dividing the photointerrupter into single photointerrupters.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface mount type photointerrupter and a method of manufacturing the same according to the present invention will be described below with reference to the drawings. 1 and 2 show a first embodiment of the present invention. FIG. 1 is a sectional view of a surface mount type photointerrupter alone, and FIG. 2 is a perspective view of FIG. In the figure,
The same members as those in the prior art are denoted by the same reference numerals.

In FIGS. 1 and 2, reference numeral 20 denotes a surface-mount type photointerrupter, which is formed on the same surface of a circuit board 21 made of glass epoxy resin or the like as an insulating substrate having a substantially rectangular flat surface. Electrode pattern 23a
And 23b are mounted with LED3 as a light emitting element and P-Tr4 as a light receiving element by die bonding and wire bonding, respectively. The electrode patterns 23a and 23b communicate with through-hole electrodes 22a and 22b serving as external connection electrodes formed on side surfaces, and the LED 3 and the P-Tr
Each of 4 is sealed with a sealing resin 8 made of an epoxy resin or the like to form a single photointerrupter 20A.

On the other hand, 24 is a housing, made of Bs material, Al
A metal thin plate such as a material or a SuS material is formed by press working, and a hole is formed in a slit portion and a main body is formed by drawing. Alternatively, it is formed by injection molding using a mold with a plastic material. The housing 24 molded by any one of the above-described methods is provided with light shielding to the outside and slits 24a and 24b serving as optical paths of both elements.
And light reflecting surfaces 24c and 24d, which are approximately symmetrically inclined about 45 ° with respect to the gap G. The reflection efficiency can be further increased by forming a plating layer (not shown) on the reflection surfaces 24c and 24d as necessary.

Next, the above-described photointerrupter unit 2
The surface mount type photointerrupter 20 is formed by applying or printing an adhesive on the outer peripheral edge of the circuit board 21 of 0A or the joining surface of the lower inner peripheral edge of the housing 24, and combining and bonding the photointerrupter unit 20A and the housing 24 together. Be completed.

The surface-mount type photointerrupter 20 having the above-described configuration allows the light from the LED 3 to be approximately 45 ° of the housing 24.
The light is reflected by approximately 90 degrees on the inclined reflecting surface 24c on the inner surface side, passes through the slit 24a, passes through the gap G, and passes through the slit 24b.
, And is further reflected at approximately 90 degrees by the reflection surface 24d, so that PT
r4 receives light. At this time, when an object enters the gap G, which is a light path, and the light is blocked, the output of the P-Tr 4 changes to detect the presence or absence of the object.

Therefore, in the conventional method, the LED 3 and the P-
Tr4 is formed as a primary mold body in a separate process, and the number of man-hours, accuracy, mold complexity, etc. are adjusted while holding the position of the optical axis by insert molding in the secondary mold body.
Alternatively, the LED 3 and the P-Tr 4 were simultaneously formed on the same surface of the circuit board 21 in the present invention, although there were many problems such as thermal stress on the element due to twice molding, reliability under stress, cost, etc. As a result, the number of manufacturing steps is small, and the slit 2
The position accuracy of the 4a and 24b and the accuracy of the processing gap G can be accurately obtained. Furthermore, because of the use of reflection,
There is no special need to adjust the optical axis position.
Excellent in accuracy, reliability and cost.

Next, a method of manufacturing a surface mount photointerrupter will be described. 3 to 8 show a manufacturing method in the case where the housing is a single body, and FIG. 3 is a perspective view showing a through-hole processing and an electrode pattern forming step on the collective circuit board. FIG. 4 is a perspective view showing a die bonding and wire bonding mounting process of the LED and the P-Tr. FIG. 5 is a perspective view showing a resin sealing step. FIG. 6 is a perspective view of the divided photointerrupter alone after the cutting step of the collective circuit board which has been completed from the mounting to the resin sealing step. FIG.
It is an external appearance perspective view of a housing. FIG. 8 is an external perspective view seen from the back side of the housing.

In FIG. 3, the through-hole processing step includes:
100mm ~ made of glass epoxy resin etc. for insulating substrate
The circuit board 21 is mounted on the collective circuit board 21A of about 200 mm square.
Are drilled by a processing means such as NC cutting or pressing at the same pitch for each row to form a large number of pieces, thereby forming through holes 22.

Next, in a plating step, after cleaning the entire surface of the collective circuit board 21A including the wall surfaces of the through holes 22, a copper plating layer is formed on the entire surface of the collective circuit board 21A by electroless plating. Move to the pattern formation process,
Through the steps of mask alignment, exposure, development, etching, resist coating, mask alignment, exposure, development, etc., a copper electrode pattern is formed, and finally Ni plating by electrolytic plating and Au plating on it are completed I do. Thus, the LED 3 and the P-Tr 4 are disposed on the upper surface of the collective circuit board 21A.
Are formed, and the through-hole electrodes 22a (22b) are formed.

FIG. 4 is an explanatory view of a mounting step. In the die bonding step, the mounting electrode patterns 23a and 23a are formed.
An anisotropic conductive sheet, an anisotropic conductive adhesive, or a conductive adhesive is applied or printed on b. For example, in the case of a silver paste, each element of the LED 3 or the P-Tr 4 is mounted on the silver paste, and then placed in a curing furnace to cure and fix the silver paste.

In the wire bonding step, wire bonding is performed from the first side of the fixed LED 3 and P-Tr 4 to a second side pattern determined by a bonding wire 7 such as a gold wire.

FIG. 5 is a view showing a resin sealing step.
In order to prevent the resin from flowing into the through holes on the through holes 22 of the collective circuit board 21A, a mask member 25 such as an adhesive tape is attached. Next, in order to secure a predetermined gap G, a plurality of rows of molds (not shown) are set according to the number of pieces to be taken, and after filling the mold with a sealing resin 8 such as an epoxy resin, the molds are cured and cured. After the sealing resin 8 is cured, the mold is removed.

The material of the collective circuit board 21A is glass epoxy resin, and the sealing resin 8 is epoxy resin. Since both are of the same epoxy type, they have the same linear expansion coefficient, and peel off or warp the resin from the board at high temperatures such as curing. Circuit board 21A after resin encapsulation with low adhesion, high adhesion strength and excellent reliability
Is obtained.

In the cutting step, the assembled circuit board 21A that has been completed from the mounting to the resin sealing step is cut by a dicing or slicing machine or the like along the orthogonal X and Y cut lines 26 and 27, as shown in FIG. The photo interrupter is divided into single photo interrupters 20A as shown. Since the cut line 26 in the X direction passes over the through-hole 22, the through-hole electrode 22a on the LED 3 side having a semicircular shape in the divided cross section is shown.
Then, the through-hole electrodes 22b on the P-Tr4 side appear in each column, and when divided into single units as shown in FIG. 6, each electrode comes to a symmetrical position and becomes an external connection electrode connected to a motherboard or the like.

As shown in FIG. 7 and FIG. 8, as described above, in the processing step of the housing, a thin metal plate such as a Bs material, an Al material, or a SuS material is pressed to form a hole in a slit portion or to squeeze a main body portion. Form by processing. Alternatively, it is formed by injection molding using a mold with a plastic material. The housing 24 molded by any of these methods has light-reflecting surfaces 24c and 24d that are approximately symmetrically inclined about 45 ° left and right with slits 24a and 24b and a gap G serving as light paths to the outside and optical paths of both elements.
Have. The reflection surfaces 24c, 24c
For d, the reflectance can be further increased by forming a plating layer (not shown) of, for example, electroless Ni plating.

In the final bonding step for integration, the adhesive is applied or printed on the bonding surface of the outer peripheral portion of the circuit board 21 of the photointerrupter unit 20A or the lower inner peripheral portion of the housing 24. Then, the photointerrupter unit 20A and the housing 24 are combined and bonded to be integrated,
The surface mount photointerrupter 20 as shown in FIGS. 1 and 2 is completed.

Next, a description will be given of a second embodiment of the surface mount photointerrupter. In the manufacturing method described above, the method of forming a surface-mount type photo interrupter by bonding the photo interrupter alone and the housing alone has been described.
Here, a manufacturing method of bonding a photointerrupter assembly and a housing assembly and cutting and dividing the photointerrupter in a final step to obtain a surface mount photointerrupter will be described.

FIGS. 9 and 10 are views for explaining a method of manufacturing each of the photointerrupter assembly and the housing assembly. FIG. 9 shows through hole processing, electrode pattern formation, LED and P-type fabrication on the assembly circuit board. It is a perspective view which shows the photointerrupter aggregate which passed Tr by die bond and wire bond mounting, and each process of resin sealing. FIG. 10 is a perspective view of the housing assembly.

In FIG. 9, the LED 3 and the P-Tr 4 are separately provided on the collective circuit board 21A made of glass epoxy resin or the like, and through-hole processing is performed for each row at a position corresponding to each photo interrupter. In the process, a through-hole 22 for forming a through-hole electrode connected to a printed circuit board such as a motherboard is formed in the same manner as described above. In the electrode pattern forming step, the collective circuit board 21A
Are formed on the upper surface of the mounting electrode patterns 23a and 23b of the LED 3 and the P-Tr 4, and through-hole electrodes 22a and 22b connected to the electrode patterns. The mounting process includes the LED 3 and the P-Tr on the collective circuit board 21A.
4 is die-bonded and wire-bonded. In the resin sealing step, a cover member such as an adhesive sheet (not shown) is attached on the through hole 22, a mold is set so that the LED 3 and the P-Tr 4 become independent islands, and sealing with epoxy resin or the like is performed. The resin 8 is filled in a mold, cured and cured. Thus, the photointerrupter assembly 20B is configured. At the corner of the photo interrupter assembly 20B, at least two diagonal guide holes 21a for positioning with a housing assembly to be described later are formed.

In FIG. 10, the housing assembly 24A is integrated with the photointerrupter assembly 20B in a later step. Therefore, the housing assembly 2 is configured such that the respective housing portions constituting the housing assembly 24A and the individual photointerrupters constituting the photointerrupter assembly 20B coincide with each other.
OA is designed. And there are two types of processing methods, such as press processing and plastic molding processing.
The press working is performed by forming a thin metal plate 24B made of a BS material, an aluminum material, a SUS material or the like by punching a slit portion or drawing a main body portion by a press machine. In plastic molding, various shapes are molded from a plastic material by using an injection molding machine using a mold. Each housing part of the housing assembly 24A molded by any of these methods interposes a gap G with slits 24a and 24b serving as light shielding to each part and optical paths of both elements,
Light reflecting surface 24c, left and right approximately symmetrically inclined by about 45 °, 2
4d. In order to further increase the reflection efficiency, the reflection surfaces 24c and 24d are made of, for example, electroless Ni.
A plating layer (not shown) such as plating is formed. In the corner of the housing assembly 24A, a guide hole 24e is formed in the photo-interrupter assembly 20B.
Similarly, at least two are formed at the paired positions.
In the next step, the guide holes overlap and are positioned.

In the integrating step, an adhesive is applied or printed on each or both of the photo interrupter assembly 20B and the housing assembly 24A, and the guide holes 21a of the both.
And 24e are aligned and positioned, and they are fixed to form an assembly of the surface mount photointerrupter 20.

The final cutting step is the surface mounting type photointerrupter 2 formed in the above-mentioned integration step of the previous step.
X, Y cut lines 26, 27 orthogonal to the set of 0
The surface mount type photo-interrupter 20 as shown in FIGS. 1 and 2 is completed by being cut and divided into single pieces by a dicing or slicing machine along.

The two manufacturing methods, that is, the case where the housing is a single body and the case where the housing is an aggregate have been described above. In any case, the LED and the P-Tr are individually mounted on the same surface of a collective circuit board. Since batch processing is performed for each process, the efficiency is high, and the number of photointerrupters to be mounted on a collective circuit board of about 100 mm to 200 mm square can be about 1000 pieces, so that the manufacturing cost can be extremely reduced.

FIGS. 11 to 13 relate to the first and second embodiments of the present invention. FIG. 11 is an external perspective view of a housing.
2 is a perspective view of the back side of the housing, and FIG. 13 is a cross-sectional view of the surface mount photointerrupter.

The difference from the housings described in the first and second embodiments is that the shape of the top surface 24e of the upper surface of the housing which is opposed to and parallel to the circuit board 21 has a large surface area and a substantially square shape. It was done. Top part 2 of the upper surface of the housing 24
By making 4e wider, the suction at the top of the mounting machine is ensured, and the supply stability of the surface mount photointerrupter to the motherboard or the like is improved.

[0044]

As described above, according to the present invention,
Since the substrate and the housing are manufactured in an aggregate, a large number of individual substrates can be obtained. Further, since most of the manufacturing process is performed in an assembled state, the manufacturing cost is extremely low. Moreover, optical axis alignment becomes extremely easy.

Further, the material of the collective circuit board, which is an insulating board, is an epoxy resin board containing glass fiber. Since epoxy resin is used for the sealing resin, both are of the same epoxy type and have the same linear expansion coefficient. The mutual fixing force at low temperature, humidity, etc. is strong and the reliability is high.

Further, since the housing is formed by pressing a metal plate or molding a plastic, the slit position and the gap width by the die can be processed with high precision, and the reliability is improved.

Further, by applying a surface treatment such as plating to the inner surface, which is the reflection surface of the housing, as required, the reflection efficiency can be improved.

Further, by forming the area of the top portion of the housing to be large, suction of the top portion by the mounting machine is ensured, and the supply stability of the surface mount photointerrupter to the motherboard or the like is improved.

In addition, since the assembly of each assembly does not use a complicated secondary mold as in the prior art, the light emitting element and the light receiving element are adversely affected by thermal stress, mechanical stress and the like. And high reliability and high accuracy can be realized.

As described above, an ultra-compact, high-precision,
High resolution can be realized, and the small size required by the market,
It is possible to provide an SMD, a long-life, high-reliability, extremely inexpensive surface-mount photointerrupter and a method for manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a surface-mount photointerrupter according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing an appearance of the surface mount photointerrupter of FIG.

FIG. 3 is a perspective view showing a process of forming a through hole and forming an electrode pattern on a collective circuit board according to the method of manufacturing a surface mount photointerrupter of the present invention.

FIG. 4 is a perspective view showing a die bonding and wire bonding mounting process of an LED and a P-Tr on the collective circuit board of FIG. 3;

FIG. 5 is a perspective view showing a resin sealing step of the collective circuit board of FIG. 4;

FIG. 6 is a perspective view of a single photointerrupter obtained by dividing the collective circuit board of FIG. 5 in a dicing process.

FIG. 7 is an external perspective view of a housing alone according to the present invention.

FIG. 8 is a perspective view of the back side of the housing of FIG. 7;

FIG. 9 shows a second example of the surface mount photointerrupter of the present invention.
FIG. 13 is a perspective view of a photointerrupter assembly that has been subjected to through-hole processing, electrode pattern formation, LED and P-Tr die-bonding and wire-bonding mounting, and resin sealing on a collective circuit board according to the embodiment.

FIG. 10 is a perspective view of a case where a housing according to a second embodiment of the present invention is manufactured as an aggregate.

FIG. 11 is an external perspective view of a housing according to the first and second embodiments of the present invention.

FIG. 12 is a perspective view of the back side of FIG. 11;

FIG. 13 is a cross-sectional view of the surface mount photointerrupter according to the first and second embodiments of the present invention.

FIG. 14 is a circuit configuration diagram of a general photo interrupter.

FIG. 15 is a perspective view of a conventional photointerrupter.

FIG. 16 is a sectional view taken along line AA of FIG.

[Explanation of symbols]

 Reference Signs List 3 LED (light emitting element) 4 P-Tr (light receiving element) 7 bonding wire 8 sealing resin 20 surface mount type photo interrupter 20A single photo interrupter 20B photo interrupter assembly 21 circuit board 21a, 24e guide hole 21A assembly circuit board 22 through Hole 22a, 22b Through-hole electrode 23a, 23b Electrode pattern 24 Housing 24a, 24b Slit 24c, 24d Reflective surface 24e Top 25 Mask member 26 X-direction cut line 27 Y-direction cut line G gap

Claims (10)

[Claims] 1. A surface-mounted photointerrupter in which a light-receiving element receives light from a light-emitting element via a gap and detects the presence or absence of an object without contact, wherein the light-emitting element or the light-receiving element is mounted on an insulating substrate. In addition to being sealed with a sealing resin, a light reflecting surface and a slit serving as an optical path of both elements are provided, and light shielding to the outside and a housing provided with a predetermined gap are combined. Surface mount type photo interrupter. 2. The surface mount photointerrupter according to claim 1, wherein the insulating substrate has a through hole electrode as an external electrode on a side surface. 3. The surface mount photointerrupter according to claim 1, wherein the housing is formed of a metal or a plastic material. 4. The surface mount type photo-interrupter according to claim 1, wherein a plating layer is formed on a light reflection surface serving as an optical path of both elements formed in said housing to increase reflection efficiency. 5. The surface mount photointerrupter according to claim 1, wherein said plating layer is nickel plating. 6. The semiconductor device according to claim 1, wherein the housing and the insulating substrate in which the two elements are sealed with a resin are fixed with an adhesive.
The surface-mounted photointerrupter described. 7. The angle of the reflection surface formed on the housing is 4
2. The surface mount photointerrupter according to claim 1, wherein the angle is within 5 ° ± 10 °. 8. The surface mount photointerrupter according to claim 1, wherein a top shape of the housing facing and parallel to the insulating substrate is a substantially square shape having a wide top surface. 9. A method for manufacturing a surface mount photointerrupter in which light from a light emitting element is received by a light receiving element via a gap and the presence or absence of an object to be detected is detected in a contactless manner. A through-hole processing step of drilling a plurality of rows of through-holes in a collective circuit board comprising a plurality of pieces, and a mounting electrode pattern for mounting a plurality of rows of light-emitting elements and light-receiving elements on an upper surface of the collective circuit board; An electrode pattern forming step of forming a through-hole electrode connected to a printed circuit board such as a motherboard in the through-hole; a mounting step of die-bonding and wire-bonding a plurality of light-emitting elements and light-receiving elements on the collective circuit board; A mask member such as a dry film is attached on the hole, a mold is set, and a sealing resin such as an epoxy resin is molded into the mold. Filling the frame, curing and curing the resin sealing step, or the resin sealing step by potting without using a mold, and the assembled circuit board that has been completed up to the resin sealing step, along the orthogonal cut line Up to the cutting step of dividing into a single circuit board by dicing or slicing, on the other hand, providing a light reflecting surface and a slit to be the optical path of the two elements, and, and shielding to the outside,
A casing is formed through a pressing step of a casing molded of a metal or a plastic material or the like provided with a predetermined gap, or a plastic molding step, and, if necessary, a plating step of forming a plating layer on a reflection surface of the casing. Next, the housing is put on the single circuit board divided in the cutting step and combined,
A method for manufacturing a surface-mount type photointerrupter, wherein a finished product is formed by a fixing step of integrating with a fixing means such as an adhesive, and the series of these steps is constituted. 10. A method for manufacturing a surface mount photointerrupter in which light from a light emitting element is received by a light receiving element via a gap and the presence or absence of an object is detected in a contactless manner. A through-hole processing step of drilling a plurality of rows of through-holes in a collective circuit board comprising a plurality of pieces, and a mounting electrode pattern for mounting a plurality of rows of light-emitting elements and light-receiving elements on an upper surface of the collective circuit board; An electrode pattern forming step of forming a through-hole electrode connected to a printed circuit board such as a motherboard in the through-hole; a mounting step of die-bonding and wire-bonding a plurality of light-emitting elements and light-receiving elements on the collective circuit board; Paste a mask member such as a dry film on the hole, set a mold, and apply a sealing resin such as an epoxy resin Filling the mold, curing and curing the resin sealing process, or the resin sealing process by potting without using the mold, to form a collective circuit board that has been completed up to resin sealing, Forming a reflection surface and a slit of light serving as an optical path of the two elements, and a step of pressing a housing assembly formed of a metal or plastic material or the like, which is provided with a light-shielding element and a predetermined gap provided with a predetermined gap; Alternatively, a housing assembly is formed by a plastic molding process step and, if necessary, a plating step of forming a plating layer on each housing reflection surface of the housing assembly, and then the steps up to the resin sealing are completed. After passing through a fixing step of putting the housing assembly on the assembly circuit board and assembling them, and integrating them with an adhesive or other fixing means, dicing or slicing the integrated components along a perpendicular cut line to form a single unit. Surface mount photointerrupter manufacturing method characterized by comprising the cutting step of dividing the bets interrupter.